JPH1116936A - Control of discharge gap and wire bonding device using this - Google Patents

Control of discharge gap and wire bonding device using this

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Publication number
JPH1116936A
JPH1116936A JP9179128A JP17912897A JPH1116936A JP H1116936 A JPH1116936 A JP H1116936A JP 9179128 A JP9179128 A JP 9179128A JP 17912897 A JP17912897 A JP 17912897A JP H1116936 A JPH1116936 A JP H1116936A
Authority
JP
Japan
Prior art keywords
discharge gap
wire
discharge
amount
voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP9179128A
Other languages
Japanese (ja)
Inventor
Tetsutaka Kudo
哲敬 工藤
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Kaijo Corp
Original Assignee
Kaijo Corp
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Filing date
Publication date
Application filed by Kaijo Corp filed Critical Kaijo Corp
Priority to JP9179128A priority Critical patent/JPH1116936A/en
Publication of JPH1116936A publication Critical patent/JPH1116936A/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
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    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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    • H01L2224/4805—Shape
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
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    • H—ELECTRICITY
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
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    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
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    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/8512—Aligning
    • H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
    • H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
    • H01L2224/8518—Translational movements
    • H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits

Abstract

PROBLEM TO BE SOLVED: To correct automatically the amount of a discharge gap between the point of a wire and a discharge electrode so that the amount of the discharge gap is within a prescribed range and to form always uniform and favorable balls by a method wherein the feed rate of the wire is controlled on the basis of the amount of the discharge gap obtained at the time of the feed of the wire for the following bonding. SOLUTION: A discharge gap voltage monitoring circuit 6 takes out a discharge gap voltage between the point of a wire 1 and a discharge electrode 5 directly or in a prescribed form, such as an integrating output, and sends the voltage to a feed rate conversion circuit 8. The circuit 8 finds the feed rate of the wire 1 for giving a prescribed amount of a discharge gap from the voltage and sends the found feed tate to a clamper control circuit 9. The circuit 9 executes an on-off control of a clamper 3 on the basis of a feed rate sent at the time of the feed of the wire for the following bonding. Accordingly, the wire 1 is subjected to feed control so that the amount of the discharge gap between the point of the wire and the electrode 5 is gained at a prescribed value and the amount of the discharge gap is automatically corrected so that the amount of the discharge gap is always obtained at the prescribed value.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【０００１】[0001]

【発明の属する技術分野】本発明は、ワイヤボンディン
グのための放電ギャップ制御方法とこの方法を利用して
構成したワイヤボンディング装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for controlling a discharge gap for wire bonding and a wire bonding apparatus constructed using the method.

【０００２】[0002]

【従来の技術】ＩＣなどの製造に際しては、ワイヤボン
ディング装置によって、ＩＣチップのパッド（第１ボン
ド電極）とフレームのリード（第２ボンド電極）の間を
金線などのワイヤでボンディングしている。このワイヤ
ボンディング時、ワイヤ先端と放電電極（放電ロッド）
との間で放電を起こさせ、ワイヤ先端にボンディング用
のボールを形成しているが、このボールのでき具合はワ
イヤ先端と放電電極との間の距離（放電ギャップ量）に
よって大きく左右され、放電ギャップ量のばらつきは、
結果としてボンディング品質に大きな影響を与える。こ
のため、ワイヤボンディングに際しては、常に放電ギャ
ップの状態を監視しながらボンディング作業を進める必
要がある。2. Description of the Related Art In manufacturing an IC or the like, a wire such as a gold wire is used to bond between a pad (first bond electrode) of an IC chip and a lead (second bond electrode) of a frame by a wire bonding apparatus. . During this wire bonding, the tip of the wire and the discharge electrode (discharge rod)
A discharge ball is formed between the wire tip and the wire to form a bonding ball at the tip of the wire. The quality of the ball depends greatly on the distance (discharge gap) between the wire tip and the discharge electrode. The variation of the gap amount is
As a result, it greatly affects the bonding quality. Therefore, in wire bonding, it is necessary to proceed with the bonding operation while always monitoring the state of the discharge gap.

