JPH1117347A - Printed wiring board and manufacture thereof - Google Patents
Printed wiring board and manufacture thereofInfo
- Publication number
- JPH1117347A JPH1117347A JP16576797A JP16576797A JPH1117347A JP H1117347 A JPH1117347 A JP H1117347A JP 16576797 A JP16576797 A JP 16576797A JP 16576797 A JP16576797 A JP 16576797A JP H1117347 A JPH1117347 A JP H1117347A
- Authority
- JP
- Japan
- Prior art keywords
- conductive circuit
- wiring board
- printed wiring
- insulating layer
- conductive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明はプリント配線板及び
その製造法に関する。The present invention relates to a printed wiring board and a method for manufacturing the same.
【0002】[0002]
【従来の技術】従来、プリント配線板で交差する導電回
路を形成する方法としては、工業調査会発行の「電子材
料」1995年10月号、第84〜88頁に記載されて
いるように、基板の両面にそれぞれ導電回路を形成する
方法が知られている。その他の方法としては、基板にス
ルーホールを設け、スルーホール間にリード線を差し込
んで接続する方法が知られている。2. Description of the Related Art Conventionally, as a method for forming a crossed conductive circuit with a printed wiring board, as described in "Electronic Materials", October 1995, pp. 84-88, issued by the Industrial Research Council, A method of forming a conductive circuit on both sides of a substrate is known. As another method, a method is known in which a through hole is provided in a substrate, and a lead wire is inserted between the through holes to make connection.
【0003】しかしながら、基板の両面にそれぞれ導電
回路を形成する方法は、交差する導電回路の数が少ない
場合においても基板の両面を使用するため、導電回路を
形成するのに手間がかかり、製造コストが高くなるとい
う欠点が生じる。また、基板にスルーホールを設け、ス
ルーホール間にリード線を差し込んで接続する方法は、
スルーホール間の長さに応じたリード線を用意しなけれ
ばならず、生産性と価格面で十分なものではなかった。However, the method of forming conductive circuits on both sides of a substrate requires use of both sides of the substrate even when the number of crossing conductive circuits is small, so that it takes time and effort to form the conductive circuits, and the manufacturing cost is increased. Is disadvantageously increased. In addition, the method of providing through holes in the board and inserting a lead wire between the through holes to connect
Lead wires must be prepared according to the length between the through holes, which is not sufficient in terms of productivity and price.
【0004】さらに、基板の片面に交差する導電回路を
エポキシ樹脂、アクリル樹脂等の絶縁層を介して印刷法
で形成することが試みられているが、耐湿性及び耐熱性
に劣り、信頼性の点では必ずしも十分なものではなかっ
た。Further, it has been attempted to form a conductive circuit crossing one side of the substrate by a printing method via an insulating layer such as an epoxy resin or an acrylic resin. However, the circuit is inferior in moisture resistance and heat resistance, and is not reliable. It was not always enough in point.
【0005】[0005]
【発明が解決しようとする課題】請求項1記載の発明
は、耐熱性及び耐湿性に優れ、かつ基板上の導電回路と
絶縁層上の導電回路間の絶縁信頼性の高いプリント配線
板を提供するものである。請求項2記載の発明は、請求
項1記載の発明のうち特に導電回路間の絶縁信頼性が高
く、さらに請求項1記載の発明に加えて抵抗変化の小さ
いプリント配線板を提供するものである。請求項3記載
の発明は、請求項1又は2記載の発明に加えて工程の簡
略化により安価なプリント配線板を提供するものであ
る。請求項4記載の発明は、耐熱性及び耐湿性に優れ、
かつ基板上の導電回路と絶縁層上の導電回路間の絶縁信
頼性の高いプリント配線板の製造法を提供するものであ
る。請求項5記載の発明は、請求項4記載の発明のうち
特に導電回路間の絶縁信頼性が高く、さらに請求項4記
載の発明に加えて抵抗変化の小さいプリント配線板を提
供するものである。SUMMARY OF THE INVENTION According to the first aspect of the present invention, there is provided a printed wiring board which is excellent in heat resistance and moisture resistance and has high insulation reliability between a conductive circuit on a substrate and a conductive circuit on an insulating layer. Is what you do. According to a second aspect of the present invention, there is provided, in addition to the first aspect of the invention, a printed wiring board having a high insulation reliability between the conductive circuits and a small resistance change. . The third aspect of the present invention provides an inexpensive printed wiring board by simplifying the steps in addition to the first or second aspect of the present invention. The invention according to claim 4 is excellent in heat resistance and moisture resistance,
Another object of the present invention is to provide a method of manufacturing a printed wiring board having high insulation reliability between a conductive circuit on a substrate and a conductive circuit on an insulating layer. According to a fifth aspect of the present invention, there is provided, in addition to the fourth aspect of the invention, a printed wiring board having a high insulation reliability between conductive circuits and a small resistance change. .
