JPH11108571A - Heat pipe type semi-conductor cooler - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent the environmental destruction, and to miniaturize the contour by providing a metallic cooling block to which a plurality of semi-conductor elements are added, a ceramic heat transfer tube to transport the refrigerant, and a refrigerant consisting of pure water. SOLUTION: A plurality of semi-conductor elements 1 are added to a cooling block 3A formed of a metallic material, and the cooling block 3A is fixed to one side of a heat transfer tube 2A formed of a ceramic material in which the refrigerant 4 of the pure water evaporated by the heat of the semi-conductor elements 1 is transferred. A heat sink 5A is inserted in the other side of the heat transfer tube 2A to share the heat sink 5A of the semi-conductor elements 1 of the different potential from the insulation of a charging part of a cooling fin. Possibility of scattering the air pollutant can be eliminated, the contour can be miniaturized, and the environmental destruction can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a heat pipe type semiconductor cooler.

[0002]

2. Description of the Related Art FIG. 12 is a sectional view showing an example of a conventional heat pipe type semiconductor cooler housed under the floor of a railway vehicle. In FIG. 12, a cooling block 3G made of a copper material is housed in a sealed chamber of a box (not shown) provided under the floor of the vehicle.
A semiconductor element 1 such as a gate turn-off thyristor (GTO) is fixed.

[0003] A cooling block 3G is formed with an insertion hole having a U-shaped cross section, into which a heat transport pipe 2M made of copper is inserted with a U-shaped cross section. It is joined to the cooling block 3G.

[0004] In the heat transport pipe 2M, perfluorocarbon is injected beforehand as a refrigerant 11, and the heat transport pipe 2M
An opening end of a heat transport tube 2L having substantially the same shape as the heat transport tube 2M is connected to an opening side of the heat transport tube 2M via an insulating tube 10 made of ceramics.

A plurality of rectangular heat radiating plates 5A made of a thin aluminum plate are inserted into the heat transport tube 2L through a punched hole formed in the center, and the heat transport tube 2L is brazed.
L.

The heat pipe type semiconductor cooler is mounted so as to be inclined so that the heat transfer pipe 2L on the heat radiating side is slightly higher than the heat transfer pipe 2M on the heat absorbing side.
The heat transport pipe 2L is housed in an open chamber outside the sealed chamber of the box below the floor of the vehicle, and is cooled by the outside air flowing between the radiator plates 5A as the vehicle travels.

[0007] In the heat pipe type semiconductor cooler thus configured, heat generated by energizing the semiconductor element 1 is transmitted to the cooling block 3G, and from the cooling block 3G via the heat transport pipe 2M. Heat transfer pipe 2M
Is absorbed by the refrigerant 11 injected into the air.

Then, the refrigerant 11 boils and vaporizes,
It rises inside the heat transport pipe 2M, flows into the heat transport pipe 2L via the insulating pipe 10, is cooled by the heat transport pipe 2L, is condensed and dropped, and then flows down from the heat transport pipe 2L to be transferred. Tube 2M
Refluxed. Hereinafter, by repeating the phase change of vaporization, cooling, and condensation, the heat of the semiconductor element 3G is released from the radiator plate 5A to the atmosphere via the refrigerant 11.

In this heat pipe type semiconductor cooler, the maintenance / inspection operator may touch the radiating fins 5A protruding into the open room under the floor of the vehicle.
An insulating tube 10 is inserted between 2M, and a perfluorocarbon having a better insulating property than pure water is used as a refrigerant.

FIG. 13 shows a case in which a common radiating fin 5C is inserted into a heat transport tube 2L which emits heat of a cooling block 3G to which a semiconductor element 1 having a different potential is attached. In this case, the semiconductor element 1 to which each semiconductor element 1 is fixed
An oxide film is formed on the mounting surface of
Are insulated from each other.

[0011]

However, in the heat pipe type semiconductor cooler constructed as described above, the perfluorocarbon injected as the refrigerant 11 has excellent insulation properties, but is released to the atmosphere. Then, there is a problem that the ozone layer is destroyed in the environmental aspect.

