FI117917B - Socket for mounting the electrical part - Google Patents

Description

117917

Socket for mounting the electrical part

Background of the Invention. <

The present invention relates to a device socket for mounting an electrical component used mainly for mounting a camera module and an electrical component 5, such as a semiconductor device, on a circuit board.

Conventionally, an electrical device such as a mobile phone is provided with a circuit board therein. A camera module and an electrical component, such as a semiconductor device, are mounted on the circuit board to provide an additional function to the function that the electrical device initially has. The electrical component, which is weak when hot, cannot be installed by soldering 10 directly, therefore, such an electrical component is connected to the circuit board using a socket to mount the electrical component, as shown in Figs. 8-10.

The device socket 1 for mounting the electrical part is provided with a contact 3 which contacts the terminal 2a of the printed wiring on the printed circuit board 2 and a housing 5 for supporting the contact 3 and for positioning the electrical part such as a semiconductor device 15 (camera module). In light of the actions of the electrical device generated by the electromagnetic wave generated by the electrical part 4, the circumference of the housing 5 is covered by a protective sheath 6 made of conductor.

The device socket 1 for mounting the electrical part is connected to the connector terminal part 2a of the circuit board by soldering the contact portion 3a of the contact 3 thereto and secured to the circuit board by soldering the attachment piece 6a of the protective cover 6 to the mounting pattern 2b. The electrical part 4 is placed in the electrical socket 1 of the instrument socket, ·. · For mounting, and the connection end of the electrical part 4 is brought into contact with the elastic • • · t '.' Contact with the contact 3, and the electrical part 4 is electrically connected to the circuit board 2 via the contact 3. * ***** '25 However, in such a device socket 1, for mounting the electrical part, because the shield mounting part 6a is located outside the contact part * · · 3a, no confirmation can be obtained as to whether the contact part 3a is precisely soldered or not. not when soldering the outer casing. In addition, if there is a problem with soldering to the contact portion 3a because the instrument socket is secured by mounting the protective cover 6, there is a problem that the instrument socket cannot be removed and cannot be removed. Perform a restore.

* * *

In order to solve the above problem, a device socket as shown in Fig. 11 has been proposed for mounting the electrical part.

·: *: The instrument socket for mounting the electrical component is constructed as follows. A conductive protective cover 11 is affixed to the circuit board 2 in advance, and the body 16 housing holding the contacts 15 is inserted into the protective cover 117917 '2, each of the contacts 15 having integrally formed resilient contact pieces 13 and 14 projecting upwards and downwards. with respect to the solid plate portion 12. Subsequently, the electrical part 4, such as a semiconductor device (camera module), is inserted and held by the enclosure 11 by the enclosure 11, so that the connector terminals and plate connector terminals 2a of the electrical member 4 are resiliently contacted with the upper resilient contact members 13 and the electrical part 4 and the circuit board 2 are electrically connected to each other.

However, in the conventional process of final assembly of an electrical component, such as a cellphone, by installing a housing connector for mounting the electrical component by integrating the housing and instrument housing at the same time, the entire instrument connector will float due to the resilient elastic contact portions of the contacts. Given the problems inherent in such a structure, since it is necessary to provide two steps for installing the protective cover and inserting the instrument socket into the body, the problem is that the routing increases and the work becomes complicated.

SUMMARY OF THE INVENTION In the light of the above-mentioned conventional method, the present invention,. : It is an object of the invention to provide an instrument for mounting an electrical component. a socket capable of connecting an electrical component such as a semiconductor device to a *. easily and easily to the circuit board.

In order to solve the above problem, the invention is characterized in that it has the following arrangement.

: Feature 1. A device socket for mounting an electrical component, comprising: a terminal block formed on a circuit board; · * · .. the body of the socket holding the contact; . * ··. 30 a conductive sheath that surrounds the instrument socket body and is secured to the circuit board; • * * a location for the electrical part into which the electrical part can be inserted; and a contact that includes an electrical component housing section on the inside of the outer T,. ··· of the elastic contact of the projecting portion and the plate-side contact part, which is formed ···.. 35 been integrally with the resilient contact portion T · * · * 3 117 917 wherein the electrical component is not inserted in the electrical component housing section, the plate-side contact part is separated from the terminal portion, wherein, when the electric part is inserted into the electronic component housing section, electric part deforms the elastic contact parts of the circuit board, so that plate-side touch-reinforcing member 5 is urged toward the circuit board, so that it is connected to the terminal portion.

