JPH11144611A - Film for dielectric layer - Google Patents
Film for dielectric layerInfo
- Publication number
- JPH11144611A JPH11144611A JP32045397A JP32045397A JPH11144611A JP H11144611 A JPH11144611 A JP H11144611A JP 32045397 A JP32045397 A JP 32045397A JP 32045397 A JP32045397 A JP 32045397A JP H11144611 A JPH11144611 A JP H11144611A
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- JP
- Japan
- Prior art keywords
- dielectric layer
- film
- component
- forming
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プラズマディスプ
レイパネル（ＰＤＰ）をはじめとする電極が固定されて
いるガラス基板上に誘電体層を形成する為に用いられる
誘電体（絶縁）層形成用フィルムに関し、更には基板と
の密着性に優れ、かつ焼成後に良好な誘電体層を得るこ
とができる誘電体層形成用フィルムに関するものであ
る。The present invention relates to a film for forming a dielectric (insulating) layer used to form a dielectric layer on a glass substrate to which electrodes such as a plasma display panel (PDP) are fixed. Further, the present invention relates to a film for forming a dielectric layer which has excellent adhesion to a substrate and can obtain a good dielectric layer after firing.
【０００２】[0002]
【従来の技術】従来より、プラズマディスプレイパネル
（ＰＤＰ）をはじめとする電極が固定されているガラス
基板上には、通常誘電体（絶縁）層が形成されており、
かかる誘電体層は一般的にはガラスやセラミックス等の
無機材料と有機バインダー及び高沸点溶媒からなるペー
ストをスクリーン印刷することにより、該ペースト層を
基板上に設けた後、乾燥して、更に焼成して形成されて
いるが、最近では該ペーストをあらかじめシート状にす
ることも試みられている。2. Description of the Related Art Conventionally, a dielectric (insulating) layer is usually formed on a glass substrate on which electrodes such as a plasma display panel (PDP) are fixed.
Such a dielectric layer is generally provided by screen-printing a paste composed of an inorganic material such as glass or ceramics, an organic binder and a high-boiling solvent, so that the paste layer is provided on a substrate, and then dried and further fired. Recently, it has been attempted to form the paste in a sheet form in advance.
【０００３】例えば、特開平８−１７６５１８号公報に
は、ブラウン管内部の基板上に誘電体層を作製するため
のシートとして、ガラス粉末、ポリブチルメタクリレー
ト樹脂及び可塑剤からなる自己接着性を有するガラスシ
ートが提案されている。また、特開平９−１０２２７３
号公報でも、その実施例に高Ｔｇ（ガラス転移温度）の
ポリマーとジアクリレート化合物からなる誘電体層形成
用のフィルムが記載されている。For example, Japanese Patent Application Laid-Open No. 8-176518 discloses a self-adhesive glass made of glass powder, polybutyl methacrylate resin, and a plasticizer as a sheet for forming a dielectric layer on a substrate inside a cathode ray tube. A seat has been proposed. Also, Japanese Patent Application Laid-Open No. 9-102273
In the publication, a film for forming a dielectric layer comprising a polymer having a high Tg (glass transition temperature) and a diacrylate compound is described in the working examples.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、特開平
８−１７６５１８号公報開示技術では、ラミネート性
（基板への追随性や密着性等）が不十分であり、また、
特開平９−１０２２７３号公報記載のフィルムでは、焼
成後の誘電体層に斑が生じる恐れがあり、新なる改良が
望まれるところである。However, the technology disclosed in Japanese Patent Application Laid-Open No. 8-176518 has insufficient laminating properties (such as followability to a substrate and adhesion).
In the film described in Japanese Patent Application Laid-Open No. 9-102273, there is a possibility that the dielectric layer after firing may be uneven, and new improvements are desired.
【０００５】[0005]
【課題を解決する為の手段】そこで、本発明者が、かか
る課題を解決すべく鋭意研究を行った結果、（ａ）ガラ
ス粉体６０〜９４重量％、（ｂ）Ｔｇが１０℃以下のア
クリル系樹脂６〜４０重量％からなる誘電体層形成用フ
ィルムが、基板との密着性に優れ、焼成後に良好な誘電
体層を得ることができることを見いだし、本発明の完成
に至った。The inventors of the present invention have conducted intensive studies to solve the above-mentioned problems. As a result, (a) 60 to 94% by weight of glass powder and (b) Tg of less than 10 ° C. The inventors have found that a film for forming a dielectric layer comprising 6 to 40% by weight of an acrylic resin has excellent adhesion to a substrate and can obtain a good dielectric layer after firing, and has completed the present invention.
