JPH11103157A - Printed wiring board - Google Patents
Printed wiring boardInfo
- Publication number
- JPH11103157A JPH11103157A JP27964497A JP27964497A JPH11103157A JP H11103157 A JPH11103157 A JP H11103157A JP 27964497 A JP27964497 A JP 27964497A JP 27964497 A JP27964497 A JP 27964497A JP H11103157 A JPH11103157 A JP H11103157A
- Authority
- JP
- Japan
- Prior art keywords
- ball
- bonding
- layer
- wiring board
- printed wiring
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01078—Platinum [Pt]
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【技術分野】本発明は，接合用ボールを有するプリント
配線板に関する。TECHNICAL FIELD The present invention relates to a printed wiring board having bonding balls.
【０００２】[0002]
【従来技術】従来，プリント配線板の導電部材間を電気
的に接続するための接合用部材として，ボール状の半田
ボールが用いられている。半田ボールは，主に半田（Ｐ
ｂ−Ｓｎ）からなる接合用ボールである。半田ボール
は，例えば，プリント配線板に設けた，パッド，スルー
ホールのランド等の接合部に接合して用いられる。パッ
ドに接合された半田ボールは，相手部材に対して接合さ
れる。そして，半田ボールは，パッドと相手部材との間
の電気的導通を行う。2. Description of the Related Art Conventionally, ball-shaped solder balls have been used as joining members for electrically connecting conductive members of a printed wiring board. Solder balls mainly consist of solder (P
b-Sn). The solder balls are used, for example, by bonding to bonding portions such as pads and lands of through holes provided on a printed wiring board. The solder ball joined to the pad is joined to a mating member. The solder balls provide electrical continuity between the pad and the mating member.
【０００３】[0003]
【解決しようとする課題】しかしながら，上記従来の半
田ボールは，接合部や相手部材との接合強度が不十分で
ある。そこで，本発明はかかる従来の問題点に鑑み，接
合用ボールと導体パターンとの間の接合強度に優れたプ
リント配線板を提供しようとするものである。However, the above-mentioned conventional solder balls have insufficient bonding strength with a bonding portion or a mating member. The present invention has been made in view of the above-mentioned conventional problems, and an object of the present invention is to provide a printed wiring board having excellent bonding strength between a bonding ball and a conductive pattern.
【０００４】[0004]
【課題の解決手段】本発明は，請求項１に記載のよう
に，導体パターンの表面に接合用ボールを接合してなる
プリント配線板において，上記接合用ボールは，銅球
と，該銅球を被覆する白金層とからなり，該接合用ボー
ルは，上記導体パターンに被覆した半田層の表面に接合
されていることを特徴とするプリント配線板である。According to a first aspect of the present invention, there is provided a printed wiring board having a bonding ball bonded to a surface of a conductive pattern, wherein the bonding ball includes a copper ball and the copper ball. Wherein the bonding balls are bonded to the surface of the solder layer coated on the conductor pattern.
【０００５】本発明において，接合用ボールは，銅球
と，該銅球を被覆する白金層とからなる２層構造を有す
る。この接合用ボールを，導体パターンを被覆する半田
層の表面に配置しこの状態で加熱すると，接合用ボール
は導体パターンに対して，優れた接合強度で接合する。In the present invention, the bonding ball has a two-layer structure including a copper ball and a platinum layer covering the copper ball. When the bonding balls are arranged on the surface of the solder layer covering the conductive pattern and heated in this state, the bonding balls are bonded to the conductive pattern with excellent bonding strength.
【０００６】その理由は定かでないが，以下のように推
定される。即ち，銅層及び白金層の成分が，導体パター
ン表面の半田層へと拡散する。そのため，接合用ボール
の表面付近は，半田（Ｐｂ−Ｓｎ）と，銅（Ｃｕ）と，
白金（Ｐｔ）とからなる合金層が形成され，該合金層の
形成によって接合部への接合強度が向上すると考えられ
る。The reason is not clear, but is presumed as follows. That is, the components of the copper layer and the platinum layer diffuse into the solder layer on the surface of the conductor pattern. Therefore, solder (Pb—Sn), copper (Cu),
An alloy layer made of platinum (Pt) is formed, and it is considered that the formation of the alloy layer improves the bonding strength to the bonding portion.
