JPH11139488A - Cover tape for carrying chip body, and sealed structural body - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent peeling of a cover tape from a carrier tape attributable to the difference in heat contraction ratio when a polystyrene carrier tape is used, and to prevent an adhesive from being left behind on the carrier tape formed of a material of relatively high polarity such as polycarbonate, polyvinyl chloride, or amorphous polyethylene terephthalate. SOLUTION: A cover tape 10 for carrying a chip comprises a tape-like base material 1, and a pressure-sensitive adhesive part 2 formed on each end in the longitudinal direction of one side of the case material 1 so as not to be opposite to a storage part, and the pressure-sensitive adhesive part 2 is formed of the pressure-sensitive adhesive mainly consisting of the copolymer in 100,000 to 2,000,000 in weight-average molecular weight where 50-99.94 pts.wt. (metha) acrylic ester having alkyl group of 1-10 in carbon number, 0.01-30 pts.wt. ethylene polymerizing monomer having a functional group, and 0.05-20 pts.wt. styrene monomer are copolymerized.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for packaging small articles such as small electronic components (hereinafter, also referred to as "chips") without contacting each other and integrally, and for storing, transporting or automatically removing the chips. The present invention relates to a cover tape for sealing a carrier tape to be used. The present invention also relates to a sealing structure using the cover tape.

[0002]

2. Description of the Related Art In recent years, electronic components such as resistors, capacitors, and IC integrated circuits have been miniaturized, and the trend toward chips has been rapidly advancing. Therefore, various methods have been proposed in which the chip body can be simultaneously stored, transported, and automatically taken out. Among them, the tape carrier system is regarded as the most promising system.

The conventional tape carrier system includes a system using a base material having through holes as a carrier tape and a system using a base material having a concave portion as a carrier tape.

In a system using a carrier tape having through holes, a large number of through holes are provided at regular intervals by punching or the like in a carrier tape made of a thick strip of paper or the like to form a housing portion. After providing a large number of feed holes, attaching a bottom tape to one surface of the carrier tape, storing a chip body such as a small electronic component in the housing portion, and laminating the other surface of the carrier tape with a cover tape. To enclose the chip body.

In the method using a base material having a concave portion as a carrier tape, a carrier tape having a plurality of concave portions provided at regular intervals on a belt-shaped plastic tape to form an accommodating portion and a perforation hole is used. After the chip body such as a small electronic component is housed in each housing part, it may be laminated and sealed with a cover tape.

[0006] In any of the above methods, a cover tape is used. As such a cover tape, a cover tape obtained by applying an adhesive to both longitudinal ends of one surface of a tape-shaped base material is used. ing. Examples of the tape-shaped substrate include polyethylene terephthalate, polyethylene, polypropylene, polystyrene, polyvinyl chloride,
Nylon, ionomer and the like are used. As the adhesive, a general-purpose acrylic, polyester or rubber pressure-sensitive adhesive has been used.
On the other hand, as the carrier tape, a tape made of polystyrene, polycarbonate, polyvinyl chloride, amorphous polyethylene terephthalate, or the like is used.

However, if such a conventional cover tape and carrier tape are used, the cover tape and the carrier tape may be peeled off during the transfer depending on the environment during the transfer, or the cover tape and the carrier tape may be separated after the transfer. When peeled, there was a problem that the adhesive was transferred (adhesive residue) to the carrier tape side.

In other words, in summer or offshore transportation,
It may be exposed to a high temperature of 50 ° C. or more, and in some cases, 70 ° C. or more. Under such a high temperature environment, a polystyrene carrier tape generally used as a carrier tape shrinks by about 2%. On the other hand, since the shrinkage of polyethylene terephthalate, which is widely used as a base material of the cover tape, is 0.1% or less, a difference in shrinkage occurs between the cover tape and the carrier tape. For this reason, the cover tape is excessive, the cover tape floats from the carrier tape, and the cover tape and the carrier tape are separated.

The above problem can be solved by increasing the adhesive strength of the adhesive layer of the cover tape.
There is a problem that, when the carrier tape having a relatively high polarity such as polycarbonate, polyvinyl chloride, or amorphous polyethylene terephthalate is used only by increasing the adhesive strength, adhesive residue remains on the carrier tape. If the adhesive remains on the carrier tape as described above, the adhesive adheres to the winding machine when winding up the used carrier tape, and the winding operation cannot be performed smoothly. There is also a disadvantage that the carrier tape cannot be reused.

