JPH11153854A - Photomask and aligning method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To easily and accurately match the respective phases of circuit patterns with each other by providing aligning marks for deciding transferring positions for the circuit patterns in positions corresponding to the sides of a substrate, and composing each of the aligning marks of first, second and third aligning marks having translucent parts and light shielding parts surrounding the translucent parts respectively. SOLUTION: The first aligning mark 4 consisting of the circular translucent part 4b and the light shielding part 4a formed to surround the translucent part 4b is formed in the position corresponding to the side 2a of the substrate 2, the second aligning mark 5 consisting of the translucent part 5b and the light shielding part 5a formed to surround the translucent part 5b is formed in the position away from the first aligning mark 4 by a fixed distance. Similarly, the third aligning mark having the translucent part 6b and the light shielding part 6a is provided in the position corresponding to the side 2b of the substrate 2. Then, the positions with respect to a photomask 1 and the substrate 2 are adjusted to bi-sect the translucent parts 4b and 5b by the side 2a.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a photomask and an alignment method, and more particularly, to an alignment method of a photomask and a substrate by image processing of an exposure apparatus. The present invention relates to a positioning mark of a photomask and a positioning method using the positioning mark for use as a photomask.

[0002] Further, the present invention relates to an alignment method by image processing of a front pattern and a back pattern of a substrate using a pair of front and back photomasks provided with the alignment marks, using sides of the substrate as alignment marks of the substrate.

[0003]

2. Description of the Related Art In recent years, in order to increase the degree of integration of a printed circuit board, a circuit board having a multilayer structure formed by superposing a plurality of inner layer boards having circuit patterns formed on the front and back surfaces has been used. ing.

The circuit patterns formed on the front and back surfaces of the inner substrate are required to accurately connect the wiring of the circuit patterns on the front and back surfaces and to connect the circuit patterns between the contact surfaces of the superposed inner layer substrates accurately. And alignment of the circuit pattern on the back surface (hereinafter referred to as “phase”).
Must exactly match.

Therefore, when a circuit pattern is formed on the front surface and the back surface of a conventional inner layer substrate, there are the following two methods for utilizing the sides of the substrate in positioning the inner layer substrate and the photomask.

The first method is shown in FIGS. 7 and 8 (X in FIG. 7).
First, as shown in FIG.
The pin 20a is brought into contact with the side 2a, and the pins 20b and 20c are brought into contact with the second side 2b of the inner layer substrate 2, thereby positioning the inner layer substrate 2. Thereafter, the pins 20a, 20b and 20c are inserted into the positioning holes 10a to 10c provided in the photomask 10 using the pins 20a, 20b and 20c, and the photomask 10 is positioned. Thereby, the positioning between the inner layer substrate 2 and the photomask 10 becomes possible.

In a second method, the photomask is positioned in advance with respect to the CCD camera or the line sensor, and then the first side 2a of the inner substrate 2 is positioned as shown in FIGS. CCD to do
The inner substrate 2 is positioned using a camera or line sensor 30a and a CCD camera or line sensor 30b and a CCD camera or line sensor 30c for positioning the second side 2b.

[0008]

However, the above two methods have the following problems.

First, in the former method, the pin 2 is inserted into the positioning holes 10a to 10c provided in the photomask 10.
0a, the pins 20b, and the pins 20c, the accuracy of the alignment between the photomask 10 and the inner layer substrate 2 is improved.
It cannot be increased beyond a dimensional error for fitting included in the positioning holes 10a to 10c.

On the other hand, in the latter method, since one-dimensional processing is basically performed, the arrangement position of the CCD camera or the line sensor and the accuracy required for the alignment between the photomask 10 and the inner layer substrate 2 are reduced. This is expensive in terms of cost because higher accuracy is required for the arrangement condition, or it is necessary to make some correction for each of the CCD camera or the line sensor.

