JPH11133394A - Liquid crystal display device - Google Patents
Liquid crystal display deviceInfo
- Publication number
- JPH11133394A JPH11133394A JP9309672A JP30967297A JPH11133394A JP H11133394 A JPH11133394 A JP H11133394A JP 9309672 A JP9309672 A JP 9309672A JP 30967297 A JP30967297 A JP 30967297A JP H11133394 A JPH11133394 A JP H11133394A
- Authority
- JP
- Japan
- Prior art keywords
- liquid crystal
- circuit board
- lead frame
- led
- backlight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3405—Edge mounted components, e.g. terminals
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3421—Leaded components
- H05K3/3426—Leaded components characterised by the leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Abstract
Description
【0001】[0001]
【発明の属する技術分野】本発明は、LEDバックライ
トを使用する液晶表示装置に関するものである。[0001] 1. Field of the Invention [0002] The present invention relates to a liquid crystal display device using an LED backlight.
【0002】[0002]
【従来の技術】近年、電子楽器,電装品,情報端末機器
等に求められる液晶表示装置のバックライトには、低消
費電力で高寿命であることが必要とされるため、LED
バックライトの採用が増加している。また、LEDバッ
クライト構成においては、低コストで薄型化を実現でき
るエッジライト構成のものが主流となってきている。ま
た、LED実装形態においては、明るさと発光色につい
て多種のLED素子の実装に対応できるため、プリント
基板にLED素子を実装するタイプのものが用いられて
いる。2. Description of the Related Art In recent years, a backlight of a liquid crystal display device required for electronic musical instruments, electric components, information terminal equipment, and the like is required to have low power consumption and a long life.
The adoption of backlight is increasing. In the LED backlight configuration, an edge backlight configuration that can realize low cost and thinness has become mainstream. Further, in the LED mounting mode, a type in which LED elements are mounted on a printed circuit board is used because various kinds of LED elements can be mounted for brightness and emission color.
【0003】以下に従来のエッジライト構成のLEDバ
ックライトを用いた液晶表示装置について説明する。Hereinafter, a liquid crystal display device using a conventional LED backlight having an edge light configuration will be described.
【0004】図2は従来の液晶表示装置の構成を示す要
部分解斜視図である。図2において、21は液晶表示パ
ネル、22は液晶表示パネル21を駆動するための駆動
回路が搭載されたプリント基板からなる液晶駆動回路基
板、23は液晶表示パネル21と液晶駆動回路基板22
をゴム圧縮により電気的に接続するための導電性ゴム、
24は導電性ゴム23の圧縮保持を行い、液晶表示パネ
ル21と液晶駆動回路基板22を保持する金属フレー
ム、25はLED素子、26はLED回路パターンが敷
設され、LED素子25が実装されたLED実装基板で
ある。また、LED実装基板26にはバックライト電源
を入力するためのバックライト電極ランド27が敷設さ
れている。28は反射板29が裏面に貼り付けられた導
光板であり、LED実装基板26と固定されることでバ
ックライトを構成して液晶表示パネル21の裏面から光
を照射する。バックライトと液晶駆動回路基板22との
電気的接続手段は、白抜矢印のようにLED実装基板2
6の一部を液晶駆動回路基板22に設けた穴部30に挿
入し、バックライト電極ランド27と液晶駆動回路基板
22の裏面側に敷設されたバックライト入力ランド31
を裏面側で半田付けすることにより行うものである。FIG. 2 is an exploded perspective view of a main part showing the structure of a conventional liquid crystal display device. In FIG. 2, reference numeral 21 denotes a liquid crystal display panel, 22 denotes a liquid crystal drive circuit board formed of a printed circuit board on which a drive circuit for driving the liquid crystal display panel 21 is mounted, and 23 denotes the liquid crystal display panel 21 and the liquid crystal drive circuit board 22.