Feature 2. The unit socket according to feature 1, wherein the fixed contact includes a plate portion attached to the socket body, the resilient contact portion formed by folding a flat plate member, and the plate-side contact portion formed integrally with the bending elastic pressing part merganser and its distal end projecting from the fixed plate of the bottom surface.

Feature 3. The unit socket according to feature 2, wherein the contact includes a projection window, a fixed plate member substantially in the center, and the distal end of the plate-side contact member passes through the projection window 15 and protrudes from the fixed plate portion towards the bottom side.

BRIEF DESCRIPTION OF THE DRAWINGS

Fig. 1 is a sectional view showing the operating state of a device socket for mounting an electrical component according to the present invention.

Figure 2A is a plan view showing the contact of Figure 1.

Figure 2B is a bottom plan view of the contact of Figure 1.

Fig. 2C is a vertical sectional view showing the contact of Fig. 1.

• · ·! Fig. 3A is a plan view showing the body of the socket of Fig. 1. f; Fig. 3B is a bottom plan view of the device receptacle body of Fig. 1.

Fig. 3C is a side view of the housing of the socket of Fig. 1.

* · · · · * * Figure 4 is a plan view showing a developmental state of the pattern envelope.

• · ·. 1: Figure 5A is a plan view showing the protective cover.

* · ·

Figure 5B is a bottom plan view of the protective cover.

Figure 5C is a side view showing the protective cover.

· * · “Figure 6 is a sectional view showing the protective cover.

. * · *. Fig. 7 is a sectional view showing a state in which the electrical part is not mounted on the socket for mounting the electrical part according to the present invention.

* * *

Fig. 8 is an exploded perspective view showing one example of the use of a conventional instrument connector for mounting an electrical component. **. 35 workspaces.

• · • · · 4 117917

Fig. 9 is a sectional view showing a conventional instrument receptacle for mounting an electrical component.

Fig. 10 is a plan view showing a circuit board.

Fig. 11 is an exploded perspective view showing another example of a conventional instrument socket for mounting an electrical component.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

One embodiment of a device socket for mounting an electrical part according to the present invention will be described with reference to the drawings.

Figure 1 illustrates the operating state of a device socket for mounting an electrical part according to the present invention. Reference numeral 20 denotes a device socket for mounting an electrical component, reference numeral 2 denotes a circuit board and reference numeral 4 denotes an electrical component such as a semiconductor device (camera module).

As in the conventional way shown in Fig. 10, the circuit belt 2 is provided with connector terminals 2a formed by a printed wiring and fastening patterns 2b formed by a printed wiring surrounding the terminals 2a.

The instrument socket 20 is provided with contacts 21 which are connected to the terminals of the circuit board 20, the instrument socket body 22 for holding the contacts 21, and *. : with a protective cover 23 to encircle the periphery of the instrument receptacle body 22. The electrical part * 24 of the electrical part 4 into which the electrical part 4 is inserted is formed in the socket *; * | 20, and the base portion of the electrical component insertion portion is defined by a portion of the socket body 22, surrounded by a protective cover 23.

The device socket 20 is configured so that the electrical part 4 is electrically ·· ·: * connected to the circuit board 2 by contacts 22 by inserting and holding the electrical part 4 in the positioning part of the electrical part.

As shown in Fig. 2, each contact 21 includes a fixed le-· · · ·. the elastic contact *, ··· of the lug 25, which is attached to the housing receptacle body 22. 30, formed by folding the solid plate portion 25 on the upper side, and the plate-side contact portion 27 formed integrally with the elastic contact portion 26 and its distal end 27a extending to the bottom surface of the solid plate portion 25. The resilient contact portion 26 has elasticity.

Annex to the resilient contact part 25, and the plate-side contact portion 27 is. ···. Elasticity with respect to elastic contact member 26.

