JPH1119965A - Mold protecting apparatus - Google Patents

Mold protecting apparatus

Info

Publication number
JPH1119965A
JPH1119965A JP17796497A JP17796497A JPH1119965A JP H1119965 A JPH1119965 A JP H1119965A JP 17796497 A JP17796497 A JP 17796497A JP 17796497 A JP17796497 A JP 17796497A JP H1119965 A JPH1119965 A JP H1119965A
Authority
JP
Japan
Prior art keywords
lead frame
mold
attached
frame
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP17796497A
Other languages
Japanese (ja)
Other versions
JP3577898B2 (en
Inventor
Yoshinobu Kano
芳伸 加納
Kazuhiro Murakami
和宏 村上
Tetsuya Tsumura
哲也 津村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP17796497A priority Critical patent/JP3577898B2/en
Publication of JPH1119965A publication Critical patent/JPH1119965A/en
Application granted granted Critical
Publication of JP3577898B2 publication Critical patent/JP3577898B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a mold protecting apparatus for preventing damage of a mold by previously detecting and treating a fault in a lead frame. SOLUTION: The mold protecting apparatus comprises a regulating guide 8 for guiding a lead frame 7 mounted with forming elements 7a, 7b, a vertically movable positioning block 9 for positioning the frame 7 mounted at one end of the guide 8, upper detector 1 and lower detector 2 having holes 1a, 2b for inserting the elements 7a, 7b having a profile similar to a recess of a cavity of the mold, proximity sensors 12, 13 mounted at side ends and vertically movable by air hydraulic cylinders 5, 6 telescopic by compression springs 3, 3a, 4, 4a, thereby conveying the frame 7 and controlling to drive the mold according to output signals of the sensors 12, 13. Before molding in the mold, faults of the elements 7a, 7b formed at the frame 7 can be detected.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は電子部品などを形成
するために、形成素子を装着したリードフレームなどを
使用して成形する際の金型保護装置に関するものであ
る。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a die protection device for forming an electronic component or the like by using a lead frame or the like on which a forming element is mounted.

【0002】[0002]

【従来の技術】従来における金型保護装置としては、成
形金型の上型と下型によるリードフレームなどの挟持動
作により異常を検出し制御して保護するものである。
2. Description of the Related Art As a conventional mold protection device, an abnormality is detected and controlled by a clamping operation of a lead frame or the like by an upper die and a lower die of a molding die to protect the die.

【0003】すなわち、電子部品などを形成するための
金属材などでなり形成素子を装着した帯状のリードフレ
ームを成形金型の上型と下型により樹脂材などで成形す
る際、上型と下型の間にリードフレームを搬送し、まず
低圧油圧回路駆動によるシリンダーの駆動で上型あるい
は下型を移動させリードフレームを挟持する。
That is, when a strip-shaped lead frame made of a metal material or the like for forming an electronic component or the like and mounted with a forming element is molded from a resin material or the like with an upper mold and a lower mold of a molding die, the upper mold and the lower mold are used. The lead frame is conveyed between the molds, and first, the upper mold or the lower mold is moved by driving the cylinder by driving the low-pressure hydraulic circuit to hold the lead frame.

【0004】そして、リードフレームや金型内に異常が
無く、金型に付属して設けた各種の検出センサーにより
上型と下型が正規の間隔あるいは型締力であると判断し
た時には、続けて正規の圧力の油圧回路駆動などによる
型締で成形を行うのである。
When there is no abnormality in the lead frame or the mold, and when it is determined that the upper mold and the lower mold have a regular interval or a mold clamping force by various detection sensors attached to the mold, the operation is continued. Molding is performed by clamping with a hydraulic circuit driven at a regular pressure.

【0005】もし、リードフレームにおける異物の付着
や形成素子などのずれ、あるいは金型内の異常などによ
り上型と下型が正規の間隔あるいは型締力で無い場合に
は検出センサーなどの信号によりシリンダーを停止させ
て成形金型を保護するのである。
If the upper die and the lower die do not have a regular interval or a mold clamping force due to adhesion of foreign matter on the lead frame, displacement of forming elements, etc., or an abnormality in the die, a signal from a detection sensor or the like is used. The cylinder is stopped to protect the mold.

