JPH11139053A - Production of ic card for certification discrimination - Google Patents

Abstract

PROBLEM TO BE SOLVED: To restrain cost increase due to format printing of an IC card for certification discrimination to be produced by continuous production method. SOLUTION: In the production of an IC card which is produced by a method in which the first substrate 1 having an image receiving layer for receiving a sublimation heat transfer image on outer surface and the second substrate 2 having a writing layer on the outer surface are made to face each other, parts including IC chips 6 are mounted at prescribed positions between the substrates 1, 2, and a resin is packed, after lengthy sheets which constitute the substrates 1, 2 being laminated, before being punched in a prescribed size, standard-size printing 91 is applied.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method of manufacturing a non-contact type IC card used for an identification card such as a driver's license, an employee card, a membership card, an alien registration card, a student card, and the like.

[0002]

2. Description of the Related Art A non-contact type IC card has no components on its surface, so it is advantageous for forming an authentication identification image such as a face image on the surface, performing printing, and preventing forgery and falsification. It is suitable for use as a card (hereinafter, also referred to as an ID card). When used as an ID card, usually one side has a card title, face image, bibliographic information, etc., and the other side is often a writable surface for the purpose of additional writing, etc. Format, which is also formed by printing.

[0003] By the way, as a method of manufacturing a non-contact type IC card, a heat bonding method, an adhesive bonding method and an injection molding method are known. Among them, the adhesive bonding method has a low processing temperature and is used. Because there are few restrictions on the card base material, there is an advantage in the selection of a receiving layer, a writable layer, etc. in the thermal transfer and sublimation image forming method for forming an authentication identification image and bibliographic information,
Also, since it is a continuous production method, it is advantageous for mass production.

In addition, the present applicant has a disadvantage in the adhesive bonding method, that is, in order to place a component including an IC chip in a predetermined position before filling the resin, the shearing force due to the flow of the resin is used. A resin layer is formed in advance on a substrate sheet in order to eliminate a lack of stability such as a detached joint, loss of surface smoothness due to resin flow or cooling, and the like. A manufacturing method for enclosing parts was proposed (Japanese Patent Application No. 9-275702, etc.).

An IC card formed as a continuous sheet by the adhesive bonding method or the resin layer enclosing method is cut into a predetermined size to be a single-sheet card. At the same time as or before the authentication identification image and the bibliographic items are recorded on this single-sheet card, a format such as a ruled line and a description item name is recorded.

[0006]

However, performing format printing on a single-sheet IC card in this way increases the cost. Therefore, we considered performing format printing on the long substrate sheet in advance.However, both the adhesive lamination method and the resin layer encapsulation method undergo a heating and pressing process at the time of lamination or encapsulation. The positional relationship between the two may shift.
In addition, when a long substrate sheet that has been subjected to format printing is stored in advance, the format may be expanded or contracted to change the aspect ratio of the format or to change the color tone of printing, depending on conditions. Further, there is a problem that it is difficult to control the timing for aligning the opposing substrate sheets at the time of bonding.

The present invention has been made in view of the above circumstances, and an object of the present invention is to suppress an increase in cost of an authentication / identification IC card manufactured by a continuous production method due to format printing.

[0008]

SUMMARY OF THE INVENTION It is an object of the present invention to provide a method wherein a first substrate having an image receiving layer for receiving a sublimation thermal transfer image on an outer surface thereof and a second substrate having a writable layer on the outer surface are opposed to each other. In order to manufacture an IC card in which a component including an IC chip is placed at a predetermined position therebetween and filled with resin, after bonding the long sheets constituting the two substrates,
This is achieved by a method of manufacturing an IC card that performs fixed-form printing before punching into a predetermined size.

[0009]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, embodiments of the present invention will be described with reference to the drawings, but embodiments of the present invention are not limited thereto. FIG. 1 is a sectional view showing a first substrate sheet material, and FIG. 2 is a sectional view showing a second substrate sheet material.

In FIG. 1, a first substrate sheet material 1 comprises:
The film support 11 has an image receiving layer 2 on one side and a thermosetting resin layer 3a on the other side. The image receiving layer 2 is formed of a material that traps and fixes the dye when the ink composed of the sublimable dye is heated and diffused by the thermal head. For example, a good image receiving layer is formed of vinyl chloride, polyacetal, polybutyral, or the like. Also known as Generally, these materials for the image receiving layer 2 are formed into powders, dissolved in a solvent such as isocyanate, applied by a gravure coater or the like, and then passed through a drying unit to volatilize the solvent.

