JPH11166169A - Adhesive composition - Google Patents
Adhesive compositionInfo
- Publication number
- JPH11166169A JPH11166169A JP33576897A JP33576897A JPH11166169A JP H11166169 A JPH11166169 A JP H11166169A JP 33576897 A JP33576897 A JP 33576897A JP 33576897 A JP33576897 A JP 33576897A JP H11166169 A JPH11166169 A JP H11166169A
- Authority
- JP
- Japan
- Prior art keywords
- adhesive composition
- adhesive
- weight
- bisphenol
- imidazole
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、接着剤組成物に関
する。更に詳しくは、本発明は、はんだ接着法に代わる
樹脂接着法に使用される電子部品用の接着剤組成物に関
する。TECHNICAL FIELD The present invention relates to an adhesive composition. More specifically, the present invention relates to an adhesive composition for electronic components used in a resin bonding method instead of a solder bonding method.
【０００２】[0002]
【従来の技術】近年、電子機器は小型化、軽量化、多様
化する傾向にある。それに伴い、電子機器に含まれる実
装基板（例えば、配線回路基板）及び実装基板上に実装
される電子部品（例えば、半導体装置）も小さくなり、
種類も豊富になっている。従来、電子部品を実装基板に
電気的に接続する方法として、はんだバンプによるフリ
ップチップ方式等が採用されている。2. Description of the Related Art In recent years, electronic devices have tended to become smaller, lighter and more diversified. Along with this, a mounting board (for example, a wiring circuit board) included in the electronic device and an electronic component (for example, a semiconductor device) mounted on the mounting board also become smaller,
There are many kinds. 2. Description of the Related Art Conventionally, as a method of electrically connecting an electronic component to a mounting board, a flip chip method using solder bumps or the like has been adopted.
【０００３】しかし、はんだバンプによる接続は、接続
時に電子部品が加熱されるため、熱に弱い電子部品は接
続することが困難であった。そのため、このような熱に
弱い電子部品にも適用することのできる接着技術の開発
が望まれている。上記はんだバンプによる接続に代わっ
て、樹脂を主成分とする接着剤組成物を使用した樹脂接
着法により、電子部品の電極上に形成された金属（例え
ば、Ａｕ）バンプを、直接実装基板の電極に接続する方
法が検討されている。この方法は、電子部品と実装基板
との電気的接続を機械的接触により行い、電気的接続の
信頼性を、接着剤組成物の接着力及び圧縮応力により確
保している。[0003] However, in connection by solder bumps, since electronic components are heated during connection, it is difficult to connect electronic components that are weak to heat. Therefore, there is a demand for the development of a bonding technique that can be applied to such heat-sensitive electronic components. Instead of the connection by the solder bump, a metal (for example, Au) bump formed on an electrode of an electronic component is directly connected to an electrode of a mounting board by a resin bonding method using an adhesive composition containing a resin as a main component. A method of connecting to is being considered. In this method, the electrical connection between the electronic component and the mounting board is made by mechanical contact, and the reliability of the electrical connection is secured by the adhesive force and the compressive stress of the adhesive composition.
【０００４】上記のような樹脂接着法に使用される接着
剤組成物として、特開昭６１−１８１８２１号公報及び
特開昭６３−７２１９４号公報に記載されたものが挙げ
られる。これら公報には、いずれも紫外線により硬化す
る接着剤組成物が記載されており、特に、特開昭６１−
１８１８２１号公報には、エポキシ樹脂前駆体、酸無水
物、硬化促進剤、アクリルモノマー及び光重合開始剤か
らなる接着剤組成物が記載されている。[0004] Examples of the adhesive composition used in the resin bonding method described above include those described in JP-A-61-181821 and JP-A-63-72194. Each of these publications describes an adhesive composition which is cured by ultraviolet rays.
JP 181821 describes an adhesive composition comprising an epoxy resin precursor, an acid anhydride, a curing accelerator, an acrylic monomer and a photopolymerization initiator.
【０００５】[0005]
【発明が解決しようとする課題】上記公報記載の接着剤
組成物は、電子部品と実装基板の接着のために、紫外線
の照射と加熱の両方を行う必要があり、このことが製造
工程を増やす原因となっていた。また、紫外線は、接着
すべき電子部品により覆われている部分には照射できな
いため、部分的に未硬化が生じる恐れがあり、硬化の制
御が困難であった。更に、これら公報に記載された接着
剤組成物は、いずれも長い接着時間が必要とされており
（例えば、特開昭６１−１８１８２１号公報の実施例１
では約５時間）、そのため所謂ベアチップを実装基板に
接着する場合に不都合が生じていた。The adhesive composition described in the above publication requires both ultraviolet irradiation and heating for bonding the electronic component and the mounting substrate, which increases the number of manufacturing steps. Was causing it. In addition, since ultraviolet rays cannot be applied to a portion covered with the electronic component to be bonded, there is a possibility that uncuring may partially occur, and it is difficult to control curing. Furthermore, all of the adhesive compositions described in these publications require a long adhesion time (for example, Example 1 of JP-A-61-181821).
