JPH11188682A - Pneumatic holding device provided with peeling mechanism - Google Patents

Pneumatic holding device provided with peeling mechanism

Info

Publication number
JPH11188682A
JPH11188682A JP1792898A JP1792898A JPH11188682A JP H11188682 A JPH11188682 A JP H11188682A JP 1792898 A JP1792898 A JP 1792898A JP 1792898 A JP1792898 A JP 1792898A JP H11188682 A JPH11188682 A JP H11188682A
Authority
JP
Japan
Prior art keywords
work
air
holding device
peeling mechanism
nozzle
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1792898A
Other languages
Japanese (ja)
Inventor
Hiroshi Akashi
博 明石
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP1792898A priority Critical patent/JPH11188682A/en
Publication of JPH11188682A publication Critical patent/JPH11188682A/en
Pending legal-status Critical Current

Links

Landscapes

  • Manipulator (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

PROBLEM TO BE SOLVED: To efficiently detach a work to be closely attached to a base without damaging or polluting it by providing a peeling mechanism which generates the negative pressure in a clearance between the mechanism and the work by ejecting air, and is provided with a nozzle to feed air into a back side of the work. SOLUTION: When a work 7 which is placed on a grinding machine 2 wet with water and closed attached to the grinding machine 2 by the surface tension is held and moved by a pneumatic holding device A fitted as a hand of a robot after the grinding work is completed, high pressure air C is fed from an air inlet 1, and ejected toward the work 7, and while high pressure air C passes through a clearance between a working surface 5 and the work 7, the negative pressure is generated by the ejector effect and the Bernoulli effect. High pressure air C is ejected from a nozzle 9 through a high pressure air inlet 8, high pressure air C is fed into a back side of work 7 through a hole in the work 7 to break the surface tension, and the work 7 is adsorbed in this condition.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【産業上の利用分野】本発明は、ハードディスク、半導
体ウエハ等を研磨機より剥離し、取り外す時に用いる空
気保持装置に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an air holding device used when a hard disk, a semiconductor wafer or the like is separated from a polishing machine and removed.

【0002】[0002]

【従来の技術】従来ハードディスクあるいはウエハ等の
ワ−クの研磨後、研磨盤より取り出す場合、水に濡れて
いるため表面張力により研磨盤に密着しているため、簡
単に剥して取り外すことはできず、密着させたまま研磨
盤上を空隙のあるところまで表面を傷つけないように人
手により移動させ取り外していたり、爪状の保持具を開
閉させてディスク内穴に引っかけて取り外していた。
2. Description of the Related Art Conventionally, when a work such as a hard disk or a wafer is polished and taken out from a polishing plate, it can be easily peeled off because it is wet with water and is in close contact with the polishing plate due to surface tension. Instead, it was manually moved and removed on the polishing plate to the point where there was a gap on the polishing plate so as not to damage the surface, or the claw-shaped holder was opened and closed and hooked on the inner hole of the disk.

【0003】[0003]

【発明が解決しようとする課題】しかしながらワ−ク表
面に触れたり、穴端面を強く爪状の保持具で押し付ける
ため傷や汚れを付着させ、また研磨マットを傷つけたり
し、製造歩留まりが低く、また作業時間もかかり非能率
的であるという欠点があった。
However, the surface of the work is touched, and the end face of the hole is strongly pressed by a nail-like holder, so that scratches and dirt are attached, and the polishing mat is damaged. In addition, there is a disadvantage that it takes a long working time and is inefficient.

【0004】[0004]

【課題を解決する手段】上記の課題を解決するために、
空気を噴出することによりワ−クとの間隙に負圧を発生
せしめ、ワ−クを吸引保持する空気保持器に、ワ−ク裏
面に空気を挿入するノズルを付加した剥離機構を備えた
空気保持装置により解決できる。
In order to solve the above problems,
Air having a peeling mechanism in which a negative pressure is generated in a gap between the work and the air by ejecting the air, and an air holder for sucking and holding the work and a nozzle for inserting air into the back of the work are added. The problem can be solved by the holding device.

