JPH1095032A - Resin molding apparatus using release film - Google Patents

Abstract

PROBLEM TO BE SOLVED: To attempt the solution of problems such as the difficulty of peeling a release film from a molding when a resin is molded using the release film and the deformation of the molding due to incomplete resin molding operation. SOLUTION: A resin molding apparatus uses release films 20a, 20b in a process in which the films 20a, 20b are sucked and supported on the resin molding surfaces of molds 10a, 10b, and an article 12 to be molded is clamped through the films 20a, 20b to mold a resin. In this process, a peeling mechanism for peeling the films 20a, 20b mechanically from the molding after resin molding with the films 20a, 20b sucked and supported on the surface of the mold. By pushing and moving a peeling frame 50 which supports a holding part which holds the molding with the films 20a, 20b air-sucked on the surface of the mold in the mold opening/closing direction, the films 20a, 20b are peeled from the molding.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molding apparatus using a release film.

[0002]

2. Description of the Related Art With a resin molding method using a release film, when a molded product such as a lead frame is resin-molded, a surface, such as an inner surface of a cavity, where resin is directly in contact with a mold is covered with a release film. This is a method of resin molding without bringing the resin into contact with the surface. Since the release film covers the resin molding surface of the mold in this manner, a material having predetermined heat resistance, flexibility, and releasability from the resin is used.

FIG. 10 shows a resin molding method using a release film. In the figure, the left half of the center line shows a state before the resin is filled in the cavity, and the right half shows a state in which the cavity is filled with the resin. The molded article 12 is clamped by the upper mold 10a and the lower mold 10b, and the resin 16 is filled into the cavity 18 from the pot 14 and resin-molded. 20a, 2
0b is a release film, and the upper mold 10a and the lower mold 10
The mold surface is covered according to the inner surface shape of the cavity concave portion b.

The method of covering the mold surface with the release films 20a and 20b is as follows. First, a suction hole 22 is provided on the clamp surface of the upper die 10a and the lower die 10b, and a cavity suction hole 24 is provided on the inner bottom surface of the cavity recess. After sucking air from the suction hole 22 of the clamping surface of the mold and adsorbing to the clamping surface,
By suctioning air from the cavity suction hole 24 on the bottom surface in the cavity. Since the release films 20a and 20b have sufficient flexibility, they are sucked and supported along the inner surface of the cavity as shown in the figure by sucking air from the inner bottom surface of the cavity.

[0005] In this example, as a molding resin, FIG.
The wrapping resin 26 shown in FIG. The wrapping resin 26 is obtained by sealing a stick-shaped resin with a wrapping film, and supplies the resin to the pot 14 in a state of being sealed with the wrapping film. The resin melted in the pot 14 is pressure-fed by a plunger, so that the sealing portions at both side edges of the wrapping film are expanded, and the cavity 16 is filled with the resin 16.

[0006]

FIG. 12 shows a plane arrangement of the cavity concave portion, the pot 14 and the like in the lower mold 10b. The pot 14 is opened in a long hole shape, and is formed so that a lapping resin 26 formed in a stick shape can be charged. The release films 20b have a width covering the cavity recesses 18a, and are arranged on both sides of the pot 14, respectively.

After adsorbing and supporting the release films 20a and 20b on the mold surface, the molded article 12 and the lapping resin 16
Is set and clamped with the upper mold 10a and the lower mold 10b to seal with resin. FIG. 12 shows a clamp portion A using a mold. As shown in the figure, the portion where the molded product 12 is clamped by the mold is a portion having a fixed width around the cavity concave portion 18a and a portion through which a runner and a gate, which are resin paths for filling the cavity with resin, pass. The reason why the entire surface of the molded article 12 is not clamped by the mold is to effectively apply the clamping force of the mold to the molded article 12 so that the clamp can be surely performed.

FIG. 13 is an enlarged view showing a state in which the lead frame of the molded article 12 is clamped by a mold.
The mold is clamped so that a clamping force is effectively applied to the molded product 12.
a, when the lead frame is clamped through 20b,
The release films 20a and 20b are inserted into the middle of the adjacent leads 12a by the clamping force, and after the resin molding, the release films 20a and 20b are removed from the lead frame.
0b becomes difficult to peel off. In the lead frame manufactured by etching, the side edge portion of the lead 12a is formed in an edge shape, and in the lead frame manufactured by press working, the burrs are formed so as to project from the side surfaces of the lead.
The release films 20a and 20b that have entered between them are easily caught and hard to peel off.

