JPH11213834A - High-frequency relay - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a high-frequency relay which can be formed with a circuit pattern in a surface of a circuit board facing to a metal base. SOLUTION: A shield case 11 for surrounding a contact device to be driven for opening and closing by a driving device, is provided and the shield case 11 is connected onto a metal base 10. The base 10 includes a part for insertion of terminal pins 12a-12c in a surface thereof facing a circuit board 20, and the base 10 is formed with a continuos notch part 17 at a part of the peripheral surface thereof. A circuit pattern capable of being connected to the terminal pins 12a-12c is formed at a part corresponding to the notch part 17.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a high-frequency relay.

[0002]

2. Description of the Related Art Conventionally, there has been provided a high-frequency relay in which a contact device is housed in a shield case and the shield case is electrically connected to a ground pattern of a circuit board (Japanese Patent Application Laid-Open No. 9-251831). . As this kind of high-frequency relay, as shown in FIG.
In some cases, a shield case 11 is provided on the top of the shield case 11. As shown in FIG. 12, the contact device includes, for example, three terminal pins 12a to 12c and a pair of movable contact plates that move between a position where the pair of terminal pins 12a to 12c is short-circuited and a position where the terminal pins are opened. 13a and 13b. The movable contact plates 13a and 13b are held by a driving device composed of an electromagnet device, and are moved in the vertical direction in FIG. 12 by the driving device. Normally, the left end terminal pin 12a and the center terminal pin 1
2b is short-circuited by the movable contact plate 13a, and the movable contact plate 13b is connected to the center terminal pin 12b and the right end terminal pin 1b.
2c away. When the movable contact plates 13a and 13b are moved by the driving device, the movable contact plate 13a is separated from the left end terminal pin 12a and the center terminal pin 12b, and the center terminal pin 12b and the right end terminal pin 12c are moved. 13b is short-circuited. That is, a normally closed contact is formed by the movable contact plate 13a and the terminal pin 12a, and a normally open contact is formed by the movable contact plate 13b and the terminal pin 12c. The terminal pins 12b serve as common contacts.

The terminal pins 12a to 12c penetrate the base 10 and are connected to the circuit board 20, and the ground terminal 14 (see FIG. 13) electrically connected to the shield case 11 is also connected to the circuit board 20. You. Ground terminal 1
As shown in FIG. 13, as shown in FIG. 13, one end of the leg 14 a has a head 14 b having a larger diameter than the leg 14 a, and the head 14 b is inserted into a recess 10 a formed in the base 10,
The head 14b is fixed to the base 10 using silver brazing.

When mounting on the circuit board 20, the circuit board 2
0 is a double-sided printed circuit board, and the terminal pins 12a-1
2c is inserted through the circuit board 20 and connected to the circuit pattern provided on the lower surface side in FIGS. Also, the ground terminal 14 is inserted into the circuit board 20 and connected to the grounding conductive part by solder 16 similarly to the terminal pins 12a to 12c. Here, FIGS.
As shown in FIG. 11, a grounding conductive portion (shaded portion) is formed on almost the entire upper surface of the base 3, and the grounding conductive portion faces the base 10. That is, the base 10 and the ground terminal 14 are connected to the head 1 of the ground terminal 14.
4b is merely fixed to the inner bottom surface of the recess 10a of the base 10 with silver solder, so that the contact area between the base 10 and the ground terminal 14 is relatively small, and sufficient conductivity cannot be obtained. Solder 16 between substrate 20 and ground terminal 14
, The distance from the fixed portion to the connection portion between the ground terminal 14 and the base 10 is relatively long, so that an impedance component is generated here. This causes a potential difference between the ground potential of the circuit board and the potential of the base 10. If there is such a potential difference, a noise component is likely to be deposited on the base 10 and the shield case 11, and
The function of the electromagnetic shield of the shield case 11 and the base 10 and the shield case 11 are reduced.
Is not stable as a reference potential, so that high-frequency characteristics (such as transmission loss) become unstable. Therefore, as described above, the grounding conductive portion is formed on the upper surface side of the circuit board 20 and the base 10
It is necessary to join the opposing portions of the ground and the conductive portion for grounding with solder.

