JPH11126963A - Jet solder flow control tool - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a jet solder flow control tool which can easily, surely, and reproducibly adjust the height and width of a jet solder flow. SOLUTION: Electrodes 2 and 3 which are insulated from each other are provided with a specific interval in between on the lower surface of a substrate 1 moved toward a jet solder flow produced by means of a wave soldering device 8 and, at the same time, a power source 4 which supplies electricity to the electrodes 2 and 3 and a conduction indicating means 5 which indicates that the electrodes 2 and 3 are conducted when the jet solder flow comes into contact between the electrodes 2 and 3 are provided on the upper surface of the substrate 1 so as to control the height and width of the jet solder flow.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet solder management tool capable of electrically managing the jet height and variation of the jet solder of a jet solder device.

[0002]

2. Description of the Related Art Conventionally, when a chip component or the like is mounted on an electronic component substrate by soldering, a soldering device is often used.

[0003] In general, a soldering apparatus has a plurality of endless conveying belts vertically provided with a plurality of conveying chucks arranged side by side at an equal interval so as to face each other. The substrate held and carried by the transport chuck is passed through the surface of the jet solder to be soldered with a lead or the like.

[0004] However, if the height and width of the jet solder are not sufficient, soldering failure will occur. Therefore, in order to manage the jet solder, the height and width of the jet solder must be adjusted visually. .

That is, the height and width of the jet are adjusted visually, the substrate for the electronic component as a product is flown, the actual evaluation is performed, and the final height adjustment is performed by repeating this.

[0006]

However, in this case, the management depends on experience and intuition, and the degree of adjustment differs depending on the operator, which causes a large variation in quality relating to the quality of soldering, and also causes a problem. Adjustment work before soldering work is time-consuming, resulting in reduced work efficiency.

[0007] An object of the present invention is to provide a jet soldering management tool that can solve the above-mentioned problems.

[0008]

In order to solve the above-mentioned problems, according to the present invention, electrodes insulated from each other are provided on a lower surface of a substrate to be transferred toward a jet solder of a jet solder device at a predetermined interval. A power supply for supplying power to the electrodes and continuity indicating means for indicating that continuity was achieved when the jet solder contacted between the electrodes were provided on the upper surface of the substrate.

According to the present invention, the electrodes are provided at a center of the substrate so as to cross the substrate and at a predetermined distance in a direction perpendicular to the center electrode. And a plurality of side electrodes.

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention relates to a jet soldering management tool, in which electrodes insulated from each other are provided on a lower surface of a substrate to be transferred toward a jet solder of a jet soldering device at regular intervals. On the upper surface of the substrate, a power supply for supplying power to the electrodes and a conduction display means for displaying that the electric current is conducted when the jet solder comes into contact between the electrodes are arranged, and the jet height and variation of the jet solder can be managed. It was done.

That is, when the jet solder comes into contact between two insulated electrodes of the substrate when the board passes over the jet soldering device, a method is used in which conduction between the electrodes is performed via the solder. When the jet solder contacts between the electrodes at the same time,
It is possible to confirm that the solder has reached a predetermined height by conducting electricity from the power supply → electrode → solder → electrode → power supply and conducting display by the conducting display means provided therebetween. Thus, the quality of the height of the jet solder can be easily and reliably determined by binarization.

Accordingly, anyone can easily adjust the height of the jet solder with the same standard, and the variation in the quality of soldering is reduced.

As the conduction indicating means, an LED can be suitably used. By lighting the LED, the conduction state, that is, the fact that the jet solder has reached a predetermined height can be visually recognized.

Further, the jet solder management tool comprises a central electrode disposed at the center of the substrate so as to cross the substrate, and a plurality of electrodes disposed at a predetermined distance in a direction perpendicular to the central electrode. It is good to comprise from a side electrode. And
It is preferable that the distance between the center electrode and each side electrode is adjustable.

With this configuration, it is possible to control the width of the jet solder, and by arranging a plurality of side electrodes with respect to the center electrode, it is possible to manage the dispersion of the jet solder.

As described above, according to the present invention, even if different operators are used, the height and width of the jet solder can be adjusted based on the same standard, so that there is no variation in the quality of soldering and the yield is improved. .

In an actual operation, before the electronic component substrate to be jet-soldered is flown by a soldering device, a plurality of the jet-flow soldering tools are flown, and the electronic component substrates are continuously adjusted under the best condition. In this case, the adjustment time of the jet solder is greatly reduced as compared with the conventional method, so that the work efficiency is improved.

[0018]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be specifically described below with reference to the accompanying drawings.

FIG. 1 shows a jet solder management tool A according to this embodiment.
FIG. 2 shows the state in which the jet solder management tool A is in contact with the jet solder, FIG. 3 shows a partial cross section of the jet solder management tool A, and FIG. 4 shows a soldering apparatus using the jet solder management tool A. B is shown.

As shown in FIGS. 1 and 2, the jet soldering management tool A includes a lower surface of a substrate 1 formed to have the same size as an electronic component substrate 9 (see FIG. 4) for soldering lead components and the like by jet soldering. That is, a center electrode 2 disposed across the center of the substrate and a plurality of side electrodes 3 disposed at a predetermined distance in a direction orthogonal to the center electrode 2 on the contact surface of the jet solder. They are provided at regular intervals and insulated from each other.

