JPH1121148A - Dielectric material for plasma display panel - Google Patents
Dielectric material for plasma display panelInfo
- Publication number
- JPH1121148A JPH1121148A JP19308497A JP19308497A JPH1121148A JP H1121148 A JPH1121148 A JP H1121148A JP 19308497 A JP19308497 A JP 19308497A JP 19308497 A JP19308497 A JP 19308497A JP H1121148 A JPH1121148 A JP H1121148A
- Authority
- JP
- Japan
- Prior art keywords
- glass
- thermal expansion
- dielectric material
- bubbles
- powder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Glass Compositions (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
Abstract
Description
【０００１】[0001]
【産業上の利用分野】本発明はプラズマディスプレーパ
ネル用誘電体材料に関し、特に前面ガラス板に高歪点ガ
ラスを用いたプラズマディスプレーパネルに用いられる
誘電体材料に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a dielectric material for a plasma display panel, and more particularly to a dielectric material used for a plasma display panel using a high strain point glass for a front glass plate.
【０００２】[0002]
【従来の技術】プラズマディスプレーパネルの前面ガラ
ス板には、プラズマ放電用の電極が形成され、その上に
放電維持のために透明な誘電体層が形成される。2. Description of the Related Art Plasma discharge electrodes are formed on a front glass plate of a plasma display panel, and a transparent dielectric layer is formed on the electrodes for sustaining the discharge.
【０００３】一般に、プラズマディスプレーパネルの前
面ガラス板や背面ガラス板には、建築窓用ソーダライム
ガラスが使用されており、前面ガラス板への誘電体層の
形成は５５０〜６００℃の温度で行われる。それゆえ誘
電体材料には、ソーダライムガラスの熱膨張係数に適合
し、５５０〜６００℃で焼成できる高鉛ガラス粉末が使
用されている。また誘電体層は高い耐電圧を有する必要
があるため、誘電体材料には、焼成時に泡が抜けやすい
こと、泡が残存する場合も大きな泡にならないこと、ま
た平滑で均一な膜厚を有するガラス膜になることが求め
られている。In general, soda lime glass for architectural windows is used for the front glass plate and the rear glass plate of a plasma display panel, and a dielectric layer is formed on the front glass plate at a temperature of 550 to 600 ° C. Will be Therefore, a high-lead glass powder that matches the coefficient of thermal expansion of soda lime glass and can be fired at 550 to 600 ° C. is used as the dielectric material. In addition, since the dielectric layer needs to have a high withstand voltage, the dielectric material has a property that bubbles are easily removed during firing, that large bubbles are not formed even when bubbles remain, and that the dielectric material has a smooth and uniform film thickness. It is required to become a glass film.
【０００４】[0004]
【発明が解決しようとする課題】ところでソーダライム
ガラスは歪点が５００℃程度と低いため、熱処理する際
の熱収縮が大きく、電極や絶縁ペーストをパターン合わ
せする際に位置ずれが起こり易い。この問題は４０〜５
０インチ以上のパネルでは特に深刻である。そこで近年
ではこのような大型パネルについては、建築用ソーダラ
イムガラスに代えて、より熱収縮の小さい高歪点ガラス
を用いたガラス板が採用されている。However, since the soda lime glass has a low strain point of about 500 ° C., the heat shrinkage during the heat treatment is large, and the misalignment tends to occur when the electrodes and the insulating paste are patterned. The problem is 40-5
This is particularly severe for panels larger than 0 inches. Therefore, in recent years, for such a large-sized panel, a glass plate using a high strain point glass having smaller heat shrinkage is employed instead of soda lime glass for building.
【０００５】しかしながら、高歪点ガラスはソーダライ
ムガラスに比べて熱膨張係数が低いため、従来の高鉛ガ
ラスからなる誘電体材料を使用すると、ガラス板に反り
が生じたり、クラックが発生してしまう。熱膨張係数を
低下させる方法として、低膨張フィラー粉末を添加する
ことも考えられるが、この方法ではフィラーを多量に添
加しなけれならず、前面ガラス板の透過率が低下するた
め好ましくない。However, high strain point glass has a lower coefficient of thermal expansion than soda lime glass. Therefore, when a conventional dielectric material made of high lead glass is used, the glass plate may be warped or cracked. I will. As a method of lowering the coefficient of thermal expansion, it is conceivable to add a low-expansion filler powder. However, this method is not preferable because a large amount of filler must be added and the transmittance of the front glass plate is reduced.