【0005】[0005]

【作用】水に濡れた研磨盤に載せられ、表面張力あるい
は真空状態により密着している平板上のワ−クに近接し
た空気保持器よりワ−クに向かって空気を噴出すると、
空気保持器とワ−クとで形成される空間は、高速空気流
が通るため減圧され、ワ−クに対して吸引力が働く。
When air is blown toward a work from an air holder placed near a work on a flat plate which is placed on a polishing plate wetted with water and closely adhered by surface tension or vacuum,
The space formed by the air retainer and the work is depressurized because high-speed air flows therethrough, and a suction force acts on the work.

【0006】同時にワ−クの端部の研磨盤上にノズルよ
り高圧空気を噴出する。
At the same time, high pressure air is blown from a nozzle onto the polishing plate at the end of the work.

【0007】噴出された高圧空気はワ−ク裏面と研磨盤
の間に入り込み、ワ−クと研磨盤との表面張力あるいは
真空を破壊する。
The jetted high-pressure air enters between the back surface of the work and the polishing disk, and breaks the surface tension or vacuum between the work and the polishing disk.

【0008】このためワ−クと研磨盤との密着力はなく
なり、容易に空気保持器の吸引力により研磨盤より剥さ
れる。
[0008] Therefore, the adhesion between the work and the polishing disk is lost, and the work is easily peeled off from the polishing disk by the suction force of the air retainer.

【0009】[0009]

【実施例1】図1及び図2に本発明の剥離機構を備えた
空気保持装置Aの実施例を示す。
Embodiment 1 FIGS. 1 and 2 show an embodiment of an air holding device A having a peeling mechanism according to the present invention.

【0010】円盤上の基体3底面に円柱状の空気保持器
Bを形成する。
A cylindrical air retainer B is formed on the bottom surface of the base 3 on the disk.

【0011】円柱体6の中央部には、基体3の上方部よ
り空気送入口1が貫通している。
An air inlet 1 extends through the center of the cylindrical body 6 from above the base 3.

【0012】前記円柱体6下部に空間を設けクッション
室4とし、クッション室4周辺部に作動面5を形成す
る。
A space is provided below the cylindrical body 6 to form the cushion chamber 4, and an operating surface 5 is formed around the cushion chamber 4.

【0013】空気保持器Bは、前記空気送入口1、クッ
ション室4及び作動面5により構成されている。
The air retainer B comprises the air inlet 1, the cushion chamber 4 and the operating surface 5.

【0014】また基体3の中央部に高圧空気供給口8を
設け、その下端部にはノズル9が設けられている。
A high-pressure air supply port 8 is provided at the center of the base 3, and a nozzle 9 is provided at the lower end thereof.

【0015】ノズル9は、中央部に穴のあるディスク状
のワ−ク7の中央穴側端の研磨盤2上に向かって噴出す
るように形成されている。
The nozzle 9 is formed so as to be ejected toward the polishing platen 2 at the end of the disc-shaped work 7 having a hole at the center portion on the side of the center hole.

【0016】上記のように剥離機構を備えた空気保持装
置Aが形成されている。
As described above, the air holding device A having the peeling mechanism is formed.

【0017】ワ−ク7は研磨作業が終了し、水で濡れて
いる研磨盤2上に置かれており、表面張力により研磨盤
2に密着している。
The work 7 is placed on the polishing plate 2 wet with water after the polishing operation is completed, and is in close contact with the polishing plate 2 by surface tension.

【0018】剥離機構を備えた空気保持装置Aは、ロボ
ット(図示せず)等の移載装置のハンドとして装着され
ており、その移動はロボットにより行なわれる。
The air holding device A having a peeling mechanism is mounted as a hand of a transfer device such as a robot (not shown), and the movement is performed by the robot.

【0019】上記の構成にて、研磨盤2上のワ−ク7
に、ロボットに装着された剥離機構を備えた空気保持装
置Aの空気保持器Bの作動面5がワ−ク7に近接した位
置に移動する。
With the above arrangement, the work 7 on the polishing machine 2
Then, the working surface 5 of the air holder B of the air holding device A equipped with the peeling mechanism mounted on the robot moves to a position close to the work 7.