In the case where the release films 20a and 20b are inserted between the leads 12a and clamped at the time of clamping as in the lead frame described above, the release films 20a and 20b are peeled off from the molded article 12 after resin molding. However, there is a problem that the operation of peeling off the release film is hindered, and the lead is deformed if the release film is forcibly peeled off.

According to the present invention, when the release film is hardly peeled off from the molded article at the time of resin molding, the release film is used which enables the release film to be surely peeled off and enables a smooth resin molding operation. An object is to provide a resin molding device.

[0011]

The present invention has the following arrangement to achieve the above object. That is, in a resin molding apparatus using a release film that adsorbs and supports a release film on a resin molding surface of a mold and clamps a molded product through the release film to perform resin molding, the release film is placed on the mold surface. And a release mechanism for mechanically releasing the release film from the molded product after resin molding while adsorbing and supporting the release film. Further, a pressing portion is provided in the peeling mechanism, the pressing portion being in contact with the molded product at an intermediate position between the release film and the molded product on the mold surface, and the pressing portion is pressed in the mold opening and closing direction. It is characterized by being supported by a mechanism. The release film is peeled from the molded product by pushing the holding portion in the mold opening / closing direction by the pushing mechanism while the release film is suction-supported on the mold surface. Further, it is characterized in that the pressing portion is buried from the clamp surface of the mold at the time of mold clamping and can be stored in the mold. Further, the pressing portion is supported by a peeling frame provided movably in the mold opening / closing direction by the pressing mechanism outside the mold. Further, the pressing portion is formed in a rod shape, and a storage groove for storing the pressing portion at the time of mold clamping is provided on the mold surface.

[0012]

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will be described below. 1 and 2 are a front view and a plan view showing a schematic configuration of an embodiment of a resin molding apparatus using a release film according to the present invention. 30
a is a fixed base of the press device, and 30b is a movable base, which supports the upper die 10a and the lower die 10b via hot plates 32a and 32b, respectively. 34a and 34b are supply reels for the release films 20a and 20b.
b is a collection reel. Release films 20a, 20
b is supplied by being sequentially fed by a predetermined length for each resin molding operation.

In FIG. 2, reference numeral 40 denotes a loader for supplying the molded article 12 and the lapping resin 26 to the lower mold 10b and taking out the product after resin molding from the lower mold 10b. The loader 40 advances and retreats in a direction orthogonal to the direction in which the release films 20a and 20b are transported, and performs operations such as supply of the molded product 12. Reference numeral 42 denotes a wrapping resin set portion provided in the loader 40, 44 denotes a set portion of a molded product, and 46 denotes a take-out portion of a molded product. Note that the type of the loader for setting the molded article 12 and the like is not limited to the present embodiment, and other methods can be used.

The resin molding apparatus of this embodiment is characterized in that the resin molding apparatus using the release film is provided with a peeling mechanism for peeling the release film from the molded product after the resin molding. As shown in FIGS. 1 and 2, the release frame 5 of the release film is movably provided in each of the upper mold 10 a and the lower mold 10 b in the mold opening and closing direction.
0 is provided, and a holding portion 52 for a molded product is provided on a release frame 50 of a release film. The holding portion 52 is arranged at a position sandwiched between the release film and the molded product. 5
Reference numeral 4 denotes a drive motor for driving the peeling frame 50 in the vertical direction.

The inner dimensions of the peeling frame 50 are set slightly larger than the outer dimensions of the upper mold 10a and the lower mold 10b.
a and can move up and down outside the lower mold 10b. The holding portion 52 of the molded product is formed by extending from the frame portion of the peeling frame 50 toward the inside thereof to the set position of the molded product in the mold. In the embodiment shown in FIGS. 1 and 2, two rods extend from the peeling frame 50 as the holding portion 52, and the rods are arranged in a positional relationship inserted between the release film and the molded product.

The peeling frame 50 and the pressing portion 52 perform an operation of peeling the release films 20a and 20b from the molded product in conjunction with the opening and closing operation of the mold during resin molding. The peeling frame 50 and the drive motor 54 constitute a pushing mechanism for pushing the holding section 52. 60a and 60b are guide portions for guiding the release films 20a and 20b when the release films 20a and 20b are conveyed. The guide portions 60a and 60b move up and down in accordance with a mold opening and closing operation during resin molding.

Next, a resin molding method using the resin molding apparatus of this embodiment will be described with reference to FIGS. FIG. 3 shows a state in which the release films 20a and 20b are transported in the mold open state. Guide rollers 56 for guiding the release films 20a, 20b are provided at both ends of the release film release frame 50, and the release films 20a, 20b are provided.
b is conveyed by being sandwiched between the holding portion 52 of the release film and the peeling frame 50 and between the guide roller 56 and the peeling frame 50. The release frame 50 includes the upper mold 10a and the lower mold 1
The release films 20a, 20b are conveyed without interfering with the mold by supporting the release films 20a, 20b apart from the mold surface.

