JPH11204237A - Heating device, and soldering device using the device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a heating device capable of uniformly and efficiently heating electronic parts of a lot of sorts of material qualities and color tones to be mounted on one printed wiring board, and apply this heating device to a soldering device. SOLUTION: For a heating device 1, triangular waves of irregulartited stripe 4 are formed at the part of one side surface 3 of a triangular columnar main body 2 comprising aluminum, a porous oxide layer 5 is formed on the surface of them by anode oxidation, inorganic pigment 6 of black comprising carbon is adsorbed in the ports and surface of the porous oxide layer 5, dyeing is applied, and a sheathed heater 8 is inserted into a heater insertion hole 7 in the main body 2 to constitute it.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heating device having a high infrared radiation efficiency and a soldering device using the heating device, and more particularly to a device for uniformly heating a work to be soldered and performing soldering. .

[0002]

2. Description of the Related Art As a heating device for heating by infrared radiation, there is known a heater in which a surface of a heater is coated with an infrared radiation material such as ceramics. That is, it is constituted by a combination of infrared radiation ceramics and a heater for heating the ceramics.

Further, as disclosed in Japanese Utility Model Laid-Open No. 5-59788, the surface of a ceramic is made uneven so that the directivity of the radiation direction of the infrared rays is diffused and the hide zone (h) of the infrared radiation is irradiated.
There is also a technology that eliminates the ide zone).

[0004] By increasing the infrared radiation area and the heat conduction area of the heater by forming irregularities on the surface of the heater or providing fins, the efficiency of heat transfer to the object to be heated is improved, and the heating efficiency is improved. Techniques for causing this are well known.

By the way, as a soldering device for soldering a work to be soldered such as a printed wiring board, a flow type soldering device and a reflow type soldering device are generally classified. In a flow type soldering apparatus, a heating apparatus is used when preheating a printed wiring board to which a flux has been applied. In a reflow soldering apparatus, a heating device is used when preheating a printed wiring board and performing reflow heating.

[0006] As a heating device used in these soldering devices, there are a device for performing heating with infrared rays or far infrared rays, a device for performing hot air heating by blowing hot air, and a device using both of them.

For example, Japanese Patent Application Laid-Open No. 60-6270 discloses an example of a reflow soldering apparatus using an infrared panel heater. In addition, the actual practice described above 5
The technology of the panel heater disclosed in JP-A-59788 is also a heater technology for reflow soldering.

Further, Japanese Utility Model Publication No. 3-15254 discloses an example in which a fin heater is used for circulating air heating in a reflow soldering apparatus, and an example in which a far-infrared heater is used for heating a hot wire. Described.

[0009]

The wavelength band in which infrared rays are favorably absorbed differs depending on the material and color tone of the object to be heated. Therefore, in the case where many types of materials and color members are used for one workpiece to be heated, in order to uniformly heat each of those parts, heating that emits abundant infrared energy over a wide wavelength range is performed. It is required to use a device. Of course, good infrared radiation efficiency is also required.

[0010] Further, if a specific work to be heated is selectively heated in a large amount, a heating device that emits a large amount of infrared energy in a wavelength band in which the work to be heated absorbs infrared light is suitable.

For example, when soldering a printed wiring board on which many types of electronic components are mounted, the printed wiring board is heated. In particular, in the case of performing reflow soldering of a printed wiring board, the difference in the material and color tone of the electronic component greatly affects the heating profile, and is particularly important in aligning them.

A "ceramic block" as disclosed in Japanese Utility Model Laid-Open Publication No. 5-59788 has good radiation efficiency of infrared rays, but the "ceramic block" is not affected by a temperature change of a heater for heating the "ceramic block". There is a problem that the response of the temperature change is slow.

This is because the thermal conductivity of ceramics, which is an infrared radiating material, is small, generally about 1/5 to 1/10 of iron and about 1/20 to 1/40 of aluminum. is there. For this reason, the "ceramic block" having a large volume has a high efficiency of emitting infrared rays, but has a problem that the response when the temperature needs to be adjusted is extremely slow.