【０００３】図３に、従来のワイヤボンディング装置に
おける放電ギャップの監視回路部分の回路構成を示す。
図において、１は金線などのワイヤ、２はワイヤ１を第
１ボンド電極から第２ボンド電極へ引き回すためのキャ
ピラリ、３はクランパ、４は放電用の高電圧を発生する
放電用高電圧発生回路、５は放電電極、６はワイヤ１の
先端と放電電極５との間の放電ギャップ電圧を監視して
その値から放電ギャップの異常を検出する放電ギャップ
電圧監視回路、７は放電によってワイヤ先端に形成され
たボンディング用のボールである。FIG. 3 shows a circuit configuration of a circuit for monitoring a discharge gap in a conventional wire bonding apparatus.
In the figure, 1 is a wire such as a gold wire, 2 is a capillary for routing the wire 1 from the first bond electrode to the second bond electrode, 3 is a clamper, 4 is a high voltage generator for generating a high voltage for discharge. A circuit 5, a discharge electrode 6; a discharge gap voltage monitoring circuit 6, which monitors a discharge gap voltage between the tip of the wire 1 and the discharge electrode 5 and detects an abnormal discharge gap from the value; This is a bonding ball formed on the substrate.

【０００４】上記従来装置における放電ギャップの監視
動作を簡単に説明する。なお、以下の説明は、放電電極
５側に負電圧を印加する負極性放電の場合の例である。
放電電極５側に正電圧を印加する正極性放電の場合は、
電圧の正負が逆になるだけで、放電動作自体は以下に述
べる負極性放電の場合と同じである。[0004] The operation of monitoring the discharge gap in the above-described conventional apparatus will be briefly described. The following description is an example in the case of a negative discharge in which a negative voltage is applied to the discharge electrode 5 side.
In the case of a positive polarity discharge in which a positive voltage is applied to the discharge electrode 5 side,
The discharge operation itself is the same as in the case of the negative-polarity discharge described below, except that the polarity of the voltage is reversed.

【０００５】放電電極５に負の放電用高電圧を印加した
時の放電特性を、図４（Ａ）に示す。いま、図の位置
において、放電用高電圧発生回路４から放電用の高電圧
をワイヤ１と放電電極５との間に印加開始すると、この
印加電圧は図示するように急峻に立上がり、の絶縁破
壊電圧まで達した時点でワイヤ１の先端と放電電極５と
の間に火花が飛び、放電が開始される。FIG. 4A shows a discharge characteristic when a high voltage for negative discharge is applied to the discharge electrode 5. When a high voltage for discharge is started to be applied between the wire 1 and the discharge electrode 5 from the high voltage generator 4 for discharge at the position shown in the figure, the applied voltage rises steeply as shown in FIG. When the voltage reaches the voltage, a spark jumps between the tip of the wire 1 and the discharge electrode 5 to start discharging.

【０００６】放電が開始されると、ワイヤ１の先端と放
電電極５との間の放電ギャップ電圧Ｅg は位置まで下
がり、そのときの放電ギャップ量Ｌg に対応した所定の
電圧Ｅg に落ち着く。この放電ギャップ電圧Ｅg は、放
電ギャップ量Ｌg が大きくなると負の方へ下がり（絶対
値が大きくなる）、放電ギャップが小さくなると正の方
へ上がる（絶対値が小さくなる）ように作用する。[0006] When the discharge is started, the discharge gap voltage E g between the tip end of the wire 1 and the discharge electrode 5 is lowered to a position, settles to a predetermined voltage E g that corresponds to the discharge gap amount L g at that time . The discharge gap voltage E g acts to decrease toward the negative side (absolute value increases) as the discharge gap amount L g increases, and to increase toward the positive side (decrease the absolute value) as the discharge gap decreases. .

【０００７】例えば、図４（Ａ）の場合で説明すると、
放電ギャップ量が規定値Ｌg0のときに放電ギャップ電圧
がＥg0（−５００Ｖ）であるとすると、放電ギャップ量
がこの規定値Ｌg0 よりも大きくなってＬg1になると、
放電ギャップ電圧はそれに応じてＥg1位置まで下側に下
がり（負電圧の絶対値が大きくなる）、また、放電ギャ
ップ量が規定値Ｌg0よりも小さくなってＬg2になると、
放電ギャップ電圧はそれに応じてＥg2位置まで上側に上
がる（負電圧の絶対値が小さくなる）。For example, in the case of FIG.
Assuming that the discharge gap voltage is E g0 (−500 V) when the discharge gap amount is the specified value L g0 , when the discharge gap amount becomes larger than the specified value L g0 and becomes L g1 ,
When the discharge gap voltage drops accordingly to the position E g1 (the absolute value of the negative voltage increases), and when the discharge gap amount becomes smaller than the specified value L g0 and becomes L g2 ,
The discharge gap voltage accordingly rises upward to the E g2 position (the absolute value of the negative voltage decreases).

