JPH1111662A - Device and method for transferring substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To quickly transfer substrates while preventing substrate contamination as for as possible, requiring no manual power, with little possibility of reducing cleanliness. SOLUTION: A substrate carrier 51 is introduced into a carrier storage part 20, and a substrate transfer member 45 is raised to hold a substrate against the substrate holding frame 33 of a substrate holding mechanism 30. The substrate holding frame 33 is designed to be capable of changing, using an air cylinder 34, the intervals at which the substrates are held, and after the intervals at which the substrates are held are changed, another substrate carrier is installed in the carrier storage part 20 and a substrate is put into the substrate carrier from the substrate holding mechanism 30 by a substrate transfer member 46.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate transfer apparatus and a substrate transfer method, and more particularly to a method for transferring a plurality of substrates mounted on a substrate carrier to substrate carriers having different shapes or structures. The present invention relates to an apparatus and a method suitable for such a case.

[0002]

2. Description of the Related Art Conventionally, in a semiconductor manufacturing process or a liquid crystal display manufacturing process, a large number of substrates are often transported in a state of being mounted on a substrate carrier, or each processing is performed in that state. . In this case, it is necessary to transfer a large number of substrates from a transport carrier for transporting substrates to a processing carrier used for processing in a predetermined process, or conversely, from a processing carrier to a transport carrier.

In such a case, conventionally, substrates have been taken out one by one using vacuum tweezers or directly by hand and transferred to the other carrier.
When the transfer is performed by vacuum tweezers, the transfer is performed by applying a suction portion to a relatively resistant portion such as the back side of the substrate and sucking the suction portion. However, particularly when transferring a glass substrate for liquid crystal or a large semiconductor wafer, vacuum tweezers cannot be used because the substrate is heavy, and the transfer is performed by holding the edge portion of the substrate by hand. I am trying to put it.

[0004] As a method of transferring a substrate to a carrier of a different type, there is a method in which a substrate is transferred by a robot without using manual operation. In the case of performing with a robot, the operation of taking out one or two substrates from one carrier and transporting the substrate to the other carrier is usually repeated by a holding portion formed at the tip of the transfer arm.

[0005]

However, in the conventional manual transfer method described above, the substrate may be contaminated because the hand or vacuum tweezers touches the substrate, and it is almost impossible to completely prevent the contamination. Impossible, and
In order to prevent a serious problem due to contamination of the substrate even though there is some contamination, strict management and careful attention are required. Further, all of the above-mentioned methods have a problem that it requires time and labor since the substrates need to be manually transferred one by one.

Further, when a large substrate is to be transferred manually, it is difficult to handle the substrate because of its heavy weight, and there is a risk that the substrate may be dropped accidentally during the operation.

Further, even in the transfer method using the above-described robot, since the number of substrates that can be gripped is small, it is necessary to perform the transfer operation repeatedly many times, which takes time. In addition, since the operating time of the robot becomes longer, dust from the robot may adversely affect the processing of the substrate.

Accordingly, the present invention has been made to solve the above problems, and its object is to minimize contamination of the substrate,
It is an object of the present invention to realize a new substrate transfer apparatus and a new substrate transfer method capable of quickly transferring a substrate without requiring any manpower and with little risk of lowering the cleanness.

[0009]

Means taken by the present invention to solve the above problems are to provide a carrier accommodating portion for accommodating a substrate carrier and a plurality of substrates mounted on the substrate carrier at least temporarily. A substrate holding mechanism configured to be able to be held, and a substrate transfer mechanism configured to transfer a plurality of substrates mounted on the substrate carrier between the carrier accommodating portion and the substrate holding mechanism. Has,
The substrate holding mechanism includes a plurality of substrate holding frames for holding the substrate, and an interval for changing a mutual interval between the substrate holding frames so as to correspond to a change in a mounting interval of the substrates of the substrate carrier. And a change mechanism.

