JPH11131298A - Device and method for plating small article - Google Patents

Abstract

PROBLEM TO BE SOLVED: To form a uniform plating film which is free from any variance in film thickness of the plating film between parts to be plated by eliminating lapping of the parts to be plated in a plating solution, to facilitate the handling of the parts to be plated, and to facilitate a plating process for plating each end part in particular. SOLUTION: This plating device comprises a plating tank 2 to store a plating solution 11, an anode 7 which is immersed in the plating solution 11 in the plating tank 2 and with which parts (a) to be plated are brought into contact, an anode 6 which is immersed in the plating solution 11 in the plating tank 2, and a power source 10 to flow the current to the anode 6 and the cathode 7. The cathode 7 is formed of a sheet through which the plating solution can be passed, and the parts (a) to be plated are held by a plate-like holding member 17, and the holding member 17 is arranged so that a part of the plated parts (a) projected from the holding member 17 is brought into contact with a conductor of the cathode 7. The current flows in the anode 6 and the cathode 7 in this condition to deposit the plating on an end part of the parts (a).

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a small component plating apparatus and a plating method for plating a small component such as a chip type circuit component, and more particularly, to a plating film having a uniform film thickness on a small component. The present invention relates to an apparatus and method for plating small parts.

[0002]

2. Description of the Related Art Conventionally, a barrel plating apparatus has been widely used as an apparatus for forming a plating film on external electrodes of a chip-shaped circuit component such as a multilayer ceramic capacitor. Barrel plating equipment installs a cathode in a cylindrical rotatable barrel, stores the plated parts in a barrel with a conductive medium of almost the same shape as or slightly smaller than the plated parts, and fills the barrel into a plating bath. Dipped in the plating solution. An anode is provided in the plating bath separately from the barrel, and a DC voltage is applied from a power supply to a cathode and an anode in the barrel. Further, the rotating shaft of the barrel is connected to a driving source, and the barrel is driven to rotate in the plating bath. When a DC current is passed between the anode and the cathode while rotating the barrel containing the plated component and energized, a plating film is deposited on the surface of the plated component.

[0003] However, many external electrodes are formed on the surface of the chip-type ceramic electronic component in many cases, and the thickness of the plating film of each electrode may vary in the conventional barrel device. In addition, there is a disadvantage that separation between the plated component and the medium after plating is troublesome.
In order to solve such a problem, for example, an apparatus has been proposed in which a plated component is placed on a cathode made of a metal mesh, and in this state, the plated component is immersed in a plating solution to perform plating (Japanese Patent Application Laid-Open No. Hei 8 (1996)). -3790).

In this proposed plating apparatus, a flat cathode is formed of a mesh or a conductive porous plate, a plating component is placed on the cathode, and an anode is opposed above the cathode. The cathode is immersed in the plating solution while reciprocating in the horizontal direction, and by this reciprocating motion, the portion of the plating component to be plated on the cathode and the contact portion with the cathode are changed, and the plating film is reliably formed on the required portion It is to try to make it. In addition, during the reciprocating movement of the cathode, an impact is applied to the cathode by a stopper in the middle of a stroke, and an attempt is made to reverse the plated component on the cathode by the impact.

[0005]

In the conventional plating apparatus, the deposition rate of the plating film is greatly different between the surface of the plating component on the side in contact with the cathode and the surface on the opposite side. Plating film becomes thinner. As a result, variations in film thickness occur. In order to solve this inconvenience, in the conventional plating apparatus, the metal mesh cathode is reciprocated, and a shock is applied in the middle of the stroke during the reciprocating motion, thereby inverting the plated component, thereby reducing the required plating component. I am trying to plating on the part. However, such a method of reversing the plated material often relies on chance, lacks certainty, and again causes variations in the thickness of the plated film. In addition, there is a problem that the plated parts are liable to overlap with each other, whereby the thickness of the plated film varies. In addition, since the plated components are handled in a completely bulk state, there is a problem that handling of the plated components is troublesome, and it is difficult to perform a continuous process.

Accordingly, the present invention has been made in view of the problems in the above-mentioned conventional plating apparatus, and a first object of the present invention is to eliminate the overlap of plated parts during plating and thereby to prevent plating between plated parts. This makes it possible to form a uniform plating film with no variation in film thickness. It is a second object of the present invention to facilitate the handling of plated parts, and particularly to facilitate the step of plating both ends.

