JPH11110934A - Manufacture of magnetic head - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a slider for easily forming prescribed crown and camber shapes in an ABS(Air Bearing Surface) in good yield. SOLUTION: A row 21 having magnetic head elements 21a, 21b and 21c is placed on a work 70, and a resist film 71 for ion milling is stuck to an ABS. A photomask 72 having the pattern in a prescribed rail shape is placed on this resist film 71 and then irradiated with ultraviolet rays, and after it is exposed on the pattern having the prescribed rail shape, parts other than exposed parts 71a, 71b, 71c, 71d, 71e and 71d are dissolved in developing solution to be eliminated. After the ABS on this row 21 is irradiated with argon ions Ar<+> and ion milling is performed, diffusion solution 75 obtained by diffusing the fine particles of a hard inorganic compound from an injection nozzle 74 is injected to the ABS of the row 21 and compression stress is applied on a part clashed with the fine particles.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a thin-film magnetic head used in a magnetic disk drive or the like.
In particular, the present invention relates to a method for manufacturing a floating magnetic head in which a surface facing a recording medium floats with respect to the recording medium when the recording medium rotates.

[0002]

2. Description of the Related Art An air bearing surface of a slider of a magnetic head, that is, a so-called floating magnetic head, in which a surface facing the recording medium floats with respect to the recording medium by rotation of the recording medium, that is, ABS (Air). When the bearing surface is flat, the ABS lands on the recording surface of the recording medium in close contact with the recording medium when the recording medium is stopped. Therefore, a large starting torque is required when the motor that drives the recording medium is started. In such a case, the length of the ABS of the slider is curved (hereinafter, referred to as a crown shape), and the width of the ABS of the slider is curved. (Hereinafter, it is called a camber shape).

For this reason, such a floating magnetic head is manufactured as follows. That is, a magnetic head wafer in which a plurality of thin film magnetic head elements are formed in a vertical direction and a horizontal direction by a wafer process is cut into one element row (hereinafter simply referred to as a row), and both sides of the cut row are cut. After polishing (double-sided lapping), this row is bonded to a work holder (jig) to polish (lap) the ABS of the row to the throat height, and to form a tapered surface on the air inflow side of the ABS. Thereafter, the rear surface of the row is polished, a rail pattern is formed on the ABS, and the row is cut for each slider, thereby producing the row.

[0004] By the above-mentioned double-sided lapping process, as shown in FIG. 8 (a), extremely thin layers (about 3 μm) on both surfaces of the row 80 have a compressive stress (see FIG.
(Refer to the arrow in (a)), but due to the perfect balance of the stresses on both sides, which is a feature of the double-sided lapping, a row 80 with high parallelism and less warpage is obtained.

[0005] After the double-sided lapping process,
Throat height processing is performed to make the row 80 a predetermined throat height. In this throat height processing, the row 80 is bonded to a jig, and the ABS 81 of the row 80 is subjected to one-side lapping. Since the processing stress due to the single-sided lapping is smaller than the processing stress due to the double-sided lapping, the balance of the residual compressive stress which is balanced by the double-sided lapping is broken, and the processing surface (ABS81) shrinks during throat height processing to form a dent. But FIG.
As shown in (b), the amount of deformation of the processing surface (ABS 81) is removed by processing, and the rear surface 82 side is warped (convex).

After the throat height processing, the back surface 82 of the row 80 is subjected to single-side lapping with fine diamond abrasive grains. Since the processing stress on the rear surface 82 side is reduced by the one-side lapping, the rear surface 82 shrinks to form a dent. However, as shown in FIG. 8C, the deformation amount of the processed surface (rear surface 82) is removed by the processing. On the contrary, the ABS 81 side shows a warp (convex portion).

After such processing, the row 80 is cut for each slider 80a, and as shown in FIG. 8D, the ABS 81a of the slider 80a is moved in the length direction (x in FIG. 8D). A crown shape curved by a predetermined amount in the −x direction is formed, and the crown shape is formed in the width direction (FIG. 8D).
(Y-y direction), a slider 80a having a camber shape curved by a predetermined amount is obtained.

