JPH11207784A - Apparatus and method for injection molding thermosetting resin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve a quality of a molding by eliminating an unevenness of a resin temperature at the time of injecting a thermosetting resin, preventing an inconvenience of a filling balance of the resin in a cavity, and improving its moldability. SOLUTION: The apparatus for injection molding a thermosetting resin comprises a mold 1 having a fixed side mold 10 and a movable side mold 20. The mold 10 has a plurality of first spools for retaining a thermosetting resin P without curing for next injection, and a plurality of second spools 12 respectively communicating with the spools 11. And, the apparatus also comprises a plurality of flow routes 30 respectively communicating with the spools 12, a plurality of cavities 40 respectively communicating with the routes 30 to mold moldings S, and temperature regulating circuits 60 formed around the respective spools 11 to temperature regulate.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a thermosetting resin for producing a molded product as a product by injecting a thermosetting resin such as an epoxy resin or a phenol resin into a heated mold. The present invention relates to an injection molding apparatus and an injection molding method.

[0002]

2. Description of the Related Art In general, when a product is manufactured using a thermosetting resin such as an epoxy resin or a phenol resin, the shape of the product is previously adjusted while heating the thermosetting resin as a material to some extent. Heat the molding die manufactured by
A thermosetting resin injection molding apparatus is used in which a thermosetting resin is injected into the molding die and cured to produce a molded product.

FIG. 3 shows a conventional thermosetting resin injection molding apparatus of this type, for example.

[0004] This injection molding apparatus, as shown in FIG.
A mold 1 comprising a fixed mold 10 and a movable mold 20 is provided. The fixed mold 10 is prepared for the next injection without curing a thermosetting resin P such as an epoxy resin or a phenol resin. And a plurality of second spools 12 respectively communicating with the first spools 11, and each of the first spools 11 is provided between the fixed mold 10 and the movable mold 20. It has a flow path 30 that communicates with the two spools 12 and a plurality of cavities 40 that respectively communicate with the flow paths 30 and form the molded product S.

Each of the first spools 11 is provided on a plurality of spool bushings 15 provided on the fixed mold 10 side to maintain the thermosetting resin P in each of the first spools 11 at a temperature at which the resin P does not cure for a certain period of time. Have been.

In the movable mold 20, each cavity 40 is provided.
When the mold 1 is opened, the projecting pins 21, 22, and 23 are respectively provided to release the cured molded product S therein, the second spool 12, and the cured resin C in the flow path 30 from the mold 1. Have been.

Further, on the upper part of each spool bush 15 in the fixed mold 10, these spool bushes 15
A manifold 50 having a runner 51 communicating with each of the first spools 11 is disposed, and an upper spool bush 17 having an upper spool 16 communicating with the runner 51 is disposed above the manifold 50.

In order to perform injection molding with the injection molding apparatus having the above-described structure, the thermosetting resin P having a temperature at which it cannot be cured for a certain period of time and which can flow from the upper spool 16 of the upper spool bushing 17 is supplied to the manifold 50. After flowing from each first spool 11 of each spool bush 15 through each runner 51 through each second spool 12 and each flow path 30 and injecting it into each cavity 40, the thermosetting resin P is heated and cured to be molded. Movable mold 2
After the downward movement of 0, the molded products S in each cavity 40 and the cured resin C in each second spool 12 and each flow path 30 are taken out by the respective projecting pins 21, 22 and 23.

Normally, in such an injection molding apparatus, the fixed mold 10 and the movable mold 20 in which the respective cavities 40 into which the thermosetting resin P is injected are formed, the thermosetting resin P is cured. Is heated to the temperature to be cured, and the time until curing is determined by the temperature of the mold 1 and the curing characteristics of the thermosetting resin P.
That is, the molding time is determined.

[0010]

However, in the injection molding apparatus having the above-described structure, the temperatures of the thermosetting resins P flowing from the plurality of first spools 11 to the plurality of second spools 12 are not the same. And each second spool 12
When the thermosetting resin is injected into each cavity 40 from each of the flow paths 30 communicating with the cavities, the temperature of the thermosetting resin varies, which causes inconvenience in the filling balance of the thermosetting resin in each cavity 40. There was a problem.

The present invention solves the above-mentioned problems, and can eliminate the variation in the resin temperature at the time of injection of the thermosetting resin, thereby preventing the inconvenience of the balance of filling the thermosetting resin in each cavity. It is an object of the present invention to provide a thermosetting resin injection molding apparatus and an injection molding method capable of improving moldability and improving the quality of a molded product.

[0012]

In order to achieve the above object, an injection molding apparatus for a thermosetting resin according to the present invention comprises a mold comprising a fixed mold and a movable mold, wherein the fixed mold is provided. The mold has a plurality of first spools for leaving the thermosetting resin without being cured and ready for the next injection, and a plurality of second spools respectively communicating with the first spools. Thermosetting between a mold and a movable mold having a plurality of flow paths each communicating with the plurality of second spools and a plurality of cavities for communicating with these flow paths to form a molded product. In the injection molding equipment of the conductive resin,
A temperature control circuit for temperature control capable of heating and cooling is formed around each of the plurality of first spools.

