JPH11144589A - Manufacture of foil connecting conductor and manufacture of alloy type thermal fuse - Google Patents

Manufacture of foil connecting conductor and manufacture of alloy type thermal fuse

Info

Publication number
JPH11144589A
JPH11144589A JP32239797A JP32239797A JPH11144589A JP H11144589 A JPH11144589 A JP H11144589A JP 32239797 A JP32239797 A JP 32239797A JP 32239797 A JP32239797 A JP 32239797A JP H11144589 A JPH11144589 A JP H11144589A
Authority
JP
Japan
Prior art keywords
foil
conductor
copper foil
melting point
thickness
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32239797A
Other languages
Japanese (ja)
Other versions
JP3878732B2 (en
Inventor
Tomohiro Niwa
智宏 丹羽
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Uchihashi Estec Co Ltd
Original Assignee
Uchihashi Estec Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Uchihashi Estec Co Ltd filed Critical Uchihashi Estec Co Ltd
Priority to JP32239797A priority Critical patent/JP3878732B2/en
Publication of JPH11144589A publication Critical patent/JPH11144589A/en
Application granted granted Critical
Publication of JP3878732B2 publication Critical patent/JP3878732B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

PROBLEM TO BE SOLVED: To provide a foil connecting conductor safely weldable to the plate electrode of a super-thin type alloy thermal fuse by welding and connecting a foil conductor to a shaft-like conductor having a width smaller than the width of the foil conductor, a thickness larger than the thickness of the foil conductor and a melting point lower than the foil conductor, and foiling the connections and the shaft-like conductor by compression. SOLUTION: A substantially circular sectional shaft-like conductor 2 having a melting point lower than a copper foil 1 and a sectional area substantially equal to the sectional area of the copper foil 1 is welded to the copper foil 1. For the heating in welding, heating by contact of a heating block, hot air heating, or direct current-carrying heating is employed. The weld part and the shaft-like conductor are pressurized and molded into a foil having the same thickness as the copper foil. The foiling is performed by passing it to a rolling roll having a gap set to the thickness of the copper foil, compressing it by a press or the like. After the foiling, both the lateral sides are trimmed so as to be equal to the copper foil width, whereby a copper foil-low melting point metal foil connected body is provided.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は超薄型合金型温度ヒ
ュ−ズのヒュ−ズエレメントとして有用な箔状接続導体
の製造方法及び合金型温度ヒュ−ズの製造方法に関する
ものである。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a foil-like connecting conductor useful as a fuse element of an ultra-thin alloy type temperature fuse and a method for manufacturing an alloy type temperature fuse.

【0002】[0002]

【従来の技術】合金型温度ヒュ−ズにおいては、ヒュ−
ズエレメントに低融点可溶合金片を使用し、機器の異常
発熱による低融点可溶合金片の溶断で機器への給電を遮
断し、機器を保護している。近来、機器の小型化に伴い
温度ヒュ−ズの薄型化が要求されている。例えば、リチ
ウムイオン二次電池では、負極缶の上端部でガスケット
を介してかしめ固定する正極蓋端部と安全弁板端部との
間に平型温度ヒュ−ズを挾持することが提案されている
が、この平型温度ヒュ−ズに要求される厚みは、電池の
寸法上1mm以下の超薄厚である。
2. Description of the Related Art In an alloy type temperature fuse, a fuse is used.
A low-melting-point fusible alloy piece is used for the element, and the power supply to the equipment is cut off by fusing the low-melting-point fusible alloy piece due to abnormal heat generation of the equipment, thereby protecting the equipment. In recent years, with the miniaturization of devices, thinner temperature fuses have been required. For example, in a lithium ion secondary battery, it has been proposed that a flat temperature fuse is sandwiched between the end of a positive electrode lid fixed by caulking through a gasket at the upper end of a negative electrode can and the end of a safety valve plate. However, the thickness required for the flat temperature fuse is an ultrathin thickness of 1 mm or less in terms of the size of the battery.