【０００７】請求項２に記載のように，上記銅球の直径
は，１００〜８００μｍであることが好ましい。これに
より，優れた接合強度を発揮することができる。一方，
１００μｍ未満の場合又は８００μｍを超える場合に
は，接合用ボールの接合強度が低下するおそれがある。[0007] As described in claim 2, the diameter of the copper sphere is preferably 100 to 800 µm. Thereby, excellent bonding strength can be exhibited. on the other hand,
If it is less than 100 μm or more than 800 μm, the joining strength of the joining ball may be reduced.
【０００８】請求項３に記載のように，上記白金層の厚
みは，０．０５〜１０μｍであることが好ましい。０．
０５μｍ未満の場合又は１０μｍを超える場合には，接
合用ボールの接合強度が低下するおそれがある。According to a third aspect of the present invention, the thickness of the platinum layer is preferably 0.05 to 10 μm. 0.
If it is less than 05 μm or more than 10 μm, the joining strength of the joining ball may decrease.
【０００９】請求項４に記載のように，上記半田層の厚
みは，０μｍを超え１５０μｍ以下であることが好まし
い。これにより，優れた接合強度を発揮することができ
る。一方，０μｍの場合又は１５０μｍを超える場合に
は，接合用ボールの接合強度が低下するおそれがある。Preferably, the thickness of the solder layer is more than 0 μm and 150 μm or less. Thereby, excellent bonding strength can be exhibited. On the other hand, if it is 0 μm or exceeds 150 μm, the bonding strength of the bonding ball may be reduced.
【００１０】本発明において，導体パターンは，その形
状を問わない。導体パターンにおける接合用ボールを接
合する接合部は，接合用ボールを接合しやすい幅広い形
状であることが好ましい。In the present invention, the shape of the conductor pattern is not limited. It is preferable that the joining portion of the conductor pattern for joining the joining balls has a wide shape that facilitates joining of the joining balls.
【００１１】[0011]
実施形態例 本発明の実施形態例に係るプリント配線板について，図
１〜図３を用いて説明する。本例のプリント配線板５
は，図１に示すごとく，導体パターン６の表面に接合用
ボール１を接合している。接合用ボール１は，銅球２
と，銅球２を被覆する白金層３とからなる。接合用ボー
ル１は，導体パターン６に被覆した半田層４の表面に接
合されている。Embodiment A printed wiring board according to an embodiment of the present invention will be described with reference to FIGS. Printed wiring board 5 of this example
Has a bonding ball 1 bonded to the surface of a conductor pattern 6 as shown in FIG. The bonding ball 1 is a copper ball 2
And a platinum layer 3 covering the copper ball 2. The bonding ball 1 is bonded to the surface of the solder layer 4 covering the conductor pattern 6.
【００１２】銅球２の直径は，１００〜８００μｍであ
る。白金層３の厚みは，０．０５〜１０μｍである。接
合用ボール１を製造するにあたっては，めっき法，浸漬
法により銅球２の表面に白金層３を形成する。白金層３
の厚みは，めっき法においてはめっき電流，濃度等によ
り調整し，浸漬法においては溶液濃度等により調整す
る。The diameter of the copper ball 2 is 100 to 800 μm. The thickness of the platinum layer 3 is 0.05 to 10 μm. In manufacturing the bonding ball 1, a platinum layer 3 is formed on the surface of the copper ball 2 by a plating method and an immersion method. Platinum layer 3
The thickness of is adjusted by plating current, concentration and the like in the plating method, and is adjusted by solution concentration and the like in the immersion method.
【００１３】導体パターン６は，銅パターン層６１と，
ニッケルめっき層６２と，金めっき層６３とからなる積
層構造を有し，その接合部６０における最表面には半田
層４が被覆されている。半田層４は，例えば，半田浴デ
ィップ法，めっき法，半田ペースト印刷法等により形成
される。導体パターン６における接合用ボール１を接合
するための接合部６０は，接合用ボール１を接合しやす
い円形である。半田層４の厚みは，０μｍを超え１５０
μｍ以下である。The conductor pattern 6 includes a copper pattern layer 61,
It has a laminated structure composed of a nickel plating layer 62 and a gold plating layer 63, and the outermost surface of the joint 60 is covered with the solder layer 4. The solder layer 4 is formed by, for example, a solder bath dipping method, a plating method, a solder paste printing method, or the like. The joining portion 60 for joining the joining ball 1 in the conductor pattern 6 has a circular shape that allows the joining ball 1 to be easily joined. The thickness of the solder layer 4 exceeds 0 μm and exceeds 150 μm.
μm or less.
