JPH1092539A - Contact for semiconductor apparatus - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lessen the inductance components and contact resistance by separately installing a contact body and an elastic member and making the contact body linear. SOLUTION: A cover body 13 is opened, an IC 16 is installed in the inside of a socket main body 12, and when the cover is closed, a lead 17 is connected with a contact 10. By separately constituting a contact body 20 and an elastic member 21 of the contact 10, a spring property of the body 20 is made unnecessary. Consequently, the body 20 can be formed into a linear shape and the length of the body 20 is shortened, so that the inductance components and the contact resistance can be lowered. Such as contact 10 can be satisfactorily used for high speed IC 16 and moreover, noise generated by an effect of a contact can be lessened. Furthermore, a small ring part 26 of one end part of the member 21 is fixed on an upper end part of the body 20 and a large ring part 28 installed in the other end part is joined to a substrate 22 and by pushing down the ring part 28, the body 20 can be elastically biased in the extension direction. As a result, the body 20 is biased toward the lead with a simple constitution.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a contact for a semiconductor device, and more particularly to a contact for a semiconductor device which is electrically connected by being pressed by an external connection terminal provided on the semiconductor device. Generally, when a test is performed on a semiconductor device (IC), various tests (for example, a burn-in test or the like) are performed by mounting the IC in an IC socket. This I
The C socket is provided with a semiconductor device contact (hereinafter, simply referred to as a contact) for making an electrical connection to an external connection terminal (a lead or the like) formed on the IC.

On the other hand, with the recent increase in the speed of semiconductor devices,
The inductance component with the contact itself is becoming non-negligible. Therefore, a contact that produces as little inductance component as possible is required.

[0003]

2. Description of the Related Art FIG. 7 shows one configuration of a conventional IC socket using a contact for a semiconductor device (hereinafter simply referred to as a contact). The IC socket 1 generally includes a socket body 2, a contact 3, a printed circuit board 4, and the like. In the figure, reference numeral 5 denotes a semiconductor device (IC).

The contact 3 is connected to a lead 6 provided on the IC 5.
Are provided in the socket body 2 in correspondence with the above. The lower end of each contact 3 penetrates through the socket body 2 and the printed board 4 disposed at the bottom of the socket body 2 and is drawn to the soldering position of the printed board 4. Then, at this position, it is soldered to the printed circuit board 4 together with the wire 7 connected to the IC test apparatus.

On the other hand, the socket body 2 is provided with a lid 9 that rotates about the support shaft 8. When the lid 9 is closed, each lead 6 of the IC 5 comes into contact with the contact 3. At this time, since the contact 3 has a curved shape as shown in the figure, the contact 3 is configured to have a spring property.
Therefore, when the lid 9 is closed, each lead 6 of the IC 5 presses the contact 3, and the contact 3 is elastically deformed by the pressing force.

The contact 3 resiliently contacts the lead 6 by an elastic restoring force generated as a reaction force of the elastic deformation, and the electric connection between the contact 3 and the lead 6 is ensured.

[0007]

As described above, the contact 3 has a curved shape in an arc shape, thereby generating a spring property, thereby reducing the impact on the IC 5 and ensuring that the lead 6 is in contact with the IC 5. It is configured to be in contact with the child 3.

However, if the shape of the contact 3 is curved in an arc shape, the distance from the IC 5 to the soldering position with the wire 7 becomes long. Therefore, the inductance of the contact 3 itself becomes large, and there is a problem that it is not possible to cope with the IC 5 having a high speed.

Further, if the contact 3 is long, the signal terminals of the IC 5 are easily affected by noise, which hinders stabilization of the electrical characteristics of the IC test system. There is also a problem that it cannot be performed. This is a serious problem in the current situation where the integration of ICs and the speeding up of the operation have been remarkably progressing as in recent years.

[0010] The present invention has been made in view of the above points, and has as its object to provide a contact for a semiconductor device capable of reducing an inductance component.

[0011]

The above-mentioned object can be attained by taking the following means. According to the first aspect of the present invention, in the contact for a semiconductor device, which is electrically connected by being pressed by an external connection terminal provided on the semiconductor device, a linear contact body movably supported by the substrate. And an elastic member that elastically biases the contact body toward an external connection terminal of the semiconductor device.

According to a second aspect of the present invention, in the contact for a semiconductor device according to the first aspect, the elastic member has one end fixed near an upper end portion of the contact body and the other end portion. Are configured to engage with the substrate.

According to a third aspect of the present invention, in the contact for a semiconductor device according to the first aspect, the elastic member is provided on the substrate. Further, in the invention according to claim 4, in the contact for a semiconductor device according to claim 3, the elastic member is made of a conductive material, and the electrical connection between the substrate and the contact body via the elastic member. The connection is performed.