According to this means, when the substrate carrier is accommodated in the carrier accommodating section, the substrate mounted on the substrate carrier can be transferred to the substrate holding mechanism by the substrate transfer mechanism. Here, the substrate holding frame of the substrate holding mechanism can be adjusted to the mounting interval of the substrate mounted on the substrate carrier by an interval changing mechanism provided in advance in the substrate holding mechanism. The substrate is held by the substrate holding frame of the substrate holding mechanism. The substrate holding mechanism is provided with an interval changing mechanism for changing the interval between the substrate holding frames so as to correspond to the change in the mounting interval of the substrates of the substrate carrier. The substrate held by the substrate holding mechanism can be directly transferred to the other substrate carrier by transferring the substrate by the substrate transfer mechanism after the holding interval is changed, since it can be changed according to another substrate carrier provided with It can be mounted.

Therefore, according to the above-mentioned apparatus, the plurality of substrates accommodated in the substrate carrier are temporarily held by the substrate holding mechanism with their mounting intervals, and the interval between the substrate holding frames of the substrate holding mechanism is changed by the interval changing mechanism. After the change, the substrate can be transferred and mounted on a substrate carrier having another different mounting interval, so that the substrate can be automatically and quickly transferred.

Here, the substrate holding mechanism is provided above the carrier accommodating portion, and has a substrate supporting portion that can be retracted and supports the substrate held by the substrate holding frame from below. An opening is provided in a bottom surface portion of the substrate carrier, and the substrate transfer mechanism can move a plurality of substrates up and down between the substrate holding mechanism through the opening from below the substrate carrier. It is preferable to include a lifting arm configured as described above.

According to this means, the substrate is lifted from the substrate carrier arranged in the carrier accommodating section through the opening by the lifting arm of the substrate transfer mechanism, and is held by the substrate holding mechanism, and then the substrate support is extended. The substrate can be supported from below by holding the substrate temporarily by the substrate holding mechanism.When transferring the substrate from the substrate holding mechanism to the substrate carrier, the substrate is lifted through the opening of the substrate carrier. The substrate can be stored in the substrate carrier by retracting the substrate support section and lowering the lifting arm after the substrate is supported by the raised / lowered arm, so that the substrate can be reliably and quickly transferred by a simple mechanism. Can be posted.

Further, the substrate transfer mechanism is configured to be able to collectively transfer the plurality of substrates mounted on the substrate carrier when transferring between the carrier accommodating portion and the substrate holding mechanism. Is preferred.

According to this means, since the substrates mounted on the substrate carrier can be transferred at one time, the transfer processing between the substrate carriers can be performed very quickly.

Further, as a method for transferring the substrates, a plurality of substrates mounted on the first substrate carrier are simultaneously transferred in the same mutual arrangement, and the mounting interval of the substrates on the first substrate carrier is determined. After holding the plurality of substrate holding frames arranged so as to have an equal holding interval, and then changing the holding interval of the substrate by the substrate holding frame to an interval equal to the mounting interval of the second substrate carrier, And transferring the plurality of substrates simultaneously to the second substrate carrier in the same mutual arrangement.

[0017]

Next, an embodiment according to the present invention will be described with reference to the accompanying drawings. FIG. 1 is a schematic configuration diagram showing the overall configuration of a substrate transfer device according to the present invention. The device has a frame 10 for supporting the entire device.
And a carrier accommodating section 20 for accommodating a substrate carrier described later, a substrate holding mechanism 30 disposed above the carrier accommodating section 20, and a substrate transfer mechanism 40 disposed below the carrier accommodating section 20. It is schematically configured.

The carrier accommodating portion 20 is formed on a bottom plate 11 fixed to the frame 10. A guide mechanism 21 is installed on the bottom plate 11 on the left side of the carrier accommodating section 20 so as to partially enter the inside of the carrier accommodating section 20. A carrier loader 22 configured to move between the side of the apparatus and the carrier accommodating section 20 is guided on the guide mechanism 21. The carrier loader 22 includes, for example, a substrate for a carrier as a transport carrier. A grip 23 for holding the carrier 51 is provided. The carrier loader 22 mounts the substrate carrier 51 and moves the carrier 51 from the side of the apparatus into the carrier accommodating portion 20 by a predetermined operation.
Alternatively, it is configured to automatically move from the inside of the carrier accommodating section 20 to the side of the apparatus.

