JPH11186671A - Light source device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To raise heat dissipation property of a semiconductor laser and restrain wavelength variation, by holding a semiconductor laser to a supporter by making at least one portion of an outer circumferential surface of a stem of a semiconductor laser not in contact with a supporter. SOLUTION: Heat dissipation property of self-heat generation of a semiconductor laser can be raised by a lead pin arranged surface S40 of a stem part S10 of a semiconductor laser and an exposed surface of a portion which is relevant to a groove position of a laser holder of an outer circumferential surface S30. A hole part formed of a slit 43 of a lens holder 40 and a tubular part of the lens holder 40 and a groove part 17 of a laser holder 10 are conductive and air flowing there cools a semiconductor stem and raises heat dissipation property of a semiconductor laser. Therefore, even if a material of a laser holder which supports a semiconductor laser is resin which is inferior to metal, heat dissipation property of a semiconductor laser can be raised and wavelength variation can be restrained without requiring special processing and method.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light source device used for an image recording apparatus such as a laser beam printer or a laser facsimile, and a pickup unit for an optical disk using a semiconductor laser.

[0002]

2. Description of the Related Art An image recording apparatus such as a laser beam printer and a laser facsimile, and a light source apparatus such as an optical disk pickup unit using a semiconductor laser collimate a laser beam generated from the semiconductor laser into a predetermined sectional shape. The semiconductor laser is coupled to a circuit board on which a driving IC and the like are mounted, and is made into a unit. FIG. 12 illustrates a general configuration of the image recording apparatus. A laser beam J0 generated from a unitized light source device E0 is applied to a polygon mirror R0 via a cylindrical lens C0, thereby performing scanning deflection. Then, the light is reflected by the turning mirror M0 via the imaging lens F0, and is imaged on the surface of a photosensitive drum (not shown). The laser light imaged on the photosensitive drum is
An electrostatic latent image is formed by main scanning by rotation of the polygon mirror R0 and sub-scanning by rotation of the photosensitive drum. A part of the laser beam deflected and scanned by the polygon mirror R0 is introduced by a detection mirror B0 to a scanning start signal detector D0, and the output signal of the scanning start signal detector D0 causes the semiconductor laser of the light source device E0 to perform write modulation. Start. The light source device E0 and the polygon mirror R
The imaging lens F0, the detection mirror B0, the scanning start signal detector D0, the folding mirror M0, and the like are attached to the housing H0, and the upper opening of the housing H0 is closed by a lid (not shown).

FIG. 13 is an enlarged view of the light source device E0. S1 is a semiconductor laser which is a light source.
P1 is a circuit board having an IC (not shown) for driving the semiconductor laser S1. 100 is the inner peripheral portion 11 of the cylindrical portion 111
2, the semiconductor laser S1 is held at one end, and the cylindrical portion 11
1 is provided with a fitting hole H10 of the housing H1.
, A mounting portion 114 for fixing the light source device E0 to the housing H1 with screws K10, and a circuit board P.
A laser holder having a mounting portion 115 for connecting the semiconductor laser S1 to the semiconductor laser S1 and fixing the semiconductor laser S1 with a screw K20.

[0004] C1 is a collimator lens for converting the laser light of the semiconductor laser S1 into parallel light. Reference numeral 200 denotes a mounting hole 210 containing a collimator lens C1 and a semiconductor laser S1.
Optical stop 220 for converting the laser light into a predetermined spot shape
Lens holding portion 230 having an inner peripheral portion 250
A lens holder in which a cylindrical portion 240 which is externally fitted to a portion of the cylindrical portion 111 of the laser holder 100 opposite to the semiconductor laser holding portion and which is a bonding portion is integrally formed.

In the above configuration, the semiconductor laser S1 is
On the inner peripheral portion 112 of the cylindrical portion 111 of the laser holder 100,
Directly press-fit and fixedly held. Collimator lens C1
Is fitted into the mounting hole 210 of the lens holder 200,
It is fixed and held by bonding or heat welding. The laser holder 100 for holding the semiconductor laser S1 and the lens holder 200 for holding the collimator lens C1 are located within the radial gap between the inner periphery of the lens holder 200 and the outer periphery of the cylindrical portion 111 of the laser holder 100. The optical axis of the laser beam S1 and the collimator lens C1 are aligned, and the collimator lens C1 is focused by sliding the lens holder 200 in the optical axis direction. After this, the lens holder 20
The light source device is formed by integrating the laser holder 100 with the laser holder 100 by bonding or the like.