Conductive rubber for electrically connecting the
24 is a metal frame that compresses and holds the conductive rubber 23 and holds the liquid crystal display panel 21 and the liquid crystal drive circuit board 22; 25 is an LED element; and 26 is an LED on which an LED circuit pattern is laid and the LED element 25 is mounted. It is a mounting board. A backlight electrode land 27 for inputting a backlight power supply is laid on the LED mounting board 26. Reference numeral 28 denotes a light guide plate on which a reflection plate 29 is attached on the back surface. The light guide plate 28 is fixed to the LED mounting board 26 to constitute a backlight and emit light from the back surface of the liquid crystal display panel 21. The electrical connection between the backlight and the liquid crystal drive circuit board 22 is made by the LED mounting board 2 as shown by the white arrow.
6 is inserted into a hole 30 provided in the liquid crystal drive circuit board 22, and a backlight electrode land 27 and a backlight input land 31 laid on the back side of the liquid crystal drive circuit board 22 are inserted.
Is soldered on the back side.
【0005】次にその動作について説明する。まず、液
晶駆動回路基板22の裏面側からバックライト入力ラン
ド31を通じてLEDの電源が入力されると、LED素
子25が発光して導光板28の側面部より入光される。
導光板28に入った光は、反射板29により反射しバッ
クライト上面部から照射される。Next, the operation will be described. First, when the power of the LED is input from the back side of the liquid crystal drive circuit board 22 through the backlight input land 31, the LED element 25 emits light and enters from the side surface of the light guide plate.
The light entering the light guide plate 28 is reflected by the reflection plate 29 and emitted from the upper surface of the backlight.
【0006】[0006]
【発明が解決しようとする課題】しかしながら前記の従
来の構成では、バックライト電極がLED実装基板26
上に設けられたバックライト電極ランド27であるため
に、LED実装基板26と導光板28の固定においてL
ED実装基板26に導光板28を溶着接続するための穴
を設ける必要があり、LED実装基板26の幅寸法が大
きくなることでバックライト全体の厚みが厚くなってし
まうことになり、またLEDバックライトに電源入力す
るには、液晶駆動回路基板22をバックライト電極直下
にあたる部分に配置させ、バックライト電極ランド27
挿入用の穴部30と裏面側にバックライト入力ランドを
設けてバックライト取り付け面の反対面側にて半田付け
により電気的接続を行う必要性があり、液晶表示装置の
全体の厚みが厚くなる。その上、液晶駆動回路基板22
における電気部品配置の設計自由度が低くなってしまう
ために、液晶駆動回路基板22が大きくなってしまうと
いう問題点も有していた。However, in the above-mentioned conventional configuration, the backlight electrode is mounted on the LED mounting board 26.
Since the backlight electrode land 27 is provided on the LED mounting board 26 and the light guide plate 28,
It is necessary to provide a hole for welding and connecting the light guide plate 28 to the ED mounting board 26, and an increase in the width of the LED mounting board 26 results in an increase in the thickness of the entire backlight. In order to input power to the light, the liquid crystal drive circuit board 22 is disposed in a portion immediately below the backlight electrode, and the backlight electrode land 27 is provided.
It is necessary to provide a backlight input land on the back surface side with the insertion hole 30 and to make electrical connection by soldering on the opposite surface side of the backlight mounting surface, which increases the overall thickness of the liquid crystal display device. . In addition, the liquid crystal drive circuit board 22
In this case, the degree of freedom in designing the arrangement of the electric components in the above-mentioned method is reduced, and the liquid crystal drive circuit board 22 is also enlarged.
【0007】本発明は上記従来の問題点を解決するもの
で、薄型で、液晶駆動回路基板における電気部品配置の
設計自由度を高めることができる液晶表示装置を提供す
ることを目的とする。An object of the present invention is to solve the above-mentioned conventional problems, and an object of the present invention is to provide a liquid crystal display device which is thin and can increase the degree of freedom in designing electric components on a liquid crystal drive circuit board.
【0008】[0008]
【課題を解決するための手段】この目的を達成するため
に本発明の液晶表示装置は、LEDバックライトと液晶
駆動回路基板の電気的接続を、一端でLED実装基板を
挟んで固定し、電気的接続を行う端子と、他端で液晶駆
動回路基板のバックライト入力ランドに接続する端子を
有するリードフレームにより行う構成を有している。In order to achieve this object, a liquid crystal display device according to the present invention comprises an electric connection between an LED backlight and a liquid crystal drive circuit board, which is fixed at one end with an LED mounting board therebetween. And a lead frame having a terminal connected to the backlight input land of the liquid crystal drive circuit board at the other end.