[0008]

However, when the row 80 is manufactured as described above, a predetermined crown shape and camber shape are formed on the ABS of the row 80, but the thickness of the row cut in rows ( Since the distance between the ABS and the rear surface is extremely thin, 0.3 to 0.6 mm, the lapping process is unevenly performed in the double-sided lapping process. Bends, swells, etc.
It was difficult to obtain a substantially straight row 80, and the yield was poor. Therefore, the present invention has been made in view of the above problems, and an object of the present invention is to provide a slider that can easily form a predetermined crown shape and camber shape on an ABS with a high yield.

[0009]

SUMMARY OF THE INVENTION The present invention relates to a method for manufacturing a magnetic head in which a surface facing a recording medium floats with respect to the recording medium by rotating the recording medium. In order to solve the above-described problem, a first feature of the present invention is that an element row (row) obtained by cutting a magnetic head wafer in which a plurality of thin film magnetic head elements are formed in a plurality of rows for each row has a predetermined throat height. A polishing step of polishing so as to make the element row polished by the polishing step.
A photo-etching step of photo-etching the BS to have a predetermined rail shape, and a portion other than the rail shape of the ABS by spraying abrasive at a high speed onto the ABS formed in the predetermined rail shape by the photo-etching step. And a hardening step of generating a compressive stress in the surface layer of the cavity (to be described later), and the ABS is formed to have a predetermined curved shape by the compressive stress generated in the hardening step.

[0010] As described above, when compressive stress is generated in the surface layer of the cavity by injecting the abrasive at high speed onto the ABS formed into a predetermined rail shape by the hardening process, residual stress is generated in the surface layer of the cavity. Occurs. ABS
, The compressive stress becomes AB
Since a force acts in a direction to expand from S, a predetermined crown shape and camber shape are formed on the ABS due to the residual stress. Further, after the ABS is formed into a predetermined rail shape, a predetermined crown shape and camber shape can be continuously obtained on the ABS, so that it is possible to easily process this kind of ABS and simplify the manufacturing process. This makes it possible to manufacture such a magnetic head at low cost.

[0011] A second feature of the present invention is that the photo-etching step includes a resist film adhering step of adhering a milling resist film to the raw ABS polished in the polishing step, and a resist film adhering step. An exposure step of exposing the resist film adhered in the attaching step through a photomask having a predetermined rail shape, and removing an exposed or unexposed part of the resist film from the ABS by the exposure step and a predetermined rail shape. A developing step of leaving the resist film so that the resist film remains, and an ion milling step of etching using the resist film remaining in the developing step as a mask, and forming a predetermined rail shape on the ABS by the ion milling step. I have.

As described above, after the milling resist film is adhered to the ABS, the resist film is exposed to light through a photomask having a predetermined shape and developed to thereby expose the milled resist film to a light-sensitive portion or a light-sensitive portion. The portions not to be removed are removed, and a predetermined rail shape is formed on the milling resist film. By irradiating the ABS where the resist film for milling formed in this predetermined rail shape remains with argon ions or the like and performing ion milling, the resist film for milling formed in the predetermined rail shape is left. An ABS having a predetermined rail shape is accurately formed.

For this reason, in the subsequent curing step, even if the abrasive is sprayed on the ABS at a high speed, a compressive stress is not generated in the portion where the resist film for milling remains, and the portion other than the rail shape is formed. Site (cavity)
A compressive stress can be generated in the surface layer of When a compressive stress remains in the ABS, a force acts in a direction in which the compressive stress expands from the ABS, so that a predetermined crown shape and camber shape are formed in the ABS due to the residual stress. .

A third feature of the present invention resides in that the above-mentioned abrasive is made of fine particles made of a hard inorganic compound. If the fine particles that collide with the ABS are hard inorganic compounds, compressive stress is easily generated at the site where the fine particles collide. This compressive stress can be freely adjusted by adjusting the particle size of the fine particles, the collision speed or the area of the collision surface, so that the crown shape and camber shape formed by the collision of the fine particles can be freely adjusted. become.