Accordingly, an object of the present invention is to provide a photomask and a positioning method which can easily and accurately match each phase of a circuit pattern formed on the front surface and the back surface of the inner layer substrate. It is in.

[0012]

According to a first aspect of the present invention, there is provided a photomask for transferring a circuit pattern to a substrate coated with a photosensitive agent having first and second sides extending in mutually different directions. A photomask to be used, which is provided with an alignment mark for determining a transfer position of the circuit pattern at a position corresponding to a side of the substrate, and the alignment mark includes a light transmitting portion and the light transmitting portion. A first, a second, and a third alignment mark each having an enclosing light-shielding portion, wherein the first and the second alignment marks are each formed of the light-transmitting light of the first and the second alignment marks. The third alignment mark is disposed such that the light-transmitting portion of the third alignment mark is divided by the first side of the substrate into a predetermined amount.
The substrate is arranged so as to be divided by a predetermined amount by the second side.

According to the positioning method of the present invention, a photo-transfer is used for transferring a circuit pattern to a substrate coated with a photosensitive agent having first and second sides extending in different directions. A method of aligning a mask with respect to the substrate, wherein first and second alignment marks each having a light-transmitting portion and a light-shielding portion surrounding the light-transmitting portion correspond to the first side of the substrate. A third alignment mark having a light-transmitting portion and a light-shielding portion surrounding the light-transmitting portion is disposed at a position corresponding to a second side of the substrate of the photomask; 1st, 2nd
And positioning the photomask with respect to the substrate based on the degree of overlap between the translucent portion of each of the third alignment marks and the side of the substrate.

As described above, according to the photomask of the first aspect and the alignment method of the seventh aspect, each of the light transmitting portions of the first and second alignment marks is positioned by the first side of the substrate. By overlapping the photomask and the substrate so that the photomask is divided into a fixed amount, for example, the photomask can be positioned in the Y direction and the rotation direction with respect to the substrate.

Further, under the above condition, the photomask and the substrate are overlapped so that the light-transmitting portion of the third alignment mark is divided into a predetermined amount by the second side of the substrate. The mask can be positioned in the X direction.

Therefore, the positioning of the photomask with respect to the front and rear substrates can be performed as described above using an image processing technique using a CCD camera or the like. As a result, it is possible to easily and accurately match the respective phases of the circuit patterns formed on the front surface side and the back surface side of the substrate.

Next, the photomask according to claim 2 is
2. The photomask according to claim 1, further comprising a fourth alignment mark having a light-transmitting portion and a light-shielding portion surrounding the light-transmitting portion, wherein the fourth alignment mark is a fourth alignment mark.
The light-transmitting portion of the alignment mark is arranged so as to be divided into a predetermined amount by a side facing the second side.

According to another aspect of the present invention, in addition to the positioning method of the seventh aspect, the light transmitting portion and the light transmitting portion are provided at positions opposed to the second side of the substrate. A fourth alignment mark having a light-shielding portion surrounding the substrate, and a photomask for the substrate with respect to the substrate based on the degree of overlap of each of the first to fourth alignment marks with the side of the substrate. Positioning is being performed.

As described above, according to the photomask of the second aspect and the alignment method of the eighth aspect, each light-transmitting portion of the first and second alignment marks is the first portion of the substrate.
By overlapping the photomask and the substrate such that the photomask is divided into a predetermined amount by the sides of the photomask, for example, the photomask can be positioned in the Y direction and the rotation direction with respect to the substrate.

Further, the degree of overlap of the light-transmitting portion of the third alignment mark by the second side of the substrate and the degree of overlap of the light-transmitting portion of the fourth alignment mark by the side opposite to the second side of the substrate are the same. By superimposing the photomask and the substrate so that the amount of the photomask and the amount of the photomask overlap each other, for example, the photomask can be positioned with respect to the substrate in the X direction.

Therefore, the positioning of the photomask with respect to the front and rear substrates can be performed by an image processing method using a CCD camera or the like. As a result, the phases of the circuit patterns formed on the front and back surfaces of the substrate can be easily and accurately matched.