The present inventors have made intensive studies to solve the above problems, and found that an adhesive obtained by introducing a small amount of styrene units into an acrylic copolymer was used as the adhesive layer of the cover tape. Thus, the inventors have found that the above problems are solved, and have completed the present invention.

Japanese Patent Application Laid-Open No. 6-49425 discloses an outgas prevention pressure-sensitive adhesive comprising a metal chelate compound and an acrylic copolymer having a small amount of styrene units introduced therein. However, the invention described in this publication is fundamentally different from the invention of the present application in the technical problem to be solved. Also, Japanese Patent Application Laid-Open No. 6-49425 does not suggest using the pressure-sensitive adhesive described in the publication in a cover tape.

JP-A-7-82542 discloses a pressure-sensitive adhesive for a polarizing plate or a retardation plate in which a styrene macromonomer is introduced into an acrylic copolymer. There is no mention of its use.

[0013]

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned prior art, and a first object of the present invention is to reduce the difference in heat shrinkage when using a polystyrene carrier tape. The purpose of the present invention is to prevent the separation between the cover tape and the carrier tape. Further, a second object of the present invention is to prevent a glue residue from being formed on a carrier tape when a relatively polar carrier tape such as polycarbonate, polyvinyl chloride or amorphous polyethylene terephthalate is used.

[0014]

SUMMARY OF THE INVENTION A cover tape for transporting a chip body according to the present invention is characterized in that a housing portion for housing a chip body is attached to a surface of a tape-shaped carrier tape formed intermittently in a longitudinal direction, and the housing section is provided with a housing section. A chip body transport cover tape for sealing the portion, a tape-shaped base material, a pressure-sensitive adhesive portion formed at both ends in one longitudinal direction of one side of the base material so as not to face the housing portion. The pressure-sensitive adhesive part comprises 50 to 99.94 parts by weight of a (meth) acrylic ester having an alkyl group having 1 to 10 carbon atoms, and 0.01 to 0.01 parts by weight of an ethylene polymerizable monomer having a functional group. It is formed from a pressure-sensitive adhesive mainly composed of a copolymer having a weight average molecular weight of 100,000 to 2,000,000 obtained by copolymerizing 30 parts by weight and a styrene monomer at 0.05 to 20 parts by weight. It is characterized by:

Further, the sealing structure according to the present invention comprises a tape-shaped carrier tape in which a large number of accommodating portions for accommodating a chip body are formed intermittently in a longitudinal direction, and is accommodated in the accommodating portion. In a sealing structure comprising a large number of micro-articles and a cover tape for chip body transport sealing the housing portion,
The chip body transport cover tape is the tip body transport cover tape according to the present invention.

According to the present invention, when a polystyrene carrier tape is used, the separation between the cover tape and the carrier tape due to the difference in the heat shrinkage can be prevented. In addition, when a relatively high-polarity carrier tape such as polycarbonate, polyvinyl chloride, or amorphous polyethylene terephthalate is used, adhesive residue generated on the carrier tape can be prevented.

[0017]

DETAILED DESCRIPTION OF THE INVENTION The cover tape for transporting a chip body according to the present invention will be described more specifically based on an embodiment shown in the drawings.

[0018] In the chip body transport cover tape according to the present invention, the accommodating portion accommodating the chip body is attached to a surface of a tape-shaped carrier tape formed intermittently in a longitudinal direction, and the accommodating portion is formed. Used for sealing.

FIG. 1 is a perspective view, partly in section, of a cover tape for transporting a chip body according to the present invention.
The usage state is shown. As shown in FIG. 1, a cover tape 10 for transporting a chip body according to the present invention
And a pressure-sensitive adhesive layer 2 formed at both longitudinal ends of one surface of the substrate 1.

The tape-shaped substrate 1 is preferably transparent, and the use of the transparent substrate makes it possible to easily identify the contained chips, thereby reducing mounting errors.

As the material of the substrate 1, various synthetic resins can be used, and preferably, stretched polyethylene terephthalate (PET), stretched polybutylene terephthalate (PBT), polyethylene naphthalate (PEN), stretched polyethylene (PE) , Stretched polypropylene (P
P), stretched polyamide, stretched polyvinyl chloride (PV
C), polystyrene, polycarbonate, polyethylene, polyacrylonitrile, etc., and their laminated films are used. Among these, in the present invention, stretched polyethylene terephthalate (PET), stretched polybutylene terephthalate (PBT), and polyethylene naphthalate (PEN) are particularly preferably used.

