JPH1117095A - Fe lead frame material for palladium plating superior in corrosion resistance - Google Patents
Fe lead frame material for palladium plating superior in corrosion resistanceInfo
- Publication number
- JPH1117095A JPH1117095A JP18186097A JP18186097A JPH1117095A JP H1117095 A JPH1117095 A JP H1117095A JP 18186097 A JP18186097 A JP 18186097A JP 18186097 A JP18186097 A JP 18186097A JP H1117095 A JPH1117095 A JP H1117095A
- Authority
- JP
- Japan
- Prior art keywords
- lead frame
- plating
- frame material
- corrosion resistance
- plating layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Electroplating Methods And Accessories (AREA)
- Lead Frames For Integrated Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、耐食性に優れたパ
ラジウムめっき用Ｆｅ系リードフレーム材及びその製造
方法、詳細には、パラジウムめっきの下地めっきとして
Ｃｕ及びＮｉの１種又は２種をめっきした耐食性に優れ
たパラジウムメッキ用Ｆｅ系リードフレーム材及びその
製造方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an Fe-based lead frame material for palladium plating having excellent corrosion resistance and a method for producing the same. More specifically, one or two of Cu and Ni are plated as a base plating for palladium plating. The present invention relates to an Fe-based lead frame material for palladium plating having excellent corrosion resistance and a method for producing the same.
【０００２】[0002]
【従来の技術】従来、ＩＣパッケージに使用した場合の
リードフレームのアウターリード部の表面にＰｂはんだ
をめっきしているが、最近環境上の問題からＰｂをなく
すことが要求されてきた。そこでＰｂはんだに代わるも
のとしてＰｄ（パラジウム）が提案され、Ｃｕ系、Ｎｉ
系のリードフレーム材においてはＰｄめっきしたものに
移行しつつある。しかし、Ｆｅ系、すなわちＦｅーＮｉ
系、ＦｅーＣｒ系などのリードフレーム材にＰｄをめっ
きすると、リードフレーム材のＦｅーＮｉ合金、Ｆｅー
Ｃｒ合金などとＰｄめっき層とは自然電位の差が大きい
ために局部電池が形成され、耐食性が劣化するという問
題が発生した。そこで、自然電位の電位差を下げるとい
う観点から、ＦｅーＮｉ系のリードフレーム材にＮｉを
めっきした後Ｐｄをめっきし、その後拡散加熱処理を行
ってＰｄとＮｉを相互拡散させた傾斜材料層を設けたも
のが本発明者らによって開発され、特願平８─１９５１
９７号として特許出願されている。しかし、ＦｅーＮｉ
系合金とＰｄ−Ｎｉ合金との電位差はＦｅーＮｉ系合金
とＰｄとの電位差より小さいので、耐食性はある程度改
善されるもののまだ十分ではなかった。2. Description of the Related Art Conventionally, Pb solder is plated on the surface of an outer lead portion of a lead frame when used in an IC package. Recently, however, it has been required to eliminate Pb due to environmental problems. Therefore, Pd (palladium) has been proposed as an alternative to Pb solder, and Cu-based, Ni-based
Pd-plated lead frame materials are shifting to Pd-plated materials. However, Fe-based, that is, Fe-Ni
When Pd is plated on leadframe materials such as Fe-Cr and Fe-Cr alloys, a local battery is formed due to the large difference in the natural potential between the Pd plating layer and the Fe-Ni alloy or Fe-Cr alloy of the leadframe material. And the problem that the corrosion resistance deteriorates. Therefore, from the viewpoint of reducing the potential difference of the natural potential, the gradient material layer in which Pd is plated after Ni is plated on the Fe—Ni-based lead frame material, and then Pd and Ni are interdiffused by diffusion heating treatment is performed. What was provided was developed by the present inventors, and was filed in Japanese Patent Application No. 8-1951.
Patent No. 97 has been filed. However, Fe-Ni
Since the potential difference between the Pd-Ni alloy and the Pd-Ni alloy was smaller than the potential difference between the Fe-Ni-based alloy and Pd, the corrosion resistance was improved to some extent, but was not yet sufficient.