[0005]

As described above, since it is necessary to provide a conductive portion for grounding on the surface of the circuit board 20 facing the base 10 and to join it to the base 10 by soldering, Terminal pins 12 are provided on the surface facing
A circuit pattern for connecting to a to 12c cannot be formed. As a result, the terminal pins 12a to 12c are not connected to the circuit pattern and are not surrounded by the base 10 in a portion of the portion protruding from the metal base 10 to the outside in a length range corresponding to the thickness of the circuit board 20. A site will be created. This portion is relatively long, and its length changes depending on the position where the solder 16 is attached, and the impedance tends to vary. That is, it is difficult to match the impedance to the impedance at this portion, and loss due to reflection or the like is likely to occur. Further, as described above, the opposing surface of the grounding conductive portion of the circuit board 20 and the base 10 has a large opposing area, and it is troublesome to join them with solder.

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and a first object of the present invention is to form a circuit pattern on a surface of a circuit board facing a base so that a terminal pin and a circuit pattern can be formed from the base. The object of the present invention is to provide a high-frequency relay in which the distance to a connection portion between the base and a circuit board is shortened, and as a result, impedance can be easily matched. To provide a high-frequency relay that facilitates electrical connection with the relay.

[0007]

According to a first aspect of the present invention, there is provided a shield case surrounding a contact device which is driven to be opened and closed by a driving device comprising an electromagnet device, and a shield case in which terminal pins constituting the contact device are inserted. And a metal base connected to the base plate, and a surface of the base facing the circuit board on which the terminal pins are mounted includes a portion where the terminal pins are inserted, and is continuous with a part of the peripheral surface of the base. In which a notch is formed.

According to a second aspect of the present invention, in the first aspect of the present invention, the terminal pins have a surface mounting type in which the terminal pins are soldered to the surface of the circuit board. According to a third aspect of the present invention, there is provided a shield case surrounding a contact device which is opened and closed by a drive device comprising an electromagnet device, and a metal base through which terminal pins constituting the contact device are inserted and electrically connected to the shield case. An earth terminal joined to the base by solder, and the solder joining the earth terminal to the base is provided at a position where the terminal pin can be melted when the terminal pin is mounted on the circuit board.

According to a fourth aspect of the present invention, there is provided a shield case surrounding a contact device which is opened and closed by a drive device comprising an electromagnet device, and a metal made of a metal which is electrically connected to the shield case through which terminal pins constituting the contact device are inserted. And a ground terminal joined to the base by soldering, the ground terminal is formed in a shape having a head having a diameter larger than that of the leg at one end of the leg, and the base has a ground terminal. An inner flange that has a through-hole penetrating through the front and back sides to be inserted and that is close to the circuit board on which the terminal pin is mounted in the through-hole is formed to lock the head of the ground terminal. The space between the outer peripheral surface of the portion and the inner peripheral surface of the inner flange is filled with the solder.

[0010]

(Embodiment 1) In this embodiment,
An example in which the technical concept of the present invention is applied to the high-frequency relay having the configuration shown in FIG. 4 will be described. However, the technical concept of the present invention can be applied to a high-frequency relay having another configuration. In the high-frequency relay shown in FIG. 4, a driving device 2 composed of an electromagnet device and a contact device 3 are mounted on a main base 1, and the driving device 2 and the contact device 3 are housed in a space surrounded by the main base 1 and the case 4. It was done.

The driving device 2 has an iron core 33 inserted into a cylindrical coil bobbin 32 around which a coil 31 is wound. One end of the yoke 34 is connected to one end of the iron core 33.
The yoke 34 has a first yoke piece 34a passing in front of the coil 31 in FIG. 4 and a second yoke piece 34b passing below the coil 31 in FIG.
And the other end of the second yoke piece 34b is extended to a position facing the other end of the iron core 33 at a distance. That is,
The other end of the first yoke piece 34a and the second yoke piece 34b face each other, and the other end of the iron core 33 is located between the facing portions. Both ends of the coil 31 are connected to a coil terminal 35.

The driving device 2 has a movable base 40 attached to the main base 1 via a balance spring 41. The movable base 40 holds a permanent magnet 42 and a pair of armatures 43 coupled to the magnetic poles of the permanent magnet 42. Each armature 43
Are the other end of the iron core 33 and the first yoke piece 34a, respectively.
Alternatively, it is inserted between the other end of the second yoke piece 34b. That is, according to the excitation polarity of the coil 31, the state in which the two armatures 43 are attracted to the iron core 33 and the first yoke piece 34 a, and the state in which the two armatures 43 are attracted to the iron core 33 and the second yoke piece 34 b
And a state of being sucked.

The equilibrium spring 41 is fixed to the equilibrium spring holding plate 44, and a part of the equilibrium spring holding plate 44 is fixed to the main base 1 by being pressed into the holding hole 5 provided in the main base 1. The equilibrium spring 41 is a leaf spring formed in a bracket shape and is formed so as to be flexible in a lower right-upper left direction in FIG.
To be swingable. In a state where the balance spring 41 does not bend, the two armatures 43 are located between the iron core 33 and the first yoke piece 34a and the second yoke piece 34b, respectively.

