JPH11163041A - Manufacture of semiconductor integrated circuit device and bonder used therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a carrier from the lateral deviation with reduced bonding time. SOLUTION: In the bonder 20 for bonding a chip 12 to designated position on a tape carrier 2 being carried with rollers R1-R6, these rollers are instantaneously opened/closed to eliminate lateral deviation owing to recovery force of the tape carrier 2. The carrier 2 is fed to form alternately slacks between the rollers R2, R3 and between the rollers R4, R5 and then alternately eliminate the formed slacks. The tape carrier may be fed fast to eliminate the slacks, and hence the total carrying time can be reduced to ensure a long bonding time. A chip 12 is fed to a position off from a designated point on the carrier 2, the electrode pad position on the chip is recognized to correct the position and the chip 12 is set again to the very designated point, thus accurately bonding the chip to the carrier quickly.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a technique for manufacturing a semiconductor integrated circuit device (hereinafter, referred to as an IC), and more particularly, to a semiconductor chip (chip of semiconductor, active element, passive element, and an electric element for these elements). A chip in which an integrated circuit including a circuit to be connected is built. A chip is hereinafter referred to as a carrier.
r) Mechanical bonding (bond. Mechanical connection that is not in close contact with the force of the atomic force. Hereafter referred to as bonding). Regarding bonding technology, for example, a chip having a size equal to or substantially equal to the size of the chip. The present invention relates to an IC that is effective for a method of manufacturing an IC having a size package (chip size package or chip scale package, hereinafter referred to as CSP).

[0002]

2. Description of the Related Art As electronic devices using ICs have become smaller and thinner, there has been a demand for smaller IC packages. Various CSPs have been developed to meet this demand,
As an example, a micro
Ball grid array package (micro ball gri
d array package. Hereinafter, it is referred to as μBGA. ).
That is, a tape carrier is insulated on the main surface of the chip on the side of the electrode (electrode: a conductive component for extracting an electrical function from a specific region of the component and electrically connecting to other components. Materials (insulating materia)
Is used to form a bond, and each inner lead laid on the tape carrier is electrically connected to each electrode pad of the chip (bond. Make sure
Or, connection is made to equalize the potential, and each outer lead is connected to a bump (bum) as each external terminal.
p) are each soldered.

As a bonding method in the μBGA, it is conceivable to apply a bonding method in which a carrier formed in a tape shape is moved in one direction and chips are sequentially bonded to designated positions of the carrier.

As a conventional bonding method of this type, there is an inner lead bonding (inner lead bending) in a method of manufacturing a TCP · IC (tape career package IC).
onding) methods are known. In this inner lead bonding method, a carrier is fed out from a supply side reel, passed through a tension roller and a guide roller, and transported to a bonding position. At this bonding position, the inner lead bonding (leading of TCP / IC) between the carrier lead and the chip is performed. In the manufacturing method, mechanical and electrical connection are performed).

[0005] As an example describing the inner lead bonding method and apparatus, there is Japanese Patent Application Laid-Open Publication No. 3-58440.

[0006]

However, in the above-mentioned bonding method, when the thickness of the carrier is reduced, it is difficult to carry out positioning by sprocket or pin insertion.
) May be deformed or damaged, so that there is a problem that reliable transport and accurate positioning are impossible.

[0007] Therefore, it has been proposed to adopt a transport technique using a friction driving force of a friction roller for transporting a carrier. However, the transport technique using the friction driving force has a problem that the carrier is likely to be displaced in the width direction (hereinafter, referred to as a lateral displacement), that is, to be easily deflected or meandered.

As an example describing a transport technique for preventing such a displacement of the carrier, there is JP-A-5-241247. That is, the film transport mechanism described here is configured to return the film to the reference position by moving the transport unit when the lateral displacement of the film is detected.

However, in the above-mentioned bonding method in which the pitch of the bonding position of the chip on the carrier is small, the bonding time is extremely short, so that the technique of preventing the carrier from returning to the reference position by the transport unit cannot be adopted.

An object of the present invention is to provide a bonding technique capable of preventing a lateral shift of a carrier while avoiding an increase in bonding time.

An object of the present invention is to provide a bonding technique capable of shortening a bonding time.

An object of the present invention is to provide a bonding technique capable of accurately bonding a chip to a specified position on a carrier.

The above and other objects and novel features of the present invention will become apparent from the description of the present specification and the accompanying drawings.

[0014]

The outline of a typical invention among the inventions disclosed in the present application is as follows.

That is, in a bonding apparatus in which a carrier formed in a tape shape is conveyed by a friction roller and a semiconductor chip is bonded to a designated position of the carrier, the friction roller is instantaneously opened and closed so that the carrier of the carrier is opened. It is characterized in that lateral displacement is eliminated.

In a bonding apparatus in which a carrier formed in a tape shape is conveyed by a friction roller and a semiconductor chip is bonded to a designated position of the carrier, a stage for bonding the semiconductor chip to the carrier is provided. The slack is formed alternately on the upstream side and the downstream side by the feed of the carrier, and both slacks are alternately eliminated by the feed of the carrier.

In a bonding apparatus for bonding a semiconductor chip to a specified position of a carrier, after the semiconductor chip is displaced by a predetermined value from the specified position of the carrier, It is characterized by being relocated to a designated position and bonded.

According to the first means, the lateral displacement of the carrier is eliminated by the restoring force of the carrier itself, so that it is possible to prevent the lateral displacement of the carrier while avoiding an increase in the bonding time.

According to the above-mentioned second means, the carrier can be sent quickly while the slack formed alternately is eliminated, so that the overall carrier transport time is set short and the long bonding time is reduced. Can be secured.

According to the third means, since the semiconductor chip can be observed by arranging the semiconductor chip at a position where it can be easily recognized, the semiconductor chip is accurately bonded to the specified position of the carrier. be able to.

Other typical aspects of the invention disclosed in the present application will be described as follows.

1. In a method for manufacturing a semiconductor integrated circuit device, wherein a carrier formed in a tape shape is transported by a friction roller and a semiconductor chip is bonded to a specified position of the carrier, the friction roller is instantaneously opened and closed. The method of manufacturing a semiconductor integrated circuit device according to claim 1, wherein the lateral displacement of the carrier is eliminated.