Each of the above means operates as follows. According to the first aspect of the invention, the linear contact body movably supported by the substrate is elastically biased toward the external connection terminal of the semiconductor device by the elastic member. As described above, by making the contact body and the elastic member separate from each other, the contact body can be formed in a linear shape, so that its length is shortened and the inductance component and the contact resistance can be reduced. . Accordingly, it is possible to cope with a high-speed semiconductor device and to reduce noise generated due to the contact.

According to the second aspect of the present invention, the elastic member has a simple structure in which one end is fixed near the upper end of the contact body and the other end is engaged with the substrate. Thus, the contact body can be elastically biased toward the external connection terminal of the semiconductor device.

According to the third aspect of the present invention, since the elastic member is disposed on the substrate on which the contact body is supported, the structure of the contact body can be simplified, and the contact for a semiconductor device can be simplified. The child can be easily assembled.

Further, according to the fourth aspect of the present invention, a conductive material is used as the elastic member, and the electrical connection between the substrate and the contact body is made through the elastic member. It can be used as a terminal for establishing electrical conduction with the child body. Therefore, since it is not necessary to separately form connection terminals, the configuration of the contact for a semiconductor device can be simplified.

[0018]

Embodiments of the present invention will now be described with reference to the drawings. 1 to 5 show a contact 10 for a semiconductor device (hereinafter simply referred to as a contact) according to a first embodiment of the present invention. FIGS. 1 and 2 show an IC socket 11 to which a contact 10 is applied, and FIGS.
Shows an enlarged view of the contact 10, and FIG. 5 shows a state where the contact 10 is disassembled.

First, an IC socket 11 to which a contact 10 is applied will be described with reference to FIGS. The IC socket 11 is roughly composed of the contact 10 and the socket body 1.
2, a lid 13 and the like. Socket body 1
Reference numeral 2 denotes a resin molded with high precision using a precision mold, and has a cavity 14 in which the contact 10 is mounted. The socket body 12 includes a support shaft 15.
Thereby, the lid 13 is rotatably supported by the shaft. The lid 13 is also formed by resin molding.

The semiconductor device 16 (hereinafter referred to as IC)
The lid 17 is mounted at a predetermined position in the socket body 12 with the lid 13 opened, and the lead 17 serving as an external connection terminal is electrically connected to the contact 10 by closing the lid 13. . FIG. 1 shows a state where the lid 13 is opened, and FIG. 2 shows a state where the lid 13 is closed.

Although not shown, the socket body 12 has a lock mechanism for locking the lid 13 in a closed state, and an IC.
A positioning mechanism for positioning the position 16 at a predetermined position in the socket body 12 is provided. Subsequently, the contact 10 as a main part of the present invention will be described with reference to FIGS. 3 to 5 in addition to FIGS. The contact 10 generally includes a contact body 20, an elastic member 21, a substrate 22, and the like.

The contact body 20 has a linear shape.
For example, it is formed of an alloy such as beryllium copper. The contact body 20 has a flange 23 at a position lower than the center thereof.
Are formed, and a groove 24 is formed near the upper end. The elastic member 21 has a thin plate shape, and is formed of a material having elasticity and electrical insulation (for example, insulating resin or the like). At one end of the elastic member 21, a small ring portion 26 having a small diameter hole 25 formed therein for engaging with the groove 24 formed in the contact body 20 is formed. A large ring portion 2 having a large diameter hole 27 through which the main body 20 is inserted.
8 are formed.

The board 22 is provided with the socket body 1 described above.
2 and is mounted in the cavity portion 14 formed of the multi-layer wiring board 2, and is constituted by a multilayer wiring board. This substrate 22
A space 29 is formed at the position where the contact body 20 is disposed, and through holes 30 and 31 through which the contact body 20 is movably inserted are formed in upper and lower portions of the space 29.
Are formed. The contact body 20 is inserted into the insertion hole 3.
It is configured to be supported by the substrate 22 by being movably inserted into 0 and 31.

A conductive film is formed on the inner wall of the space 29 and the inner walls of the through holes 30 and 31, and this conductive film is led out to the lower surface of the substrate 22 by the internal wiring 32 formed inside the substrate 22. Have been. Then, at this extraction position, a test device (not shown) and the internal wiring 32 are electrically connected.

As described above, the contact body 20 is supported by being inserted into the through holes 30 and 31, and the flange 23 is configured to be movable in the space 29. Therefore, the contact body 20 can be moved up and down with respect to the substrate 22. At this time, the contact body 20 is electrically connected to the through holes 30 and 31 by sliding contact, and the flange portion 23 is in contact with the conductive film formed on the inner wall of the space portion 29. Therefore, the contact body 2
0 and the internal wiring 32 are electrically connected.

