JPH1098258A - Solder paste filling device - Google Patents
Solder paste filling deviceInfo
- Publication number
- JPH1098258A JPH1098258A JP8252834A JP25283496A JPH1098258A JP H1098258 A JPH1098258 A JP H1098258A JP 8252834 A JP8252834 A JP 8252834A JP 25283496 A JP25283496 A JP 25283496A JP H1098258 A JPH1098258 A JP H1098258A
- Authority
- JP
- Japan
- Prior art keywords
- hole
- solder paste
- filling
- electronic component
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3457—Solder materials or compositions; Methods of application thereof
- H05K3/3485—Applying solder paste, slurry or powder
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、プリント配線板に
形成されたスルーホール内壁に、はんだペーストをリン
グ状に充填する充填装置に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a filling device for filling a solder paste in a ring shape into an inner wall of a through hole formed in a printed wiring board.
【０００２】[0002]
【従来の技術】プリント配線板のスルーホール部へはん
だペーストをスクリーン印刷し、はんだペーストが充填
された該スルーホールへ電子部品を挿入し、リフローは
んだ付けする従来技術の一例を図４を用いて説明する。
図４は従来のプリント配線板への電子部品挿入例を示す
図で、（ａ）はんだペースト充填部の断面図、（ｂ）電
子部品挿入状態の断面図である。2. Description of the Related Art FIG. 4 shows an example of a conventional technique in which a solder paste is screen-printed in a through-hole portion of a printed wiring board, an electronic component is inserted into the through-hole filled with the solder paste, and reflow soldering is performed. explain.
FIGS. 4A and 4B are diagrams showing an example of insertion of an electronic component into a conventional printed wiring board, wherein FIG. 4A is a cross-sectional view of a solder paste filled portion, and FIG.
【０００３】６０はプリント配線板で、表面に電子回路
パターン（図示省略）や電子部品（図示省略）等を挿入
するスルーホール６１等が形成されている。プリント配
線板６０に電子部品をリフローはんだ付けにより搭載す
るには、先ず、プリント配線板６０にスクリーン印刷を
行い、スルーホール６１にはんだペースト７０を充填す
る。次に、はんだペースト７０が充填されたスルーホー
ル６１に電子部品のリード線８０を挿入する。そして、
炉内で温度を上げはんだペースト７０を溶融して、スル
ーホール６１とリード線８０とをはんだ付けする。Reference numeral 60 denotes a printed wiring board, on the surface of which are formed through holes 61 for inserting electronic circuit patterns (not shown), electronic components (not shown), and the like. To mount an electronic component on the printed wiring board 60 by reflow soldering, first, screen printing is performed on the printed wiring board 60, and the through-hole 61 is filled with the solder paste 70. Next, the lead wire 80 of the electronic component is inserted into the through hole 61 filled with the solder paste 70. And
The temperature is raised in the furnace, the solder paste 70 is melted, and the through holes 61 and the lead wires 80 are soldered.
【０００４】[0004]
【発明が解決しようとする課題】しかし、上述の電子部
品のはんだ付けでは、プリント配線板６０のスルーホー
ル６１内全体にはんだペースト７０が充填されているの
で、電子部品を挿入する際に、リード線８０の先端部８
１ではんだペースト７０をスルーホール６１の外え押し
出しはんだ不足となり、電子部品のはんだ付け品質が悪
化するおそれがある。また、押し出されたはんだペース
ト７０が溶融し他の電子回路等に付着（ブリッジ）しシ
ョート等の不具合を発生させるおそれがある。その他
に、スルーホール６１がはんだペースト７０で充満して
いるので、電子部品を挿入する際に挿入孔が見にくく挿
入作業に手間がかかり作業効率が低下するおそれがあ
る。However, in the above-mentioned soldering of the electronic component, the solder paste 70 is filled in the entire through hole 61 of the printed wiring board 60. Tip 8 of line 80
In step (1), the solder paste 70 is pushed out of the through-hole 61 and the solder is insufficient, so that the soldering quality of the electronic component may be deteriorated. Further, the extruded solder paste 70 may be melted and adhered (bridged) to other electronic circuits and the like, causing a problem such as a short circuit. In addition, since the through-hole 61 is filled with the solder paste 70, the insertion hole is difficult to see when inserting an electronic component, the insertion work is troublesome, and the work efficiency may be reduced.