Therefore, as shown in FIG. 14, the semiconductor element 1 is mounted on both sides of the cooling block 3G via the ceramic plate 12, and the heat transport pipe 2F employs a connected copper pipe as shown in FIGS. A method of injecting pure water as the coolant 4 without the insulating tube 10 shown is also conceivable. However, when connecting the left and right semiconductor elements 1, the connecting copper plate 13 is inserted into the outer surface of the ceramic plate 12. These connecting copper plates 13 must be connected by connecting conductors 13a.

Then, the inductance of the circuit connecting the semiconductor element 1 increases due to the connection conductor 13a, and the semiconductor element which is turned on / off at high speed for the main motor whose speed is controlled by the variable voltage and variable frequency. Not only does the loss occurring in the connection conductor 12a between the two increase, but also the outer shape of the semiconductor converter increases. Accordingly, an object of the present invention is to provide a heat pipe type semiconductor cooler capable of miniaturizing the outer shape and preventing environmental destruction.

[0014]

According to a first aspect of the present invention, one side of a heat transport pipe for transporting a refrigerant vaporized by heat generation of a semiconductor element is fixed to a cooling block provided with a plurality of semiconductor elements, In a heat pipe type semiconductor cooling device having a heat radiating plate inserted on the other side of the heat transport pipe, the cooling block is made of a metal material, the heat transport pipe is made of a ceramic material, and the refrigerant is pure water.

According to a second aspect of the present invention, one side of a heat transport pipe for transporting a refrigerant vaporized by the heat generated by the semiconductor element is fixed to a cooling block provided with a plurality of semiconductor elements. In the heat pipe type semiconductor cooling device having a heat sink inserted on the other side, the cooling block is made of a ceramic material, the heat transport pipe is made of a metal material, and the refrigerant is made of pure water.

In the heat pipe type semiconductor cooler according to the present invention, one side of the heat transport pipe is inserted into the cooling block, and pure water is injected into the heat transport pipe. The heat pipe type semiconductor cooler of the invention corresponding to No. 4 is characterized in that one end of the heat transport pipe is joined to the open end of the pure water storage hole formed in the cooling block.

A heat pipe type semiconductor cooler according to a fifth aspect of the present invention is characterized in that a conductive film is formed on an additional surface of a semiconductor element of a cooling block, and the invention corresponds to a sixth aspect. The heat pipe type semiconductor cooler of
It is characterized in that a conductor is provided between the attached surfaces of the semiconductor elements on both sides of the cooling block.

In particular, the heat pipe type semiconductor cooler according to the invention of claim 7 is characterized in that pure water storage holes are formed on both sides of the conductor, and the heat pipe of the invention according to claim 8 is provided. The low-melting point metal material is injected between the cooling block and the outer periphery of the heat transport tube inserted into the cooling block, wherein the low-melting point metal material is injected into the cooling block.
The heat pipe type semiconductor cooler according to the present invention is characterized in that a heat transfer pipe made of a ceramic material is divided into a plurality of parts and connected by a copper pipe or an aluminum pipe.

According to the first to eighth aspects of the present invention, it is possible to insulate the cooling fins from the charged portion and share the heat sinks of the semiconductor elements having different electric potentials. Eliminates the risk of pollutant emissions. In the invention corresponding to claim 9, fatigue of the heat transport pipe due to vibration is reduced.

[0020]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a heat pipe type semiconductor cooler according to the present invention will be described below with reference to the drawings. FIG. 1 is a perspective view showing a first embodiment of a heat pipe type semiconductor cooler of the present invention, and FIGS.
FIG. 7 is a diagram corresponding to claim 1 and claim 4.

FIG. 1 is different from FIG. 12 shown in the prior art in the material of the heat transport pipe and the refrigerant, and the heat radiating plate is the same as FIG. That is, the heat transport pipe 2A shown in FIG. 1 is made of ceramics in a cylindrical shape, and both ends are sealed. Pure water as the refrigerant 4 is injected into the heat transport pipe 2A.

The heat transport pipe 2A is flat at both ends, unlike the heat transport pipe 2L shown in FIG. Therefore, the bottom surface of the insertion hole of the heat transport tube 2A formed in the cooling block 3A is also flat.