2. 2. The method for manufacturing a semiconductor integrated circuit device according to claim 1, wherein the instantaneous opening and closing of the friction roller is performed in sections with respect to the carrier.

3. 3. The semiconductor integrated circuit according to claim 1, wherein the instantaneous opening and closing of the friction roller is performed separately on an upstream side and a downstream side of a stage where the semiconductor chip is bonded to the carrier. A method for manufacturing a circuit device.

4. In a bonding apparatus in which a carrier formed in a tape shape is transported by a friction roller and a semiconductor chip is bonded to a designated position of the carrier, the friction roller is momentarily opened and closed to eliminate lateral displacement of the carrier. A bonding apparatus.

[5] A plurality of sets of the friction rollers are arranged at intervals in the transport direction of the carrier, and instantaneous opening and closing of the friction rollers are simultaneously performed between adjacent friction rollers. 3. The bonding apparatus according to claim 1.

6. A plurality of sets of the friction rollers are arranged at intervals in the transport direction of the carrier, and the instantaneous opening and closing of the friction rollers is performed on an upstream side and a downstream side of a stage where the semiconductor chip is bonded to the carrier. Item 6. The bonding device according to item 4 or 5, wherein the bonding device is implemented separately from the side.

7. A method of manufacturing a semiconductor integrated circuit device, comprising a bonding step in which a carrier formed in a tape shape is transported by a friction roller and a semiconductor chip is bonded to a specified position of the carrier, wherein the semiconductor chip is mounted on the carrier. Wherein the slack is formed alternately on the upstream side and the downstream side of the stage to which the bonding is performed by the feed of the carrier, and both slacks are alternately eliminated by the feed of the carrier. Method.

8. 8. The method for manufacturing a semiconductor integrated circuit device according to claim 7, wherein the chip is bonded to the carrier during a period in which the slack on the upstream side is formed.

9. 9. The method for manufacturing a semiconductor integrated circuit device according to item 7 or 8, wherein the height of the slack is regulated.

10. In a bonding apparatus in which a carrier formed in a tape shape is transported by a friction roller and a semiconductor chip is bonded to a specified position of the carrier, an upstream side and a downstream side of a stage where the semiconductor chip is bonded to the carrier. The bonding apparatus is characterized in that slacks are formed alternately by feeding the carrier, and both slacks are alternately eliminated by feeding the carrier.

11. 11. The bonding apparatus according to claim 10, wherein the chip is bonded to the carrier during a period in which the slack on the upstream side is formed.

12. Item 12. The bonding apparatus according to item 10 or 11, wherein a height of the slack is regulated.

13. A method of manufacturing a semiconductor integrated circuit device, comprising a bonding step in which a carrier formed in a tape shape is transported by a friction roller and a semiconductor chip is bonded to a specified position of the carrier,
The lateral displacement of the carrier is eliminated by the instantaneous opening and closing of the friction roller, and the slack on the upstream side and the downstream side of the stage on which the semiconductor chip is bonded to the carrier is alternately caused by the feeding of the carrier. The method for manufacturing a semiconductor integrated circuit device, wherein the slacks are formed and both slacks are alternately eliminated by feeding the carrier.

14. 14. The method of manufacturing a semiconductor integrated circuit device according to claim 13, wherein the friction roller is momentarily opened and closed during the period in which the slack is formed.

15. In a bonding apparatus in which a carrier formed in a tape shape is transported by a friction roller and a semiconductor chip is bonded to a designated position of the carrier, the friction roller is momentarily opened and closed to eliminate lateral displacement of the carrier. A slack is formed alternately on the upstream side and the downstream side of the stage where the semiconductor chip is bonded to the carrier by feeding the carrier, and both slacks are alternately eliminated by feeding the carrier. Bonding equipment.

16. 16. The bonding apparatus according to claim 15, wherein the friction roller is momentarily opened and closed during the period in which the slack is formed.

17. In a method of manufacturing a semiconductor integrated circuit device including a bonding step of bonding a semiconductor chip to a specified position of a carrier, the semiconductor chip is shifted by a preset value with respect to the specified position of the carrier. A semiconductor integrated circuit device, wherein the semiconductor integrated circuit device is placed again at a designated position and then bonded.

18. When the rearrangement is performed, the position of the semiconductor chip shifted and disposed is measured to determine an error, and the semiconductor chip is rearranged at a designated position so that the determined error is eliminated. Item 18. The method for manufacturing a semiconductor integrated circuit device according to Item 17.

19. In a bonding apparatus in which a semiconductor chip is bonded to a specified position of a carrier, after the semiconductor chip is arranged by being shifted by a predetermined value with respect to the specified position of the carrier, the semiconductor chip is moved to a specified position. A bonding apparatus, wherein the bonding apparatus is repositioned and bonded.

20. When the rearrangement is performed, the position of the semiconductor chip shifted and disposed is measured to determine an error, and the semiconductor chip is rearranged at a designated position so that the determined error is eliminated. 20. The bonding apparatus according to item 19, wherein

[0042]

FIG. 1 is a perspective view showing a bonding portion of a bonding apparatus according to an embodiment of the present invention. FIG. 2 is a partially cut front view thereof. FIG. 3 is a plan view thereof. FIG. 4 is a side sectional view thereof. FIG. 5 is a front view showing the entire bonding apparatus according to one embodiment of the present invention. FIG. 6 is a plan view thereof. FIG. 7 is a partially omitted plan view showing the tape carrier with a bond. FIG. 8A is a partially cut front view, and FIG. 8B is a partially cut side view. 9A and 9B show a chip, wherein FIG. 9A is a plan view, FIG. 9B is a partially cut front view, and FIG. 9C is an enlarged partially cut side view. FIG. 10 is a partially omitted plan view showing the state after bonding, and FIG. 11 also shows the state after bonding. (A) is a partially cut front view, and (b) is a partially cut side view. FIG. 12 is an explanatory view showing an operation of supplying a tape carrier with a bond to a stage by a group of rollers. FIG. 13 is an explanatory view showing the alignment between the bonded portion and the chip. FIG. 14 is a front sectional view showing the manufactured μBGA · IC.

In the present embodiment, the method for manufacturing a semiconductor integrated circuit device according to the present invention is configured as a method for manufacturing a μBGA IC, and the bonding step, which is the main step, is shown in FIGS. Is performed by the bonding apparatus.