【０００６】[0006]
【発明の実施の形態】以下、本発明を詳細に説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in detail.
【０００７】本発明の（ａ）ガラス粉体としては、特に
限定されないが、ＰｂＯが２５〜５０％、Ｂ2Ｏ3が１０
〜４０％、ＳｉＯ2が５〜２０％、Ａｌ2Ｏ3が０〜６０
％、ＴｉＯ2が０〜３０％の組成を有するものが好まし
く、その形状は特に限定されないが、０．１〜３０μｍ
程度の球状が好ましい。かかる（ａ）成分の配合量は、
６０〜９４重量％で、該配合量が６０重量％未満ではバ
インダー量が多くなり焼成時に誘電体層中に気泡が多く
含有されてしまい、逆に９４重量％を越えるとラミネー
ト性（基板への追随性や密着性等）が低下して、本発明
の目的を達成できない。更に好ましくは７０〜９０重量
％である。The glass powder (a) of the present invention is not particularly limited, but PbO is 25 to 50% and B 2 O 3 is 10%.
To 40%, SiO 2 is 5~20%, Al 2 O 3 0 to 60
% And TiO 2 having a composition of 0 to 30% are preferable, and the shape thereof is not particularly limited.
A spherical shape is preferred. The amount of the component (a) is
When the blending amount is less than 60% by weight, the amount of the binder is increased, and the dielectric layer contains a large amount of air bubbles at the time of firing. (E.g., followability and adhesion) are reduced, and the object of the present invention cannot be achieved. More preferably, it is 70 to 90% by weight.
【０００８】また、本発明の（ｂ）Ｔｇが１０℃以下の
アクリル系樹脂としては、Ｔｇが１０℃以下のアクリル
系樹脂であれば、特に限定されないが、特にラミネート
性や焼成性等の点でｎ−ブチルアクリレートおよび／ま
たは２−エチルヘキシルアクリレートを共重合成分とす
る共重合体が好ましく、更には（ｂ）成分中にかかるｎ
−ブチルアクリレートや２−エチルヘキシルアクリレー
トを５０重量％以上（更には６０重量％以上）含有する
こともラミネート性や焼成性等の点で好ましい。かかる
（ｂ）成分のＴｇが１０℃を越えるとラミネート性が不
足して本発明の目的を達成できない。更に好ましくは−
７０〜０℃である。また、かかる（ｂ）成分の配合量
は、６〜４０重量％で、該配合量が６重量％未満ではラ
ミネート性が不足し、逆に４０重量％を越えると焼成時
に誘電体層中に気泡が多く含有されてしまって、本発明
の目的を達成できない。更に好ましくは１０〜３０重量
％である。The (b) acrylic resin having a Tg of 10 ° C. or lower in the present invention is not particularly limited as long as it is an acrylic resin having a Tg of 10 ° C. or lower. And a copolymer containing n-butyl acrylate and / or 2-ethylhexyl acrylate as a copolymer component, and furthermore, n in the component (b)
It is also preferable to contain -butyl acrylate or 2-ethylhexyl acrylate in an amount of 50% by weight or more (more preferably 60% by weight or more) in terms of laminating properties and firing properties. When the Tg of the component (b) exceeds 10 ° C., the laminating property is insufficient and the object of the present invention cannot be achieved. More preferably-
70 to 0 ° C. The amount of the component (b) is from 6 to 40% by weight. If the amount is less than 6% by weight, the laminating property is insufficient. Is contained so much that the object of the present invention cannot be achieved. More preferably, it is 10 to 30% by weight.