On the upper part of the frame 10, a pair of front and rear upper guide shafts 12, 12 and lower guide shafts 13, 13 are fixed so as to extend in the horizontal direction. The upper guide shaft 12 and the lower guide shaft 13 support the substrate holding mechanism 30 and guide the substrate holding mechanism 30 in the axial direction. The substrate holding mechanism 30 has a movable plate 31 slidably guided by the upper guide shaft 12 and the lower guide shaft 13, and is fixed to the upper guide shaft 12 and the lower guide shaft 13 on the opposite side of the movable plate 31. A fixing plate 32 is provided. The fixed plate 32 is normally fixed to the upper guide shaft 12 and the lower guide shaft 13, but is configured to be movable along the guide shaft during positioning adjustment, similarly to the movable plate 31. Upper guide shaft 12 and lower guide shaft 13 in movable plate 31 and fixed plate 32
A bearing ring made of a fluororesin such as polytetrafluoroethylene is attached to a portion in contact with. With this bearing ring, generation of dust when performing a sliding operation with respect to the upper guide shaft 12 and the lower guide shaft 13 is suppressed.

Between the movable plate 31 and the fixed plate 32, a plurality of substrate holding frames 33 guided by the upper guide shaft 12 and the lower guide shaft 13 are arranged at equal intervals. Movable plate 31
The distal end of the movable rod 34a of the air cylinder 34 fixed to the frame 10 is attached and fixed. When the air cylinder 34 is operated, the movable plate 31 moves right and left in the figure as the movable rod 34a moves in and out, so that the distance between the substrate holding frames 33 can be widened or narrowed as described later. I have. Movable plate 31 and fixed plate 32
Positioning plates 35, 3 formed of a corrosion-resistant resin, for example, a fluorine resin such as polytetrafluoroethylene,
6 is attached.

Nut members 41 and 42 are rotatably mounted on the bottom plate 11. Feed screws 43 and 44 are screwed into the nut members 41 and 42, respectively. Nut member 4
1, 42 are rotationally connected to drive motors 47, 48 via a drive belt. Here, the drive motors 47, 4
When the nut members 41, 42 are rotated by the operation of the nut 8, the feed screws 43, 44 move up and down.

At the upper ends of the feed screws 43, 44, a pair of front and rear substrate transfer members 45, 46 formed of a corrosion-resistant resin, for example, a fluororesin such as polytetrafluoroethylene, are fixed. A plurality of V-shaped cross-section engaging grooves 45a, 46a extending in the front-rear direction for positioning and supporting the lower end of the substrate are formed in parallel on the upper surfaces of the substrate transfer members 45, 46 in a comb-tooth shape. The pitch of the engagement grooves 45a of the substrate transfer member 45 is small, and the pitch of the engagement grooves 46a of the substrate transfer member 46 is large. The substrate transfer member 45 supports a predetermined number of substrates at a pitch. The transfer member 46 is configured to support the same number of substrates at a wide pitch. When the drive motors 47 and 48 operate, the nut members 41 and 42 are interlocked, and the feed screws 43 and 4 are driven.
As the substrate 4 moves up and down, the substrate transfer members 45 and 46 perform the raising and lowering operations when necessary.

FIG. 2 conceptually shows a connection state of the substrate holding frame 33 inside the substrate holding mechanism 20. The substrate holding frames 33 are connected to each other with the connecting pins 35 being inserted through engagement holes formed in four stages in the vertical direction. The connection pins 35 are commonly inserted into the three adjacent substrate holding frames 33, of which the left substrate holding frame 33 is fixed to the connection pins 35, and the two substrate holding frames 33 at the center and right in the drawing are shown. Is slidably engaged with the connecting pin 35 in the axial direction. Three board holding frames 33 engaged with the connection pins 35 arranged at the top,
The three board holding frames 33 engaged with the connection pins 35 arranged third from the top are all the same. On the other hand, the three board holding frames 33 engaged with the connection pins 35 disposed second from the top are the connection pins 3 disposed at the uppermost position.
5 are shifted one by one to the right side in the figure with respect to the three substrate holding frames 33 engaged. 2 from above
The three substrate holding frames 33 that engage with the connection pins 35 arranged at the fourth position and the substrate holding frames 33 that engage with the connection pins 35 disposed at the fourth position from the top, that is, the lowest position, are all the same. Therefore, as shown in the drawing, the adjacent substrate holding frames 33 are alternately connected by the connecting pins 35 arranged at any positions, and indirectly connect the large number of substrate holding frames 3.
3 are connected to each other.