On the other hand, the above-mentioned elastic member 21 is formed by inserting a large ring portion 28 formed at one end into a contact body 20 extending to the upper part of the substrate 22, and then forming a small ring portion formed at the other end. 26 is attached to the contact body 20 by fitting it into the groove 24. Since the elastic member 21 is an elongated plate-like member, the elastic member 21 is in a bent state in the attached state as shown in the drawings.

Further, since the elastic member 21 is formed of a material having a spring property, the elastic member 21 generates an elastic force by being bent as described above. The small ring portion 26 of the elastic member 21 is fixed to the contact body 20 and the large ring portion 28
Is configured to be movable with respect to the contact body 20, the elastic restoring force generated in the elastic member 21 by being bent acts so that the large ring portion 28 presses the substrate 22.

For this reason, the contact main body 20 is
Thus, it is always elastically urged in the extending direction (the direction of arrow X1 in the figure). However, the flange 23 formed on the elastic member 21
Is in contact with the upper surface of the space 29 so that further movement is restricted. FIG. 1 and FIG.
The contact 10 is shown in an extended state.

Next, the operation of the contact 10 configured as described above will be described in accordance with the procedure for mounting the IC 16 on the IC socket 11. To mount the IC 16 in the IC socket 11, first, as shown in FIG.
16 is placed on the upper end of the contact body 20. In this state, as shown in FIG. 3, the contact body 20 constituting the contact 10 is extended by being elastically urged by the elastic member 21 (that is, moved in the direction of the arrow X1). Has become. Each lead 17 of the semiconductor device 16 is in contact with the upper end of the contact body 20.

Subsequently, the lid 13 is closed as shown in FIG. When the lid 13 is closed, the upper surface of the IC 16 is pushed by the lid 13 and slightly moves down. Thereby, as shown in FIG. 4, the lead 17 of the IC 16 urges the contact body 20 downward, and the contact body 20 is
It moves down against the elastic biasing force of 1.

Therefore, in the state where the lid 13 is closed, the contact body 20 is urged upward by the elastic urging force of the elastic member 21, and the contact body 20 is moved by an appropriate force to the IC.
It makes elastic contact with 16 leads 17. Thereby, the lead 17
And the contact body 20 can be reliably connected.

Here, attention is paid to the electrical characteristics of the contact 10 having the above configuration. The contact 10 according to the present embodiment includes a contact body 20 which is conventionally configured by one member.
The elastic member 21 and the elastic member 21 are configured separately. Thus, the contact body 20 and the elastic member 2
Since the contact body 1 and the contact body 1 do not have to have a spring property, the contact body
Can be formed into a linear shape. In addition, the length of the contact body 20 can be shortened by forming the contact body 20 into a linear shape, so that the inductance component and the contact resistance can be reduced.

Therefore, by using the contact 10 according to the present embodiment, it is possible to sufficiently cope with the IC 16 having a higher speed, and it is possible to reduce the noise generated by the contact. . Further, as described above, in this embodiment, the small ring portion 26 formed at one end of the elastic member 21 is fixed near the upper end of the contact body 20, and the large ring portion 28 formed at the other end is fixed. Since the contact body 20 is elastically urged in the extension direction by engaging with and pressing the substrate 22, the contact body 20 can be elastically urged toward the lead 17 with a simple structure.

Next, a second embodiment of the present invention will be described. FIG. 6 shows a contact 10A according to a second embodiment of the present invention. In FIG. 6, components corresponding to those of the contact 10 according to the first embodiment described with reference to FIGS. 1 to 5 are denoted by the same reference numerals, and description thereof is omitted.

The contact 10 according to the first embodiment is
The contact body 20 and the elastic member 21 are configured separately, and the contact body 20 is urged in the extension direction by disposing the elastic member 21 on the contact body 20.
On the other hand, the contact 10A according to the present embodiment includes the elastic member 2
1A is provided on a substrate 22A. Hereinafter, a specific configuration will be described.

The substrate 22A is a multi-layer substrate, in which internal wirings 32A are formed. This internal wiring 32
For A, a material having both conductivity and spring properties is selected. As a material of the internal wiring 32A, for example, a copper alloy can be used.

A recess 33 is formed in the substrate 22A at a position where the contact body 20A is formed, and the internal wiring 32A is formed.
Is configured to extend toward the inside of the concave portion 33 (hereinafter, a portion of the internal wiring 32A exposed inside the concave portion 33 is referred to as an elastic member 21A). Accordingly, the elastic member 21A is exposed inside the concave portion 33, and the elastic member 21A has a cantilever configuration.
Further, as described above, since the internal wiring 32A is formed of a material having a spring property, the elastic member 21A configured as a part of the internal wiring 32A is naturally configured to be elastically deformable.