【0003】図6は上記平型温度ヒュ−ズの一例を示
し、中央孔31’を有する絶縁スペ−サ3’の上下にプ
レ−ト電極4’,4’を設け、これらのプレ−ト電極
4’,4’間にヒュ−ズエレメントとしての低融点可溶
合金片20’を橋設した構成である。この平型温度ヒュ
−ズの超薄型化には、低融点可溶合金片を箔状とするこ
とが有効である。例えば、直径700μmの円形断面は
厚さ100μm×幅4000μmの箔の断面と同一断面
積であり、かかる箔状とすることにより低融点可溶合金
片の厚さを1/7にでき、温度ヒュ−ズの超薄型には低
融点可溶合金片の箔状化が有効である。
FIG. 6 shows an example of the above-mentioned flat type temperature fuse. Plate electrodes 4 'and 4' are provided above and below an insulating spacer 3 'having a central hole 31'. A low melting point fusible alloy piece 20 'as a fuse element is bridged between the electrodes 4', 4 '. To make the flat temperature fuse ultra-thin, it is effective to make the low melting point fusible alloy piece into a foil shape. For example, a circular section having a diameter of 700 μm has the same sectional area as a section of a foil having a thickness of 100 μm and a width of 4000 μm. By adopting such a foil shape, the thickness of the low melting point fusible alloy piece can be reduced to 1/7, and the temperature hue can be reduced. It is effective to make a low melting point fusible alloy piece into a foil for an ultra-thin alloy.

【0004】[0004]

【発明が解決しようとする課題】上記電池に組み込んだ
合金型温度ヒュ−ズにおいては、平常時でも、例えば日
間温度変化や季節的温度変化等により熱応力を受けるか
ら、低融点可溶合金箔とプレ−ト電極との間の安定な電
気的接触を確保するために、その接触箇所の溶接が必要
である。しかしながら、低融点可溶合金箔とプレ−ト電
極とを加熱ブロックの当接で溶接しようとすると、低融
点可溶合金箔が早く溶融し、プレ−ト電極が溶着可能な
温度になるまえに低融点可溶合金箔が溶断してしまい、
溶接が至難である。これに対し、瞬間的な溶接、例え
ば、スポット抵抗溶接やレザ−溶接では前記溶断は生じ
難いが、低融点可溶合金箔の溶接スポットが強力な集中
熱エネルギ−で飛散してしまい、満足な溶接は望めな
い。
In the alloy type temperature fuse incorporated in the above-mentioned battery, even under normal conditions, thermal stress is applied due to, for example, daily or seasonal temperature changes. In order to ensure stable electrical contact between the plate and the plate electrode, it is necessary to weld the contact point. However, when welding the low-melting-point fusible alloy foil and the plate electrode by abutment of the heating block, the low-melting-point fusible alloy foil is melted quickly, and before the temperature reaches a temperature at which the plate electrode can be welded. The low melting point fusible alloy foil melts,
Welding is very difficult. In contrast, the instantaneous welding, for example, spot resistance welding or laser welding, does not easily cause the fusing, but the welding spot of the low melting point fusible alloy foil is scattered by strong concentrated heat energy, which is satisfactory. Welding cannot be expected.

【0005】本発明の目的は、超薄型の合金型温度ヒュ
−ズのプレ−ト電極に安全に溶接できる箔状接続導体を
製造することにある。
It is an object of the present invention to produce a foil-like connecting conductor which can be safely welded to an ultra-thin alloy-type temperature fuse plate electrode.

【0006】[0006]

【課題を解決するための手段】本発明に係る箔状接続導
体の製造方法は箔状導体と、該箔状導体よりも低融点で
しかも厚さが箔状導体の厚さよりも大きく、かつ幅が同
箔状導体の幅よりも小さな軸状導体とを溶接により接続
し、而るのち接続部及び軸状導体を圧縮して箔状化する
ことを特徴とする構成である。本発明に係る合金型温度
ヒュ−ズの製造方法は、前記箔状接続導体の製造方法に
より製造した、両端に箔状導体を有する低融点金属箔を
プレ−ト電極間に配し、各箔状導体と各プレ−ト電極と
の間を溶接したことを特徴とする構成である。
SUMMARY OF THE INVENTION According to the present invention, there is provided a method for manufacturing a foil-shaped connection conductor, comprising: a foil-shaped conductor; a foil having a lower melting point than the foil-shaped conductor; Is characterized in that a shaft-like conductor smaller than the width of the foil-like conductor is connected by welding, and then the connecting portion and the shaft-like conductor are compressed to form a foil. The method for producing an alloy-type temperature fuse according to the present invention comprises the steps of: disposing a low-melting metal foil having a foil-like conductor at both ends, which is produced by the above-described method for producing a foil-like connection conductor, between plate electrodes; The structure is characterized by welding between the plate-shaped conductor and each plate electrode.