【０００８】したがって、前記Ｌg0とＥg0を基点とし
て、放電ギャップ量Ｌg と放電ギャップ電圧Ｅg との関
係を描くと、図５に示すような特性となる。この図５か
ら明らかなように、放電ギャップ電圧Ｅg の値からその
ときの放電ギャップ量Ｌg を知ることができる。そこ
で、放電ギャップ電圧監視回路６は、この放電ギャップ
電圧Ｅg を検出し、この放電ギャップ電圧Ｅg を放電ギ
ャップ量Ｌg に変換した後、該得られた放電ギャップ量
Ｌg が規定値Ｌg0からどれだけずれているかを求め、そ
のずれ量が規定範囲を越えたときに異常発生としてボン
ディング動作を自動停止する。Therefore, when the relationship between the discharge gap amount L g and the discharge gap voltage E g is drawn based on the above L g0 and E g0 , the characteristics are as shown in FIG. The 5 As is apparent from, the value of the discharge gap voltage E g can be known a discharge gap amount L g at that time. Therefore, the discharge gap voltage monitoring circuit 6 detects the discharge gap voltage E g, after converting the discharge gap voltage E g the discharge gap amount L g,該得was discharge gap amount L g is the specified value L The amount of deviation from g0 is determined, and when the deviation exceeds a specified range, an abnormality is generated and the bonding operation is automatically stopped.

【０００９】そして、上記装置の稼働中および自動停止
後、作業員などが放電ギャップ調整用ダイヤルなどを手
で操作し、放電ギャップ量Ｌg が規定範囲内に納まるよ
うに再調整していた。[0009] Then, after a running and automatic stop of the apparatus, such as a worker manually by a like discharge gap adjustment dial, a discharge gap distance L g were readjusted to fit within the specified range.

【００１０】なお、前記放電監視回路６は、放電ギャッ
プ電圧Ｅg を直接検出するようにしてもよいが、判定の
信頼性を上げるために、通常は図４（Ｂ）に示すように
検出された放電ギャップ電圧を積分し、その積分出力が
所定のしきい値を越えたときに異常発生と判定するよう
にしている。これによって、放電ギャップ電圧の脈動や
瞬動が平滑化され、誤判定を低減することができる。The discharge monitoring circuit 6 may directly detect the discharge gap voltage Eg. However, in order to increase the reliability of the determination, the discharge monitoring circuit 6 normally detects the discharge gap voltage Eg as shown in FIG. The discharge gap voltage is integrated, and when the integrated output exceeds a predetermined threshold value, it is determined that an abnormality has occurred. As a result, pulsation and flicker of the discharge gap voltage are smoothed, and erroneous determination can be reduced.

【００１１】[0011]

【発明が解決しようとする課題】上述したように、従来
においては、ワイヤ先端と放電電極との間の放電ギャッ
プ量が規定範囲から外れるとその都度ボンディング動作
を停止し、作業員などが手動操作によって放電ギャップ
量を再調整していた。このため、一旦異常が発生すると
装置の再稼働までに手間と時間がかかり、製造効率が極
端に低下するという問題があった。As described above, in the related art, when the discharge gap between the wire tip and the discharge electrode is out of the specified range, the bonding operation is stopped each time, and an operator or the like manually operates the bonding operation. The discharge gap amount was readjusted. For this reason, once an abnormality occurs, it takes time and effort until the apparatus is restarted, and there has been a problem that manufacturing efficiency is extremely reduced.

【００１２】本発明は、上記のような問題を解決するた
めになされたもので、ワイヤ先端と放電電極との間の放
電ギャップ量が規定範囲内に納まるように自動補正し、
常に均一で良好なボールを形成することのできる放電ギ
ャップ制御方法とこれを用いたワイヤボンディング装置
を提供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made to solve the above problems, and automatically corrects a discharge gap between a wire tip and a discharge electrode so as to fall within a specified range.
It is an object of the present invention to provide a discharge gap control method capable of always forming a uniform and good ball, and a wire bonding apparatus using the same.