【０００６】そこでガラス中の鉛含有量を低減し、熱膨
張係数を低下させた誘電体材料が提案されている。しか
しながらこの材料は、焼成時に泡が抜けにくく、大きな
泡が多数残存してしまうため、耐電圧の高い誘電体層を
形成することができない。Therefore, a dielectric material in which the lead content in glass is reduced and the coefficient of thermal expansion is reduced has been proposed. However, this material does not allow bubbles to escape easily during firing, and many large bubbles remain, so that a dielectric layer having high withstand voltage cannot be formed.
【０００７】本発明の目的は、高歪点ガラスに適合した
熱膨張係数を有し、しかも焼成時に泡が抜けやすいプラ
ズマディスプレーパネル用誘電体材料を提供することで
ある。An object of the present invention is to provide a dielectric material for a plasma display panel which has a coefficient of thermal expansion suitable for a glass having a high strain point, and in which bubbles easily escape during firing.
【０００８】[0008]
【課題を解決するための手段】本発明者等は種々の検討
を行った結果、ＰｂＯ−Ｂ2 Ｏ3 −ＳｉＯ2 系ガラスに
おいて、ＰｂＯとＳｉＯ2 の含有量を低く抑えるととも
に、ＺｎＯ、ＢａＯ、ＣａＯ、Ｂｉ2 Ｏ3 、Ａｌ2 Ｏ3
を所定量含有させることにより、上記目的が達成できる
ことを見いだし、本発明として提案するものである。The present inventors have Means for Solving the Problems] As a result of various studies, the PbO-B 2 O 3 -SiO 2 -based glass, with suppressing the content of PbO and SiO 2, ZnO, BaO , CaO, Bi 2 O 3 , Al 2 O 3
It has been found that the above-mentioned object can be achieved by containing a predetermined amount of, and the present invention is proposed.
【０００９】即ち、本発明のプラズマディスプレーパネ
ル用誘電体材料は、重量百分率でＰｂＯ ２５〜５５
％、Ｂ2 Ｏ3 １０〜４０％、ＳｉＯ2 １〜１５％、
ＺｎＯ５〜３５％、ＢａＯ＋ＣａＯ＋Ｂｉ2 Ｏ3 ２〜
２０％、Ａｌ2 Ｏ3 ０〜５％の組成を有するガラス粉
末９０〜１００％と、セラミック粉末０〜１０％からな
ることを特徴とする。That is, the dielectric material for a plasma display panel according to the present invention is composed of PbO 25 to 55 by weight percentage.
%, B 2 O 3 10~40% , SiO 2 1~15%,
ZnO 5 to 35%, BaO + CaO + Bi 2 O 3 2
20%, to a 90% to 100% glass powder having a composition of Al 2 O 3 0 to 5% characterized in that it consists of 0-10% ceramic powder.
【００１０】[0010]
【作用】本発明のプラズマディスプレーパネル用誘電体
材料は、上記組成範囲にあるために、高歪点ガラスの熱
膨張係数（約８３×１０-7／℃）に適合する７０〜８０
×１０-7／℃の熱膨張係数を示す。またガラスの軟化点
が５００〜５８０℃の範囲にあるため、６００℃以下の
温度で焼成が可能である。しかも軟化点付近での粘性変
化が急（ショートなガラス）であるため、泡が抜けやす
い。Since the dielectric material for a plasma display panel of the present invention is in the above composition range, it conforms to the coefficient of thermal expansion of high strain point glass (about 83 × 10 −7 / ° C.).
It shows a coefficient of thermal expansion of × 10 -7 / ° C. Further, since the softening point of the glass is in the range of 500 to 580 ° C., firing at a temperature of 600 ° C. or less is possible. Moreover, since the change in viscosity near the softening point is abrupt (short glass), bubbles are easily removed.
【００１１】本発明の材料において、ガラス粉末の組成
範囲を上記のように限定した理由を述べる。The reasons for limiting the composition range of the glass powder in the material of the present invention as described above will be described.