The portion of the substrate holding frame 33 that contacts the upper guide shaft 12 and the lower guide shaft 13 and the portion that contacts the connection pin 35 are provided with bearing rings made of a fluorine resin such as polytetrafluoroethylene. Is attached, and suppresses generation of dust when the substrate holding frame 33 slides on these shafts.

When the movable rod 31 is moved rightward in FIG. 1 when the cylinder rod 34a of the air cylinder 34 shown in FIG. 1 is retracted, as shown in FIG. The substrate holding frames 33 are arranged at equal intervals from each other. At this time, the space between the substrate holding frame 33 and the one head 35c of the connecting pin 35 is not further expanded.

From this state, the air cylinder 3 shown in FIG.
When the fourth cylinder rod 34a is protruded, the movable plate 31 shown in FIG. 1 moves to the left in the figure, and as shown in FIG. 2B, the movable plate 31 on the right side of the substrate holding frame 33 fixed to the left end of the connecting pin 35. The adjacent substrate holding frame 33 comes into contact with the stop step 35a of the connection pin 35, so that further approach is prevented. Similarly, adjacent connecting pins 35 are connected to one head 35b.
And the other head 35c abuts and stops. Therefore, the substrate holding frames 33 are arranged at equal intervals at a smaller pitch than in the case shown in FIG. In this manner, by moving the movable plate 31 shown in FIG. 1, the distance between the substrate holding frames 33 can be changed between two wide and narrow states. In this case, the distance between the plurality of substrate holding frames 33 is equal to each other regardless of whether the distance is wide or narrow. FIG. 2 shows only a structural example of the present embodiment, and the distance between the substrate holding frames 33 and the amount of change in the distance can be changed as appropriate.

FIG. 3 shows the substrate holding frame 33 shown in FIG. 2 and its peripheral structure as viewed from a direction orthogonal to FIG. The planar shape of the substrate holding frame 33 is formed of a U-shaped metal plate-like material in which two legs are connected by a horizontal portion. The upper guide shaft 12 and the lower guide shaft 13 described above are slidably inserted into the two opposing legs of the substrate holding frame 33, and the four connecting pins 35 arranged vertically are also slid. It is movably inserted. Inside the two legs of the substrate holding frame 35, three vertically arranged guide pins 36 are attached. The guide pin 36 is a molded product made of a corrosion-resistant resin, for example, a fluorine resin, and includes an engagement groove 36a having an inverted trapezoidal cross section as shown in FIG. The engagement grooves 36 a are for holding the side edges on both sides of the substrate 53, and are in point contact with the substrate 53. Even if the cross-sectional shape of the engaging groove 36 is V-shaped or semi-circular, the same function is obtained.
In order to prevent the substrate from being caught on the substrate, it is preferable that the engaging groove has a semicircular cross section.

At the lower ends of the two legs of the substrate holding frame 33,
A pin support portion 33a is provided at a tip extending downward. A resin member molded of a corrosion-resistant resin is fixed to the bottom and the tip of the pin support 33a. A longitudinal guide groove 33b for guiding the substrate so as to be able to pass through is provided in the corrosion-resistant resin portion at the tip of the pin support portion 33a.
Are formed.

On the upper surface of the pin support portion 33a, a substrate receiving pin 38 as a substrate support member is mounted. When the cylinder rod 37a of the air cylinder 37 moves up and down, the substrate receiving pin 38 changes its posture between the posture shown by the solid line and the posture shown by the dashed line in FIG. The cylinder rod 37a is 37 in the figure.
When it protrudes downward as shown in FIG.
Of the substrate 53 is flipped up by the upper surface of the pin support portion 33a to assume a position shown by 38 'in the figure, and is retracted from a lifting passage of the substrate 53 described later. When the cylinder rod 37a is pulled upward, the tip of the substrate receiving pin 38 moves downward. A substrate supporting portion 38a made of a corrosion-resistant resin is attached to the tip of the substrate receiving pin 38. When the tip of the substrate supporting pin 38 is lowered, the substrate 53 is placed on the upper surface near the tip of the substrate supporting portion 38a. It is configured to support the bottom of the bottom from below.
As shown in FIGS. 3 and 4, an inverted trapezoidal cross section similar to the guide groove 36a or V
A letter-shaped engagement groove 38c is formed to support the lower end of the substrate 53 in a point contact or line contact state.