【０００５】そこで、本発明は上述の問題を解決するも
ので、電子部品の挿入作業性がよく、しかも挿入部品の
はんだ付け品質の向上が図れるスルーホールへのはんだ
ペーストの充填装置を提供することを目的とする。SUMMARY OF THE INVENTION Accordingly, the present invention is to solve the above-mentioned problem, and to provide an apparatus for filling a through-hole with a solder paste which can improve the workability of inserting an electronic component and improve the soldering quality of the inserted component. With the goal.
【０００６】[0006]
【課題を解決するための手段】本発明は上述の目的を達
成するもので、プリント配線板に形成されたスルーホー
ルにはんだペーストを充填し、該スルーホールに電子部
品のリード線を挿入後リフローはんだ付けする該基板の
はんだ付けにおいて、前記スルーホールを塞ぐ蓋部と該
蓋部より立設し該スルーホールに挿通する軸部が形成さ
れた段付ピンと、前記スルーホールに前記段付ピンの反
対側から前記はんだペーストを充填する充填機とからな
り、前記スルーホールの両面に前記蓋部と前記充填機の
ノズル先端部を密着させ、前記はんだペーストを充填す
るようにしたことを特徴とするものである。SUMMARY OF THE INVENTION The present invention has been accomplished to achieve the above-mentioned object. A through-hole formed in a printed wiring board is filled with a solder paste, and a lead wire of an electronic component is inserted into the through-hole and reflowed. In the soldering of the board to be soldered, a stepped pin formed with a lid for closing the through hole, a shaft standing upright from the lid and inserted into the through hole, and the stepped pin in the through hole. A filling machine for filling the solder paste from the opposite side, wherein the lid and the nozzle tip of the filling machine are brought into close contact with both surfaces of the through hole, and the solder paste is filled. Things.
【０００７】また、前記軸部に抜き勾配を設けたことを
特徴とするものである。また、前記軸部の立設基部に前
記スルーホールの内径よりやや小さめの直径を有する増
径部を設けたことを特徴とするものである。Further, the shaft portion is provided with a draft angle. Further, an increased diameter portion having a diameter slightly smaller than the inner diameter of the through hole is provided in a standing base portion of the shaft portion.
【０００８】[0008]
【実施例】本発明の第１実施例を図１および図２を用い
て説明する。図１は本発明の第１実施例のはんだペース
ト充填装置を示す断面図で、（ａ）段付ピン挿入状態、
（ｂ）はんだペースト充填状態である。図２は本発明の
第１実施例のプリント配線板への電子部品挿入状態を示
す図で、（ａ）はんだペースト充填部の断面図、（ｂ）
電子部品挿入状態の断面図である。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A first embodiment of the present invention will be described with reference to FIGS. FIG. 1 is a sectional view showing a solder paste filling apparatus according to a first embodiment of the present invention.
(B) Solder paste filling state. FIGS. 2A and 2B are views showing a state in which an electronic component is inserted into a printed wiring board according to the first embodiment of the present invention. FIG.
It is sectional drawing of the electronic component insertion state.