The thickness of the substrate 1 is preferably 6 to 200
μm, and more preferably 10 to 100 μm. Further, an antistatic treatment agent may be kneaded into the substrate 1.

The adhesive has a large amount of peeling charge, which sometimes impairs the reliability of the electronic component. However, such an antistatic treatment can prevent damage to the electronic component due to static electricity. .

The pressure-sensitive adhesive layer 2 is formed on one side of the substrate 1. The thickness of the pressure-sensitive adhesive layer 2 is not particularly limited, but is preferably 5 to 50 μm, and particularly preferably about 10 to 30 μm.

The pressure-sensitive adhesive layer 2 is obtained by copolymerizing a (meth) acrylate having an alkyl group having 1 to 10 carbon atoms, an ethylene polymerizable monomer having a functional group, and a styrene monomer. Formed from a pressure-sensitive adhesive containing a copolymer as a main component.

The (meth) acrylate having an alkyl group having 1 to 10 carbon atoms includes, for example, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, propyl acrylate, propyl methacrylate, acrylic acid Butyl, isobutyl acrylate,
Methacrylic acid, octyl acrylate and the like are used. Among them, alkyl groups having 2 to 8 carbon atoms (meth)
Acrylic esters are preferred, and methyl acrylate, butyl acrylate, isobutyl acrylate and octyl acrylate are particularly preferred.

The functional group of the ethylene polymerizable monomer includes a carboxyl group, a hydroxyl group, an amide group, an epoxy group and the like, and particularly preferably a carboxyl group, a hydroxyl group and an amide group. Therefore, specific examples of the ethylene polymerizable monomer having a functional group preferably used in the present invention include acrylic acid, methacrylic acid, 2-hydroxyethyl acrylate, acrylamide, itaconic acid, and 2-hydroxyethyl methacrylate. , Hydroxypropyl methacrylate, methylol acrylamide, glycidyl acrylate, glycidyl methacrylate and the like. Among them, acrylamide and 2-hydroxyethyl methacrylate are particularly preferably used. By introducing such a functional group, the cohesive force of the pressure-sensitive adhesive is increased, and even when a relatively high-polarity carrier tape such as polycarbonate, polyvinyl chloride or amorphous polyethylene terephthalate is used, the carrier tape may be used. It is possible to prevent the pressure-sensitive adhesive from remaining on the upper surface.

Examples of the styrene monomer include styrene, α-methylstyrene, divinylbenzene, vinyltoluene, pt-butylstyrene, p-methylstyrene and the like, with styrene being particularly preferred. By introducing such a styrene-based monomer into the pressure-sensitive adhesive, the adhesion to the styrene carrier tape is improved, and even if the carrier tape shrinks, the cover tape and the carrier tape can be separated. Can be prevented.

In the present invention, the copolymer used as the main component of the pressure-sensitive adhesive is obtained by random copolymerization of the above monomers. In such a copolymer, the structural unit derived from a (meth) acrylate ester is 50 to 9
It is present in a proportion of 9.94 parts by weight, preferably 60 to 99.80 parts by weight, and the structural unit derived from the ethylene polymerizable monomer having a functional group is 0.01 to 30 parts by weight, preferably 0 to 30 parts by weight. 0.1 to 25 parts by weight, and the structural unit derived from the styrene monomer is present in a proportion of 0.05 to 20 parts by weight, preferably 0.1 to 15 parts by weight.

The weight average molecular weight of the copolymer is 1
In the range of 100,000 to 2,000,000, preferably 200,000 to 15
It is in the range of 10,000. Further, in order to improve the cohesive force of the pressure-sensitive adhesive layer, the copolymer can be partially cross-linked by using a cross-linking agent. Specific examples of the crosslinking agent include compounds containing a glycidyl group in the molecule, such as neopentyl glycol diglycidyl ether, polyethylene glycol diglycidyl ether, bisphenol A
Diglycidyl ether, bisphenol F diglycidyl ether, diglycidyl phthalate, diglycidyl ether dimer, triglycidyl isocyanurate, diglycerol triglycidyl ether, sorbitol tetraglycidyl ether, N, N, N ', N'-
Epoxy crosslinking agent such as tetraglycidyl m-xylenediamine, 1,3-bis (N, N-diglycidylaminomethyl) cyclohexane, N, N, N ', N'-tetraglycidyldiaminodiphenylmethane, isocyanate in the molecule A compound containing a group, for example, an isocyanate-based crosslinking agent such as tolylene diisocyanate or diphenylmethane diisocyanate, a melamine-based crosslinking agent, a phenol-based crosslinking agent, a chelate-based crosslinking agent, or an aziridine-based crosslinking agent is used.