【００１３】[0013]

【課題を解決するための手段】上記目的を達成するた
め、本発明の放電ギャップ制御方法は、ワイヤ先端と放
電電極との間の放電ギャップ電圧を検出し、該検出した
放電ギャップ電圧から放電ギャップ量を求め、次のボン
ディングのワイヤフィード時に、前記得られた放電ギャ
ップ量に基づいてワイヤのフィード量を制御することに
よって、ワイヤ先端と放電電極との間の放電ギャップ量
を規定値に自動補正するようにしたものである。In order to achieve the above object, a discharge gap control method according to the present invention detects a discharge gap voltage between a wire tip and a discharge electrode, and calculates a discharge gap voltage from the detected discharge gap voltage. The discharge gap amount between the wire tip and the discharge electrode is automatically corrected to a specified value by controlling the wire feed amount based on the obtained discharge gap amount at the time of wire feeding for the next bonding. It is something to do.

【００１４】また、本発明のワイヤボンディング装置
は、ワイヤ先端と放電電極との間の放電によってワイヤ
先端にボンディング用のボールを形成するようにしたワ
イヤボンディング装置において、前記ワイヤ先端と放電
電極との間の放電ギャップ電圧を検出して所定の形式で
取り出す放電ギャップ電圧監視回路と、該放電ギャップ
電圧監視回路で検出した放電ギャップ電圧から規定の放
電ギャップを与えるためのワイヤのフィード量を求める
フィード量変換回路と、該フィード量変換回路で得られ
たフィード量に従ってワイヤ先端と放電電極との間の放
電ギャップ量が規定値となるようにクランパを開閉制御
するクランパ制御回路とを備えることにより構成したも
のである。Further, according to the wire bonding apparatus of the present invention, in a wire bonding apparatus in which a ball for bonding is formed at a wire tip by a discharge between the wire tip and a discharge electrode, A discharge gap voltage monitoring circuit for detecting a discharge gap voltage between the discharge gap voltages and extracting the discharge gap voltage in a predetermined format; and a feed amount for obtaining a wire feed amount for providing a specified discharge gap from the discharge gap voltage detected by the discharge gap voltage monitor circuit. A conversion circuit, and a clamper control circuit that controls opening and closing of the clamper so that the discharge gap amount between the wire tip and the discharge electrode becomes a specified value according to the feed amount obtained by the feed amount conversion circuit. Things.

【００１５】[0015]

【作用】放電ギャップ電圧監視回路は、ワイヤ先端と放
電電極との間の放電ギャップ電圧を直接あるいは積分出
力などの所定の形式で取り出し、フィード量変換回路に
送る。フィード量変換回路は、この放電ギャップ電圧か
ら規定の放電ギャップ量を与えるためのワイヤのフィー
ド量を求め、クランパ制御回路に送る。そして、クラン
パ制御回路は、次のボンディングのワイヤフィード時
に、前記送られてきたフィード量に基づいてクランパを
開閉制御し、ワイヤ先端と放電電極との間の放電ギャッ
プ量が規定値となるようにワイヤをフィード制御する。
この結果、ワイヤ先端と放電電極との間の放電ギャップ
量は常に規定値となるように自動補正される。The discharge gap voltage monitoring circuit extracts the discharge gap voltage between the tip of the wire and the discharge electrode directly or in a predetermined form such as an integrated output and sends it to the feed amount conversion circuit. The feed amount conversion circuit obtains a wire feed amount for giving a specified discharge gap amount from the discharge gap voltage, and sends the wire feed amount to the clamper control circuit. Then, the clamper control circuit controls the opening and closing of the clamper based on the fed amount of the wire when the wire is fed for the next bonding so that the discharge gap amount between the wire tip and the discharge electrode becomes a specified value. Feed control the wire.
As a result, the discharge gap amount between the tip of the wire and the discharge electrode is automatically corrected so as to always be a specified value.

【００１６】[0016]

【発明の実施の形態】以下、本発明の実施の形態につい
て図面を参照して説明する。図１に、本発明に係るワイ
ヤボンディング装置の一実施形態を示す。図において、
１はワイヤ、２はキャピラリ、３はクランパ、４は放電
用高電圧発生回路、５は放電電極、６は放電ギャップ電
圧監視回路、７はワイヤ先端に形成されたボールであっ
て、これらは前述した従来の装置と同一の構成になるも
のである。本発明は、この従来装置と同一の構成におい
て、フィード量変換回路８とクランパ制御回路９を付設
したものである。Embodiments of the present invention will be described below with reference to the drawings. FIG. 1 shows an embodiment of a wire bonding apparatus according to the present invention. In the figure,
1 is a wire, 2 is a capillary, 3 is a clamper, 4 is a discharge high voltage generating circuit, 5 is a discharge electrode, 6 is a discharge gap voltage monitoring circuit, and 7 is a ball formed at the tip of the wire. The configuration is the same as that of the conventional device described above. In the present invention, a feed amount conversion circuit 8 and a clamper control circuit 9 are additionally provided in the same configuration as the conventional device.