【0009】この構成によって、LED実装基板をリー
ドフレームの一端の端子で挟んで固定することによっ
て、LED実装基板のLED実装面と液晶表示面を垂直
方向に固定できるため、LED実装基板とバックライト
を構成する導光板の分離が可能になることで、LED実
装基板が小さくなり、バックライトの全体の厚みを薄く
できる。また、リードフレームのリード部分をリードフ
ォーミングすることによって、バックライト入力ランド
をLED実装基板の直下以外に構成することが可能にな
り、液晶駆動回路基板における電気部品配置の設計自由
度を高めることができる。また、リードフレームの液晶
駆動回路基板と電気的接続を行う部分を平板形状とする
ことで、液晶駆動回路基板のバックライト取り付け面側
での電極接続が可能になり、バックライトの電極半田付
け高さを低くできる。With this configuration, the LED mounting board is sandwiched between the terminals at one end of the lead frame and fixed, so that the LED mounting surface of the LED mounting board and the liquid crystal display surface can be vertically fixed. Can be separated, the size of the LED mounting board can be reduced, and the overall thickness of the backlight can be reduced. Also, by performing the lead forming on the lead portion of the lead frame, it is possible to configure the backlight input lands other than directly below the LED mounting board, thereby increasing the degree of freedom in designing the layout of electric components in the liquid crystal driving circuit board. it can. In addition, by making the portion of the lead frame that is electrically connected to the liquid crystal drive circuit board into a flat plate shape, electrode connection on the backlight mounting surface side of the liquid crystal drive circuit board becomes possible, and the electrode soldering height of the backlight is increased. Can be lowered.
【0010】[0010]
【発明の実施の形態】本発明は各請求項に記載した構成
とすることにより具体的に実施できるものであるが、そ
の実施を容易にするために構成に加えて機能を以下に併
記することとする。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention can be embodied concretely by adopting the constitutions described in the respective claims. However, in order to facilitate its implementation, the following functions are described in addition to the constitutions. And
【0011】請求項1記載に係る発明は、LED素子を
実装したLED実装基板に固着して前記LED実装基板
を所定位置に固定し、かつ前記LED実装基板の入力電
極ランドを挟んで電気的に接続する端子を一端に有する
リードフレームを備えていて、前記リードフレームの他
端を液晶駆動回路基板のバックライト入力電極としたも
のであり、リードフレームによってLED実装基板と液
晶駆動回路基板とを電気的に接続するのみならず機械的
にも所定位置に固定することができる。特に、リードフ
レームのフォーミングによってLED実装基板の入力電
極ランドの直下に液晶駆動回路基板のバックライト入力
電極を設置する必要がなく、LED実装基板と液晶駆動
回路基板との設計位置を任意にすることができる。The invention according to claim 1 is characterized in that the LED mounting board is fixed to a predetermined position by being fixed to an LED mounting board on which an LED element is mounted, and electrically connected to an input electrode land of the LED mounting board. A lead frame having a terminal to be connected at one end is provided, and the other end of the lead frame is used as a backlight input electrode of the liquid crystal drive circuit board, and the lead frame electrically connects the LED mounting board and the liquid crystal drive circuit board. It can be fixed at a predetermined position mechanically as well as mechanically. In particular, it is not necessary to install the backlight input electrode of the liquid crystal drive circuit board directly below the input electrode land of the LED mount board by forming the lead frame, and the design position of the LED mount board and the liquid crystal drive circuit board can be made arbitrary. Can be.
【0012】また、請求項2記載に係る発明は、リード
フレームの他端のバックライト入力電極は液晶駆動回路
基板に設けたバックライト入力ランドに固定した平板形
状端子とすることによりリードフレームは容易に形成す
ることができる。According to the second aspect of the present invention, the backlight input electrode at the other end of the lead frame is a flat terminal fixed to the backlight input land provided on the liquid crystal drive circuit board, so that the lead frame can be easily manufactured. Can be formed.
