JPH11189703A - Phenol resin molding material - Google Patents

Phenol resin molding material

Info

Publication number
JPH11189703A
JPH11189703A JP36937397A JP36937397A JPH11189703A JP H11189703 A JPH11189703 A JP H11189703A JP 36937397 A JP36937397 A JP 36937397A JP 36937397 A JP36937397 A JP 36937397A JP H11189703 A JPH11189703 A JP H11189703A
Authority
JP
Japan
Prior art keywords
molding material
resin
weight
component
phenol
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP36937397A
Other languages
Japanese (ja)
Inventor
Hiroshi Akimoto
広 秋本
Kenji Asami
賢治 浅見
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kyocera Chemical Corp
Original Assignee
Toshiba Chemical Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Chemical Corp filed Critical Toshiba Chemical Corp
Priority to JP36937397A priority Critical patent/JPH11189703A/en
Publication of JPH11189703A publication Critical patent/JPH11189703A/en
Pending legal-status Critical Current

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  • Compositions Of Macromolecular Compounds (AREA)

Abstract

PROBLEM TO BE SOLVED: To obtain the subject molding material having excellent mechanical properties, electrical insulating properties and sliding characteristics by including specific amounts of a phenol novolak resin and fluorinated ethylene resin fine powder. SOLUTION: This phenol resin molding material comprises (A) a phenol novolak resin having 10,000-50,000 weight-average molecular weight and (B) tetrafluoroethylene resin fine powder as essential components in the ratio of 0.1-40 wt.% of based on the total molding material of the component B. The component A is obtained by formulating and reacting a phenol with an aldehyde in the molar ratio to the aldehyde of 0.85-0.90 in the presence of an acidic catalyst such as oxalic acid or the like and preferably 30-60 wt.% of the component A is mixed with the total of the molding material. Preferably the component B has 20-40 μm average particle diameter and 60-80 μm maximum particle diameter. The molding material can be optionally compounded with an inorganic filler such as calcium carbonate, clay, talc or the like and a natural wax.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、機械的特性、電気
的特性、摺動特性に優れたフェノール樹脂成形材料に関
する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a phenol resin molding material having excellent mechanical, electrical and sliding properties.

【0002】[0002]

【従来の技術】従来から、4 フッ化エチレン樹脂やグラ
ファイトといった摺動特性に優れる物質を配合したフェ
ノール樹脂成形材料を成形して得られる成形部品は、摺
動性に優れ、機構部品として使用されてきた。そして、
使用される部品の強度の向上志向から、より一層の高強
度化の要求が高まり、さらに電気絶縁性にも優れた材料
が望まれてきた。
2. Description of the Related Art Conventionally, molded parts obtained by molding a phenolic resin molding material containing a substance having excellent sliding properties, such as tetrafluoroethylene resin and graphite, have excellent sliding properties and have been used as mechanical parts. Have been. And
With the intention of improving the strength of components used, demands for higher strength have been increasing, and materials having excellent electrical insulation properties have been desired.

【0003】ところで、ガラス繊維を高充填した高強度
のフェノール樹脂成形材料は、上市されてはいるが、摺
動特性に問題がある。すなわち、ガラス繊維を高充填す
ることで、機械的強度は向上するものの、摺動特性が低
下するため、機械的強度と摺動特性を両立させることは
大変困難であった。また、4 フッ化エチレン樹脂やグラ
ファイトを配合したフェノール樹脂成形材料は、摺動特
性は向上するものの、機械的強度の低下が著しく、特に
グラファイトを配合したものについては電気絶縁性も低
下するため、前述の要求に応えるのは難しい現状であっ
た。
[0003] Although a high-strength phenolic resin molding material filled with glass fibers at a high level is on the market, it has a problem in sliding characteristics. That is, although the mechanical strength is improved by highly filling the glass fiber, the sliding characteristics are reduced, and it is very difficult to achieve both the mechanical strength and the sliding characteristics. In addition, the phenolic resin molding compound containing tetrafluoroethylene resin or graphite improves the sliding characteristics, but the mechanical strength is remarkably reduced.Especially, the compound containing graphite also decreases the electrical insulation. It was difficult to meet the aforementioned requirements.

【0004】[0004]

【発明が解決しようとする課題】本発明は、上記の事情
に鑑みてなされたもので、高い機械的強度を保持し、電
気絶縁性が良好で、かつ摺動特性に優れたフェノール樹
脂成形材料を提供しようとするものである。
SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and is a phenolic resin molding material having high mechanical strength, good electrical insulation, and excellent sliding properties. It is intended to provide.