【００１７】フィード量変換回路８は、放電ギャップ電
圧監視回路６の出力する放電ギャップ電圧の積分出力か
ら規定放電ギャップ量を得るためのワイヤ１のフィード
量を算出する回路である。また、クランパ制御回路９
は、フィード量変換回路８で算出されたワイヤ１のフィ
ード量に従ってクランパ３の開閉動作を制御し、放電電
極５とワイヤ１の間の放電ギャップが規定の放電ギャッ
プ量となるようにワイヤ１のフィード量を制御する回路
である。The feed amount conversion circuit 8 is a circuit for calculating the feed amount of the wire 1 for obtaining the specified discharge gap amount from the integrated output of the discharge gap voltage output from the discharge gap voltage monitoring circuit 6. In addition, the clamper control circuit 9
Controls the opening and closing operation of the clamper 3 in accordance with the feed amount of the wire 1 calculated by the feed amount conversion circuit 8 so that the discharge gap between the discharge electrode 5 and the wire 1 becomes a specified discharge gap amount. This is a circuit for controlling the feed amount.

【００１８】次に、図２を参照してその動作を説明す
る。なお、説明を分かり易くするため、図２（Ａ）に示
すように、ワイヤ１の先端と放電電極５との間の放電ギ
ャップ量が規定値Ｌg0よりも大きなＬg1となっている場
合を例に取る。Next, the operation will be described with reference to FIG. In order to make the description easy to understand, as shown in FIG. 2A, the case where the discharge gap amount between the tip of the wire 1 and the discharge electrode 5 is L g1 larger than the specified value L g0 is assumed. Take for example.

【００１９】この状態において、放電用高電圧発生回路
４からワイヤ１と放電電極５との間に高電圧を印加する
と、図２（Ｂ）に示すように、ワイヤ１と放電電極５と
の間に火花が飛んで放電が開始され、所定時間の後、ワ
イヤ１の先端にはボンディング用のボール７が形成され
る。In this state, when a high voltage is applied between the wire 1 and the discharge electrode 5 from the high voltage generator 4 for discharge, as shown in FIG. Then, a spark is blown to start discharging, and after a predetermined time, a bonding ball 7 is formed at the tip of the wire 1.

【００２０】上記放電の間、放電ギャップ電圧監視回路
６はワイヤ１と放電電極５との間の放電ギャップ電圧Ｅ
g1を検出し、これを積分する（図４（Ｂ）参照）。そし
て、放電が終了すると、放電ギャップ電圧監視回路６
は、この放電終了時の積分出力をフィード量変換回路８
に送る。During the above discharge, the discharge gap voltage monitoring circuit 6 monitors the discharge gap voltage E between the wire 1 and the discharge electrode 5.
g1 is detected and integrated (see FIG. 4B). When the discharge is completed, the discharge gap voltage monitoring circuit 6
Converts the integrated output at the end of the discharge into a feed amount conversion circuit 8.
Send to

【００２１】放電が終了し、ワイヤ１の先端にボンディ
ング用のボール７が形成されると、放電電極５は図示し
ない機構によってボンディングの邪魔にならない位置に
引き込められ、図２（Ｃ）に示すように、キャピラリ２
を移動制御することによって、ワイヤ１をＩＣチップ２
１のパッド（第１ボンド電極）２２とフレーム２３のリ
ード（第２ボンド電極）２４の間のボンディングを行な
う。When the discharge is completed and the bonding ball 7 is formed at the end of the wire 1, the discharge electrode 5 is drawn into a position where it does not hinder the bonding by a mechanism (not shown), and as shown in FIG. Like, Capillary 2
Is controlled by moving the wire 1 to the IC chip 2
The bonding between the first pad (first bond electrode) 22 and the lead (second bond electrode) 24 of the frame 23 is performed.