【０００９】１０は段付ピン（一部省略）で、大径ピン
部１１と小径ピン部１２の段付きとなっており、先端部
は円錐状に形成されている。大径ピン部１１の段部端面
１３は、スルーホール３１にはんだペースト４０を充填
する際にスルーホール３１の蓋の役目を果たすもので、
スルーホール３１の外径よりやや大きめとする。また、
小径ピン部１２は、スルーホール３１に挿入する電子部
品のリード線４５の線径と略同じ大きさに形成される。
段付ピン１０の材料にはステンレス鋼線等が用いられ
る。尚、段付ピン１０は駆動部（例えばエアーシリンダ
等、図示省略）に接続されており矢印２方向（Ａ、Ｂ）
へ移動するようになっている。Reference numeral 10 denotes a stepped pin (partially omitted), which has a stepped large-diameter pin portion 11 and a small-diameter pin portion 12, and whose tip is formed in a conical shape. The stepped end surface 13 of the large-diameter pin portion 11 serves as a lid for the through hole 31 when the solder paste 40 is filled in the through hole 31.
The diameter is slightly larger than the outer diameter of the through hole 31. Also,
The small diameter pin portion 12 is formed to have substantially the same size as the diameter of the lead wire 45 of the electronic component to be inserted into the through hole 31.
A stainless steel wire or the like is used as a material of the stepped pin 10. The stepped pin 10 is connected to a drive unit (for example, an air cylinder or the like, not shown), and is connected in two directions indicated by arrows (A, B).
To move to.
【００１０】２０は、はんだペースト充填機ではんだペ
ースト４０の吐出部（ノズル部のみ図示）と吐出部を矢
印２方向（Ｃ、Ｄ）へ移動させる駆動部（例えばエアー
シリンダ等、図示省略）等により構成されており、スル
ーホール３１にはんだペースト４０を所定量充填するも
のである。ノズル部２１の外径はスルーホール３１の外
径よりやや大きめとし、ノズル部２１の内径はスルーホ
ール３１の内径と略同じ大きさに形成される。Reference numeral 20 denotes a solder paste filling machine which discharges the solder paste 40 (only the nozzle portion is shown), and a driving portion (for example, an air cylinder, not shown) for moving the discharge portion in the two directions of arrows C and D, etc. The through hole 31 is filled with a predetermined amount of the solder paste 40. The outer diameter of the nozzle portion 21 is slightly larger than the outer diameter of the through hole 31, and the inner diameter of the nozzle portion 21 is formed to be substantially the same size as the inner diameter of the through hole 31.
【００１１】３０はプリント配線板で、表面に電子回路
パターン（図示省略）や電子部品（図示省略）等を挿入
するスルーホール３１等が形成されている。次に、はん
だペーストの充填について説明する。先ず、プリント配
線板３０を位置決め固定し、段付ピン１０を矢印Ａ方向
へ移動させ小径ピン部１２をスルーホール３１の孔に挿
通し、段付ピン１０の段部端面１３をスルーホール３１
の上面（図示上方）に密着させる。次に、はんだペース
ト充填機２０を矢印Ｃ方向へ移動させ、ノズル部２１の
先端部２３をスルーホール３１の下面（図示下方）に密
着させ、はんだペースト４０をスルーホール内径２２と
小径ピン部１２との隙間３３に所定の量充填する。次
に、はんだペースト充填機２０を矢印Ｄ方向へ、また、
段付ピン１０を矢印Ｂ方向へそれぞれ移動させる。次
に、はんだペースト４０が充填されたスルーホール３１
の孔４２に電子部品のリード線４５を挿入する。そし
て、炉内で温度を上げはんだペースト４０を溶融して、
スルーホール３１とリード線４５とをはんだ付けする。Reference numeral 30 denotes a printed wiring board, on the surface of which are formed through holes 31 for inserting electronic circuit patterns (not shown), electronic components (not shown), and the like. Next, the filling of the solder paste will be described. First, the printed wiring board 30 is positioned and fixed, the stepped pin 10 is moved in the direction of arrow A, the small-diameter pin portion 12 is inserted into the hole of the through hole 31, and the step end face 13 of the stepped pin 10 is inserted into the through hole 31.
To the upper surface (upper side in the figure). Next, the solder paste filling machine 20 is moved in the direction of arrow C so that the tip 23 of the nozzle 21 is brought into close contact with the lower surface (downward in the figure) of the through hole 31, and the solder paste 40 is filled with the through hole inner diameter 22 and the small diameter pin 12. Is filled in a predetermined amount in the gap 33 between them. Next, the solder paste filling machine 20 is moved in the direction of arrow D,
The stepped pins 10 are each moved in the direction of arrow B. Next, the through hole 31 filled with the solder paste 40 is formed.