After transporting the release films 20a, 20b by a predetermined length, the release films 20a, 20b are suction-supported on the mold surfaces of the upper mold 10a and the lower mold 10b by air (FIG. 4 (a)). FIG. 4A shows a state in which the drive motor 54 is driven to pull the peeling frame 50 toward the clamping surface of the mold, and the release films 20a and 20b are brought into contact with the clamping surface. Similarly, the guides 60a and 60b are moved in the pull-in direction so that the release films 20a and 20b are securely sucked by air to the clamp surfaces.

When the release films 20a and 20b are suctioned to the clamp surface by air, the pressing portion 52 is prevented from protruding from the clamp surface. In the present embodiment, since the pressing portion 52 formed in a rod shape is used, the peeling frame 50 is used.
In order to prevent the holding portion 52 from protruding from the clamp surface when the wire is pulled in, the holding groove 5 of the holding portion is formed in the upper die 10a and the lower die 10b.
8 were provided. FIG. 4B shows a state in which the holding portion 52 is pulled into the storage groove 58 of the holding portion. Release film 20
a is drawn into the storage groove 58 together with the holding portion 52.

The release films 20a and 20b are
After air is adsorbed to the lower mold 10a and the lower mold 10b, the molded article 12 and the lapping resin 26 are set in a mold. Then, upper mold 1
The molded object 12 is clamped by the lower mold 10a and the lower mold 10b, and the resin is filled into the cavity from the pot and molded. FIG.
Indicates a state in which the resin is molded by clamping. Upper die 10a
The release frame 50 of the lower mold 10b is retracted to a position where it does not interfere with each other, and the holding portion 52 is also retracted from the clamp surface, and the molded article 12 is clamped via the release films 20a and 20b.

After the resin molding is completed, the mold is opened. At that time, first, the molded product 70 and the release film 20a are separated from each other with the upper die 10a so that the molded product 70 remains in the lower die 10b (FIG. 6). The release operation of the release film 20a is performed by pressing the release frame 50 of the upper die 10a in the mold opening direction by the drive motor 54 when the lower die 10b is moved downward, and by the pressing portion 52 provided on the release frame 50. This is performed by pressing the upper surface of the molded product 70 and pressing it downward. Upper die 10
In a, the release film 20a is sucked and supported on the mold surface by air suction, so that the release film 20a can be reliably peeled off from the molded product 70 when the holding portion 52 pushes the molded portion. In FIG. 6, the release film 20a is adsorbed and supported on the clamp surface of the upper mold 10a, and the molded product 70 is peeled off from the release film 20a to form the lower mold 1
0b.

FIG. 7 shows that the molded product 70 is peeled off from the release film 20a of the upper die 10a and is lowered to the lowest point position while being supported by the lower die 10b in a state where the die is completely opened. After the lower mold 10b descends to the lowest point, the molded product 70 is peeled from the release film 20b of the lower mold 10b (FIG. 8). Molded product 7 from release film 20b
The operation of peeling 0 is the same as in the case of the upper mold 10a,
The release film 20b is adsorbed and supported on the clamp surface of the lower mold 10b by air suction, the peeling frame 50 of the lower mold 10b is moved upward by the drive motor 54, and the lower surface of the molded portion is pushed up by the pressing portion 52. Since the release film 20b is adsorbed and supported by the lower mold 10b, the release frame 50
By this operation, the release film 20b and the molded product 70 are reliably separated and separated.

The holding portion 52 formed in a rod shape is formed of a pipe, and a small-diameter hole is provided in the pipe.
The compressed air is passed through the
2, the release film 20a, 2
When peeling Ob, it is also possible to blow out compressed air from a pipe and peel release films 20a and 20b from molded article 70.

After separating the molded product 70 from the release film 20b, the molded product 70 is picked up by the loader 40 and taken out of the mold. Release film 20a,
The air suction on the mold surface of the mold 20b is released, and the guide 60a,
60b, the next release film 20a,
20b is conveyed. In this manner, resin molding can be continuously performed while performing an operation of separating the release films 20a and 20b from the molded product 70 by the separation mechanism.

The resin molding apparatus according to the present embodiment uses the release frame 5
By pressing 0 and mechanically peeling the release films 20a and 20b from the molded product 70, even when the release film gets into a molded product such as a lead frame and the release film becomes difficult to peel. By forcibly peeling off the release film, the release film can be reliably removed from the molded product, and the release film adheres to the molded product and is difficult to peel off. This can be effectively eliminated.