[0015]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A preferred embodiment of a method of manufacturing a magnetic head according to the present invention will be described below with reference to FIGS.
Description will be made in the following order of steps 1 to 10. FIG. 1 is a diagram schematically illustrating a magnetic head wafer in which a plurality of thin film magnetic head elements are formed in a vertical direction and a horizontal direction by a wafer process, and FIG. 2 is a diagram illustrating an element array of the magnetic head wafer in a slicing process. FIG. 3 is a view showing a state in which a row is cut into blocks for each of a plurality of rows. FIG. 3 shows a state in which the cut block is bonded to a work holder (jig), and the ABS of the lowest row of this block is attached. FIG. 4 is a view showing a state in which a row after wrapping is cut, FIG. 5 is a view showing a cut row of one row, and FIG. 6 is a view showing one row of cut row. A
It is a figure which shows a series of processes from photoetching for forming a rail in BS to hardening process.

1. Block cutting step As shown in FIG.
Surface 10a of substrate made of sintered alumina containing fluoride such as F ₂ , CaF ₂ , SrF ₂ , BaF ₂ , and LiF
A plurality of thin film magnetic head elements are formed by a wafer process so as to be rows 11, 12, 13,... In the vertical direction. For example, a number of thin-film magnetic head elements 11a, 11b, 11c,... Note that the same applies to the rows 12, 13,....

Thus, a plurality of rows (for example, 10 rows) of rows 11, 12, 13,... Of the magnetic head wafer 10 in which the thin-film magnetic head elements are formed as the rows 11, 12, 13,. As one block, as shown in FIG. 2, a plurality of blocks 20, 30, 40,.
Although FIG. 2 shows only the blocks 20, 30, and 40, actually, a large number of blocks (for example, 10 blocks)
Cut). Thus, blocks 20, 3
When the magnetic head wafer 10 is cut at every 0, 40, the blocks 20, 30, 40 are cut while maintaining the high straightness of the magnetic head wafer 10, and the cut blocks 20, 30, 40 are cut at 1, respectively. High straightness block 2 because it is much stiffer than row rows
0, 30, and 40.

One block cut in this way, for example, block 20, is made up of rows 21, 22,.
The rows 21 (the same applies to the rows 22...) Are formed with thin-film magnetic head elements 21 a, 21 b, 22 c. Then, this block 20 (30, 4)
0) side surface 20a (30a, 40a) becomes ABS,
The side surface 20b (30b, 40b) is the back surface for the ABS. In the subsequent steps, only the block 20 will be described to simplify the description.

2. Lapping Step The block 20 manufactured as described above is placed on the mounting surface of the work holder (jig) 50 as shown in FIG. 3, and the end of the block 20 and the mounting surface of the work holder 50 are rosin-bonded. Adhesion is performed with an adhesive 51 such as a system wax. At this time, the back surface of the lowermost row of the block 20 serves as an adhesive surface, that is, the ABS of the uppermost row of the block 20 serves as an upper end surface. Adhered to.

Thereafter, the work holder 50 is rotated so that the block 20 adhered to the work holder 50 faces downward, and is placed on a lapping machine 60 as shown in FIG. Then, the lapping machine 60 is rotated while spraying the polishing abrasive grains 62 made of diamond 0.5 μm or the like accommodated in the polishing abrasive grain container 61 onto the lapping board 60 by the pump 63, so that the lowermost row of the block 20 is removed. ABS
Wrap. At the time of this lapping, as shown in FIG. 5, processing is performed from the bottom of the row 21 (α line in FIG. 5) to the target position of lapping (β line in FIG. 5). FIG.
Is the reference line for the element height, and
The height to the line is the element height (for example, 1 μm, and in the case of an MR head, the height of the MR element).