An object of the present invention is to realize a heating device which has good infrared radiation efficiency and emits abundant infrared energy over a wide wavelength range. Another object of the present invention is to realize a heating device capable of selectively and relatively heating a specific portion of a work to be heated. Another object of the present invention is to realize a heating device having good responsiveness when adjusting the heating temperature. Another object of the present invention is to realize a soldering apparatus that can uniformly and efficiently heat electronic components of various materials and colors such as a printed wiring board using the heating apparatus.

[0015]

SUMMARY OF THE INVENTION The present invention is based on the object of forming a three-dimensional structure of a metal oxide which is made of aluminum having a high thermal conductivity and which has excellent infrared radiation when heated and carbon which emits infrared radiation over a wide wavelength range. There is a feature in that a member formed by combining them into one is used as an infrared radiator.

(1) Heating device-1 A porous oxide layer is formed on the surface of aluminum, and the porous oxide layer is dyed with an inorganic pigment to form a heat ray radiator. Is a heating device configured to be provided.

That is, the porous metal oxide radiates infrared rays favorably. Further, since the pigment is porous, the pigment is adsorbed in the pores to form a strong layer. Further, by selecting a pigment, it is possible to select infrared radiation characteristics such as emitting more infrared rays in a specific wavelength band.

(2) Heating device-2 Aluminum is anodically oxidized to form a porous oxide layer on its surface, and the porous oxide layer is dyed with a black inorganic pigment to emit heat rays. This is a heating device configured to be a body and provided with a heater for the heat ray radiator.

When a black inorganic pigment, that is, carbon is brought into contact with the porous oxide layer formed on the surface of the porous oxide layer by anodizing aluminum and dyeing the inorganic oxide, the inorganic pigment is coated on the inner surface of the porous oxide layer. Is adsorbed. That is, the porous oxide layer is impregnated with a black inorganic pigment made of carbon and dyed, and the porous oxide layer and carbon are integrated.

Incidentally, it is known that metal oxides radiate infrared rays better than the metal itself. It is also known that black carbon radiates infrared rays abundantly over a wide wavelength range due to blackbody radiation.

That is, the porous oxide layer and carbon, which is a black inorganic pigment adsorbed on the porous oxide layer,
When heated, infrared light is emitted efficiently over a wide wavelength range. Therefore, even when the workpiece to be heated is composed of many types of partial workpieces and is composed of many materials and colors, the workpiece to be heated can be efficiently and uniformly heated.

Further, since aluminum has a high thermal conductivity, the response of the heater to changes in temperature is good, and the controllability of temperature is excellent.

(3) Soldering Apparatus-1 In a flow type and a reflow type soldering apparatus,
This is a soldering device configured to provide any one of the heating devices described in the above item (1) or (2) so as to face the work to be soldered.

In a work to be soldered constituted by mounting many types of components such as a printed wiring board, it is difficult to uniformly heat those components. This is because the material and color tone of the material used for each type of component are different, and the wavelength dependence of the infrared absorptivity is different for each component.

However, by using the heating device as described in the above item (1) or (2), the work to be heated is constituted by many kinds of partial works, and these are made of a large number of materials and color tones. , The workpieces to be heated can be efficiently and uniformly heated.

It is also possible to forcibly heat only a specific portion having a large heat capacity or the like by relatively heating it.

That is, it becomes possible to uniformly heat a work to be soldered constituted by mounting many types of components such as a printed wiring board. As a result, it is possible to uniformly heat the printed wiring board and its mounted components to perform uniform soldering. In particular, in a reflow soldering apparatus using infrared heating or a combination of infrared heating and hot air heating, by uniformly heating the reflow component itself, the soldered portion of the component can be heated uniformly. The effect is remarkable.

(4) Soldering Apparatus-2 In a soldering apparatus for heating and soldering a work to be soldered while being conveyed by a conveyer, the heating apparatus described in the above item (1) or (2) is used. The soldering device is provided at a position opposed to the work to be soldered, and is configured to form a number of concave and convex strips on the surface of the heating device in a direction intersecting the transport direction of the work to be soldered.

When a large number of concave and convex strips are formed, the surface area is increased and the radiation efficiency of infrared rays is improved, and infrared rays are radiated vertically from the surface of the concave and convex strips. Directivity can be given.

When the flow soldering apparatus or the reflow soldering apparatus has a conveyor for transferring the work to be soldered, it is necessary to perform sufficient heating. Is provided. In particular, in the reflow soldering apparatus, a tunnel-shaped heating furnace in which furnace walls of a furnace body are provided on both sides of a conveyor is configured.