In the heat pipe type semiconductor cooler thus constructed, the cooling block 3A and the radiating fins 5
A can maintain the insulation withstand voltage characteristics by creeping insulation of the heat transport pipe 2A.

Therefore, not only can the safety against electric shock at the time of maintenance / inspection be improved, but also, as shown in FIG. Insulation between them can be maintained.

Further, since an insulating tube and a connecting conductor are not required, the structure is simple and the manufacturing is easy, the size can be reduced, and the risk of air pollution due to leakage during injection operation or the like can be eliminated. be able to.

FIG. 2 is a perspective view showing a heat pipe type semiconductor cooler according to a second embodiment of the present invention, which is shown in FIG. 12 shown in the prior art and FIG. 1 shown in the first embodiment. It is a figure corresponding to Claim 1 and Claim 4.

FIG. 2 is different from FIG. 1 particularly in the fixing structure of the heat transport pipe.
Is the same as That is, the heat transport pipe 2B shown in FIG.
Is made of ceramics and has a short cylindrical shape, and one end is open. The heat transport pipe 2B has an opening side joined to an opening end of the cooling block 3B with a silver solder.

The cooling block 3B has a coolant storage hole having a U-shaped cross section corresponding to the inner diameter of the heat transport pipe 2B. Also in the heat pipe type semiconductor cooler thus configured, the cooling block 3B and the radiating fins 5A can maintain the withstand voltage characteristics by creeping insulation of the heat transport pipe 2B.

Therefore, not only safety at the time of maintenance and inspection can be improved, but also, as shown in FIG. Insulation can be maintained.

Further, since an insulating tube and a connecting conductor are not required, the structure is simple and the manufacturing is easy, the size of the outer shape can be reduced, and the risk of air pollution due to leakage during injection work or the like can be eliminated. be able to. In addition, a flange portion may be formed on the opening side of the heat transport pipe 2B to increase the area of the brazing portion with the cooling block 3B to increase the bonding strength.

FIG. 3 is a perspective view showing a heat pipe type semiconductor cooler according to a third embodiment of the present invention, which is shown in FIG. 12 shown in the prior art and FIGS. 1 and 2 shown in the above embodiment. FIG. 6 is a diagram corresponding to another embodiment of claim 1. FIG.
1 is different from FIG. 1 and FIG. 2 in the structure of the heat transport pipe, and the radiator plate and the refrigerant are the same.

That is, the heat transport pipe 2D shown in FIG.
Manufactured in a cylindrical shape with ceramics, the lower end is sealed. An open end of a heat transport pipe 2C made of an aluminum material is joined to the heat transport pipe 2D by brazing.

In the heat pipe type semiconductor cooler thus configured, the cooling block 3A and the radiating fins 5 are also provided.
A can maintain the withstand voltage property by creeping insulation at the exposed portion of the heat transport pipe 2D.

Therefore, not only can the safety at the time of maintenance and inspection be improved, but also, as shown in FIG. Insulation can be maintained.

Further, since an insulating tube and a connecting conductor are not required, the structure is simple, the external size can be reduced, and the risk of air pollution due to leakage at the time of injection or the like can be eliminated. Also in this case, a slight flange portion is formed on the opening side of the heat transport pipe 2C so that the heat transport pipe 2D
May be increased to increase the bonding strength.

FIG. 4 is a perspective view showing a heat pipe type semiconductor cooler according to a fourth embodiment of the present invention. FIG. 12 shows the prior art, and FIGS. FIG. 11 is a diagram corresponding to FIG. 3 and corresponding to claims 1 and 8.

FIG. 4 is different from FIG. 1 particularly in the structure of the insertion portion of the heat transport pipe into the cooling block.
The heat sink and the refrigerant are the same. That is, the outer periphery of the insertion part of the heat transport pipe 2A into the cooling block 3C shown in FIG.
After inserting the heat transport tube 2A, the solder 6 is injected.

Therefore, the outer periphery of the inserted portion between the cooling block 3C and the heat transport tube 2A is in close contact with the solder 6 layer.

In the heat pipe type semiconductor cooler thus configured, the cooling block 3C and the radiation fin 5
A not only can maintain the insulation withstand voltage characteristic by creeping insulation of the heat transport tube 2A, but also can improve the cooling effect by improving the heat transfer coefficient between the semiconductor element 1 and the heat transport tube 2A.