In the method of manufacturing the μBGA · IC, the tape carrier 1 with the bond wound on a reel is supplied to a bonding apparatus for performing the bonding method. That is, the tape carrier with bond 1 as one of the works in the bonding apparatus is shown in FIGS.
And supplied to the bonding apparatus in a state of being wound on a reel. The bonded tape carrier 1 includes a tape carrier 2 and a bond 10. The tape carrier 2 corresponds to a TAB (tape automated tape) tape used in a method of manufacturing a TCP / IC. Since the tape carrier 2 is configured such that the same pattern is repeated in the longitudinal direction,
The description and illustration of the configuration is made for only one unit.

The tape carrier 2 has a carrier body 3, and the carrier body 3 has an insulating property (in
The same pattern is integrally formed into a tape shape continuous in the longitudinal direction using a resin having high sulation performance. A large number of perforations 3A regularly arranged are arranged at both ends of the carrier body 3 and arranged at equal intervals in the length direction, and each perforation 3A is formed in a square hole shape. . Bump forming parts 4 are arranged in a row in the carrier body 3 in the longitudinal direction. A large number of bump holes 5 are drilled in the bump forming section 4 in alignment on four parallel lines. In each bump hole 5, a bump is formed so as to be electrically connected to the outer lead in a later step. A window hole 6 formed in a long hole shape is formed on the center line of the bump forming portion 4.
Are opened in parallel with the rows of the bump holes 5. Further, four long holes 6A for assisting the cutting are formed in the outer peripheral portion of the bump forming portion 4 in a rectangular frame shape.

A plurality of inner leads 7 are wired on one main surface (hereinafter, referred to as a lower surface) of the carrier body 3 so as to protrude into the window 6 in the lateral direction. At one end (hereinafter, referred to as an outer end) of each of the inner leads 7 located on the side of the bump forming portion 4, each of the outer leads 8 is connected in series, and the inner leads 7 are connected in series.
The outer lead 8 is mechanically and electrically integrated with the outer lead 8. The portion of each outer lead 8 facing the bump hole 5 is exposed from the bump forming portion 4, and the outer end of each outer lead 8 extends to the outside of the elongated hole 6A. The group of inner leads 7 and the group of outer leads 8 are formed using a conductive material such as copper or gold. As a method of forming the inner lead 7 group and the outer lead 8 group, a copper foil fixed to the carrier main body 3 by means of adhesion (adhesion; a state in which two surfaces are bonded by chemical or physical force or both) is used. And a method of patterning gold foil by lithography and etching, and a method of selectively plating gold on the carrier body 3 by lithography.

The inner leads 7 are wired in parallel with each other at intervals in the longitudinal direction of each window hole 6. The portion of each inner lead 7 projecting into the window hole 6 is cut at a position straddling the center line of the window hole 6. That is, the length of the portion of the inner lead 7 protruding into the window hole 6 is set shorter than the width of the window hole 6 and longer than half the width.

A bond 10 made of an elastomer or silicone rubber is adhered to the lower surface of the carrier body 3, and the inner leads 7 and the outer leads 8 are covered with the bond 10. At a portion of the bond 10 facing the window hole 6 of the carrier body 3, a rectangular hole-shaped window hole 11 is formed slightly larger than the window hole 6 of the carrier body 3 so as to expose the inner leads 7 to the outside. ing. Therefore, the bonded tape carrier 1 is a carrier body 3,
Inner lead 7 group, outer lead 8 group and bond 10
It is constituted by.

The chip 12 is formed in the shape of a rectangular flat plate as shown in FIG. 9, and has an active element or a passive element, 2. Description of the Related Art A desired semiconductor integrated circuit including a circuit to be electrically connected has been manufactured. That is, chip 1
2 has a large number of semiconductor elements arranged in a matrix, and is a semiconductor wafer (wafer of semicondu
ctor. Hereinafter, it is called a wafer. In this state, a semiconductor integrated circuit is built on the active area side. The surface on the active area side of each chip 12 is covered with a passivation film 13, and the passivation film (passivat
ion film) 13 formed through holes (through ha)
In ll), the electrode pad 14 is formed so as to be exposed to the outside. A plurality of electrode pads 14 are formed and correspond to the respective inner leads 7 of the tape carrier 2.

As shown in FIG. 1, the main surface of the wafer 15 opposite to the active area side has a wafer sheet 1
6 is attached, and a wafer ring 17 is attached to an outer peripheral portion of the wafer sheet 16. In a state where the wafer sheet 16 is stuck, the wafer 15 is cut into a rectangular flat plate shape along a scribing line in a dicing process, and a state in which many chips 12 are manufactured is obtained. Since the divided chips 12 have the wafer sheet 16 attached to the wafer 15, they do not fall apart. The group of chips 12 is supplied to the pickup device 50 of the bonding device 20 while being held by the wafer sheet 16 and the wafer ring 17.

By the way, as shown in FIGS. 10 and 11, after the bonding operation is performed, the chip 12 is mechanically connected (bonded) to the tape carrier 2. That is, the chip 12 is bonded to the tape carrier 2 at the boundary between the passivation film 13 and the bond 10 in a state where the respective electrode pads 14 are arranged so as to face the respective inner leads 7. In this state, the inner lead 7 faces the electrode pad 14 at a position separated upward by the thickness of the bond 10, and the tip of the inner lead 7 is
4 is located directly above.

As shown in FIGS. 5 and 6, the bonding apparatus 20 has a loading reel 21 and an unloading reel 22 for transporting the tape carrier 1 with bonds at both left and right ends. The tape carrier 1 is stretched between a loading reel 21 and an unloading reel 22. Spacer tape take-up reel 2 is located below loading reel 21.
3 is supported, and the spacer tape take-up reel 23
Is the loading reel 21 with the bonded tape carrier 1
Is wound up. A spacer tape pay-out reel 25 is supported below the unloading reel 22.
The spacer tape payout reel 25 is configured so that the spacer tape 26 is paid out when the unloading reel 22 winds up the bonded tape carrier 1.