When the coil 31 is excited, the armature 43 is attracted to the iron core 33 and the first yoke piece 34a or the second yoke piece 34b according to the excitation polarity as described above. Movable base 40 in the direction in which
Will move. In this operation, once the coil 31 is excited and the armature 43 is once attracted to the first yoke piece 34a or the second yoke piece 34b, the movable base 40 does not move until the coil 31 is next excited to the opposite polarity. Becomes bistable operation from. However, in the present embodiment, a non-magnetic residual plate 36 is fixed to the surface of the iron core 33 facing the first yoke piece 34a, and the permanent magnet when the armature 43 is attracted to the second yoke piece 34b. The suction force is weakened such that the suction force by the spring 42 becomes weaker than the return force by the balance spring 41 so that a monostable operation is achieved. That is, the coil 31 must be excited to attract the armature 43 to the second yoke piece 34b. However, if the excitation of the coil 31 is stopped, the armature 43 , And the armature 43 is attracted to the first yoke piece 34a by the attractive force of the permanent magnet 42. As a result, the movable base 40 can be reciprocated depending on whether or not the coil 31 is energized without switching the direction in which the current flows through the coil 31.

A pair of movable contact plates 13a and 13b are provided on one side of the movable base 40 via a holding member 45 made of an insulating material.
Is held. Each of the movable contact plates 13a and 13b is made of a metal plate having good conductivity, and a middle portion in the longitudinal direction is held by a holding member 45, respectively. Both movable contact plates 13
a and 13b are arranged apart from each other in the swinging direction of the movable base 40, and one ends of the movable contact plates 13a and 13b are opposed to each other.

The contact device 3 has substantially the same configuration as that of the related art, and includes three terminal pins 12a to 12c whose intermediate portions are penetrated by a cylindrical insulating member 15. The insulating member 15 is held by the metal base 10, and the terminal pins 12a to 12c
Is inserted through the base 10. Also base 1
A shield case 11 that surrounds the terminal pins 12a to 12c together with the base 10 is disposed on the reference numeral 0. The shield case 11 is formed by combining two metal plates having good conductivity. Further, four ground terminals 14 are fixed to the base 10. The base 10 is fixed to the side of the main base 1 such that the lower surface is substantially flush with the lower surface of the main base 1.

As shown in FIG. 3, the terminal pins 12a to 12c are arranged in a straight line, and a movable contact plate 13a, 12c is provided between the center terminal pin 12b and the other terminal pins 12a, 12c.
The contact device 3 is configured by making it possible to select a short-circuit state and an open state at 13b. In the illustrated example, the movable contact plate 13a short-circuits between the terminal pins 12a and 12b while the coil 31 is not excited, and the movable contact plate 13b
Opens between the terminal pins 12b and 12c. That is, the terminal pins 12a and 12b and the movable contact plate 13a form a normally closed contact, and the terminal pins 12b and 12c and the movable contact plate 13b form a normally open contact.

By the way, as shown in FIG.
A cutout portion 17 is formed on the lower surface of each of the above-described portions, at which the terminal pins 12a to 12c are inserted, and at the periphery thereof. That is, the base 10 contacts the circuit board 20 at the portion where the ground terminal 14 is provided, but the base 10 is located away from the circuit board 20 at the portion where the cutout 17 is formed. The notch 17 corresponding to the terminal pins 12a and 12c is located in the longitudinal direction of the base 10 (terminal pins 12a to 12c).
Are open to each end face (in the direction in which
The cutout 17 corresponding to 2b is open to the end face of the base 10 in the width direction (direction orthogonal to the longitudinal direction). In addition,
Each notch 17 is desirably formed over the entire length of the base 10 in the width direction. That is, the notches 17 are formed at the three ends, that is, both ends and the middle part in the longitudinal direction, over the entire length in the width direction.

With this configuration, the surface of the circuit board 20 facing the base 10 is, as shown in FIG.
Not only the grounding conductive part 21 but also the terminal pins 12a to 12c
The circuit pattern 22 electrically connected to the circuit pattern 22 can be formed. If the circuit pattern 22 is formed within the range of the notch 17, the circuit pattern 22 will not contact the base 10. By forming such a circuit pattern 22,
As compared with the case where the circuit pattern 20 is formed on the other surface side of the circuit board 20, the number of transmission paths is reduced by the thickness of the circuit board 20, and the loss occurring in the conventional configuration is reduced. In other words, in the conventional configuration, the impedance mismatch within the thickness dimension of the circuit board 20 affects the impedance matching of the high-frequency relay as a whole, but it is not necessary to consider the impedance mismatch at this portion. . As a result, high-frequency characteristics (especially with respect to loss) can be improved as compared with the conventional configuration.