The lead wire 45 of the electronic component is inserted into the hole 42 of FIG. Then, the temperature is raised in the furnace to melt the solder paste 40,
The through hole 31 and the lead wire 45 are soldered.
【００１２】以上説明したように本実施例によれば、ス
ルーホール３１に充填されたはんだペースト４０がリン
グ状になるので、電子部品の挿入孔の位置確認が容易に
なり挿入作業時間の短縮が図れる。また、電子部品を挿
入後にスルーホール内周３２と電子部品のリード線４５
との隙間に適切量のはんだペースト４１が充填されるの
で、リフローはんだ付け品質の向上が図れる。As described above, according to this embodiment, the solder paste 40 filled in the through-holes 31 is formed into a ring shape, so that the position of the insertion hole of the electronic component can be easily confirmed, and the time required for the insertion work can be reduced. I can do it. After the electronic component is inserted, the through hole inner circumference 32 and the lead wire 45 of the electronic component are inserted.
Is filled with an appropriate amount of solder paste 41, so that the reflow soldering quality can be improved.
【００１３】次に、本発明の第２実施例を図２を用いて
説明する。図２は本発明の第２実施例のはんだペースト
充填装置を示す図で、（ａ）段付ピンの正面図、（ｂ）
はんだペースト充填部の断面図である。尚、第２実施例
は第１実施例の一部を変更したもので、その他について
は第１実施例と略同じであるので、同じ構成については
同じ符号を付し説明を省略する。Next, a second embodiment of the present invention will be described with reference to FIG. FIG. 2 is a view showing a solder paste filling apparatus according to a second embodiment of the present invention, in which (a) a front view of a stepped pin, and (b)
It is sectional drawing of a solder paste filling part. In the second embodiment, a part of the first embodiment is changed, and the others are substantially the same as those of the first embodiment.
【００１４】５０は段付ピンで、大径ピン部５１と小径
ピン部５２の段付きとなっており、大径ピン部５１の段
部端面５４は、スルーホール３１にはんだペースト４０
を充填する際にスルーホール３１の蓋の役目を果たすも
ので、スルーホールの直径よりやや大きめとする。ま
た、小径ピン部５２には段付端面５４と小径ピン部５２
の基部に円錐部５３が形成されており、円錐部５３の先
端部より小径ピン部５２の先端部方向にテーパー（抜き
勾配）が設けられている。段付ピン１０の材料にはステ
ンレス鋼線等が用いられる。尚、段付ピン５０は駆動装
置（例えばエアーシリンダ等、図示省略）に接続されて
おり矢印２方向（Ａ、Ｂ）へ移動するようになってい
る。Reference numeral 50 denotes a stepped pin, which has a large diameter pin portion 51 and a small diameter pin portion 52. The stepped end surface 54 of the large diameter pin portion 51 has a solder paste 40
When filling the hole, it serves as a lid of the through hole 31 and is slightly larger than the diameter of the through hole. The small-diameter pin 52 has a stepped end surface 54 and a small-diameter pin 52.
A conical portion 53 is formed at the base of the conical portion 53, and a taper (draft) is provided from the distal end portion of the conical portion 53 toward the distal end portion of the small diameter pin portion 52. A stainless steel wire or the like is used as a material of the stepped pin 10. The stepped pin 50 is connected to a driving device (for example, an air cylinder or the like, not shown) and moves in two directions indicated by arrows (A, B).