【０００３】また、Ｃｕ系、Ｎｉ系のリードフレーム材
にＰｄをめっきしたものは耐食性が問題になっていない
ことから、ＦｅーＮｉ系、ＦｅーＣｒ系のリードフレー
ム材にＰｄをめっきする前に下地めっきとしてＣｕをめ
っきすることが提案されているが、このＣｕを下地めっ
きしたものは、Ｃｕをめっきしていないものより耐食性
が改善されているもののまだ十分ではなかった。そこ
で、Ｃｕを下地めっきしたものが耐食性が十分でない原
因について調べたところ、Ｐｄめっき層及び下地めっき
のＣｕめっき層は、ポーラスであるためにＰｄとＦｅー
Ｎｉ系合金、ＦｅーＣｒ系合金などとの間で局部電池が
形成され、耐食性が劣化することが原因であることが判
明した。この対策としてＰｄを厚くめっきをして孔を低
減することも考えられたが、Ｐｄめっきは非常に高価で
あるために実施することが困難である。[0003] Further, since Pd is plated on a Cu-based or Ni-based lead frame material, the corrosion resistance is not a problem. Therefore, before plating Pd on a Fe-Ni-based or Fe-Cr-based lead frame material. It has been proposed that Cu be plated as an underlayer, but the underlayer plated with Cu has been improved in corrosion resistance as compared with the unplated Cu, but was not yet sufficient. Then, when the cause of insufficient corrosion resistance was investigated by plating the underlayer of Cu, the Pd plating layer and the Cu plating layer of the underplating were porous, so that Pd and Fe-Ni alloy, Fe-Cr alloy, etc. A local battery was formed between them, and it was found that this was caused by deterioration of corrosion resistance. As a countermeasure, it has been conceived to reduce the number of holes by plating Pd thickly, but Pd plating is very expensive and difficult to implement.
【０００４】[0004]
【発明が解決しようとする課題】本発明は、下地めっき
としてＣｕ及びＮｉの１種又は２種（以下、「Ｃｕ及び
／又はＮｉ」という。）をめっきしたものにおいても耐
食性が優れ、あるいは耐食性が優れているとともにめっ
き後に打ち抜きによるタイバーカットを行ってもリード
フレーム材自体が露出することがないせん断面を得るこ
とができるリードフレーム材及びその製造方法を提供す
ることを目的とするものである。SUMMARY OF THE INVENTION The present invention provides excellent corrosion resistance or corrosion resistance even when one or two of Cu and Ni (hereinafter referred to as "Cu and / or Ni") are plated as a base plating. It is an object of the present invention to provide a lead frame material which is excellent in that it can obtain a shear surface where the lead frame material itself is not exposed even when tie bar cutting by punching is performed after plating, and a method for manufacturing the same. .
【０００５】[0005]
【課題を解決するための手段】上記目的を達成するた
め、本発明の耐食性に優れたパラジウムめっき用Ｆｅ系
リードフレーム材においては、ＦｅーＮｉ系合金などの
Ｆｅ系リードフレーム材の表面にＣｕ及び／又はＮｉの
４μｍ以上のめっき層が設けられており、このめっき層
が加工率１０％以上の冷間圧延あるいは冷間圧延後に４
００℃以上の温度で焼鈍されたものとしたことである。
また、上記目的を達成するため、本発明の耐食性に優れ
たパラジウムめっき用Ｆｅ系リードフレーム材の製造方
法においては、ＦｅーＮｉ系合金などのＦｅ系リードフ
レーム材の表面にＣｕ及び／又はＮｉを４．５μｍ以上
めっきした後、加工率１０％以上の冷間圧延あるいは冷
間圧延後に４００℃以上の温度で焼鈍をする製造方法と
したことである。In order to achieve the above object, in the Fe-based lead frame material for palladium plating having excellent corrosion resistance according to the present invention, the surface of a Fe-based lead frame material such as an Fe-Ni alloy is coated with Cu. And / or a plated layer of Ni of 4 μm or more is provided, and this plated layer is formed by cold rolling with a working ratio of 10% or more or after cold rolling.
That is, the material was annealed at a temperature of 00 ° C. or more.
In order to achieve the above object, in the method for producing an Fe-based lead frame material for palladium plating having excellent corrosion resistance according to the present invention, the surface of an Fe-based lead frame material such as an Fe-Ni-based alloy is coated with Cu and / or Ni. Is plated at 4.5 μm or more, and then cold-rolled at a working ratio of 10% or more, or is annealed at a temperature of 400 ° C. or more after cold-rolling.