Therefore, in order to make the infrared rays radiated from the heating device effectively act on the work to be soldered, it is desirable to radiate the infrared rays in the same direction as the conveying path of the work to be soldered.

According to the present invention, since a large number of uneven stripes are formed on the surface of the heating device in a direction intersecting with the conveying direction of the work to be soldered, infrared rays radiated from the heating device are irradiated with the work to be soldered. Heating can be performed efficiently by directional irradiation in the transport direction. In addition, since the infrared rays are irradiated from the front or rear of the work to be soldered, or from the oblique front or oblique rear with respect to the transport direction, it is possible to heat uniformly and efficiently without generating a hide zone. As a result, uniform and good soldering can be performed.

It should be noted that the large number of concave and convex strips formed in the direction intersecting the transport direction need not necessarily be orthogonal to the transport direction. Thus, infrared irradiation from an oblique direction or the like becomes possible.

[0034]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention can be implemented in the following modes.

(1) Heating Apparatus-1 FIG. 1 is a perspective view showing a first embodiment of the heating apparatus of the present invention, and FIG. 2 is a longitudinal sectional view of FIG.

In these figures, reference numeral 1 denotes a heating unit, which is a triangular prism-shaped main body 2 formed of an aluminum member.
And a triangular wave-shaped unevenness 4 is formed on one side surface 3 thereof. The surface of the main body 2 is formed by forming a porous oxide layer 5 by anodic oxidation, and then adsorbing and dyeing a black inorganic pigment 6, generally made of carbon, on the inside and on the surface.

As a method of forming the porous oxide layer 5 on the surface of the aluminum member, there are an etching method, a plasma method and the like in addition to the anodic oxidation method. good.

As the inorganic pigment, in addition to a black carbon-based pigment, a pigment composed of a ceramic slurry or the like can be used. That is, by selecting the material of the pigment, it is possible to select what wavelength band of infrared rays to emit more. Of course, a conventionally used infrared radiation material can be used as the pigment.

The triangular prism-shaped main body 2, that is, the heat ray radiator, is provided with a heater insertion hole 7 through which a sheathed heater (hereinafter, referred to as a heater) 8 is inserted. The heater 8 is inserted into the heater insertion hole 7. Insert and heat unit 1
Is configured. Also, it is taken into consideration that a plurality of such units can be used as one unit of the heating device.

As a result, when the heater 8 is energized and heated to raise the temperature, the porous oxide layer 5 and the black inorganic pigment 6 made of carbon are immediately heated because aluminum has a high thermal conductivity. Raise the temperature. Then, infrared rays are efficiently radiated over a wide wavelength range from the integrally formed porous oxide layer 5 and inorganic pigment 6 made of carbon. In general, metal oxides have high infrared radiation efficiency, and carbon emits infrared radiation 9 over a wide wavelength range by blackbody radiation, and its efficiency is high.

Therefore, even if the wavelength dependence of infrared absorption is different due to the difference in the material and color tone of the heated workpieces (not shown), each of the heated workpieces is uniform. Can be heated.

However, if it is desired to heat a specific portion, for example, a portion having a large heat capacity, in order to heat the work to be heated uniformly, an infrared ray in a wavelength band in which the portion absorbs infrared rays best. Inorganic pigments, for example, ceramic-based inorganic pigments may be used.

FIG. 3 is a perspective view of an array-like heating device in which the heating device 1 of FIG. 1 is arranged as a unit and arranged in an array. The same reference numerals in FIGS. In a soldering apparatus or a flow soldering apparatus, the apparatus is configured to heat a printed wiring board which is a work to be heated, and is particularly suitable for a reflow soldering apparatus.

The array-shaped heating device 11 is provided with heater insertion holes 13 arranged side by side in a square frame-shaped array frame 12, into which the heater 8 is fitted and inserted into the heater insertion hole 7 of the heating device unit 1 of FIG. Heating unit 1 before
Are fitted so that the mutual positions with the heater insertion holes 13 of the array frame 12 are aligned, and then the heater 8 is fitted and inserted into and fixed to the array frame 12 and the heater unit 1. The array heating device 11 in FIG. 3 is configured by arranging a plurality of heating device units 1 in FIG. 1 in an array.