【００１５】尚、プリント配線板３０のスルーホール３
１に、はんだペースト４０を充填させるのは第１実施例
と同じようにして行われるが、スルーホール３１内に形
成されたはんだペーストリング５５には、上面入口（図
示上方）に皿面部５７が形成され孔全体にテーパーが形
成される。以上説明したように本実施例においては、ス
ルーホール３２に充填されたはんだペーストリング５５
の孔の入口が皿状に形成されるので、電子部品の挿入孔
の位置確認が、第１実施例よりもさらに容易になり挿入
作業時間の短縮が図れる。また、小径ピン部５２にテー
パーを設けることにより、小径ピン部５２とはんだペー
ストリング５５との型離れがよくなるので、はんだペー
ストリング５５がより安定して形成される。尚、本実施
例てははんだペーストリング５５の上面入口を皿面にし
たが、この他に浅い円座状にしても同じように電子部品
の挿入孔の位置確認が容易となる。この場合には、段付
ピン５０の円錐部５３を円柱状に形成すればよい。The through hole 3 of the printed wiring board 30
1 is filled with the solder paste 40 in the same manner as in the first embodiment, except that the solder paste ring 55 formed in the through hole 31 has a dish surface 57 at the upper surface entrance (upper side in the figure). The entire hole is tapered. As described above, in the present embodiment, the solder paste ring 55 filled in the through hole 32
Since the entrance of the hole is formed in a dish shape, it is easier to confirm the position of the insertion hole of the electronic component than in the first embodiment, and the insertion work time can be shortened. Also, by providing the small-diameter pin portion 52 with a taper, the mold separation between the small-diameter pin portion 52 and the solder paste ring 55 is improved, so that the solder paste ring 55 is more stably formed. In this embodiment, the entrance of the upper surface of the solder paste ring 55 is a flat surface. However, the position of the insertion hole of the electronic component can be easily confirmed in the same manner even if it is formed in a shallow circular shape. In this case, the conical portion 53 of the stepped pin 50 may be formed in a column shape.
【００１６】[0016]
【発明の効果】以上説明したように本発明によれば、基
板に形成されたスルーホール内周に、はんだペーストの
リングが形成され電子部品の挿入孔の位置確認が容易に
なり挿入作業時間の短縮が図れる。また、電子部品を挿
入後にスルーホールの内周と電子部品のリード線との隙
間に適切量のはんだペーストが充填されるので、リフロ
ーはんだ付け品質の向上が図れる。As described above, according to the present invention, a ring of a solder paste is formed on the inner periphery of a through hole formed in a substrate, so that the position of an insertion hole of an electronic component can be easily confirmed, and the time required for the insertion work can be reduced. It can be shortened. Further, since an appropriate amount of solder paste is filled in the gap between the inner periphery of the through hole and the lead wire of the electronic component after the insertion of the electronic component, the reflow soldering quality can be improved.
【図１】本発明の第１実施例のはんだペースト充填装置
を示す断面図で、（ａ）段付ピン挿入状態、（ｂ）はん
だペースト充填状態である。FIG. 1 is a sectional view showing a solder paste filling apparatus according to a first embodiment of the present invention, in which (a) a stepped pin is inserted and (b) a solder paste is filled.
【図２】本発明の第１実施例のプリント配線板への電子
部品挿入状態を示す図で、（ａ）はんだペースト充填部
の断面図、（ｂ）電子部品挿入状態の断面図である。FIGS. 2A and 2B are views showing a state in which an electronic component is inserted into a printed wiring board according to the first embodiment of the present invention, wherein FIG. 2A is a cross-sectional view of a solder paste filling portion, and FIG.
【図３】本発明の第２実施例のはんだペースト充填装置
を示す図で、（ａ）段付ピンの正面図、（ｂ）はんだペ
ースト充填部の断面図である。FIG. 3 is a view showing a solder paste filling apparatus according to a second embodiment of the present invention, in which (a) is a front view of a stepped pin, and (b) is a sectional view of a solder paste filling section.
【図４】従来のプリント配線板への電子部品挿入例を示
す図で、（ａ）はんだペースト充填部の断面図、（ｂ）
電子部品挿入状態の断面図である。4A and 4B are views showing an example of insertion of an electronic component into a conventional printed wiring board, in which FIG. 4A is a cross-sectional view of a solder paste filling portion, and FIG.