In the above-described example, the configuration using the terminal pins 12a to 12c inserted into the circuit board 20 has been described, but terminal pins 12a to 12c having a shape suitable for surface mounting may be used. That is, as shown in FIG.
The terminal pins 2a to 12c are bent into a substantially L shape. If the terminal pins 12a to 12c having such a shape are employed, the high-frequency relay can be mounted on the circuit board 20 without forming a through hole in the circuit board 20. Will be possible. In addition, when the surface mounting is performed, there is no surplus portion generated when the terminal pins 12a to 12c are inserted into the circuit board 20, so that high-frequency characteristics may be further improved. FIG. 6 shows an example of the circuit pattern 22 when a high-frequency relay for surface mounting is used.

As the surface mounting terminal pins 12a to 12c, not only the terminal pins 12a to 12c subjected to the bending process as described above, but also the tip portions of the terminal pins 12a to 12c are crushed as shown in FIG. A large-diameter header-processed one may be used. (Embodiment 2) In this embodiment, the ground terminal 14 is
And is fixed to the base 10 with the structure shown in FIG. The ground terminal 14 is the same as the conventional one,
a is provided with a head 14b having a diameter larger than that of the leg 14a at one end. A through hole 18 penetrating vertically is provided at a portion of the base 10 where the ground terminal 14 is mounted.
Are formed at the lower end of the through-hole 18, and an inner flange 18a having a smaller diameter than other parts is formed. The head 14b of the ground terminal 14 is dimensionally set so as to be locked on the upper surface of the inner flange 18a. In this state, a portion indicated by hatching in FIG.
Is fixed. That is, the solder 16 is filled between the inner peripheral surface of the through hole 18 and the outer peripheral surface of the head 14b of the terminal pin 14, and the inner peripheral surface of the inner flange 18a and the outer peripheral surface of the leg 14a.

If such a structure is adopted, the terminal pins 1
Since the terminal pin 14 is supported by the base 10 by mounting the head 14b of the terminal 4 on the inner flange 18a, the head 14b of the terminal pin 14 is held at a position closer to the circuit board 20 than in the conventional configuration. Even so, the fixing strength of the end pin 14 to the base 10 can be maintained. Further, since the terminal pins 14 are fixed to the base 10 by the solder 16 and the fixing position of the head 14 b is close to the circuit board 20, the solder 16 is also fixed to the circuit board 2.
0, the terminal pin 14 is connected to the base 1 when the high-frequency relay is mounted on the circuit board 20 by soldering.
A part of the solder 16 fixed to 0 is melted, and the ground terminal 14 and the grounding conductive portion 21 of the circuit board 20 are connected by soldering. Further, since the ground terminal 14 and the base 10 are also connected by the solder 16, the base 10 and the ground terminal 14 are compared with the case where a silver solder is used as in the conventional configuration.
The conductivity between the ground and the ground conductive portion 21 is good, and these potentials are almost equal. That is, since the reference potential of the base 10 and the shield case 11 is stabilized, the high frequency characteristics are stabilized. In the illustrated example, the notch 17 as in the first embodiment is not provided.
The notch 17 can be provided in the same manner as described above. Other configurations and operations are the same as those of the first embodiment.

[0023]

According to the first aspect of the present invention, a shield case surrounding a contact device which is opened and closed by a drive device comprising an electromagnet device, and a terminal pin constituting the contact device are inserted and electrically connected to the shield case. A metal base, and a notch portion including a portion where the terminal pins are inserted and continuing to a part of the peripheral surface of the base is provided on a surface of the base facing the circuit board on which the terminal pins are mounted. Since it is formed and the conductive pattern connectable to the terminal pin can be provided on the circuit board within the range of the notch, the transmission path of the high-frequency signal can be shortened by the thickness of the circuit board. The loss of the high frequency is reduced and the high frequency characteristics are improved.

According to the second aspect of the present invention, the terminal pins having a surface mounting type shape in which the terminal pins are soldered to the surface of the circuit board can be mounted on the surface by forming the cutouts. It is. According to a third aspect of the present invention, there is provided a shield case surrounding a contact device which is opened and closed by a drive device comprising an electromagnet device, and a metal base through which terminal pins constituting the contact device are inserted and electrically connected to the shield case. An earth terminal joined to the base by solder, and the solder joining the earth terminal to the base is provided at a position where the terminal pin can be melted when the terminal pin is mounted on a circuit board. When mounting on the circuit board, part of the solder joining the ground terminal to the base melts and connects the ground terminal to the circuit board, so that the electrical connection between the base, the ground terminal, and the circuit board is good. Become
As a result, a good high-frequency characteristic in which the ground potential is stable and is not easily affected by noise can be obtained.