【0020】空気送入口1より高圧空気Cを供給し、ワ
−ク7に向かって噴出する。
High-pressure air C is supplied from an air inlet 1 and jets toward a work 7.

【0021】高圧空気Cはクッション室4、作動面5と
ワ−ク7と空隙を通過する際に、エゼクタ効果及びベル
ヌ−イ効果により負圧を発生させ、ワ−ク7に対して吸
引力を生じる。
The high-pressure air C generates a negative pressure due to the ejector effect and the Bernoulli effect when passing through the air gap between the cushion chamber 4, the operating surface 5, the work 7 and the suction space. Is generated.

【0022】しかしながらワ−ク7は、水の表面張力に
より研磨盤2に密着しており、吸引剥離しない。
However, the work 7 is in close contact with the polishing plate 2 due to the surface tension of water, and does not peel off by suction.

【0023】そのため高圧空気供給口8より高圧空気C
をノズル9に供給し、ノズル9より高圧空気Cをワ−ク
7の穴の下端部の研磨盤2上面に噴出し、ワ−ク7裏面
に高圧空気Cを挿入させ、表面張力を破壊させワ−ク7
の研磨盤2より剥離させる。
Therefore, the high-pressure air C is supplied from the high-pressure air supply port 8.
Is supplied to the nozzle 9, and high-pressure air C is blown out from the nozzle 9 onto the upper surface of the polishing platen 2 at the lower end of the hole of the work 7, and high-pressure air C is inserted into the back of the work 7 to break the surface tension. Work 7
Is peeled off from the polishing plate 2.

【0024】これによりワ−ク7は、空気保持器Bに接
触しない無接触状態にて吸引保持され、この状態でロボ
ットにより所定の位置まで搬送される。
As a result, the work 7 is sucked and held in a non-contact state without contacting the air retainer B, and is conveyed to a predetermined position by the robot in this state.

【0025】剥離機構を備えた空気保持装置Aのワ−ク
7の空気保持器Bは、図3に示す機構の空気保持器Fで
もよく、その他噴出する高速空気流により負圧を発生さ
せワ−クを吸引する機能を生じるものであればよい。
The air retainer B of the work 7 of the air retainer A having the peeling mechanism may be the air retainer F of the mechanism shown in FIG. -Any function that produces a function of sucking the gas may be used.

【0026】また剥離用ノズル9は、図5に示すように
ワ−ク7外端に向かって噴出するものでもよい。
Further, the peeling nozzle 9 may be one which blows out toward the outer end of the work 7 as shown in FIG.

【0027】またノズル9は、基体3と一体化せず分離
した構造のものでもよい。
The nozzle 9 may have a structure separated from the base 3 without being integrated.

【0028】[0028]

【実施例2】図6は、本発明の別の実施例の側面断面図
である。
FIG. 6 is a side sectional view of another embodiment of the present invention.

【0029】円盤状の基体10の下面に基盤10の上面
に貫通する空気吸引口11を備えたじょうご状の空気保
持器Eを装着している。
A funnel-shaped air retainer E provided with an air suction port 11 penetrating through the upper surface of the base 10 is mounted on the lower surface of the disk-shaped base 10.

【0030】空気保持器Eの側壁12は柔軟なゴム材に
て形成されている。
The side wall 12 of the air retainer E is formed of a flexible rubber material.

【0031】基体10端部に高圧空気供給口8を設け、
その下端部にはノズル9が設けられて、剥離機構を備え
た空気保持装置Dを形成する。
A high-pressure air supply port 8 is provided at an end of the base 10,
A nozzle 9 is provided at its lower end to form an air holding device D having a peeling mechanism.

【0032】剥離機構を備えた空気保持装置Dは、ロボ
ット(図示せず)のハンドとして装着されており、その
移動はロボットにより行なわれる。
The air holding device D provided with a peeling mechanism is mounted as a hand of a robot (not shown), and its movement is performed by the robot.