【００１２】ＰｂＯは軟化点を下げる成分であり、その
含有量は２５〜５５％、好ましくは３０〜５０％であ
る。ＰｂＯが２５％より少ないと軟化点が６００℃を越
えるため、焼成後にガラス中に泡が多数残存してしま
う。５５％より多いと熱膨張係数が高くなる。PbO is a component that lowers the softening point, and its content is 25 to 55%, preferably 30 to 50%. If the content of PbO is less than 25%, the softening point exceeds 600 ° C., so that many bubbles remain in the glass after firing. If it exceeds 55%, the coefficient of thermal expansion becomes high.
【００１３】Ｂ2 Ｏ3 はガラス化範囲を広げる成分であ
り、その含有量は１０〜４０％、好ましくは１５〜３５
％である。Ｂ2 Ｏ3 が１０％より少ないとガラス化が困
難になり、４０％より多いとガラスが分相し易くなって
好ましくない。B 2 O 3 is a component that widens the vitrification range, and its content is 10 to 40%, preferably 15 to 35%.
%. When the content of B 2 O 3 is less than 10%, vitrification becomes difficult. When the content is more than 40%, the glass is liable to phase separation, which is not preferable.
【００１４】ＳｉＯ2 はガラスの骨格を形成する成分で
あり、その含有量は１〜１５％、好ましくは２〜１３％
である。ＳｉＯ2 が１％より少ないとガラス化が困難に
なり、１５％より多いと軟化点が６００℃を越え、また
ガラスの粘性変化が緩やか（ロングなガラス）になるた
め、泡が抜けにくくなる。SiO 2 is a component forming a skeleton of glass, and its content is 1 to 15%, preferably 2 to 13%.
It is. When the content of SiO 2 is less than 1%, vitrification becomes difficult. When the content is more than 15%, the softening point exceeds 600 ° C., and the viscosity of the glass changes slowly (long glass), so that bubbles hardly escape.
【００１５】ＺｎＯは熱膨張係数を低下させるととも
に、軟化点を下げる成分であり、その含有量は５〜３５
％、好ましくは１０〜３０％である。ＺｎＯが５％より
少ないと上記効果を得ることができず、３５％より多い
と焼成時に失透し易くなる。ZnO is a component that lowers the coefficient of thermal expansion and lowers the softening point.
%, Preferably 10 to 30%. If ZnO is less than 5%, the above effect cannot be obtained, and if it is more than 35%, devitrification tends to occur during firing.
【００１６】ＢａＯ、Ｃａ０、及びＢｉ2 Ｏ3 は軟化点
を低下させるとともに、脱泡性に影響する高温粘性を調
整するための成分であり、その含有量は合量で２〜２０
％、好ましくは３〜１８％である。なお各成分の含有量
は、ＢａＯ ０〜２０％（好ましくは０〜１５％）、Ｃ
ａＯ ０〜２０％（好ましくは０〜１５％）、Ｂｉ2Ｏ3
０〜１０％（好ましくは０〜７％）である。これら
成分の合量が２％より少ないと上記効果を得ることが困
難になり、２０％より多いと軟化点が低下しすぎて焼成
時に発泡し易くなるとともに、熱膨張係数が高くなりす
ぎる。また各成分の含有量が多すぎる場合も、発泡した
り、高膨張化し易くなって好ましくない。BaO, Ca0, and Bi 2 O 3 are components for lowering the softening point and for adjusting the high-temperature viscosity which affects the defoaming property.
%, Preferably 3 to 18%. The content of each component is BaO 0 to 20% (preferably 0 to 15%),
aO 0-20% (preferably 0-15%), Bi 2 O 3
It is 0 to 10% (preferably 0 to 7%). If the total amount of these components is less than 2%, it is difficult to obtain the above effects. If the total amount is more than 20%, the softening point is too low, so that foaming tends to occur during firing, and the thermal expansion coefficient is too high. Also, when the content of each component is too large, it is not preferable because foaming or high expansion is easily caused.
【００１７】Ａｌ2 Ｏ3 は分相を抑制し、均一なガラス
を得るための成分であり、５％まで含有させることがで
きる。しかしＡｌ2 Ｏ3 が５％より多いと軟化点が上昇
し、泡が抜け難くなる。Al 2 O 3 is a component for suppressing phase separation and obtaining a uniform glass, and can be contained up to 5%. However, if the content of Al 2 O 3 is more than 5%, the softening point is increased, and it is difficult for bubbles to escape.