【０００９】本発明の誘電体層形成用フィルムを得るに
あたっては、上記の（ａ）及び（ｂ）を混合して、フィ
ルム化すればよい。すなわち、所定量の（ａ）及び
（ｂ）（必要に応じて、テルピネオール、酢酸ｎ−ブチ
ルセロソルブ、酢酸ｎ−ブチルカルビトール等の溶剤を
５〜２０重量％程度混合）をダイナミックスターラー等
の混合撹拌機で混合後、三本ロールやボールミル等にて
混練して、ペースト状にした後、必要により離型処理し
たＰＥＴやＰＰ等の支持体シート上に、乾燥後の厚さが
２０〜１００μｍ程度になるように塗工して、８０〜１
５０℃程度で乾燥させれば、本発明の誘電体層形成用フ
ィルムを得ることができるのである。尚、本発明におい
ては、本発明の目的を阻害しない範囲においてシランカ
ップリング剤やレベリング剤等を添加することも可能で
ある。In order to obtain the dielectric layer forming film of the present invention, the above (a) and (b) may be mixed to form a film. That is, a predetermined amount of (a) and (b) (if necessary, a solvent such as terpineol, n-butyl cellosolve acetate, or n-butyl carbitol acetate is mixed in an amount of about 5 to 20% by weight) is mixed and stirred by a dynamic stirrer or the like. After mixing with a kneader, the mixture is kneaded with a three-roll or ball mill or the like to form a paste, and then, if necessary, a thickness of about 20 to 100 μm after drying on a support sheet such as PET or PP which has been release-treated. 80-1
By drying at about 50 ° C., the dielectric layer forming film of the present invention can be obtained. In the present invention, it is also possible to add a silane coupling agent, a leveling agent and the like as long as the object of the present invention is not hindered.
【００１０】得られた本発明の誘電体層形成用フィルム
を用いて、誘電体層を形成するにあたっては、基板上に
該フィルムをラミネーター等を用いて、６０〜１２０
℃，０〜５ｋｇ／ｃｍ2圧の条件で熱圧着後、支持体シ
ートを剥離して、３５０〜４００℃の脱灰工程を有し、
最高温度が５００〜６００℃の連続焼成炉を用いて焼成
を行えばよい。本発明の誘電体層形成用フィルムは、基
板との密着性に優れ、焼成後には良好な誘電体層が形成
され、ＰＤＰをはじめとする電極が設けられたガラス基
板等に誘電体層を形成するのに大変有用である。In forming a dielectric layer using the obtained film for forming a dielectric layer of the present invention, the film is formed on a substrate by using a laminator or the like to form a film having a thickness of 60 to 120.
After the thermocompression bonding under the condition of 0 ° C., 0 to 5 kg / cm 2 pressure, the support sheet is peeled off, and a decalcification step of 350 to 400 ° C. is provided.
The firing may be performed using a continuous firing furnace having a maximum temperature of 500 to 600 ° C. The film for forming a dielectric layer of the present invention has excellent adhesion to a substrate, forms a good dielectric layer after firing, and forms a dielectric layer on a glass substrate or the like provided with electrodes such as a PDP. Very useful to do.
【００１１】[0011]
【実施例】以下、実施例を挙げて本発明を更に具体的に
説明する。尚、実施例中「部」、「％」とあるのは、特
に断りのない限り重量基準を表す。 実施例１ 下記（ａ）成分８０部、下記（ｂ）成分２０部及びテル
ピネオール１０部をダイナミックスターラー（特殊機化
工業社製『Ｔ．Ｋ．ＨＯＭＯＤＩＳＰＥＲ』）で混合撹
拌後、三本ロールに混練して均一なペーストを得た。 （ａ）成分：ＰｂＯが３１．１％、Ｂ2Ｏ3が１５．１
％、ＳｉＯ2が９．２％、Ａｌ2Ｏ3が３４．２％、Ｔｉ
Ｏ2が１０．４％の組成物 （ｂ）成分：メチルメタクリレート／ｎ−ブチルアクリ
レート／アクリル酸＝２０／７７／３（共重合重量比）
の共重合体 （Ｔｇ＝−３１℃） 得られたペーストを１００μｍ厚の離型処理されたＰＥ
Ｔシート上に塗工し、１２５℃で４０分間乾燥して、６
０μｍ厚の本発明の誘電体層形成用フィルムを得た。得
られた誘電体層形成用フィルムを以下の要領で評価を行
った。EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples. In the examples, “parts” and “%” are based on weight unless otherwise specified. Example 1 80 parts of the following component (a), 20 parts of the following component (b) and 10 parts of terpineol were mixed and stirred with a dynamic stirrer ("TK HOMODISPER" manufactured by Tokushu Kika Kogyo Co., Ltd.), and then kneaded on a three-roll mill. Thus, a uniform paste was obtained. Component (a): PbO 31.1%, B 2 O 3 15.1
%, SiO 2 9.2%, Al 2 O 3 34.2%, Ti
O 2 10.4% of the composition component (b): Methyl methacrylate / n-butyl acrylate / acrylic acid = 20/77/3 (copolymerization weight ratio)
(Tg = −31 ° C.) The obtained paste was subjected to release treatment of PE having a thickness of 100 μm.