A pre-bake furnace 27 having a plurality of rollers 28 is provided downstream of the loading reel 21. The tape carrier with bond 1 passes through the pre-bake furnace 27 and is set at the center of the bonding apparatus 20. It is supplied to a bonding stage (hereinafter, referred to as a stage) 31. When passing through the pre-baking furnace 27, the insulating layer 10 of the tape carrier with bond 1 is heated to a predetermined temperature (about 150 ° C.) to evaporate water. An afterbake furnace 29 having a plurality of rollers 30 is provided upstream of the unloading reel 22. The tape carrier with bond 1 having passed through the stage 31 passes through the afterbake furnace 29 and is wound on the unloading reel 22. It is supposed to be. When passing through the after-bake furnace 29, the adhesive layer of the bond 10 to which the chip 12 of the bonded tape carrier 1 has been bonded is cured by being heated to a predetermined temperature (about 250 ° C.).

As shown in detail in FIGS. 1 to 4, both ends (hereinafter, referred to as front and rear sides) of the tape carrier with bond 1 on a stage 31 set at the center of the bonding apparatus 20. A pair of guide rails 32, 32 are laid horizontally in the front and rear in parallel with the left-right direction. The tape carrier with bond 1 is horizontally guided with both ends of the carrier body 3 on which the perforations 3A are arranged so as to be slidable by the two guide rails 32, 32, and is unloaded from the loading reel 21 side. The paper is sent in the direction of the loading reel 22.

A first roller R is provided on both left and right sides of the stage 31.
1, second roller R2, third roller R3, fourth roller R
4. The fifth roller R5 and the sixth roller R6 are in the stage 3
1 are arranged substantially symmetrically with respect to the center. However,
As shown in FIG. 6, the first roller R1 is disposed upstream of the pre-bake furnace 27, and the sixth roller R6 is disposed downstream of the after-bake furnace 29. The rollers R1 to R6 are constituted by a pair of upper and lower rollers, and the pair of upper and lower rollers are constituted as friction rollers which convey the bonded tape carrier 1 from above and below by a friction driving force. In addition, each roller is divided into front and rear portions, and is arranged on the front and rear guide rails 32, 32, respectively, so as to contact and transport both ends of the tape carrier 1 with a bond. In other words, the divided front and rear rollers are configured to be able to transport the bonded tape carrier 1 in a state where they do not interfere with the bond 10 and the chip 12 arranged at the center of the bonded tape carrier 1.

As shown in FIG. 2, the stage 31
Lower roller R3a of the third roller R3 arranged on the left side of
Is supported so as to be rotatable in contact with the lower surfaces of both ends of the carrier body 3, and a belt R3c driven by a motor R3b is wound therearound. The upper roller R3d of the third roller R3 is disposed so as to sandwich the carrier body 3 in cooperation with the lower roller R3a, and the upper roller R3d can swing the other end in the vertical direction by a pin R3e. The arm R3f is supported so as to be rotatable at one end thereof.
A spring R is provided at a position near the pin R3e of the arm R3f.
3g is attached so as to push down the arm R3f, and an electromagnetic plunger R3h is attached at a position closer to the upper roller R3d than the spring R3g of the arm R3f so as to move the arm R3f up and down.

The lower roller R5a of the fifth roller R5 disposed on the right side of the fourth roller R4 on the right side of the stage 31 is:
The carrier R3 is supported so as to be rotatable in contact with the lower surfaces of both ends of the carrier body 3, and a belt R5c driven by a motor R5b is wound therearound. The upper roller R5d of the fifth roller R5 is disposed so as to sandwich the carrier body 3 in cooperation with the lower roller R5a, and the upper roller R5d can swing the other end in the vertical direction by a pin R5e. The arm R5f is supported so as to be rotatable at one end thereof. A spring R5g is located on the arm R5f near the pin R5e.
Is mounted so as to push down the arm R5f, and an electromagnetic plunger R5h is mounted at a position closer to the upper roller R5d than the spring R5g of the arm R5f so as to move the arm R5f up and down.

A first sensor S1 for detecting a slack formed between the second roller R2 and the third roller R3 is disposed between the second roller R2 and the third roller R3.
A fourth roller R4 is provided between the roller R4 and the fifth roller R5.
A second sensor S2 for detecting a slack formed between the second roller S5 and the fifth roller R5 is provided.

The first roller R1, the second roller R2, and the fourth roller R are not limited to the third roller R3 and the fifth roller R5.
The fourth and sixth rollers R6 are also configured to be driven forward and reverse by a motor. Then, the first roller R1
The motor of the sixth roller R6, the control unit of the electromagnetic plunger, the first sensor S1, and the second sensor S2 are connected to communicate with the main controller 47. As described later, the main controller 47 is connected to the first roller R1. ~ 6th
The roller R6 is controlled as shown in FIG.

At the place where the stage 31 of the bonding apparatus 20 is set, the lower presser 33 is provided so as to be moved up and down by an elevating device, and the lower presser 33 moves the outer region of the bond 10 in the carrier body 3. It is formed in a rectangular frame shape to hold down. Right above the lower holder 33, there is provided an upper holder 34 formed in the same rectangular frame shape as the lower holder 33, and the upper holder 34 is reciprocated vertically by a rotary actuator 35. Supported. The upper retainer 34 moves downward and presses the periphery of the chip 12 in the bonded tape carrier 1 against the lower retainer 33, thereby fixing the bonded tape carrier 1 to the stage 31.

As shown in FIG.
An XY table 36 is provided at the rear side of the XY table 36. The XY table 36 is mounted on the bonding head 3 mounted thereon.
7 is moved in the XY directions. The bonding head 37 supports one end of a bonding arm 38 with a bonding tool 39 attached to the tip. The bonding head 37 is configured to move the bonding tool 39 up and down by operating the bonding arm 38. I have. The bonding tool 39 has a built-in heater.

The XY table 36 is provided with an industrial television camera (hereinafter, referred to as a camera) 41 as an image capturing device for constituting the position recognition device 40 by a stand 42. The tape carrier 1 with a bond is photographed. An inner lead recognition measurement line setting unit (hereinafter, referred to as a setting unit) 43 for setting an inner lead recognition measurement line is connected to the camera 41, and a luminance measurement unit 44 is connected to the setting unit 43. . The forming unit 45 that forms the added luminance distribution waveform is connected to the luminance measuring unit 44, and the forming unit 45
Is connected to a determination unit 46 for determining the center line of the inner lead. The determination unit 46 is connected to the main controller 47, and transmits a determination result to the main controller 47. Incidentally, a controller 48 of the XY table 36 is connected to one input terminal of the main controller 47, and a monitor 49 is connected to an output terminal of the main controller 47.