The film support 11 is made of, for example, polyethylene terephthalate (PET), polypropylene (PP), or the like in which a white pigment is mixed or air bubbles are folded into a honeycomb structure in order to enhance the formed image. You.

To form a multi-gradation image for authentication and identification on the image receiving layer 2, the pulse width applied to the thermal head is changed so that the thermal head has a gradation for each dot.
The amount of thermal diffusion of the sublimable dye ink is controlled.
When the film support 11 has a honeycomb structure containing air bubbles, the contact with the thermal head becomes uniform, and since the heat insulating property is good, the cutting of each dot becomes good, and a good image can be obtained.

The thermosetting resin 3a is formed of, for example, a gel epoxy resin generally called a B-stage epoxy. In order to form the thermosetting resin 3a as a thick film, a film is formed on the film support 11 by using a die called extrusion, and extruding the resin by applying pressure with a pump.

In FIG. 2, the second substrate sheet material 4 is
The film support 12 has a writable layer 5 on one side and a thermosetting resin layer 3b on the other side. The film support 12 may have any function as its original required function. However, when the card is heated under pressure, if the upper and lower material constitutions are symmetrical, the warpage is small and a flat surface is obtained. Of the same bubble-containing white PET as the film support 11 of the substrate sheet material. The thermosetting resin 3b has exactly the same configuration as the thermosetting resin 3a.

The writable layer 5 is formed, for example, by dispersing calcium carbonate, silica fine particles and the like in a polyester emulsion, and is dissolved in a solvent, like the image receiving layer 2 of the first substrate sheet material 1, and is then coated with a gravure coater or the like. After the application, it is formed by evaporating the solvent through a drying section. The thickness of the writable layer 5 is also substantially the same as that of the image receiving layer 2.

A first substrate sheet material 1 having an image receiving layer 2 on one side and a thermosetting resin layer 3a on the other side shown in FIG.
And a second substrate sheet material 4 having a writable layer 5 on one side and a thermosetting resin layer 3b on the other side shown in FIG. 2 with the thermosetting resin layers 3a and 3b separated from each other. The IC component 6 shown in FIGS. 3 and 4 is inserted between the thermosetting resin layers 3a and 3b of the first and second substrate sheet materials 1 and 4 so as to face each other. Second substrate sheet material 1,
4 are superposed and heated under pressure, and punched out to manufacture an IC card CA. This IC card CA is shown in FIG. 3, and the IC component 6 is shown in FIG.

FIG. 3 is a sectional view showing an IC card. I
The thickness of the C card CA is specified by, for example, the ISO standard.
It comprises first and second substrate sheet materials 1 and 4 and a thermosetting resin layer 3 interposed between the first and second substrate sheet materials 1 and 4. On the surface of the first substrate sheet material 1, an image receiving layer 2 for printing an image and written information, and a second substrate sheet material 4
A writable layer 5 is adhered to the surface of. A wireless IC component 6 is sealed in the thermosetting resin layer 3. The thermosetting resin layer 3 is, for example, an epoxy resin applied to the first substrate sheet material 1 and the second substrate sheet material 4 with a predetermined thickness in the form of a gel. And cured by pressurizing and heating.

FIG. 4 is a perspective view showing a wireless IC component.
In this figure, the wireless IC component 6 is a method of starting signal processing after first receiving a radio wave for a power supply,
The built-in component includes an antenna 7 for radio wave reception and a printed circuit board 10 on which a chip capacitor 8 and an LSI 9 are mounted.

The wireless IC component 6 has an antenna 7 having a diameter of, for example, 0.5 mm. A lmm urethane wire is wound about 50 turns, and the thickness is suppressed to, for example, about 0.3 mm. The part of the printed circuit board 10 mounted on the LSI 9 is an LSI
9 has a thickness of 0.3 mm, so that the thickness of 0.45
The thickness is about mm.

FIG. 5 shows a method of manufacturing an IC card according to the present invention.
FIG. 4 shows a schematic process of an example. In the figure, the film support 11 of the first substrate sheet material 1 sent out by the rotation of the sending shaft 21 reaches the gravure coater roll 31, and the reverse rotation of the gravure coater roll 31 causes the image receiving layer coating solution container 30 to move to one side. Is applied to form an image receiving layer 2 on the surface.