【００２２】一方、前記フィード量変換回路８は、放電
ギャップ電圧監視回路６から送られてきた積分出力を基
に現在の放電ギャップ量Ｌg1を求め、この放電ギャップ
量Ｌg1から規定値Ｌg0を与えるためのフィード補正量Δ
Ｌg1＝Ｌg1−Ｌg0を算出する。そして、この得られたフ
ィード補正量ΔＬg1を前回のワイヤ１のフィード量Ｓに
加算してやることにより、次のボンディング時のワイヤ
1 のフィード量Ｓ＋ΔＬg1を得る。On the other hand, the feed amount conversion circuit 8 obtains the current discharge gap amount L g1 based on the integrated output sent from the discharge gap voltage monitoring circuit 6, and obtains the specified value L g0 from the discharge gap amount L g1. Feed correction amount Δ to give
L g1 = L g1 −L g0 is calculated. Then, by adding the obtained feed correction amount ΔL g1 to the previous feed amount S of the wire 1, the wire correction amount for the next bonding is obtained.
A feed amount S + ΔL g1 of 1 is obtained.

【００２３】図２（Ｃ）のように、リード２４へのボン
ディングが終了すると、クランパ３を開いたまま、キュ
ピラリ２を前記算出したフィード量Ｓ＋ΔＬg1だけ上方
へ引き上げ、図２（Ｄ）の状態とする。そして、図２
（Ｄ）の状態となった時点で、クランパ制御回路９によ
ってクランパ３を閉じ、ワイヤ１，キャピラリ２，クラ
ンパ３の全体を図２（Ｅ）に示す放電位置まで引き上げ
る。その後、放電電極５が所定の位置に押し出され、次
の放電の準備が完了する。As shown in FIG. 2C, when the bonding to the lead 24 is completed, the capillary 2 is pulled upward by the calculated feed amount S + ΔL g1 while the clamper 3 is opened, and the state shown in FIG. And And FIG.
At the time of the state (D), the clamper 3 is closed by the clamper control circuit 9, and the entire wire 1, capillary 2, and clamper 3 are pulled up to the discharge position shown in FIG. Thereafter, the discharge electrode 5 is pushed out to a predetermined position, and preparation for the next discharge is completed.

【００２４】図２（Ｅ）から明らかなように、上記ワイ
ヤ１のフィード制御の結果、ワイヤ１の先端と放電電極
５との間の放電ギャップ量はΔＬg1だけ自動補正され、
ワイヤ１の先端と放電電極５との間の放電ギャップ量は
規定値Ｌg0となる。このワイヤ１のフィード制御は、ワ
イヤ１の先端と放電電極５との間で放電が行なわれる度
に実行される。したがって、ワイヤ１の先端と放電電極
５との間の放電ギャップ量は常に規定値ＬG0に維持さ
る。この結果、ワイヤ１の先端には常に均一で良好なボ
ールが形成され、高品質のワイヤボンディングが実現さ
れる。As is apparent from FIG. 2E, as a result of the feed control of the wire 1, the discharge gap amount between the tip of the wire 1 and the discharge electrode 5 is automatically corrected by ΔL g1 ,
The discharge gap amount between the tip of the wire 1 and the discharge electrode 5 has a specified value L g0 . The feed control of the wire 1 is executed every time a discharge is performed between the tip of the wire 1 and the discharge electrode 5. Therefore, always monkey maintain the specified value L G0 discharge gap size between the tip of the wire 1 and the discharge electrode 5. As a result, a uniform and good ball is always formed at the tip of the wire 1, and high-quality wire bonding is realized.

【００２５】なお、上記ワイヤ１のフィード制御が不可
能なほどに放電ギャップ量Ｌg が大きく変化したような
場合には、従来と同様に、放電ギャップ電圧監視回路６
から異常検知出力が発生するので、このような場合には
従来と同様に装置を自動停止させることができる。In the case where the discharge gap amount Lg has changed so much that the feed control of the wire 1 is impossible, the discharge gap voltage monitoring circuit 6 is operated as in the conventional case.
Generates an abnormality detection output, and in such a case, the apparatus can be automatically stopped as in the related art.

【００２６】また、上記の例においては、放電ギャップ
電圧監視回路６は検出した放電ギャップ電圧を積分して
出力するようにしたが、判定の信頼性が若干低下するこ
とを我慢できるならば、検出した放電ギャップ電圧を積
分することなくそのまま出力するようにしてよいもので
ある。In the above example, the discharge gap voltage monitoring circuit 6 integrates the detected discharge gap voltage and outputs the integrated value. However, if the reliability of the judgment can be tolerated slightly, the detection gap voltage can be detected. It is possible to output the discharge gap voltage as it is without integrating it.