At the front side of the stage 31, the wafer sheet 16
A pickup device 50 is provided for picking up the chips 12 one by one. The pickup device 50 has an XY table 51 that holds the wafer ring 17 and moves the wafer 15 in the XY directions. Immediately below the XY table 51, a push rod 52 for pushing up the chips 12 adhered to the wafer sheet 16 (bonded by applying a slight pressure at room temperature without using water, solvent, heat, etc.) one by one.
Is provided. Right above the XY table 51, there is provided a visual observation system 53 for detecting the quality of the chip 10.

An alignment device 54 is provided on one side of the pickup device 50.
Has an X table 55, a Y table 56, a Z table 57, and a Θ table 58. The Θ table 58 is configured to be able to reciprocate between the alignment station 59 and the stage 31. A visual observation system 60 is provided directly above the alignment station 59, and the visual observation system 60 is connected to communicate with the main controller 47. The main controller 47 controls an operation to be described later based on observation data from the visual observation system 60. The upper surface of the table 58 is configured so that the chips 12 can be suctioned and held by the vacuum force, and the held chips 12 can be heated.

A handling device 61 is provided between the pickup device 50 and the alignment station 59. The handling device 61 includes a guide rail 62, and a moving block 64 that is reciprocated by an X-axis motor 63 is provided on the guide rail 62 so as to straddle, and an arm 65 is supported on the moving block 64. ing. A collet 66 that is moved up and down by a Z-axis motor 67 is attached to the distal end of the arm 65. The collet 66 is configured to be able to hold the chip 12 by suction by a vacuum force.

Next, a description will be given of a bonding method of a method of manufacturing a μBGA IC according to an embodiment of the present invention using the bonding apparatus having the above configuration.

FIG. 12 shows a first roller R1 to a sixth roller R6.
Shows the operation of supplying the tape carrier with bond 1 to the stage 31 by the following method.

In FIG. 12A, the first roller R1 and the second roller R2 are connected to the bonded tape carrier 1 while the intermediate portion of the bonded tape carrier 1 is restrained by the upper presser 34 and the lower presser 33. When the third roller R3 is stopped when it is rotated in the forward direction (hereinafter, referred to as forward rotation) with respect to the feeding direction of the tape carrier, as shown in FIG. A slack portion is formed between the first second roller R2 and the third roller R3.

In FIG. 12C, the restraint by the upper presser 34 and the lower presser 33 and the restraint by the third roller R3 are released, and then, as shown in FIG. When the roller R4 is rotated forward, FIG.
As shown in (e), the slack between the second roller R2 and the third roller R3 of the bonded tape carrier 1 is reduced, and the distance between the fourth roller R4 and the fifth roller R5 is reduced. A slack is formed.

In FIG. 12 (f), the third roller R3 is closed in a state where the restraint between the upper presser 34 and the lower presser 33 is released, and the fifth roller R5 and the sixth roller R6 are closed.
Is momentarily opened and closed. For example, in FIG. 2, the main controller 47 controls the electromagnetic plunger R of the fifth roller R5.
5h is expanded after a short time and then shortened.

The instantaneous opening and closing of the tape carrier with bond 1 is in a free state, and the lateral displacement such as deflection and meandering occurring in the tape carrier with bond 1 is eliminated by the restoring force of the tape carrier with bond 1 itself. Is done. In this manner, the lateral displacement in the section downstream of the stage 31 in the bonded tape carrier 1 is eliminated by the self-control function of the bonded tape carrier 1 itself accompanying the instantaneous opening and closing of the fifth roller R5 and the sixth roller R6. Therefore, it is not necessary to perform the high-precision control necessary when the tape carrier with bond 1 is forcibly moved laterally to eliminate the lateral displacement, and no time is wasted in eliminating the lateral displacement.

In FIG. 12 (g), when the third roller R3 is rotated in a direction opposite to the feeding direction of the bonded tape carrier 1 (hereinafter, referred to as reverse rotation), the fourth roller R3 is rotated.
Since the roller 4 is stopped, the third roller R3 and the fourth roller R4 of the tape carrier with bond 1 are in tension in a straight line. When the fifth roller R5 and the sixth roller R6 are rotated forward, the fourth roller R4 and the fifth
The slack with the roller R5 is reduced.

In FIG. 12H, when the third roller R3 is rotated in the reverse direction, the upper holder 34 and the lower holder 33 are closed, and the bonded tape carrier 1 is restrained. At this time, the tape carrier 1 with the bond is driven by the third roller R3.
The back-tension is applied to the tape carrier 1 with the bond.
4 and the lower presser 33.

In FIG. 12 (i), the first roller R1 and the second roller R2 are momentarily opened and closed with the third roller R3 closed and the rotation stopped. For example, in FIG. 2, the main controller 47 includes a second roller R2.
The electromagnetic plunger R2h of the above is shortened after being extended in a short time.

Since the bonded tape carrier 1 is in a free state by this momentary opening and closing, the lateral displacement such as deflection and meandering occurring in the bonded tape carrier 1 is eliminated by the restoring force of the bonded tape carrier 1 itself. Is done. In this manner, the lateral displacement in the section upstream of the stage 31 in the bonded tape carrier 1 is eliminated by the self-control function of the bonded tape carrier 1 itself accompanying the instantaneous opening and closing of the first roller R1 and the second roller R2. Therefore, it is not necessary to perform strict control of the precision required when the tape carrier with bond 1 is forcibly moved laterally to eliminate the lateral displacement, and no time is wasted in eliminating the lateral displacement.

In FIG. 12 (j), the first roller R1 and the second roller R2 are held in a state where the tape carrier 1 with a bond is restrained by the upper holding member 34 and the lower holding member 33.
Is rotated forward, the third roller R3 is stopped. As shown in FIG. 12 (k), the third roller R3 is moved between the second roller R2 and the third roller R3 of the bonded tape carrier 1. The slack is formed.