[0007]

According to the present invention, in order to achieve the above object, a part of the plated component a is made to protrude from the holding member 17 while the plated component a is held by the holding member 17.
A part of the plated component a protruding from the holding member 17 is
The anode 6 is brought into contact with the cathode 7 through which the plating solution immersed in the plating solution can pass, the anode 6 is opposed to the cathode 7, and a current flows through the anode 6 and the cathode 7. This allows
The plurality of plated parts a can be easily handled while being held by the holding member 17, and the overlap and contact of the plated parts a or the unevenness of the integration density can be eliminated.

That is, the small component plating apparatus according to the present invention comprises a plating bath 2 for storing a plating solution 11, a cathode 7 which is immersed in the plating solution 11 of the plating bath 2 and contacts a plating component a to be plated, and a plating bath. It has an anode 6 immersed in a plating solution 11 of a bathtub 2 and a power supply 10 for supplying a current to the anode 6 and the cathode 7. Here, the cathode 7
Is composed of a thin plate through which a plating solution can pass. The plating component a is held by the plate-like holding member 17, and a part of the plating component a protruding from the holding member 17 becomes a conductor of the cathode 7. The holding member 17 is arranged to be in contact. In this state, a current is applied to the anode 6 and the cathode 7 to deposit plating on the end of the plated component a. As described above, the thin plate-shaped cathode 7 through which the plating solution 11 can pass.
Is, for example, any one of a mesh shape, a porous shape, and a nonwoven fabric shape, and is made of a material having conductivity.

At least a part of the plated component a that is to be plated protrudes from the holding member 17, and a part of the plated component a protruding from the holding member 17 contacts the conductor on one surface of the cathode 7. doing. For example, both ends of the plated component a to be plated are projected from both surfaces of the holding member 17, and one end of the plated component a projected from the holding member 17 is connected to the conductor on one surface of the cathode 7. Make contact. In this state, one end of the plated component a is plated. Next, the holding member 17 is turned over,
The other end of the plated component a is brought into contact with the conductor of the cathode 7. In this state, the other end of the plated component a is plated. Thereby, plating is applied to both ends of the plated component a.

This is a case where one anode 6 and one cathode 7 are used, and a pair of cathodes 7 arranged so as to sandwich both ends of the plated part a projecting from the holding member 17 so as to sandwich the plated part a, When the anodes 6 and 6 are disposed on both sides of the conductor while being in contact with the conductors so as to be sandwiched between the conductors 7, both ends of the plated component a can be plated simultaneously. In this case, since both ends of the plated component a are plated simultaneously, there is no need to invert the holding member 17 holding the plated component a.

In this manner, the plating component a is held by the holding member 17 and plating is performed, whereby the plating component a
And the dispersion of the plated parts a does not vary, and the plated parts a can be uniformly plated. Further, since the plurality of plated components a can be handled collectively by the holding member 17, it is easy to reverse the plated components in the plating process, and to handle and transport the plated components before and after the plating process.

A through-hole-shaped plating solution passage 1 penetrating both sides adjacent to a position where the plating component a is held by the holding member 17.
When 9 is provided, the plating solution flows smoothly through the holding member 17. Further, when the plating component a is moved relative to the cathodes 7 and 7 in the surface direction during plating, the portion where the plating component a contacts the conductor of the cathode 7 is constantly changed. It is effective to eliminate the variation of.

[0013]

Embodiments of the present invention will now be described specifically and in detail with reference to the drawings.
FIG. 1 shows an example of a small component plating apparatus according to the present invention. As shown in FIG. 1, a plating bath 2 is provided in a hot water bath 1, and the plating bath 11 is filled with a plating solution 11. The plating solution 11 is maintained at a predetermined temperature by hot water filled in the hot water tank 1.

A pair of anode 6 and cathode 7 are immersed in plating solution 11 in plating bath 2. The anode 6 is made of a metal plate. On the other hand, the cathode 7 has a metal wire 13 stretched between frame-shaped frames 15 and is made of a material such as a net or a punched metal through which a plating solution can pass. FIG. 3 shows an example of the cathode 7 made of punched metal.