5 hours), which causes inconvenience when a so-called bare chip is bonded to a mounting substrate.
【０００６】従って、製造工程の増加の原因となる光重
合開始剤を添加することなく、短時間で硬化すると共に
接着強度の大きい接着剤組成物が求められている。Accordingly, there is a need for an adhesive composition which cures in a short time and has high adhesive strength without adding a photopolymerization initiator which causes an increase in the number of production steps.
【０００７】[0007]
【課題を解決するための手段】上記課題を鑑み、本発明
の発明者等は、従来光重合開始剤と組み合わせて使用さ
れていたトリメチロールプロパントリアクリレートを、
光重合開始剤の非存在下で使用することにより、接着剤
組成物を短時間で硬化させることができることを意外に
も見いだし本発明に至った。In view of the above problems, the inventors of the present invention have developed trimethylolpropane triacrylate which has been used in combination with a photopolymerization initiator.
It has been surprisingly found that the adhesive composition can be cured in a short time by using it in the absence of a photopolymerization initiator, and the present invention has been accomplished.
【０００８】かくして本発明によれば、主接着成分とし
てのトリメチロールプロパントリアクリレートとビスフ
ェノールＦ型エポキシ樹脂前駆体、硬化剤として熱可塑
性樹脂でマイクロカプセル化されたイミダゾール又はそ
の誘導体、及び任意成分としての絶縁性フィラーからな
る熱硬化型電子部品用接着剤組成物が提供される。更
に、本発明によれば、主接着成分としてのトリメチロー
ルプロパントリアクリレートとビスフェノールＦ型エポ
キシ樹脂前駆体、硬化剤として熱可塑性樹脂でマイクロ
カプセル化されたイミダゾール又はその誘導体、ポリメ
タクリル酸メチル及び任意成分としての絶縁性フィラー
からなる熱硬化型電子部品用接着剤組成物が提供され
る。Thus, according to the present invention, trimethylolpropane triacrylate and a bisphenol F type epoxy resin precursor as main adhesive components, imidazole microcapsulated with a thermoplastic resin as a curing agent or a derivative thereof, and optional components The present invention provides a thermosetting electronic component adhesive composition comprising an insulating filler. Further, according to the present invention, trimethylolpropane triacrylate and a bisphenol F type epoxy resin precursor as main adhesive components, imidazole or its derivative microencapsulated with a thermoplastic resin as a curing agent, polymethyl methacrylate and any An adhesive composition for a thermosetting electronic component comprising an insulating filler as a component is provided.
【０００９】[0009]
【発明の実施の形態】まず、本発明の接着剤組成物の主
接着成分としてのビスフェノールＦ型エポキシ樹脂前駆
体としては、公知のビスフェノールＦ型エポキシ樹脂前
駆体をいずれも使用することができる。特に、トリメチ
ロールプロパントリアクリレート（以下、ＴＭＰと称す
る）の熱による反応開始温度（熱硬化温度）がほぼ同じ
ビスフェノールＦ型エポキシ樹脂前駆体を使用すること
が好ましい。本発明において、樹脂前駆体とは、比較的
低分子量の樹脂を意味し、硬化させることにより架橋し
て高分子量の樹脂となるものをいう。BEST MODE FOR CARRYING OUT THE INVENTION First, as a bisphenol F type epoxy resin precursor as a main adhesive component of the adhesive composition of the present invention, any known bisphenol F type epoxy resin precursor can be used. In particular, it is preferable to use a bisphenol F type epoxy resin precursor having substantially the same reaction initiation temperature (thermosetting temperature) as the heat of trimethylolpropane triacrylate (hereinafter, referred to as TMP). In the present invention, the resin precursor means a resin having a relatively low molecular weight, and a resin which is cured to be crosslinked to become a resin having a high molecular weight.
