JPH11104542A - Coating application system of coating material to substrate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to facilitate washing of substrate supporters, to reduce the line space over the entire part and to decrease the amt. of the washing liquid to be used. SOLUTION: A coating application line 21 and a drying line 22 are separated. A printed circuit board 28 is supported on the substrate supporter 25 transported by a transporting device 23 of the coating application line 21 and a liquid photoresist agent 38 is applied on printed circuit board 28 in a coating application booth 31. The printed circuit board 28 is thereafter removed from the substrate supporter 25 in an unloading section 34 and is transferred to a transporting device 24 on the drying line 22 side and is dried in a drying booth 35. On the other hand, the substrate supporter 25 on the coating application line 21 side from which the printed circuit board 28 is removed is washed in a washing booth 32 on the coating application line 21 side. At this time, the photoresist agent 38 adhered to the substrate supporter 25 is before curing and is, therefore, liable to fall. The easy washing is thus made possible.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a system for applying a coating material to a substrate, wherein the coating material is applied to the substrate while the substrate is supported by a substrate support, and then the substrate is dried. .

[0002]

For example, when a liquid photoresist agent is applied to a printed circuit board in order to form a solder resist layer on the printed circuit board, a conventional method is shown in FIG.
The system is as shown in the figure.

That is, a coating booth 1 and a drying booth 2
And the washing booth 3 are connected by one transfer device 4. A large number of substrate supports 6 (hangers) for supporting the printed circuit board 5 in a suspended state are attached to the chain 4a of the transport device 4 so that the substrate supports 6 are transported in the direction of the arrow. Has become.

[0004] First, in the loading section 7, the printed board 5 is supported by the board support 6, and the printed board 5 is sent to the coating booth 1 in this state. In the application booth 1, a photoresist agent 9 for solder resist is applied to the printed board 5 by a spray gun 8.
Thereafter, the printed circuit board 5 is sent to the drying booth 2 and is dried while being supported by the substrate support 6. After the drying, the printed board 5 is moved to the substrate support 6 in the unloading section 10.
, And the printed circuit board 5 is sent to the exposure device side, where exposure, development, final printing, and the like are performed.

On the other hand, the substrate support 6 from which the printed circuit board 5 has been removed is sent to the cleaning booth 3 where it is cleaned. The cleaning here is performed, for example, by placing the substrate support 6 in a cleaning liquid such as a developing solution, or by spraying the cleaning liquid on the substrate support 6. The washed substrate support 6 is sent to the loading section 7 again, and a new printed circuit board 5 is supported on the substrate support 6.

[0006] However, the above-mentioned conventional system has the following problems. That is, the substrate support 6
Is washed in the washing booth 3 after the substrate support 6 has passed through the drying booth 2 and after the photoresist agent 9 attached to the substrate support 6 has been cured.
The photoresist agent 9 hardly falls off, and it takes much time for cleaning. For this reason, it is necessary to secure a large overall line space, and a large amount of cleaning liquid is required.

The present invention has been made in view of the above circumstances, and an object of the present invention is to facilitate the cleaning of a substrate support, to reduce the entire line space, and to reduce the amount of a cleaning liquid used. It is an object of the present invention to provide a system for applying a coating agent to a substrate.

[0008]

In order to achieve the above object, a system for applying a coating agent to a substrate according to the present invention is provided with a coating line and a drying line separated from each other. While applying the coating agent to the substrate in a state where the substrate is supported by the substrate support being conveyed, the substrate on which the coating agent is applied is removed from the substrate support and transferred to the drying line, while the substrate is removed. The substrate support is cleaned on the coating line side.

According to the above-mentioned means, after the coating agent is applied to the substrate, the substrate is removed from the substrate support and moved to a drying line and dried. Is not transferred and is washed on the application line side. Therefore, since the substrate support is cleaned without passing through the drying line, the coating agent adhered to the substrate support is easy to be dropped since it has not been cured, and can be easily cleaned.

[0010]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS Hereinafter, an embodiment in which the present invention is applied to a case where a liquid photoresist agent is applied to a printed circuit board in order to form a solder resist layer on the printed circuit board will be described with reference to FIGS. It will be described with reference to FIG. First, in FIG. 1, in the coating system of the present invention, a coating line 2
1 and a drying line 22 are separated from each other, and transporting devices 23 and 24 are provided respectively. Each transfer device 23,
Reference numeral 24 denotes a configuration in which an annular chain 23a, 24a is moved in directions indicated by arrows A, B, respectively, using a motor (not shown) as a drive source.