FIGS. 2 and 3 show an example of the cathode 7 made of punched metal. As shown in FIG. 2, the lower surface side of the metal wire 13 stretched on the frame 15 of the cathode 7 has an insulating coating 1.
4 is covered. When the cathode 7 is made of a net, the metal wires 13 are woven so as to intersect with each other up and down. Similarly, only the lower surface is covered with the insulating coating 14. FIG.
Shows the anode 6. The anode 6 serves as an insulating coating 14 for the cathode 7.
Are disposed so as to face the surface on the side opposite to the surface on which is provided. In the examples of FIGS. 3 and 4, the anode 6 and the cathode 7
Are all squares, but they can take any appropriate shape, such as a rectangle, a circle, or an ellipse, as needed.

Further, a plate-like holding member 17 having a holding hole 18 for holding the plated parts a one by one is used. The plated component a is fitted into the holding hole 18 of the holding member 17 to be aligned and held, and the plated component a is arranged on the cathode 7 in this state. In the example shown in FIGS. 3 and 4, a plate-like holding member 17 corresponding to the shape of the cathode 7 is prepared, and
The plated parts a are vertically fitted into and held by holding holes 18 provided vertically and horizontally on the plate 7. The holding member 17 is a plate-like member which is hardly affected by a plating solution such as silicone rubber and has elasticity, and has a thickness smaller than the height of the plated component a.

As shown in FIG. 2, the plated component a is fitted into the holding hole 18 of the holding member 17, and both ends of the plated component a to be plated project from both main surfaces of the holding member 17, respectively. . In this state, the plated component a together with the holding member 17 is placed on the cathode 7, and one end of the plated component a to be plated contacts the conductor of the cathode 7. The plated component a contacts the surface of the cathode 7 opposite to the surface on which the insulating coating 14 is applied, that is, the surface opposite to the surface facing the anode 6. Reference numeral 13 denotes the metal wire 1 of the cathode 7
Reference numeral 3 denotes an insulating coating provided thereon.

As described above, with the arrangement of the anode 6 on the surface of the cathode 7 opposite to the surface where the plated part a is in contact, the electric field intensity tends to be larger at the periphery of the cathode 7 than at the center. Therefore, as described above, by providing the insulating film 14 only at the central portion of the cathode 7 or by increasing the covering ratio of the insulating film 14 at the central portion as compared with the peripheral portion of the cathode 7, this electric field intensity variation Can be eliminated, and the deposition rate of the plating film on the plating component a at the central portion and the peripheral portion of the cathode 7 can be made uniform.

As shown in FIG. 1, the anode 6 and the cathode 7
It is immersed in the plating solution 11 filled inside the plating bath 2 while facing horizontally while being held horizontally. FIG.
In the example shown in (1), the driving body 3 is attached to the hot tub 1,
An arm 5 is horizontally attached to the driving body 3 via a connecting member 4. The anode 6 and the cathode 7 are held so as to face up and down via supporting members 8 and 9 vertically suspended from the arm 5, and the plating solution 11 in the plating bath 2 is held.
Is immersed in. As shown by the arrow in FIG. 1, the driving body 3 drives the arm 5 to reciprocate in the horizontal direction via the connecting member 4, whereby the anode 6 and the cathode 7 are reciprocated in the horizontal direction. The plating component a relatively moves in the horizontal direction with respect to the cathode 7 due to the inertial force of the holding member 17 and the plating component a accompanying the horizontal reciprocation of the cathode 7. As a result, the portion of the plated component a that comes into contact with the cathode 7 constantly changes.

A power supply 10 is connected to the anode 6 and the cathode 7,
A positive potential is applied to the anode 6 and a negative potential is applied to the cathode 7. In such a small component plating apparatus, as shown in FIG.
The plating component a held by the holding member 17 is placed on the upper surface of the plating solution 11 and the plating solution 11 in the plating bath 2 is placed in a state where the end thereof is in contact with the conductor of the cathode 7 and the anode 6 is opposed to the lower surface thereof. Soak in Then, a current is supplied to the anode 6 and the cathode 7 by the power supply 10. Thus, an electric field is generated between the anode 6 and the cathode 7 via the plating solution 11 which is an electrolytic solution.