【００１４】導体パターン６の表面には，接合用ボール
１を配置し加熱することにより，接合用ボール１が接合
されている。また，図２に示すごとく，接合用ボール１
の頭部には，マザーボード７のパッド７１が接合され
る。パッド７１の積層構造及び接合方法は，上記導体パ
ターン６と同様である。The bonding balls 1 are bonded to the surface of the conductor pattern 6 by disposing and heating the bonding balls 1. In addition, as shown in FIG.
Is joined to the pad 71 of the motherboard 7. The laminated structure and bonding method of the pad 71 are the same as those of the above-described conductor pattern 6.
【００１５】プリント配線板５は，上記導体パターン６
のほかに，該導体パターン６を表面に設けた，ガラスエ
ポキシ基板等の絶縁基板５１と，絶縁基板５１のほぼ全
面を被覆するソルダーレジスト５２とを有している。導
体パターン６における上記接合用ボール１を接合するた
めの接合部６０は，ソルダーレジスト５２から露出して
いる。The printed wiring board 5 is provided with the conductor pattern 6
In addition, there are provided an insulating substrate 51 such as a glass epoxy substrate provided with the conductor pattern 6 on the surface, and a solder resist 52 covering almost the entire surface of the insulating substrate 51. A joint portion 60 for joining the joining ball 1 in the conductor pattern 6 is exposed from the solder resist 52.
【００１６】また，マザーボード７は，プリント配線板
５と同様に，銅パターン層７１１と，ニッケルめっき層
７１２と，金めっき層７１３とからなるパッド７１と，
絶縁基板７３と，ソルダーレジスト７２とを有してい
る。接合用ボール１を接合する部分におけるパッド７１
の最表面には半田層４が被覆されている。Similarly to the printed wiring board 5, the motherboard 7 includes a pad 71 composed of a copper pattern layer 711, a nickel plating layer 712, and a gold plating layer 713,
It has an insulating substrate 73 and a solder resist 72. Pad 71 at a portion where bonding ball 1 is bonded
Is covered with a solder layer 4.
【００１７】次に，本例の作用及び効果について説明す
る。本例において，接合用ボール１は，銅球２と，銅球
２を被覆する白金層３とからなる２層構造を有する。こ
の接合用ボール１を，導体パターン６を被覆する半田層
４の表面に載置しこの状態で加熱すると，接合用ボール
１は導体パターン６に対して，優れた接合強度で接合す
る。また，接合用ボール１は，マザーボード７のパッド
７１に対しても優れた接合強度で接合する。また，接合
用ボール１は，マザーボード７のパッド７１に対しても
優れた接合強度で接合する。Next, the operation and effect of this embodiment will be described. In this example, the bonding ball 1 has a two-layer structure including a copper ball 2 and a platinum layer 3 covering the copper ball 2. When the bonding ball 1 is placed on the surface of the solder layer 4 covering the conductor pattern 6 and heated in this state, the bonding ball 1 is bonded to the conductor pattern 6 with excellent bonding strength. The bonding ball 1 is also bonded to the pad 71 of the motherboard 7 with excellent bonding strength. The bonding ball 1 is also bonded to the pad 71 of the motherboard 7 with excellent bonding strength.
【００１８】その理由は定かでないが，以下のように推
定される。即ち，図３に示すごとく，銅球２及び白金層
３の２層構造を有する接合用ボール１（図３（Ａ））を
加熱すると，銅層２及び白金層３の成分が，導体パター
ン６の表面の半田層４へと拡散する（図３（Ｂ））。そ
のため，接合用ボール１の表面付近に，半田（Ｐｂ−Ｓ
ｎ）と，銅（Ｃｕ）と，白金（Ｐｔ）とからなる合金層
４５が形成され，合金層４５の形成によって，導体パタ
ーン６への接合強度が向上すると考えられる。The reason is not clear, but is presumed as follows. That is, as shown in FIG. 3, when the bonding ball 1 (FIG. 3A) having a two-layer structure of the copper ball 2 and the platinum layer 3 is heated, the components of the copper layer 2 and the platinum layer 3 are changed to the conductor pattern 6. (FIG. 3 (B)). For this reason, the solder (Pb-S
n), copper (Cu), and platinum (Pt) are formed, and it is considered that the formation of the alloy layer 45 improves the bonding strength to the conductor pattern 6.
【００１９】なお，本例においては，銅球２の全表面が
白金層３により被覆されている例を示したが，半田層４
と接触する部分が少なくとも白金層３により被覆されて
いてもよい。In this embodiment, an example is shown in which the entire surface of the copper ball 2 is covered with the platinum layer 3, but the solder layer 4
May be covered by at least the platinum layer 3.