Further, a rectifying plate 14 having a large number of holes 15 uniformly distributed is provided above the array frame 12. That is, when a blower such as a fan or a blower (not shown) is provided on the side of the rectifying plate 14, the blower pressure and thus the amount of blown air are uniformly distributed to each part. In connection with this, the triangular uneven ridges 4 provided on the heating device unit 1
It is configured so as to face a lower position opposite to the above.

That is, the array-shaped heating device 11 is configured to irradiate infrared rays to the lower side in FIG. 3 and also blows hot air downward, thereby performing combined heating of infrared rays and hot air. A slit-shaped nozzle portion 16 having a narrow air flow channel is formed between the respective heating device units 1, and a slit-shaped horn portion 17 having a wide air flow channel is formed at the tip thereof.

As a result, the hot air also blows and spreads on the lower side of the concave and convex strips 4 on the lower side of the array-shaped heating device 11.
The work to be heated is irradiated and blown together with the infrared rays radiated from the concave and convex strips 4 and the hot air blown out by the horn portion 17, and the member to be heated can be uniformly heated by the infrared rays and the hot air. Become like

That is, the infrared rays are emitted from the slit-shaped nozzle portion 16 in FIG.
Irradiation is also performed in a direction intersecting with the longitudinal direction of the nozzle, and hot air is also blown out by the horn portion 17 in the same direction as intersecting with the nozzle portion 16 in FIG. The workpiece to be heated can be heated so as not to generate an area. This is a very important matter for a reflow soldering apparatus described later.

(2) Heating Apparatus-2 FIG. 4 is a perspective view showing a second embodiment of the heating apparatus of the present invention, and FIG. 5 is a sectional view taken along the line II of FIG.

This heating device is made of an aluminum member and is in the form of a flat plate.
After the porous oxide layer 5 is formed by anodic oxidation on the flat heating device unit 21 having
Generally, it is obtained by adsorbing and dyeing a black inorganic pigment 6 made of carbon on the inside and the surface of the pores.

Other methods of forming the porous oxide layer and other examples of the inorganic pigment are the same as those described in the above section (1).

The main body 22 of the flat member, that is, the heat ray radiator is provided with a heater insertion hole 23 through which the heater 8 is inserted, and the heater 8 is inserted into the heater insertion hole 23 by insertion. The heating device unit 21 is as follows. Also, as in the first embodiment shown in FIG. 3, it is considered that the heating device unit 21 can be used as one unit. 4 shows an example in which six heaters 8 are provided.

Thus, similarly to the first embodiment, when the heater 8 is energized and heated to raise the temperature, aluminum has a high thermal conductivity, so that the porous oxide layer 5 The black inorganic pigment 6 composed of carbon and carbon is heated to increase the temperature. Then, infrared rays are efficiently emitted over a wide wavelength range from the integrally formed porous oxide layer 5 and black inorganic pigment 6 made of carbon.

Accordingly, even when the wavelength dependence of infrared absorption differs due to the difference in the material and color tone of the plurality of workpieces, the respective workpieces are uniformly heated. Will be able to

(3) Heat Transfer Characteristics FIG. 6 is a characteristic diagram obtained by measuring the relationship between the surface temperature of the heater 8 and the surface temperature of the heater unit 1 in the heater unit 1 of FIG. The horizontal axis represents elapsed time, and the vertical axis represents temperature. The solid characteristic line represents the surface temperature of the heater 8, and the broken characteristic line represents the surface temperature of the heating device unit 1. Note that this measurement was performed with the heating device unit 1 mounted in a reflow soldering device.

That is, the target surface temperature of the heater 8 is set to 45
The temperature is set to 0 ° C., the measurement is started at the same time when the heater is energized, and the time required for the temperature to reach the target temperature is ten and several minutes. Of course, this time varies depending on the rated power of the heater 8.

As can be seen from the measurement results, the heater 8
There is almost no time delay in the rise of the surface temperature of the heating device unit 1 with respect to the rise in the surface temperature of the heater 8, and when the surface temperature of the heater 8 reaches the target temperature of 450 ° C., infrared radiation from the heating device unit 1 The decrease in surface temperature due to heat conduction is about several degrees Celsius. Incidentally, the ambient temperature around the heating device unit 1 at this time was about 330 ° C.