【００１０】次に、硬化剤としてのイミダゾール又はそ
の誘導体としては、上記ビスフェノールＦ型エポキシ樹
脂前駆体及び／又はＴＭＰの硬化に使用されるものであ
れば、特に限定されない。本発明に使用されるイミダゾ
ール又はその誘導体は、熱可塑性樹脂でマイクロカプセ
ル化されている。以下、単にマイクロカプセル型硬化剤
と称する。このマイクロカプセル型硬化剤は、接着時の
加熱で熱可塑性樹脂が溶融することにより、イミダゾー
ル又はその誘導体が接着剤組成物中に分散し、ビスフェ
ノールＦ型エポキシ樹脂前駆体を硬化させることとな
る。ここで、熱可塑性樹脂としては、接着時の加熱によ
り溶融するものであれば特に限定されないが、ポリウレ
タン樹脂、アクリル樹脂等が挙げられる。マイクロカプ
セル型硬化剤の具体例としては、イミダゾール誘導体が
ポリウレタン樹脂でマイクロカプセル化された、旭化成
社製ノバキュアが挙げられる。Next, imidazole or a derivative thereof as a curing agent is not particularly limited as long as it is used for curing the above bisphenol F type epoxy resin precursor and / or TMP. The imidazole or a derivative thereof used in the present invention is microencapsulated with a thermoplastic resin. Hereinafter, it is simply referred to as a microcapsule type curing agent. In the microcapsule-type curing agent, imidazole or a derivative thereof is dispersed in the adhesive composition when the thermoplastic resin is melted by heating at the time of bonding, and the bisphenol F-type epoxy resin precursor is cured. Here, the thermoplastic resin is not particularly limited as long as it is melted by heating at the time of bonding, and examples thereof include a polyurethane resin and an acrylic resin. As a specific example of the microcapsule-type curing agent, NOVACURE manufactured by Asahi Kasei Corporation, in which an imidazole derivative is microencapsulated with a polyurethane resin, may be mentioned.
【００１１】熱可塑性樹脂の被覆方法としては、例え
ば、界面重合法やｉｎ−ｓｉｔｕ重合法により行うこと
ができ、例えば、次のようにして形成することができ
る。即ち、まず、溶剤、熱可塑性樹脂の原料とイミダゾ
ール又はその誘導体からなる油相を形成する。これとは
別に、水に乳化剤を添加して水相を形成する。この水相
に上記の油相を徐々に滴下し、次いでホモジナイザーの
ような攪拌機で油相を分散させてサスペンジョンを形成
する。この後、サスペンジョンに熱や触媒を加えて、イ
ミダゾール又はその誘導体の表面で熱可塑性樹脂の原料
を攪拌しつつ重合させることにより、イミダゾール又は
その誘導体を熱可塑性樹脂で被覆することができる。The thermoplastic resin can be coated by, for example, an interfacial polymerization method or an in-situ polymerization method, and can be formed, for example, as follows. That is, first, an oil phase comprising a solvent, a raw material of a thermoplastic resin, and imidazole or a derivative thereof is formed. Separately, an emulsifier is added to water to form an aqueous phase. The oil phase is gradually dropped into the aqueous phase, and then the oil phase is dispersed with a stirrer such as a homogenizer to form a suspension. Thereafter, heat or a catalyst is added to the suspension, and the raw material of the thermoplastic resin is polymerized with stirring on the surface of the imidazole or the derivative thereof, whereby the imidazole or the derivative thereof can be coated with the thermoplastic resin.
【００１２】次に、任意成分としての絶縁性フィラーと
しては、接着剤組成物に通常含まれるものをいずれも使
用することができ、例えばアルミナ、シリカ等が挙げら
れる。ビスフェノールＦ型エポキシ樹脂前駆体に対する
ＴＭＰの添加割合は、１〜６０重量％の範囲であること
が好ましい。ＴＭＰの添加割合が、１重量％より少ない
場合は、被着体とのぬれ性が不足し、接着強度が低下す
るので好ましくない。６０重量％より多い場合は、接着
強度が低下するので好ましくない。より好ましい添加割
合は５〜５０重量％であり、特に好ましい添加割合は３
０〜５０重量％である。Next, as the insulating filler as an optional component, any one usually contained in an adhesive composition can be used, and examples thereof include alumina and silica. The proportion of TMP added to the bisphenol F type epoxy resin precursor is preferably in the range of 1 to 60% by weight. If the proportion of TMP added is less than 1% by weight, wettability with the adherend is insufficient, and the adhesive strength is undesirably reduced. If the amount is more than 60% by weight, the adhesive strength is undesirably reduced. A more preferable addition ratio is 5 to 50% by weight, and a particularly preferable addition ratio is 3 to 50% by weight.
0 to 50% by weight.