【０００６】[0006]
【発明の実施の形態】次に、本発明の実施の形態を説明
する。先ず、本発明の耐食性に優れたパラジウムめっき
用Ｆｅ系リードフレーム材について説明すると、本発明
のＦｅ系リードフレーム材は、Ｎｉを３０〜５５％含有
しているＦｅーＮｉ系合金、このＦｅーＮｉ系合金にＮ
ｂを２〜７％及びＣｏを１〜５％含有しているＦｅーＮ
ｉ─Ｎｂ─Ｃｏ系合金、Ｃｒを５〜１３％含有している
ＦｅーＣｒ系合金などである。また、本発明のパラジウ
ムめっき用Ｆｅ系リードフレーム材は、表面にＣｕ及び
／又はＮｉを４μｍ以上設けているが、表面にＣｕ及び
／又はＮｉをめっきするのは、Ｃｕ及びＮｉがＦｅーＮ
ｉ系合金及びＦｅーＣｒ系合金に付着し易く、またこれ
らの合金及びＰｄと自然電位が近くて局部電池が形成さ
れ難いからである。またＦｅ系リードフレーム材はめっ
き層を４μｍ以上にしているが、４μｍより薄いと耐食
性が十分改善されないからである。このめっき層の厚さ
は好ましくは７．５μｍ以上であり、上限はコストの点
を考慮すると冷間圧延後の厚さが１２μｍ以下が好まし
い。Next, an embodiment of the present invention will be described. First, the Fe-based lead frame material for palladium plating having excellent corrosion resistance of the present invention will be described. The Fe-based lead frame material of the present invention is an Fe-Ni-based alloy containing 30 to 55% of Ni. N to Ni-based alloy
Fe—N containing 2 to 7% of b and 1 to 5% of Co
i─Nb─Co alloys, Fe—Cr alloys containing 5 to 13% of Cr, and the like. Also, the Fe-based lead frame material for palladium plating of the present invention has Cu and / or Ni provided on the surface at 4 μm or more, but the Cu and / or Ni is plated on the surface because Cu and Ni are Fe—N
This is because the alloy easily adheres to the i-based alloy and the Fe-Cr-based alloy and has a natural potential close to that of these alloys and Pd, so that a local battery is hardly formed. Also, the Fe-based lead frame material has a plating layer of 4 μm or more, but if it is thinner than 4 μm, the corrosion resistance is not sufficiently improved. The thickness of the plating layer is preferably 7.5 μm or more, and the upper limit is preferably 12 μm or less after cold rolling in consideration of cost.
【０００７】本発明のパラジウムめっき用Ｆｅ系リード
フレーム材は、めっき層が加工率１０％以上の冷間圧延
をしたものであるが、冷間圧延しているのはＣｕ及びＮ
ｉめっき層に発生した孔を封孔して局部電池を形成する
のを防止するためであり、加工率を１０％以上にするの
は、１０％より少ないと封孔が十分行われないために局
部電池の形成を防止することができないからである。上
限は、特に限定されないが加工率を高くするとＣｕ及び
Ｎｉめっき層を厚くめっきする必要があるので、５０％
以下が好ましい。また、本発明の別の実施の形態のパラ
ジウムめっき用Ｆｅ系リードフレーム材は、めっき層が
４００℃以上の温度で焼鈍したものであるが、焼鈍して
いるのは下地めっき層のＣｕ及び／又はＮｉの歪みを取
って伸びを回復させるためであり、その結果として打ち
抜き加工によってタイバーカットした場合に生じるせん
断面に下地めっき層のＣｕ及び／又はＮｉを被覆させて
耐食性を改善するためである。この焼鈍を４００℃以上
で行うのは、４００℃以下の温度では下地めっき層の歪
みを十分取ることができないからである。上限は、コス
トの点を考慮すると８００℃以下が好ましい。In the Fe-based lead frame material for palladium plating of the present invention, the plating layer is cold-rolled with a working ratio of 10% or more.
The purpose is to prevent the formation of a local battery by sealing the holes generated in the i-plated layer, and to set the processing rate to 10% or more because if less than 10%, the sealing is not sufficiently performed. This is because formation of a local battery cannot be prevented. The upper limit is not particularly limited, but if the processing rate is increased, it is necessary to plate the Cu and Ni plating layers thickly.