【0007】[0007]

【発明の実施の形態】以下、図面を参照しつつ本発明の
実施の形態について説明する。図1の(イ)〜図1の
(ハ)は本発明に係る箔状接続導体の製造方法の一例を
示し、箔状接続導体は厚さは50〜200μmの銅箔・
低融点金属箔接続体である。この銅箔・低融点金属箔接
続体を製造するには、まず図1の(イ)に示すように、
銅箔1に、この銅箔1よりも低融点でかつ断面積が銅箔
1の断面積にほぼ等しい(0.7〜1.5倍程度)断面
ほぼ円形の軸状導体2を溶接する。この溶接時の加熱に
は、加熱ブロックの当接による加熱、熱風加熱、直接通
電加熱(アプセット溶接)等を用いることができる。つ
いで、図1の(ロ)に示すように溶接部並びに軸状導体
を加圧して銅箔と同じ厚さの箔状に成形する。この箔状
化には、ギャップを銅箔厚さに設定した圧延ロ−ルに通
す方法、プレスで圧縮する方法等を使用できる。この箔
状化の終了後は、図1の(ハ)に示すように、銅箔幅に
揃えるように幅両端をトリミングし、これにて銅箔・低
融点金属箔接続体の製造を終了する。上記において、銅
箔以外に低融点金属箔よりも高融点の金属箔、例えば、
アルミニウム箔の使用も可能である。また、箔状導体に
は、厚さが箔状導体の厚さよりも大きく、かつ幅が同箔
状導体の幅よりも小さな断面角形(例えば、正方形や矩
形)や長円形の低融点軸状導体も使用できる。
Embodiments of the present invention will be described below with reference to the drawings. 1 (a) to 1 (c) show an example of a method for manufacturing a foil-like connection conductor according to the present invention. The foil-like connection conductor has a thickness of 50 to 200 μm.
It is a low melting point metal foil connector. In order to manufacture this copper foil / low melting point metal foil connection body, first, as shown in FIG.
An axial conductor 2 having a melting point lower than that of the copper foil 1 and a cross section substantially equal to the cross sectional area of the copper foil 1 (approximately 0.7 to 1.5 times) and having a substantially circular cross section is welded to the copper foil 1. As the heating at the time of welding, heating by contact of a heating block, hot air heating, direct current heating (upset welding), or the like can be used. Next, as shown in FIG. 1B, the welded portion and the shaft-shaped conductor are pressed to form a foil having the same thickness as the copper foil. For the formation of the foil, a method of passing the gap through a rolling roll set to a copper foil thickness, a method of compressing with a press, and the like can be used. After completion of the formation of the foil, as shown in FIG. 1C, both ends of the width are trimmed so as to be equal to the width of the copper foil, thereby completing the production of the copper foil / low melting point metal foil connection body. . In the above, a metal foil having a higher melting point than the low melting point metal foil other than the copper foil, for example,
The use of aluminum foil is also possible. In addition, the foil-shaped conductor has a low-melting-point shaft conductor having a rectangular cross section (for example, a square or a rectangle) or an ellipse whose thickness is larger than the thickness of the foil conductor and whose width is smaller than the width of the foil conductor. Can also be used.

【0008】本発明に係る箔状接続導体の製造方法にお
いては、低融点金属導体を箔状化するまえの軸形状で高
融点箔状導体に溶接しており、同一断面積のもとでの強
度は箔形状よりも軸形状の方が高く、低融点金属が溶接
温度で軟化しても、軸形状のもとでは箔形状の場合より
破断し難いから、低融点金属導体と高融点導体箔とを低
融点金属導体の溶断をよく防止して容易に溶接できる。
更に、溶接した軸体低融点金属導体の箔状化は展延加工
であり、引張り力を受けることがないから、軸体低融点
金属導体の破断なく容易に箔状化できる。従って、本発
明によれば、銅箔・低融点金属箔接続導体のような箔状
接続導体を容易に製作できる。
In the method for manufacturing a foil-shaped connection conductor according to the present invention, the low-melting-point metal conductor is welded to the high-melting-point foil conductor in a shaft shape before being formed into a foil, and the same cross-sectional area is used. The shaft shape is higher in strength than the foil shape, and even if the low melting point metal softens at the welding temperature, it is less likely to break under the shaft shape than the foil shape. Can be easily welded by preventing the low-melting metal conductor from being melted.
Furthermore, since the shaping of the welded low-melting metal conductor is a rolling process and does not receive a tensile force, the low-melting metal conductor can be easily formed into a foil without breaking. Therefore, according to the present invention, a foil-like connection conductor such as a copper foil / low-melting-point metal foil connection conductor can be easily manufactured.