• * • * · 5 117917

The projection window 20 is formed in the fixed plate portion 25 substantially in the central portion and the plate-side contact portion 27 passes through the projection window 28 and a plate extends from the switching portion 25 of the bottom surface side. projecting the number of plate-side contact portion of the bottom surface side is defined so that the contact portion 5 27a at the distal end of the non-contacting state of the terminal portion 2a with SA, the unit socket 20 is mounted on the circuit board 2, in other words, when the protective shell 23 is fixed to the circuit board 2.

Each contact 21 is formed so that the protruding plate side of the distal end of the contact portion (contact portion 27a) has been transferred to the lateral direction of the mouth 10 of the elastic contact portion 26 of elastic deformation in connection with the depressing direction.

As shown in Fig. 3, the instrument connector 22 is formed in the form of a flat rectangular parallelepiped made of synthetic resin and is provided on opposite sides with contact holder portions 29 to which contacts 2 are inserted, opening onto opposite sides of the instrument connector body.

Each contact holder portion 29 is formed by coupling grooves 30 on opposite inner sides. The contacts 21 are held by the housing receptacle body 22 by engaging the opposite sides of the plate engaging portion of the contact 21 by a plunger 30 of the coupling 20 and engaging the terminal projections 25a projecting from the opposite sides of the plate engaging portion, respectively. j. ·. : Each contact holder portion 29 includes a resilient contact portion float ·. | For konemista syvennysleikkausuran 31, which opens the socket frame * · J • direction of the body 22, the upper surface of the page, and the plate-side contact portion to expose ** * 25 of the recessed slot portion 32, which opens the socket body ····· | / 22 in the direction of the lower surface. The elastic contact member 26 protrudes from the recess * ·: of the slit member 31. i ·· *

The sheath 23 is formed by forming and folding a thin plate member made of a conductive member as shown in Fig. 4 so that the peripheral walls 34 are raised from the four sides of the rectangular base member 33, ♦ *** as shown in Figs. 5 and 6.

· · ·

The bottom plate 33 is provided with paljastusikkunoilla 35, and the contacts * · *; * // plate-side contact portions 27 may protrude beyond the detection window 35, respectively.

* ··· * The base plate part 33 is provided with cut-out mounted pieces 36 which are ·: ··· 35 mounted vertically, and the instrument socket body 22 is mounted in a protective cover ***. reel 23 by placing the cut assembled pieces as a compression fitting to the machine: • · *; y- '6 117917 to the mounting holes formed in the socket body 22. The base plate portion 33 is provided with mounting members 37 which project to the underside (plate side) along the edges of the backscatter windows 35 and are soldered to the circuit board mounting template 2b.

Each circumferential wall 34 is resiliently pivotable about a base defined by its bottom end portion 5, i.e., the boundary between the peripheral wall and the bottom panel portion 33, and is provided with a mounting recess portion 38 at its lower end.

The electrical component insertion portion 24 has a bottom portion defined by a device receptacle body 22 mounted on the shielding enclosure 23 and is surrounded by the peripheral walls 34 of the protective enclosure. The elastic contact portions 26 of the contacts extend from the interior of the electrical component insertion portion 24.

The electrical part 4, such as a semiconductor device, is inserted into the electrical part insertion part 24 by elastically expanding the peripheral walls 34 of the shield, and the electrical part insertion part 24 holds the electrical part 4 held by the peripheral walls 34 in a state

As shown in Figure 7, the electrical unit socket is not part 4 contacts the plate-side contact portions 27a are in non-contacting state of the circuit board terminal portion 2a, that is to say, the plate-side contact portion turned back contact portions of the socket 20 on the bottom surface. On the other hand, as shown in Fig. 1, the electrical part 4 is inserted into the electrical part insertion part 24, the resilient contact portions 26 being pressed by the electrical part 4 into such a condition that the resilient contact parts 26 are brought into contact with the electrical part 4. with paosien, and this in connection with the plate-side contact parts 27 are forced »· · * I protrude from the circuit board components to a 27 per direction, so that the kauemmissa • * · **. *; The end contact portions 27a are pressed into and electrically connected to the circuit board connector terminals.

·· ·: The method for installing the electrical component 4, such as a semiconductor device, using the aforementioned instrument connector 20 for mounting the electrical component will now be described.