【００１８】本発明のプラズマディスプレーパネル用誘
電体材料において、焼成後のガラス強度の改善や外観の
調節のために、アルミナ、ジルコン、ジルコニア、酸化
チタン等のセラミック粉末を添加することができる。In the dielectric material for a plasma display panel of the present invention, a ceramic powder such as alumina, zircon, zirconia, or titanium oxide can be added for improving the glass strength after firing and adjusting the appearance.
【００１９】ガラス粉末とセラミック粉末の割合は、ガ
ラス粉末９０〜１００重量％、セラミック粉末０〜１０
重量％である。なおセラミック粉末が１０％より多いと
可視光が散乱して不透明になってしまう。またガラス粉
末及びセラミック粉末の最大粒径は、それぞれ３０μｍ
以下、及び１５μｍ以下であることが好ましい。The ratio of glass powder to ceramic powder is 90 to 100% by weight of glass powder and 0 to 10% of ceramic powder.
% By weight. If the content of the ceramic powder is more than 10%, visible light is scattered and becomes opaque. The maximum particle size of the glass powder and the ceramic powder is 30 μm each.
Or less, and preferably 15 μm or less.
【００２０】[0020]
【実施例】以下、実施例に基づいて本発明を説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below based on embodiments.
【００２１】表１〜３は、本発明の実施例（試料Ｎｏ．
１〜１１）及び比較例（試料Ｎｏ．１２）を示してい
る。Tables 1 to 3 show examples (sample Nos.) Of the present invention.
1 to 11) and a comparative example (sample No. 12).
【００２２】[0022]
【表１】 [Table 1]
【００２３】[0023]
【表２】 [Table 2]
【００２４】[0024]
【表３】 [Table 3]
【００２５】各試料は次のようにして調製した。まず表
に示す組成となるようにガラス原料を調合し、白金坩堝
に入れて１３００℃で２時間溶融した後、溶融ガラスを
薄板状に成形した。次いでこれを粉砕し、分級して最大
粒径２０μｍ以下のガラス粉末からなる試料を得、ガラ
スの軟化点を測定した。さらにＮｏ．１１のガラス粉末
についてはアルミナ粉末と混合して試料とした。Each sample was prepared as follows. First, glass raw materials were prepared so as to have the composition shown in the table, put in a platinum crucible and melted at 1300 ° C. for 2 hours, and then the molten glass was formed into a thin plate. Next, this was pulverized and classified to obtain a sample composed of glass powder having a maximum particle size of 20 μm or less, and the softening point of the glass was measured. In addition, No. The glass powder of No. 11 was mixed with alumina powder to prepare a sample.
【００２６】得られた試料について、熱膨張係数、焼成
後に残存する泡の平均径を評価した。結果を各表に示
す。The obtained sample was evaluated for the coefficient of thermal expansion and the average diameter of bubbles remaining after firing. The results are shown in each table.
【００２７】表から明らかなように、実施例であるＮ
ｏ．１〜１１の各試料は、ガラスの軟化点が５２５〜５
８０℃、熱膨張係数が７３〜７９×１０-7／℃であり、
また焼成後に残存する泡の平均径が１６μｍ以下であっ
た。一方、比較例であるＮｏ．１２の試料は、ガラスの
軟化点が５８０℃、熱膨張係数が７８×１０-7／℃であ
り、実施例の各試料と同等の値を示した。しかし残存す
る泡の平均径が２５μｍと大きく、耐電圧の高い誘電体
層を形成できないことがわかった。As is clear from the table, the N
o. Each of the samples 1 to 11 has a glass softening point of 525 to 5
80 ° C., the coefficient of thermal expansion is 73 to 79 × 10 −7 / ° C.,
Further, the average diameter of the foam remaining after firing was 16 μm or less. On the other hand, in Comparative Example No. Twelve samples had a glass softening point of 580 ° C. and a coefficient of thermal expansion of 78 × 10 −7 / ° C., showing values equivalent to each of the samples of the examples. However, it was found that the average diameter of the remaining bubbles was as large as 25 μm, and a dielectric layer having a high withstand voltage could not be formed.