Next, in a photomask according to a third aspect, in addition to the photomask according to the first or second aspect, a photomask having a light transmitting portion and a light shielding portion surrounding the light transmitting portion is provided. The fifth alignment mark further includes a fifth alignment mark, and the fifth alignment mark is divided into a predetermined amount by a side of the fifth alignment mark in which the light-transmitting portion of the fifth alignment mark faces the first side. Are arranged as follows.

According to the positioning method of the ninth aspect, in addition to the positioning method of the eighth aspect,
A fifth alignment mark having a light-transmitting portion and a light-shielding portion surrounding the light-transmitting portion at a position facing the first side;
The photomask and the substrate are aligned based on the degree of overlap of the first, second, third, fourth, and fifth alignment marks with the sides of the substrate of the light transmitting portion.

As described above, according to the photomask of the third aspect and the alignment method of the ninth aspect, the first and second alignment marks are formed on the first portion of the substrate of the light-transmitting portion of the first and second alignment marks.
By overlapping the photomask and the substrate in such a manner that the degree of overlap with the side of the photomask and the degree of overlap of the fifth alignment mark light-transmitting portion with the side opposite to the first side of the substrate are the same, for example, Can be positioned in the Y direction and the rotation direction with respect to the photomask.

Further, the degree of overlap of the light-transmitting portion of the third alignment mark with the second side of the substrate and the degree of overlap of the light-transmitting portion of the fourth alignment mark with the side opposite to the second side of the substrate are determined. By overlapping the photomask and the substrate so as to have the same amount, for example, the X direction of the photomask can be positioned with respect to the substrate.

Therefore, the positioning of the photomask with respect to the front and rear substrates can be performed by using an image processing method using a CCD camera or the like. As a result, the circuit pattern formed on the front and back surfaces of the substrate can be determined. Each phase can be easily and accurately matched.

Next, the photomask according to claim 4 is
4. The photomask according to claim 1, wherein the alignment mark is arranged such that the light-transmitting portion of the alignment mark is divided into a predetermined amount by a side of the substrate. 5. When this is done, the divided light-transmitting portion has a light-impermeable region.

Further, the photomask according to claim 5 is
4. The photomask according to claim 1, wherein the alignment mark is arranged such that the light-transmitting portion of the alignment mark is divided into a predetermined amount by a side of the substrate. 5. In this case, there is a light-impermeable region having the center of gravity of the divided light-transmitting portion as the center of gravity.

According to a tenth aspect of the present invention, in the alignment method according to any one of the seventh to ninth aspects, the light-transmitting portion of the alignment mark is provided on the substrate. When arranged so as to be divided into a predetermined amount by the side, the non-light-transmitting area provided at the center of gravity of the semicircle serving as the light-transmitting part, and the light-transmitting part of the alignment mark, When the substrate is divided by the above method, the substrate and the photomask are positioned by matching the positions of the centers of gravity of the portions that become the light transmitting portions.

Further, according to the positioning method of the present invention, the circuit pattern is transferred to a substrate coated with a photosensitive agent having first and second sides extending in different directions from each other. A method of aligning a photomask with respect to the substrate, wherein the photomask has an alignment mark for determining a transfer position of the circuit pattern at a position corresponding to the first and second sides of the substrate. The alignment mark is provided at a position outside the corresponding side of the substrate at least at two positions along the first side and at one position along the second side, and the first side And measuring the distance between the alignment mark corresponding to the first side and the distance between the second side and the alignment mark corresponding to the second side,
The positioning of the photomask with respect to the substrate is determined based on the measured distance data.

As described above, according to the photomasks according to the fourth and fifth aspects and the alignment method according to the tenth and eleventh aspects, for example, an image can be formed within the same CCD camera and within the same field of view. Processing (calculation of area and center of gravity) becomes possible, and there are few factors that cause errors in calculation.
This is advantageous in accuracy.