Coated on T sheet, dried at 125 ° C for 40 minutes,
A 0 μm thick film for forming a dielectric layer of the present invention was obtained. The obtained dielectric layer forming film was evaluated in the following manner.
【００１２】（ラミネート性）誘電体層形成用フィルム
をＰＥＴシートを積層したままで、ＰＥＴシートと反対
の面を基板（銀電極を形成したガラス板）上にラミネー
ターでラミネート（温度；６０℃、圧力；３ｋｇ／ｃｍ
2、速度２ｍ／ｍｉｎ）して、ラミネート性を以下の通
り評価した。 ○ −−− 基板端部にもフィルムの剥離は認められ
ず、追随性も良好 × −−− フィルムの剥離が生じる、あるいは追随性
が不良でラミネートが困難 （誘電体層形成性）上記でラミネートされた積層体（基
板／誘電体層形成用フィルム）から離型処理されたＰＥ
Ｔシートを剥離して、脱灰条件が３８０℃で１０分，最
大温度が５２０℃に設定されたベルト式焼成炉で焼成し
て、形成された誘電体層を目視観察して、以下の通り評
価した。 ○ −−− 表面にピンホールやクラック等の欠陥が認
められない × −−− 表面にピンホールやクラック等の欠陥が認
められる(Laminating property) The surface opposite to the PET sheet is laminated on a substrate (a glass plate on which silver electrodes are formed) with a laminator while the dielectric layer forming film is laminated on the PET sheet (temperature: 60 ° C., Pressure; 3 kg / cm
2 , the speed was 2 m / min), and the laminating property was evaluated as follows. ○ −−− No peeling of the film was observed at the edge of the substrate, and the followability was good. × −− The peeling of the film occurred or the followability was poor, making lamination difficult (dielectric layer forming property). PE released from the laminated body (substrate / film for forming a dielectric layer)
The T sheet was peeled off, fired in a belt-type firing furnace in which the demineralization conditions were set at 380 ° C. for 10 minutes and the maximum temperature was set at 520 ° C., and the formed dielectric layer was visually observed as follows. evaluated. ○ −−− No defects such as pinholes or cracks were observed on the surface × −−−
【００１３】実施例２ 下記（ａ）成分９０部、下記（ｂ）成分１０部及びテル
ピネオール１５部を用いて、実施例１と同様に行って誘
電体層形成用フィルムを得て、同様に評価を行った。 （ａ）成分：実施例１と同組成 （ｂ）成分：ｎ−ブチルアクリレート／２−エチルヘキ
シルアクリレート＝８５／１５（共重合重量比）の共重
合体 （Ｔｇ＝−５７℃）Example 2 A film for forming a dielectric layer was obtained in the same manner as in Example 1, except that 90 parts of the following component (a), 10 parts of the following component (b) and 15 parts of terpineol were used. Was done. (A) Component: Same composition as in Example 1. (b) Component: n-butyl acrylate / 2-ethylhexyl acrylate = 85/15 (copolymer weight ratio) copolymer (Tg = −57 ° C.)
【００１４】実施例３ 実施例１において、（ｂ）成分として下記の共重合体も
用いた以外は実施例１と同様に行って誘電体層形成用フ
ィルムを得て、同様に評価を行った。 （ｂ）成分：ｎ−ブチルメタクリレート／２−エチルヘ
キシルアクリレート／アクリル酸＝３７／６０／３（共
重合重量比）の共重合体 （Ｔｇ＝−４０℃）Example 3 A film for forming a dielectric layer was obtained in the same manner as in Example 1 except that the following copolymer was used as the component (b), and a film for forming a dielectric layer was obtained. . Component (b): n-butyl methacrylate / 2-ethylhexyl acrylate / acrylic acid = 37/60/3 (copolymer weight ratio) copolymer (Tg = −40 ° C.)