In FIG. 12 (l), the restraint by the upper presser 34 and the lower presser 33 and the restraint by the third roller R3 are released, and then, as shown in FIG. When the roller R4 is rotated forward, the slack between the second roller R2 and the third roller R3 of the bonded tape carrier 1 is reduced, and the fourth rotation is performed as shown in FIG. A slack is formed between the roller R4 and the fifth roller R5.

Thereafter, the operation from FIG. 12E is repeated. Then, the bonding operation of the chip 12 to the bonded tape carrier 1 is performed during the restraining period of the bonded tape carrier 1 by the upper holder 34 and the lower holder 33 between FIGS. 12 (h) to 12 (k). Is done.

As described above, in the present embodiment, during the bonding operation of the chip 12 to the bonded tape carrier 1, the bonded tape carrier 1
The tape carrier 1 with a bond can be sent in advance by forming a slack on the tape carrier, so that the entire transport time of the tape carrier 1 with a bond can be reduced. In other words, if the tape carrier with bond 1 is not sent in advance, the entire transport time is one chip.
2 is determined by the bonding operation time to the bonded tape carrier 1, but if the bonded tape carrier 1 is sent in advance to form slack, the slack can be conveyed at a high speed. Minutes and the overall transport time can be reduced.

The height of the slack formed between the second roller R2 and the third roller R3 is regulated within a predetermined range by being monitored by the first sensor S1. Further, the height of the slack formed between the fourth roller R4 and the fifth roller R5 is regulated within a predetermined range by being monitored by the second sensor S2. Various adverse effects due to the formation of excessive slack are prevented by this height regulation. Further, it is possible to prevent the bonded tape carrier 1 from being cut due to the high-speed feeding of the bonded tape carrier 1 in a state where no slack is formed.

The bonding operation of the chip 12 to the bonded tape carrier 1 supplied to the stage 31 as described above will be described.

When the bonded tape carrier 1 supplied to the stage 31 by the above-described supply operation is restrained by the upper holder 34 and the lower holder 33 on the stage 31, the position of the inner lead 7 in the bonded tape carrier 1 is changed. FIG.
Is measured as shown in FIG.

In FIG. 13A, the position recognition device 40
Assuming that the center of the camera 41 is the origin O of the coordinates of a region 9 to be bonded (hereinafter referred to as a bonded portion) 9 of the bonded tape carrier 1, each of the inner leads 7 in the bonded portion 9 is connected to the camera 41. By recognizing and observing the coordinate position, the positional relationship between the coordinate position of each inner lead 7 and the coordinate origin, that is,
An error value between the actual position of the inner lead 7 and a reference position of the inner lead 7 registered in advance can be obtained.

The chip 12 is diced and the wafer 15 held on the wafer sheet 16 and the wafer ring 17 is diced.
Is supplied to the pickup device 50 in the bonding device 20 in the state described above.

In the pickup device 50, based on the observation of the visual observation system 53, the XY table 51 positions the non-defective chips 12 on the wafer sheet 16 directly above the push rod 52. The push rod 52 pushes the wafer sheet 16 from below to push up a good chip 12. The chips 12 pushed up from the wafer sheet 16 are sucked by the collet 66 of the handling device 61 by a vacuum force and picked up.

The chips 12 held by the collet 66 are conveyed by the handling device 61 to the alignment station 59 of the alignment device 54, and are transferred to the Θ table 58 which also serves as a chip holding table. At the alignment station 59 of the alignment device 54, the chip 12 is observed by the visual observation system 60. The visual observation system 60 transmits the observation data to the main controller 47. The main controller 47 compares the transmitted data on the position of the electrode pad 14 of the chip 12 with the reference data, and determines a correction value for eliminating the error value in FIG.
3 (b). The main controller 47 controls the table 55, the Y table 56, and the Θ table 57 based on the correction value,
The misalignment of the chip 12 in the XY and Θ directions is corrected and alignment is performed.

In FIG. 13B, assuming that the center of the visual observation system 60 is the origin of the coordinates of the chip 12, the visual observation system 60 recognizes the electrode pad 14 and observes the coordinate position. The positional relationship between the coordinate position of the electrode pad 14 and the coordinate origin, that is, each electrode pad 14
Error value between the actual position of the chip 12 and the pre-registered reference position of each electrode pad 14 can be obtained.
The error value with respect to the coordinate origin of the center of can be obtained.

The chip 12 whose error value with respect to the reference position has been corrected in the alignment station 59 as described above is placed on the stage 31 by the X
The table 55 and the Y table 56 are translated by a reference amount set in advance. With this translation,
The chip 12 is disposed directly below the bonded portion 9 of the stage 31. As shown in FIG.
The electrode pads 14 of the chip 12 are arranged so as to be offset by a preset value so as not to overlap the inner leads 7 of the bonded portion 9.

The electrode pads 14 of the chip 12 arranged on the stage 31 in an offset state with respect to the bonding portion 9 are moved by the position recognition device 40 to the bonding portion 9.
Is measured through the window hole 6. At this time, as shown in FIG. 13C, the electrode pad 14 is
The position recognition device 40 can accurately determine the center of the electrode pad 14 without being affected by the inner lead 7 because it is offset so as not to overlap.

By the way, when the electrode pads 14 are arranged without being offset with respect to the inner leads 7, for example, as shown in FIG. , The position recognition device 40 erroneously determines that the center of the electrode pad 14 is O ′. If the center of the electrode pad 14 is erroneously determined as described above, an error occurs when the positions of the electrode pad 14 and the inner lead 7 are adjusted by correction, and thus the inner lead 7 An error will occur in single point bonding.

However, in this embodiment, the electrode pads 14 are arranged offset from the inner leads 7 as shown in FIG.
Since the electrode pad 14 does not overlap the inner lead 7 located on the upper side, the position recognition device 40 can accurately determine the center of the electrode pad 14. Further, since the field of view of the camera 41 for position recognition can be narrowed down to the area of the electrode pad 14, the recognition accuracy can be further improved. Thus, the center O of the electrode pad 14 is
Is accurately determined, the positions of the electrode pads 14 and the inner leads 7 can be accurately adjusted by correction, so that the inner leads 7 can be precisely single-point bonded to the electrode pads 14.