[0032]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Embodiments of a photomask and a positioning method according to the present invention will be described below with reference to the drawings. The same reference numerals in the drawings indicate the same or corresponding parts.

[Embodiment 1] First, referring to FIG.
A photomask and a positioning method in Embodiment 1 will be described.

A photomask 1 on which a predetermined transfer circuit pattern 3 is formed is disposed on a square substrate 2 on which a predetermined circuit pattern is formed on the front and back surfaces. As the material of the photomask 1, a film, glass, or the like is used depending on its use.

Each side (2) of the substrate 2 of the photomask 1
At positions corresponding to (a, 2b, 2c, 2d), a plurality of alignment marks for aligning the photomask 1 with the substrate 2 are arranged at predetermined positions.

In this embodiment, the side 2a of the substrate 2
And a first alignment mark 4 including a circular light-transmitting portion 4b and a light-shielding portion 4a formed to surround the light-transmitting portion 4b.
At a predetermined distance from the light transmitting portion 5b and the light transmitting portion 5
b comprising a light-shielding portion 5a formed so as to surround b.
An alignment mark 5 is formed. Further, the substrate 2
A third alignment mark having a light transmitting portion 6b and a light shielding portion 6a formed so as to surround the light transmitting portion 6b is provided at a position corresponding to the side 2b.

Next, the first alignment mark 4 and the second alignment mark 4
A method of aligning the photomask 1 having the alignment marks 5 and the third alignment marks 6 with the substrate 2 will be described below. First, a region surrounded by the light transmitting portion 4b of the first alignment mark 4 and the substrate 2 and a region surrounded by the light transmitting portion 5b of the second alignment mark 5 and the substrate 2 were measured using a CCD camera or the like. Image recognition is performed using an image processing apparatus, the position of the side 2a of the substrate 2 and the position of the photomask 1 are obtained, and the two are matched. Further, an area of the third alignment mark 6 surrounded by the light-transmitting portion 6b and the substrate 2 is image-recognized using an image processing device using a CCD camera or the like, and the side 2b of the substrate 2 and the photomask 1 are recognized. The position is determined and the two are matched.

In this alignment, the positions of the photomask 1 and the substrate 2 are adjusted so that the light transmitting portions 4b and 5b are divided into two by the side 2a. This makes it possible to determine the inclination (rotational position) of the side 2a and the position in the Y direction. Further, the light transmitting portion 6b of the third alignment mark 6 is
By performing positioning so as to be divided into two by b, positioning in the X direction can be performed.

Therefore, by using the above-described method, it becomes possible to align the photomask 1 and the substrate 2 with reference to the sides 2a and 2b of the substrate 2.

At this time, the light transmitting portions of the alignment marks for the photomask for the front surface of the substrate 2 and the photomask for the back surface of the substrate 2 are provided at the same position and size with respect to the substrate, thereby positioning the photomask. The line segment of the side 2a of the substrate 2 appearing in the mark uses the same portion when the photomask on the front side is aligned with the substrate and when the photomask on the rear side is aligned with the substrate. as a result,
Using the same information on the front and back sides, it is possible to perform alignment between the photomask and the substrate.

In this way, it is possible to easily and accurately match the phases of the circuit patterns formed on the front and back surfaces of the substrate.

[Embodiment 2] Hereinafter, referring to FIG.
A photomask and a positioning method according to Embodiment 2 will be described.

The photomask according to the second embodiment is different from the photomask according to the first embodiment in that a light transmitting portion 7 is further provided at a position corresponding to the side 2 d of the substrate 2.
b and the light shielding portion 7 formed so as to surround the light transmitting portion 7b.
and a fourth alignment mark 7 having a.

As described above, the alignment method using the photomask 1 including the first alignment mark 4, the second alignment mark 5, the third alignment mark 6, and the fourth alignment mark 7 is performed in the Y direction. As for the rotation direction, the first alignment mark 4 and the second
The positioning of the photomask 1 and the substrate 2 is performed using the alignment marks 5.