[0013] Further, the injection molding method of a thermosetting resin of the present invention has a mold comprising a fixed mold and a movable mold.
The fixed-side mold has a plurality of first spools for leaving the thermosetting resin in preparation for the next injection without curing, and a plurality of second spools respectively communicating with these first spools, A plurality of flow paths respectively communicating with the plurality of second spools and a plurality of cavities for communicating with the flow paths and molding a molded product are provided between the fixed mold and the movable mold. Using a thermosetting resin injection molding apparatus having the thermosetting resin from the first spool to the second spool.
Injection into the cavity through a spool and a flow path, and heat-curing of the thermosetting resin to take out a molded product in the cavity and a cured resin in the second spool and the flow path. In the injection molding method of a thermosetting resin, a temperature control circuit for temperature control capable of heating and cooling is formed around each of the plurality of first spools, and the thermosetting resin in the first spool is formed by the temperature control circuit. The temperature is adjusted, and a thermosetting resin is injected from the first spool to the second spool in this state.

According to the thermosetting resin injection molding apparatus and the injection molding method of the present invention, a temperature control circuit capable of heating and cooling is formed around a plurality of first spools provided on a fixed mold. Since the thermosetting resin passing through each of the plurality of first spools is controlled to the same resin temperature that is optimal for injection molding, it is possible to eliminate variations in the resin temperature during injection of the thermosetting resin. In addition, it is possible to improve the moldability and improve the quality of the molded product without inconvenience in the filling balance of the thermosetting resin in each cavity.

[0015]

Embodiments of the present invention will be described below with reference to the drawings.

FIG. 1 is a longitudinal sectional view showing a thermosetting resin injection molding apparatus according to an embodiment of the present invention, and FIG. 2 is an enlarged schematic longitudinal sectional view of a main part thereof. The same members and the same parts as those of the above-described conventional thermosetting resin injection molding apparatus are denoted by the same reference numerals and described.

As shown in FIG. 1, the injection molding apparatus of the present embodiment includes a mold 1 comprising a fixed mold 10 and a movable mold 20 which are vertically arranged, and a fixed mold which is an upper mold. Mold 1
Numeral 0 is fixed, and the movable mold 20 as the lower mold is configured to move up and down, so that opening and closing of the mold 1 is performed by moving the movable mold 20 up and down. It has become.

A thermosetting resin P, such as an epoxy resin or a phenol resin, which has not been cured for a certain period of time and has been heated to a temperature at which it can flow, is left in the upper fixed die 10 in preparation for the next injection. A plurality of spool bushes 15 having a plurality of first spools 11 are provided, and below the first spools 11 are communicated with the first spools 11 and heated to a temperature at which the thermosetting resin P is cured. Multiple second
A spool 12 is formed.

A plurality of flow paths 30 communicating with the second spools 12 and heated to a temperature at which the thermosetting resin P is cured, are provided between the fixed mold 10 and the movable mold 20. A plurality of cavities 40 are provided in communication with the flow path 30 to heat and cure the thermosetting resin to form the molded product S.

Further, a temperature control circuit 60 for heating and cooling for temperature control is formed around each first spool 11. These temperature control circuits 60 include the first spool 1
2 is provided from the upper portion of each spool bush 15 to the vicinity of the lower portion of the first spool 11. As shown in FIG. 2, the lower portion of the first spool 11 is formed in an annular shape so as to surround the first spool 11. ing. A medium such as oil or water flows in these temperature control circuits 60 in the directions of arrows in FIGS. 1 and 2, and the temperature in each first spool 11 is set to about 70 ° C. to about 110 ° C. Is maintained at a predetermined temperature in the range of.

Further, after the mold 1 is opened, the movable side mold 20 has projecting pins 21, 2 for pushing out the cured resin C in each flow path 30 and the molded product S in each cavity 40.
2 and 23 are provided respectively.

Further, on the upper part of each spool bush 15 in the fixed mold 10, these spool bushes 15
A manifold 50 having a runner 51 communicating with each of the first spools 11 is disposed, and an upper spool bush 17 having an upper spool 16 communicating with the runner 51 is disposed above the manifold 50.

Next, using the injection molding apparatus having the above configuration,
The steps of the injection molding method of a thermosetting resin will be described below.

In the mold closing step of the mold 1, the movable mold 20
Is raised so as to come into contact with the fixed mold 10 to close the mold. Next, in the injection process of the thermosetting resin P, the thermosetting resin P sent from an external injection cylinder (not shown) or the like is melted without being cured for a certain period of time and heated and melted to a temperature at which it can flow. The thermosetting resin P, which flows from the upper spool 16 of the first through the runners 51 of the manifold 50 into the first spools 11 and is heated to a temperature at which the first spools 11 harden, is supplied to the second spools 17.
Each cavity 40 through the spool 12 and the flow path 30
It is injected and filled in.

Since the temperature control circuit 60 capable of heating and cooling is incorporated in each spool bush 15, the resin temperature of the thermosetting resin P is controlled to an optimum temperature. There is an operation to be described.