According to a fourth aspect of the present invention, there is provided a shield case surrounding a contact device which is driven to be opened and closed by a drive device comprising an electromagnet device, and a metal case in which terminal pins constituting the contact device are inserted and electrically connected to the shield case. And a ground terminal joined to the base by soldering, the ground terminal is formed in a shape having a head having a diameter larger than that of the leg at one end of the leg, and the base has a ground terminal. An inner flange that has a through-hole penetrating through the front and back sides to be inserted and that is close to the circuit board on which the terminal pin is mounted in the through-hole is formed to lock the head of the ground terminal. A part of the solder that is filled with the solder between the outer peripheral surface of the portion and the inner peripheral surface of the inner flange, and joins the ground terminal to the base when mounting the terminal pin on the circuit board. Melted times Because connecting the ground terminal to the substrate,
The electrical connection between the base, the ground terminal, and the circuit board is improved, and as a result, a good high-frequency characteristic is obtained in which the ground potential is stable and is less affected by noise. Moreover, since the ground terminal is inserted into the through hole, the assembling work is easy,
And place the head of the ground terminal close to the circuit board,
Solder for joining the ground terminal to the base can also be provided at a position close to the circuit board. As a result, the solder is likely to melt when the terminal pins are mounted.

[Brief description of the drawings]

FIG. 1 is a front view of a main part showing a first embodiment of the present invention.

FIG. 2 is a plan view of a main part of the circuit board used in the above.

FIG. 3 is a plan view showing the contact device according to the first embodiment;

FIG. 4 is an exploded perspective view of the same.

FIGS. 5A and 5B show another configuration example of the above, wherein FIG. 5A is a front view of a main part, and FIG. 5B is a side view of the main part.

6 is a plan view of a main part of a circuit board used for the high-frequency relay shown in FIG.

FIG. 7 is a main part front view showing the shape of another terminal pin used in the above.

FIG. 8 is a front view of a main part showing Embodiment 2 of the present invention.

FIG. 9 is a sectional view of a main part of the above.

FIG. 10 is a front view of a main part showing a conventional example.

FIG. 11 is a plan view of a main part of the circuit board used in the above.

FIG. 12 is a plan view showing the contact device of the above.

FIG. 13 is a sectional view of a main part of the above.

[Explanation of symbols]

 Reference Signs List 2 Drive device 3 Contact device 10 Base 11 Shield case 12a to 12c Terminal pin 14 Ground terminal 14a Leg 14b Head 16 Solder 17 Notch 18 Through hole 18a Inner flange

Claims (4)

[Claims] 1. A shield case enclosing a contact device which is opened and closed by a drive device comprising an electromagnet device, and a metal base through which terminal pins constituting the contact device are inserted and electrically connected to the shield case. A notch is formed on a surface of the base facing the circuit board on which the terminal pins are mounted, the cutout including a portion where the terminal pins are inserted and being continuous with a part of the peripheral surface of the base. And high frequency relay. 2. The high-frequency relay according to claim 1, wherein the terminal pins have a surface-mounting shape that is soldered to a surface of the circuit board. 3. A shield case surrounding a contact device which is opened and closed by a driving device comprising an electromagnet device, a metal base through which terminal pins constituting the contact device are inserted and electrically connected to the shield case, A high-frequency relay comprising: a base; and a ground terminal joined by solder, wherein the solder joining the ground terminal to the base is provided at a position where the terminal pin can be melted when the terminal pin is mounted on a circuit board. 4. A shield case surrounding a contact device which is opened and closed by a drive device comprising an electromagnet device; a metal base through which terminal pins constituting the contact device are inserted and electrically connected to the shield case; An earth terminal joined to the base by soldering, the earth terminal is formed in a shape having a head having a diameter larger than that of the leg at one end of the leg, and the base is provided on the front and back sides through which the earth terminal is inserted. An inner flange that has a through hole that penetrates and that locks the head of the ground terminal is formed in a portion of the through hole near the circuit board on which the terminal pin is mounted, and at least an outer peripheral surface of a leg portion of the terminal pin. A high-frequency relay, wherein the solder is filled between the inner flange and an inner peripheral surface of the inner flange.