【0006】[0006]
【課題を解決するための手段】本発明は、基板上に導電
回路、その上に絶縁層が形成され、さらに絶縁層上に導
電回路が形成されたプリント配線板において、絶縁層が
ポリイミド樹脂又はポリアミドイミド樹脂で形成された
層であるプリント配線板に関する。また、本発明は、こ
のプリント配線板において、絶縁層が2層以上形成さ
れ、かつ上部に形成する毎に層の大きさ(面積)を順次
小さくしてなるプリント配線板に関する。また、本発明
は、このプリント配線板において、絶縁層上に形成され
た導電回路が導電ペーストの硬化物であるプリント配線
板に関する。また、本発明は、基板上に形成された導電
回路上にポリイミド樹脂又はポリアミドイミド樹脂を塗
布し、乾燥した後その上に導電ペーストで導電回路を形
成し、次いで乾燥、硬化することを特徴とするプリント
配線板の製造法に関する。さらに、本発明は、このプリ
ント配線板の製造法において、ポリイミド樹脂又はポリ
アミドイミド樹脂が繰り返し塗布され、上部に塗布する
毎に塗布面積を順次小さくすることを特徴とするプリン
ト配線板の製造法に関する。SUMMARY OF THE INVENTION The present invention relates to a printed wiring board having a conductive circuit on a substrate, an insulating layer formed thereon, and a conductive circuit formed on the insulating layer. The present invention relates to a printed wiring board which is a layer formed of a polyamideimide resin. The present invention also relates to a printed wiring board in which two or more insulating layers are formed and the size (area) of each layer is reduced gradually each time the insulating layer is formed on the printed wiring board. The present invention also relates to a printed wiring board in which the conductive circuit formed on the insulating layer is a cured product of a conductive paste. Further, the present invention is characterized in that a polyimide resin or a polyamide-imide resin is applied on a conductive circuit formed on a substrate, and after drying, a conductive circuit is formed thereon with a conductive paste, and then dried and cured. To a method for manufacturing a printed wiring board. Further, the present invention relates to a method for manufacturing a printed wiring board, wherein a polyimide resin or a polyamideimide resin is repeatedly applied in the method for manufacturing a printed wiring board, and the application area is sequentially reduced each time the application is performed on the upper portion. .
【0007】[0007]
【発明の実施の形態】本発明で用いる基板としては、紙
フェノール積層板、ガラスエポキシ積層板等に銅箔を張
り付けた銅張り積層板を用いることが好ましい。基板上
の導電回路は、例えば上記の銅張り積層板の銅箔を公知
の方法でエッチングすることで形成することができる。
この導電回路の銅箔厚さは、一般に35μm又は18μ
mのものが用いられる。DESCRIPTION OF THE PREFERRED EMBODIMENTS As a substrate used in the present invention, it is preferable to use a copper-clad laminate in which a copper foil is adhered to a paper phenol laminate, a glass epoxy laminate or the like. The conductive circuit on the substrate can be formed, for example, by etching the copper foil of the copper-clad laminate by a known method.
The copper foil thickness of this conductive circuit is generally 35 μm or 18 μm.
m.