Therefore, not only can the safety at the time of maintenance and inspection be improved, but also, as shown in FIG. Insulation can be maintained.

Furthermore, since an insulating tube and a connecting conductor are not required, the configuration is simple, the external shape can be reduced, and the risk of air pollution due to leakage during injection work can be eliminated.

FIG. 5 is a perspective view showing a heat pipe type semiconductor cooler according to a fifth embodiment of the present invention. FIG. 12 shows the heat pipe type semiconductor cooler according to the prior art, and FIGS. FIG. 14 is a diagram corresponding to another embodiment of claims 1 and 8.

FIG. 5 is different from FIG. 3 particularly in the structure of the insertion portion of the heat transport pipe into the cooling block.
The heat sink and the refrigerant are the same. That is, the outer periphery of the insertion part of the heat transport pipe 2D into the cooling block 3D shown in FIG.
Solder 6 is injected as in FIG.

The thickness of the heat transfer pipe 2E on the heat radiation side is larger than that of the heat transfer pipe 2C shown in FIG. 3, and as a result, the brazing surface with the heat transfer pipe 2D on the heat absorption side is increased. . In the heat pipe type semiconductor cooler thus configured,
The cooling block 3C and the radiation fins 5A can maintain the withstand voltage characteristics by creeping insulation of the heat transport pipe 2D.

Therefore, not only safety at the time of maintenance and inspection can be improved, but also, as shown in FIG. Insulation can be maintained.

Further, since an insulating tube and a connecting conductor are not required, the structure is simple, the external size can be reduced, and the risk of air pollution due to leakage during injection work or the like can be eliminated.

FIG. 6 is a perspective view showing a heat pipe type semiconductor cooler according to a sixth embodiment of the present invention. FIG. 12 shows the heat pipe type semiconductor cooler according to the prior art and FIGS. It is a figure corresponding to Claim 2 and Claim 5.

FIG. 6 is different from FIG. 1 particularly in the material of the heat transport pipe and the cooling block, and the heat radiating plate is the same. That is, the heat transport pipe 2F shown in FIG. 6 is manufactured in a cylindrical shape from a copper material, and both ends are sealed. On the other hand, the cooling block 3D is made of ceramics, and has a welding film 7 made of a copper material except for the periphery of the opening.

In the heat pipe type semiconductor cooler thus constructed, the semiconductor element 1 and the heat transport pipe 2F are
The insulation withstand voltage characteristics can be maintained by the cooling block 3D.

Therefore, not only safety at the time of maintenance and inspection can be improved, but also, as shown in FIG. Insulation can be maintained.

Further, since an insulating tube and a connecting conductor are not required, the structure is simple, the outer shape can be reduced, and the risk of air pollution due to leakage at the time of injection or the like can be eliminated.

FIG. 7 is a perspective view showing a heat pipe type semiconductor cooler according to a seventh embodiment of the present invention. FIG. 12 shows the heat pipe type semiconductor cooler according to the prior art, and FIGS. It is a figure corresponding to Claim 2 and Claim 4.

FIG. 7 is different from FIG. 6 in the structure of fixing the heat transport pipe to the cooling block.
That is, the heat transport pipe 2G shown in FIG. 7 is manufactured in a cylindrical shape from a copper material, and the open lower end is brazed to the open end of the ceramic cooling block 3E.

The heat transport pipe 2G has a columnar coolant injection hole corresponding to the inner diameter of the heat transport pipe 2G. Therefore, the diameter is smaller than the insertion hole of the heat transport pipe 2F formed in the cooling block 3D of FIG.

Also in the heat pipe type semiconductor cooler thus configured, the semiconductor element 1 and the heat transport pipe 2G are
The insulation withstand voltage characteristics can be maintained at the opening of the copper coating film 7 formed on the opening side of the cooling block 3E.

Therefore, not only safety at the time of maintenance and inspection can be improved, but also, as shown in FIG. Insulation can be maintained.

Further, since an insulating tube and a connecting conductor are not required, the structure is simple, the external size can be reduced, and the risk of air pollution due to leakage at the time of injection work or the like can be eliminated.