The chain 23a on the coating line 21 side includes
A plurality of substrate supports 25 called hangers as shown in FIG. 2 are attached, and these substrate supports 25 are transported in the direction indicated by arrow A via the chain 23a. The substrate support 25 has a configuration in which two clippers 27 such as clothespins are attached to the lower portion of the main body 26, and the upper end of the main body 26 is attached to the chain 23a. . This substrate support 25
Is configured to support the printed board 28 in a suspended state by sandwiching an upper side portion of the printed board 28 as a board by two clipping members 27. Drying line 2
The substrate support 29 having the same configuration as the substrate support 25 is also attached to the second chain 24a side.

The coating line 21 is provided with a coating booth 31 and a washing booth 32 in the arrangement shown in FIG. The left side of the coating booth 31 in FIG.
The right side between the coating booth 31 and the washing booth 32 is an unloading section 34. A drying booth 35 is provided in the drying line 22.
The middle left is the receiving part 36 and the right is the unloading part 37.

A spray gun 39 for spraying a liquid photoresist agent 38 as a coating agent in a mist state is disposed in the coating booth 31, and a spray gun for spraying a cleaning liquid 40 such as a thinner in the cleaning booth 32. 41 are provided. Hot air of about 80 ° C. is supplied to the drying booth 35.

In the above configuration, when the photoresist agent 38 as the coating agent is applied to the printed circuit board 28 as the substrate, the following is performed. First, in the loading section 33 of the coating line 21, the printed board 28 is supported by the board support 25 in a suspended state, and the printed board 28 is sent to the coating booth 31 in this state. In this application booth 31, a photoresist agent 38 is applied to both front and back surfaces of the printed circuit board 28 by a spray gun 39.

The printed circuit board 30 to which the photoresist agent 38 has been applied is sent to the unloading section 34, where it is removed from the substrate support 27. It is transferred to the substrate support 29. Printed circuit board 28 supported by substrate support 29
Is sent to the drying booth 35 and dried by hot air while being supported by the substrate support 29. After this drying, the printed circuit board 28 is moved to the substrate support 29
After being removed from the device, it is sent to the exposure device side where exposure, development, main printing, and the like are performed.

On the other hand, in the coating line 21, the substrate support 25 from which the printed circuit board 28 has been removed
, Where it is washed. The cleaning here is performed by spraying a cleaning liquid 40 on the substrate support 25 with a spray gun 41. Washed substrate support 2
5 is dried by blowing air at the outlet side of the washing booth 32, and then is sent again to the loading section 33, where a new printed board 28 is attached to the board support 25.
Will be supported.

According to the above-described embodiment, the following effects can be obtained. That is, after applying the photoresist agent 38 to the printed board 28, the printed board 2
8 is removed from the substrate support 25 on the application line 21 side and transferred to the drying line 22 for drying.
The substrate support 25 from which is removed is not transferred to the drying line 22 but is washed on the application line 21 side. Therefore, since the substrate support 25 on the application line 21 side is washed without passing through the drying line 22, the photoresist agent 38 adhered to the substrate support 25 is easy to fall off since it has not been cured, and is easy to clean. Can be washed. Along with this, the time required for cleaning the substrate support 25 can be reduced, and the overall line space can be reduced, and the amount of the cleaning liquid 40 used can be reduced.

The present invention is not limited to the embodiment described above, but can be modified or expanded as follows. The means for cleaning the substrate support 25 may be configured such that the cleaning is performed by rotating the brush while spraying the cleaning liquid 40.
May be placed in a tank in which the cleaning liquid 40 is stored for cleaning.

The substrate is not limited to the printed circuit board 28, but may be a switch device panel or the like as long as it has a rectangular shape. The coating agent may be a paint such as paint.

[0020]

As is apparent from the above description, according to the present invention, since the substrate support of the application line is cleaned without passing through the drying line, the substrate adheres to the substrate support. Since the coating agent has not yet been cured, it easily falls off and can be easily washed. Along with this, the time required for cleaning the substrate support can be reduced, and as a result, the entire line space can be reduced, and
It is also possible to reduce the amount of the cleaning liquid used.

[Brief description of the drawings]

FIG. 1 is a simplified plan view showing a system according to an embodiment of the present invention.

FIG. 2 is a perspective view of a state in which a printed board is supported by a board support.

FIG. 3 is a diagram corresponding to FIG. 1 showing a conventional example.

[Explanation of symbols]

21 is a coating line, 22 is a drying line, 23 and 24 are transfer devices, 25 and 29 are substrate supports, 28 is a printed circuit board (substrate), 31 is a coating booth, 32 is a washing booth, 35
Is a drying booth, 38 is a photoresist agent (coating agent), 4
0 indicates a cleaning solution.

Claims (1)

[Claims] 1. A coating line and a drying line are separately provided, and an application agent is applied to a substrate while the substrate is supported by a substrate support conveyed by a conveyance device of the application line. The coated substrate is removed from the substrate support and transferred to the drying line, while the substrate support from which the substrate is removed is washed on the coating line side. Coating system.