On the other hand, on the upper surface of the substrate 1, there are provided a battery 4 as a power supply for supplying power to the electrodes 2 and 3 and a conduction display means for displaying that conduction occurs when the jet solder contacts between the electrodes 2 and 3. An LED 5 connected to each of the side electrodes 3 is disposed, and the center electrode 2 is connected to the + side of the battery 4 and the side electrodes 3 and 3 are connected to the-side. Reference numeral 6 denotes a resistor connected to each side electrode 3.

In FIG. 2, reference numeral 8 denotes a jet soldering device.
It is arranged in a soldering device B to be described later. 81 is a solder jet nozzle.

The distance d between the center electrode 2 and each side electrode 3 is adjustable. In this embodiment, as shown in FIG. 3, an electrode insertion hole for mounting the side electrode 3 on the substrate 1 is provided. A plurality of electrodes 11 are formed at a predetermined pitch, and the electrode insertion holes 11 are selected so as to have a desired interval d, and the side electrodes 3 are inserted and mounted.

The method of adjusting the distance d and the configuration thereof are not limited. For example, the side electrodes 3 may be configured to be of a sliding type.

A soldering apparatus B using such a jet soldering management tool A has a configuration shown in FIG. 4, in which endless transport bands 83 having a large number of transport chucks 82 are provided at regular intervals. The flux application device 84 and the heating device 85 are arranged in order from the upper side of the conveyance, and the jet soldering device 8 is arranged below the flux application device 84 and the heating device 85. Reference numeral 86 denotes a chuck cleaning brush.

The actual use of the jet soldering management tool A will be described. As shown in FIG. 4, prior to transferring the electronic component substrate 9 toward the jet soldering apparatus 8, the jet soldering management tool A is used. Are continuously transferred at appropriate intervals and passed over the jet soldering device 8.

When passing over the jet soldering device 8, FIG.
As shown in (2), when the jet solder contacts the center electrode 2 and the side electrode 3 of the substrate 1 at the same time, the electric current flows from the + side of the battery 4
The current flows from the resistor 6 to the LED 5 and then to the negative side of the battery 4 via the jet solder, so that the electrodes 2 and 3 conduct and the LED 5 is turned on. As a matter of course, the LED 5 in the part where the jet solder is not in contact remains off.

Further, the distance d between the center electrode 2 and the side electrode 3 is determined according to the distribution range of the soldering portion of the electronic component substrate 9.
By checking the lighting state of the LED 5 by changing the above, it can be determined at the same time whether or not the solder is jetted at the required width.

Therefore, the operator can easily and reliably determine whether the height of the jet solder is in a state suitable for soldering by checking the lighting state of the LED 5 from outside the soldering apparatus B. , Can be corrected.

Therefore, first, the output state of the jet soldering device 8 is adjusted according to the lighting state of the LED 5 of the first jet soldering management tool A, and this is repeated with a plurality of jet soldering management tools A to obtain the optimum jet height and height. If the width is determined, the subsequent electronic component substrate 9 can be continuously and optimally soldered,
In addition, since it has reproducibility, the same level of soldering can be performed even when performed by different operators, and there is no variation in quality.

As described above, according to the present invention, the height and width of the jet solder can be easily and reliably adjusted in a short period of time with a simple structure, so that work efficiency is improved, and individual work between workers is improved. The product can be adjusted to the best condition without any adjustment difference, so that the product yield is also improved.

[0032]

The present invention is implemented in the form described above, and has the following effects.

According to the first aspect of the present invention, mutually insulated electrodes are provided at regular intervals on the lower surface of the substrate to be transferred toward the jet solder of the jet soldering device, and the upper surface of the substrate is provided with the electrodes. By disposing the power supply for supplying power and the conduction indicating means for indicating that conduction occurs when the jet solder contacts between the electrodes, it is possible to manage the jet height and variation of the jet solder. In addition, since there is reproducibility, the height and width of the jet solder can be easily adjusted based on the same standards even if different operators are used, thereby shortening the adjustment time and improving the work efficiency. In addition, variations in the quality of soldering are eliminated, and the yield is improved.

According to the second aspect of the present invention, the electrode is provided at a center of the substrate so as to cross the substrate and a plurality of electrodes provided at a predetermined distance in a direction orthogonal to the center electrode. With this configuration, it can be determined at the same time whether or not the solder is jetted with a required width.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram of a jet solder management tool according to the present embodiment.

FIG. 2 is an explanatory view showing a state in which a jet solder management tool is in contact with the jet solder.

FIG. 3 is a partial cross-sectional view of the jet solder management tool.

FIG. 4 is an explanatory diagram of a soldering device using the jet soldering management tool.

[Explanation of symbols]

 Reference Signs List A jet solder management tool B soldering device d interval 1 substrate 2 center electrode 3 side electrode 4 battery (power supply) 5 LED (conduction display means) 8 jet solder device 9 board for electronic components

Claims (2)

[Claims] An insulated electrode is provided at regular intervals on a lower surface of a substrate to be transferred toward a jet solder of a jet solder device, and a power supply for supplying power to the electrode is provided on the upper surface of the substrate. And a continuity display means for displaying that the continuity has occurred when the blast solder contacts the blast solder. 2. An electrode comprising: a central electrode disposed at the center of a substrate so as to cross the substrate; and a plurality of side electrodes disposed at a predetermined distance in a direction perpendicular to the central electrode. The jet solder management tool according to claim 1, wherein