FIG. 8A is a perspective view showing an eighth embodiment of a heat pipe type semiconductor cooler according to the present invention, which is shown in FIG. 12 according to the prior art and FIGS. FIG. 8 is a diagram corresponding to FIG. 7 and corresponding to claims 2 and 6. FIG. 8B is a cross-sectional view taken along the line AA in FIG.

8 (a) and 8 (b), FIGS. 12 (a) and 12 (b) shown in the prior art and FIGS.
The difference is that the number of heat transport tubes and the cross-sectional structure of the cooling block are the same, and the radiator plate is the same.

That is, in the cooling block 3F shown in FIGS. 8A and 8B, three through-holes 3a are formed in a line at the center, and both side surfaces of these through-holes 3a are A circular counterbore is formed.

A copper rod 8A is inserted into each through hole 3a.
Both ends of these copper rods 8A are brazed to opposing surfaces of a copper plate 8B inserted into a counterbore. Left and right semiconductor elements 1
Are fixed to the left and right copper plates 8B. Cooling block 3
Two heat transport tubes 2F identical to the heat transport tubes 2F shown in FIG.

In the heat pipe type semiconductor cooler thus configured, the cooling block 3A and the radiation fin 5
A can maintain the insulation withstand voltage characteristic by the creepage insulation of the heat transport pipe 2A. As shown in FIG. 13, it is possible to increase the cooling effect by inserting a common cooling fin into the heat transport pipe 2F. it can.

Therefore, not only can the safety at the time of maintenance / inspection be improved, but also, as shown in FIG. Insulation can be maintained.

Furthermore, since an insulating tube and a connecting conductor are not required, the structure is simple, the external shape can be reduced, and the risk of air pollution due to leakage during injection work can be eliminated.

FIG. 9A is a perspective view showing a ninth embodiment of a heat pipe type semiconductor cooler according to the present invention, which is shown in FIG. 12 according to the prior art and FIGS. FIG. 10 is a diagram corresponding to FIG. 8 and corresponding to another embodiment of claims 2 and 6; Further, FIG. 9B is a diagram showing the B-
It is B sectional drawing.

In FIGS. 9A and 9B, FIG.
The difference from (a) and (b) is the connection structure between the heat transport pipe and the cooling block, and the other is the same as FIG. That is, the two heat transport pipes 2G shown in FIG. 9 are made of the same product as the heat transport pipe 2G shown in FIG. 7 and are made of a copper material in a cylindrical shape. 3H.

The two cylindrical holes formed in the cooling block 3H are smaller in diameter than the insertion holes of the heat transport pipe formed in the cooling block 3F shown in FIG. And the copper rod 8A is inserted and the copper plate 8B is brazed from both sides in the same structure.

In the heat pipe type semiconductor cooler thus constructed, the cooling block 3A and the radiating fins 5
A can maintain the insulation withstand voltage characteristic by the creepage insulation of the heat transport pipe 2A, and by inserting the common cooling fin into the two heat transport pipes 2G as in the embodiment shown in FIG. ,
The cooling effect can be improved.

Therefore, not only can the safety at the time of maintenance and inspection be improved, but also, as shown in FIG. Can be maintained.

Further, since an insulating tube and a connecting conductor are not required, the configuration is simple, the size can be reduced, and the risk of air pollution due to leakage at the time of injection work can be eliminated.

FIG. 10 shows a heat pipe type semiconductor cooler according to a tenth embodiment of the present invention.
8 (a) and 9 (a) shown in the above-described embodiment.
2 shows the shape of the heat sink when a common heat sink is inserted into two heat transport tubes.

In FIG. 10, the 2 shown in FIG. 8 and FIG.
Between the heat transport pipes on the left and right sides of the heat radiating plate 5B inserted into the heat transport pipes 2F and 2G, a wavy portion 5a consisting of peaks and valleys is formed in parallel with the cooling air flowing in a direction perpendicular to the plane of the paper. .

In the heat pipe type semiconductor cooler in which the common radiator plate is formed as described above, the area of the radiator plate in contact with the cooling air can be increased, so that the cooling effect can be further improved and the size can be reduced. Can be achieved.