【0013】また、請求項3記載に係る発明は、LED
素子を実装したLED実装基板に固着して前記LED実
装基板を液晶駆動回路基板の所定位置に固定し、かつ前
記LED実装基板の入力電極ランドに電気的に接続する
端子を一端に有するリードフレームの他端を液晶駆動回
路基板のバックライト入力ランドに電気的に接続して固
定したもので、前記する請求項1記載に係る発明と請求
項2記載に係る発明の両機能を備えたものである。According to a third aspect of the present invention, an LED
A lead frame having a terminal fixed to one end of an LED mounting board on which an element is mounted and fixed to a predetermined position of a liquid crystal driving circuit board, and having one end electrically connected to an input electrode land of the LED mounting board. The other end is electrically connected and fixed to the backlight input land of the liquid crystal drive circuit board, and has both functions of the invention according to claim 1 and the invention according to claim 2. .
【0014】[0014]
【実施例】以下、本発明の具体的な実施例について、図
面を参照しながら説明する。DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, specific embodiments of the present invention will be described with reference to the drawings.
【0015】図1は液晶表示装置の液晶駆動回路基板
に、LEDバックライトを取り付けた構成を示す斜視図
である。図1において、1はLED素子2をプリント基
板に実装したLED実装基板である。3はLED実装基
板1を固定し、入力電極ランド4との電気的接続機能を
有するクリップ形状端子3aと、液晶駆動回路基板5に
設けられたバックライト入力ランド6との電気的接続用
の平板状端子3bを有するリードフレームである。7は
反射板8が裏面に貼り付けられた導光板であり、LED
実装基板1と分離されている。また、リードフレーム3
のクリップ形状端子3aと入力電極ランド4との電気的
接続手段については、紫外線硬化樹脂での固定もしくは
半田付けにより行われ、平板状端子3bとバックライト
入力ランド6との電気的接続手段は、半田付けにより行
われる。FIG. 1 is a perspective view showing a configuration in which an LED backlight is mounted on a liquid crystal drive circuit board of a liquid crystal display device. In FIG. 1, reference numeral 1 denotes an LED mounting board in which an LED element 2 is mounted on a printed board. Reference numeral 3 denotes a flat plate for fixing the LED mounting board 1 and electrically connecting the clip-shaped terminal 3 a having an electric connection function with the input electrode land 4 to the backlight input land 6 provided on the liquid crystal drive circuit board 5. It is a lead frame having a terminal 3b. Reference numeral 7 denotes a light guide plate on which a reflection plate 8 is attached on the back surface,
It is separated from the mounting substrate 1. Also, lead frame 3
The electrical connection between the clip-shaped terminal 3a and the input electrode land 4 is performed by fixing with an ultraviolet curable resin or by soldering. The electrical connection between the flat terminal 3b and the backlight input land 6 is as follows. This is performed by soldering.
【0016】以上のように本実施例によれば、リードフ
レーム3のクリップ形状端子3aによりLED実装基板
1の固定を行えることから、LED実装基板1と導光板
7が分離できるため、LED実装基板1の幅寸法が小さ
くなり、バックライトの厚み寸法を薄くできる。また、
リードフレーム3のピン部分の長さ寸法およびフォーミ
ングを必要に応じて変えることで、平板状端子3bの位
置の適正化が図れるため、液晶駆動回路基板5における
バックライト入力ランド6の位置を適正化でき、電気部
品配置の設計自由度を高めることができる。また、平板
状端子3bの形状を平板形状とすることで液晶駆動回路
基板5のバックライト取り付け面側での電気的接続が可
能になり、バックライトの電極半田付け高さを低くでき
る。As described above, according to the present embodiment, since the LED mounting board 1 can be fixed by the clip-shaped terminals 3a of the lead frame 3, the LED mounting board 1 and the light guide plate 7 can be separated. 1 is reduced in width, and the thickness of the backlight can be reduced. Also,
By changing the length and forming of the pin portion of the lead frame 3 as necessary, the position of the flat terminal 3b can be optimized, and thus the position of the backlight input land 6 on the liquid crystal drive circuit board 5 is optimized. It is possible to increase the degree of freedom in designing the arrangement of electric components. Further, by making the shape of the flat terminal 3b flat, electrical connection on the backlight mounting surface side of the liquid crystal drive circuit board 5 becomes possible, and the electrode soldering height of the backlight can be reduced.