【0008】上記の導電回路上に形成する絶縁層として
ポリイミド樹脂又はポリアミドイミド樹脂を用いること
が必要とされ、これ以外の樹脂又は物質では耐熱性及び
耐湿性に劣り電食が発生し易くなるという欠点が生じ
る。It is necessary to use a polyimide resin or a polyamide imide resin as an insulating layer formed on the above-mentioned conductive circuit, and other resins or substances are inferior in heat resistance and moisture resistance and easily cause electrolytic corrosion. Disadvantages arise.
【0009】本発明で用いるポリイミド樹脂は、テトラ
カルボン酸無水物と芳香族ジアミンを閉環脱水重縮合さ
せて得られるイミド結合が繰り返された構造を有するも
のである。またポリアミドイミド樹脂はトリカルボン酸
と芳香族ジアミンを閉環脱水重縮合させた耐熱性ポリマ
ーでイミド結合及びアミド結合が繰り返された構造を有
するものである。このポリイミド樹脂及びポリアミドイ
ミド樹脂は、特に本発明における絶縁層としての耐湿性
及び耐熱性に優れ、かつ基板上の導電回路と絶縁層上の
導電回路間の絶縁性に寄与している。The polyimide resin used in the present invention has a structure in which an imide bond obtained by subjecting a tetracarboxylic anhydride and an aromatic diamine to ring-closing dehydration polycondensation is repeated. The polyamideimide resin is a heat-resistant polymer obtained by subjecting a tricarboxylic acid and an aromatic diamine to ring-closing dehydration polycondensation and having a structure in which an imide bond and an amide bond are repeated. The polyimide resin and the polyamide-imide resin are particularly excellent in moisture resistance and heat resistance as the insulating layer in the present invention, and contribute to insulation between the conductive circuit on the substrate and the conductive circuit on the insulating layer.
【0010】該絶縁層は2層以上形成し、かつ上部に形
成する毎に層の大きさ(面積)を順次小さくして端部の
段差を小さくするか又は未硬化状態の絶縁層を加熱して
絶縁層の端部を熱軟化させ、端部の段差を小さくするこ
とが好ましく、特に段差が絶縁層の厚さの1/2以下に
する事ができれば、絶縁層上に形成する導電回路の厚さ
の不均一を抑制できるので好ましい。絶縁層の厚さは3
0〜60μmの範囲が好ましく、40〜50μmの範囲
であることがより好ましい。The insulating layer is formed of two or more layers, and each time the insulating layer is formed on the upper portion, the size (area) of the layer is sequentially reduced to reduce the step at the end portion, or by heating the uncured insulating layer. Preferably, the edge of the insulating layer is thermally softened to reduce the step at the end. In particular, if the step can be reduced to 1 / or less of the thickness of the insulating layer, a conductive circuit formed on the insulating layer can be formed. This is preferable because unevenness in thickness can be suppressed. The thickness of the insulating layer is 3
The range is preferably from 0 to 60 μm, and more preferably from 40 to 50 μm.
【0011】絶縁上に形成する導電ペーストは、銀ペー
スト、銀と銅の混合ペースト、銅ペースト等が用いら
れ、特に前記ペーストにおいて比抵抗が100mΩ以下
のペーストを用いることが好ましく、60mΩ以下のペ
ーストを用いることがより好ましい。該導電ペーストに
よる導体回路を形成する方法は特に制限されないが、作
業性、生産性等の面からスクリーン印刷法で形成するこ
とが好ましい。導体回路の厚さは5〜20μmの範囲が
好ましく、10〜15μmの範囲であることがより好ま
しい。As the conductive paste formed on the insulation, silver paste, mixed paste of silver and copper, copper paste, etc. are used. In particular, it is preferable to use a paste having a specific resistance of 100 mΩ or less, and more preferably a paste of 60 mΩ or less. It is more preferable to use The method for forming a conductive circuit using the conductive paste is not particularly limited, but is preferably formed by a screen printing method in terms of workability, productivity, and the like. The thickness of the conductor circuit is preferably in the range of 5 to 20 μm, more preferably in the range of 10 to 15 μm.