【００１３】次に、マイクロカプセル型硬化剤の添加割
合は、ビスフェノールＦ型エポキシ樹脂前駆体１００重
量部に対して、３０〜７０重量部の範囲であることが好
ましい。マイクロカプセル型硬化剤の添加割合が、３０
重量部より少ない場合は、硬化時間が長くなるので好ま
しくない。一方、７０重量部より多い場合は、未硬化の
硬化剤が残り、その硬化剤により被着体が腐食される恐
れがあるので好ましくない。特に好ましい添加割合は、
４０〜６０重量部である。Next, the addition ratio of the microcapsule type curing agent is preferably in the range of 30 to 70 parts by weight based on 100 parts by weight of the bisphenol F type epoxy resin precursor. When the addition ratio of the microcapsule type curing agent is 30
When the amount is less than the weight part, the curing time is undesirably long. On the other hand, when the amount is more than 70 parts by weight, an uncured curing agent remains and the adherend may be corroded by the curing agent, which is not preferable. A particularly preferred addition ratio is
It is 40 to 60 parts by weight.
【００１４】次いで、絶縁性フィラーの添加割合は、接
着剤組成物全体に対して、２０〜７０重量％の範囲であ
ることが好ましい。絶縁性フィラーの添加割合が、２０
重量％より少ない場合は、熱伝導性が不足するので好ま
しくない。一方、７０重量％より多い場合は、粘度が著
しく上昇するので好ましくない。特に好ましい添加割合
は、２５〜６５重量％である。Next, the proportion of the insulating filler to be added is preferably in the range of 20 to 70% by weight based on the whole adhesive composition. When the addition ratio of the insulating filler is 20
When the amount is less than% by weight, thermal conductivity is insufficient, which is not preferable. On the other hand, when the content is more than 70% by weight, the viscosity is undesirably increased. A particularly desirable addition ratio is 25 to 65% by weight.
【００１５】本発明では、更にポリメタクリル酸メチル
（以下、ＰＭＭと称する）を添加した接着剤組成物が提
供される。ＰＭＭを添加することで、接着剤組成物にリ
ペア性を付与することができる。従って、従来一旦接着
した後に、実装基板から電子部品を剥がすことは困難で
あったため、一部に不良があると全体を廃棄する必要が
あったが、本発明の接着剤組成物には、リペア性が付与
されているため、不良のない実装基板及び電子部品を廃
棄することなく使用することが可能となる。According to the present invention, there is provided an adhesive composition further containing polymethyl methacrylate (hereinafter referred to as PMM). By adding PMM, repairability can be imparted to the adhesive composition. Therefore, conventionally, it was difficult to remove the electronic component from the mounting board after once bonding, and it was necessary to discard the entire component if there was any defect. However, the adhesive composition of the present invention requires a repair. Since the properties are imparted, it is possible to use the mounting board and the electronic component having no defect without discarding.
【００１６】ＰＭＭの添加割合は、接着剤組成物全体に
対して、１０〜５０重量％の範囲であることが好まし
い。ＰＭＭの添加割合が、１０重量％より少ない場合
は、リペアできないので好ましくない。一方、５０重量
％より多い場合は、接着強度が低くなるので好ましくな
い。特に好ましい添加割合は、１０〜２０重量％であ
る。更に、本発明の接着剤組成物には、導電性微粒子を
絶縁性樹脂で被覆したマイクロカプセル型導電フィラー
を添加してもよい。マイクロカプセル型導電フィラーを
添加すれば、接着時に導通を所望する部分に圧力をかけ
ることにより、マイクロカプセルを破壊して導通をとる
ことが可能となる。なお、圧力がかからない部分では、
マイクロカプセルは破壊されないため、絶縁性が保たれ
る。導電性微粒子としては、特に限定されず、銀、金、
銅、ニッケル等の金属、これら金属の合金、グラファイ
ト等が挙げられる。絶縁性樹脂としては、熱硬化性樹脂
を使用することが好ましく、例えばエポキシ樹脂が挙げ
られる。The addition ratio of PMM is preferably in the range of 10 to 50% by weight based on the whole adhesive composition. When the addition ratio of PMM is less than 10% by weight, repair cannot be performed, which is not preferable. On the other hand, if it is more than 50% by weight, the adhesive strength is undesirably low. A particularly desirable addition ratio is 10 to 20% by weight. Further, a microcapsule-type conductive filler in which conductive fine particles are coated with an insulating resin may be added to the adhesive composition of the present invention. When the microcapsule-type conductive filler is added, it is possible to break the microcapsules and to conduct electricity by applying pressure to a portion where conduction is desired at the time of bonding. In the part where pressure is not applied,
Since the microcapsules are not broken, the insulation is maintained. The conductive fine particles are not particularly limited, and may be silver, gold,
Examples thereof include metals such as copper and nickel, alloys of these metals, and graphite. As the insulating resin, it is preferable to use a thermosetting resin, such as an epoxy resin.