By partially cross-linking the copolymer constituting the pressure-sensitive adhesive layer 2 with a cross-linking agent, the cohesive force and peel strength of the obtained pressure-sensitive adhesive can be adjusted to an appropriate level. The crosslinking agent is used in an amount of preferably 0.001 to 1.0 mol, particularly preferably 0.01 to 0.75 mol, per 1 mol of the functional group present in the copolymer.

Further, the pressure-sensitive adhesive layer 2 of the present invention may have an adhesive force, a cohesive force, a tack, a molecular weight, a molecular weight distribution, and an elasticity of the pressure-sensitive adhesive, if necessary, as long as the object of the present invention is not impaired. To adjust the rate, glass transition point, hydrophilicity, water resistance, etc., hydrophilic plasticizers such as water-soluble polyhydric alcohols, tackifying resins, pigments, dyes, defoamers, preservatives, etc. may also be added. it can. Such other components vary depending on the purpose of adding each component, but preferably 0.01 to 2 parts by weight based on 100 parts by weight of the copolymer as the main component.
It is used at a ratio of about 0 parts by weight.

The cover tape for transporting a chip body according to the present invention comprises:
Specifically, it can be manufactured as follows. First, after the surface of a predetermined base material 1 is subjected to a release treatment using a release agent described later using a roll coater, a gravure coater, or the like, a pressure-sensitive adhesive layer 2 is applied to both ends in the longitudinal direction of the opposite surface of the treated surface. The coating is formed by a roll coater, a knife coater or the like.

Further, by applying a plurality of lines of a pressure-sensitive adhesive in the longitudinal direction of a relatively wide sheet, and cutting the longitudinal direction along the center line of the line-shaped pressure-sensitive adhesive, the present invention can be applied. Can also be manufactured.

[0035] Even if a polystyrene carrier tape is used, the chip body cover tape 10 according to the present invention is in close contact with the carrier tape.
The peeling of the cover tape and the carrier tape due to the difference in the heat shrinkage can be prevented. In addition, when a relatively high-polarity carrier tape such as polycarbonate, polyvinyl chloride, or amorphous polyethylene terephthalate is used, adhesive residue generated on the carrier tape can be prevented.

The cover tape for transporting a chip body of the present invention may be provided with a release layer on one surface of the substrate 1 (the surface on which the pressure-sensitive adhesive layer 2 is not formed). As the material of the release layer, a silicone-based, fluorine-based, or long-chain alkyl-based resin is used. Further, the base material 1 and the release layer may be subjected to an antistatic treatment. Antistatic treatment is carbon,
It is carried out by applying an antistatic treatment agent such as a metal, a metal oxide, a cation type, an anion type, a nonionic type and an organic polymer conductor. Further, in order to improve the adhesion between the substrate and the pressure-sensitive adhesive, one surface of the substrate may be subjected to a corona treatment.

The cover tape for transporting chips according to the present invention can be used, for example, as a sealing structure without any particular change to the conventional tape carrier system. In the method using a base material having a concave portion as a carrier tape (see FIG. 2), a large number of concave portions are provided at regular intervals in a belt-shaped plastic tape to form an accommodating portion, and a feed hole 13 is formed. Using the carrier tape 12,
After accommodating the chip body 14 such as a small electronic component in each accommodating portion, and laminating and sealing with the cover tape 10, a sealed structure accommodating a large number of electronic components is obtained.

In the method using a carrier tape having through holes (see FIG. 3), a large number of through holes are provided at regular intervals by punching or the like in a carrier tape 15 made of a thick strip of paper or the like. After a number of feed holes 13 are separately provided, a bottom tape is attached to one surface of the carrier tape 15 and a chip body 14 such as a small electronic component is stored in the storage portion. The sealing structure is obtained by laminating the other surface of the substrate 15 with the cover tape 10 and enclosing the chip body.

Although the cover tape and the sealing structure for transporting a chip body according to the present invention have been described above, the present invention is not limited to these, and includes partial modifications and additions. For example, the material of the base material is not limited to the exemplified materials as long as the object of the present invention is not impaired, and can be variously changed. Further, the chip body accommodated in the accommodating portion of the carrier tape is not limited to small electronic parts, but also small mechanical parts,
Alternatively, it may be a tablet or the like.