【0033】上記の構成にて、研磨盤2上のワ−ク7に
ロボットに装着された剥離機構を備えた空気保持装置D
の空気保持器Eが移動し、ワ−ク7に密着する。
In the above configuration, the air holding device D having a peeling mechanism mounted on the robot on the work 7 on the polishing plate 2
The air retainer E moves and comes into close contact with the work 7.

【0034】空気吸引口11より真空ポンプ(図示せ
ず)により空気を吸引し、空気保持器E内部を真空状態
にしワ−ク7を吸着する。
Air is sucked from the air suction port 11 by a vacuum pump (not shown), and the inside of the air holder E is evacuated to suck the work 7.

【0035】しかしながらワ−ク7は、水の表面張力に
より研磨盤2に密着しており、吸引剥離しない。
However, the work 7 is in close contact with the polishing plate 2 due to the surface tension of water, and does not peel off by suction.

【0036】そのため高圧空気供給口8より高圧空気C
をノズル9に供給し、ノズル9より高圧空気Cをワ−ク
7の下端部の研磨盤2面に噴出し、ワ−ク7の裏面に高
圧空気Cを挿入させ、表面張力を破壊させる。
For this reason, the high-pressure air C
Is supplied to the nozzle 9 and high-pressure air C is jetted from the nozzle 9 onto the polishing platen 2 at the lower end of the work 7 to insert the high-pressure air C into the back surface of the work 7 to break the surface tension.

【0037】これによりワ−ク7は、空気保持器Eによ
り吸着保持され、この状態でロボットにより所定の位置
まで搬送される。
Thus, the work 7 is sucked and held by the air holder E, and is conveyed to a predetermined position by the robot in this state.

【0038】空気保持器Eは、真空吸着パッドと称せら
れるものでもよい。
The air retainer E may be called a vacuum suction pad.

【0039】[0039]

【実施例3】図7及び図8は本発明の他の実施例を示
す。
Embodiment 3 FIGS. 7 and 8 show another embodiment of the present invention.

【0040】基体25には内外(K方向)に移動可能な
爪状の保持具22が装着されている。
The base 25 is provided with a claw-shaped holder 22 movable in and out (in the direction K).

【0041】また基体25下部には高圧空気Cを噴出す
るノズル9を設けたボス23を配設して剥離機構を備え
た空気保持装置Gを形成している。
A boss 23 provided with a nozzle 9 for ejecting high-pressure air C is provided below the base 25 to form an air holding device G having a peeling mechanism.

【0042】剥離機構を備えた空気保持装置Gは、ロボ
ット(図示せず)のハンドとして装着されており、その
移動はロボットにより行なわれる。
The air holding device G provided with a peeling mechanism is mounted as a hand of a robot (not shown), and its movement is performed by the robot.

【0043】上記の構成にて、研磨盤2上のワ−ク7に
ロボットに装着された剥離機構を備えた空気保持装置G
の爪状の保持具22が内側にある状態にて下降し、ワ−
ク7の内穴に入り停止する。
In the above configuration, the air holding device G provided with the peeling mechanism mounted on the robot on the work 7 on the polishing plate 2
Is lowered with the claw-shaped holding member 22 of
It enters the inner hole of the lock 7 and stops.

【0044】この状態にて高圧空気C源に通じるノズル
9より高圧空気Cをワ−ク7の下端部の研磨盤2面に噴
出し、ワ−ク7の裏面に高圧空気Cを挿入させ、表面張
力を破壊させ、ワ−ク7を浮上させる。
In this state, high-pressure air C is jetted from the nozzle 9 leading to the high-pressure air C source to the polishing platen 2 at the lower end of the work 7, and the high-pressure air C is inserted into the back of the work 7. The surface tension is destroyed, and the work 7 floats.

【0045】同時に爪状の保持具22を外側へ移動さ
せ、ワ−ク7の内穴側端に押着させワ−ク7を保持す
る。
At the same time, the claw-like holder 22 is moved outward, and is pressed against the inner hole side end of the work 7 to hold the work 7.

【0046】このようにしてワ−ク7は空気保持器Gに
より保持され、この状態でロボットにより所定の位置ま
で搬送される。
In this way, the work 7 is held by the air holder G, and is transferred to a predetermined position by the robot in this state.

【0047】[0047]

【実施例4】図9は、本発明の剥離機構を備えた空気保
持装置を用いて研磨盤のごとき平滑な積載台14上に密
着した平滑なワ−ク7を剥離させ、移載台13上に移載
するワ−ク剥離搬送システムである。
[Embodiment 4] FIG. 9 is a view showing a state in which a smooth work 7 closely adhered to a smooth loading table 14 such as a polishing machine is peeled off using an air holding device provided with a peeling mechanism of the present invention, This is a work peeling and conveying system to be transferred above.

【0048】図に於て剥離機構を備えた空気保持装置A
(あるいはD、G)を装着している前後進及び昇降可能
な移動片16を備える旋回可能な移動具15と、剥離機
構を備えた空気保持装置Aが移載台14上のワ−ク7上
方の吸引保持可能な位置に到達したとき、高圧空気源
(あるいは真空発生源)(図示せず)と空気送入口1を
接続する配管19の途中に介在する開閉弁17および高
圧空気供給口8とを接続する配管20の途中に介在する
開閉弁18を開け剥離機構を備えた空気保持装置Aに空
気を供給し、ワ−ク7吸引保持する。
In the figure, an air holding device A having a peeling mechanism is shown.
(Or D, G) equipped with a movable piece 16 having a movable piece 16 capable of moving forward and backward and ascending and descending, and an air holding device A equipped with a peeling mechanism are provided with a work 7 on a transfer table 14. When reaching the upper position where suction can be held, an on-off valve 17 and a high-pressure air supply port 8 are provided in the middle of a pipe 19 connecting the high-pressure air source (or vacuum generation source) (not shown) and the air inlet 1. The air is supplied to the air holding device A provided with a peeling mechanism by opening the on-off valve 18 provided in the middle of the pipe 20 connecting the work 7 and the work 7, and the work 7 is sucked and held.

【0049】ワ−ク7を剥離機構を備えた空気保持装置
Aが吸引保持したことをセンサー21が検出すると、移
動片16が上昇し、同時に移動具15が積載台13上ま
で旋回し、所定の位置にきたとき開閉弁17、18を閉
じワ−ク7を脱着し、積載台13上に積載する。
When the sensor 21 detects that the work 7 has been sucked and held by the air holding device A provided with a peeling mechanism, the moving piece 16 rises, and at the same time, the moving tool 15 pivots on the loading table 13 and moves to a predetermined position. , The valves 7 and 18 are closed, the work 7 is detached and loaded on the loading table 13.

【0050】移載台14及び積載台13は固定されてる
ものでなく、ベルト状の移動体でもよい。
The transfer table 14 and the loading table 13 are not fixed, but may be belt-shaped moving bodies.

【0051】移動片16は、昇降機能だけのものでもよ
く、移動具15は往復運動だけのものでもよい。
The moving piece 16 may have only a lifting function, and the moving tool 15 may have only a reciprocating motion.

【0052】上記剥離機構を備えた空気保持装置Aは、
剥離機構を備えた空気保持装置D、Gでもよい。
The air holding device A provided with the above-mentioned peeling mechanism is:
Air holding devices D and G having a peeling mechanism may be used.

【0053】[0053]

【発明の効果】以上説明したように、本発明により表面
張力あるいは真空により台に密着しているワ−クを傷や
汚れを付けることなく、また損傷することなく効率よく
取り外すことができるようになり、その結果自動化が可
能となり、製造歩留まりの向上、大量生産可能、および
コストダウンが可能になった。
As described above, according to the present invention, it is possible to efficiently remove a work closely adhered to a table by surface tension or vacuum without damaging or damaging the work. As a result, automation has become possible, and it has become possible to improve manufacturing yield, enable mass production, and reduce costs.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明の剥離機構を備えた空気保持装置の側面
断面図である。
FIG. 1 is a side sectional view of an air holding device provided with a peeling mechanism of the present invention.

【図2】本発明の剥離機構を備えた空気保持装置の下平
面図である。
FIG. 2 is a bottom plan view of an air holding device provided with a peeling mechanism of the present invention.

【図3】別の空気保持器の側面断面図である。FIG. 3 is a side sectional view of another air retainer.

【図4】別の空気保持器の下平面図である。FIG. 4 is a bottom plan view of another air retainer.

【図5】本発明の別の剥離機構を備えた空気保持装置の
側面断面図である。
FIG. 5 is a side sectional view of an air holding device provided with another peeling mechanism of the present invention.

【図6】本発明の他の剥離機構を備えた空気保持装置の
側面断面図である。
FIG. 6 is a side sectional view of an air holding device provided with another peeling mechanism of the present invention.

【図7】本発明のその他の剥離機構を備えた空気保持装
置の側面断面図である。
FIG. 7 is a side sectional view of an air holding device provided with another peeling mechanism of the present invention.

【図8】本発明のその他の剥離機構を備えた空気保持装
置の下平面図である。
FIG. 8 is a bottom plan view of an air holding device provided with another peeling mechanism of the present invention.

【図9】本発明のワ−ク剥離搬送システムの説明図であ
る。
FIG. 9 is an explanatory view of a work separation and transport system of the present invention.

【符号の説明】[Explanation of symbols]

1 空気送入口 2 研磨盤 3 基体 4 クッション室 5 作動面 6 側壁 7 ワ−ク 8 高圧空気供給口 9 ノズル 10 基体 11 空気吸引口 12 側壁 13 移載台 14 積載台 15 移送具 16 移載片 17、18 開閉弁 21 センサー 22 保持具 23 ボス 25 基体 A、D 、G 剥離機構を備えた空気保持装置 B、E、F 空気保持器 C 高圧空気 DESCRIPTION OF SYMBOLS 1 Air inlet 2 Polishing board 3 Base 4 Cushion chamber 5 Working surface 6 Side wall 7 Work 8 High pressure air supply port 9 Nozzle 10 Base 11 Air suction port 12 Side wall 13 Transfer stand 14 Loading stand 15 Transfer tool 16 Transfer piece 17, 18 On-off valve 21 Sensor 22 Holder 23 Boss 25 Substrate A, D, G Air holding device equipped with peeling mechanism B, E, F Air holding device C High pressure air

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】 空気を噴出することによりワ−クとの間
隙に負圧を発生せしめ、ワ−クを吸引保持する空気保持
器に、ワ−ク裏面に空気を挿入するノズルを付加した剥
離機構を備えた空気保持装置。
1. A peeling method in which a negative pressure is generated in a gap between a workpiece and a workpiece by ejecting air, and a nozzle for inserting air into the back of the workpiece is added to an air retainer for sucking and holding the workpiece. An air holding device with a mechanism.
【請求項2】 真空吸着によりワ−クを吸引保持する空
気保持器に、ワ−ク裏面に空気を挿入するノズルを付加
した剥離機構を備えた空気保持装置。
2. An air holding apparatus having a peeling mechanism in which a nozzle for inserting air into the back surface of a work is added to an air holder for sucking and holding a work by vacuum suction.
【請求項3】 ワ−ク端側部に保持具を押着することに
よりワ−クを保持する保持器に、ワ−ク裏面に空気を挿
入するノズルを付加した剥離機構を備えた空気保持装
置。
3. An air holding device having a peeling mechanism in which a retainer for holding a work by pressing a holder on a side of a work end and a nozzle for inserting air into the back surface of the work are provided. apparatus.
【請求項4】 ワ−クを積載している積載台と、前記ワ
−クを移載する移載台との間を往復運動ができかつ昇降
自在な移動片を備える移動具と、前記移動片に取り付け
られた請求項1、請求項2あるいは請求項3に記載され
た剥離機構を備えた空気保持装置と、前記剥離機構を備
えた空気保持装置とからなるワ−ク剥離搬送システム。
4. A moving tool having a movable piece capable of reciprocating and moving up and down between a loading table on which a work is loaded and a transfer table for transferring the work; A work separation and transport system comprising: an air holding device provided with the separation mechanism according to claim 1 attached to a piece; and an air holding device provided with the separation mechanism.
JP1792898A 1997-10-23 1998-01-14 Pneumatic holding device provided with peeling mechanism Pending JPH11188682A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1792898A JPH11188682A (en) 1997-10-23 1998-01-14 Pneumatic holding device provided with peeling mechanism

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP9-309380 1997-10-23
JP30938097 1997-10-23
JP1792898A JPH11188682A (en) 1997-10-23 1998-01-14 Pneumatic holding device provided with peeling mechanism

Publications (1)

Publication Number Publication Date
JPH11188682A true JPH11188682A (en) 1999-07-13

Family

ID=26354518

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1792898A Pending JPH11188682A (en) 1997-10-23 1998-01-14 Pneumatic holding device provided with peeling mechanism

Country Status (1)

Country Link
JP (1) JPH11188682A (en)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010048254A1 (en) * 2008-10-23 2010-04-29 Corning Incorporated High temperature sheet handling system and methods
JP2015013353A (en) * 2013-07-08 2015-01-22 浜井産業株式会社 Workpiece release device and release method
JP2015110272A (en) * 2015-02-25 2015-06-18 東芝機械株式会社 Robot hand
KR20160131242A (en) * 2015-05-06 2016-11-16 주식회사 케이씨텍 Dechuck method for substrate polishing apparatus
CN106903711A (en) * 2017-03-30 2017-06-30 苏州华科精密模具有限公司 A kind of manipulator jig of voice coil motor production of plastics parts

Cited By (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010048254A1 (en) * 2008-10-23 2010-04-29 Corning Incorporated High temperature sheet handling system and methods
CN102197455A (en) * 2008-10-23 2011-09-21 康宁股份有限公司 High temperature sheet handling system and methods
US8443863B2 (en) 2008-10-23 2013-05-21 Corning Incorporated High temperature sheet handling system and methods
JP2015013353A (en) * 2013-07-08 2015-01-22 浜井産業株式会社 Workpiece release device and release method
JP2015110272A (en) * 2015-02-25 2015-06-18 東芝機械株式会社 Robot hand
KR20160131242A (en) * 2015-05-06 2016-11-16 주식회사 케이씨텍 Dechuck method for substrate polishing apparatus
CN106903711A (en) * 2017-03-30 2017-06-30 苏州华科精密模具有限公司 A kind of manipulator jig of voice coil motor production of plastics parts

Similar Documents

Publication Publication Date Title
TWI417985B (en) Non - contact type adsorption holding device
JP4491340B2 (en) Transport device
KR101768721B1 (en) Workpiece transport method and workpiece transport apparatus
TWI742023B (en) Substrate processing apparatus, method of detaching substrate from vacuum suction table of substrate processing apparatus, and method of placing substrate onto vacuum suction table of substrate processing apparatus
JP3920720B2 (en) Substrate delivery method, substrate delivery mechanism, and substrate polishing apparatus
JPH05277977A (en) Tool and method for picking up semi-conductor chip
CN107887313B (en) Processing device
JP2012191051A (en) Method of manufacturing semiconductor, and device of manufacturing semiconductor
US20050163598A1 (en) Method for carrying substrate
JPH11188682A (en) Pneumatic holding device provided with peeling mechanism
JP2009170761A (en) Pasting apparatus of substrate body, and treating method of substrate body
JP2002368065A (en) Aligning device
JP2013145776A (en) Transferring method
JP6632344B2 (en) Wafer transfer device
JP2005074606A (en) Vacuum tweezers
JP2000159342A (en) Conveying apparatus for plate-shaped member
JP2001162575A (en) Conveying device
KR20050072665A (en) Method of removing unnecessary matter from semiconductor wafer, and apparatus using the same
JP4459023B2 (en) Substrate holding device
JP6695225B2 (en) Transport unit
JP7339860B2 (en) processing equipment
JP7320428B2 (en) processing equipment
KR20210072698A (en) Plate-like object holder
JP7193933B2 (en) Conveying method of workpiece
JPH07299734A (en) Method and device for transportation of wafer