【0012】[0012]
【実施例】次に実施例により本発明を詳しく説明する。 実施例1 ビスフェノールA型エポキシ樹脂(油化シェルエポキシ
製、商品名エピコート1004)50重量部及びレゾー
ル型フェノール樹脂(日立化成工業(株)製、商品名VP
−11N、平均分子量450)50重量部を予め混合し
たものに、2エチル4メチルイミダゾール1重量部を加
えて均一に混合して樹脂組成物を得た。次いで樹脂組成
物にエチルカルビトール50重量部及びブチルセロソル
ブ50重量部を加えて均一に混合して樹脂溶液を得た。
次に、銀粉(徳力化学研究所製、商品名TCG−1)8
00重量部を上記で得た樹脂溶液に添加し、撹拌らいか
い機で均一に分散して銀ペーストを得た。Next, the present invention will be described in detail with reference to examples. Example 1 50 parts by weight of a bisphenol A type epoxy resin (manufactured by Yuka Shell Epoxy, trade name: Epicoat 1004) and a resole type phenol resin (manufactured by Hitachi Chemical Co., Ltd., trade name: VP)
50 parts by weight of −11 N, average molecular weight of 450) were mixed in advance with 1 part by weight of 2-ethyl-4-methylimidazole and uniformly mixed to obtain a resin composition. Next, 50 parts by weight of ethyl carbitol and 50 parts by weight of butyl cellosolve were added to the resin composition and uniformly mixed to obtain a resin solution.
Next, silver powder (manufactured by Tokurika Chemical Laboratory, trade name: TCG-1) 8
00 parts by weight was added to the resin solution obtained above, and the mixture was uniformly dispersed with a stirrer to obtain a silver paste.
【0013】この後、銅張り積層板〔日立化成工業(株)
製、商品名MCL−437F(SRD)〕を使用し、厚
さ35μmの銅箔をエッチングして幅が1mmで長さが3
0mmの導電回路を形成した。さらに該導電回路上にポリ
イミド樹脂〔セントラル硝子(株)製、商品名PP200
0〕を2回印刷し、厚さが30μmで縦×横が28mm×
2mmの絶縁層を形成した。これを100℃で2時間乾燥
した後、170℃で30分間熱風を絶縁層上に2分間吹
き付け、絶縁層の端部を熱硬化させて上方部分を曲面状
にし、絶縁層の段差を20μmとした。Thereafter, a copper-clad laminate [Hitachi Chemical Co., Ltd.
And trade name MCL-437F (SRD)], and etching a 35 μm thick copper foil to a width of 1 mm and a length of 3
A conductive circuit of 0 mm was formed. Further, a polyimide resin [manufactured by Central Glass Co., Ltd., trade name PP200]
0] is printed twice, and the thickness is 30 μm and the length × width is 28 mm ×
An insulating layer of 2 mm was formed. After drying this at 100 ° C. for 2 hours, hot air is blown onto the insulating layer at 170 ° C. for 30 minutes for 2 minutes, and the end of the insulating layer is heat-cured to make the upper portion curved, and the step of the insulating layer is set to 20 μm. did.
【0014】次に銅箔の導電回路と直交する方向に、上
記で得た銀ペーストをスクリーン印刷法で厚さが15μ
m及び幅が1mmで長さが10mmの導電回路を形成し、こ
れを160℃で60分間乾燥硬化し、プリント配線板を
得た。得られたプリント配線板の印刷形成した導電回路
の比抵抗は、60μΩ・cmであり、接着性も良好であっ
た。また基板上にエッチングで形成した導電回路と印刷
形成した導電回路の絶縁抵抗は、1010Ω以上であっ
た。Next, the silver paste obtained above was screen-printed to a thickness of 15 μm in a direction orthogonal to the conductive circuit of the copper foil.
A conductive circuit having an m and a width of 1 mm and a length of 10 mm was formed and dried and cured at 160 ° C. for 60 minutes to obtain a printed wiring board. The specific resistance of the printed conductive circuit of the obtained printed wiring board was 60 μΩ · cm, and the adhesiveness was also good. The insulation resistance of the conductive circuit formed on the substrate by etching and the conductive circuit formed by printing was 10 10 Ω or more.