【００１７】上記マイクロカプセル型導電フィラー以外
にも、剥離強度や耐衝撃性を高めるためのエラストマ
ー、接着剤の表面硬化性を高めるためのパラフィンワッ
クス、安定性を高めるための酸化防止剤、可塑剤、着色
剤等の添加剤を適宜添加してもよい。以下、本発明の接
着剤組成物を使用した接着方法を説明する。In addition to the above-mentioned microcapsule-type conductive filler, an elastomer for increasing the peel strength and impact resistance, a paraffin wax for increasing the surface curability of the adhesive, an antioxidant for increasing the stability, and a plasticizer An additive such as a coloring agent may be appropriately added. Hereinafter, a bonding method using the adhesive composition of the present invention will be described.
【００１８】まず、本発明の接着剤組成物を電子部品の
接着面及び／又は実装基板の接着面に塗布する。ここ
で、塗布方法は特に限定されず、公知の方法を使用する
ことができる。塗布後、電子部品と実装基板を貼り合わ
せ、必要に応じて加圧しつつ、加熱することにより、Ｔ
ＭＰとビスフェノールＦ型エポキシ樹脂前駆体を熱硬化
させる。ここで加熱（硬化）温度は、１００〜２００℃
が好ましい。本発明の接着剤組成物は、含まれる各成分
の種類、硬化温度により相違するが、５〜３０秒程度の
短時間で硬化させることができる。First, the adhesive composition of the present invention is applied to an adhesive surface of an electronic component and / or an adhesive surface of a mounting substrate. Here, the application method is not particularly limited, and a known method can be used. After the application, the electronic component and the mounting board are bonded together, and heated while being pressurized as necessary, so that T
The MP and the bisphenol F type epoxy resin precursor are thermally cured. Here, the heating (curing) temperature is 100 to 200 ° C.
Is preferred. The adhesive composition of the present invention can be cured in a short time of about 5 to 30 seconds, though it differs depending on the type of each component contained and the curing temperature.
【００１９】更に、ＰＭＭを含む接着剤組成物を使用し
た場合は、１００〜２００℃で加熱すれば、ＰＭＭを溶
融させることができ、その結果、実装基板に接着した電
子部品を剥がすことができる。Further, when an adhesive composition containing PMM is used, the PMM can be melted by heating at 100 to 200 ° C., and as a result, the electronic component adhered to the mounting substrate can be peeled off. .
【００２０】[0020]
【実施例】実施例１ ビスフェノールＦ型エポキシ樹脂前駆体１００ｇ、ＴＭ
Ｐ（０重量％、１重量％、５重量％、１０重量％、２０
重量％、３０重量％、４０重量％、５０重量％、６０重
量％、７０重量％）、イミダゾール誘導体を熱可塑性樹
脂で被膜したマイクロカプセル型硬化剤（旭化成ノバキ
ュア）５０ｇと、これら成分の合計量に対して３０重量
％の粒径５μｍ以下のアルミナ粒子とからなる１０種の
接着剤組成物を２組製造した。Example 1 100 g of bisphenol F type epoxy resin precursor, TM
P (0 wt%, 1 wt%, 5 wt%, 10 wt%, 20 wt%
Wt%, 30 wt%, 40 wt%, 50 wt%, 60 wt%, 70 wt%), 50 g of a microcapsule-type curing agent (Asahi Kasei Novacure) obtained by coating an imidazole derivative with a thermoplastic resin, and the total amount of these components In total, two sets of ten kinds of adhesive compositions comprising 30% by weight of alumina particles having a particle size of 5 μm or less were produced.
【００２１】これら１０種の接着剤組成物を図１に示す
ように、厚さ２ｍｍのガラスエポキシ基板１上に塗布
し、厚さ２ｍｍのガラスエポキシ基板２を貼り合わせこ
とにより、接着強度測定用試料を得た。図１中、参照番
号３は接着剤層を意味する。接着剤層３を１５０℃で硬
化させ、２５℃及び１００℃における接着強度をインス
トロン万能試験機で測定した。得られた結果を表１に示
した。なお、表１中、接着強度の単位はｋｇ／ｃｍ2 と
した。As shown in FIG. 1, these ten kinds of adhesive compositions are applied on a glass epoxy substrate 1 having a thickness of 2 mm, and a glass epoxy substrate 2 having a thickness of 2 mm is adhered to obtain a bonding strength. A sample was obtained. In FIG. 1, reference numeral 3 denotes an adhesive layer. The adhesive layer 3 was cured at 150 ° C., and the adhesive strength at 25 ° C. and 100 ° C. was measured with an Instron universal testing machine. Table 1 shows the obtained results. In Table 1, the unit of the adhesive strength was kg / cm 2 .
【００２２】[0022]
【表１】 [Table 1]
【００２３】接着剤組成物は、硬化後の接着強度が約１
００ｋｇ／ｃｍ2 以上であることが接着の信頼性を確保
する観点から好ましいことが経験的に知られているた
め、この観点から表１について考察する。２５℃で硬化
させた場合、ＴＭＰの添加割合は１〜６０重量％が好ま
しいことが判った。また、１００℃で硬化させた場合、
ＴＭＰの添加割合は５〜５０重量％が好ましいことが判
った。なお、ＴＭＰの添加割合と接着強度とが比例関係
でないのは、ＴＭＰが被着体（ガラスエポキシ基板）と
の濡れ性を向上させる役割をしているためである。The adhesive composition has an adhesive strength after curing of about 1
Since it is empirically known that a pressure of 00 kg / cm 2 or more is preferable from the viewpoint of securing the bonding reliability, Table 1 will be considered from this viewpoint. When cured at 25 ° C., it was found that the addition ratio of TMP is preferably 1 to 60% by weight. When cured at 100 ° C,
It turned out that the addition ratio of TMP is preferably 5 to 50% by weight. The reason why the proportion of TMP added is not proportional to the adhesive strength is that TMP plays a role in improving the wettability with the adherend (glass epoxy substrate).
【００２４】実施例２ 以下の条件でチップ（電子部品）とガラスエポキシ基板
（実装基板）とを接着した。接着剤組成物として、実施
例１のＴＭＰの添加割合が０重量％と４０重量％の場合
の２種類使用した。ガラスエポキシ基板には、２００μ
ｍ角の電極パッドを、間隔１００μｍで１２８ピン形成
した。一方、チップには、２００μｍ角の電極パッド
を、間隔１００μｍで１２８ピン形成した。ガラスエポ
キシ基板に接着剤組成物を塗布し、チップ側を１７５℃
で加熱しつつ、１０ｇ／電極パッドの加圧下で、３０秒
間保持することにより、チップとガラスエポキシ基板と
を接着した。Example 2 A chip (electronic component) and a glass epoxy substrate (mounting substrate) were bonded under the following conditions. Two types of adhesive compositions were used in the case where the addition ratio of TMP in Example 1 was 0% by weight and 40% by weight. 200μ on glass epoxy board
128 pins of m-square electrode pads were formed at an interval of 100 μm. On the other hand, on the chip, 128 pins of 200 μm square electrode pads were formed at an interval of 100 μm. Apply the adhesive composition to the glass epoxy substrate and set the chip side to 175 ° C.
The chip and the glass epoxy substrate were adhered by holding for 30 seconds under the pressure of 10 g / electrode pad while heating with.
【００２５】上記接着されたチップとガラスエポキシ基
板を−５５℃の冷却及び１２５℃の加熱を１サイクルと
し、これを１０００サイクル繰り返すと共に、サイクル
中に導通確認試験を実施した。導通確認試験の結果、Ｔ
ＭＰの添加割合が０重量％の接着剤組成物は、５サイク
ル目でチップとガラスエポキシ基板の電極パッド間に導
通不良が発生した。これに対して、ＴＭＰの添加割合が
４０重量％の接着剤組成物を使用した場合、電極パッド
間の接着初期の接続抵抗値と比較した１０００サイクル
終了後の接続抵抗値の変化率は５％以下であった。この
結果から明らかなように、接着剤組成物がＴＭＰを含む
ことにより、接着強度が上がり、接着の信頼性を向上さ
せることができた。The bonded chip and the glass epoxy substrate were cooled at -55 ° C. and heated at 125 ° C. as one cycle, and this cycle was repeated 1000 times, and a conduction test was performed during the cycle. As a result of the continuity check test, T
In the case of the adhesive composition containing 0% by weight of MP, conduction failure occurred between the chip and the electrode pad of the glass epoxy substrate at the fifth cycle. On the other hand, when an adhesive composition containing 40% by weight of TMP was used, the rate of change of the connection resistance after 1000 cycles compared to the connection resistance at the initial stage of bonding between the electrode pads was 5%. It was below. As is clear from these results, when the adhesive composition contained TMP, the adhesive strength was increased, and the reliability of the adhesive could be improved.
【００２６】実施例３ ビスフェノールＦ型エポキシ樹脂前駆体１００ｇ、ＴＭ
Ｐ（３０重量％、４０重量％、５０重量％）、イミダゾ
ール誘導体を熱可塑性樹脂で被膜したマイクロカプセル
型硬化剤（旭化成ノバキュア）５０ｇと、これら成分の
合計量に対して３０重量％の粒径５μｍ以下のアルミナ
粒子、ＰＭＭ（０重量％、１０重量％、２０重量％、３
０重量％、４０重量％、５０重量％、６０重量％、７０
重量％）とからなる２４種の接着剤組成物を２組製造し
た。Example 3 Bisphenol F type epoxy resin precursor 100 g, TM
P (30% by weight, 40% by weight, 50% by weight), 50 g of a microcapsule-type curing agent (Asahi Kasei Novacure) in which an imidazole derivative is coated with a thermoplastic resin, and a particle size of 30% by weight based on the total amount of these components 5 μm or less alumina particles, PMM (0 wt%, 10 wt%, 20 wt%, 3 wt%
0%, 40%, 50%, 60%, 70%
% By weight) were prepared in two sets.
【００２７】これら２４種の接着剤組成物を図１に示す
ように、厚さ２ｍｍのガラスエポキシ基板１上に塗布
し、厚さ２ｍｍのガラスエポキシ基板２を貼り合わせ
た。接着剤層３を１５０℃で硬化させ、２５℃及び１０
０℃における接着強度をインストロン万能試験機で測定
した。得られた結果を表２〜４に示した。なお、表２〜
４中、接着強度の単位はｋｇ／ｃｍ2 とした。また、リ
ペア性は、キシレンにより拭き取り可能かどうかにより
判断した。As shown in FIG. 1, these 24 kinds of adhesive compositions were applied on a glass epoxy substrate 1 having a thickness of 2 mm, and a glass epoxy substrate 2 having a thickness of 2 mm was bonded. The adhesive layer 3 is cured at 150 ° C.
The adhesive strength at 0 ° C. was measured with an Instron universal testing machine. The obtained results are shown in Tables 2 to 4. Table 2
In 4, the unit of the adhesive strength was kg / cm 2 . The repairability was determined based on whether or not wiping was possible with xylene.
【００２８】[0028]
【表２】 [Table 2]
【００２９】[0029]
【表３】 [Table 3]
【００３０】[0030]
【表４】 [Table 4]
【００３１】接着剤組成物は、硬化後の接着強度が約１
００ｋｇ／ｃｍ2 以上であることが接着の信頼性を確保
する観点から好ましいことが経験的に知られているた
め、この観点から表２〜４について考察する。２５℃及
び１００℃で硬化させた場合のいずれも、ＴＭＰの添加
割合が３０〜５０重量％のとき、ＰＭＭの添加割合が１
０〜５０重量％が好ましいことが判った。また、リペア
性の観点からも、前記添加割合が好ましいことが判っ
た。The adhesive composition has an adhesive strength after curing of about 1
Since it is empirically known that a pressure of at least 00 kg / cm 2 is preferable from the viewpoint of ensuring the reliability of adhesion, Tables 2 to 4 will be considered from this viewpoint. In both cases of curing at 25 ° C. and 100 ° C., when the addition ratio of TMP is 30 to 50% by weight, the addition ratio of PMM is 1
It has been found that 0 to 50% by weight is preferable. Also, from the viewpoint of repairability, it was found that the addition ratio was preferable.
【００３２】実施例４ 接着剤組成物として、ＴＭＰとＰＭＭをそれぞれ４０重
量％の添加割合で含む実施例３の接着剤組成物を使用し
た。この接着剤組成物を使用すること以外は、実施例２
と同様にして、導通確認試験を行った。導通確認試験の
結果、電極パッド間の接着初期の接続抵抗値と比較した
１０００サイクル終了後の接続抵抗値の変化率は５％以
下であった。この結果から明らかなように、接着剤組成
物がＴＭＰを含むことにより、接着強度が上がり、接着
の信頼性を向上させることができた。Example 4 As the adhesive composition, the adhesive composition of Example 3 containing TMP and PMM at an addition ratio of 40% by weight, respectively was used. Example 2 except that this adhesive composition was used.
A continuity confirmation test was performed in the same manner as described above. As a result of the conduction confirmation test, the change rate of the connection resistance value after the completion of 1000 cycles was 5% or less compared to the connection resistance value at the initial stage of bonding between the electrode pads. As is clear from these results, when the adhesive composition contained TMP, the adhesive strength was increased, and the reliability of the adhesive could be improved.
【００３３】更に、ガラスエポキシ基板１と２及び接着
剤層３を１５０℃に加熱し、トルクをかけたところ、容
易にガラスエポキシ基板１と２を剥がすことができた。
従って、本発明の接着剤組成物が、その硬化後、容易に
リペアできることが確認できた。Further, when the glass epoxy substrates 1 and 2 and the adhesive layer 3 were heated to 150 ° C. and a torque was applied, the glass epoxy substrates 1 and 2 could be easily peeled off.