(4) Reflow Soldering Apparatus-1 FIG. 7 is a side sectional view showing an example in which the reflow soldering apparatus is constructed using the array-shaped heating apparatus 11 of FIG. 3 and the heating apparatus unit 21 of FIG. 3 and 4 denote the same parts. The reflow soldering device is a heating device used when soldering a printed wiring board 31 or the like on which electronic components are mounted. Solder is supplied to a soldered portion of the printed wiring board 31 in advance, and the printed wiring board is printed. This is an apparatus that heats the board 31 by infrared rays, hot air, or the like, melts the solder, and solders the electronic component to the printed wiring board 31.

In the soldering apparatus, there are various transport means for transporting the printed wiring board 31. In the reflow soldering apparatus shown in FIG. 7, the transport conveyor 32 which holds the printed wiring board 31 and transports it in the direction of arrow A. A description will be given of a case in which is provided. The soldering device is provided with a furnace body 33 along a conveyor 32. Inside the furnace body 33, a pre-heating section 36 having one heating section 34 and one equalizing section 35, and a reflow section 37. Is a heating device 38 configured by connecting one of the chambers.

Although not shown, the transport conveyor 32 has a printed wiring board 3 mounted on pins of two parallel transport chains.
1 is placed, held and transported, and is generally used.

In the heating section heating chamber 39 and the soaking section heating chamber 40, two heating device units 21 each illustrated in FIG. 4 are arranged vertically above and below the transport conveyor 32, respectively. The upper surface and the lower surface of the printed wiring board 31 conveyed by the conveyor 32 can be heated independently. The uneven strips 4 provided on the heating device unit 21 are provided so as to oppose the direction of the conveyor 32, and the uneven strips 4 are disposed so as to be orthogonal to the transfer direction (arrow direction) A of the transfer conveyor 32. It is.

Subsequently, the reflow section heating chamber 41 has a heating chamber structure of a hot air circulation system, in which the atmosphere supplied by the blower 42, that is, the hot air heated to a predetermined temperature predetermined by the heater 44 of the hot air heating chamber 43 is used. 3 is blown onto the printed wiring board 31 from the holes 15 of the current plate 14 of the arrayed heating device 11 illustrated in FIG. Then, the hot air blown to the printed wiring board 31 is sucked into the blower 42 from the suction port 46 through the recirculation path 47, and again the hot air heating chamber 4
3 and circulate. The reflow section heating chamber 4
1 has the same structure on the upper side and the lower side of the transport conveyor 32.

The array-shaped heating device 11 is provided with the concavo-convex strips 4 provided on the heating device unit 1 facing the direction of the conveyor 32, and the concavo-convex strips 4 are orthogonal to the conveying direction of the conveyer 32. It is arranged.

Then, the hot air supplied to the array-shaped heating device 11 passes through the slit-shaped nozzle portion 16, passes through the slit-shaped horn portion 17, spreads radially by the action of the horn portion 17, and blows out. Sprayed evenly. That is, the hot air blows out to the side of the concave and convex strips 4 of each of the heating device units 1 and acts so as not to generate a hide zone when blowing the hot air.

Next, the operation of the reflow soldering apparatus will be described. That is, when the printed wiring board 31 is carried in from the carry-in port 48, the printed wiring board 31 is preheated by the infrared rays radiated from the heating device unit 21 in the preheating section 36, and subsequently, the arrayed heating is performed in the reflow section 37. The infrared rays radiated from the device 11 and the hot air blown out of the horn 17 melt the solder supplied to the soldered portion by reflow heating, and after the reflow soldering is performed, the solder is discharged from the outlet 49. You.

These heating devices are described in (1) and (2) above.
As described in the above section, all of the above-described embodiments efficiently radiate infrared rays over a wide wavelength range from the porous oxide layer 5 and the black inorganic pigment 6 adsorbed and dyed on the porous oxide layer 5 using aluminum as a matrix. I do. Also, the heater 8
The responsiveness to temperature control is also very good. Therefore,
It is possible to efficiently heat many types of electronic components mounted on the printed wiring board 31, that is, electronic components made of many materials and colors, to a uniform temperature, and to achieve uniform soldering with less quality deviation. It can be performed. Further, the controllability of the heating profile of the printed wiring board 31 is improved.