【0015】さらに、該プリント配線板の冷熱衝撃試験
を実施した結果、比抵抗の変化率は5%であった。また
該プリント配線板の湿中負荷試験を実施した結果、基板
上にエッチングで形成した導電回路と印刷形成した導電
回路の絶縁抵抗は、108Ω以上であった。なお冷熱試
験条件は125℃30分〜−65℃30分を100サイ
クル行い、湿中負荷試験は40℃、90%RH中で10
00時間保持した。Further, as a result of performing a thermal shock test on the printed wiring board, the rate of change in specific resistance was 5%. In addition, as a result of performing a wet and medium load test on the printed wiring board, the insulation resistance of the conductive circuit formed by etching on the substrate and that of the conductive circuit formed by printing were 10 8 Ω or more. The cooling test was performed at 125 ° C. for 30 minutes to −65 ° C. for 30 minutes for 100 cycles.
Held for 00 hours.
【0016】比較例1 実施例1の絶縁層に代えて、実施例1で得た樹脂組成物
にエチルカルビトール15重量部及びブチルセロソルブ
15重量部を加えて均一に混合した樹脂溶液を3回塗布
して、厚さ40μm絶縁層を形成し、導電回路の乾燥硬
化条件を160℃で30分間とした以外は実施例1と同
様の工程を経てプリント配線板を得た。Comparative Example 1 Instead of the insulating layer of Example 1, a resin solution obtained by adding 15 parts by weight of ethyl carbitol and 15 parts by weight of butyl cellosolve to the resin composition obtained in Example 1 and uniformly mixing was applied three times. A printed wiring board was obtained through the same steps as in Example 1 except that an insulating layer having a thickness of 40 μm was formed, and the drying and curing conditions of the conductive circuit were changed to 160 ° C. for 30 minutes.
【0017】得られたプリント配線板の印刷形成した導
電回路の比抵抗は、65μΩ・cmであり、接着性も良好
であった。また基板上にエッチングで形成した導電回路
と印刷形成した導電回路の絶縁抵抗は、1010Ω以上で
あった。さらに、該プリント配線板の冷熱衝撃試験を実
施した結果、比抵抗の変化率は10%と大きく、湿中負
荷試験の結果では基板上にエッチングで形成した導電回
路と印刷形成した導電回路の絶縁抵抗は、105Ωに低
下した。The specific resistance of the printed conductive circuit of the obtained printed wiring board was 65 μΩ · cm, and the adhesion was good. The insulation resistance of the conductive circuit formed on the substrate by etching and the conductive circuit formed by printing was 10 10 Ω or more. Further, as a result of performing a thermal shock test on the printed wiring board, the rate of change in specific resistance was as large as 10%. The resistance dropped to 10 5 Ω.
【0018】実施例2 実施例1で用いた銅張り積層板に実施例1と同様の導電
回路を形成した後、該導電回路上にポリイミド樹脂〔セ
ントラル硝子(株)製、商品名PP2000〕を印刷し、
厚さが20μmで縦×横が28mm×2.6mmの絶縁層を
形成した。これを100℃で2時間乾燥した後、再度上
記で用いたポリイミド樹脂を印刷し、厚さが20μmで
縦×横が28mm×2.0mmの絶縁層を形成した。これを
170℃で30分間乾燥して硬化させた。Example 2 After a conductive circuit similar to that of Example 1 was formed on the copper-clad laminate used in Example 1, polyimide resin (manufactured by Central Glass Co., Ltd., trade name: PP2000) was formed on the conductive circuit. Print and
An insulating layer having a thickness of 20 μm and a length × width of 28 mm × 2.6 mm was formed. After drying at 100 ° C. for 2 hours, the polyimide resin used above was printed again to form an insulating layer having a thickness of 20 μm and a length × width of 28 mm × 2.0 mm. This was dried and cured at 170 ° C. for 30 minutes.
【0019】次に銅箔の導電回路と直交する方向に、実
施例1で得た銀ペーストをスクリーン印刷法で厚さが1
5μm及び幅が1mmで長さが10mmの導電回路を形成
し、これを、160℃で60分間乾燥、硬化し、プリン
ト配線板を得た。Next, the silver paste obtained in Example 1 was screen-printed to a thickness of 1 in a direction perpendicular to the conductive circuit of the copper foil.