【００２０】[0020]
【発明の効果】本発明によれば，接合用ボールと導体パ
ターンとの間の接合強度に優れたプリント配線板を提供
することができる。According to the present invention, it is possible to provide a printed wiring board having excellent bonding strength between a bonding ball and a conductive pattern.
【図１】実施形態例における，接合用ボールの断面図。FIG. 1 is a cross-sectional view of a bonding ball in an embodiment.
【図２】実施形態例における，接合用ボールを用いて，
プリント配線板をマザーボードに搭載する方法を示す説
明図。FIG. 2 shows an example of the embodiment using a bonding ball.
FIG. 4 is an explanatory view showing a method of mounting a printed wiring board on a motherboard.
【図３】実施形態例における，作用及び効果を示す説明
図。FIG. 3 is an explanatory diagram showing an operation and an effect in the embodiment.
１．．．接合用ボール， ２．．．銅球， ３．．．白金層， ４．．．半田層， ４５．．．合金層， ５．．．プリント配線板， ６．．．導体パターン， ６０．．．接合部， ７．．．マザーボード， ７１．．．パッド， 1. . . Joining ball, 2. . . Copper ball, 3. . . 3. platinum layer; . . Solder layer, 45. . . Alloy layer, 5. . . Printed wiring board, 6. . . Conductor pattern, 60. . . 6. joints; . . Motherboard, 71. . . pad,
Claims (4)
合してなるプリント配線板において，上記接合用ボール
は，銅球と，該銅球を被覆する白金層とからなり，該接
合用ボールは，上記導体パターンに被覆した半田層の表
面に接合されていることを特徴とするプリント配線板。1. A printed wiring board having a bonding ball bonded to the surface of a conductive pattern, wherein the bonding ball comprises a copper ball and a platinum layer covering the copper ball. A printed wiring board joined to a surface of a solder layer covering the conductor pattern.
１００〜８００μｍであることを特徴とするプリント配
線板。2. The method of claim 1, wherein the diameter of the copper ball is
A printed wiring board having a thickness of 100 to 800 μm.
厚みは，０．０５〜１０μｍであることを特徴とするプ
リント配線板。3. The printed wiring board according to claim 1, wherein the thickness of the platinum layer is 0.05 to 10 μm.
上記半田層の厚みは，０μｍを超え１５０μｍ以下であ
ることを特徴とするプリント配線板。4. The method according to claim 1, wherein:
A printed wiring board, wherein the thickness of the solder layer is more than 0 μm and 150 μm or less.
Priority Applications (6)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27964497A JP3341648B2 (en) | 1997-09-26 | 1997-09-26 | Printed wiring board |
| EP98923088A EP1009202B1 (en) | 1997-06-04 | 1998-06-02 | Soldering member for printed wiring boards |
| PCT/JP1998/002437 WO1998056217A1 (en) | 1997-06-04 | 1998-06-02 | Soldering member for printed wiring boards |
| KR10-1999-7011446A KR100376253B1 (en) | 1997-06-04 | 1998-06-02 | Solder member for printed wiring board |
| DE69838586T DE69838586T2 (en) | 1997-06-04 | 1998-06-02 | SOLDERING ELEMENT FOR PRINTED PCB |
| US09/424,582 US6358630B1 (en) | 1997-06-04 | 1998-06-02 | Soldering member for printed wiring boards |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27964497A JP3341648B2 (en) | 1997-09-26 | 1997-09-26 | Printed wiring board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11103157A true JPH11103157A (en) | 1999-04-13 |
| JP3341648B2 JP3341648B2 (en) | 2002-11-05 |
Family
ID=17613863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP27964497A Expired - Fee Related JP3341648B2 (en) | 1997-06-04 | 1997-09-26 | Printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3341648B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002056654A1 (en) * | 2001-01-15 | 2002-07-18 | Innochips Technology | Terminal for chip and fabricating method thereof |
| JP2007287712A (en) * | 2006-04-12 | 2007-11-01 | Oki Electric Ind Co Ltd | Semiconductor device, packaging structure thereof, and manufacturing method of semiconductor device and packaging structure |
-
1997
- 1997-09-26 JP JP27964497A patent/JP3341648B2/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2002056654A1 (en) * | 2001-01-15 | 2002-07-18 | Innochips Technology | Terminal for chip and fabricating method thereof |
| JP2007287712A (en) * | 2006-04-12 | 2007-11-01 | Oki Electric Ind Co Ltd | Semiconductor device, packaging structure thereof, and manufacturing method of semiconductor device and packaging structure |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3341648B2 (en) | 2002-11-05 |
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