In the case where the temperature rise is slow even with the same heat input due to the fact that the heat capacity of a specific electronic component is extremely large, in order to increase the heat input of the component relatively, It is also possible to use a pigment which emits a relatively large amount of infrared rays in a wavelength band in which the satisfactorily absorbs, for example, a pigment based on ceramics.

Further, the heating device unit 21 provided in the preheating portion 36 and the heating device unit 1 of the array-shaped heating device 11 provided in the reflow portion 37 have a direction intersecting the transport direction A of the printed wiring board 31. Since the uneven stripes 4 are formed on the surface, the surface area is enlarged, the infrared radiation efficiency is improved, and the infrared rays are radiated from the uneven stripes 4 in the direction perpendicular to the surface of the uneven stripes 4 as illustrated in FIG. As a result, the amount of infrared rays emitted toward the furnace wall of the reflow soldering device on both sides of the conveyor 32 is reduced, and the printed wiring board 31 can be efficiently heated.

In addition, since the infrared rays are emitted from the front or rear of the printed wiring board 31 with respect to the transport direction A of the printed wiring board 31, or from the oblique front or oblique rear, uniform and efficient heating is performed without generating a hide zone. It becomes possible. As a result, uniform and good soldering can be performed by uniform heating.

It should be noted that the large number of uneven strips 4 provided in the direction intersecting the transport direction A need not necessarily be perpendicular to the transport direction A, but by providing an appropriate intersection angle as described above, Irradiates infrared light from an oblique direction.

In the reflow section 37, the infrared rays radiated from the array-shaped heating device 11 and the hot air blown from the horn section 17 are both radiated and blown onto the printed wiring board 31 so as not to generate a hide zone. There is no temperature pulsation in the heating profile of the wiring board 31, and the wiring board 31 can be heated stably and uniformly with a desired heating profile.

A temperature sensor 50 is provided on the surface of each heating device unit 21 of the pre-heating section 36, and the power applied to the heating device unit 21 is adjusted and controlled based on the temperature detection result, and the heating device is controlled. A temperature controller (not shown) for adjusting the surface temperature of the unit 21 to a desired temperature is provided.

A temperature sensor 51 is also provided on the surface of the heating device unit 1 of the array-shaped heating device 11 in the reflow section 37, and the surface temperature of the heating device unit 1 is similarly controlled by a temperature control device (not shown). It is configured so that it can be adjusted and controlled to a desired temperature. Further, the outlet 45 is provided with a temperature sensor 52 for detecting the temperature of hot air supplied to the array-shaped heating device 11.
4 is provided with a temperature control device (not shown) for adjusting and controlling the power applied to the hot air 4 to adjust the hot air temperature to a desired temperature.

(5) Reflow Soldering Apparatus-2 FIG. 8 is a side sectional view showing an example in which the reflow soldering apparatus is configured by using the array heating apparatus 11 shown in FIG. The same reference numerals as those in FIG. 7 indicate the same parts.

In this reflow soldering apparatus, the heating chamber 39 of the preheating section 36, the heating chamber 40 of the temperature equalizing section, and the reflow section heating chamber 41 of the reflow section 37 constitute heating chambers having the same structure. As shown in FIG. 7, there is no heater 44 dedicated to atmosphere heating, that is, a heater for directly controlling the temperature of hot air.

That is, the atmosphere supplied from the fan 62 driven by the motor 61 is blown out from the arrayed heating device 11 illustrated in the figure, and the blown-out atmosphere is blown onto the printed wiring board 31 conveyed by the conveyor 32. After that, the atmosphere is circulated to the fan 62 through the atmosphere return path 64 between the furnace body 63 and the array-shaped heating device 11. Since this atmosphere is heated by the array heating device 11, it is hot air.
Note that, in this example, the fan 62 is
A hood section 65 is provided to allow the hood to face.

On the other hand, infrared rays are radiated from each heating device unit 1 of the array-shaped
Irradiates the printed wiring board 31 conveyed by. The heating device unit 1 of the array-shaped heating device 11 is provided with the uneven ridges 4 as shown in FIG. 7 in the above (4).