On the other hand, the contact body 20
A is formed through the insertion hole 34, and the elastic member 21A comes into contact with the lower part of the flange 23A formed in the contact body 20A when the contact body 20A is inserted through the insertion hole 34. It is configured as follows.

Therefore, when the contact body 20A is pressed and moved downward with the mounting of the IC 16, the contact body 20A is elastically deformed via the flange 23A, and the contact restoring force is generated by the elastic restoring force generated by this elastic deformation. IC 20 for main body 20A
6 is resiliently biased. Thereby, the contact body 20A and the lead 17 can be reliably electrically connected.

As is clear from the above description, the contact 10A according to the present embodiment also includes the contact body 20A and the elastic member 2A.
It is configured separately from 1A. Therefore, similarly to the first embodiment, it is not necessary to provide the contact body 20A with a spring property, so that the contact body 20A can be formed in a linear shape. For this reason, the length of the contact body 20 can be shortened, so that the inductance component and the contact resistance can be reduced. Noise can be reduced.

Further, in this embodiment, since the elastic member 21A is disposed on the substrate 22A on which the contact body 20A is supported, the structure of the contact body 20A can be simplified as compared with the first embodiment. The contact 10A can be easily assembled. Further, in the configuration of the present embodiment, since the elastic member 21A is formed by using a part of the internal wiring 32A, it is necessary to separately form connection terminals for electrically connecting the contact body 20A and the internal wiring 32A. , The configuration of the contact 10A can be simplified.

[0042]

According to the present invention as described above, the following various effects can be realized. According to the first aspect of the present invention, the contact body can be formed into a linear shape by separately configuring the contact body and the elastic member,
Therefore, the length is shortened, and the inductance component and the contact resistance are reduced, whereby it is possible to cope with a high-speed semiconductor device and to reduce noise generated due to the contact.

According to the second aspect of the present invention, the elastic member has a simple structure in which one end is fixed near the upper end of the contact body and the other end is engaged with the substrate. Thus, the contact body can be elastically biased toward the external connection terminal of the semiconductor device. According to the third aspect of the present invention, since the elastic member is provided on the substrate on which the contact body is supported, the structure of the contact body can be simplified, and assembling of the contact for a semiconductor device. Can be easily performed.

Furthermore, according to the fourth aspect of the present invention, since the elastic member can be used as a terminal for establishing electrical continuity with the contact body, it is not necessary to form a separate connection terminal, so that the contact for a semiconductor device can be eliminated. The configuration of the child can be simplified.

[Brief description of the drawings]

FIG. 1 is an IC using a contact according to a first embodiment of the present invention.
It is a figure showing the state where the upper lid of the socket was opened.

FIG. 2 is an IC using a contact according to a first embodiment of the present invention;
It is a figure showing the state where the upper lid of the socket was closed.

FIG. 3 is an enlarged view (when extended) of a contact according to a first embodiment of the present invention.

FIG. 4 is an enlarged view (when contracted) of the contact according to the first embodiment of the present invention.

FIG. 5 is an exploded view showing the contact according to the first embodiment of the present invention.

FIG. 6 is an enlarged view showing a contact according to a second embodiment of the present invention.

FIG. 7 is a diagram showing an IC socket using a contact, which is an example of the related art.

[Explanation of symbols]

 10, 10A contact 11 IC socket 12 socket body 13 lid 14 cavity 16 IC 17 lead 20, 20A contact body 21, 21A elastic member 22, 22A substrate 23, 23A flange 24 groove 25 small diameter hole 26 small ring 27 Large diameter hole 28 Large ring part 29 Space part 30, 31 Through hole 32, 32A Internal wiring 33 Recess 34 Insertion hole

Claims (4)

[Claims] A contact body for a semiconductor device, which is electrically connected by being pressed by an external connection terminal provided on the semiconductor device, a linear contact body movably supported by a substrate; An elastic member for elastically urging the contact body toward an external connection terminal of the semiconductor device. 2. The contact for a semiconductor device according to claim 1, wherein one end of the elastic member is fixed near an upper end of the contact body, and the other end is engaged with the substrate. A contact for a semiconductor device, comprising: 3. The contact for a semiconductor device according to claim 1, wherein the elastic member is disposed on the substrate. 4. The contact for a semiconductor device according to claim 3, wherein the elastic member is made of a conductive material, and the substrate and the contact body are electrically connected via the elastic member. Contact for a semiconductor device.