30 First, the solder paste is applied to the circuit board mounting patterns 2b, and then the instrument connector 20 is placed on the circuit board 2 so that the protective cover • · ·. ·. fastening models 37 with the positions of the fastening model 2b.

• · · During this time, because the plate-side contact portions 27a of the contact parts are in non-contacting state with the printed circuit board terminal portions, in other words * ·, ··; 35 plate-side contact part contacting portions 27a of the socket 20 turned back bottom, * · «* · • · • · · 117,917 ..7.

From this, the contacts 21 do not interfere with the circuit board 2, so that the instrument socket never floats and a permanent installation space can be realized.

By performing heat treatment, the sheath mountings are secured to the circuit board mounting patterns 2b by solder, thereby securing the device socket 20 to the circuit board 2.

Next, the electrical part 4 is inserted into the electrical part insertion part 24.

During this time, the electrical member 4 is inserted while extending the peripheral walls 34 of the shield and is held in place by the effect of the resiliency of the peripheral walls 34 when the base member 4a of the electrical member 4 is coupled to the engaging groove portions 38.

Injecting electric part 4 of the electrical component placement portion 24 in elastic contact portions 26 which extend from the electrical component placement section 24 is brought into contact with the electrical component four terminal portions and is compressed, and the distal end of the page at 26 in connection with the elastic contact parts of the movement 15 of the plate-side contact parts 27 are forced towards the circuit board to the protrusion direction.

When the electrical part 4 is held electronic component placement portion 24, as shown in Figure 1, the plate-side contact portions contact portions 27a are in contact with a suitable contact pressure of the circuit board 2 of the terminal parts 2a and 2, the electric part 4 20 is electrically connected to the circuit board to that of the contacts 21.

Thus, the installation function of the electrical part 4 on the circuit board 2 is completed. :.

···. ·. ί As explained above, according to the invention, the contactor and circuit · · * | in the plate non-touching state is maintained when the electric part is not pistetty- ** "25 as in, correctly printed circuit board liitosnapaosa touch the contacts in response to an electrical • · · · · \ / köosan in injecting function:.!. * The plate-side contact portion of the distal end extends properly toward the bottom; • * ·, which is verified by the projection window substantially at the center of the solid plate connector, thereby reducing the wasted space, thus reducing the size of the instrument socket for mounting the electrical component.

• · ·:: Ί ··· t •: s • · • · · · · '·:. · * • * • · · · · · · · · · · · · · · · · · · · · · · · • · ϊκ

Claims (3)

Apparatus inlet for mounting an electrical component comprising: a connector coil portion (2a) formed on a circuit board (2); an apparatus intake body (22) for retaining a contact (21); a conductive protective shell (23) surrounding the device input body (22) and fixed to the circuit board (2) and a positioning member (24) of the electrical component into which an electrical component (4) may be inserted, characterized by a contact (21) which contains an elastic contact portion (26) which projects to the inside of the positioning portion of the electrical component (24), and a contact portion (27) on the short side which is integrally formed with the elastic contact portion (26), wherein the contact portion (27) on the short side is separated from the connector pole (2a) when the electrical component (4) is not inserted into the location part (24) of the electrical component, the electrical component (4) deforming the elastic contact part (4). 26) toward the circuit board (2), when the electrical component (4) is inserted into the location portion (24) of the electrical component, such that on the short side the contact portion (27) is forced against the circuit board (2) so that it is connected to the terminal. inductor portions (2a). • · Device inlet according to claim 1, characterized by the abutment contact (21) contains a fixed card part (25) attached to the device inlet body (22), the: /: elastic contact part (26) formed by folding the the fixed card portion 25 (25) and the contact portion (27) on the short side formed integrally by folding: <with the flexible contact portion (26), the distal end thereof projecting to a * 1. bottom surface of the fixed card part (25). Device inlet according to claim 2, characterized in that the contact (21) contains a window (28) for a projection substantially in the middle of the fixed card part (25) and the distal end of the contact part (27). ) on the short side * ♦ * · "1 passes through the window (28) for the projection and protrudes toward a bottom side: /: of the fixed card portion (25). * · 1 • · • · • · · * 1 • · · * ·