Next, the light transmitting portion 6 of the third alignment mark 6
The photomask 1 and the substrate 2 are aligned so that the degree of overlap between b and the side 2b and the degree of overlap between the light transmitting portion 7b of the fourth alignment mark 7 and the side 2d are the same. This makes it possible to perform alignment between the photomask 1 and the substrate 2 with reference to the side 2a of the substrate 2 and the distribution center line 2e of the side 2b and the side 2d.

As described above, in the present embodiment, similarly to the first embodiment, it is possible to perform the alignment by image processing using a CCD camera or the like, and the circuit pattern formed on the front and back sides of the substrate can be adjusted. Each phase easily and
Accurate matching can be achieved.

[Embodiment 3] Next, referring to FIG.
Third Embodiment A photomask and a positioning method according to a third embodiment of the present invention will be described.

In the photomask according to the third embodiment, when compared with the second embodiment,
A fifth alignment mark 8 is further provided at a position corresponding to c. The fifth alignment mark 8 includes a light transmitting portion 8b and a light shielding portion 8a surrounding the light transmitting portion 8b.

As described above, the first alignment mark 4, the second alignment mark 5, the third alignment mark 6, the fourth alignment mark
The method of aligning the photomask 1 with the substrate 2 using the photomask 2 having the alignment marks 7 and the fifth alignment marks 8 is described in FIG.
In the same manner as in the second embodiment shown in FIG.
Positioning is performed using and the fourth alignment mark 7.

Next, the light transmitting portion 4 of the first alignment mark 4
b and the degree of overlap between each of the light transmitting portions 5b of the second alignment mark 5 and the side 2a and the fifth alignment mark 8
The position of the photomask 1 and the substrate 2 is adjusted so that the degree of overlap between the light transmitting portion 8b and the side 2c becomes equal. This makes it possible to align the photomask 1 and the substrate 2 with reference to the distribution center line 2f between the sides 2a and 2c and the distribution center line 2e between the sides 2b and 2d. become.

As described above, also in this embodiment, the CCD
Positioning using a camera or the like can be performed, and each phase of a circuit pattern formed on the front and back surfaces of the substrate can be easily and accurately matched.

In each of the above embodiments, the alignment between the photomask and the substrate is performed based on the degree of overlap between the alignment mark and the side of the substrate. However, as shown in FIG. The light-shielding region 4c is provided in the portion 4b, and positioning can be performed based on the positional relationship between the light-transmitting portion and the light-shielding region formed by the overlap of the light-transmitting portion and the substrate.

Hereinafter, the principle of this positioning will be described. First, with reference to FIG. 5A, a case where the area of a circle having a radius r is halved will be considered. Now, assuming that the area of the circle is halved, a semicircle with a radius r is created.
The center of gravity of a semicircle (see FIG. 5B) can be generally represented by the following approximate expression.

E1 ≒ 0.4244 × r E2 ≒ 0.5756 × r When the original circle is arbitrarily linearly covered in part, the center of gravity of the remaining translucent part (FIG. 5C) ) And the distance and direction from the center of gravity of the semicircle to a predetermined value, the position of the circle and the straight line can be controlled to a predetermined degree.

More specifically, by providing a "black circle" having a center of gravity at the semicircular center of gravity, the distance and direction between the center of gravity of the black circle and the center of light transmission are adjusted. By using this method, the following operations and effects can be obtained.

Since image processing (calculation of area and center of gravity, etc.) can be performed within the same CCD camera field of view, there are few factors causing calculation errors, which is advantageous in terms of accuracy (for example, "half the area"). If the above processing is performed by calculation from another reference mark, the resolution, gain, illumination, and the like of the camera will be affected.

In FIGS. 1 to 5 in each of the above embodiments, the light transmitting portions 4b to 8b are circular in shape, but the size covered by the substrate 2 and the remaining size can be easily calculated. Any shape can be adopted.