Next, the guide roller 23 is passed over the drive roller 24 to reach the extrusion die 40 facing the opposite side of the image receiving layer 2, and the thermosetting resin solution is applied to the support 11, and is transported in the transport direction. By passing through the drying unit 41 arranged on the downstream side, the solvent of the image receiving layer 2 and the solvent of the thermosetting resin layer 3a are vaporized, and the layers on both sides are formed.

On the other hand, the film support 12 of the second substrate sheet material 4 sent out from the feed shaft 50 reaches the gravure coater roll 61, and the gravure coater roll 61 is rotated in the reverse direction so that the writing layer coating solution container 60 The writable layer coating liquid 62 in the inside is applied to form the writable layer 5 on the surface.

Next, the guide layer 51 is passed over a drive roller 52 to reach an extrusion die 43 facing the other side of the writing layer 5, and a thermosetting resin solution is applied to the support 12 and transported. By passing through the drying unit 42 disposed on the downstream side in the direction, the solvent of the writable layer 5 and the solvent of the thermosetting resin layer 3b is vaporized to form layers on both surfaces.

The first substrate sheet material 1 thus formed has an image receiving layer 2 on one side of a film support 11 and a thermosetting resin layer 3a on the other side. Lumber 4
Has a writable layer 5 on one side of the film support 12 and a thermosetting resin layer 3b on the other side. The first substrate sheet material 1 and the second substrate sheet material 4 are separated from each other. The sheet is conveyed along the conveyance path 70 while coming into contact from the opposite state. The wireless IC components 6 are inserted one by one at the positions where the first substrate sheet material 1 and the second substrate sheet material 4 face each other at a distance.

The transport path 70 is provided with a protective film supply section 7 along the transport direction of the first and second substrate sheet materials 1 and 4.
1. Vacuum hot press section 72, fixed form printing section 91, punching section 73
And a cutting section 74.

The protective film supply section 71 is provided with a first protective film supply section 7 which is disposed opposite to the upper and lower sides of the transport path 70.
1a and a second protective film supply section 71b. The first and second protection film supply units 71a and 71b include supply shafts 71a1 and 71b1 and winding shafts 71a2 and 71b2, and supply the first and second protection films 28 and 29 in the direction of the arrow.

The vacuum heat press section 72 includes a flat vacuum heat press upper mold 72a and a vacuum heat press lower mold 72b which are arranged to face each other up and down the transfer path 70. The upper vacuum heat press mold 72a and the lower vacuum heat press mold 72b are provided so as to be movable in directions of coming and coming from each other. Vacuum heat press upper mold 72a
The lower mold 72b may be a heat roller instead of a flat mold. However, in consideration of cracking of the wireless IC component 6, a roller close to the line contact and to which an excessive bending force is applied even with a slight displacement is used. It is preferable to use a flat press type avoiding this.

In this embodiment, the fixed-form printing section 91 includes print heads 91a and 91b which are disposed to face each other up and down the transport path 70, and a sensor 90 which detects an antenna position of an IC chip. The printing means used in the standard printing section is a normal printing such as offset printing, silk screen printing, letterpress printing, gravure printing, a contact method such as an electrophotographic method, a fusion heat transfer method, or a non-contact method such as an ink jet printer. May be. In this case, the sensor 9
Although the position of the IC chip is controlled by detecting the antenna position of the IC chip based on 0, the control may be performed at a predetermined timing.

The punching section 73 comprises a card punching upper die 73a and a card punching lower die 73b which are arranged to face the transport path 70 up and down. The card punching upper die 73a is movable in the vertical direction, and the first and second substrate sheet materials 1,
4 are completely welded after heat welding, and then punched into the size of the IC card CA. A storage section 80 is provided below the card punching die 73b for sequentially stacking and storing the extracted IC cards CA.

Further, in order to completely solidify the adhesive, after printing, cut every 5 to 10 cards and stock them.
After a predetermined time, the card may be punched.

The cutting section 74 includes a waste material upper mold 74a and a waste material lower mold 7 that are disposed above and below the transport path 70 so as to face each other.
4b, the waste material cutter upper mold 74a is provided so as to be vertically movable, and cuts the waste material 84 into a predetermined size. A storage section 85 for stacking and storing the cut waste materials 84 is provided below the cutting section 74.