[0006]

A semiconductor laser has a characteristic that its wavelength fluctuates to a longer wavelength side due to a rise in temperature. In particular, as shown in FIG. 14, in a short time immediately after the start of light emission of the semiconductor laser, a temperature rise due to self-heating of the semiconductor laser and wavelength fluctuation are remarkable. This fluctuation in the wavelength of the semiconductor laser changes the final image formation position of the laser light, and adversely affects the latent image shape. In order to reduce the influence of the temperature change of these semiconductor lasers, generally, a light emitting system in which the temperature of the semiconductor laser is controlled by a Peltier element or the like or a temperature compensation system is added is known. However, these methods require new control devices and complicated control systems, and have problems such as cost and space.

On the other hand, by radiating and cooling the semiconductor laser itself, a certain degree of self-heating of the semiconductor laser can be suppressed. Therefore, holding the semiconductor laser with a metal support (laser holder) is advantageous in heat dissipation. Speaking of this laser holder, in terms of cost, it is required to be formed integrally with a molded product,
Further, from the viewpoints of weight reduction, dimensions and surface accuracy, it is desirable that the material is made of resin rather than metal. However, in addition to using a resin that is less heat-dissipating than metal as a material, in the method of holding a semiconductor laser to a laser holder as shown in the conventional example, the lead pin of the stem portion of the semiconductor laser functions as a heat dissipation surface. Only one side is set. For this reason, the latent image shape becomes unstable due to the wavelength fluctuation due to the self-heating of the semiconductor laser described above. In particular, it is not suitable for a model with high definition image specifications.

Accordingly, the present invention solves the above-mentioned problems of the prior art, and can enhance the heat radiation of the semiconductor laser and suppress the wavelength fluctuation by using a resin support.
It is an object of the present invention to provide an inexpensive, high-performance, high-definition light source device.

[0009]

According to the present invention, in order to achieve the above object, a light source device is constituted as follows. That is, the light source device of the present invention is:
In a light source device comprising a support for press-fitting and holding a semiconductor laser as a light source, and a collimator lens for substantially collimating the laser light, and a lens holder arranged at a predetermined distance from the semiconductor laser, The support for press-fitting and holding is made of a resin support, and at least one support is provided on the outer peripheral surface of the stem of the semiconductor laser held by the support.
The semiconductor laser is held on the support so as to form an exposed surface that does not contact the support at at least two places. Further, in the light source device according to the present invention, the exposed surface may be formed in a cylindrical portion serving as a laser light path of a semiconductor laser provided on the support, and an inner peripheral surface extending in an optical axis direction of the cylindrical portion to the semiconductor laser mounting hole. It is characterized by being formed by at least one or more continuously formed grooves. Further, in the light source device of the present invention, at least one of the exposed surfaces penetrates in the optical axis direction on a circumference of a mounting hole of the semiconductor laser provided on the flange portion of the support.
At least three through holes are provided, and each through hole portion is formed by three or more surfaces including at least the outer peripheral surface of the stem surface of the semiconductor laser that does not come into contact with the support by the through hole portion. And Further, in the light source device of the present invention, the support is provided with a circuit board for driving the semiconductor laser, and the circuit board has a hole at the same position as a through hole provided in a flange of the support. It is characterized by being formed. Further, in the light source device according to the present invention, the exposed surface intersects a mounting hole of the semiconductor laser provided on the flange portion of the support, and extends on a plane perpendicular to the laser emission direction by at least one or more grooves. It is characterized by being formed.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS As described above, according to the present invention, a semiconductor laser is formed such that an exposed surface which does not contact at least one or more resin supports (laser holders) is formed on an outer peripheral surface of a stem. By employing a configuration in which the semiconductor laser is held by the laser holder, it is possible to increase the number of surfaces of the semiconductor laser that are exposed to the external atmosphere, thereby improving the heat radiation effect of the semiconductor laser. Further, the present invention provides a cylindrical portion serving as a laser light path of a semiconductor laser provided in a laser holder, at least one or more portions continuously formed in a semiconductor laser mounting hole from an inner peripheral surface of the cylindrical portion extending in the optical axis direction. By adopting a configuration in which an exposed surface of the outer peripheral surface of the stem of the semiconductor laser is formed by the groove, the stem of the semiconductor laser can be cooled by an airflow having the groove as an air passage, and the heat radiation effect of the semiconductor laser is enhanced. be able to. Further, the present invention has at least one through hole penetrating in the optical axis direction on the circumference of the mounting hole of the semiconductor laser provided on the flange portion of the laser holder. By forming an exposed surface of the outer peripheral surface of the stem or forming a circuit board having a hole at the same position as the through hole, an air flow outside the light source device, such as cooling air inside the image recording device, is applied to the semiconductor laser. It can be used for cooling, and the heat radiation effect of the semiconductor laser can be enhanced. Further, the present invention employs a configuration having at least one or more grooves that intersect a mounting hole of a semiconductor laser provided in a flange portion of a laser holder and extend on a plane orthogonal to a laser emission direction. The airflow that flows in the direction parallel to the flange outside the light source device, such as cooling air inside the device,
The semiconductor laser can be used for cooling, and the heat radiation effect of the semiconductor laser can be enhanced.

[0011]

[Embodiment 1] FIG. 1 is a schematic sectional view of a light source device E which best shows the features of Embodiment 1 of the present invention. FIG. 2 is a view as viewed from the arrow TT in FIG. S is a semiconductor laser which is a light source. The semiconductor laser S includes a stem S10 for supporting a laser chip (not shown) and a cap S20 for protecting the laser chip. S30 is the outer peripheral surface of the stem S10. S40 is a bottom surface on which the lead pins of the stem S10 are provided. S50 is the upper surface of the stem S10 on which the cap S20 is arranged. P is a circuit board having an IC (not shown) for driving the semiconductor laser S. Reference numeral 10 denotes a cylindrical portion 12 having an inner peripheral portion 11 as a laser beam path of a semiconductor laser.
And a plate-like flange 14 including a mounting hole 13 (shown in FIG. 2) provided at one end of the cylindrical portion 11 for holding the semiconductor laser S and being orthogonal to the laser optical axis. Resin laser holder.

Reference numeral 15 (shown in FIG. 2) denotes an outer peripheral surface S3 of the stem S10 of the semiconductor laser S, which is provided in the mounting hole 13.
A holding portion having an inner peripheral surface 16 to be fitted with 0. Reference numeral 17 denotes at least one or more grooves formed continuously from the inner surface of the inner peripheral portion 11 in the optical axis direction and arranged on the circumference of the mounting hole 13. In this embodiment, three grooves 17 are provided.
7, the holding part 15 is also divided into three parts.
Reference numeral 18 denotes a cylindrical portion fitted into a fitting hole (not shown) of a housing (not shown) provided on the flange 14 side of the cylindrical portion 12. 1
Reference numeral 9 denotes an attachment portion provided on the flange 14 for fixing the light source device E to the housing with the screw K1. Reference numeral 20 denotes a mounting portion provided on the flange 14 for fixing the circuit board P to which the semiconductor laser S is connected, with the screw K2.

C is a collimator lens for converting the laser light of the semiconductor laser S into parallel light. Reference numeral 40 denotes a laser holder which holds a collimator lens C in the hole 41 and has an optical aperture 42 for forming the laser beam of the semiconductor laser S into a predetermined spot shape, and at least one slit 43 extending in the optical axis direction. A lens holder in which a cylindrical portion 44 which is externally fitted to the cylindrical portion 11 of FIG.

In this embodiment, in the above configuration, when the semiconductor laser S is held by the laser holder 10, the outer peripheral surface S 30 of the stem S 10 of the semiconductor laser S fits on the inner peripheral surface 16 of the three holding portions 15. And held at a predetermined position. A portion of the outer peripheral surface S30 of the semiconductor laser S, which does not fit with the holding portion 15 and hits the position of the groove 17, forms a heat radiation surface W1 exposed to the external atmosphere (see FIG. 3).

A laser holder 10 holding a semiconductor laser S by press fitting and a lens holder 4 holding a collimator lens C
Numeral 0 moves the laser beam of the semiconductor laser S and the optical axis of the collimator lens C by moving the laser beam within a range allowed by the gap between the inner peripheral portion of the cylindrical portion 44 of the lens holder 40 and the outer peripheral portion of the cylindrical portion 11 of the laser holder 10. The collimator lens C is focused by sliding the lens holder 40 in the optical axis direction.
Thereafter, the laser holder 10 and the lens holder 40 are fixed by bonding or the like, and the lens holder 40 and the laser holder 10 are fixed.
Are integrated into a light source device.

FIG. 3 is a schematic sectional view of the light source device. In a state where the laser holder 10 and the lens holder 40 are integrated, a hole Q is formed by the tip of the cylindrical portion 12 of the laser holder 10 and the slit 43 of the lens holder 40. Therefore, the groove 17 of the laser holder 10, the slit 43 of the lens holder 40, and the hole Q formed by the cylindrical portion of the laser holder 10 make the inner periphery of the laser light path of the semiconductor laser S as shown by arrows G 1 and G 2. The part 11 and the external atmosphere are conducted.

In this embodiment, the following effects can be obtained by the above configuration. According to the configuration of this embodiment, the heat radiation of the self-heating of the semiconductor laser is reduced by the lead pin mounting surface S40 of the stem portion S10 of the semiconductor laser and the exposed surface of the outer peripheral surface S30 corresponding to the groove position of the laser holder. Can be enhanced. In addition, a hole formed between the slit 43 of the lens holder 40 and the cylindrical portion of the laser holder 10 and the groove 17 of the laser holder 10 conduct, and the air flow flowing through the groove cools the stem of the semiconductor laser, and Enhances the heat dissipation. Therefore, even if the material of the laser holder that supports the semiconductor laser is made of resin, which is inferior to metal, the heat radiation of the semiconductor laser can be increased and the wavelength fluctuation can be suppressed without requiring any special processing or method.

Embodiment 2 FIG. 4 is a schematic cross-sectional view of a light source device according to Embodiment 2. FIG. 5 shows T-
FIG. The laser holder 10 includes a cylindrical portion 12 having an inner peripheral portion 11 as a laser light optical path of a semiconductor laser, and a mounting hole 13 provided at one end of the cylindrical portion 11 for holding a semiconductor laser S, and is orthogonal to the laser light optical axis. A resin-made laser holder in which a flat flange 14 is formed on the surface. Reference numeral 15 denotes a holding portion provided in the mounting hole 13 and having an inner peripheral surface 16 that fits with the outer peripheral surface S30 of the stem S10 of the semiconductor laser S. The configuration described above is the same as in the first embodiment. Reference numeral 21 denotes a step portion provided on the inner peripheral portion 11 of the cylindrical portion 12 of the laser holder 10. The inner peripheral portion 11 in the laser light emission direction from the step portion 21 is
Has an inner diameter slightly larger than the outer diameter of the cap S20.

The flange 14 is provided with a through-hole 22 that penetrates the mounting hole 13 in the optical axis direction around the circumference of the mounting hole 13. The holding portion 15 is divided by the through hole 22, and in the present embodiment, the holding portion 15 is divided into three through holes arranged equally on the circumference and the three holding portions 15 divided thereby. Other configurations of the laser holder 10, the lens holder 40, the semiconductor laser S, and the like are the same as those in the first embodiment.

FIG. 6 is an enlarged view of the holding part of the semiconductor laser S of the light source device having the above configuration. The semiconductor laser S press-fitted into the laser holder 10 includes the inner peripheral surface 16 of each holding portion 15 divided into the through hole 22 and the stem S1 of the semiconductor laser S.
0 outer peripheral surface S30 is fitted. Further, the upper surface S50 of the stem S30 of the semiconductor laser S on the side of the cap S20 and the surface orthogonal to the optical axis of the step portion 21 provided on the inner peripheral portion 11 of the laser holder 10 abut, and the optical axis direction of the semiconductor laser S Regulate position. Through hole 2 provided in laser holder 10
2, an air path indicated by an arrow G3 is formed, and a portion of the semiconductor laser S corresponding to the through hole 22 is formed on an outer peripheral surface S3 of the stem S10.
0, the bottom surface S40, and the top surface S50 do not come into contact with the laser holder 10, and serve as a heat radiation surface W2 exposed to the external atmosphere.

In the present embodiment, the following effects are obtained by the above configuration. According to the configuration of the present embodiment, a low-temperature airflow such as a cooling fan of an optical scanning device that flows outside is actively used in the air passage formed by the through hole 22 provided in the laser holder 10, and the external The cooling effect of the stem of the semiconductor laser can be improved by cooling the heat radiation sites W2 on the three surfaces of the outer peripheral surface S10, the bottom surface S40, and the upper surface S50 exposed to the atmosphere. Further, according to the configuration of the present embodiment, since the above-described air flow does not flow into the inside of the laser holder 10 but only cools the three heat-dissipating portions W2 exposed to the external atmosphere not in contact with the laser holder 10, It is possible to prevent the emission window of the semiconductor laser, the collimator lens, and the like from being contaminated by air in an extremely contaminated external atmosphere.

Third Embodiment FIG. 7 is a schematic sectional view of a light source device according to a third embodiment. FIG. 8 shows a view as seen from the arrow T in FIG. The configurations of the laser holder 10, the lens holder 20, the semiconductor laser S, and the like are the same as in the second embodiment. The circuit board P includes a flange 14 of the laser holder 10.
P10 provided at the same position as through hole 22 provided at
Is placed. In the above configuration, the airflow for cooling the stem S10 of the semiconductor laser S flows from the hole P10 in the circuit board P to the through hole 22 of the laser holder 10, as indicated by an arrow G4.

In the present embodiment, the following effects are obtained by the above configuration. According to the configuration of the present embodiment, when a cooling fan or the like for suppressing the temperature rise of the optical scanning device including the light source device is provided on the circuit board side, it is possible to actively use this air flow for cooling the semiconductor laser. The cooling effect can be improved.

Fourth Embodiment FIG. 9 is a schematic sectional view of a light source device according to a fourth embodiment. FIG. 10 is a view showing a state where the flange surface of the laser holder is viewed from the circuit board side.
The laser holder 10 includes a cylindrical portion 12 having an inner peripheral portion 11 as a laser beam path of a semiconductor laser, and a mounting hole 13 provided at one end of the cylindrical portion 11 for holding a semiconductor laser S.
A resin laser holder in which a flat flange 14 is formed integrally with a surface orthogonal to the laser beam optical axis. Fifteen
Is a holder provided in the mounting hole 13 and having an inner peripheral surface 16 that fits with the outer peripheral surface S30 of the stem S10 of the semiconductor laser S. The configuration of the laser holder 10 described above is the same as that of the first embodiment.
Is the same as

Reference numeral 23 denotes at least one or more grooves which intersect with the mounting holes 13 of the semiconductor laser S of the flange 14 and extend on a plane perpendicular to the optical axis. The holding portion 15 is divided by the groove 23. In the present embodiment, the holding portion 15 is divided into four portions by two grooves. Reference numeral 24 denotes a screw hole for fixing the light source device to a housing provided on the flange 14 with a screw K1. Reference numeral 25 denotes a screw K2 provided on the flange 14 for connecting the circuit board P to which the semiconductor laser S is connected.
Tapped holes to be fixed by. Other configurations such as the lens holder and the semiconductor laser are the same as those in the first embodiment.

In the semiconductor laser S, the outer peripheral surface S30 of the stem S10 and the inner peripheral surface 16 of the holding portion 15 divided by the groove 23 of the laser holder 10 are fitted and held. A portion corresponding to the position of the groove 23 on the outer peripheral surface S30 of the stem S10 of the semiconductor laser S becomes a heat radiation surface W3 exposed to the external atmosphere. The circuit board P is fixed in contact with the side surface of the flange 14 of the laser holder 10 that supports the semiconductor laser S.
In this state, the bottom surface S40 of the semiconductor laser S has a positional relationship in the laser emission direction from the flange 14 of the laser holder 10. Therefore, when the circuit board P is in contact with the flange 14 and is fixed, the semiconductor laser S
A cavity Q1 is formed between the bottom surface S40 and the circuit board P. Even when the semiconductor laser S is held, the mounting holes 13
, Each groove 23 and the cavity Q1 form an air path in the direction of arrow G5.

In this embodiment, the following effects can be obtained by the above configuration. According to the configuration of the present embodiment, the semiconductor laser can be cooled by the airflow flowing in the direction along the flange surface of the laser holder and the circuit board. Since the circuit board can be abutted and fixed on the wide surface of the flange of the laser holder, the cooling effect of the semiconductor laser can be obtained even when the space in the laser emission direction is limited. It is possible to improve the deformation of the circuit board due to an external force in the laser emission direction of the circuit board, and the reliability of the joint part due to the soldering of the semiconductor laser and the circuit board accompanying the deformation.

[0028]

According to the present invention, the following effects can be obtained by the configuration described above. According to the present invention, at least one or more exposed surfaces that do not come into contact with the support are formed on the outer peripheral surface of the stem of the semiconductor laser without performing new processing by using a resin capable of integrally molding the support (laser holder). With such a configuration, it is possible to enhance the heat radiation of self-heating of the semiconductor laser and to suppress a rise in the temperature of the semiconductor laser, thereby realizing an inexpensive, high-performance, high-definition light source device. Further, according to the present invention, the semiconductor laser is controlled by utilizing the air flow in the image recording apparatus without using a new mechanism or method such as a temperature control or a temperature compensation system for suppressing the temperature rise. Temperature rise can be suppressed. Further, as shown in FIG. 11, the relationship between the temperature, wavelength, and focus position change (solid line) of the semiconductor laser in the light source device of the present invention and each change (dotted line) of the conventional light source device is shown in FIG. In the above, both the temperature and the wavelength are relatively smaller in the amount of change than in the conventional example, and the fluctuation of the focus position corresponding to this change can also be suppressed. Therefore, according to the present invention, by suppressing the temperature rise of the semiconductor laser, it is possible to suppress the fluctuation of the focus position of the laser light, and to stabilize the final latent image shape.

[Brief description of the drawings]

FIG. 1 is a schematic sectional view showing a light source device according to a first embodiment of the present invention.

FIG. 2 is a TT arrow view of the light source device of FIG. 1;

FIG. 3 is a sectional view showing the operation of the light source device according to the first embodiment of the present invention.

FIG. 4 is a schematic sectional view showing a light source device according to a second embodiment of the present invention.

FIG. 5 is a view of the light source device of FIG.

FIG. 6 is a sectional view showing the operation of the light source device according to the second embodiment of the present invention.

FIG. 7 is a schematic sectional view showing a light source device according to a third embodiment of the present invention.

FIG. 8 is a view of the light source device of FIG. .

FIG. 9 is a schematic sectional view showing a light source device according to a fourth embodiment of the present invention.

FIG. 10 is an explanatory view of a laser holder flange surface of the light source device of FIG. 9;

FIG. 11 is a diagram illustrating changes in temperature, wavelength, and focus position of the light source device.

FIG. 12 is an explanatory diagram of the entire image recording apparatus.

FIG. 13 is a schematic sectional view showing a conventional light source device.

FIG. 14 is a diagram showing temperature and wavelength change of a semiconductor laser.

[Explanation of symbols]

 J / J0 / J1: Laser light E / E0 / E1: Light source device H / H0 / H1: Housing H10: Fitting hole S / S1: Semiconductor laser P / P0: Circuit board C / C1: Collimator lens 10.100 : Laser holder 20 ・ 200: Lens holder 11: Cylindrical part 13: Mounting hole 15: Holding part 17 ・ 23: Groove 22: Through hole Q ・ Q1: Hole part G: Air flow arrow W: Heat radiation surface

Claims (5)

[Claims] 1. A light source device comprising: a support for press-fitting and holding a semiconductor laser as a light source; and a lens holder for holding a collimator lens for making a laser beam substantially parallel and arranged at a predetermined distance from the semiconductor laser. The support for press-fitting and holding the semiconductor laser is made of a resin support, and at least one or more exposed surfaces that do not contact the support are formed on the outer peripheral surface of the stem of the semiconductor laser held by the support. A light source device for holding the semiconductor laser on the support. 2. The semiconductor laser mounting hole according to claim 2, wherein said exposed surface is formed continuously from a cylindrical portion provided on said support body as a laser light path of a semiconductor laser and an inner peripheral surface of said cylindrical portion extending in an optical axis direction. 2. The light source device according to claim 1, wherein the light source device is formed by at least one groove. 3. The semiconductor device according to claim 2, wherein the exposed surface has at least one through hole penetrating in the optical axis direction on a circumference of a mounting hole of the semiconductor laser provided on the flange portion of the support. 2. The light source device according to claim 1, wherein at least one light source device is formed by three or more surfaces including at least an outer peripheral surface of a stem surface of the semiconductor laser that does not contact the support by the through hole. 4. A circuit board for driving the semiconductor laser is provided on the support, and a hole is formed in the circuit board at the same position as a through hole provided in a flange of the support. The light source device according to claim 3, wherein: 5. The semiconductor device according to claim 1, wherein the exposed surface is formed by at least one groove that intersects a mounting hole of the semiconductor laser provided on the flange portion of the support and extends on a plane perpendicular to a laser emission direction. 2. The method according to claim 1, wherein
The light source device according to item 1.