That is, the printed wiring board 31 is heated by infrared rays radiated by the array-shaped heating device 11, and the atmosphere heated by the array-shaped heating device 11, that is, hot air is circulated in the heating chamber while circulating the atmosphere in the heating chamber. This is a configuration in which heating is performed by spraying the sprayed material 31 on.

The action of heating the printed wiring board 31 by the array-shaped heating device 11 is as described with reference to FIG. 7 in the above section (4). The only difference is that they are also used for heating. However, when viewed from the concept of the reflow soldering apparatus, both the preheating unit 36 and the reflow unit 37 perform the combined heating of infrared rays and hot air. 7 is basically different from the reflow soldering apparatus shown in FIG.

The reflow soldering apparatus illustrated in FIG. 8 also has the same configuration on the upper and lower sides of the transport conveyor 32 as in the reflow soldering apparatus illustrated in FIG. The surface and the lower surface can be heated independently.

Of course, if only one surface of the printed wiring board 31 needs to be heated, a configuration in which the array-shaped heating device 11 is disposed on either the upper side or the lower side of the transport conveyor 32 may be adopted. Good.

(6) Flow Soldering Apparatus FIG. 9 is a side sectional view showing an example in which a flow soldering apparatus is configured using the heating unit 21 shown in FIG. 4 in the above item (2).

The flux application step 10 is carried out along the transport direction A of the transport conveyor 32 for transporting the printed wiring board 31.
0, a preheating step 200, a soldering step 300, and a cooling step 400 are provided in this order. The heating device unit 21 shown in FIG. Arranged in step 200. In addition, the arrangement of the heating device unit 21 is arranged such that the uneven stripes 4 are orthogonal to the transport direction A of the printed wiring board 31.

An outline of the configuration of the flow soldering apparatus will be described. In the flux applying step 100, a spray-type flux applying apparatus 101 is provided. Flux 7
1 is pressurized in a flux tank 72 by a pressurized air supply device 73, and an open / close valve 74, a flow control valve 75, and a flow meter 76
The flux 71 is supplied to the spray nozzle 77 via the.
The spray nozzle 77 is a two-fluid nozzle, to which pressurized air (not shown) is supplied, and the flux 71 is sprayed in the form of a mist along with the spray.

The board detection sensor 78 optically detects, for example, that the printed wiring board 31 has been transported above the spray nozzle 77, and opens and closes only when the printed wiring board 31 is located above the spray nozzle 77. The valve 74 is opened to spray the flux 71, and the mist-like flux 71 is applied to the printed wiring board 31. Hood 79 and exhaust fan 8
Numeral 0 denotes a means for discharging the mist-like flux 71 not applied to the printed wiring board 31.

Preheating apparatus 201 in preheating step 200
As described above, the heating device unit 21 illustrated in FIG. 4 in the section (2) is provided and configured. The pre-heating of the printed wiring board 31 coated with the flux 71 is performed to promote the activation of the flux 71 and the vaporization of the solvent of the flux 71. In addition, the soldered portion and the component to be soldered are heated, and a soldering process 30
At 0, the heat shock at the time of contact with the molten solder is reduced.

The solder bath device 30 in the soldering process 300
In FIG. 1, a solder bath 83 for forming a jet wave 82 of molten solder 81 is provided. The solder bath 83 is heated by a heater (not shown) to store the molten solder 81, and a pump 84 blows molten solder 81 into a blow port 85. 81 to form a jet wave 82. The printed wiring board 31 comes into contact with the jet wave 82 while being conveyed by the conveyer 32, and the solder is supplied to the portion to be soldered and the soldering is performed.

In the cooling step 400, a cooling fan 91 is provided as a cooling device 401, and the cooling fan 91 blows the room temperature air onto the printed wiring board 31 to promote cooling of the printed wiring board 31.

In the flow soldering apparatus, not only the soldering of the lead-type parts but also the soldering of various chip-type parts are performed, and the material and the color tone are various.
Therefore, it is important to heat them uniformly to perform uniform and good soldering. Therefore, by using the heating device unit 21 shown in FIG. 4 in the above item (2), efficient preheating can be performed at a uniform temperature as described above, and good soldering can be performed. Will be able to do.