【００２７】また、上記の例は、放電電極５に負電圧を
印加する負極性放電の場合について例示したが、放電電
極５に正電圧を印加する正極性放電の場合も同様に実現
できるものである。In the above example, the case of a negative discharge in which a negative voltage is applied to the discharge electrode 5 has been described. However, the case of a positive discharge in which a positive voltage is applied to the discharge electrode 5 can be similarly realized. is there.

【００２８】[0028]

【発明の効果】以上説明したように、本発明の放電ギャ
ップ制御方法は、ワイヤ先端と放電電極との間の放電ギ
ャップ電圧を検出し、該検出した放電ギャップ電圧から
放電ギャップ量を求め、次のボンディングのワイヤフィ
ード時に、前記得られた放電ギャップ量に基づいてワイ
ヤのフィード量を制御することによって、ワイヤ先端と
放電電極との間の放電ギャップ量を規定値に自動補正す
るようにしたので、ワイヤ先端と放電電極との間の放電
ギャップ量を常に規定範値となるように自動補正するこ
とができる。このため、常に均一で良好なボールを形成
することができ、高品質のワイヤボンディングを実現で
きる。また、放電ギャップ量が規定範囲から外れて装置
が自動停止されるというような事故がほとんどなくなる
ので、製造効率を上げることができる。As described above, according to the discharge gap control method of the present invention, the discharge gap voltage between the tip of the wire and the discharge electrode is detected, and the discharge gap amount is determined from the detected discharge gap voltage. Since the wire feed amount is controlled based on the obtained discharge gap amount during the bonding wire feed, the discharge gap amount between the wire tip and the discharge electrode is automatically corrected to a specified value. In addition, it is possible to automatically correct the discharge gap amount between the wire tip and the discharge electrode so that the discharge gap amount always becomes a specified range. For this reason, a uniform and good ball can always be formed, and high-quality wire bonding can be realized. In addition, since there is almost no accident such that the discharge gap amount is out of the specified range and the device is automatically stopped, manufacturing efficiency can be improved.

【００２９】また、本発明のワイヤボンディング装置
は、ワイヤ先端と放電電極との間の放電ギャップ電圧を
検出して所定の形式で取り出す放電ギャップ電圧監視回
路と、該放電ギャップ電圧監視回路で検出した放電ギャ
ップ電圧から規定の放電ギャップを与えるためのワイヤ
のフィード量を求めるフィード量変換回路と、該フィー
ド量変換回路で得られたフィード量に従ってワイヤ先端
と放電電極との間の放電ギャップ量が規定値となるよう
にクランパを開閉制御するクランパ制御回路とを備える
ことにより構成したので、常に均一で良好なボールを形
成することができる高品質で製造効率に優れたワイヤボ
ンディング装置を提供することができる。Further, in the wire bonding apparatus of the present invention, a discharge gap voltage monitoring circuit which detects a discharge gap voltage between a wire tip and a discharge electrode and takes out the discharge gap voltage in a predetermined format, and the discharge gap voltage monitoring circuit detects the discharge gap voltage. A feed amount conversion circuit for obtaining a wire feed amount for giving a specified discharge gap from the discharge gap voltage; and a discharge gap amount between the wire tip and the discharge electrode is defined according to the feed amount obtained by the feed amount conversion circuit. And a clamper control circuit that controls the opening and closing of the clamper so as to obtain a high-quality, high-quality wire bonding apparatus capable of always forming uniform and good balls. it can.

【図面の簡単な説明】[Brief description of the drawings]

【図１】本発明の一実施形態を示すブロック図である。FIG. 1 is a block diagram showing an embodiment of the present invention.

【図２】上記実施形態のボンディング動作の説明図であ
る。FIG. 2 is an explanatory diagram of a bonding operation of the embodiment.

【図３】従来装置を示すブロック図である。FIG. 3 is a block diagram showing a conventional device.

【図４】ワイヤボンディングにおける放電特性の説明図
である。FIG. 4 is an explanatory diagram of discharge characteristics in wire bonding.

【図５】放電ギャップ電圧と放電ギャップ量の関係を示
す図である。FIG. 5 is a diagram showing a relationship between a discharge gap voltage and a discharge gap amount.