The metal wire 13 constituting the cathode 7 is covered with an insulating coating 14 on the side facing the anode 6 and is insulated from the surface, so that an electric field passes between the metal wires 13 on the cathode 7 side. It goes around the upper surface side on which the plated component a is placed.
As a result, a plating film is deposited not only on the lower surface side where the anode 6 faces but also on the upper surface side of the portion where the plating film of the plating component a is to be applied. In this case, as compared with the case where the anode 6 is opposed to the upper surface side of the cathode 7, that is, the side on which the plated component a is mounted, the deposition speed of the plating film above and below the plating film is leveled, and the deposition speed of the plating film varies. Does not occur. As a result, the plating film is uniformly deposited on both upper and lower surfaces of the plated component.

At this time, the arm 5 is moved by the driving body 3 as shown in FIG.
Is reciprocated as indicated by the arrow. As a result, the plated component a relatively moves in the horizontal direction with respect to the cathode 7, so that the portion of the plated component a that comes into contact with the cathode 7 is constantly changed, and the plating film is uniformly deposited at a desired position on the plated component. Further, as described above, the plated components a are arranged vertically and horizontally on the portion where the inner metal wires 13 are stretched and surrounded by the frame 15 of the cathode 7, and the plated components a are mutually plated. The plating can be performed by dispersing on the cathode 7 without causing interference. As a result, the variation in the deposition rate of the plating film between the plated components a can be eliminated, and a plating film having a uniform film thickness can be formed.

In the above-described apparatus, as shown in FIG. 2A, plating is first applied to one end of a plated component a in a state where the one end is in contact with the conductor of the cathode 7. Thereafter, the plated component a is turned over together with the holding member 17, and the other end of the plated component a is brought into contact with the conductor of the cathode 7 as shown in FIG. In this state, the other end of the plated component a is plated in the same manner as described above. Thereby, plating is applied to both ends of the plated component a.

In the example shown in FIG. 5, a through-hole-shaped plating solution passage 19 is provided in the vicinity of the holding hole 18 of the holding member 17 for holding the plating component a. When plating, the plating solution passes through this plating solution passage 19,
The distribution of the plating solution is improved, and the plating film can be uniformly deposited at a predetermined position of the plated component a.

In the example shown in FIG. 6, the cathodes 7, 7 are arranged vertically so as to sandwich the plated part a held by the holding member 17, and both ends of the plated part a projecting from both ends of the holding member 17 are connected. , Respectively, in contact with the upper and lower cathodes 7, 7. The lower cathode 7 is provided with an insulating coating 14 below the metal wire 13, and the lower end of the plated component a is in contact with the upper side of the metal wire 13 where the insulating coating 14 is not provided. On the other hand, the upper cathode 7 is provided with an insulating coating 14 above the metal wire 13, and the upper end of the plated component a is in contact with the lower side of the metal wire 13 where the insulating coating 14 is not provided. Further, anodes 6, 6 are opposed to the upper and lower sides of the cathodes 7, 7, respectively.

In such a small component plating apparatus, since both ends of the plated component a are plated simultaneously, the holding member 1
7, the reversal of the plated component a becomes unnecessary. In the example shown in FIG. 6, the holding member 17 is installed horizontally and the cathodes 7 and 7 and the anodes 6 and 6 are provided vertically facing each other. However, the holding member 17 is installed vertically and the cathode 7 is installed. , 7 and the anodes 6, 6 may be provided to face each other in the lateral direction. Further, the holding member 17 may be installed obliquely, and the cathodes 7, 7 and the anodes 6, 6 may be provided so as to face each other in an oblique direction. The combination of the pair of anodes 6 and 6 and the pair of cathodes 7 and 7 and the holding member 17 holding the plated component a is not solely used, but is immersed in a plurality of sets in the plating solution 11 for plating. You can also.

The examples shown in FIGS. 7 to 10 do not vertically hold the plated component a in the holding hole 18 of the holding member 17 and hold the plated component a in the holding hole 18 as described above. a is fitted sideways and held. Plated parts a
Has both sides protruding from the holding member 17. The holding hole 18 of the holding member 17 avoids both ends where the plating of the plated component a is plated, and holds the center thereof.
The one shown has a shape as if two circular holes were connected.