【００２８】なおガラスの軟化点は示差熱分析計を用い
て測定したものであり、第二吸収ピークの値で示した。
熱膨張係数は、各試料を粉末プレス成型し、焼成、研磨
後に熱機械分析装置により３０〜３００℃における値を
測定した。泡の平均径については次のようにして評価し
た。まず各試料をエチルセルロースの５％ターピネオー
ル溶液と混練してペーストを得た。次いでこのペースト
を高歪点ガラス板（熱膨張係数８３×１０-7／℃）の上
にスクリーン印刷法で塗布し、電気炉中に入れて５８０
℃で１０分間焼成した。その後、この焼成物を金属顕微
鏡（２００倍）を用いて写真撮影し、５ｃｍ角の面積内
の泡のサイズを測定してその平均値を算出した。The softening point of the glass was measured using a differential thermal analyzer and is shown by the value of the second absorption peak.
The coefficient of thermal expansion was measured at 30 to 300 ° C. by a thermomechanical analyzer after each sample was subjected to powder press molding, firing and polishing. The average diameter of the foam was evaluated as follows. First, each sample was kneaded with a 5% terpineol solution of ethyl cellulose to obtain a paste. Next, this paste was applied on a glass plate having a high strain point (coefficient of thermal expansion 83 × 10 −7 / ° C.) by a screen printing method, and placed in an electric furnace for 580.
Baking at ℃ for 10 minutes. Thereafter, a photograph of the fired product was taken using a metallographic microscope (magnification: 200), the size of bubbles in an area of 5 cm square was measured, and the average value was calculated.
【００２９】[0029]
【発明の効果】以上説明したように、本発明のプラズマ
ディスプレーパネル用誘電体材料は、高歪点ガラスに適
合する熱膨張係数を有している。しかも焼成時に泡が抜
けやすいために、耐電圧の高い誘電体層を得ることがで
きる。As described above, the dielectric material for a plasma display panel according to the present invention has a coefficient of thermal expansion suitable for high strain point glass. Moreover, since bubbles are easily removed during firing, a dielectric layer having high withstand voltage can be obtained.
【００３０】それゆえ高歪点ガラスを用いたプラズマデ
ィスプレーパネルの誘電体形成材料として好適である。Therefore, it is suitable as a dielectric material for a plasma display panel using a high strain point glass.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 波多野 和夫 滋賀県大津市晴嵐２丁目７番１号 日本電 気硝子株式会社内 ────────────────────────────────────────────────── ─── Continued on front page (72) Inventor Kazuo Hatano 2-7-1 Hararashi, Otsu City, Shiga Prefecture Nippon Electric Glass Co., Ltd.
Claims (1)
2 Ｏ3 １０〜４０％、ＳｉＯ2 １〜１５％、ＺｎＯ
５〜３５％、ＢａＯ＋ＣａＯ＋Ｂｉ2 Ｏ3２〜２０
％、Ａｌ2 Ｏ3 ０〜５％の組成を有するガラス粉末９
０〜１００％と、セラミック粉末０〜１０％からなるこ
とを特徴とするプラズマディスプレーパネル用誘電体材
料。1. 25 to 55% by weight of PbO, B
2 O 3 10~40%, SiO 2 1~15%, ZnO
5~35%, BaO + CaO + Bi 2 O 3 2~20
%, Glass powder 9 having a composition of Al 2 O 3 0 to 5%
A dielectric material for a plasma display panel, comprising 0 to 100% and 0 to 10% of a ceramic powder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19308497A JP3829887B2 (en) | 1997-07-02 | 1997-07-02 | Dielectric materials for plasma display panels |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP19308497A JP3829887B2 (en) | 1997-07-02 | 1997-07-02 | Dielectric materials for plasma display panels |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1121148A true JPH1121148A (en) | 1999-01-26 |
| JP3829887B2 JP3829887B2 (en) | 2006-10-04 |
Family
ID=16301967
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP19308497A Expired - Fee Related JP3829887B2 (en) | 1997-07-02 | 1997-07-02 | Dielectric materials for plasma display panels |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3829887B2 (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6271161B1 (en) * | 1998-09-01 | 2001-08-07 | Lg Electronics Inc. | Composition for barrier ribs of plasma display panel and method of fabricating such barrier ribs using the composition |
| US6417123B1 (en) | 2000-08-14 | 2002-07-09 | Nippon Electric Glass Co., Ltd. | Dielectric composition useful for light transparent layer in PDP |
| US6635193B1 (en) | 1999-08-13 | 2003-10-21 | Nippon Electric Glass Co., Ltd. | Dielectric composition comprising powder of glass containing copper oxide useful for light transparent layer in PDP |
| US7012372B2 (en) | 2002-01-10 | 2006-03-14 | Matsushita Electric Industrial Co., Ltd. | Electrode-coating glass composition, coating for forming electrode-coating glass, and plasma display panel using the same and its manufacturing method |
| CN100384767C (en) * | 2003-05-22 | 2008-04-30 | 日本电气硝子株式会社 | Dielectric material for plasma display plate |