The following is preferred. Further, in the Fe-based lead frame material for palladium plating according to another embodiment of the present invention, the plating layer is annealed at a temperature of 400 ° C. or more. Or, to recover the elongation by taking the strain of Ni, and to improve the corrosion resistance by coating the underlying plating layer with Cu and / or Ni on the shearing surface generated when the tie bar is cut by punching as a result. . The reason for performing this annealing at 400 ° C. or more is that if the temperature is 400 ° C. or less, the distortion of the base plating layer cannot be sufficiently removed. The upper limit is preferably 800 ° C. or less in consideration of cost.
【０００８】[0008]
【作用】本発明の耐食性に優れたパラジウムめっき用Ｆ
ｅ系リードフレーム材は、加工率１０％以上の冷間圧延
をしたＣｕ及び／又はＮｉの４μｍ以上のめっき層を設
けているので、めっき層の孔が封孔されているためにＦ
ｅーＮｉ系合金、ＦｅーＣｒ系合金などとＰｄとが局部
電池を形成してリードフレーム材を腐食することがな
い。またその後４００℃以上の温度で焼鈍しているもの
においては、下地めっき層のＣｕ及び／又はＮｉの伸び
が回復しているので、タイバーカットのための打ち抜き
加工後に生じたせん断面に下地めっき層のＣｕ及び／又
はＮｉを被覆し、耐食性を改善することができる。The F of the present invention is excellent in corrosion resistance for palladium plating.
Since the e-based lead frame material is provided with a plated layer of Cu and / or Ni of 4 μm or more that has been cold-rolled with a working ratio of 10% or more, the F of the plated layer is closed because the holes in the plated layer are sealed.
An e-Ni-based alloy, an Fe-Cr-based alloy, etc. and Pd do not form a local battery and corrode the lead frame material. In the case of annealing at a temperature of 400 ° C. or more thereafter, since the extension of Cu and / or Ni of the base plating layer has recovered, the base plating layer Of Cu and / or Ni to improve corrosion resistance.
【０００９】次に、本発明の耐食性に優れたパラジウム
めっき用Ｆｅ系リードフレーム材の製造方法について説
明すると、Ｆｅ系リードフレーム材、Ｃｕ及び／又はＮ
ｉのめっきをすること、加工率１０％以上の冷間圧延す
ること及び４００℃以上の温度で焼鈍することについて
は上記耐食性に優れたパラジウムめっき用Ｆｅ系リード
フレーム材のところで述べたとおりである。本発明の耐
食性に優れたパラジウムめっき用Ｆｅ系リードフレーム
材の製造方法は、表面にＣｕ及び／又はＮｉを４．５μ
ｍ以上めっきしているが、４．５μｍ以上めっきしてす
れば加工率１０％の冷間圧延によっても耐食性を改善す
るのに必要な厚さ、すなわち４μｍ以上のめっき層が得
られるからである。ただ、冷間圧延の加工率を１０％よ
り高くする場合には、加工率に従ってめっき層も厚くす
る必要がある。このめっき層の厚さは、好ましくは７．
５μｍ以上であり、上限はコストの点を考慮すると冷間
圧延後の厚さが１２μｍ以下が好ましい。Next, the method of manufacturing the Fe-based lead frame material for palladium plating having excellent corrosion resistance according to the present invention will be described. The Fe-based lead frame material, Cu and / or N
The plating of i, the cold rolling at a working ratio of 10% or more, and the annealing at a temperature of 400 ° C. or more are as described above for the Fe-based lead frame material for palladium plating having excellent corrosion resistance. . The method for producing an Fe-based lead frame material for palladium plating excellent in corrosion resistance according to the present invention is characterized in that Cu and / or Ni are coated on a surface with 4.5 μm.
This is because, if plating is performed with a thickness of 4.5 μm or more, a thickness necessary for improving corrosion resistance, that is, a plating layer with a thickness of 4 μm or more, can be obtained even by cold rolling at a working ratio of 10%. . However, when the working ratio of the cold rolling is set to be higher than 10%, it is necessary to increase the thickness of the plating layer according to the working ratio. This plating layer preferably has a thickness of 7.
The upper limit is preferably 5 μm or more, and the upper limit is preferably 12 μm or less after cold rolling in consideration of cost.