The thermosetting resin P flowing to each first spool 11 through the upper spool 16 and the runner 51 is heated to a temperature at which it can flow and cannot be cured for a certain period of time. The resin temperature of one spool 11 depends on the temperature of each spool bush 15. That is, since each spool bush 15 is in contact with the fixed mold 10 heated to the extent that the thermosetting resin P is cured, the heat is heated by the heat and the temperature of the spool bush 15 rises.
The temperature of the thermosetting resin P in the first spool 11 also increases. Here, the spool bush 15 is heated to about 70 ° C. to about 1 ° C. by a pre-formed heating / cooling temperature control circuit 60.
The temperature is kept constant at a predetermined temperature in the range of 10 ° C. As a result, the thermosetting resin P injected through each first spool 11 does not generate a temperature difference, and each
Each cavity 40 through the spool 12 and the flow path 30
It is injected and filled in.

Here, each spool bush 15 is maintained at a constant temperature by setting the temperature of a medium such as oil or water flowing through each temperature control circuit 60 to a constant temperature.

The thermosetting resin P has the property that when it is heated in the mold 1, its viscosity decreases due to an increase in temperature, and the thermosetting resin P becomes fluid.

When the mold is further heated to a temperature at which it can be cured, its flow becomes the largest and the mold 1 is filled up to every corner. In this state, curing starts gradually, and the curing is completed in a certain period of time. The time when the flow becomes the largest is the gel time, and the injection operation required for the thermosetting resin is completed by completing the necessary injection operation during that time.

According to the above-described operation, the temperature of the resin which influences the flow of the thermosetting resin P can be controlled to an optimum and uniform temperature in each of the first spools 11 by the respective temperature control circuits 60 capable of heating and cooling. As a result, it is possible to control the thermosetting resin P to be injected into each cavity 40 when the flow of the thermosetting resin P becomes the best (when the viscosity of the resin decreases). Therefore, in a component such as a semiconductor molded component in which fine wiring and the like are arranged inside, it was confirmed that a good molded product can be obtained without causing disconnection or wiring collapse of the wiring. .

Next, in the molded article removing step, after the molded article S is completely cured by the operation of each of the above-described steps, the mold 1 is opened, and the cured molded article S and the second molded article are removed.
The cured resin C of the spool 12 and the flow path 30 is supplied to the mold 1 by the protruding pins 21, 22, and 23 incorporated in the movable mold 20.
Release from mold.

Therefore, in the injection molding apparatus of this embodiment,
It is possible to obtain a molded article S such as a semiconductor molded part having a higher quality while having the same molding operation as the conventional one.

[0033]

According to the thermosetting resin injection molding apparatus and the injection molding method of the present invention, it is possible to eliminate the variation in the temperature of the thermosetting resin in the plurality of first spools and to minimize the viscosity. In this state, the thermosetting resin can be injected into each cavity and the temperature of the thermosetting resin at the time of injection can be eliminated, and the filling balance of the thermosetting resin in each cavity can be inconvenient. Can be prevented, the moldability can be improved, and the quality of the molded product can be improved.

[Brief description of the drawings]

FIG. 1 is a longitudinal sectional view of an embodiment of a thermosetting resin injection molding apparatus according to the present invention.

FIG. 2 is a schematic enlarged sectional view showing a main part of a thermosetting resin injection molding apparatus according to an embodiment.

FIG. 3 is a longitudinal sectional view of a conventional thermosetting resin injection molding apparatus.

[Explanation of symbols]

 Reference Signs List 1 mold 10 fixed mold 11 first spool 12 second spool 20 movable mold 30 flow path 40 cavity 60 temperature control circuit P thermosetting resin S molded product

Claims (2)

[Claims] 1. A mold comprising a fixed-side mold and a movable-side mold, wherein the fixed-side mold is provided with a plurality of thermosetting resins which are not cured but are left in preparation for the next injection. A first spool and a plurality of second spools respectively communicating with the first spools; a plurality of second spools respectively communicating with the plurality of second spools between the fixed mold and the movable mold; In a thermosetting resin injection molding apparatus having a flow path and a plurality of cavities for communicating with the flow paths to form a molded product, a temperature control for heating and cooling around the plurality of first spools is provided. An injection molding apparatus for a thermosetting resin, wherein each of the temperature control circuits is formed. 2. A mold comprising a fixed mold and a movable mold, wherein the fixed mold has a plurality of thermosetting resins which are not cured and are left for the next injection. And a plurality of second spools respectively communicating with the first spools. A plurality of second spools respectively communicating with the plurality of second spools are provided between the fixed mold and the movable mold. The thermosetting resin flows from the first spool to the second spool by using a thermosetting resin injection molding apparatus having a plurality of flow paths and a plurality of cavities communicating with the respective flow paths to form a molded product. The thermosetting resin is injected into the cavity through a path, and the thermosetting resin is heated and cured to take out the molded product in the cavity and the cured resin in the second spool and the flow path. In the injection molding method, A temperature control circuit for temperature control capable of heating and cooling is formed around each of the plurality of first spools, and the temperature of the thermosetting resin in the first spool is controlled by the temperature control circuit. A thermosetting resin injection molding method, wherein the thermosetting resin is injected from the first spool to the second spool.