3. Row Cutting Step After wrapping the ABS of the lower row of the block 20 so as to have a predetermined element height, the work holder 50 is removed from the lapping machine 60, and the work holder 50 is turned sideways as shown in FIG. Then, the row 21 wrapped so that the ABS has a predetermined element height is cut by rotating a cutting blade (not shown).

In this manner, when the ABS of the lowermost row of the block 20 is wrapped so as to have a predetermined element height, the block 20 has greater rigidity and straightness than the row of rows. Is large,
This ABS becomes uniform, so that the lapping process can be performed efficiently. Further, when the ABS is uniform, the element height of the row is also uniform, so that lapping with a good yield can be performed.

4. Iterative process In this manner, by cutting the wrapped row 21 so that the ABS has a predetermined element height, the block 20 is shortened by the length of the cut of the row 21. Then, again, the block 20 thus shortened
The work holder 50 to which is adhered is placed on a lapping machine 60, and polishing abrasive grains 62 made of diamond 0.5 μm or the like stored in a polishing abrasive grain container 61 are placed on the lapping machine 60 by a pump 63. The lapping machine 60 is rotated while spraying to wrap the ABS of the lower row 22 of the shortened block 20 until the element height of the row 22 reaches a predetermined height.

After wrapping the ABS of the row 22, the work holder 50 is removed from the lapping machine 60, the work holder 50 is turned sideways, and the row 22 is cut in the same manner as when the row 21 is cut.

The above lapping and row cutting processes are repeated, and when the remaining rows of the block 20 are aligned, the last lapping process is performed.
The wrapping processing and cutting processing of 0 are completed. Similarly, wrapping and cutting are performed on the blocks 30, 40,... So that the ABS of each row has a predetermined element height.

Then, the ABS of each row 21, 22... Wrapped so that the ABS of each row has a predetermined element height becomes an adhesive surface, that is, the back surface is wrapped. Are adhered to the work holders 50 so as to form surfaces, and the back surfaces of the rows 21, 22,... Are each wrapped in the same manner as the ABS lapping process described above. In this case, it is necessary to perform the lapping process on the back surface so as to generate a residual compressive stress that substantially balances the residual compressive stress generated by the ABS lapping process.

In this manner, each row 2 wrapped so that the ABS has a predetermined element height.
., Are sequentially cut for each row 21, 22,..., And the back surface of each row 21, 22,. Magnetic head elements 21a, 21b, 21c, 21d, 2
A row 21 having 1e and 21f (the same applies to other rows) is produced. In FIG. 5, the magnetic head elements 21a, 21b, 21c, 21
Although six d, 21e, and 21f are shown, the number is determined when the magnetic head wafer 10 is manufactured, and may be any number of elements.

5. Resist Film Attaching Step The row 21 manufactured as described above is placed on a strip-shaped work 70 as shown in FIG. Next, a resist film 71 for ion milling is attached on the ABS of the row 21 placed on the work 70. This ion milling resist film 71 is made of a photosensitive resin,
It is formed of a negative photosensitive resin that is hardly soluble even when immersed in a developing solution (for example, an aqueous solution of sodium hydroxide (NaOH)) by being irradiated with ultraviolet rays. As the photosensitive resin, a positive photosensitive resin which is easily melted when immersed in a developer by being irradiated with ultraviolet rays may be used.

6. Exposure Step Next, as shown in FIG. 6B, a photomask 72 on which a predetermined rail-shaped pattern is formed is placed on the ABS of the row 21 in which the ion milling resist film 71 is stuck on the ABS. Then, ultraviolet rays are irradiated on the photomask 72 from an ultraviolet lamp 73 disposed above the photomask 72. When the photomask 72 is irradiated with ultraviolet rays, the ultraviolet rays that have passed through the photomask 72 on which the predetermined rail-shaped pattern is formed expose the ion milling resist film 71 to the predetermined rail-shaped pattern. UV-exposed portions 71a, 71b, 71c, 71d, 7 of the ion milling resist film 71
1e and 71f are hardened and hardly dissolved even when immersed in a developing solution (for example, sodium hydroxide (NaOH) aqueous solution) in a later developing step.