【００１０】[0010]
【作用】本発明のＦｅ系リードフレーム材の製造方法
は、Ｃｕ及び／又はＮｉを４．５μｍ以上めっきした
後、加工率１０％以上の冷間圧延をしているので、Ｃｕ
及びＮｉめっき層に発生した孔を封孔することができ
る。その結果としてＦｅーＮｉ系合金及びＦｅーＣｒ系
合金とＰｄとが局部電池を形成することによる腐食を防
止することができる。また４００℃以上の温度で焼鈍す
るものにおいては、焼鈍することによって下地めっき層
の歪みが除去されて伸びが回復される。その結果として
タイバーカットのための打ち抜き加工後をすると、せん
断面に下地めっき層のＣｕ及び／又はＮｉが被覆されて
せん断面の耐食性も改善することができる。According to the method for producing an Fe-based lead frame material of the present invention, Cu and / or Ni are plated at 4.5 μm or more and then cold-rolled at a working ratio of 10% or more.
And the holes generated in the Ni plating layer can be sealed. As a result, it is possible to prevent corrosion caused by the formation of a local battery by the Fe—Ni-based alloy and the Fe—Cr-based alloy and Pd. In the case of annealing at a temperature of 400 ° C. or more, the annealing removes the distortion of the base plating layer and recovers the elongation. As a result, after punching for tie-bar cutting, the shear surface is coated with Cu and / or Ni of the base plating layer, so that the corrosion resistance of the shear surface can be improved.
【００１１】[0011]
【実施例】次に、本発明の実施例及び比較例を説明す
る。 実施例１ 下記表１に示した成分組成の材料を溶解後鋳造して鋼塊
にし、この鋼塊を１１００℃にて熱間鍛造して厚さ２０
ｍｍ、幅５０ｍｍの板にした。この板の表面をグライン
ダーにより脱スケールした後、熱間圧延により厚さ３ｍ
ｍの板にし、その後この板を再度グラインダーにより脱
スケールし、冷間圧延により厚さ１ｍｍの板にした。こ
の板を１０００℃にて５分間の真空焼鈍と冷間圧延とを
繰り返して０．２ｍｍの板とし、同様に真空焼鈍した。Next, examples and comparative examples of the present invention will be described. Example 1 A material having the composition shown in Table 1 below was melted and cast into a steel ingot, and the steel ingot was hot forged at 1100 ° C. to a thickness of 20%.
mm and a width of 50 mm. After descaling the surface of this plate with a grinder, the thickness is 3 m by hot rolling.
m, which was then descaled again by a grinder and cold rolled to a 1 mm thick plate. This plate was repeatedly subjected to vacuum annealing and cold rolling at 1000 ° C. for 5 minutes to obtain a 0.2 mm plate, and similarly vacuum annealed.
【００１２】[0012]
【表１】 [Table 1]
【００１３】この板を切断して３０ｍｍ×５０ｍｍのそ
れぞれの供試材について６枚ずつ計１８枚の試験片を作
成し、下記めっき浴を用いてＣｕ、ＮｉあるいはＣｕ及
びＮｉを下記表２に記載したような３種類の厚さにめっ
きするとともに、４種類の冷間加工率を加えた試料を作
成した。この試料をJIS Z 2371に準じた２４時間の塩水
噴霧試験を行い、その錆の発生率を画像処理法で求め、
下記表２に示した結果を得た。なお、ＣｕとＮｉの両方
をめっきしたものは、Ｃｕをめっきした後Ｎｉをめっき
した。 Ｎｉめっき浴及びめっき条件 硫酸ニッケル ２４０ｇ／ｌ 塩化ニッケル ４５ｇ／ｌ ホウ酸 ３０ｇ／ｌ ｐＨ ５．０ 温度 ５０℃ 陽極 銅板 電流密度 ５Ａ／ｄｍ2 陽極 ニッケル板 Ｃｕめっき浴及びめっき条件 硫酸銅（CuSO4 ・5H2O) ２２０ｇ／ｌ 硫酸 ５０ｇ／ｌ 温度 ３５℃ 電流密度 ５Ａ／ｄｍ2 陽極 銅板This plate was cut to prepare 18 test pieces each of 6 specimens of each 30 mm × 50 mm test material, and Cu, Ni or Cu and Ni were listed in Table 2 below using a plating bath described below. Samples were prepared by plating to three different thicknesses as described and adding four different cold working rates. This sample was subjected to a 24-hour salt spray test according to JIS Z 2371, and the rust generation rate was determined by an image processing method.