【0006】また、型締機構としてシリンダーの代わり
にサーボモータとボールネジなどを使用する場合には、
サーボモータのトルク制御による低圧型締、あるいは前
記トルクの異常を検出し制御する方法により金型保護を
行うのである。
When a servomotor and a ball screw are used instead of a cylinder as a mold clamping mechanism,
Mold protection is performed by low-pressure mold clamping by controlling the torque of the servomotor or by a method of detecting and controlling abnormalities in the torque.

【0007】[0007]

【発明が解決しようとする課題】しかしながら、前記従
来の金型保護装置における低圧型締力は少なくても1〜
2トンの圧力であり、成形金型のキャビティーに対して
リードフレームなどに搭載された形成素子のずれや、異
物の付着などにより局部的に集中荷重が印加された場合
には、金型の損傷や破壊につながる恐れがある。
However, the low-pressure mold clamping force in the conventional mold protection device is at least one to one.
When a concentrated load is applied locally due to a displacement of a forming element mounted on a lead frame or the like with respect to a cavity of a molding die or adhesion of a foreign substance to the cavity of the molding die, May lead to damage or destruction.

【0008】また、実際に成形金型の上型と下型にリー
ドフレームを挟持してしまうために、リードフレームや
装着した形成素子の損傷は避けられないという課題を有
している。
In addition, since the lead frame is actually sandwiched between the upper mold and the lower mold of the molding die, there is a problem that damage to the lead frame and the mounted forming element is inevitable.

【0009】本発明は、前記従来の課題を解決しようと
するものであり、リードフレームにおける形成素子のず
れや、異物の付着などに対して成形直前に検出し事前に
処理することにより、成形金型の損傷を防止する金型保
護装置を提供することを目的とするものである。
An object of the present invention is to solve the above-mentioned conventional problems, and it is possible to detect a displacement of a forming element in a lead frame or an adhesion of a foreign substance, etc., immediately before molding, and to perform processing in advance, thereby forming a molding metal. It is an object of the present invention to provide a mold protection device for preventing a mold from being damaged.

【0010】[0010]

【課題を解決するための手段】前記課題を解決するため
に本発明による金型保護装置は、形成素子が装着された
リードフレームをガイドする規制ガイドと、前記規制ガ
イドの一端に取付けられリードフレームを位置決めする
上下移動自在な位置決めブロックと、成形金型のキャビ
ティーの凹部と外形が相似で形成素子を挿入する孔を設
けた上下移動自在の対の検出体と、検出体に取付けられ
た近接センサーの出力信号によりリードフレームの搬送
や成形金型の駆動を制御する構成としたものであり、成
形金型の外で事前にリードフレームにおける異常を検出
し、適切な処理ができ、また復帰作業の効率も良く、成
形金型の破損の防止をすることが可能となる。
According to the present invention, there is provided a mold protection apparatus comprising: a regulating guide for guiding a lead frame on which a forming element is mounted; and a lead frame attached to one end of the regulating guide. A pair of vertically movable detectors having holes similar to the recesses of the cavity of the molding die and having a hole for inserting a forming element, and a proximity mounted on the detector. It is designed to control the transport of the lead frame and the driving of the molding die by the output signal of the sensor, so that the abnormality in the lead frame can be detected beforehand outside the molding die, appropriate processing can be performed, and the return work can be performed. It is possible to prevent the breakage of the molding die with good efficiency.

【0011】[0011]

【発明の実施の形態】本発明の請求項1記載の発明は、
形成素子が装着されたリードフレームをガイドする規制
ガイドと、前記規制ガイドの一端に取付けられリードフ
レームを位置決めする上下移動自在な位置決めブロック
と、成形金型のキャビティーの凹部と外形が相似で形成
素子を挿入する孔を設けた上下移動自在の対の検出体
と、検出体に取付けられた近接センサーの出力信号によ
りリードフレームの搬送や成形金型の駆動を制御する金
型保護装置としたものであり、成形金型の外で事前にリ
ードフレームにおける異常を検出できるという作用を有
する。
BEST MODE FOR CARRYING OUT THE INVENTION
A regulating guide for guiding a lead frame on which a forming element is mounted, a vertically movable positioning block attached to one end of the regulating guide and positioning the lead frame, and a recess and an outer shape of the cavity of the molding die are formed to be similar. A pair of vertically movable detectors with holes for inserting elements, and a die protection device that controls the transport of the lead frame and the driving of the molding die by the output signal of a proximity sensor attached to the detector. This has the effect that an abnormality in the lead frame can be detected in advance outside the molding die.