When the actual position of the electrode pad 14 of the chip 12 on the stage 31 is recognized, the main controller 47 calculates an error value by comparing the actual position of the inner lead 7 with the above-mentioned position, and corrects the error value. Ask for. The main controller 47 controls the X table 55, the Y table 56, and the Θ table 57 of the alignment device 54 to correct the position of the chip 12 with the correction value and move the chip 12 from the offset position to the normal position. Deploy. That is, the chip 12 is rearranged from the offset position by the offset value and the correction value set in advance.

When the chip 12 is correctly aligned with the bonded portion 9 of the bonded tape carrier 1 as described above, the chip 12 is raised by the Z table 57 and the bonding tool 39 is lowered by the bonding head 37. Is done. As a result, the chip 12 is pressed against the lower surface of the bond 10 of the portion 9 to be bonded, and the chip 12 and the bond 10 are heated. Therefore, the chip 12 is thermocompression-bonded to the bond 10, and the chip 12 is attached to the bonded tape carrier 1. The bonding portion 9 is bonded to the bonding portion 9 by the adhesive layer of the bond 10.

When the chip 12 is bonded to the bonded portion 9 of the tape carrier with bond 1, the tape carrier with bond 1 is connected to the tape carrier 1 with bond as described above.
Is sent by one pitch p according to the supply and positioning method of the stage. Thereafter, the bonding method is sequentially performed on the bonded tape carrier 1 fed from the loading reel 21 by repeatedly performing the above-described operation.

Thereafter, in the inner lead bonding step in the method of manufacturing the μBGA IC, as shown in FIG. 14, the inner lead 7 of the tape carrier 1 with the bond is inner lead bonded to the electrode pad 14 of the chip 12, Similarly, in the resin sealing body forming step, an insulating material such as an elastomer or silicon rubber is potted inside each window hole 6 of the tape carrier 2 so that the inner leads 7 and the electrode pads 14 are formed by the resin sealing portion. It is sealed with resin.

In the bump forming step in the method of manufacturing the μBGA IC, the solder balls are soldered to the portions of each outer lead 8 of the tape carrier 2 which are exposed at the bottom of each bump hole 5, so that the bump forming section 4 is formed. Are formed on the tape carrier 2.

The μBGA IC 19 shown in FIG. 14 has been manufactured by the manufacturing method described above.

Although the invention made by the inventor has been specifically described based on the embodiment, the invention is not limited to the embodiment, and various changes can be made without departing from the gist of the invention. Needless to say.

For example, a method and a structure in which slacks are formed alternately on the upstream side and the downstream side of the stage by feeding a tape carrier with a bond and both slacks are alternately eliminated by feeding the tape carrier with a bond are described below. This may be omitted when a margin can be set.

The method and structure for eliminating the lateral displacement of the bonded tape carrier by instantaneously opening and closing the rollers may be omitted when the bonded tape carrier can be transported by a sprocket.

A method and a configuration for bonding a chip by disposing a chip at a predetermined value with respect to a specified position of a carrier, and then re-arranging the chip at a specified position and bonding the chip to the carrier via a bond. The present invention can be applied not only to the case where the chip is bonded by bonding but also to the case where the chip is mechanically and electrically connected to the inner lead of the carrier (inner lead bonding) as in the case of the inner lead bonding method of TCP / IC.

In the above description, the invention made mainly by the present inventor is described in terms of the application field μBG which is the background of the invention.
A case where the present invention is applied to A / IC manufacturing technology has been described, but the present invention is not limited to this case.
The present invention can be applied to all manufacturing technologies for semiconductor integrated circuit devices such as ICs and TCP / ICs.

[0103]

The effects obtained by typical aspects of the invention disclosed in the present application will be briefly described as follows.

The lateral displacement of the carrier can be eliminated by instantaneously opening and closing the friction roller.
The lateral displacement of the carrier can be prevented while avoiding an increase in the bonding time.

The slack is alternately formed on the upstream and downstream sides of the stage by feeding the carrier, and both slacks are alternately eliminated by feeding the carrier, so that the slack formed alternately is eliminated. , It is possible to secure a long bonding time while shortening the transport time of the entire carrier.

After the semiconductor chip is displaced by a predetermined value from the designated position of the carrier, the semiconductor chip is relocated to the designated position and bonded, so that the semiconductor chip can be easily recognized. Since the position of the semiconductor chip can be observed by arranging the semiconductor chip, the semiconductor chip can be accurately bonded to the specified position of the carrier.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a bonding section of a bonding apparatus according to an embodiment of the present invention.

FIG. 2 is a partially cut front view thereof.

FIG. 3 is a plan view thereof.

FIG. 4 is a side sectional view thereof.

FIG. 5 is a front view showing the entirety of a bonding apparatus according to an embodiment of the present invention.

FIG. 6 is a plan view thereof.

FIG. 7 is a partially omitted plan view showing a tape carrier with a bond.

8 (a) is a partially cut front view and FIG. 8 (b) is a partially cut side view.

9A and 9B show a chip, wherein FIG. 9A is a plan view and FIG.
Is a partially cut front view, and (c) is an enlarged partially cut side view.

FIG. 10 is a partially omitted plan view showing a state after bonding.

FIG. 11 also shows a state after bonding, and (a)
Is a partially cut front view, and (b) is a partially cut side view.

FIG. 12 is an explanatory diagram showing an operation of supplying a tape carrier with a bond to a stage by a group of rollers.

FIG. 13 is an explanatory diagram showing alignment between a bonded portion and a chip.

FIG. 14 is a front sectional view showing the manufactured μBGA · IC.