As shown in FIG. 7, the plated component a is fitted into the holding hole 18 of the holding member 17, the central part of the plated component a is held, and the plated component a is arranged. In this state, as shown in FIG.
Is placed on the portion where the inner metal wire 13 is stretched surrounded by the frame 15 and the plated component a is brought into contact therewith, and the plated component is plated by the apparatus shown in FIG. 1 in the same manner as described above. Thus, plating is applied to both ends of the plated component a from both sides of the plated component a.

As described above, the plated parts a are arranged vertically and horizontally on the inner metal wire 13 surrounded by the frame 15 of the cathode 7 to perform plating. The plating can be performed by dispersing on the cathode 7 without causing interference. As a result, the variation in the deposition rate of the plating film between the plated components a can be eliminated, and a plating film having a uniform film thickness can be formed. The cathode 7
Is provided with an insulating coating 14 covering the lower surface of the metal wire 13 on the surface facing the anode 6 in the same manner as in the above-described example.

In this example, it is not always necessary to invert the holding member 17 holding the plated component a and perform plating by sequentially contacting both sides of the holding member 17 with the cathode 7. However, it is preferable to invert the holding member 17 holding the plated component a and perform plating by sequentially contacting both sides of the holding member 17 with the cathode 7. For example, first, a plating film is formed by bringing one side surface of the plated component a into contact with the cathode 7. Thereafter, the holding member 17 is turned upside down while holding the plated component a on the holding member 17, and the other side surface of the plated component a is brought into contact with the cathode 7. Then, a plating film is applied to the plating component a under the same conditions as the previous time. Thereby, a plating film having a uniform thickness can be applied to both side surfaces of the plating component a. Furthermore, in the same manner as described above, two anodes 6 and 6 and two cathodes 7 and 7 are used, and the plated parts a held by the holding member 17 are brought into contact with the cathodes 7 and 7 so as to be sandwiched from both sides thereof. Plating can be performed simultaneously from both sides of the component a.

The insulating film 14 provided on one side of the cathode 7 as described above covers the entire metal wire 13 of the cathode 7, that is, the cathode 7
Is generally applied to the entire surface on one side. On the other hand, in the example of FIG. 11, only the metal wire 13 in the central square portion is provided with the insulating coating 14, and the surrounding portion is not provided with the insulating coating 14. The metal wire 13 whose side is a conductor is exposed. Regardless of the overall shape of the cathode 7, the region where the insulating film 14 is formed on the metal wire 13 on one side of the cathode 7 is not only a square as shown in FIG. An appropriate shape such as a shape can be taken as needed. Further, as shown in the example of FIG.
Instead, the coating ratio of the insulating coating 14 may be gradually increased from the peripheral portion to the central portion on one surface of the cathode 7.

[0032]

EXAMPLES Next, more specific examples of the present invention will be described in detail while giving specific numerical values. (Example 1) Using a small component plating apparatus as shown in FIG. 1, as shown in FIG. 2, one end of a multilayer ceramic capacitor which is a plated component a held by a holding member 17 is connected to a cathode 7. Contact with the conductor and set the current density to 500 C / d
One end of the plated component a was solder-plated as m ² . After that, the holding member 17 is turned upside down,
One end of the plated component a held by 7 was brought into contact with the conductor of the cathode 7, and the other end of the plated component a was subjected to solder plating at a current density of 500 C / dm ² . The cathode 7
Is made of punched metal, an insulating coating 14 is provided on the metal wire 13 over the entire surface on one side, and the end of the plated component a is brought into contact with the side where the insulating coating 14 is not provided. 10 randomly from the washed parts a
When the thickness of the solder plating film at both ends of the multilayer ceramic capacitor was measured according to the fluorescent X-ray method, the average value was 4.87 μm, and the variation in the thickness of the plating film on the upper and lower surfaces (CV) was measured. (Value = standard deviation / average value)
Was 12.0%.