A conductive circuit having a length of 5 μm, a width of 1 mm and a length of 10 mm was formed, and dried and cured at 160 ° C. for 60 minutes to obtain a printed wiring board.
【0020】得られたプリント配線板の印刷形成した導
電回路の比抵抗は60μΩ・cmであり、接着性も良好で
あった。また基板上にエッチングで形成した導電回路と
印刷形成した導電回路の絶縁抵抗は、1010Ω以上であ
った。さらに、該プリント配線板の冷熱衝撃試験を実施
した結果、比抵抗の変化率は4%であった。また該プリ
ント配線板の湿中負荷試験を実施した結果、基板上にエ
ッチングで形成した導電回路と印刷形成した導電回路の
絶縁抵抗は、108Ω以上であった。The specific resistance of the printed conductive circuit of the obtained printed wiring board was 60 μΩ · cm, and the adhesion was good. The insulation resistance of the conductive circuit formed on the substrate by etching and the conductive circuit formed by printing was 10 10 Ω or more. Furthermore, as a result of performing a thermal shock test on the printed wiring board, the rate of change in specific resistance was 4%. In addition, as a result of performing a wet and medium load test on the printed wiring board, the insulation resistance of the conductive circuit formed by etching on the substrate and that of the conductive circuit formed by printing were 10 8 Ω or more.
【0021】[0021]
【発明の効果】請求項1記載の発明は、耐熱性及び耐湿
性に優れ、かつ基板上の導電回路と絶縁層上の導電回路
間の絶縁信頼性の高いプリント配線板である。請求項2
記載の発明は、請求項1記載の発明のうち特に導電回路
間の絶縁信頼性が高く、さらに請求項1記載の発明に加
えて抵抗変化の小さいプリント配線板である。請求項3
記載の発明は、請求項1又は2記載の発明に加えて工程
の簡略化により安価なプリント配線板である。請求項4
記載の発明は、耐熱性及び耐湿性に優れ、かつ基板上の
導電回路と絶縁層上の導電回路間の絶縁信頼性の高いプ
リント配線板を製造できる。請求項5記載の発明は、請
求項4記載の発明のうち特に導電回路間の絶縁信頼性が
高く、さらに請求項4記載の発明に加えて抵抗変化の小
さいプリント配線板を製造できる。According to the first aspect of the present invention, there is provided a printed wiring board which is excellent in heat resistance and moisture resistance and has high insulation reliability between a conductive circuit on a substrate and a conductive circuit on an insulating layer. Claim 2
The invention described in the above is a printed wiring board having a particularly high insulation reliability among the conductive circuits of the invention described in the first aspect and further having a small resistance change in addition to the invention described in the first aspect. Claim 3
The invention described is a printed wiring board which is inexpensive due to simplification of the process in addition to the invention described in claim 1 or 2. Claim 4
According to the described invention, a printed wiring board having excellent heat resistance and moisture resistance and having high insulation reliability between the conductive circuit on the substrate and the conductive circuit on the insulating layer can be manufactured. According to the fifth aspect of the present invention, it is possible to manufacture a printed wiring board having a particularly high insulation reliability between the conductive circuits and a small resistance change in addition to the fourth aspect of the invention.
───────────────────────────────────────────────────── フロントページの続き (72)発明者 助川 正 茨城県ひたちなか市馬渡2525番地561 (72)発明者 千葉 一広 茨城県ひたちなか市湊中央一丁目5番2号 (72)発明者 小口 智英 茨城県ひたちなか市足崎1457番地37 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tadashi Sukekawa, 2525, Mawatari, Hitachinaka City, Ibaraki Prefecture 561 (72) Inventor Kazuhiro Chiba 1-2-2, Minatochuo, Hitachinaka City, Ibaraki Prefecture 1457 37 Ashizaki, Hitachinaka City, Prefecture
Claims (5)
成され、さらに絶縁層上に導電回路が形成されたプリン
ト配線板において、絶縁層がポリイミド樹脂又はポリア
ミドイミド樹脂で形成された層であるプリント配線板。1. A printed wiring board in which a conductive circuit is formed on a substrate, an insulating layer is formed on the conductive circuit, and a conductive circuit is formed on the insulating layer, wherein the insulating layer is formed of a polyimide resin or a polyamideimide resin. Is a printed wiring board.