[7] Developing Step Next, the row 21 in which the ion milling resist film 71 was exposed to a predetermined rail-shaped pattern was immersed in a developing solution (for example, an aqueous solution of sodium hydroxide (NaOH)) to expose the ion milling resist film 71 to light. Portions 71a, 71b, 71c, 71d, 71e, 7
The milling resist film 30 in a portion other than 1f is developed with a developing solution (for example, sodium hydroxide (NaOH) aqueous solution)
To remove the exposed portion 71
a, 71b, 71c, 71d, 71e, 71f are left.

8. Ion Milling Step Next, as shown in FIG. 6C, portions 71a, 71b, 71c, 71d, and 7 exposed to a predetermined rail pattern.
Irradiation of argon ions Ar ⁺ onto the ABS of the row 21 with the remaining 1e and 71f is performed, and the exposed portions 71a, 71b, 71c and 7 of the resist film 71 for ion milling are irradiated.
Ion milling is performed using 1d, 71e and 71f as a mask. By this ion milling, as shown in FIG. 6D, the resist film 71 for ion milling of ABS is used.
71a, 71b, 71c, 71d, 71 where
e, sites 21g, 21h, 21 of ABS other than 71f
The grooves i, 21j, 21k, 211, and 21m are etched into grooves to form a rail pattern as shown in FIG.

9. Curing Step After the ion milling, the ion milling resist film 71 remaining on the ABS is used as it is, that is, the exposed portions 71a, 71b, 71c, 71d, 71e, 71 of the ion milling resist film 71.
As shown in FIG. 6D, using the f as a mask,
4, harder inorganic compounds such as silicon carbide (SiC),
Silicon dioxide (SiO ₂ ), aluminum oxide (Al
A dispersion 75 in which fine particles having a particle size of 1000 to 2000 mesh such as ₂ O ₃ ) are dispersed is jetted at high speed toward the ABS of the row 21 to perform wet blasting (or honing).

In this wet blasting process, since the amount of the remaining resist film 71 for ion milling is extremely small, it is not necessary to form a mask for wet blast by adding a new resist film or the like. In addition, at the time of wet blasting, the rail surface itself is protected by the remaining resist film 71 for ion milling, so that it is not damaged by the wet blasting. Further, the groove-shaped region between the rail surfaces, that is, the portion on which the above-described ion milling is performed is called a cavity. However, since the ion milling resist film 71 is not provided over the entire cavity. The entire cavity is subjected to wet blasting.

The depth of the entire cavity (the distance along the direction perpendicular to the main plane of the row) is determined by both ion milling and wet blasting.
80 to 90% of the depth of the formed cavity is formed by ion milling, and the entire depth of 10 to 20% is formed by wet blasting. The water pressure in this high-speed injection is preferably 3 to 5 kg / cm ² , and the injection time is preferably about 30 seconds to 2 minutes.

The portions 71a, 71b, 7 exposed to a predetermined rail-shaped pattern by the high-speed injection of the fine particles.
A of row 21 with 1c, 71d, 71e, 71f remaining
Parts 21g, 21h, 21i, 21j, 21 other than BS
Particles collide with k, 211 and 21m. 21g, 21h, 21i, 21j, 21 where these particles collided
Compressive stress acts on the surface layers of k, 211, and 21m due to the impact force. 21g, 21 where these particles collided
When a compressive stress acts on the surface layers of h, 21i, 21j, 21k, 211, and 21m, the compressive stress remains, and the residual compressive stress acts in a direction in which the ABS expands from the ABS.

On the other hand, portions 21g, 21h, 21i, 21j, 21k, 211, and 2 of the ABS where the particles collided.
A portion other than 1 m, that is, portions (71a, 71b, 71) having the remaining ion milling resist film 71.
c, 71d, 71e, and 71f) act to prevent expansion, so that the ABS is curved in accordance with a predetermined rail shape pattern due to the residual stress, and the crown shape is determined in accordance with the predetermined rail shape pattern. And a camber shape is formed. Therefore, the crown shape and the camber shape can be freely adjusted by changing the rail shape pattern.