FIG. 11 is a view showing an eleventh embodiment of a heat pipe type semiconductor cooler according to the present invention, and particularly corresponds to claim 9 in which the heat transport pipe is made of a ceramic material. In FIG. 11, a copper pipe 9 is brazed to a tip of a heat transport pipe 2K fixed to a cooling block (not shown), and a heat transport pipe 2J and a copper pipe 9 are attached to the tip of the copper pipe 9. Heat transport pipe 2
H is continuously brazed.

In the heat pipe type semiconductor cooler configured as described above, for example, even when the heat transport pipe and the cooling plate protrude and are attached to the open portion of the box under the floor of the railway vehicle, the vibration is accompanied by the vibration of the vehicle. The fatigue caused by the vibration of the heat transport tube can be reduced by the bending of the copper tube.

[0076]

As described above, according to the invention corresponding to claim 1, one side of the heat transport pipe for transporting the refrigerant vaporized by the heat generated by the semiconductor elements is fixed to the cooling block provided with the plurality of semiconductor elements, In a heat pipe type semiconductor cooling device in which a heat sink is inserted on the other side of the heat transport pipe, the cooling block is made of a metal material, the heat transport pipe is made of a ceramic material, and the refrigerant is made of pure water. Heat pipe-type semiconductor cooling that enables the common use of a heat sink for semiconductor elements with a potential different from that of insulation, and eliminates the risk of air pollutants being radiated, miniaturizing the outer shape and preventing environmental destruction. You can get a bowl.

According to the invention corresponding to claim 2,
A heat pipe type semiconductor in which one side of a heat transport pipe for transporting a refrigerant vaporized by heat generation of a semiconductor element is fixed to a cooling block provided with a plurality of semiconductor elements, and a radiator plate is inserted on the other side of the heat transport pipe. In the cooling device, the cooling block is made of a ceramic material, the heat transport pipe is made of a metal material, and the cooling water is made of pure water. Further, since the danger of air pollutant emission is eliminated, a heat pipe type semiconductor cooler capable of miniaturizing the outer shape and preventing environmental destruction can be obtained.

According to a third aspect of the present invention, one side of the heat transport pipe is inserted into the cooling block and pure water is injected into the heat transport pipe. One end of the heat transport pipe is joined to the open end of the pure water storage hole formed in the cooling block, and the cooling fin can be insulated from the charged part and the heat sink of the semiconductor element at a different potential can be shared, Since the danger of emission of air pollutants has been eliminated,
It is possible to obtain a heat pipe type semiconductor cooler capable of miniaturizing the external shape and preventing environmental destruction.

According to a fifth aspect of the present invention, there is provided a heat pipe type semiconductor cooler according to the sixth aspect of the present invention, wherein a conductive film is formed on an additional surface of the cooling block to which the semiconductor element is attached. A conductor is provided between the attached surfaces of the semiconductor elements on both sides of the cooling block to allow the cooling fins to be insulated from the charged portion and to share a heat sink for the semiconductor element having a different potential from the air. Since the danger of emission of pollutants has been eliminated, a heat pipe type semiconductor cooler capable of miniaturizing the outer shape and preventing environmental destruction can be obtained.

In particular, according to the invention according to claim 7, the pure water storage holes are formed on both sides of the conductor, and according to the invention according to claim 8, the cooling block and the cooling block are inserted into the cooling block. A low-melting metal material is injected between the heat transfer pipe and the outer periphery of the heat transfer pipe to allow the cooling fins to be insulated from the charged part and to share a heat sink for the semiconductor element having a different potential from the air. Since the risk of emission of pollutants has been eliminated,
It is possible to obtain a heat pipe type semiconductor cooler capable of miniaturizing the external shape and preventing environmental destruction.

According to the ninth aspect of the present invention, the heat transport pipe made of a ceramic material is divided into a plurality of sections and connected by a copper pipe or an aluminum pipe to reduce the fatigue of the heat transport pipe due to vibration. It is possible to obtain a heat pipe type semiconductor cooler which can be miniaturized, can prevent environmental destruction, and can withstand vibration for a long time.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a first embodiment of a heat pipe type semiconductor cooler according to the present invention.