【0012】請求項2に記載の発明は、請求項1に記載
の発明において、対の検出体の上下移動の駆動にエアハ
イドロシリンダーを使用するものであり、対の検出体の
移動速度を適切に、かつ形成素子を損傷せずに所定の位
置に精度良く停止できるという作用を有する。
According to a second aspect of the present invention, in the first aspect of the invention, an air-hydro cylinder is used for driving the pair of detectors to move up and down, and the moving speed of the pair of detectors is adjusted appropriately. In addition, it is possible to stop the forming element accurately at a predetermined position without damaging the forming element.

【0013】請求項3に記載の発明は、請求項1に記載
の発明において、側端部にリードフレームからの位置を
検出する近接センサーを取付け、バネにより伸縮自在な
対の検出体としたものであり、検出時にリードフレーム
や装着した形成素子を損傷しないという作用を有する。
According to a third aspect of the present invention, in the first aspect of the present invention, a proximity sensor for detecting a position from a lead frame is attached to a side end portion, and a pair of expandable and contractible detectors is provided by a spring. This has the effect of not damaging the lead frame and the mounted forming element upon detection.

【0014】請求項4に記載の発明は、請求項1に記載
の発明において、規制ガイドの一端に隣接して形成素子
を検出する検出センサーを取付けてなるものであり、リ
ードフレームに装着された形成素子の装着もれやぬけを
検出するという作用を有する。
According to a fourth aspect of the present invention, in the first aspect of the present invention, a detection sensor for detecting a forming element is attached adjacent to one end of the regulating guide, and the detection sensor is mounted on a lead frame. It has the effect of detecting missing or missing mounting elements.

【0015】以下、本発明の実施の形態について、図面
を用いて説明する。図1(a)は本発明の実施の形態に
おける金型保護装置の構成図、図1(b)は同リードフ
レームの要部斜視図、図2は同検出体とリードフレーム
の関係を示す要部斜視図、図3は同検出動作を説明する
要部断面図、図4は同金型保護装置を成形機に搭載した
構成概要正面図である。
Hereinafter, embodiments of the present invention will be described with reference to the drawings. 1A is a configuration diagram of a mold protection device according to an embodiment of the present invention, FIG. 1B is a perspective view of a main part of the lead frame, and FIG. 2 is a main view showing a relationship between the detector and the lead frame. FIG. 3 is a sectional view of a main part for explaining the detecting operation, and FIG. 4 is a schematic front view of a configuration in which the mold protecting device is mounted on a molding machine.

【0016】図1において、7は金属材などでなる帯状
のリードフレームであり、電子部品などを形成する能動
素子、受動素子、機構素子、あるいはそれらの複合体な
どの形成素子7a,7bを上面と下面に、そして成形す
るための成形金型の各々のキャビティーの間隔と同じ間
隔に接着、カシメ、熔着、嵌め込み、圧入などにより装
着しており、所定寸法長さの短冊状あるいはフープ状で
保管および供給される。
In FIG. 1, reference numeral 7 denotes a strip-shaped lead frame made of a metal material or the like. And the lower surface, and the same space as the cavity of each molding die for molding is attached by gluing, caulking, welding, fitting, press-fitting, etc. Stored and supplied in.

【0017】1は金属材や樹脂材あるいはセラミック材
でなる板状の上検出体であり、リードフレーム7に定間
隔に装着された形成素子7aを挿入できる前記キャビテ
ィーの凹部と外形がやや大きい相似の孔1aを設けてい
る。
Reference numeral 1 denotes a plate-shaped upper detector made of a metal material, a resin material, or a ceramic material. The concave portion and the outer shape of the cavity in which the forming elements 7a mounted on the lead frame 7 at regular intervals can be inserted are slightly larger. A similar hole 1a is provided.