In the present invention, first, ion milling is performed to form a large part of the depth of the cavity, and subsequently, wet blasting is performed, so that no cavity is formed. Compared to forming a crown and camber shape by performing wet blasting on the raw as it is, it is possible to form a crown shape and camber shape with less processing stress, and an excessive crown shape and camber shape may occur, The processing stress can be easily controlled without the row being twisted.

On the other hand, when wet blasting is performed on a part of the cavity to generate processing stress,
Since the region where the wet blasting is performed is narrow, a desired processing stress cannot be generated unless the wet blasting is performed to such a depth that a groove having a further different depth is formed in the cavity. As a result of such processing, a step is generated in the cavity. Such grooves or steps having different depths adversely affect the flying characteristics of the slider.

However, in the present invention, the ion milling resist film 7 during the ion milling process is used.
Since wet blasting is performed by using 1 as it is as a mask, wet blasting can be performed on the entire cavity portion, and no new groove or step having a different depth is generated in the cavity.
As a result, the flying characteristics of the slider are not adversely affected.

Since the compressive stress generated by the collision of the fine particles can be freely adjusted by adjusting the particle size or the collision speed of the fine particles, the crown shape and the camber formed by the collision of the fine particles can be adjusted. The shape can be adjusted freely.

10. Slider manufacturing process By the hardening process, each thin-film magnetic head element 21a, 2
After the row 21 in which the ABS of 1b, 21c, 21d, 21e and 21f has a predetermined rail shape is washed with a washing liquid to remove the ion milling resist film 71, the thin film magnetic head elements 21a, 21b, 21c and 21d are removed. , 2
The slider is cut at each of 1e and 21f to obtain a slider in which the ABS has a predetermined crown shape and camber shape.

FIG. 7 is a view showing an example of a rail-shaped pattern which is the ABS of the row 21. The photomask 72 is formed so as to have a rail-shaped pattern as shown in these figures.
Are formed. FIG.
In FIG. 7, a hatched portion indicates a portion where fine particles collide in the curing process, that is, a cavity. The upper part of FIG. 7 is a front part (air inflow side) of each slider, and the lower part of FIG. (Outflow side).

Here, in FIG. 7A, fine particles are made to collide with the left and right end portions A ₁ and A ₂ and the center portion A ₃ of the slider A so that the ABS has a U-shaped rail shape.
In FIG. 7 (2), the left and right ends B ₁ , B ₂ and the center B ₃ of the slider B are arranged so that the center of both sides of the U-shape of the slider B has a rail shape protruding inward. Collision with fine particles. In FIG. 7 (3), in order to form a square rail shape symmetrically on the front ABS of the slider C and to form a U-shaped rail shape on the rear ABS, a center portion C of the slider C is formed. Particles are made to collide with ₁ .

In FIG. 7 (4), the slider D is formed to have a square rail shape symmetrically with respect to the ABS at the front portion of the slider D, and the inclined portion is formed at the rear portion of the ABS at the upper portion of both sides of the U-shape. to form, the impinging particles in the central portion D ₁ of the slider D. In FIG. 7 (5),
And forming the front of the rail shape of a square symmetrically ABS of the slider E, in order to form form the rail shape of the hook-shaped symmetrically to the rear of the ABS, collision particulates in the central portion E ₁ of the slider E Let it. In FIG. 7 (6), the slider F is formed in a square rail shape symmetrically on the front ABS on the front portion, and is formed on the rear ABS symmetrically in a rail shape in which one side of the rectangle is inclined symmetrically on the left and right sides. , colliding fine particles in the central portion F ₁ of the slider F.