【0017】[0017]
【発明の効果】以上のように本発明は、LEDバックラ
イトと液晶駆動回路基板の電気的接続を両端に端子を有
するリードフレームを使用することによって行うことが
でき、薄型で、液晶駆動回路基板の設計自由度が高い優
れた液晶表示装置を実現できるものである。As described above, according to the present invention, the electric connection between the LED backlight and the liquid crystal driving circuit board can be made by using a lead frame having terminals at both ends, and the liquid crystal driving circuit board is thin. An excellent liquid crystal display device having a high degree of design freedom can be realized.
【図1】本発明の一実施例における液晶表示装置の要部
斜視図FIG. 1 is a perspective view of a main part of a liquid crystal display device according to an embodiment of the present invention.
【図2】従来の液晶表示装置の構成を示す要部分解斜視
図FIG. 2 is an exploded perspective view of a main part showing a configuration of a conventional liquid crystal display device.
1,26 LED実装基板 2,25 LED素子 3 リードフレーム 3a クリップ形状端子 3b 平板状端子 4 入力電極ランド 5,22 液晶駆動回路基板 6,31 バックライト入力ランド 7,28 導光板 8,29 反射板 30 穴部 1,26 LED mounting board 2,25 LED element 3 lead frame 3a clip-shaped terminal 3b flat terminal 4 input electrode land 5,22 liquid crystal drive circuit board 6,31 backlight input land 7,28 light guide plate 8,29 reflector 30 holes
Claims (3)
固着して前記LED実装基板を所定位置に固定し、かつ
前記LED実装基板の入力電極ランドを挟んで電気的に
接続する端子を一端に有するリードフレームを備えてい
て、前記リードフレームの他端を液晶駆動回路基板のバ
ックライト入力電極とした液晶表示装置。1. An LED mounting board on which an LED element is mounted, the LED mounting board being fixed at a predetermined position, and having a terminal at one end for electrically connecting the LED mounting board with an input electrode land interposed therebetween. A liquid crystal display device comprising a lead frame, wherein the other end of the lead frame is used as a backlight input electrode of a liquid crystal drive circuit board.
力電極は液晶駆動回路基板に設けたバックライト入力ラ
ンドに固定した平板形状端子とした請求項1記載の液晶
表示装置。2. The liquid crystal display device according to claim 1, wherein the backlight input electrode at the other end of the lead frame is a flat terminal fixed to a backlight input land provided on the liquid crystal drive circuit board.
固着して前記LED実装基板を液晶駆動回路基板の所定
位置に固定し、かつ前記LED実装基板の入力電極ラン
ドに電気的に接続する端子を一端に有するリードフレー
ムの他端を液晶駆動回路基板のバックライト入力ランド
に電気的に接続して固定した構成を有する液晶表示装
置。3. A terminal which is fixed to an LED mounting board on which an LED element is mounted, fixes the LED mounting board at a predetermined position on a liquid crystal driving circuit board, and electrically connects to an input electrode land of the LED mounting board. A liquid crystal display device having a configuration in which the other end of a lead frame provided at one end is electrically connected to and fixed to a backlight input land of a liquid crystal drive circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9309672A JPH11133394A (en) | 1997-10-24 | 1997-10-24 | Liquid crystal display device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP9309672A JPH11133394A (en) | 1997-10-24 | 1997-10-24 | Liquid crystal display device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH11133394A true JPH11133394A (en) | 1999-05-21 |
Family
ID=17995892
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP9309672A Pending JPH11133394A (en) | 1997-10-24 | 1997-10-24 | Liquid crystal display device |
Country Status (1)
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JP (1) | JPH11133394A (en) |
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JP2009259548A (en) * | 2008-04-15 | 2009-11-05 | Showa Denko Kk | Display device and light-emitting device |
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KR101272014B1 (en) * | 2006-06-30 | 2013-06-05 | 엘지디스플레이 주식회사 | Back light structure and lquid crystal display device thereby |
US8636382B2 (en) | 2009-06-25 | 2014-01-28 | Sharp Kabushiki Kaisha | Light source apparatus, image display apparatus and television receiving apparatus |
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