【0009】図2は本発明により製造した銅箔・低融点
金属箔接続導体Aをヒュ−ズエレメントとする薄型温度
ヒュ−ズの一例を示している。図2において、3は中央
孔31を有する絶縁スペ−サであり、耐熱性プラスチッ
クフィルム(例えば、ポリエチレンテレフタレ−ト、ポ
リアミド、ポリイミド、ポリフエニレンサルファィド
等)やセラミックスプレ−トを使用できる。4,4は絶
縁スペ−サ3の上下面に接着剤41により固着したプレ
−ト電極であり、金属箔、例えば銅箔を使用できる。a
は本発明により製造した箔状接続導体を示し、低融点金
属箔20の両端に銅箔片10を有する構成であり、低融
点金属箔20を中央孔31に収容し、各銅箔片10を絶
縁スペ−サ3の上下各端面と各プレ−ト電極4との間に
挾み、各銅箔片10と各プレ−ト電極4との間をスポッ
ト抵抗溶接またはレザ−溶接等で溶接してある。5は中
央孔31に充填したフラックスである。
FIG. 2 shows an example of a thin temperature fuse using a copper foil / low melting point metal foil connecting conductor A manufactured according to the present invention as a fuse element. In FIG. 2, reference numeral 3 denotes an insulating spacer having a central hole 31, which uses a heat-resistant plastic film (for example, polyethylene terephthalate, polyamide, polyimide, polyphenylene sulfide, etc.) or a ceramic plate. it can. Reference numerals 4 and 4 denote plate electrodes fixed to the upper and lower surfaces of the insulating spacer 3 with an adhesive 41, and a metal foil such as a copper foil can be used. a
Denotes a foil-shaped connection conductor manufactured according to the present invention, which has a structure in which copper foil pieces 10 are provided at both ends of a low-melting metal foil 20, the low-melting metal foil 20 is accommodated in a central hole 31, and each copper foil piece 10 is It is sandwiched between the upper and lower end surfaces of the insulating spacer 3 and the respective plate electrodes 4, and the copper foil pieces 10 and the respective plate electrodes 4 are welded by spot resistance welding or laser welding. It is. Reference numeral 5 denotes a flux filled in the central hole 31.

【0010】図2に示す合金型温度ヒュ−ズを製作する
には、請求項1記載の発明で製造した、両端に銅箔片1
0を有する低融点金属箔20を絶縁スペ−サ3の中央孔
31に納め、その孔31にフラックス5を充填したの
ち、絶縁スペ−サ3の上下面にプレ−ト電極4を接着剤
41により固着すると共に各銅箔片10を各プレ−ト電
極4と絶縁スペ−サ3の上下各面との間で挾持し、つい
で各銅箔片10と各プレ−ト電極4とをスポット抵抗溶
接またはレザ−溶接等で溶接し、これにて当該合金型温
度ヒュ−ズの製作を終了する。上記銅箔片10とプレ−
ト電極4との溶接は瞬時かつスポット的に行っているか
ら、この溶接時での低融点金属箔20への熱伝導を充分
に排除でき、低融点金属箔20を安定に保持できる。従
って、請求項2記載の発明で製造した合金型温度ヒュ−
ズにおいては、図6に示すような合金型温度ヒュ−ズに
おいて、低融点金属箔20’をスポット的に熱エネルギ
−を集中させて直接にプレ−ト電極4’に溶接する場合
に生じる低融点金属の飛散を排除し得、低融点金属箔と
プレ−ト電極との間の安全な溶接を介して安定な電気的
導通を保証できる。
In order to produce the alloy type temperature fuse shown in FIG. 2, copper foil pieces 1 at both ends manufactured according to the invention of claim 1 are used.
The low-melting metal foil 20 having 0 is placed in the central hole 31 of the insulating spacer 3 and the hole 31 is filled with the flux 5, and then the plate electrode 4 is attached to the upper and lower surfaces of the insulating spacer 3 with the adhesive 41. And each copper foil piece 10 is clamped between each plate electrode 4 and the upper and lower surfaces of the insulating spacer 3, and then each copper foil piece 10 and each plate electrode 4 are spot-resistant. The welding is performed by welding or laser welding, and the production of the alloy-type temperature fuse is completed. The copper foil piece 10 and the pre-
Since welding with the electrode 4 is performed instantaneously and in a spot manner, heat conduction to the low melting point metal foil 20 during this welding can be sufficiently eliminated, and the low melting point metal foil 20 can be stably held. Therefore, the alloy type temperature heater manufactured by the invention of claim 2 is provided.
In the case of the alloy type temperature fuse shown in FIG. 6, the low melting point metal foil 20 'is formed by welding the spot directly to the plate electrode 4' by concentrating heat energy in a spot manner. Scattering of the melting point metal can be eliminated, and stable electrical conduction can be ensured through safe welding between the low melting point metal foil and the plate electrode.

【0011】図3は請求項2記載の発明により製作され
る合金型温度ヒュ−ズの別例を示している。この合金型
温度ヒュ−ズを請求項2記載の発明により製作するに
は、請求項1記載の発明により製造した、両端に銅箔片
10,10を有する低融点金属箔20を絶縁スペ−サ3
の上下面から中央孔31の内面にわたって沿わせ、中央
孔31にフラックス5を充填し、絶縁スペ−サ3の上下
面にプレ−ト電極4を接着剤41により固着し、各プレ
−ト電極4と各銅箔片10とをスポット抵抗溶接または
レザ−溶接等で溶接し、これにて当該合金型温度ヒュ−
ズの製作を終了する。
FIG. 3 shows another example of the alloy type temperature fuse manufactured according to the second aspect of the present invention. In order to manufacture the alloy type temperature fuse according to the second aspect of the present invention, the low melting point metal foil 20 having the copper foil pieces 10 at both ends manufactured according to the first aspect of the present invention is used as an insulating spacer. 3
The central hole 31 is filled with a flux 5 and the plate electrodes 4 are fixed to the upper and lower surfaces of the insulating spacer 3 with an adhesive 41. 4 and each copper foil piece 10 are welded by spot resistance welding, laser welding, or the like, whereby the alloy mold temperature hue is welded.
The production of the game ends.

【0012】上記図2及び図3に示す合金型温度ヒュ−
ズにおいて、プレ−ト電極4の厚さは50μm〜200
μm、低融点金属箔20及び銅箔片10の厚さは50μ
m〜200μm、絶縁スペ−サ3の厚さはほぼ100〜
900μm、接着剤層41の厚さは50〜200μm、
全厚さはほぼ300〜1000μmとされ、図4の
(イ)及び図4の(ロ)〔図4の(イ)におけるロ−ロ
断面図〕に示すように、リチウムイオン二次電池に組み
込んで使用される。図4において、61及び62は負極
缶63の上端部631でガスケット64を介して外周を
かしめ固定した正極蓋及び安全弁板を、aはこれらの間
に挾持した環状の超薄型温度ヒュ−ズをそれぞれ示して
いる。31は上記絶縁スペ−サの中央孔を示している。
The alloy type temperature hue shown in FIG. 2 and FIG.
The thickness of the plate electrode 4 is 50 μm to 200 μm.
μm, the thickness of the low melting point metal foil 20 and the copper foil piece 10 is 50 μm.
m to 200 μm, and the thickness of the insulating spacer 3 is almost 100 to
900 μm, the thickness of the adhesive layer 41 is 50 to 200 μm,
The total thickness is approximately 300 to 1000 μm, and as shown in FIG. 4A and FIG. Used in. In FIG. 4, reference numerals 61 and 62 denote an upper end portion 631 of a negative electrode can 63 and a positive electrode lid and a safety valve plate whose outer periphery is fixed via a gasket 64, and a denotes an annular ultra-thin temperature fuse sandwiched therebetween. Are respectively shown. Numeral 31 indicates a central hole of the insulating spacer.

【0013】図5に示すように、環状の一部を超薄型温
度ヒュ−ズaとし、他の部分bを超薄型温度ヒュ−ズa
と同じ厚さの補助絶縁スペ−サとした形態で使用するこ
ともできる。
As shown in FIG. 5, an annular part is an ultra-thin temperature fuse a and another part b is an ultra-thin temperature fuse a.
It can also be used in the form of an auxiliary insulating spacer having the same thickness as the above.