FIG. 5 is a partial cross-sectional view showing the structure of the carrier accommodating portion 20 and a part of the substrate transfer mechanism 40 disposed below the carrier accommodating portion 20 as viewed from the introduction direction of the substrate carrier. Above the bottom plate 11, a pair of the substrate transfer members 45 and 46 made of a corrosion-resistant resin are arranged. As described above, the substrate transfer members 45 and 46 are driven by the drive motors 47 and 48, respectively, when necessary.
, And reaches the inside of the carrier holding mechanism 30. The substrate transfer member 45 disposed inside corresponds to the substrate carrier 51 for arranging a plurality of substrates at a narrow pitch.
When the substrate 5 rises, the substrate carrier 51 has a shape and an arrangement that can enter the substrate carrier 51 from an opening (not shown) on the bottom surface of the substrate carrier 51. Similarly, the substrate transfer member 46 arranged outside corresponds to the substrate carrier 52 which is a carrier dedicated to processing, for example, in which a plurality of substrates can be arranged at a wide pitch, and the substrate transfer member 46 is raised. At this time, the substrate carrier 52 is shaped and arranged so as to be able to enter the substrate carrier 52 from an opening (not shown) on the bottom surface of the substrate carrier 52.

Next, the operation of this embodiment having the above configuration will be described. In this embodiment, first, the pitch on the carrier loader 22 on the guide mechanism 21 on the side of the device,
That is, the substrate carrier 51 on which a plurality of substrates are mounted is held in a state where the intervals are narrow. The carrier loader 22 is provided with a substrate carrier 51 by an air-driven gripper 23.
Can be held firmly. next,
The carrier loader 22 is moved rightward in the figure as shown in FIG. 6 by a control device and a drive system (not shown), and is drawn into the carrier accommodating portion 20. Carrier loader 2
2 reaches a predetermined position inside the carrier accommodating portion 20, the grip portion 23 is lifted upward by a predetermined pressure by air driving, whereby the substrate carrier 51 is moved to the positioning plate of the substrate holding mechanism 30. The gripping portions 35 and 36 are pressed against each other, and are held between the gripping portion 23 and the positioning plates 35 and 36. Here, the upper end portion of the substrate carrier 51 and the lower end portions of the positioning plates 35 and 36 have a fitting structure having a tapered surface so that accurate positioning between the substrate carrier 51 and the substrate holding mechanism 30 can be achieved. It can be carried out.

At this time, in the substrate holding mechanism 30, the cylinder rod 34a of the air cylinder 34 projects and the movable plate 31 moves to the left in the drawing, and the substrate holding frame 33 becomes narrow as shown in FIG. The pitch is set so that the holding interval of the substrate in the substrate holding frame 33 matches the mounting interval of the substrate carrier 51. As shown in the figure, the carrier loader 22 is provided with the above-described positioning plate 35, such that the substrate holding position in each substrate holding frame 33 of the substrate holding mechanism 30 is disposed immediately above the substrate 53 mounted on the substrate carrier 51. It is accurately positioned inside the carrier accommodating section 20 by the pressure contact with 36.

Next, as shown in FIG.
Is operated, and the substrate transfer member 45 is raised by the action of the feed screw 43. The substrate transfer member 45 rises and simultaneously lifts the plurality of substrates 53, and the substrate 53 enters the inside of the substrate holding mechanism 30. Eventually, as shown by the two-dot chain line 53 'in FIG. 3, the substrate transfer member 45 temporarily pushes the substrate 53 up to a position slightly above the regular holding position of the substrate shown by the one-dot chain line in the figure. Here, the air cylinder 37 protrudes the cylinder rod 37a downward as shown by the one-dot chain line in FIG. 3, and the distal end of the substrate receiving pin 38 is in the retracted posture lifted upward. In this case, there is provided a passage that allows the inside of the substrate holding mechanism 30 to rise without any trouble. At this time, the cylinder rod 37a is pulled upward by the operation of the air cylinder 37, and the substrate support portion 38a at the tip of the substrate receiving pin 38 descends as shown by the solid line in the figure, and slightly protrudes below the substrate 53. . Next, when the substrate transfer member 45 is slowly lowered, the substrate 53 is lowered halfway. However, when the lower end of the substrate 53 contacts the substrate support portion 38a, the substrate 53 stops at the position indicated by the dashed line in the figure. Only the substrate transfer member 45 moves downward and returns to the initial position shown in FIG.