The light-transmitting portion and the light-non-transmitting portion indicate those which are determined to be light-transmitting and non-light-transmitting as a result of determining the brightness in image processing. By performing light transmission and image processing, the same alignment can be performed. Similarly, the same alignment can be performed by processing the image by the reflection illumination into the light transmitting portion and the light non-transmitting portion.

[Embodiment 4] Next, referring to FIG.
Fourth Embodiment A photomask and a positioning method according to a fourth embodiment of the present invention will be described.

Photomask 1 in Embodiment 4
A first alignment mark 10a and a second alignment mark 10b are provided at positions corresponding to the side 2a of the substrate 2 coated with the photosensitive agent, and at positions corresponding to the side 2b,
A third alignment mark 10c is provided.

The pattern shapes of the first alignment mark 10a, the second alignment mark 10b, and the third alignment mark 10c are different from those in the above embodiments, and
If it can be read by a camera etc.,
Any shape may be used.

The position of the photomask 1 with respect to the substrate 2 is determined by using an optical sensor such as a CCD camera to determine the distance L1 between the first alignment mark 10a and the side 2a.
Distance L2 between second alignment mark 10b and side 2a
And the distance L3 between the third alignment mark 10c and the side 2b are measured, and the distance L1 and the distance L are measured.
The position of the photomask 1 with respect to the substrate 2 is adjusted so that the distance 2 and the distance L3 become a preset distance.

As described above, by performing at least two position alignments with respect to the side 2a, it is possible to determine the inclination (rotational position) and the position in the Y direction of the side 2a.
In addition, by performing one-position alignment with respect to the side 2b, it becomes possible to perform positioning in the X direction.

As a result, it becomes possible to align the photomask 1 and the substrate 2 with reference to the sides 2a and 2b of the substrate 2a.

As described above, the embodiments disclosed this time are to be considered in all respects as illustrative and not restrictive. Therefore, the scope of the present invention is defined by the terms of the claims, rather than the description above, and is intended to include any modifications within the scope and meaning equivalent to the terms of the claims.

[Brief description of the drawings]

FIG. 1 is a schematic diagram for explaining a photomask and an alignment method according to a first embodiment.

FIG. 2 is a schematic diagram for explaining a photomask and an alignment method according to a second embodiment.

FIG. 3 is a plan view of an alignment mark having an opaque region at the center of gravity of a semicircle.

FIG. 4 is a schematic diagram for explaining a photomask and an alignment method according to a fourth embodiment.

FIG. 5 is a schematic diagram for explaining the principle of positioning by a method of matching the “center of gravity” of a semicircle with the “center of gravity” of the remaining portion.

FIG. 6 is a schematic diagram for explaining a photomask and an alignment method according to a fourth embodiment.

FIG. 7 is a first diagram illustrating a positioning method according to the related art.

FIG. 8 is a cross-sectional view taken along the arrow X in FIG. 7;

FIG. 9 is a second diagram illustrating a positioning method according to the related art.

FIG. 10 is a schematic diagram showing an image processing state in FIG. 9;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Mask 2 Substrate 4 1st alignment mark 5 2nd alignment mark 6 3rd alignment mark 7 4th alignment mark 8 5th alignment mark 9 Auxiliary alignment mark 4a-8a Shield part 4b-8b Light transmission part

──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. ⁶ Identification code FI H01L 21/30 502M

Claims (11)