【0018】2は同じく上検出体1と対向する下検出体
であり、リードフレーム7に定間隔に装着された形成素
子7bを挿入できる前記キャビティーの凹部と外形がや
や大きい相似の孔2bを設けている。
Reference numeral 2 denotes a lower detector which also faces the upper detector 1. The lower detector 2 has a similar hole 2b having a slightly larger outer shape than the concave portion of the cavity into which the forming elements 7b mounted at regular intervals on the lead frame 7 can be inserted. Provided.

【0019】上検出体1、下検出体2はガイド軸(図示
せず)を内蔵する圧縮バネ3,3a、圧縮バネ4,4a
を介して金属材でなる取付板14、取付板15に伸縮自
在に取付けられており、上検出体1、下検出体2が形成
素子7a,7bやリードフレーム7に接触しても、それ
らを損傷しないようにしている。
The upper detecting member 1 and the lower detecting member 2 include compression springs 3, 3a, compression springs 4, 4a each having a guide shaft (not shown).
The upper and lower detectors 1 and 2 are attached to the mounting plates 14 and 15 made of a metal material so as to be extendable and contractible via the through holes. I try not to damage it.

【0020】取付板14,15は本体アングル17に固
定されたスライドシャフト10,11を挿通して上下移
動自在であり、取付板14は本体フレームに取付けられ
たエアハイドロシリンダー5の先端が、また、取付板1
5は同じくエアハイドロシリンダー6の先端がそれぞれ
固着されており、それらの駆動により上下方向に移動あ
るいは所定位置に停止保持される。
The mounting plates 14 and 15 can be moved up and down by inserting slide shafts 10 and 11 fixed to the main body angle 17, and the mounting plate 14 is provided with the tip of the air-hydro cylinder 5 mounted on the main body frame. , Mounting plate 1
Numeral 5 similarly has the tips of air-hydro cylinders 6 fixedly attached, respectively, and is moved up and down or stopped and held at a predetermined position by driving them.

【0021】8は金属材あるいはセラミック材などでな
る断面がコ字状の対の規制ガイドであり、そのコ字状内
をリードフレーム7が規制され、かつガイドされて通過
する。
Reference numeral 8 denotes a pair of regulating guides each having a U-shaped cross section made of a metal material or a ceramic material, and the lead frame 7 is regulated and guided in the U-shape.

【0022】9は規制ガイド8の側端に取付けられた位
置決めブロックであり、位置決め用のパイロットピンな
どを内蔵しており、本体フレーム17に取付けられたエ
アシリンダー16の先端に固着され、その駆動により上
下に移動して規制ガイド8を通過するリードフレーム7
の位置決めを行う。
Reference numeral 9 denotes a positioning block attached to a side end of the regulating guide 8, which has a built-in pilot pin for positioning and is fixed to the tip of an air cylinder 16 attached to the main body frame 17, and drives the same. Lead frame 7 that moves up and down through the guide 8
Perform positioning.

【0023】12,13は機械式、電気式あるいは光学
式などでなる近接センサーであり、それぞれ上検出体
1、下検出体2の端部の側面に対向するように取付けら
れており、上検出体1、下検出体2と対応するリードフ
レーム7の上面および下面からの位置を検出し出力信号
をリードフレーム7の供給機構(図示せず)や後記する
成形金型の駆動機構などを制御するために送出する。
Reference numerals 12 and 13 denote proximity sensors of a mechanical type, an electric type or an optical type, which are mounted so as to face the side surfaces of the ends of the upper detection body 1 and the lower detection body 2, respectively. The position from the upper surface and the lower surface of the lead frame 7 corresponding to the body 1 and the lower detection body 2 is detected, and an output signal is controlled by a supply mechanism (not shown) of the lead frame 7 and a driving mechanism of a molding die described later. To send out.