The results shown in Table 2 below were obtained. In the case of plating both Cu and Ni, Ni was plated after plating Cu. Ni plating bath and plating conditions Nickel sulfate 240 g / l Nickel chloride 45 g / l Boric acid 30 g / l pH 5.0 Temperature 50 ° C. Anode Copper plate Current density 5 A / dm 2 Anode Nickel plate Cu plating bath and plating conditions Copper sulfate (CuSO 4・ 5H 2 O) 220g / l sulfuric acid 50g / l temperature 35 ℃ current density 5A / dm 2 anode copper plate
【００１４】[0014]
【表２】 [Table 2]
【００１５】これらの結果より、いずれのめっきをした
ものにおいても冷間加工前のめっき厚さが４．５μｍ以
上になると、錆発生量が大幅に低下し、１０％以上の冷
間圧延をしたものは、錆の発生率が極端に低下している
ことが分かる。From these results, when the plating thickness before cold working becomes 4.5 μm or more in any of the plated products, the amount of rust is greatly reduced, and cold rolling of 10% or more was performed. It can be seen that the occurrence of rust was extremely reduced.
【００１６】実施例２ 上記実施例１と同じ方法で製造し、切断した試験片に上
記めっき浴を用いてめっき時間を変えながらＣｕ、Ｎｉ
あるいはＣｕ及びＮｉを表３に示したような厚さにめっ
きし、２０％の冷間加工した後６００℃で５分間真空焼
鈍してリードフレーム材の試料を得た。これらの試料を
図１に示したような形状の穴を打ち抜いて試料にした。
この試料にJIS Z 2371に準じた２４時間の塩水噴霧試験
を行い、打ち抜いた穴の部分の錆の発生率を画像処理法
で求め、下記表３に示した結果を得た。Example 2 A sample prepared in the same manner as in Example 1 above was cut on a test piece using the above-mentioned plating bath while changing the plating time with Cu and Ni.
Alternatively, Cu and Ni were plated to the thickness as shown in Table 3, cold worked at 20%, and then vacuum annealed at 600 ° C. for 5 minutes to obtain a sample of a lead frame material. These samples were made into samples by punching holes having the shape shown in FIG.
This sample was subjected to a salt spray test for 24 hours according to JIS Z 2371, and the rust generation rate at the punched hole was determined by an image processing method, and the results shown in Table 3 below were obtained.
【００１７】これらの結果より、冷間加工前のめっき厚
さが４．５μｍ以上になると、錆発生量が大幅に低下
し、７．５μｍ以上になると、錆発生量が極端に低下す
ることが分かる。From these results, it can be seen that when the plating thickness before cold working is 4.5 μm or more, the amount of rust generation is significantly reduced, and when it is 7.5 μm or more, the amount of rust generation is extremely reduced. I understand.
【００１８】[0018]
【表３】 [Table 3]
【００１９】実施例３ 上記実施例１と同じ方法で製造し、切断した試験片に上
記めっき浴を用いて表４に記載したような厚さのＣｕ、
ＮｉあるいはＣｕ及びＮｉをめっきし、表４に記載した
ような加工率の冷間加工をし、その後６００℃で５分間
真空焼鈍または焼鈍をせず下記に記載しためっき浴を用
いてＰｄを０．５μｍめっきした試料を作成した。この
試料を実施例１と同じ塩水噴霧試験を行い、表面の錆の
発生率を求めた。その結果を下記表４に示した。 Ｐｄめっき パラジウム（Pd(NH3)2(NO2)2として） １３ｇ／ｌ スルファミン酸アンモニウム １００ｇ／ｌ ｐＨ（アンモンニア水で） ８．０ 温度 ２７℃ 電流密度 ０．６Ａ／ｄｍ2 陽極 白金被覆陽極Example 3 A test piece prepared in the same manner as in Example 1 above and having a thickness as shown in Table 4
Plating Ni or Cu and Ni, cold working at a working rate as shown in Table 4, and then performing a vacuum annealing at 600 ° C. for 5 minutes or a Pd of 0 using a plating bath described below without performing annealing. A sample plated with 0.5 μm was prepared. This sample was subjected to the same salt spray test as in Example 1 to determine the occurrence rate of rust on the surface. The results are shown in Table 4 below. Pd plating Palladium (as Pd (NH 3 ) 2 (NO 2 ) 2 ) 13 g / l Ammonium sulfamate 100 g / l pH (with ammonia water) 8.0 Temperature 27 ° C. Current density 0.6 A / dm 2 Anode Platinum coated anode
【００２０】[0020]
【表４】 [Table 4]
【００２１】これらの結果より、Ｐｄをめっきしても冷
間加工の加工率が５％のものは耐食性が十分でないこと
が分かった。また焼鈍をしてないものと焼鈍をしている
ものとは耐食性に殆ど違いがないことが分かった。From these results, it was found that even if Pd was plated, the one having a cold working rate of 5% had insufficient corrosion resistance. It was also found that there was almost no difference in corrosion resistance between the unannealed and the annealed ones.