It is sectional drawing of the electronic component insertion state.
１０、５０・・段付ピン １１、５１・・大径ピン部 １２、５２・・小径ピン部 １３、５４・・段部端面 ２０・・・・・はんだペースト充填機 ２１・・・・・ノズル ２２・・・・・ノズル内径 ２３・・・・・ノズル先端面 ３０・・・・・プリント配線板 ３１・・・・・スルーホール ３２・・・・・スルーホール内周 ３３・・・・・隙間 ４０・・・・・はんだペースト ４１、５５・・はんだペーストリング ４２・・・・・孔 ４５・・・・・リード線 ５３・・・・・円錐部 ５６・・・・・テーパー孔 ５７・・・・・皿面部 10, 50 ··· stepped pin 11, 51 · · · large diameter pin part 12, 52 · · · small diameter pin part 13, 54 · · · step end face 20 ··· solder paste filling machine 21 ··· nozzle 22 ... Nozzle inner diameter 23 ... Nozzle tip surface 30 ... Printed wiring board 31 ... Through hole 32 ... Inner circumference of through hole 33 ... Gap 40 solder paste 41, 55 solder paste ring 42 hole 45 lead 53 conical portion 56 taper hole 57 .... Dish surface
Claims (3)
ルにはんだペーストを充填し、該スルーホールに電子部
品のリード線を挿入後リフローはんだ付けする該基板の
はんだ付けにおいて、 前記スルーホールを塞ぐ蓋部と該蓋部より立設し該スル
ーホールに挿通する軸部が形成された段付ピンと、 前記スルーホールに前記段付ピンの反対側から前記はん
だペーストを充填する充填機とからなり、 前記スルーホールの両面に前記蓋部と前記充填機のノズ
ル先端部を密着させ、前記はんだペーストを充填するよ
うにしたことを特徴とするはんだペースト充填装置。1. A lid for closing a through-hole in a soldering of the board, in which a through-hole formed in a printed wiring board is filled with a solder paste, a lead wire of an electronic component is inserted into the through-hole, and reflow soldering is performed. A stepped pin having a shaft portion formed upright from the portion and the lid portion and inserted into the through hole, and a filling machine for filling the through hole with the solder paste from the opposite side of the stepped pin, A solder paste filling device, wherein the lid and the nozzle tip of the filling machine are brought into close contact with both surfaces of a through hole to fill the solder paste.
とする請求項１記載のはんだペースト充填装置。2. The solder paste filling device according to claim 1, wherein a draft is provided in said shaft portion.
の内径よりやや小さめの直径を有する増径部を設けたこ
とを特徴とする請求項１記載のはんだペースト充填装
置。3. The solder paste filling apparatus according to claim 1, wherein an increased diameter portion having a diameter slightly smaller than an inner diameter of the through hole is provided at a standing base portion of the shaft portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8252834A JPH1098258A (en) | 1996-09-25 | 1996-09-25 | Solder paste filling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8252834A JPH1098258A (en) | 1996-09-25 | 1996-09-25 | Solder paste filling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1098258A true JPH1098258A (en) | 1998-04-14 |
Family
ID=17242850
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8252834A Withdrawn JPH1098258A (en) | 1996-09-25 | 1996-09-25 | Solder paste filling device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1098258A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291947A (en) * | 2011-07-29 | 2011-12-21 | 杭州华三通信技术有限公司 | Method for manufacturing through hole pad on step structure of printed circuit board (PCB) and PCB |
-
1996
- 1996-09-25 JP JP8252834A patent/JPH1098258A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102291947A (en) * | 2011-07-29 | 2011-12-21 | 杭州华三通信技术有限公司 | Method for manufacturing through hole pad on step structure of printed circuit board (PCB) and PCB |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A300 | Withdrawal of application because of no request for examination |
Free format text: JAPANESE INTERMEDIATE CODE: A300 Effective date: 20031202 |