FIG. 2 is a sectional view showing a heat pipe type semiconductor cooler according to a second embodiment of the present invention.

FIG. 3 is a sectional view showing a heat pipe type semiconductor cooler according to a third embodiment of the present invention.

FIG. 4 is a sectional view showing a heat pipe type semiconductor cooler according to a fourth embodiment of the present invention.

FIG. 5 is a sectional view showing a heat pipe type semiconductor cooler according to a fifth embodiment of the present invention.

FIG. 6 is a sectional view showing a heat pipe type semiconductor cooler according to a sixth embodiment of the present invention.

FIG. 7 is a sectional view showing a heat pipe type semiconductor cooler according to a seventh embodiment of the present invention.

FIG. 8 is a sectional view showing an eighth embodiment of the heat pipe type semiconductor cooler of the present invention, wherein (a) is a partial plan view and (b)
3A is a sectional view taken along line AA of FIG.

FIG. 9 is a sectional view showing a ninth embodiment of the heat pipe type semiconductor cooler of the present invention, where (a) is a partial plan view and (b)
3A is a cross-sectional view taken along line BB of FIG.

FIG. 10 shows a tenth embodiment of the heat pipe type semiconductor cooler of the present invention.
The partial side view which shows embodiment of FIG.

FIG. 11 shows the eleventh embodiment of the heat pipe type semiconductor cooler of the present invention.
FIG. 2 is a partial cross-sectional view showing the embodiment.

FIG. 12 is a sectional view showing an example of a conventional heat pipe type semiconductor cooler.

FIG. 13 is a diagram showing an example of a conventional heat pipe type semiconductor cooler different from FIG.

FIG. 14 is a sectional view showing an example of a conventional heat pipe type semiconductor cooler different from FIGS. 12 and 13;

[Explanation of symbols]

1: semiconductor element, 2A, 2B, 2C, 2D, 2E, 2
F, 2G, 2H, 2J, 2K ... heat transport pipes, 3A, 3B,
3C, 3D, 3E, 3F, 3G, 3H ... cooling block,
4: Refrigerant, 5A, 5B: Heat sink, 6: Solder, 7: Welding film, 8A: Copper rod, 8B: Copper plate.

Claims (9)

[Claims] 1. A heat transfer pipe for transporting a refrigerant vaporized by the heat generated by the semiconductor element is fixed to a cooling block provided with a plurality of semiconductor elements, and a radiator plate is inserted into the other side of the heat transport pipe. In the heat pipe type semiconductor cooling device, the cooling block is made of a metal material, the heat transport pipe is made of a ceramic material, and the refrigerant is made of pure water. 2. One side of a heat transport pipe for transporting a refrigerant vaporized by the heat generated by the semiconductor element is fixed to a cooling block provided with a plurality of semiconductor elements, and a radiator plate is inserted into the other side of the heat transport pipe. In the heat pipe type semiconductor cooling device according to the present invention, the cooling block is made of a ceramic material, the heat transport pipe is made of a metal material, and the refrigerant is made of pure water. 3. The heat pipe type semiconductor cooling device according to claim 1, wherein one side of the heat transport pipe is inserted into the cooling block, and the pure water is injected into the heat transport pipe. vessel. 4. The heat pipe type semiconductor cooler according to claim 1, wherein one end of the heat transport pipe is joined to an open end of a pure water storage hole formed in the cooling block. . 5. The heat pipe type semiconductor cooler according to claim 2, wherein a conductive film is formed on a surface of the cooling block provided with the semiconductor element. 6. The heat pipe type semiconductor cooler according to claim 2, wherein a conductor is provided between the attached surfaces of the semiconductor elements on both sides of the cooling block. 7. The heat pipe type semiconductor cooler according to claim 6, wherein storage holes of said pure water are formed on both sides of said conductor. 8. The heat pipe type according to claim 3, wherein a low melting point metal material is injected between the cooling block and the outer periphery of the heat transport pipe inserted into the cooling block. Semiconductor cooler. 9. The heat pipe type semiconductor cooler according to claim 1, wherein said ceramic material heat transport pipe is divided into a plurality of parts and connected by a copper pipe or an aluminum pipe.