【0024】なお、32,33はリードフレーム7の供
給される側の前記規制ガイド8に隣接して設けた認識機
構や光学式でなる検出センサーであり、形成素子7a,
7bの装着もれや抜けなどの異常を検出し、同じく出力
信号をリードフレーム7の供給機構(図示せず)や後記
する成形金型の駆動機構などを制御するために送出す
る。
Reference numerals 32 and 33 denote recognition mechanisms and optical detection sensors provided adjacent to the regulation guide 8 on the side to which the lead frame 7 is supplied.
An abnormality such as a missing or detached mounting of the lead frame 7b is detected, and an output signal is sent out to control a supply mechanism (not shown) of the lead frame 7 and a driving mechanism of a molding die described later.

【0025】図4において18は成形金型における上型
であり、シャフト23,24に固定あるいは移動自在に
取付けられた上型プレート25の下面に固着されてい
る。
In FIG. 4, reference numeral 18 denotes an upper die of a molding die, which is fixed to the lower surface of an upper die plate 25 fixed or movably attached to the shafts 23, 24.

【0026】19は同じく上型18に対向した下型であ
り、本体22に取付けられた型締用油圧シリンダー20
の先端に固着されて上下移動自在な下型プレート26の
上面に固着されている。
Numeral 19 denotes a lower mold which is also opposed to the upper mold 18 and has a mold-clamping hydraulic cylinder 20 attached to the main body 22.
And is fixed to the upper surface of a lower mold plate 26 which is movable up and down.

【0027】21,21aはリードフレーム7を規制ガ
イドするガイドローラであり、図1に示す金型保護装置
を上型18と下型19などでなる成形金型に隣接して、
本体22の上面に設置している。
Reference numerals 21 and 21a denote guide rollers for regulating and guiding the lead frame 7. The guide rollers shown in FIG.
It is installed on the upper surface of the main body 22.

【0028】次に動作について説明する。フープ状の形
成素子7a,7bを装着したリードフレーム7が供給機
構(図示せず)により矢印方向に搬送され、本体22に
搭載された金型保護装置と、ガイドローラ21を経由し
て上型18と下型19の間に移送し載置されて所定の成
形を行う。
Next, the operation will be described. The lead frame 7 on which the hoop-shaped forming elements 7a and 7b are mounted is conveyed in the direction of the arrow by a supply mechanism (not shown), and is passed through the die protection device mounted on the main body 22 and the upper roller via the guide roller 21. It is transferred and placed between the lower mold 18 and the lower mold 19 to perform predetermined molding.

【0029】その時、次に成形される部分のリードフレ
ーム7における金型保護装置を動作させるのであり、ま
ず、検出センサー32,33により形成素子7a,7b
の異常の有無を検出し、かつ異常が無ければエアシリン
ダー16の駆動により位置決めブロック9を作動させ
て、リードフレーム7の搬送方向の位置決めを行い、同
時に垂直方向の位置決めは規制ガイド8により行われ
る。
At that time, the mold protection device of the lead frame 7 at the next molded portion is operated. First, the detection elements 32 and 33 form the forming elements 7a and 7b.
Is detected, and if there is no abnormality, the positioning block 9 is operated by driving the air cylinder 16 to position the lead frame 7 in the transport direction, and at the same time, the positioning in the vertical direction is performed by the regulating guide 8. .

【0030】次にエアハイドロシリンダー5,6の設定
された適切な速度の駆動により、上検出体1、下検出体
2を上下に移動させて、接近した時の形成素子7a,7
bを損傷させずにリードフレーム7に接近あるいは接触
させる所定の距離あるいは位置に停止させる。
Next, the upper detector 1 and the lower detector 2 are moved up and down by driving the air-hydro cylinders 5 and 6 at the set appropriate speed, and the forming elements 7a and 7 when approaching each other.
b is stopped at a predetermined distance or position at which the lead frame 7 approaches or contacts the lead frame 7 without being damaged.