(Example 2) The same small component plating apparatus as shown in FIG. 1 was used, but two anodes 6, 6 and two cathodes 7, 7 were used, and as shown in FIG. Both ends of the laminated ceramic capacitor, which is the plated component a held by the member 17, were simultaneously contacted with the cathodes 7, 7, and the anodes 6, 6 were opposed to both sides thereof. Then, the current density is set to 500 C / dm ² and the plated component a
Were plated at both ends. The cathode 7 was made of a punched metal, and an insulating coating was provided on the entire surface of one side of the metal wire 13, and the end of the plated component a was brought into contact with the side where the insulating coating 14 was not provided. When 100 pieces were taken out at random from the washed plated parts a and the thickness of the solder plating film at both ends of the multilayer ceramic capacitor was measured according to the fluorescent X-ray method, the average value was 4.73 μm, and the variation of the plating film was found. (CV value = standard deviation / average value)
Was 12.2%.

(Embodiment 3) In the embodiment 2, the holding member 17 holding the multilayer ceramic capacitor as the plated component a is vertically arranged, and the cathode 7 and the cathode 7 are sandwiched therebetween.
7 and anodes 6 and 6 are arranged in opposition.
1 was plated at a current density of 500 C / dm ^{2 at} both ends of the plated component a. The cathode 7 was made of a punched metal, and an insulating coating was provided on the entire surface of one side of the metal wire 13, and the end of the plated component a was brought into contact with the side where the insulating coating 14 was not provided. When 100 pieces were taken out at random from the washed plating part a and the thickness of the solder plating film at both ends of the multilayer ceramic capacitor was measured according to the fluorescent X-ray method, the average value was 4.70 μm, and the variation of the plating film was found. (CV value = standard deviation / average value) was 12.1%. The average ratio of the thicknesses of the plating films on the upper and lower surfaces was 90%.

(Embodiment 4) Using a small component plating apparatus as shown in FIG. 1, as shown in FIGS. 7 to 10, one side of a multilayer ceramic capacitor which is a plated component a held by a holding member 17 is used. The side portion was brought into contact with the conductor of the cathode 7, and the current density was set to 500 C / dm ² , and one end of the plated component a was subjected to solder plating. Thereafter, the holding member 17 is turned upside down, and one side of the plated component a held by the holding member 17 is brought into contact with the conductor of the cathode 7, and the current density is set to 500C.
/ Dm ² , the other end of the plated component a was plated with solder. The cathode 7 is made of a punched metal, and an insulating coating 14 is provided on the metal wire 13 over the entire surface on one side, and the end of the plated component a is brought into contact with the side where the insulating coating 14 is not provided. Was. When 100 pieces were taken out at random from the washed plating part a and the thickness of the solder plating film at both ends of the multilayer ceramic capacitor was measured according to the fluorescent X-ray method, the average value was 4.61 μm, and the variation of the plating film was found. (CV value = standard deviation / average value)
Was 12.0%.

(Comparative Example) An anode 6 was placed on the upper side, and a cathode 7 without the insulating coating was placed below, and plating was performed under the same conditions as in the first embodiment. When 100 pieces were taken out at random from the washed plated part a and the thickness of the solder plating film at both ends of the multilayer ceramic capacitor was measured according to the fluorescent X-ray method, the average value was 4.50 μm, and the variation of the plating film was found. (CV value = standard deviation / average value) was 18.0%.

[0037]

As described above, according to the present invention, it is possible to form a plating film having a uniform thickness with a small variation in the thickness of the plating film between each part of the plating material and each plating material. Become. Thereby, the quality of the plated component can be improved, and the quality of the product, the yield, and the like can be improved. Furthermore, since a plurality of plated components are held by the holding member, not only the plating components are reversed in the plating process, but also the handling and transport of the plated components in the processes before and after the plating components are facilitated, so that labor and automation of the plating process can be reduced. Can be easier.

[Brief description of the drawings]

FIG. 1 is a schematic longitudinal sectional side view showing an example of a plating apparatus according to the present invention.

FIG. 2 is an enlarged vertical sectional side view showing an example of an anode, a cathode, and a holding member of the plating apparatus.

FIG. 3 is a perspective view showing an example of an anode and a holding member of the plating apparatus.

FIG. 4 is a perspective view showing an example of an anode, a cathode, and a holding member of the plating apparatus.

FIG. 5 is a perspective view of a main part showing another example of a holding member of the plating apparatus.

FIG. 6 is a vertical sectional side view of an essential part showing another example of the arrangement of the anode, the cathode and the holding member of the plating apparatus.