[Explanation of symbols]

1. Tape carrier with bond 2. Tape carrier 3,
... Carrier body, 3A ... Perforation, 4 ... Bump forming part, 5 ... Bump hole, 6 ... Window hole, 7 ... Inner lead, 8 ... Outer lead, 9 ... Part to be bonded, 10
... insulating film, 11 ... window hole, 12 ... chip, 13 ... passivation film, 14 ... electrode pad, 15 ... wafer, 16 ...
Wafer sheet, 17: Wafer ring, 19: μBGA ・
IC, 20: bonding apparatus, 21: loading reel, 22: unloading reel, 23: spacer tape take-up reel, 24: spacer tape, 25: spacer tape feeding reel, 26: spacer tape, 2
7: Pre-bake furnace, 28: Roller, 29: After-bake furnace, 30: Roller, 31: Bonding stage, 32
... Guide rail, R1 ... First roller, R2 ... Second roller, R3 ... Third roller, R4 ... Fourth roller, R5 ... Fifth
Roller, R6 ... Sixth roller, 33 ... Lower presser, 34 ...
Upper retainer, 35 ... Rotary actuator, 36 ...
XY table, 37 bonding head, 38 bonding arm, 39 bonding tool, 40 position recognition device, 41 camera, 42 stand, 43 measurement line setting unit for inner lead recognition, 44 luminance measurement unit, 45
... addition luminance distribution wave forming unit, 46 ... determining unit, 47 ... main controller, 48 ... controller, 49 ... monitor, 5
0: pickup device, 51: XY table, 52: stick, 53: visual observation system, 54: alignment device, 5
5 X table, 56 Y table, 57 Z table, 58 Θ table, 59 alignment station, 60 visual observation system, 61 handling device, 62
... Guide rail, 63 ... X-axis motor, 64 ... Move block, 65 ... Arm, 66 ... Collet, 67 ... Z-axis motor.

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Tomoji Suda 3-3-2 Fujibashi, Ome-shi, Tokyo Inside Hitachi Tokyo Electronics Corporation

Claims (20)

[Claims] 1. A method for manufacturing a semiconductor integrated circuit device comprising a bonding step in which a carrier formed in a tape shape is transported by a friction roller and a semiconductor chip is bonded to a specified position of the carrier. Wherein the lateral shift of the carrier is eliminated by instantaneously opening and closing the semiconductor integrated circuit device. 2. The method of manufacturing a semiconductor integrated circuit device according to claim 1, wherein the instantaneous opening and closing of the friction roller is performed in sections with respect to the carrier. 3. The method according to claim 1, wherein the instantaneous opening and closing of the friction roller is performed separately on an upstream side and a downstream side of a stage where the semiconductor chip is bonded to the carrier. A manufacturing method of the semiconductor integrated circuit device according to the above. 4. A bonding apparatus in which a carrier formed in a tape shape is conveyed by a friction roller and a semiconductor chip is bonded to a specified position of the carrier. The carrier is opened and closed instantaneously by the friction roller. A bonding apparatus characterized in that the lateral displacement of the bonding is eliminated. 5. A method according to claim 1, wherein a plurality of sets of the friction rollers are arranged at intervals in a carrier conveying direction, and the instantaneous opening and closing of the friction rollers is simultaneously performed between adjacent friction rollers. The bonding apparatus according to claim 4, wherein 6. A stage in which a plurality of sets of the friction rollers are arranged at intervals in a carrier conveying direction, and the semiconductor chip is bonded to the carrier by instantaneous opening and closing of the friction rollers. The bonding apparatus according to claim 4, wherein the bonding is performed separately for an upstream side and a downstream side. 7. A method of manufacturing a semiconductor integrated circuit device, comprising a bonding step in which a carrier formed in a tape shape is transported by a friction roller and a semiconductor chip is bonded to a specified position of the carrier. On the other hand, slack is formed alternately on the upstream and downstream sides of the stage to which the semiconductor chip is bonded by feeding the carrier, and both slacks are alternately eliminated by feeding the carrier. A method for manufacturing an integrated circuit device. 8. The method according to claim 7, wherein the chip is bonded to the carrier while the slack on the upstream side is formed. 9. The method according to claim 7, wherein the height of the slack is regulated. 10. A bonding apparatus in which a carrier formed in a tape shape is conveyed by a friction roller and a semiconductor chip is bonded to a designated position of the carrier, wherein a stage on which the semiconductor chip is bonded to the carrier is provided. A bonding apparatus wherein slacks are formed alternately on the upstream side and the downstream side by feeding the carrier, and both slacks are alternately eliminated by feeding the carrier. 11. The bonding apparatus according to claim 10, wherein the chip is bonded to the carrier during a period in which the slack on the upstream side is formed. 12. The bonding apparatus according to claim 10, wherein a height of the slack is regulated. 13. A method for manufacturing a semiconductor integrated circuit device, comprising a bonding step in which a carrier formed in a tape shape is transported by a friction roller and a semiconductor chip is bonded to a specified position of the carrier. The lateral displacement of the carrier is eliminated by instantaneously opening and closing, and slack is formed on the upstream side and the downstream side of the stage on which the semiconductor chip is bonded to the carrier, and the slack is alternately formed by feeding the carrier, A method of manufacturing a semiconductor integrated circuit device, wherein both slacks are alternately eliminated by feeding the carrier. 14. The method according to claim 13, wherein the friction roller is opened and closed instantaneously during the period in which the slack is formed. 15. A bonding apparatus in which a carrier formed in a tape shape is conveyed by a friction roller and a semiconductor chip is bonded to a designated position of the carrier. The carrier is opened and closed instantaneously by the friction roller. And the slack is alternately formed on the upstream side and the downstream side of the stage where the semiconductor chip is bonded to the carrier by sending the carrier, and both slacks are alternately eliminated by sending the carrier. A bonding apparatus characterized by being performed. 16. The bonding apparatus according to claim 15, wherein the friction roller is opened and closed instantaneously during the period in which the slack is formed. 17. A method for manufacturing a semiconductor integrated circuit device comprising a bonding step of bonding a semiconductor chip to a specified position of a carrier, wherein the semiconductor chip is set in advance to a specified position of the carrier. After being shifted by
A method of manufacturing a semiconductor integrated circuit device, wherein the semiconductor integrated circuit device is repositioned at a designated position and bonded. 18. The semiconductor device according to claim 1, wherein the position of the semiconductor chip shifted is measured at the time of the rearrangement, an error is obtained, and the semiconductor chip is arranged at a designated position so as to eliminate the obtained error. 18. The method according to claim 17, wherein the correction is performed.
3. The method for manufacturing a semiconductor integrated circuit device according to 1. 19. A bonding apparatus for bonding a semiconductor chip to a specified position of a carrier, wherein the semiconductor chip is arranged by being shifted by a preset value with respect to the specified position of the carrier,
A bonding apparatus, wherein the bonding apparatus is repositioned at a designated position and bonded. 20. At the time of the rearrangement, the position of the semiconductor chip shifted and measured is measured to determine an error, and the semiconductor chip is arranged at a designated position so as to eliminate the determined error. 20. The method of claim 19, wherein
3. The bonding apparatus according to claim 1.