[Claims] 1. A photomask used for transferring a circuit pattern onto a substrate coated with a photosensitive agent having first and second sides extending in different directions, the photomask corresponding to a side of the substrate. A positioning mark for determining a transfer position of the circuit pattern at a position, wherein the positioning mark has first, second, and third light-transmitting portions and a light-shielding portion surrounding the light-transmitting portion, respectively. The first and second alignment marks are divided into a predetermined amount by the first side of the substrate, wherein the light-transmitting portion of each of the first and second alignment marks is divided. The third alignment mark is arranged such that the light-transmitting portion of the third alignment mark is divided into a predetermined amount by the second side of the substrate. Disk. 2. The alignment mark further includes a fourth alignment mark having a light-transmitting portion and a light-shielding portion surrounding the light-transmitting portion, and the fourth alignment mark is a fourth alignment mark. 2. The photomask according to claim 1, wherein the light-transmitting portion is disposed so as to be divided into a predetermined amount by a side disposed at a position facing the second side of the substrate. 3. The alignment mark further includes a fifth alignment mark having a light-transmitting portion and a light-shielding portion surrounding the light-transmitting portion, and the fifth alignment mark includes the fifth alignment mark. 3. The photomask according to claim 1, wherein the light-transmitting portion of the mark is disposed so as to be divided into a predetermined amount by a side disposed at a position facing the first side of the substrate. 4. . 4. The alignment mark, when the light-transmitting portion of the alignment mark is arranged so as to be divided by a predetermined amount by a side of the substrate, is not provided in the divided light-transmitting portion. The photomask according to claim 1, having a light-transmitting region. 5. The center of gravity of the divided light-transmitting portion when the light-transmitting portion of the alignment mark is arranged so as to be divided by a predetermined amount by a side of the substrate. The photomask according to claim 1, wherein the photomask has an opaque region whose position is a center of gravity. 6. The photomask according to claim 1, wherein both the light transmitting portion and the light non-transmitting region are circular. 7. A method for aligning a photomask used for transferring a circuit pattern onto a substrate coated with a photosensitive agent having first and second sides extending in mutually different directions with respect to the substrate, the method comprising: First and second alignment marks, each having a light portion and a light-shielding portion surrounding the light-transmitting portion, are arranged at positions corresponding to the first side of the substrate. A third alignment mark having a light-shielding portion surrounding the light portion is arranged at a position corresponding to a second side of the substrate, and the light transmission of each of the first, second, and third alignment marks is performed. A positioning method of positioning a photomask with respect to the substrate based on a degree of overlap between a portion and a side of the substrate. 8. A position corresponding to a second side of the substrate,
A fourth alignment mark having a light-transmitting portion and a light-shielding portion surrounding the light-transmitting portion is further disposed; and the first, second, third, and fourth alignment marks are arranged on the light-transmitting portion. The alignment method according to claim 7, wherein the alignment of the photomask with respect to the substrate is performed based on a degree of overlap with a side of the substrate. 9. A fifth alignment mark having a light-transmitting portion and a light-shielding portion surrounding the light-transmitting portion is arranged at a position corresponding to a side facing the first side of the substrate, 8. The photomask is positioned with respect to the substrate based on the degree of overlap between the light transmitting portion of each of the second, third, fourth, and fifth alignment marks and the side of the substrate. The alignment method described in 1. 10. The non-light-transmitting portion provided in the divided light-transmitting portion when the light-transmitting portion of the alignment mark is arranged so as to be divided by a predetermined amount by the side of the substrate. When the center of gravity position and the light transmitting portion of the alignment mark are divided by the side of the substrate, the center of gravity position of the portion that becomes the light transmitting portion is aligned with a predetermined position to match the substrate. The positioning method according to claim 7, wherein the positioning of the photomask is performed. 11. A method of aligning a photomask used for transferring a circuit pattern to a substrate coated with a photosensitive agent having first and second sides extending in different directions from each other, the method comprising: The photomask has an alignment mark for determining a transfer position of the circuit pattern at a position corresponding to the first and second sides of the substrate, and the alignment mark is provided on the corresponding substrate. At least two locations along the first side and one location along the second side are provided at positions outside the side, and the alignment corresponding to the first side and the first side is provided. The distance between the second side and the alignment mark corresponding to the second side is measured, and the photo to the substrate is measured based on the measured distance data. Determining the alignment of the disk, the alignment process.