The first and second substrate sheet materials 1 and 4 having the coating layers formed on both surfaces are opposed to each other via the drive roller 24 and the drive roller 52 and are taken out one by one on the substrate sheet material 4. The wireless IC component 6 is placed. Thereafter, the first protective film 28 and the second protective film 29 are fed between the upper vacuum heat press die 72a and the image receiving layer 2 and between the lower vacuum heat press die 72b and the writable layer 5, and the first and second protective films 29 are formed. The second protective films 28, 29 and the first and second substrate sheet materials 1, 4 are pressurized and heated by the upper and lower molds 72a and 72b. Thereby, the gel-like thermosetting resins 3a, 3b of the first and second substrate sheet materials 1, 4 are formed.
Is cured, and the wireless IC component 6 is sealed. Each time the protective films 28 and 29 are pressed, the vacuum heat press upper die 7 is pressed.
2a, the lower mold 72b, the image receiving layer 2, and the writable layer 5 are strongly pressed and heated to cause damage. If the protective films 28 and 29 are peeled off in a high temperature state, the image receiving layer 2 may be partially peeled off. Then, you can peel it off cleanly.

In general, since a gel-like layer is pressed, air is often entrapped in the thermosetting resins 3a and 3b, and bubbles are often left. For this reason, the vacuum heat press upper mold 72a and lower mold 72b are set to a negative pressure at the periphery before both molds are strongly pressurized and heated to remove air and prevent generation of bubbles.

Next, the first and second protective films 28,
After the 29 has been peeled off, the first and second substrate sheet materials 1 and 4 which have been completely welded together are subjected to fixed-form printing on both sides simultaneously or individually in a fixed-form printing section 91, and furthermore, a card punching upper mold 73a. And the card punching die 73b,
As the card punching upper die 73a descends, the IC card CA is punched to the size of the IC card CA. The punched IC cards CA are sequentially stacked on the storage unit 80 and stored. IC
Since the thermosetting resins 3a and 3b are hardened, and the card waste material after the card is punched out is thick and hard, it cannot be wound up. For this reason, the waste material cutter upper mold 74a,
The waste material cutter lower mold 74b is driven, cut as waste material 84, and stored in the storage unit 85.

In a series of these steps, it is preferable to control the timing so that the supply of the IC component 6, the standard printing, the punching, and the conveyance correspond to, for example, the pulse of the feed motor as a reference signal.

[0036]

According to the present invention, after the long sheets constituting the two opposing substrates are pasted to each other, fixed-size printing is performed before punching into a predetermined size.
It is possible to suppress an increase in cost due to format printing.

[Brief description of the drawings]

FIG. 1 is a side sectional view showing an example of a first substrate sheet material having an image receiving layer on an outer surface.

FIG. 2 is a side sectional view showing an example of a second substrate sheet material having a writable layer on the outer surface.

FIG. 3 is a side sectional view of the IC card.

FIG. 4 is a perspective view showing an IC component.

FIG. 5 is a schematic view showing one example of a process of an IC card manufacturing method according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 first substrate sheet material 2 image receiving layer 3 a, 3 b thermosetting resin layer 4 second substrate sheet material 5 writable layer 6 IC component (wireless IC component) 11, 12 film support 21, 50 delivery shaft 23, Reference Signs List 51 Guide roller 24, 52 Drive roller 28, 29 Protective film 31, 61 Gravure coater roll 32 Image receiving layer coating liquid 40, 43 Extrusion die 41, 42 Drying unit 62 Writable layer coating liquid 70 Transport path 71 Protective film supply unit 72 Vacuum heat press unit 73 Punching unit 74 Cutting unit 80, 85 Storage unit 84 Waste material 90 Sensor 91 Standard printing unit

Claims (1)

[Claims] A first substrate having an image receiving layer for receiving a sublimation thermal transfer image on an outer surface thereof is opposed to a second substrate having a writable layer on the outer surface, and an IC chip is provided at a predetermined position therebetween. In manufacturing an IC card in which the components including the components are placed and filled with resin, after the long sheets constituting the two substrates are pasted together, the fixed-size printing is performed before punching into a predetermined size. Manufacturing method of an authentication identification IC card.