The above sliders A, B, C, D,
In E and F, as the hardened area in the length direction of the sliders A, B, C, D, E and F (hatched portion in FIG. 7) becomes larger, that is, the sliders A → B → C → D → E → F , The crown shape becomes larger, and the slider A,
As the cured area in the width direction of B, C, D, E, and F (the hatched portion in FIG. 7) increases, that is, the slider A → B → C
The camber shape becomes larger as the order of → D → E → F. Therefore, each slider A, B, C, D, E,
By changing the rail shape like F, the crown shape and camber shape can be controlled.

As described above, in this embodiment,
In a state where the ABS formed in a predetermined rail shape is protected by the resist film 71 for ion milling, hard fine particles are jetted at a high speed at a low speed to generate a compressive stress on a surface layer of a portion other than the rail shape, thereby generating a predetermined stress. Since the crown shape and the camber shape are formed, the manufacturing process can be simplified, and this type of magnetic head can be manufactured at low cost.

When the fine particles colliding with the ABS are hard inorganic compounds, a compressive stress is easily generated at a portion where the fine particles collide, and the compressive stress is caused by the particle size of the fine particles, the collision speed or the collision surface. Since it is possible to freely adjust by adjusting the area, the crown shape and camber shape formed by the collision of the fine particles can be freely adjusted, and the predetermined crown shape and camber shape can be easily adjusted. It can be formed.

[Brief description of the drawings]

FIG. 1 is a diagram schematically showing a magnetic head wafer.

FIG. 2 is a diagram showing a state where a magnetic head wafer is cut into blocks.

FIG. 3 is a diagram illustrating a state in which the lowest row ABS of a block is wrapped.

FIG. 4 is a diagram showing a state in which a row after wrapping is cut.

FIG. 5 is a diagram showing one row of cut rows.

FIG. 6 is a diagram showing a series of steps from a step of photo-etching a row of ABS to a step of curing.

FIG. 7 is a diagram showing an example of a rail-shaped pattern formed on the ABS.

FIG. 8 is a view showing a conventional slider after wrapping.

[Explanation of symbols]

10 ... magnetic head wafer, 11a, 11b, 11c ...
Magnetic head element, 20, 30, 40 ... row block,
21a, 21b, 21c: magnetic head element, 50: work holder (jig), 51: adhesive, 60: antiferromagnetic film, 60: lapping machine, 61: polishing abrasive container, 62: polishing abrasive, 63 … Pump, α… lower end face of low ABS, β…
Target position of lapping, γ: Element height reference line, 70: Work, 71: Milling resist film, 72: Photomask, 73: Ultraviolet lamp, 74:
Injection device, 75: dispersion liquid in which fine particles (abrasive) are dispersed

Claims (3)

[Claims] 1. A method for manufacturing a magnetic head in which a recording medium rotates so that a surface facing the recording medium floats with respect to the recording medium, the method comprising: forming an element row on which a plurality of thin film magnetic head elements are formed. A polishing step of polishing to a predetermined throat height; a photoetching step of photoetching the ABS of the element row polished by the polishing step to have a predetermined rail shape; and a predetermined rail by the photoetching step. A hardening treatment step of injecting an abrasive at a high speed to the ABS formed into a shape to generate a compressive stress in a surface layer of a portion other than the rail shape of the ABS, wherein the compressive stress generated in the hardening process step A
A method for manufacturing a magnetic head, wherein a BS is formed to have a predetermined curved shape. 2. The photo-etching step includes: a resist film attaching step of attaching a milling resist film to the ABS of the element row polished by the polishing step; and a step of forming the attached resist film into a predetermined rail shape. An exposure step of exposing the same resist film through a photomask, and removing the unexposed or exposed areas of the resist film from the ABS by the exposing step, and removing the resist film so as to have the predetermined rail shape. A developing step of remaining, and an ion milling step of etching using the resist film of the predetermined rail shape left by the developing step as a mask, wherein the predetermined rail shape is formed on the ABS by the ion milling step. 2. The method according to claim 1, wherein Method for producing a mounting of the magnetic head. 3. The abrasive according to claim 1, wherein the abrasive is fine particles made of a hard inorganic compound.
3. The method for manufacturing a magnetic head according to claim 1.