【００２２】[0022]
【発明の効果】本発明は、上記構成にしたことにより、
下地めっきとしてＣｕ及び／又はＮｉをめっきした後加
工率１０％以上の冷間加工をしたものにおいては耐食性
が十分優れており、また冷間加工後に焼鈍をしたものは
打ち抜き加工をしてもせん断面に下地めっき層のＣｕ及
び／又はＮｉを被覆させることができるので、せん断面
も耐食性を改善することができるという優れた効果を奏
する。According to the present invention, the above-described configuration enables
Those that have been subjected to cold working with a working ratio of 10% or more after plating Cu and / or Ni as the base plating have sufficiently excellent corrosion resistance, and those that have been annealed after cold working cannot be punched. Since the cross-section can be coated with Cu and / or Ni of the base plating layer, an excellent effect that the shear surface can also improve the corrosion resistance can be obtained.
【図１】せん断面の耐食性を調査するために打ち抜き加
工した穴の形状及び大きさを説明するための平面図であ
る。FIG. 1 is a plan view for explaining the shape and size of a punched hole for investigating the corrosion resistance of a shear surface.
Claims (4)
びＮｉの１種又は２種の４μｍ以上のめっき層が設けら
れており、このめっき層が加工率１０％以上の冷間圧延
されたものであることを特徴とする耐食性に優れたパラ
ジウムめっき用Ｆｅ系リードフレーム材。1. An Fe-based lead frame material having one or two Cu or Ni plating layers of 4 μm or more provided on a surface thereof, and the plating layers are cold-rolled at a working ratio of 10% or more. An Fe-based lead frame material for palladium plating having excellent corrosion resistance.
びＮｉの１種又は２種の４μｍ以上のめっき層が設けら
れており、このめっき層が加工率１０％以上の冷間圧延
された後、４００℃以上の温度で焼鈍されたものである
ことを特徴とする耐食性に優れたパラジウムめっき用Ｆ
ｅ系リードフレーム材。2. One or two types of Cu and Ni plating layers having a thickness of 4 μm or more are provided on the surface of the Fe-based lead frame material, and after the plating layers are cold-rolled at a working ratio of 10% or more. For palladium plating excellent in corrosion resistance, characterized by being annealed at a temperature of 400 ° C. or higher.
e-type lead frame material.
びＮｉの１種又は２種を４．５μｍ以上めっきした後、
加工率１０％以上の冷間圧延をすることを特徴とする耐
食性に優れたパラジウムめっき用Ｆｅ系リードフレーム
材の製造方法。3. After plating one or two of Cu and Ni on the surface of the Fe-based lead frame material by 4.5 μm or more,
A method for producing an Fe-based lead frame material for palladium plating having excellent corrosion resistance, comprising cold rolling at a working ratio of 10% or more.