Therefore, it was confirmed that the adhesive composition of the present invention can be easily repaired after curing.
【００３４】[0034]
【発明の効果】本発明の接着剤組成物を電子部品と実装
基板との接着に使用すれば、接着剤組成物を短時間で硬
化させることができる共に大きな接着強度を得ることが
できる。更に、ＰＭＭを含む本発明の接着剤組成物を接
着に使用すれば、上記効果に加えて、接着剤組成物の硬
化後のリペア性も向上させることができる。When the adhesive composition of the present invention is used for bonding an electronic component and a mounting board, the adhesive composition can be cured in a short time and a large adhesive strength can be obtained. Furthermore, if the adhesive composition of the present invention containing PMM is used for bonding, in addition to the above-mentioned effects, repairability of the adhesive composition after curing can be improved.
【図１】接着強度測定用試料の概略斜視図である。FIG. 1 is a schematic perspective view of a sample for measuring adhesive strength.
１、２ ガラスエポキシ基板 ３ 接着剤層 1, 2 glass epoxy board 3 adhesive layer
フロントページの続き (72)発明者 伊達 仁昭 神奈川県川崎市中原区上小田中４丁目１番 １号 富士通株式会社内 (72)発明者 今泉 延弘 神奈川県川崎市中原区上小田中４丁目１番 １号 富士通株式会社内 (72)発明者 徳平 英士 神奈川県川崎市中原区上小田中４丁目１番 １号 富士通株式会社内Continuation of the front page (72) Inventor Hitoshi Date 4-1-1, Kamidadanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Inside Fujitsu Limited (72) Inventor Nobuhiro Imaizumi 4-1-1, Kamiodanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture No. Fujitsu Limited (72) Inventor Eiji Tokuhira 4-1-1, Kamidadanaka, Nakahara-ku, Kawasaki City, Kanagawa Prefecture Fujitsu Limited
Claims (2)
パントリアクリレートとビスフェノールＦ型エポキシ樹
脂前駆体、硬化剤として熱可塑性樹脂でマイクロカプセ
ル化されたイミダゾール又はその誘導体、及び任意成分
としての絶縁性フィラーからなる熱硬化型電子部品用接
着剤組成物。1. Trimethylolpropane triacrylate and bisphenol F type epoxy resin precursor as main adhesive components, imidazole or its derivative microencapsulated with a thermoplastic resin as a curing agent, and insulating filler as an optional component Thermosetting adhesive composition for electronic parts.
パントリアクリレートとビスフェノールＦ型エポキシ樹
脂前駆体、硬化剤として熱可塑性樹脂でマイクロカプセ
ル化されたイミダゾール又はその誘導体、ポリメタクリ
ル酸メチル及び任意成分としての絶縁性フィラーからな
る熱硬化型電子部品用接着剤組成物。2. Trimethylolpropane triacrylate and a bisphenol F type epoxy resin precursor as main adhesive components, imidazole or its derivative microencapsulated with a thermoplastic resin as a curing agent, polymethyl methacrylate and an optional component An adhesive composition for a thermosetting electronic component comprising an insulating filler.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33576897A JP3449904B2 (en) | 1997-12-05 | 1997-12-05 | Adhesive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33576897A JP3449904B2 (en) | 1997-12-05 | 1997-12-05 | Adhesive composition |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11166169A true JPH11166169A (en) | 1999-06-22 |
| JP3449904B2 JP3449904B2 (en) | 2003-09-22 |
Family
ID=18292247
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33576897A Expired - Fee Related JP3449904B2 (en) | 1997-12-05 | 1997-12-05 | Adhesive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3449904B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001072921A1 (en) * | 2000-03-28 | 2001-10-04 | Fujitsu Limited | Adhesive composition |
| JP2002121533A (en) * | 2000-10-11 | 2002-04-26 | Ricoh Co Ltd | Heat-sensitive pressure-sensitive adhesive material |
-
1997
- 1997-12-05 JP JP33576897A patent/JP3449904B2/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2001072921A1 (en) * | 2000-03-28 | 2001-10-04 | Fujitsu Limited | Adhesive composition |
| US6790881B2 (en) | 2000-03-28 | 2004-09-14 | Fujitsu Limited | Adhesive composition |
| JP2002121533A (en) * | 2000-10-11 | 2002-04-26 | Ricoh Co Ltd | Heat-sensitive pressure-sensitive adhesive material |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3449904B2 (en) | 2003-09-22 |
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