【0005】[0005]

【課題を解決するための手段】本発明者らは、上記の課
題を達成しようと鋭意研究を重ねた結果、重量平均分子
量10,000〜50,000のフェノールノボラック樹脂とともに
4 フッ化エチレン樹脂微粉末を特定量配合することによ
って、機械的強度、電気絶縁性および摺動特性に優れた
成形材料が得られることを見いだし、本発明を完成した
ものである。
Means for Solving the Problems The inventors of the present invention have made intensive studies to achieve the above-mentioned objects, and as a result, together with a phenol novolak resin having a weight average molecular weight of 10,000 to 50,000.
4 It has been found that a molding material excellent in mechanical strength, electrical insulation and sliding properties can be obtained by mixing a specific amount of fine powder of fluoroethylene resin, and the present invention has been completed.

【0006】即ち、本発明は、重量平均分子量10,000〜
50,000フェノールノボラック樹脂および4 フッ化エチレ
ン樹脂微粉末を必須成分とし、全体の成形材料に対して
上記4 フッ化エチレン樹脂微粉末を 0.1〜40重量%の割
合で含有することを特徴とするフェノール樹脂成形材料
である。
[0006] That is, the present invention provides a method for preparing a weight-average molecular weight of 10,000-
A phenol resin characterized by comprising 50,000 phenol novolak resin and fine powder of tetrafluoroethylene resin as essential components, and containing 0.1 to 40% by weight of the fine powder of tetrafluoroethylene resin with respect to the whole molding material. It is a molding material.

【0007】以下、本発明を詳細に説明する。Hereinafter, the present invention will be described in detail.

【0008】本発明に用いるフェノールノボラック樹脂
としては、フェノール、クレゾール等のフェノール類、
または糖密、リグニン、キシレン、ナフタレン、石油系
芳香族炭化水素による変性フェノール類に対して、ホル
マリン、パラホルム等のアルデヒド類を0.85〜0.90のモ
ル比に配合し、蓚酸等の酸性触媒下で反応させた重量平
均分子量10,000〜50,000好ましくは30,000〜40,000のフ
ェノールノボラック樹脂であり、これを脱水工程を省略
した初期縮合物の状態で成形材料配合に用いる。このフ
ェノール樹脂の樹脂分配合割合は、成形材料全体に対し
て 0.1〜70重量%含有するように配合することが望まし
く、より望ましくは30〜60重量%である。この割合が0.
1 重量%未満では、機械的強度、電気的特性を向上させ
る効果はなく、また、70重量%を超えると、成形材料を
乾式法で製造することが困難となり好ましくない。この
フェノールノボラック樹脂の他に、必要に応じて重量平
均分子量10,000未満のノボラック型フェノール樹脂を併
用することができる。しかし、フェノールノボラック樹
脂を成形材料全体に対して70重量%を超えないようにす
ることが好ましい。
The phenol novolak resin used in the present invention includes phenols such as phenol and cresol;
Alternatively, aldehydes such as formalin and paraform are blended in a molar ratio of 0.85 to 0.90 with respect to phenols modified by molasses, lignin, xylene, naphthalene and petroleum aromatic hydrocarbons, and reacted under an acidic catalyst such as oxalic acid. It is a phenol novolak resin having a weight-average molecular weight of 10,000 to 50,000, preferably 30,000 to 40,000, which is used for compounding a molding material in the state of an initial condensate without a dehydration step. It is desirable that the phenolic resin is blended so as to contain 0.1 to 70% by weight, more preferably 30 to 60% by weight, based on the whole molding material. This ratio is 0.
If the amount is less than 1% by weight, there is no effect of improving the mechanical strength and the electrical properties, and if it exceeds 70% by weight, it is difficult to produce a molding material by a dry method, which is not preferable. In addition to the phenol novolak resin, a novolak phenol resin having a weight-average molecular weight of less than 10,000 can be used as needed. However, it is preferred that the phenol novolak resin does not exceed 70% by weight, based on the total molding material.

【0009】本発明に用いる4 フッ化エチレン樹脂微粉
末としては、平均粒径が10〜50μmで、最大粒径が50〜
100 μmであることが望ましい。より好ましくは、平均
粒径20〜40μm、最大粒径が60〜80μmである。4 フッ
化エチレン樹脂微粉末の分子量は、特に制限されるもの
ではない。
The fine powder of tetrafluoroethylene resin used in the present invention has an average particle diameter of 10 to 50 μm and a maximum particle diameter of 50 to 50 μm.
Desirably, it is 100 μm. More preferably, the average particle size is 20 to 40 μm, and the maximum particle size is 60 to 80 μm. 4 The molecular weight of the fluorinated ethylene resin fine powder is not particularly limited.

【0010】4 フッ化エチレン樹脂微粉末の配合量は、
全体の成形材料に対して、 0.1〜40重量%含有させるこ
とが必要であり、より好ましくは、10〜30重量%の範囲
内である。その配合量が、0.1 重量%未満では、摺動特
性が低下し好ましくない。またた、40重量%を超える
と、摺動特性は向上するものの、機械的強度に劣り好ま
しくない。
4 The compounding amount of the fluorinated ethylene resin fine powder is as follows:
It is necessary to contain 0.1 to 40% by weight with respect to the whole molding material, and more preferably, it is in the range of 10 to 30% by weight. If the compounding amount is less than 0.1% by weight, the sliding characteristics deteriorate, which is not preferable. On the other hand, if it exceeds 40% by weight, the sliding characteristics are improved, but the mechanical strength is poor, which is not preferable.

【0011】本発明のフェノール樹脂成形材料は、前述
したフェノール樹脂および4 フッ化エチレン樹脂微粉末
を含有するが、本発明の目的に反しない範囲において、
また必要に応じて、例えば、炭酸カルシウム、クレー、
タルク等の無機質充填剤、天然ワックス類、合成ワック
ス類、直鎖脂肪酸の金属塩、酸アミド、エステル類、パ
ラフィン類等の離型剤、塩化パラフィン、ブロムトルエ
ン、ヘキサブロムベンゼン、三酸化アンチモン等の難燃
剤、ヘキサメチレンテトラミン等の硬化剤、種々の硬化
促進剤等を適宜添加配合することができる。
[0011] The phenolic resin molding material of the present invention contains the above-mentioned phenolic resin and fine powder of tetrafluoroethylene resin.
If necessary, for example, calcium carbonate, clay,
Inorganic fillers such as talc, natural waxes, synthetic waxes, metal salts of linear fatty acids, mold release agents such as acid amides, esters, paraffins, paraffin chloride, bromtoluene, hexabromobenzene, antimony trioxide, etc. , A curing agent such as hexamethylenetetramine, various curing accelerators, and the like can be appropriately added and blended.

【0012】本発明のフェノール樹脂成形材料は、通
常、次のようにして製造される。前述したフェノール樹
脂、4 フッ化エチレン樹脂微粉末および必要に応じてそ
の他の添加剤を加えて混合して、均一に分散させた後、
混練機で加熱混練し、次いで冷却固化させて適当な大き
さに粉砕し成形材料とする。
The phenolic resin molding material of the present invention is usually manufactured as follows. After adding and mixing the above-mentioned phenol resin, fine powder of tetrafluoroethylene resin and other additives as necessary, and uniformly dispersing,
The mixture is heated and kneaded by a kneader, then solidified by cooling and pulverized to an appropriate size to obtain a molding material.

【0013】[0013]

【作用】本発明のフェノール樹脂成形材料は、高分子量
のフェノールノボラック樹脂を用いることによって、4
フッ化エチレン樹脂微粉末で摺動性を向上させているに
もかかわらず、機械的強度に優れたものとすることがで
きた。
The phenolic resin molding material of the present invention uses a high-molecular-weight phenol novolak resin,
Despite improving the slidability with the fine powder of the fluorinated ethylene resin, excellent mechanical strength could be obtained.

【0014】[0014]

【発明の実施の形態】次に本発明を実施例によって具体
的に説明するが、本発明は、下記実施例に限定されるも
のではない。以下、「%」とは、特に説明のないかぎ
り、「重量%」を意味する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be described specifically by way of examples, but the present invention is not limited to the following examples. Hereinafter, “%” means “% by weight” unless otherwise specified.

【0015】実施例 重量平均分子量38,000のフェノールノボラック樹脂の含
水初期縮合物50%(樹脂分)、ヘキサミン8 %、4 フッ
化エチレン樹脂微粉末15%、木粉15%、炭酸カルシウム
5 %、その他添加剤7 %を常温で混合し、さらに熱ロー
ルで混練して冷却した後、粉砕してフェノール樹脂成形
材料を製造した。
Example 50% of a water-containing initial condensate of a phenol novolak resin having a weight average molecular weight of 38,000 (resin content), 8% of hexamine, 15% of fine powder of tetrafluoroethylene resin, 15% of wood flour, calcium carbonate
5% and 7% of other additives were mixed at room temperature, kneaded with a hot roll, cooled, and pulverized to produce a phenolic resin molding material.

【0016】比較例1 重量平均分子量6,000 のフェノールノボラック樹脂50
%、ヘキサミン8 %、4フッ化エチレン樹脂微粉末15
%、木粉15%、炭酸カルシウム5 %、その他添加剤7 %
を常温で混合し、さらに熱ロールで混練して冷却した
後、粉砕してフェノール樹脂成形材料を製造した。
Comparative Example 1 Phenol novolak resin 50 having a weight average molecular weight of 6,000
%, Hexamine 8%, tetrafluoroethylene resin fine powder 15
%, Wood flour 15%, calcium carbonate 5%, other additives 7%
Were mixed at room temperature, further kneaded with a hot roll, cooled, and then pulverized to produce a phenolic resin molding material.

【0017】比較例2 重量平均分子量38,000の脱水をしたフェノールノボラッ
ク樹脂50%、ヘキサミン8 %、グラファイト粉末15%、
木粉15%、炭酸カルシウム5 %、その他添加剤7 %を常
温で混合し、さらに押出機で混練して冷却した後、粉砕
してフェノール樹脂成形材料を製造した。
Comparative Example 2 50% of a dehydrated phenol novolak resin having a weight average molecular weight of 38,000, 8% of hexamine, 15% of graphite powder,
15% of wood flour, 5% of calcium carbonate and 7% of other additives were mixed at room temperature, kneaded and cooled by an extruder, and then pulverized to produce a phenolic resin molding material.

【0018】実施例および比較例1〜2で製造したフェ
ノール樹脂成形材料を用いて射出成形で170 ℃に加熱し
た金型中で成形硬化させて成形部品とした。得られた成
形部品について、機械的特性、電気的特性、摩擦係数を
試験した。その結果を表1に示したが、本発明は、諸特
性に優れ、かつバランスのとれた特性を示し、本発明の
効果を確認することができた。
The phenolic resin molding materials produced in Examples and Comparative Examples 1 and 2 were molded and cured in a mold heated to 170 ° C. by injection molding to obtain molded parts. The obtained molded parts were tested for mechanical properties, electrical properties, and coefficient of friction. The results are shown in Table 1. As shown in the table, the present invention was excellent in various characteristics and exhibited well-balanced characteristics, thereby confirming the effects of the present invention.

【0019】[0019]

【表1】 [Table 1]

【0020】[0020]

【発明の効果】以上の説明および表1から明らかなよう
に、本発明のフェノール樹脂成形材料は、高い機械的強
度、電気的特性を保持しながら摺動性に優れたものであ
る。
As is apparent from the above description and Table 1, the phenolic resin molding material of the present invention is excellent in slidability while maintaining high mechanical strength and electrical characteristics.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】 重量平均分子量10,000〜50,000フェノー
ルノボラック樹脂および4 フッ化エチレン樹脂微粉末を
必須成分とし、全体の成形材料に対して上記4 フッ化エ
チレン樹脂微粉末を 0.1〜40重量%の割合で含有するこ
とを特徴とするフェノール樹脂成形材料。
A phenol novolak resin having a weight average molecular weight of 10,000 to 50,000 and a fine powder of tetrafluoroethylene resin as essential components, and a ratio of the fine powder of tetrafluoroethylene resin of 0.1 to 40% by weight to the whole molding material. A phenolic resin molding material characterized by containing
JP36937397A 1997-12-26 1997-12-26 Phenol resin molding material Pending JPH11189703A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP36937397A JPH11189703A (en) 1997-12-26 1997-12-26 Phenol resin molding material

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP36937397A JPH11189703A (en) 1997-12-26 1997-12-26 Phenol resin molding material

Publications (1)

Publication Number Publication Date
JPH11189703A true JPH11189703A (en) 1999-07-13

Family

ID=18494257

Family Applications (1)

Application Number Title Priority Date Filing Date
JP36937397A Pending JPH11189703A (en) 1997-12-26 1997-12-26 Phenol resin molding material

Country Status (1)

Country Link
JP (1) JPH11189703A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110678518A (en) * 2017-07-12 2020-01-10 爱克工业株式会社 Additive for wood plastic

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110678518A (en) * 2017-07-12 2020-01-10 爱克工业株式会社 Additive for wood plastic
CN110678518B (en) * 2017-07-12 2023-03-14 爱克工业株式会社 Additive for wood plastic

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