| JP2008150269A (en) * | 2006-12-20 | 2008-07-03 | Central Glass Co Ltd | Insulating protective coating material |
-
1997
- 1997-07-02 JP JP19308497A patent/JP3829887B2/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6271161B1 (en) * | 1998-09-01 | 2001-08-07 | Lg Electronics Inc. | Composition for barrier ribs of plasma display panel and method of fabricating such barrier ribs using the composition |
| US6635193B1 (en) | 1999-08-13 | 2003-10-21 | Nippon Electric Glass Co., Ltd. | Dielectric composition comprising powder of glass containing copper oxide useful for light transparent layer in PDP |
| US7138076B2 (en) | 1999-08-13 | 2006-11-21 | Nippon Electric Glass Co., Ltd. | Dielectric composition comprising powder of glass containing copper oxide useful for light transparent layer in PDP |
| US6417123B1 (en) | 2000-08-14 | 2002-07-09 | Nippon Electric Glass Co., Ltd. | Dielectric composition useful for light transparent layer in PDP |
| US7012372B2 (en) | 2002-01-10 | 2006-03-14 | Matsushita Electric Industrial Co., Ltd. | Electrode-coating glass composition, coating for forming electrode-coating glass, and plasma display panel using the same and its manufacturing method |
| CN100343938C (en) * | 2002-01-10 | 2007-10-17 | 松下电器产业株式会社 | Glass composite for coating electrode, glass paint for forming coated electrode, plasma display plate with it and its making process |
| CN100384767C (en) * | 2003-05-22 | 2008-04-30 | 日本电气硝子株式会社 | Dielectric material for plasma display plate |
| JP2008150269A (en) * | 2006-12-20 | 2008-07-03 | Central Glass Co Ltd | Insulating protective coating material |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3829887B2 (en) | 2006-10-04 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP3827987B2 (en) | Lead-free glass frit | |
| JP2995728B2 (en) | Low dielectric constant glass composition | |
| JP3775556B2 (en) | Plasma display panel materials and glass powder | |
| JP2005041734A (en) | Glass for dielectric formation and dielectric formation material for plasma display panel | |
| JP2007039269A (en) | Glass for covering electrode, and plasma display device | |
| JP2000313635A (en) | Material for plasma display panel | |
| KR20070088296A (en) | Glass for coating electrode | |
| JPH09268026A (en) | Glass composition for electrical insulation | |
| JP4686858B2 (en) | Glass substrate for flat panel display | |
| JPH11180726A (en) | Substrate for plasma display panel and low melting point glass composition | |
| JP3829887B2 (en) | Dielectric materials for plasma display panels | |
| JP2001048577A (en) | Material for plasma display panel, and glass powder | |
| JPH09188544A (en) | Glass composition | |
| JP2926800B2 (en) | Glass composition | |
| JP2001080934A (en) | Material for plasma display panel and glass powder | |
| JP4389257B2 (en) | Glass substrate for flat panel display | |
| JP3424700B2 (en) | Glass composition for insulation | |
| JP4114121B2 (en) | Material for plasma display panel and glass composition | |
| JPH1025128A (en) | Glass for substrate | |
| JP2002160940A (en) | Glass for forming partition | |
| JP4756428B2 (en) | Glass substrate for flat panel display | |
| JP4174894B2 (en) | Transparent dielectric material for front glass plate of plasma display panel | |
| JP2000351650A (en) | Black stripe material for plasma display panel | |
| JP3829959B2 (en) | Dielectric material for plasma display panel | |
| JP3897202B2 (en) | Glass ceramic composite material for partition wall formation |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Effective date: 20050701 Free format text: JAPANESE INTERMEDIATE CODE: A971007 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20060515 |
|
| A521 | Written amendment |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20060531 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Effective date: 20060621 Free format text: JAPANESE INTERMEDIATE CODE: A01 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20060704 |
|
| R150 | Certificate of patent (=grant) or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| LAPS | Cancellation because of no payment of annual fees |