【００１５】比較例１ 実施例１において、（ｂ）成分としてポリブチルメタク
リレート樹脂（Ｔｇ＝２０℃）を用いた以外は同様に誘
電体層形成用フィルムを得て、同様に評価した。Comparative Example 1 A film for forming a dielectric layer was obtained in the same manner as in Example 1, except that a polybutyl methacrylate resin (Tg = 20 ° C.) was used as the component (b).
【００１６】比較例２ 実施例１において、（ａ）成分９８部、（ｂ）成分２部
とした以外は同様に誘電体層形成用フィルムを得て、同
様に評価した。Comparative Example 2 A film for forming a dielectric layer was obtained in the same manner as in Example 1, except that the component (a) was 98 parts and the component (b) was 2 parts.
【００１７】比較例３ 実施例１において、（ａ）成分５０部、（ｂ）成分５０
部とした以外は同様に誘電体層形成用フィルムを得て、
同様に評価した。実施例及び比較例の評価結果を表１に
示す。Comparative Example 3 In Example 1, (a) component 50 parts, (b) component 50
Parts except for obtaining a film for forming a dielectric layer,
It was evaluated similarly. Table 1 shows the evaluation results of the examples and the comparative examples.
【００１８】[0018]
【表１】 ＊ラミネート不良であったため、評価できず。[Table 1] * Cannot be evaluated due to poor lamination.
【００１９】[0019]
【発明の効果】本発明の誘電体層形成用フィルムは、基
板上との密着性に優れ、焼成後には良好な誘電体層が形
成され、ＰＤＰをはじめとする電極が形成されたガラス
基板等の誘電体層の形成に大変有用である。The film for forming a dielectric layer according to the present invention has excellent adhesion to the substrate, a good dielectric layer is formed after firing, and a glass substrate or the like on which electrodes such as PDP are formed. It is very useful for forming a dielectric layer.
フロントページの続き (51)Int.Cl.6 識別記号 ＦＩ Ｃ０８Ｌ 33:00 Continued on the front page (51) Int.Cl. 6 Identification code FI C08L 33:00
Claims (3)
（ｂ）Ｔｇ（ガラス転移温度）が１０℃以下のアクリル
系樹脂６〜４０重量％からなることを特徴とする誘電体
層形成用フィルム。(1) 60-94% by weight of a glass powder,
(B) A film for forming a dielectric layer, comprising 6 to 40% by weight of an acrylic resin having a Tg (glass transition temperature) of 10 ° C. or less.
リレートおよび／または２−エチルヘキシルアクリレー
トを共重合成分とするアクリル系共重合体であることを
特徴とする請求項１記載の誘電体層形成用フィルム。2. The dielectric layer according to claim 1, wherein the component (b) is an acrylic copolymer containing at least n-butyl acrylate and / or 2-ethylhexyl acrylate as a copolymer component. the film.
チルアクリレートおよび／または２−エチルヘキシルア
クリレートの共重合成分であることを特徴とする請求項
１または２記載の誘電体層形成用フィルム。3. The dielectric layer according to claim 1, wherein 50% by weight or more of the component (b) is a copolymerized component of n-butyl acrylate and / or 2-ethylhexyl acrylate. the film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32045397A JP3592507B2 (en) | 1997-11-05 | 1997-11-05 | Film for forming dielectric layer |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32045397A JP3592507B2 (en) | 1997-11-05 | 1997-11-05 | Film for forming dielectric layer |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11144611A true JPH11144611A (en) | 1999-05-28 |
| JP3592507B2 JP3592507B2 (en) | 2004-11-24 |
Family
ID=18121625
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32045397A Expired - Lifetime JP3592507B2 (en) | 1997-11-05 | 1997-11-05 | Film for forming dielectric layer |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3592507B2 (en) |
-
1997
- 1997-11-05 JP JP32045397A patent/JP3592507B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JP3592507B2 (en) | 2004-11-24 |
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