[0090]

As described above, according to the heating device of the present invention, the infrared radiation efficiency is good and abundant infrared energy is radiated over a wide wavelength range. In addition, the responsiveness when adjusting the heating temperature is improved.

Further, by selecting the type of the inorganic pigment, a relatively large amount of infrared rays in a specific wavelength band can be emitted.

By using this heating device as a heating device in a reflow soldering device or a flow soldering device, a work to be heated composed of various materials and colors, such as a printed wiring board, can be used. Heating can be uniformly and efficiently performed irrespective of the type of component, and uniform soldering can be performed without having different solderability depending on the component.

Further, by providing a large number of irregularities on the surface of the heating device used in the above-mentioned soldering device in a direction intersecting with the conveying direction of the work to be soldered, the surface area of the heating device is enlarged and infrared rays are emitted. Radiation efficiency is improved and infrared rays are radiated in the direction perpendicular to the surface of the uneven strip, so the infrared rays radiated from the heating device are directed toward the work to be soldered, and various components are mounted. Soldering such as a finished printed wiring board can be efficiently heated without producing a hide zone in a work, and uniform and good soldering can be performed.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a first embodiment of a heating device of the present invention.

FIG. 2 is a cross-sectional view of FIG.

FIG. 3 is a perspective view of an array-shaped heating device in which the heating device units of FIG. 1 are arranged in an array.

FIG. 4 is a perspective view showing a second embodiment of the heating device of the present invention.

FIG. 5 is a sectional view taken along the line II of FIG. 4;

FIG. 6 is a characteristic diagram obtained by measuring the relationship between the surface temperature of the heater and the surface temperature of the heating device unit in the heating device unit of FIG. 1;

FIG. 7 is a side sectional view showing an example in which a reflow soldering apparatus is configured using the array-shaped heating apparatus of FIG. 3 and the heating apparatus unit of FIG. 4;

FIG. 8 is a side sectional view showing an example in which a reflow soldering apparatus is configured using the array heating apparatus of FIG. 3;

9 is a side sectional view showing an example in which a flow soldering apparatus is configured using the heating device unit shown in FIG.

[Description of Signs] 1 Heating device unit 2 Main body 3 Side surface 4 Irregular stripes 5 Porous oxide layer 6 Inorganic pigment 7 Heater insertion hole 8 Seed heater 11 Array heating device 12 Array frame 13 Heater insertion hole 14 Rectifier plate 15 hole DESCRIPTION OF SYMBOLS 16 Nozzle part 17 Horn part 21 Heating unit 22 Main body 23 Heater insertion hole 31 Printed wiring board 32 Conveyor 33 Furnace 34 Heating part 35 Temperature uniforming part 36 Preheating part 37 Reflow part 38 Heating device 39 Heating part heating chamber Reference Signs List 40 uniform temperature heating chamber 41 reflow heating chamber 42 blower 43 hot air heating chamber 44 heater 45 blowout port 46 suction port 47 return path 61 motor 62 fan 63 furnace body 64 atmosphere return path 65 food section 71 flux 77 spray nozzle 81 molten solder 82 Jet Wave 83 Solder Bath 91 Cooling Fan 100 Flux coating process 101 Flux coating device 200 Preheating process 201 Preheating device 300 Soldering process 301 Solder bath device 400 Cooling process 401 Cooling device

Claims (4)

[Claims] 1. A method according to claim 1, wherein a porous oxide layer is formed on the surface of the aluminum, and the porous oxide layer is dyed with an inorganic pigment to form a heat ray radiator, and the heat ray radiator is provided with a heater. Characteristic heating device. 2. Anodizing aluminum to form a porous oxide layer on the surface thereof, and dye the porous oxide layer with a black inorganic pigment to obtain a heat ray radiator. A heating device, wherein a heater is provided in the heating device. 3. A soldering device of a flow type or a reflow type, wherein the heating device according to claim 1 or 2 is provided at a position facing the work to be soldered. 4. A flow type or reflow type soldering apparatus in which a work to be soldered is heated and soldered while being transported by a transport conveyor.
The heating device described above is provided at a position facing the work to be soldered, and a large number of uneven strips are formed on a surface of the heating device in a direction intersecting with a conveying direction of the work to be soldered. And soldering equipment.