【0031】なお、上検出体1、下検出体2とリードフ
レーム7は図2に示すように、上検出体1の孔1aの寸
法A,Bと下検出体2の孔2bの寸法C,Dは、上型1
8と下型19のキャビティー(図示せず)の凹部と外形
が相似で、かつ形成素子7a,7bを挿入できるものと
なっている。
As shown in FIG. 2, the upper detector 1, the lower detector 2 and the lead frame 7 have the dimensions A and B of the holes 1a of the upper detector 1 and the dimensions C and C of the holes 2b of the lower detector 2 as shown in FIG. D is the upper mold 1
8 and the cavity of the lower mold 19 (not shown) are similar in outer shape to the concave portion, and can insert the forming elements 7a and 7b.

【0032】従って、もしリードフレーム7の装着され
た形成素子7a,7bがずれたり、異物などが付着した
場合には、例えば図3に示すように、上検出体1が所定
の位置まで移動せずに、距離Eの隙間が発生して近接セ
ンサー12,13によりリードフレーム7の異常を検出
し、その出力信号をリードフレーム7が成形金型に移送
された時、供給機構や型締油圧シリンダー20の駆動機
構(図示せず)に伝達して成形動作を停止させるのであ
る。
Accordingly, if the forming elements 7a and 7b on which the lead frame 7 is mounted are displaced or foreign matter is attached, the upper detector 1 is moved to a predetermined position as shown in FIG. However, when a gap of the distance E occurs and the abnormality of the lead frame 7 is detected by the proximity sensors 12 and 13 and the output signal is transferred to the molding die, the supply mechanism and the hydraulic cylinder This is transmitted to the drive mechanism 20 (not shown) to stop the molding operation.

【0033】すなわち、低価格で簡単なエアハイドロシ
リンダー5,6の上検出体1、下検出体2の駆動によ
り、リードフレーム7における異常を検出し制御するの
である。
That is, an abnormality in the lead frame 7 is detected and controlled by driving the upper and lower detectors 1 and 2 of the air-hydro cylinders 5 and 6 at low cost and simpler.

【0034】なお、リードフレーム7の形が所定寸法の
短冊状のものであっても同じく型締め直前、すなわち成
形前に異常を検出することができる。
Even if the lead frame 7 has a rectangular shape with a predetermined size, an abnormality can be detected immediately before clamping, that is, before molding.

【0035】[0035]

【発明の効果】以上のように本発明の金型保護装置によ
れば、成形金型の外で事前にリードフレームにおける異
常を検出でき、リードフレームや形成素子に対する損傷
を防止でき、また成形金型の損傷あるいは破壊を防止す
ることができるという効果を有する。
As described above, according to the mold protection apparatus of the present invention, an abnormality in the lead frame can be detected in advance outside the molding die, and damage to the lead frame and the forming element can be prevented. This has the effect that damage or destruction of the mold can be prevented.

【図面の簡単な説明】[Brief description of the drawings]

【図1】(a)は本発明の実施の形態における金型保護
装置の構成図 (b)は同リードフレームの要部斜視図
FIG. 1A is a configuration diagram of a mold protection device according to an embodiment of the present invention; FIG. 1B is a perspective view of a main part of the lead frame;

【図2】同検出体とリードフレームの関係を示す要部斜
視図
FIG. 2 is a perspective view of a main part showing a relationship between the detector and a lead frame.

【図3】同検出動作を説明する要部断面図FIG. 3 is a sectional view of a main part for explaining the detection operation;

【図4】同金型保護装置を成形機に搭載した構成概要正
面図
FIG. 4 is a schematic front view of a configuration in which the mold protection device is mounted on a molding machine.

【符号の説明】[Explanation of symbols]

1 上検出体 1a 孔 2 下検出体 2b 孔 3,3a 圧縮バネ 4,4a 圧縮バネ 5,6 エアハイドロシリンダー 7 リードフレーム 7a,7b 形成素子 8 規制ガイド 9 位置決めブロック 10,11 スライドシャフト 12,13 近接センサー 14,15 取付板 16 エアシリンダー 17 本体フレーム 18 上型 19 下型 20 型締用油圧シリンダー 21,21a ガイドローラ 32,33 検出センサー DESCRIPTION OF SYMBOLS 1 Upper detection body 1a hole 2 Lower detection body 2b hole 3, 3a Compression spring 4, 4a Compression spring 5, 6 Air-hydro cylinder 7 Lead frame 7a, 7b Forming element 8 Regulation guide 9 Positioning block 10, 11 Slide shaft 12, 13 Proximity sensor 14,15 Mounting plate 16 Air cylinder 17 Body frame 18 Upper mold 19 Lower mold 20 Hydraulic cylinder for mold clamping 21,21a Guide roller 32,33 Detection sensor

───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.6 識別記号 FI // B29L 31:34 ──────────────────────────────────────────────────続 き Continued on front page (51) Int.Cl. 6 Identification code FI // B29L 31:34

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 形成素子が装着されたリードフレームを
ガイドする規制ガイドと、前記規制ガイドの一端に取付
けられリードフレームを位置決めする上下移動自在な位
置決めブロックと、成形金型のキャビティーの凹部と外
形が相似で形成素子を挿入する孔を設けた上下移動自在
の対の検出体と、検出体に取付けられた近接センサーの
出力信号によりリードフレームの搬送や成形金型の駆動
を制御する金型保護装置。
1. A regulation guide for guiding a lead frame on which a forming element is mounted, a positioning block attached to one end of the regulation guide and capable of moving the lead frame up and down, and a concave portion of a cavity of a molding die. A pair of detectors that are similar in outer shape and have a hole that allows the formation element to be inserted and that can move up and down, and a die that controls the transport of the lead frame and the driving of the molding die by the output signal of the proximity sensor attached to the detector Protective equipment.
【請求項2】 対の検出体の上下移動の駆動にエアハイ
ドロシリンダーを使用する請求項1に記載の金型保護装
置。
2. The mold protection device according to claim 1, wherein an air-hydro cylinder is used to drive the pair of detectors to move up and down.
【請求項3】 対の検出体の側端部にリードフレームか
らの位置を検出する近接センサーを取付け、バネにより
伸縮自在な対の検出体とした請求項1に記載の金型保護
装置。
3. The mold protection device according to claim 1, wherein a proximity sensor for detecting a position from the lead frame is attached to a side end portion of the pair of detection bodies to form a pair of detection bodies that can be expanded and contracted by a spring.
【請求項4】 規制ガイドの一端に隣接して形成素子を
検出する検出センサーを取付けてなる請求項1に記載の
金型保護装置。
4. The mold protection device according to claim 1, wherein a detection sensor for detecting a forming element is attached adjacent to one end of the regulation guide.
JP17796497A 1997-07-03 1997-07-03 Mold protection device Expired - Fee Related JP3577898B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17796497A JP3577898B2 (en) 1997-07-03 1997-07-03 Mold protection device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP17796497A JP3577898B2 (en) 1997-07-03 1997-07-03 Mold protection device

Publications (2)

Publication Number Publication Date
JPH1119965A true JPH1119965A (en) 1999-01-26
JP3577898B2 JP3577898B2 (en) 2004-10-20

Family

ID=16040164

Family Applications (1)

Application Number Title Priority Date Filing Date
JP17796497A Expired - Fee Related JP3577898B2 (en) 1997-07-03 1997-07-03 Mold protection device

Country Status (1)

Country Link
JP (1) JP3577898B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102608261A (en) * 2010-12-30 2012-07-25 通用电气公司 Methods, systems and apparatus for detecting material defects in combustors of combustion turbine engines
CN106908714A (en) * 2017-03-06 2017-06-30 邹霞 Chip automatic detection device
WO2018161239A1 (en) * 2017-03-06 2018-09-13 邹霞 Automatic chip testing apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US11986982B2 (en) 2021-09-28 2024-05-21 Canon Virginia, Inc. Injection molding system using multiple molds

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102608261A (en) * 2010-12-30 2012-07-25 通用电气公司 Methods, systems and apparatus for detecting material defects in combustors of combustion turbine engines
CN106908714A (en) * 2017-03-06 2017-06-30 邹霞 Chip automatic detection device
CN106908714B (en) * 2017-03-06 2018-05-15 深圳信息职业技术学院 Chip automatic detection device
WO2018161239A1 (en) * 2017-03-06 2018-09-13 邹霞 Automatic chip testing apparatus

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