The plurality of substrates 53 are held inside the substrate holding mechanism 30 as described above. Next, the substrate holding mechanism 30 is moved from the state shown in FIG. 2B to the state shown in FIG. In this state, the cylinder rod 34a of the air cylinder 34 is pulled in, the movable plate 31 is moved rightward in the drawing, and the holding interval of the substrate is increased as shown in FIG. At this time, before moving to the next operation, the carrier accommodating unit 20 is
The substrate carrier 51 accommodated in the carrier is discharged to the outside. Instead, as shown in FIG. 8, a substrate carrier 52 attached to and fixed to the carrier loader 23 and having a large holding interval of the substrate is accommodated in the carrier accommodation. It is introduced into the unit 20.

As shown in FIG. 5, the substrate carrier 52 is sequentially fed along the guide rail 26 while being mounted on the carrier loader 27 from the rear of the apparatus. To the inside of the carrier accommodating section 20. Carrier storage unit 20
Inside, a dedicated carrier holder 2 for the substrate carrier 52 is provided.
4 and 25 (see FIGS. 1 and 8) are installed, and a substrate carrier 52 is set to these carrier holders 24 and 25 from above. When the substrate carrier 52 is set on the carrier holders 24, 25, the carrier holders 24, 25 are raised, and the upper ends of the substrate carriers 52 are pressed against the positioning plates 35, 36 as shown in FIG.

The substrate carrier 52 thus positioned is configured to have the same substrate mounting interval as the substrate holding interval of the wide pitch in the substrate holding mechanism 30. Carrier 52
Is positioned such that the substrate holding position of the substrate holding mechanism 30 is located immediately above the substrate mounting position on the substrate carrier 52. The method for positioning the substrate carrier 52 is the same as the method for positioning the substrate carrier 51.

Next, by operating the drive motor 48, the substrate transfer member 46 is raised by the action of the feed screw 44, and the substrate 53 is supported from below in the substrate holding mechanism 30. Lift once to the state shown. In this state, the air cylinder 37 is operated to move the substrate supporting portion 38a of the substrate receiving pin 38 upward and store it in the retracted position. Next, as shown in FIG. 9, the substrate transfer member 46 is lowered, and finally the substrate 53 is moved to the substrate carrier 5.
2 is stored. Then, the substrate transfer member 46
Is returned to the original position shown in FIG. 1, the substrate carrier 52 in which the substrate 53 is stored is placed on the carrier loader 29 in front of the apparatus (right side in the figure) from the carrier holders 24 and 25 as shown in FIG. It is transferred and discharged along the guide rail 28 to the outside of the apparatus. The transfer of the substrate carrier 52 shown in FIG. 5 is performed by a robot arm, a feed screw mechanism, or the like (not shown).

As described above, according to the present embodiment, a plurality of substrates 5 mounted on the substrate carrier 51 are provided.
3 is a substrate carrier 5 having different mounting intervals of the substrate.
2 can be transferred. Here, as the substrate carrier, various types of carriers can be used by setting the apparatus in advance such as a carrier for transport and a carrier for processing.

Further, a plurality of substrates mounted on the substrate carrier can be transferred to the substrate holding mechanism at once, and similarly, can be simultaneously transferred to another substrate carrier. Processing can be performed quickly.

In this embodiment, the substrate carrier itself is almost the same as that of the conventional structure, and there is no problem. The substrate holding mechanism 30 according to the mounting interval of the substrates of the two substrate carriers to be transferred. Since it is sufficient to set two values of the holding interval that can be changed mutually in the above, there is no need to change the transporting process using the substrate carrier, the processing process, or the like, or a complicated structure is required for the substrate carrier. There is no need to provide.

Further, a portion which comes into contact with the substrate 53 to be transferred is made of a corrosion-resistant resin, particularly a fluorine resin, and all the regions where the substrate exists are operated by air drive. Therefore, there is little generation of dust, and there is little danger of lowering the cleanliness and contaminating the substrate.

[0042]

As described above, according to the present invention, the following effects can be obtained.