形成する毎に層の大きさ(面積)を順次小さくしてなる
請求項1記載のプリント配線板。2. The printed wiring board according to claim 1, wherein two or more insulating layers are formed, and the size (area) of the layers is gradually reduced each time the insulating layer is formed thereon.
ーストの硬化物である請求項1又は2記載のプリント配
線板。3. The printed wiring board according to claim 1, wherein the conductive circuit formed on the insulating layer is a cured product of a conductive paste.
ミド樹脂又はポリアミドイミド樹脂を塗布し、乾燥した
後その上に導電ペーストで導電回路を形成し、次いで乾
燥、硬化することを特徴とするプリント配線板の製造
法。4. A conductive circuit is formed by applying a polyimide resin or a polyamideimide resin onto a conductive circuit formed on a substrate, drying, forming a conductive circuit on the conductive circuit with a conductive paste, and then drying and curing. Manufacturing method of printed wiring board.
脂が繰り返し塗布され、上部に塗布する毎に塗布面積を
順次小さくすることを特徴とする請求項4記載のプリン
ト配線板の製造法。5. The method for manufacturing a printed wiring board according to claim 4, wherein the polyimide resin or the polyamideimide resin is repeatedly applied, and the application area is gradually reduced each time the polyimide resin or the polyamideimide resin is applied to the upper portion.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16576797A JPH1117347A (en) | 1997-06-23 | 1997-06-23 | Printed wiring board and manufacture thereof |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP16576797A JPH1117347A (en) | 1997-06-23 | 1997-06-23 | Printed wiring board and manufacture thereof |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH1117347A true JPH1117347A (en) | 1999-01-22 |
Family
ID=15818660
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP16576797A Pending JPH1117347A (en) | 1997-06-23 | 1997-06-23 | Printed wiring board and manufacture thereof |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH1117347A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005347571A (en) * | 2004-06-03 | 2005-12-15 | Hitachi Chem Co Ltd | Printed wiring board, substrate therefor and method for manufacturing the same |
-
1997
- 1997-06-23 JP JP16576797A patent/JPH1117347A/en active Pending
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005347571A (en) * | 2004-06-03 | 2005-12-15 | Hitachi Chem Co Ltd | Printed wiring board, substrate therefor and method for manufacturing the same |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
JPH10256687A (en) | Conductor paste composition for filling it into via hole, and printed circuit board using the same | |
JPH1117347A (en) | Printed wiring board and manufacture thereof | |
JPS6248001A (en) | Manufacture of electric resistance element | |
JP2836337B2 (en) | Anisotropic conductive resin film adhesive | |
JPH07154068A (en) | Adhesive sheet and production thereof, metal based wiring board employing adhesive sheet and production thereof | |
JPH0575225A (en) | Metallic base printed wiring substrate and its manufacture | |
JPH03209792A (en) | Both-side metal-cladded flexible printed circuit board and manufacture thereof | |
JPH05129765A (en) | Wiring board | |
JP2945129B2 (en) | Wiring board | |
JPS6113690A (en) | Method of producing mutual connection circuit | |
CN110301015B (en) | Insulated wire | |
JPH08125294A (en) | Metal base board and manufacture thereof | |
JPH07307110A (en) | Conductive paste | |
JP3653640B2 (en) | IC card circuit board | |
JPH0553628B2 (en) | ||
JPH01232792A (en) | Circuit board | |
JPH01275622A (en) | Epoxy resin composition | |
JPH0231799Y2 (en) | ||
JPH02306686A (en) | Flexible printed circuit | |
JPH07262822A (en) | Conductive paste | |
JPH06338219A (en) | Conductive paste | |
JPH06338218A (en) | Conductive paste | |
JPH01232795A (en) | Manufacture of metal based board | |
JPS62242529A (en) | Substrate for flexible printed circuit | |
JPS62112393A (en) | Circuit substrate |