びＮｉの１種又は２種を４．５μｍ以上めっきした後、
加工率１０％以上の冷間圧延をし、その後４００℃以上
の温度で焼鈍をしたことを特徴とする耐食性に優れたパ
ラジウムめっき用Ｆｅ系リードフレーム材の製造方法。4. After plating one or two of Cu and Ni on the surface of the Fe-based lead frame material by 4.5 μm or more,
A method for producing an Fe-based lead frame material for palladium plating having excellent corrosion resistance, comprising performing cold rolling at a working ratio of 10% or more and then annealing at a temperature of 400 ° C. or more.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18186097A JPH1117095A (en) | 1997-06-24 | 1997-06-24 | Fe lead frame material for palladium plating superior in corrosion resistance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18186097A JPH1117095A (en) | 1997-06-24 | 1997-06-24 | Fe lead frame material for palladium plating superior in corrosion resistance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1117095A true JPH1117095A (en) | 1999-01-22 |
Family
ID=16108108
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18186097A Pending JPH1117095A (en) | 1997-06-24 | 1997-06-24 | Fe lead frame material for palladium plating superior in corrosion resistance |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1117095A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001262390A (en) * | 2000-01-12 | 2001-09-26 | Furukawa Electric Co Ltd:The | Palladium plating liquid |
| US7929858B2 (en) | 1998-03-17 | 2011-04-19 | Nikon Corporation | Image-capturing apparatus, electronic still camera, method and apparatus for processing mounting surface of image-capturing apparatus and metal member contact structure |
-
1997
- 1997-06-24 JP JP18186097A patent/JPH1117095A/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7929858B2 (en) | 1998-03-17 | 2011-04-19 | Nikon Corporation | Image-capturing apparatus, electronic still camera, method and apparatus for processing mounting surface of image-capturing apparatus and metal member contact structure |
| JP2001262390A (en) * | 2000-01-12 | 2001-09-26 | Furukawa Electric Co Ltd:The | Palladium plating liquid |
| JP4570213B2 (en) * | 2000-01-12 | 2010-10-27 | 古河電気工業株式会社 | Palladium plating solution |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN102239280B (en) | Conductive member and method for producing the same | |
| KR950704542A (en) | Nanocrystalline Metals (NANOCRYSTALLINE METALS) | |
| CA1322345C (en) | Cold-rolled steel strip with electrodeposited nickel coating exhibiting a large diffusion depth, and process for producing said coated strip | |
| CN106757232A (en) | A kind of preparation method of high corrosion resistance perforated steel ribbon | |
| CN104928521B (en) | The Fe-P series copper alloy plates of intensity, heat resistance and excellent in bending workability | |
| JPH1117095A (en) | Fe lead frame material for palladium plating superior in corrosion resistance | |
| JP2002348649A (en) | HOT-DIP Al-Zn ALLOY PLATED STEEL SHEET EXCELLENT IN WORKABILITY, AND MANUFACTURING METHOD THEREFOR | |
| TW446761B (en) | A steel sheet for electrogalvanization and an electrogalvanized steel sheet with excellent black mark resistance, and a method for manufacturing them | |
| JP2648838B2 (en) | Direct plating of stainless steel with Zn-based metal | |
| JPS63105990A (en) | Multilayered nickel alloy plating and its formation | |
| JP2946154B2 (en) | Zn-based alloy plated steel sheet with excellent plating adhesion | |
| US20040238078A1 (en) | Heat treatment method for a cold-rolled strip with an ni and/or co surface coating, sheet metal producible by said method and battery can producible by said method | |
| JP3153786B2 (en) | Lead frame | |
| JPS63282293A (en) | Electroplating method for stainless steel sheet with zn, ni, or cu | |
| JP2001345080A (en) | Ni plated steel sheet for positive electrode can of alkaline manganese battery, its manufacturing method and positive electrode using it | |
| JPH0288797A (en) | Surface-treated steel sheet for high-performance, lead frame having excellent corrosion resistance, solderability, and platability | |
| JPH1022444A (en) | Palladium-plated iron-nickel alloy lead frame material having excellent anticorrosive property and manufacture thereof | |
| JPH03243789A (en) | Cu-coated cr-containing steel sheet excellent in corrosion resistance, solderability and adhesion | |
| JPS61147895A (en) | Method for suppressing elution of pb ion of pb electrode | |
| JP2001192863A (en) | Copper alloy material and producing method therefor | |
| JPH1174438A (en) | Lead frame | |
| JPH01286407A (en) | Rare earth permanent magnet superior in corrosion resistance and its manufacture | |
| JPH02104655A (en) | Production of surface treated steel sheet for high-efficiency lead frame excellent in corrosion resistance, plating suitability, and solderability | |
| JPH02104654A (en) | Production of surface treated steel sheet for high-effeiciency lead frame excellent in corrosion resistance, plating suitability, and solderability | |
| JPH0288796A (en) | Surface-treated steel sheet for high-performance lead frame having excellent corrosion resistance, solderability, and platability |