【0014】[0014]

【発明の効果】本発明によれば、厚さ50〜200μm
の超薄低融点金属箔の両端に同じ厚みの高融点金属箔が
溶接接続されてなる接続導体箔を容易に製造でき、かか
る接続導体箔を平型温度ヒュ−ズのヒュ−ズエレメント
として使用することにより厚み1000μm以下の超薄
型温度ヒュ−ズの製造が可能となる。
According to the present invention, the thickness is 50 to 200 μm.
And a high-melting-point metal foil of the same thickness welded to both ends of the ultra-thin low-melting-point metal foil can be easily manufactured, and such a connecting conductive foil is used as a fuse element of a flat temperature fuse. By doing so, it is possible to manufacture an ultra-thin temperature fuse having a thickness of 1000 μm or less.

【図面の簡単な説明】[Brief description of the drawings]

【図1】本発明に係る箔状接続導体の製造方法を示す図
面である。
FIG. 1 is a drawing showing a method for manufacturing a foil-shaped connection conductor according to the present invention.

【図2】本発明により製造した箔状接続導体使用の温度
ヒュ−ズの一例を示す図面である。
FIG. 2 is a drawing showing an example of a temperature fuse using a foil-shaped connection conductor manufactured according to the present invention.

【図3】本発明により製造した箔状接続導体使用の温度
ヒュ−ズの別例を示す図面である。
FIG. 3 is a drawing showing another example of a temperature fuse using a foil-shaped connection conductor manufactured according to the present invention.

【図4】図2または図3に示す温度ヒュ−ズの電池内へ
の内付け状態の一例を示す図面である。
FIG. 4 is a drawing showing an example of a state in which the temperature fuse shown in FIG. 2 or 3 is installed in a battery.

【図5】図2または図3に示す温度ヒュ−ズの電池内へ
の内付け状態の別例を示す図面である。
FIG. 5 is a drawing showing another example of a state in which the temperature fuse shown in FIG. 2 or 3 is installed in a battery.

【図6】従来の平型温度ヒュ−ズを示す図面である。FIG. 6 is a view showing a conventional flat temperature fuse.

【符号の説明】[Explanation of symbols]

1 箔状導体 2 軸状導体 A 銅箔・低融点金属箔接続導体 10 銅箔 20 低融点金属箔 3 絶縁スペ−サ 31 絶縁スペ−サの中央孔 4 プレ−ト電極 DESCRIPTION OF SYMBOLS 1 Foil conductor 2 Axial conductor A Copper foil / low melting point metal foil connection conductor 10 Copper foil 20 Low melting point metal foil 3 Insulating spacer 31 Central hole of insulating spacer 4 Plate electrode

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】箔状導体と、該箔状導体よりも低融点でし
かも厚さが箔状導体の厚さよりも大きく、かつ幅が同箔
状導体の幅よりも小さな軸状導体とを溶接により接続
し、而るのち接続部及び軸状導体を圧縮して箔状化する
ことを特徴とする箔状接続導体の製造方法。
1. A method for welding a foil conductor to a shaft conductor having a lower melting point than the foil conductor, a thickness larger than the thickness of the foil conductor, and a width smaller than the width of the foil conductor. , And thereafter, the connecting portion and the shaft-shaped conductor are compressed into a foil to form a foil-shaped connecting conductor.
【請求項2】請求項1記載の箔状接続導体の製造方法に
より製造した、両端に箔状導体を有する低融点金属箔を
プレ−ト電極間に配し、各箔状導体と各プレ−ト電極と
の間を溶接したことを特徴とする合金型温度ヒュ−ズの
製造方法。
2. A low-melting metal foil having a foil-like conductor at both ends, which is produced by the method for producing a foil-like connection conductor according to claim 1, is disposed between the plate electrodes. A method for producing an alloy-type temperature fuse, characterized in that the temperature is welded to a metal electrode.
JP32239797A 1997-11-06 1997-11-06 Alloy type temperature fuse manufacturing method Expired - Fee Related JP3878732B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32239797A JP3878732B2 (en) 1997-11-06 1997-11-06 Alloy type temperature fuse manufacturing method

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32239797A JP3878732B2 (en) 1997-11-06 1997-11-06 Alloy type temperature fuse manufacturing method

Publications (2)

Publication Number Publication Date
JPH11144589A true JPH11144589A (en) 1999-05-28
JP3878732B2 JP3878732B2 (en) 2007-02-07

Family

ID=18143215

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32239797A Expired - Fee Related JP3878732B2 (en) 1997-11-06 1997-11-06 Alloy type temperature fuse manufacturing method

Country Status (1)

Country Link
JP (1) JP3878732B2 (en)

Also Published As

Publication number Publication date
JP3878732B2 (en) 2007-02-07

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