According to the first or fourth aspect, the plurality of substrates accommodated in the substrate carrier are temporarily held by the substrate holding mechanism while maintaining the mounting intervals, and the distance between the substrate holding frames of the substrate holding mechanism is reduced. After the substrate is changed by the interval changing mechanism, the substrate can be transferred and mounted on another substrate carrier having a different mounting interval, so that the substrate can be automatically and quickly transferred.

According to the second aspect, the substrate is lifted from the substrate carrier arranged in the carrier accommodating section through the opening by the elevating arm of the substrate transfer mechanism, and is held by the substrate holding mechanism. The substrate can be extended to support the substrate from below, and the substrate can be temporarily held by the substrate holding mechanism.When the substrate is transferred from the substrate holding mechanism to the substrate carrier, the substrate is lifted through the opening of the substrate carrier. After the substrate is supported by the lift arm that has been moved, the substrate support section is retracted, and the substrate can be stored in the substrate carrier by lowering the lift arm. Can be transferred.

According to the third aspect, since the substrates mounted on the substrate carrier can be transferred at once, the transfer processing between the substrate carriers can be performed very quickly.

[Brief description of the drawings]

FIG. 1 is a schematic front view showing a schematic configuration of an embodiment of a substrate transfer device according to the present invention.

FIGS. 2A and 2B are principle mechanism diagrams (a) and (b) showing a principle operation for changing a substrate holding interval in the substrate holding mechanism of the embodiment.

FIG. 3 is a side view showing a structure of a substrate holding frame in the substrate holding mechanism of the embodiment.

FIG. 4 is a partial cross-sectional view showing a structure of a substrate holding frame in the substrate holding mechanism of the embodiment, with a part being omitted.

FIG. 5 is a schematic side view showing a schematic configuration in the vicinity of a carrier accommodating portion of the embodiment in a partial cross section.

FIG. 6 is a schematic front view showing the operation of the embodiment.

FIG. 7 is a schematic front view showing the operation of the embodiment.

FIG. 8 is a schematic front view showing the operation of the embodiment.

FIG. 9 is a schematic front view showing the operation of the embodiment.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Frame 11 Bottom plate 12, 13 Guide shaft 20 Carrier accommodation part 30 Substrate holding mechanism 33 Substrate holding frame 38 Substrate receiving pin 38a Substrate support part 40 Substrate transfer mechanism 45, 46 Substrate transfer member 51, 52 Substrate carrier 53 Substrate

Claims (4)

[Claims] 1. A carrier accommodating portion for accommodating a substrate carrier, a substrate holding mechanism configured to at least temporarily hold a plurality of substrates mounted on the substrate carrier, the carrier accommodating portion and the substrate Between the holding mechanism,
A substrate transfer mechanism configured to transfer a plurality of substrates mounted on the substrate carrier, wherein the substrate holding mechanism includes a plurality of substrate holding frames for holding the substrate, A substrate transfer device, comprising: an interval changing mechanism for changing an interval between the substrate holding frames so as to correspond to a change in the mounting interval of the substrates on the substrate carrier. 2. The substrate support section according to claim 1, wherein the substrate holding mechanism is disposed above the carrier accommodating section, and is capable of supporting the substrate held by the substrate holding frame from below. An opening is provided on the bottom surface of the substrate carrier, and the substrate transfer mechanism moves the plurality of substrates with the substrate holding mechanism from below the substrate carrier via the opening. A substrate transfer device, comprising: a lifting arm configured to be able to move up and down. 3. The substrate transfer mechanism according to claim 1, wherein the substrate transfer mechanism can transfer the plurality of substrates mounted on the substrate carrier collectively during the transfer between the carrier accommodating portion and the substrate holding mechanism. A substrate transfer device, characterized in that: 4. A plurality of substrates mounted on a first substrate carrier are simultaneously transferred in the same mutual arrangement, and are arranged so that a holding interval equal to a mounting interval of the substrates in the first substrate carrier is provided. After holding the plurality of substrate holding frames, and then changing the holding interval of the substrate by the substrate holding frame to an interval equal to the mounting interval of the second substrate carrier, the plurality of substrates are left as they are. A method of transferring substrates, wherein the substrates are simultaneously transferred to the second substrate carrier in a mutual arrangement.