JP3577898B2 - Mold protection device - Google Patents

Mold protection device Download PDF

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Publication number
JP3577898B2
JP3577898B2 JP17796497A JP17796497A JP3577898B2 JP 3577898 B2 JP3577898 B2 JP 3577898B2 JP 17796497 A JP17796497 A JP 17796497A JP 17796497 A JP17796497 A JP 17796497A JP 3577898 B2 JP3577898 B2 JP 3577898B2
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JP
Japan
Prior art keywords
lead frame
protection device
mold
detectors
die
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
JP17796497A
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Japanese (ja)
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JPH1119965A (en
Inventor
芳伸 加納
和宏 村上
哲也 津村
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Corp
Panasonic Holdings Corp
Original Assignee
Panasonic Corp
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
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Priority to JP17796497A priority Critical patent/JP3577898B2/en
Publication of JPH1119965A publication Critical patent/JPH1119965A/en
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Publication of JP3577898B2 publication Critical patent/JP3577898B2/en
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  • Moulds For Moulding Plastics Or The Like (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Description

【0001】
【発明の属する技術分野】
本発明は電子部品などを形成するために、形成素子を装着したリードフレームなどを使用して成形する際の金型保護装置に関するものである。
【0002】
【従来の技術】
従来における金型保護装置としては、成形金型の上型と下型によるリードフレームなどの挟持動作により異常を検出し制御して保護するものである。
【0003】
すなわち、電子部品などを形成するための金属材などでなり形成素子を装着した帯状のリードフレームを成形金型の上型と下型により樹脂材などで成形する際、上型と下型の間にリードフレームを搬送し、まず低圧油圧回路駆動によるシリンダーの駆動で上型あるいは下型を移動させリードフレームを挟持する。
【0004】
そして、リードフレームや金型内に異常が無く、金型に付属して設けた各種の検出センサーにより上型と下型が正規の間隔あるいは型締力であると判断した時には、続けて正規の圧力の油圧回路駆動などによる型締で成形を行うのである。
【0005】
もし、リードフレームにおける異物の付着や形成素子などのずれ、あるいは金型内の異常などにより上型と下型が正規の間隔あるいは型締力で無い場合には検出センサーなどの信号によりシリンダーを停止させて成形金型を保護するのである。
【0006】
また、型締機構としてシリンダーの代わりにサーボモータとボールネジなどを使用する場合には、サーボモータのトルク制御による低圧型締、あるいは前記トルクの異常を検出し制御する方法により金型保護を行うのである。
【0007】
【発明が解決しようとする課題】
しかしながら、前記従来の金型保護装置における低圧型締力は少なくても1〜2トンの圧力であり、成形金型のキャビティーに対してリードフレームなどに搭載された形成素子のずれや、異物の付着などにより局部的に集中荷重が印加された場合には、金型の損傷や破壊につながる恐れがある。
【0008】
また、実際に成形金型の上型と下型にリードフレームを挟持してしまうために、リードフレームや装着した形成素子の損傷は避けられないという課題を有している。
【0009】
本発明は、前記従来の課題を解決しようとするものであり、リードフレームにおける形成素子のずれや、異物の付着などに対して成形直前に検出し事前に処理することにより、成形金型の損傷を防止する金型保護装置を提供することを目的とするものである。
【0010】
【課題を解決するための手段】
前記課題を解決するために本発明による金型保護装置は、形成素子が装着されたリードフレームをガイドする規制ガイドと、前記規制ガイドの一端に取付けられリードフレームを位置決めする上下移動自在な位置決めブロックと、成形金型のキャビティーの凹部と外形が相似で形成素子を挿入する孔を設けた上下移動自在の対の検出体と、検出体に取付けられた近接センサーの出力信号によりリードフレームの搬送や成形金型の駆動を制御する構成としたものであり、成形金型の外で事前にリードフレームにおける異常を検出し、適切な処理ができ、また復帰作業の効率も良く、成形金型の破損の防止をすることが可能となる。
【0011】
【発明の実施の形態】
本発明の請求項1記載の発明は、形成素子が装着されたリードフレームをガイドする規制ガイドと、前記規制ガイドの一端に取付けられリードフレームを位置決めする上下移動自在な位置決めブロックと、成形金型のキャビティーの凹部と外形が相似で形成素子を挿入する孔を設けた上下移動自在の対の検出体と、検出体に取付けられた近接センサーの出力信号によりリードフレームの搬送や成形金型の駆動を制御する金型保護装置としたものであり、成形金型の外で事前にリードフレームにおける異常を検出できるという作用を有する。
【0012】
請求項2に記載の発明は、請求項1に記載の発明において、対の検出体の上下移動の駆動にエアハイドロシリンダーを使用するものであり、対の検出体の移動速度を適切に、かつ形成素子を損傷せずに所定の位置に精度良く停止できるという作用を有する。
【0013】
請求項3に記載の発明は、請求項1に記載の発明において、側端部にリードフレームからの位置を検出する近接センサーを取付け、バネにより伸縮自在な対の検出体としたものであり、検出時にリードフレームや装着した形成素子を損傷しないという作用を有する。
【0014】
請求項4に記載の発明は、請求項1に記載の発明において、規制ガイドの一端に隣接して形成素子を検出する検出センサーを取付けてなるものであり、リードフレームに装着された形成素子の装着もれやぬけを検出するという作用を有する。
【0015】
以下、本発明の実施の形態について、図面を用いて説明する。
図1(a)は本発明の実施の形態における金型保護装置の構成図、図1(b)は同リードフレームの要部斜視図、図2は同検出体とリードフレームの関係を示す要部斜視図、図3は同検出動作を説明する要部断面図、図4は同金型保護装置を成形機に搭載した構成概要正面図である。
【0016】
図1において、7は金属材などでなる帯状のリードフレームであり、電子部品などを形成する能動素子、受動素子、機構素子、あるいはそれらの複合体などの形成素子7a,7bを上面と下面に、そして成形するための成形金型の各々のキャビティーの間隔と同じ間隔に接着、カシメ、熔着、嵌め込み、圧入などにより装着しており、所定寸法長さの短冊状あるいはフープ状で保管および供給される。
【0017】
1は金属材や樹脂材あるいはセラミック材でなる板状の上検出体であり、リードフレーム7に定間隔に装着された形成素子7aを挿入できる前記キャビティーの凹部と外形がやや大きい相似の孔1aを設けている。
【0018】
2は同じく上検出体1と対向する下検出体であり、リードフレーム7に定間隔に装着された形成素子7bを挿入できる前記キャビティーの凹部と外形がやや大きい相似の孔2bを設けている。
【0019】
上検出体1、下検出体2はガイド軸(図示せず)を内蔵する圧縮バネ3,3a、圧縮バネ4,4aを介して金属材でなる取付板14、取付板15に伸縮自在に取付けられており、上検出体1、下検出体2が形成素子7a,7bやリードフレーム7に接触しても、それらを損傷しないようにしている。
【0020】
取付板14,15は本体アングル17に固定されたスライドシャフト10,11を挿通して上下移動自在であり、取付板14は本体フレームに取付けられたエアハイドロシリンダー5の先端が、また、取付板15は同じくエアハイドロシリンダー6の先端がそれぞれ固着されており、それらの駆動により上下方向に移動あるいは所定位置に停止保持される。
【0021】
8は金属材あるいはセラミック材などでなる断面がコ字状の対の規制ガイドであり、そのコ字状内をリードフレーム7が規制され、かつガイドされて通過する。
【0022】
9は規制ガイド8の側端に取付けられた位置決めブロックであり、位置決め用のパイロットピンなどを内蔵しており、本体フレーム17に取付けられたエアシリンダー16の先端に固着され、その駆動により上下に移動して規制ガイド8を通過するリードフレーム7の位置決めを行う。
【0023】
12,13は機械式、電気式あるいは光学式などでなる近接センサーであり、それぞれ上検出体1、下検出体2の端部の側面に対向するように取付けられており、上検出体1、下検出体2と対応するリードフレーム7の上面および下面からの位置を検出し出力信号をリードフレーム7の供給機構(図示せず)や後記する成形金型の駆動機構などを制御するために送出する。
【0024】
なお、32,33はリードフレーム7の供給される側の前記規制ガイド8に隣接して設けた認識機構や光学式でなる検出センサーであり、形成素子7a,7bの装着もれや抜けなどの異常を検出し、同じく出力信号をリードフレーム7の供給機構(図示せず)や後記する成形金型の駆動機構などを制御するために送出する。
【0025】
図4において18は成形金型における上型であり、シャフト23,24に固定あるいは移動自在に取付けられた上型プレート25の下面に固着されている。
【0026】
19は同じく上型18に対向した下型であり、本体22に取付けられた型締用油圧シリンダー20の先端に固着されて上下移動自在な下型プレート26の上面に固着されている。
【0027】
21,21aはリードフレーム7を規制ガイドするガイドローラであり、図1に示す金型保護装置を上型18と下型19などでなる成形金型に隣接して、本体22の上面に設置している。
【0028】
次に動作について説明する。フープ状の形成素子7a,7bを装着したリードフレーム7が供給機構(図示せず)により矢印方向に搬送され、本体22に搭載された金型保護装置と、ガイドローラ21を経由して上型18と下型19の間に移送し載置されて所定の成形を行う。
【0029】
その時、次に成形される部分のリードフレーム7における金型保護装置を動作させるのであり、まず、検出センサー32,33により形成素子7a,7bの異常の有無を検出し、かつ異常が無ければエアシリンダー16の駆動により位置決めブロック9を作動させて、リードフレーム7の搬送方向の位置決めを行い、同時に垂直方向の位置決めは規制ガイド8により行われる。
【0030】
次にエアハイドロシリンダー5,6の設定された適切な速度の駆動により、上検出体1、下検出体2を上下に移動させて、接近した時の形成素子7a,7bを損傷させずにリードフレーム7に接近あるいは接触させる所定の距離あるいは位置に停止させる。
【0031】
なお、上検出体1、下検出体2とリードフレーム7は図2に示すように、上検出体1の孔1aの寸法A,Bと下検出体2の孔2bの寸法C,Dは、上型18と下型19のキャビティー(図示せず)の凹部と外形が相似で、かつ形成素子7a,7bを挿入できるものとなっている。
【0032】
従って、もしリードフレーム7の装着された形成素子7a,7bがずれたり、異物などが付着した場合には、例えば図3に示すように、上検出体1が所定の位置まで移動せずに、距離Eの隙間が発生して近接センサー12,13によりリードフレーム7の異常を検出し、その出力信号をリードフレーム7が成形金型に移送された時、供給機構や型締油圧シリンダー20の駆動機構(図示せず)に伝達して成形動作を停止させるのである。
【0033】
すなわち、低価格で簡単なエアハイドロシリンダー5,6の上検出体1、下検出体2の駆動により、リードフレーム7における異常を検出し制御するのである。
【0034】
なお、リードフレーム7の形が所定寸法の短冊状のものであっても同じく型締め直前、すなわち成形前に異常を検出することができる。
【0035】
【発明の効果】
以上のように本発明の金型保護装置によれば、成形金型の外で事前にリードフレームにおける異常を検出でき、リードフレームや形成素子に対する損傷を防止でき、また成形金型の損傷あるいは破壊を防止することができるという効果を有する。
【図面の簡単な説明】
【図1】(a)は本発明の実施の形態における金型保護装置の構成図
(b)は同リードフレームの要部斜視図
【図2】同検出体とリードフレームの関係を示す要部斜視図
【図3】同検出動作を説明する要部断面図
【図4】同金型保護装置を成形機に搭載した構成概要正面図
【符号の説明】
1 上検出体
1a 孔
2 下検出体
2b 孔
3,3a 圧縮バネ
4,4a 圧縮バネ
5,6 エアハイドロシリンダー
7 リードフレーム
7a,7b 形成素子
8 規制ガイド
9 位置決めブロック
10,11 スライドシャフト
12,13 近接センサー
14,15 取付板
16 エアシリンダー
17 本体フレーム
18 上型
19 下型
20 型締用油圧シリンダー
21,21a ガイドローラ
32,33 検出センサー
[0001]
TECHNICAL FIELD OF THE INVENTION
The present invention relates to a die protection device for molding using a lead frame or the like on which a forming element is mounted in order to form an electronic component or the like.
[0002]
[Prior art]
As a conventional die protection device, an abnormality is detected and controlled by a clamping operation of a lead frame or the like by an upper die and a lower die of a molding die to protect the die.
[0003]
In other words, when forming a strip-shaped lead frame made of a metal material or the like for forming an electronic component or the like on which a forming element is mounted with a resin material or the like using an upper mold and a lower mold of a molding die, a gap between the upper mold and the lower mold is required. First, the lead frame is conveyed, and first, the upper mold or the lower mold is moved by driving the cylinder by driving the low-pressure hydraulic circuit to hold the lead frame.
[0004]
Then, when there is no abnormality in the lead frame or the mold, and when it is judged by the various detection sensors attached to the mold that the upper mold and the lower mold have the regular interval or the mold clamping force, the regular Molding is performed by clamping using pressure-driven hydraulic circuits.
[0005]
If the upper and lower dies are not at the proper interval or due to the mold clamping force due to adhesion of foreign matter on the lead frame, displacement of forming elements, etc., or abnormalities in the mold, the cylinder is stopped by a signal from a detection sensor etc. This protects the mold.
[0006]
When a servo motor and a ball screw are used instead of a cylinder as the mold clamping mechanism, the mold protection is performed by low pressure mold clamping by controlling the torque of the servo motor or by a method of detecting and controlling the abnormality of the torque. is there.
[0007]
[Problems to be solved by the invention]
However, the low-pressure mold clamping force in the conventional mold protection device is a pressure of at least 1 to 2 tons, and a displacement of a forming element mounted on a lead frame or the like with respect to a cavity of a molding mold or foreign matter If a concentrated load is locally applied due to adhesion of the metal, there is a possibility that the mold is damaged or broken.
[0008]
Further, since the lead frame is actually sandwiched between the upper mold and the lower mold of the molding die, there is a problem that damage to the lead frame and the mounted forming element is inevitable.
[0009]
An object of the present invention is to solve the above-mentioned conventional problems, and it is possible to detect a displacement of a forming element in a lead frame or an adhesion of a foreign substance by detecting immediately before molding and performing a pre-processing to prevent damage to a molding die. It is an object of the present invention to provide a die protection device for preventing the occurrence of a die.
[0010]
[Means for Solving the Problems]
In order to solve the above-mentioned problem, a mold protection device according to the present invention includes a regulating guide that guides a lead frame on which a forming element is mounted, and a positioning block that is attached to one end of the regulating guide and that can move up and down to position the lead frame. And a pair of detectors that are similar in shape to the concave part of the cavity of the molding die and have holes for inserting forming elements, and a vertically movable pair of detectors, and the lead frame is transported by the output signal of the proximity sensor attached to the detectors. It is designed to control the driving of the molding die and detect abnormalities in the lead frame in advance outside the molding die, perform appropriate processing, and have a good return work efficiency, Breakage can be prevented.
[0011]
BEST MODE FOR CARRYING OUT THE INVENTION
According to the first aspect of the present invention, there is provided a regulating guide for guiding a lead frame on which a forming element is mounted, a positioning block attached to one end of the regulating guide and capable of vertically moving the lead frame, and a molding die. A pair of detectors that are similar in shape to the concave part of the cavity and have holes for inserting forming elements, and that can move up and down, and the output signal of a proximity sensor attached to the detector will convey the lead frame and move the molding die. This is a mold protection device that controls driving, and has an effect that an abnormality in the lead frame can be detected in advance outside the molding die.
[0012]
According to a second aspect of the present invention, in the first aspect of the invention, an air-hydro cylinder is used to drive the pair of detectors to move up and down, and the moving speed of the pair of detectors is appropriately adjusted, and This has the function of stopping accurately at a predetermined position without damaging the forming element.
[0013]
According to a third aspect of the present invention, in the first aspect of the present invention, a proximity sensor for detecting a position from a lead frame is attached to a side end portion, and a pair of expandable and contractible detectors is provided by a spring. This has the effect of not damaging the lead frame and the mounted forming element at the time of detection.
[0014]
According to a fourth aspect of the present invention, in the first aspect of the present invention, a detection sensor for detecting a forming element is attached adjacent to one end of the regulating guide. It has the effect of detecting leaks and omissions.
[0015]
Hereinafter, embodiments of the present invention will be described with reference to the drawings.
1A is a configuration diagram of a mold protection device according to an embodiment of the present invention, FIG. 1B is a perspective view of a main part of the lead frame, and FIG. 2 is a main view showing a relationship between the detector and the lead frame. FIG. 3 is a cross-sectional view of a main part for explaining the detection operation, and FIG. 4 is a schematic front view of a configuration in which the mold protection device is mounted on a molding machine.
[0016]
In FIG. 1, reference numeral 7 denotes a strip-shaped lead frame made of a metal material or the like, and forming elements 7a and 7b such as an active element, a passive element, a mechanical element, or a composite thereof for forming an electronic component or the like are formed on the upper surface and the lower surface. And, it is attached by gluing, caulking, welding, fitting, press-fitting, etc. at the same interval as each cavity of the molding die for molding, and it is stored and stored in a strip or hoop shape of a predetermined length. Supplied.
[0017]
Reference numeral 1 denotes a plate-shaped upper detector made of a metal material, a resin material, or a ceramic material. A similar hole having a slightly larger outer shape than the concave portion of the cavity into which the forming elements 7a mounted at regular intervals on the lead frame 7 can be inserted. 1a is provided.
[0018]
Reference numeral 2 denotes a lower detector which also faces the upper detector 1, and has a similar hole 2b whose outer shape is slightly larger than the concave portion of the cavity into which the forming elements 7b mounted at regular intervals on the lead frame 7 can be inserted. .
[0019]
The upper detection body 1 and the lower detection body 2 are attached to a mounting plate 14 and a mounting plate 15 made of metal via compression springs 3 and 3a having built-in guide shafts (not shown) and compression springs 4 and 4a. Even if the upper detector 1 and the lower detector 2 contact the forming elements 7a and 7b and the lead frame 7, they are not damaged.
[0020]
The mounting plates 14 and 15 are vertically movable by inserting the slide shafts 10 and 11 fixed to the main body angle 17. The mounting plate 14 has the tip of the air-hydro cylinder 5 mounted on the main body frame. Numeral 15 also has the tip ends of the air-hydro cylinders 6 fixedly fixed, and is moved up and down or stopped and held at a predetermined position by driving them.
[0021]
Reference numeral 8 denotes a pair of regulating guides each having a U-shaped cross section made of a metal material, a ceramic material, or the like. The lead frame 7 is regulated and guided in the U-shape.
[0022]
Reference numeral 9 denotes a positioning block attached to a side end of the regulating guide 8, which has a built-in pilot pin for positioning and is fixed to the tip of an air cylinder 16 attached to the main body frame 17, and is vertically moved by its drive. The lead frame 7 that moves and passes through the regulation guide 8 is positioned.
[0023]
Reference numerals 12 and 13 denote proximity sensors of a mechanical type, an electrical type, an optical type, or the like, which are mounted so as to face the side surfaces of the ends of the upper detection body 1 and the lower detection body 2, respectively. The position from the upper surface and the lower surface of the lead frame 7 corresponding to the lower detector 2 is detected, and an output signal is sent out to control a supply mechanism (not shown) of the lead frame 7 and a driving mechanism of a molding die described later. I do.
[0024]
Reference numerals 32 and 33 denote recognition mechanisms and optical detection sensors provided adjacent to the regulation guide 8 on the side to which the lead frame 7 is supplied. The detection sensors 32 and 33 prevent the formation elements 7a and 7b from being mounted or missing. When an abnormality is detected, an output signal is sent out to control a supply mechanism (not shown) of the lead frame 7 and a driving mechanism of a molding die described later.
[0025]
In FIG. 4, reference numeral 18 denotes an upper die of a molding die, which is fixed to the lower surface of an upper die plate 25 fixed or movably attached to the shafts 23, 24.
[0026]
Reference numeral 19 denotes a lower die facing the upper die 18, which is fixed to the tip of a hydraulic cylinder for clamping 20 attached to the main body 22, and is fixed to the upper surface of a lower die plate 26 which can move up and down.
[0027]
Reference numerals 21 and 21a denote guide rollers for regulating and guiding the lead frame 7. The guide rollers shown in FIG. 1 are installed on the upper surface of the main body 22 adjacent to a molding die including an upper die 18 and a lower die 19. ing.
[0028]
Next, the operation will be described. The lead frame 7 on which the hoop-shaped forming elements 7a and 7b are mounted is conveyed in the direction of the arrow by a supply mechanism (not shown), and is passed through the die protection device mounted on the main body 22 and the upper roller via the guide roller 21. It is transferred and placed between the lower mold 18 and the lower mold 19 to perform a predetermined molding.
[0029]
At that time, the mold protection device in the lead frame 7 to be molded next is operated. First, the detection sensors 32 and 33 detect the presence or absence of an abnormality in the forming elements 7a and 7b. The positioning block 9 is operated by driving the cylinder 16 to position the lead frame 7 in the transport direction, and at the same time, the positioning in the vertical direction is performed by the regulating guide 8.
[0030]
Next, the upper detection body 1 and the lower detection body 2 are moved up and down by driving the air-hydro cylinders 5 and 6 at the set appropriate speed, and the lead is formed without damaging the forming elements 7a and 7b when approaching. The frame 7 is stopped at a predetermined distance or position for approaching or contacting the frame 7.
[0031]
As shown in FIG. 2, the upper detector 1, the lower detector 2 and the lead frame 7 have the dimensions A and B of the hole 1a of the upper detector 1 and the dimensions C and D of the hole 2b of the lower detector 2 as shown in FIG. The concave portions of the cavities (not shown) of the upper die 18 and the lower die 19 are similar in outer shape, and the forming elements 7a and 7b can be inserted therein.
[0032]
Therefore, if the forming elements 7a and 7b to which the lead frame 7 is attached are displaced or foreign matter is attached, the upper detector 1 does not move to a predetermined position as shown in FIG. When a gap of the distance E is generated and an abnormality of the lead frame 7 is detected by the proximity sensors 12 and 13, the output signal is transmitted when the lead frame 7 is transferred to the molding die and the supply mechanism and the closing hydraulic cylinder 20 are driven. This is transmitted to a mechanism (not shown) to stop the molding operation.
[0033]
That is, an abnormality in the lead frame 7 is detected and controlled by driving the upper detection body 1 and the lower detection body 2 of the low-cost and simple air-hydro cylinders 5 and 6.
[0034]
Even if the shape of the lead frame 7 is a strip having a predetermined size, an abnormality can be detected immediately before the mold clamping, that is, before molding.
[0035]
【The invention's effect】
As described above, according to the mold protection device of the present invention, abnormality in the lead frame can be detected in advance outside the molding die, damage to the lead frame and the forming element can be prevented, and damage or destruction of the molding die can be prevented. Can be prevented.
[Brief description of the drawings]
1A is a configuration diagram of a mold protection device according to an embodiment of the present invention, and FIG. 1B is a perspective view of a main part of the lead frame. FIG. 2 is a main part showing a relationship between the detector and the lead frame. FIG. 3 is a cross-sectional view of a main part for explaining the detection operation. FIG. 4 is a schematic front view of a configuration in which the mold protection device is mounted on a molding machine.
DESCRIPTION OF SYMBOLS 1 Upper detection body 1a Hole 2 Lower detection body 2b Hole 3, 3a Compression spring 4, 4a Compression spring 5, 6 Air-hydro cylinder 7 Lead frame 7a, 7b Forming element 8 Regulation guide 9 Positioning blocks 10, 11 Slide shafts 12, 13 Proximity sensors 14, 15 Mounting plate 16 Air cylinder 17 Main frame 18 Upper die 19 Lower die 20 Hydraulic cylinders 21, 21a for mold clamping Guide rollers 32, 33 Detection sensors

Claims (4)

形成素子が装着されたリードフレームをガイドする規制ガイドと、前記規制ガイドの一端に取付けられリードフレームを位置決めする上下移動自在な位置決めブロックと、成形金型のキャビティーの凹部と外形が相似で形成素子を挿入する孔を設けた上下移動自在の対の検出体と、検出体に取付けられた近接センサーの出力信号によりリードフレームの搬送や成形金型の駆動を制御する金型保護装置。A regulating guide for guiding the lead frame on which the forming element is mounted, a vertically movable positioning block attached to one end of the regulating guide and positioning the lead frame, and a recess and an outer shape of the cavity of the molding die are formed to be similar. A die protection device that controls the conveyance of a lead frame and the driving of a molding die by an output signal of a pair of vertically movable detectors provided with holes for inserting elements and a proximity sensor attached to the detectors. 対の検出体の上下移動の駆動にエアハイドロシリンダーを使用する請求項1に記載の金型保護装置。The mold protection device according to claim 1, wherein an air-hydro cylinder is used to drive the pair of detectors to move up and down. 対の検出体の側端部にリードフレームからの位置を検出する近接センサーを取付け、バネにより伸縮自在な対の検出体とした請求項1に記載の金型保護装置。2. The mold protection device according to claim 1, wherein a proximity sensor for detecting a position from the lead frame is attached to a side end of the pair of detectors, and the pair of detectors is a pair of detectors that can be expanded and contracted by a spring. 規制ガイドの一端に隣接して形成素子を検出する検出センサーを取付けてなる請求項1に記載の金型保護装置。The mold protection device according to claim 1, wherein a detection sensor for detecting a forming element is attached adjacent to one end of the regulation guide.
JP17796497A 1997-07-03 1997-07-03 Mold protection device Expired - Fee Related JP3577898B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP17796497A JP3577898B2 (en) 1997-07-03 1997-07-03 Mold protection device

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Application Number Priority Date Filing Date Title
JP17796497A JP3577898B2 (en) 1997-07-03 1997-07-03 Mold protection device

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JP3577898B2 true JP3577898B2 (en) 2004-10-20

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Cited By (1)

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WO2023056224A1 (en) * 2021-09-28 2023-04-06 Canon Virginia, Inc. Injection molding system using multiple molds

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US20120169326A1 (en) * 2010-12-30 2012-07-05 General Electric Company Methods, systems and apparatus for detecting material defects in combustors of combustion turbine engines
CN106908714B (en) * 2017-03-06 2018-05-15 深圳信息职业技术学院 Chip automatic detection device
WO2018161239A1 (en) * 2017-03-06 2018-09-13 邹霞 Automatic chip testing apparatus

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023056224A1 (en) * 2021-09-28 2023-04-06 Canon Virginia, Inc. Injection molding system using multiple molds
US11986982B2 (en) 2021-09-28 2024-05-21 Canon Virginia, Inc. Injection molding system using multiple molds

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