【符号の説明】[Explanation of symbols]

１ ワイヤ ２ キャピラリ ３ クランパ ４ 放電用高電圧発生回路 ５ 放電電極 ６ 放電ギャップ電圧監視回路 ７ ボール ８ フィード量変換回路 ９ クランパ制御回路 ２１ ＩＣチップ ２２ パッド（第１ボンド電極） ２３ フレーム ２４ リード（第２ボンド電極） Ｌg 放電ギャップ量 Ｅg 放電ギャップ電圧REFERENCE SIGNS LIST 1 wire 2 capillary 3 clamper 4 discharge high voltage generation circuit 5 discharge electrode 6 discharge gap voltage monitoring circuit 7 ball 8 feed amount conversion circuit 9 clamper control circuit 21 IC chip 22 pad (first bond electrode) 23 frame 24 lead (first Lg discharge gap amount Eg discharge gap voltage

Claims (2)

【特許請求の範囲】[Claims] 【請求項１】 ワイヤ先端と放電電極との間の放電によ
ってワイヤ先端にボンディング用のボールを形成するよ
うにしたワイヤボンディングのための放電ギャップ制御
方法であって、 ワイヤ先端と放電電極との間の放電ギャップ電圧を検出
し、該検出した放電ギャップ電圧から放電ギャップ量を
求め、次のボンディングのワイヤフィード時に、前記得
られた放電ギャップ量に基づいてワイヤのフィード量を
制御することによって、ワイヤ先端と放電電極との間の
放電ギャップ量を規定値に自動補正することを特徴とす
る放電ギャップ制御方法。1. A method of controlling a discharge gap for wire bonding, wherein a bonding ball is formed at a wire tip by a discharge between the wire tip and a discharge electrode, the method comprising: The discharge gap voltage is detected, the discharge gap amount is determined from the detected discharge gap voltage, and at the time of the wire feed of the next bonding, the wire feed amount is controlled based on the obtained discharge gap amount, thereby obtaining the wire. A discharge gap control method, wherein a discharge gap amount between a tip and a discharge electrode is automatically corrected to a specified value. 【請求項２】 ワイヤ先端と放電電極との間の放電によ
ってワイヤ先端にボンディング用のボールを形成するよ
うにしたワイヤボンディング装置において、 前記ワイヤ先端と放電電極との間の放電ギャップ電圧を
検出して所定の形式で取り出す放電ギャップ電圧監視回
路と、 該放電ギャップ電圧監視回路で検出した放電ギャップ電
圧から規定の放電ギャップを与えるためのワイヤのフィ
ード量を求めるフィード量変換回路と、 該フィード量変換回路で得られたフィード量に従ってワ
イヤ先端と放電電極との間の放電ギャップ量が規定値と
なるようにクランパを開閉制御するクランパ制御回路
と、を備えたことを特徴とするワイヤボンディング装
置。2. A wire bonding apparatus in which a bonding ball is formed at a wire tip by a discharge between the wire tip and a discharge electrode, wherein a discharge gap voltage between the wire tip and the discharge electrode is detected. A discharge gap voltage monitoring circuit for extracting a wire feed amount for providing a prescribed discharge gap from the discharge gap voltage detected by the discharge gap voltage monitoring circuit; and a feed amount conversion circuit. A wire bonding apparatus comprising: a clamper control circuit that controls opening and closing of a clamper so that a discharge gap amount between a wire tip and a discharge electrode has a specified value according to a feed amount obtained by a circuit.
JP9179128A 1997-06-20 1997-06-20 Control of discharge gap and wire bonding device using this Pending JPH1116936A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9179128A JPH1116936A (en) 1997-06-20 1997-06-20 Control of discharge gap and wire bonding device using this

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9179128A JPH1116936A (en) 1997-06-20 1997-06-20 Control of discharge gap and wire bonding device using this

Publications (1)

Publication Number Publication Date
JPH1116936A true JPH1116936A (en) 1999-01-22

Family

ID=16060487

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9179128A Pending JPH1116936A (en) 1997-06-20 1997-06-20 Control of discharge gap and wire bonding device using this

Country Status (1)

Country Link
JP (1) JPH1116936A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011103775A1 (en) * 2010-02-23 2011-09-01 清华大学 Generation device and method for nominal voltage

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2011103775A1 (en) * 2010-02-23 2011-09-01 清华大学 Generation device and method for nominal voltage

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