In the above embodiment, the holding portion 52 formed in the shape of two rods is used for the peeling frame 50. However, the holding portion 52 may have any form as long as it can suitably peel the molded product from the release film. It is not particularly limited. FIG. 9 shows another configuration example of the pressing portion 52 attached to the peeling frame 50. In the same figure, 52a is formed in a simple rod shape, 52b is arranged in the middle of two adjacent resin mold parts, two are arranged near the side edge of the resin mold part, and 52c is the periphery of the resin mold part. It is formed in a rectangular frame shape so that the portion can be pressed. The pressing portion 52c presses substantially the entire peripheral edge of the resin mold portion to eliminate the deformation of the molded product at the time of the peeling operation, and aims at a more reliable peeling operation.

In this embodiment, the lead frame is resin-molded as a molded article. However, the present invention can be similarly applied to molded articles other than the lead frame. The present invention can be effectively applied when the release film is difficult to peel off from the molded product. In addition to the case where both surfaces of the molded product are clamped with the release film as in the above embodiment, only one surface of the molded product is clamped with the release film. The same can be applied to the case of performing resin molding.

[0028]

According to the resin molding apparatus using the release film according to the present invention, as described above, even when the release film is difficult to peel off from the molded product when the resin molding is performed using the release film, The release film can be peeled off quickly, thereby making it possible to perform automatic resin molding operation smoothly. In addition, by peeling the release film without deforming the molded product, it is possible to improve the reliability of the product and achieve a stable production.

[Brief description of the drawings]

FIG. 1 is a front view showing a schematic configuration of an embodiment of a resin molding apparatus using a release film according to the present invention.

FIG. 2 is a plan view showing a schematic configuration of an embodiment of a resin molding apparatus using a release film according to the present invention.

FIG. 3 is an explanatory view of a state in which a release film is transported by a resin molding apparatus using a release film according to the present invention.

FIG. 4 is an explanatory view showing a state in which a release film is attracted to a mold surface by a resin molding apparatus using a release film according to the present invention.

FIG. 5 is an explanatory view showing a state in which a molded article is resin-molded by a resin molding apparatus using a release film according to the present invention.

FIG. 6 is an explanatory view of a state in which a molded product is peeled off from the release film by the upper mold when the mold is opened in the resin molding apparatus using the release film according to the present invention.

FIG. 7 is an explanatory view of a state in which a mold is completely opened by a resin molding apparatus using a release film according to the present invention.

FIG. 8 is an explanatory view of a state in which a molded product is peeled from a release film in a lower mold of a resin molding apparatus using a release film according to the present invention.

FIG. 9 is an explanatory diagram showing another configuration of the pressing portion provided on the peeling frame.

FIG. 10 is an explanatory diagram showing a resin molding method using a release film.

FIG. 11 is a perspective view of a wrapping resin.

FIG. 12 is an explanatory view showing a portion where a molded object is clamped by a mold.

FIG. 13 is an explanatory diagram showing a state in which a release film is hardly inserted between leads.

[Explanation of symbols]

 10a Upper die 10b Lower die 12 Molded product 14 Pot 20a, 20b Release film 26 Wrapping resin 30a Fixed base 30b Movable base 34a, 34b Supply reel 36a, 36b Recovery reel 40 Loader 50 Release frame 52, 52a, 52b, 52c Pressing portion 54 Drive motor 58 Storage groove 60a, 60b Guide 70 Molded product

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code FI // B29K 105: 20 B29L 31:34

Claims (5)

[Claims] 1. A resin molding apparatus using a release film that adsorbs and supports a release film on a resin molding surface of a mold and clamps a molded product through the release film to perform resin molding. In the state of being supported by suction on the mold surface
A resin molding apparatus using a release film, comprising a release mechanism for mechanically releasing the release film from a molded product after resin molding. 2. The release mechanism has a pressing portion that is in contact with the molded product at an intermediate position between the release film and the molded product on the mold surface, and the pressing portion is pressed in the mold opening and closing direction. 2. A resin molding apparatus using a release film according to claim 1, wherein said resin molding apparatus is supported by a pushing mechanism. 3. The resin molding apparatus using a release film according to claim 2, wherein the pressing portion is buried from the clamp surface of the mold at the time of mold clamping and can be stored in the mold. 4. The release film according to claim 2, wherein the pressing portion is supported by a peeling frame provided movably in a mold opening and closing direction by the pressing mechanism outside the mold. Resin molding equipment using 5. The pressing portion is formed in a rod shape,
The resin molding apparatus using a release film according to claim 4, wherein a storage groove for storing the holding portion at the time of mold clamping is provided on the mold surface.