[0040]

As described above, according to the present invention, it is possible to prevent peeling of the cover tape and the carrier tape which occur at the time of high-temperature transport, and to prevent adhesive residue on the carrier tape. Thus, according to the present invention, a sealing structure capable of stably transporting a large number of electronic components is provided.

[0041]

EXAMPLES Hereinafter, the present invention will be described more specifically with reference to examples, but the present invention is not limited to these examples.

In the following Examples and Comparative Examples, evaluations of "tape floating" and "adhesive residue" were performed according to the following methods. [Floating tape] The cover tape for conveying chip bodies obtained in Examples and Comparative Examples was adhered to a carrier tape made of polystyrene, and allowed to stand at 70 ° C for 24 hours. It was determined visually.

[Residual adhesive] After evaluating the "floating tape", the cover tape was peeled off, and the presence or absence of residual adhesive on the polystyrene carrier tape was visually determined.

[0044]

Example 1 [Preparation of pressure-sensitive adhesive] In a four-necked flask equipped with a reflux condenser, a stirrer, a thermometer, an inert gas inlet tube, and a dropping funnel, 92 parts by weight of butyl acrylate and acrylic acid 4. 5 parts by weight, 2-hydroxyethyl acrylate 0.
5 parts by weight, 3 parts by weight of styrene, 200 parts by weight of ethyl acetate, 0.5 parts by weight of azobisisobutyronitrile were added,
After stirring for 30 minutes in a nitrogen stream, the reaction was carried out at 60 ° C. for about 8 hours to obtain a copolymer.

To 100 parts by weight of the solid content of the copolymer obtained above, 0.2 parts by weight of hexamethylene diisocyanate was added as a crosslinking agent, and the mixture was sufficiently stirred to obtain a pressure-sensitive adhesive. . [Manufacture of cover tape for transporting chip body] A tape-shaped polyethylene terephthalate film having a width of 9.3 cm and a thickness of 25 µm, obtained by subjecting the pressure-sensitive adhesive obtained as described above to a peeling treatment on one side and a corona treatment on the other side. 22 on corona treated surface
g / m ² to obtain a cover tape for chip body transport.

Using this pressure-sensitive adhesive sheet, "floating tape" and "adhesive residue" were evaluated by the above method. Table 1 shows the results.

[0047]

Comparative Example 1 The same operation as in Example 1 was performed except that styrene was not used at the time of preparing the pressure-sensitive adhesive.

Table 1 shows the results.

[0049]

Comparative Example 2 The same operation as in Example 1 was carried out except that 95 parts by weight of butyl acrylate and 5 parts by weight of acrylic acid were used when preparing the pressure-sensitive adhesive, and 2-hydroxyethyl acrylate and styrene were not used. Was.

Table 1 shows the results.

[0051]

[Table 1]

[Brief description of the drawings]

FIG. 1 is a perspective view, partly in section, of a cover tape for conveying chip bodies according to the present invention.

FIG. 2 is a schematic explanatory view of a sealing structure according to the present invention.

FIG. 3 is a schematic explanatory view of a sealing structure according to the present invention.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Base material 2 ... Pressure-sensitive adhesive part 10 ... Cover tape for chip body transport 12 ... Carrier tape 13 ... Hole for feeding 14 ... Chip body 15 ... Carrier tape

Claims (2)

[Claims] An accommodating portion for accommodating a chip body is attached to a surface of a tape-shaped carrier tape formed intermittently in a longitudinal direction, and a chip body transporting cover tape for sealing the accommodating portion is provided. A tape-shaped base material, and a pressure-sensitive adhesive portion formed at both ends in the longitudinal direction of one surface of the base material so as not to face the housing portion; and the pressure-sensitive adhesive portion is made of carbon. 50 to 99.94 parts by weight of a (meth) acrylate having an alkyl group of the number 1 to 10, and 0.01 to 0.01 of an ethylene polymerizable monomer having a functional group
It is formed from a pressure-sensitive adhesive mainly composed of a copolymer having a weight average molecular weight of 100,000 to 2,000,000 obtained by copolymerizing 30 parts by weight and a styrene monomer at 0.05 to 20 parts by weight. A cover tape for conveying chip bodies, characterized in that: 2. A tape carrier tape in which a large number of accommodation sections for accommodating a chip body are formed intermittently in a longitudinal direction, a large number of minute articles accommodated in the accommodation section, and the accommodation section. A sealing structure comprising a chip body transport cover tape to be sealed, wherein the chip body transport cover tape is the tape according to claim 1.