FIG. 7 is a perspective view showing another example of a cathode of the plating apparatus and a holding member placed on the cathode.

FIG. 8 is a perspective view showing an example of an anode, a cathode, and a holding member placed on the cathode of the plating apparatus.

FIG. 9 is an enlarged plan view of a main part showing an example of a holding member of the plating apparatus.

10 is a sectional side view taken along line AA of FIG.

FIG. 11 is a bottom view showing another example of the cathode of the plating apparatus according to the present invention.

[Explanation of symbols]

 2 Plating bath 6 Anode 7 Cathode 10 Power supply 11 Plating solution 13 Metal wire 14 Insulating coating 17 Holding member 19 Plating solution passage a Plating component

Claims (10)

[Claims] A plating bath (2) for storing a plating solution (11) and a cathode (7) immersed in the plating solution (11) of the plating bath (2) and contacting a plating component (a) to be plated. And an anode (6) immersed in a plating solution (11) of a plating bath (2), and these anode (6) and cathode (7)
And a power supply (10) for supplying a current to the cathode, the cathode (7) is made of a thin plate through which a plating solution can pass, and the plating component (a) is a plate-like holding member ( 17) and the holding member (1)
A small component plating apparatus, wherein a holding member (17) is arranged so that a part of the plated component (a) protruding from the component (7) comes into contact with the conductor of the cathode (7). 2. A thin plate-like cathode (7) through which a plating solution (11) can pass is any one of a mesh, a porous, and a non-woven fabric, and has conductivity. The small component plating apparatus according to claim 1. 3. The plated component (a) has at least a portion to be plated projecting from the holding member (17), and a part of the plated component (a) projecting from the holding member (17) is 3. The small component plating apparatus according to claim 1, wherein one side of the cathode is in contact with the conductor. 4. The plated component (a) has both ends to be plated projecting from both surfaces of the holding member (17), and one of the plated components (a) projecting from the holding member (17). The small component plating apparatus according to any one of claims 1 to 3, wherein an end portion is in contact with the conductor on one surface of the cathode (7). 5. The plating component (a) has both ends to be plated projecting from both sides of the holding member (17), and both ends of the plating component (a) projecting from the holding member (17). The small parts according to any one of claims 1 to 3, wherein the small parts contact the conductors of a pair of cathodes (7) and (7) arranged so as to sandwich these plated parts (a). Plating equipment. 6. The holding member (17) has a through-hole-shaped plating solution passage (19) penetrating on both sides thereof, adjacent to a position for holding the plating component (a). A small component plating apparatus according to any one of claims 1 to 5. 7. A cathode (7) and an anode (8) are immersed in a plating bath (2) containing a plating solution (11).
In the method of plating a small component, in which the plated component (a) is brought into contact with the cathode (7) and current is applied to the anode (6) and the cathode (7) to deposit plating on the plated component (a), The plating component (a) is a sheet-like plate that can pass through, and holds the plating component (a) by the holding member (17), and a part of the plating component (a) protruding from the holding member (17) is coated with a plating solution. The electrode is brought into contact with a conductor of a thin plate-like cathode (7) that can pass therethrough, and in this state, a current is applied to the anode (6) and the cathode (7) to deposit plating on the plated part (a). Small parts plating method. 8. The plated part (a) is a cathode (7), (7)
The small component plating method according to claim 7, wherein the component is relatively moved in a plane direction of the small component. 9. The plated component (a) has both ends to be plated projecting from both sides of the holding member (17), and first, one of the plated components (a) projecting from the holding member (17). The end of the cathode (7) is contacted with the conductor on one side of the cathode (7) to perform plating, and then the holding member (17)
9. The small component according to claim 7, wherein the plating is performed by inverting the entire plated component, and then performing plating by bringing the other end into contact with the conductor on one surface of the cathode. Plating method. 10. Both ends of the plated component (a) to be plated project from both sides of the holding member (17), and both ends of the plated component (a) projecting from the holding member (17). Are brought into contact with conductors of a pair of cathodes (7) and (7) arranged so as to sandwich the plated component (a), and both ends of the plated component (a) are simultaneously plated. 9. The small component plating method according to claim 7, wherein: