JPH1079574A - Electronic component and its manufacturing method - Google Patents
Electronic component and its manufacturing methodInfo
- Publication number
- JPH1079574A JPH1079574A JP25378196A JP25378196A JPH1079574A JP H1079574 A JPH1079574 A JP H1079574A JP 25378196 A JP25378196 A JP 25378196A JP 25378196 A JP25378196 A JP 25378196A JP H1079574 A JPH1079574 A JP H1079574A
- Authority
- JP
- Japan
- Prior art keywords
- terminal
- hole
- pad
- flange portion
- pad portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/306—Lead-in-hole components, e.g. affixing or retention before soldering, spacing means
- H05K3/308—Adaptations of leads
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】この発明は、ピン状の端子を
有する圧力センサやＩＣ基板等の電子素子とその製造方
法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic device such as a pressure sensor or an IC substrate having a pin-shaped terminal and a method of manufacturing the same.
【０００２】[0002]
【従来の技術】従来、ピン状の端子を有する電子素子と
して、半導体圧力センサがある。従来の半導体圧力セン
サは、シリコン製のセンサチップを内蔵したセンサケー
スを有している。センサチップには、エッチングにより
部分的に厚さ数ミクロンにされたシリコンダイヤフラム
が形成され、このシリコンダイヤフラム上に、機械的歪
により抵抗値の変化する半導体抵抗が形成されている。
センサケースには圧力導入筒が形成され、増幅回路等の
電気回路が形成されたプリント基板が取り付けられ、こ
のプリント基板には、入出力端子が設けられている。そ
して、収容部材であるハウジングには大気圧導入部が形
成され、センサケースは大気圧導入部に気密状態に取り
付けられてハウジングに収容され、合成樹脂により埋設
されている。2. Description of the Related Art Conventionally, there is a semiconductor pressure sensor as an electronic element having a pin-shaped terminal. A conventional semiconductor pressure sensor has a sensor case with a built-in silicon sensor chip. On the sensor chip, a silicon diaphragm partially formed to a thickness of several microns by etching is formed, and a semiconductor resistor whose resistance value changes due to mechanical strain is formed on the silicon diaphragm.
A pressure introducing cylinder is formed in the sensor case, and a printed board on which an electric circuit such as an amplifier circuit is formed is attached. The printed board is provided with input / output terminals. An atmospheric pressure introducing portion is formed in the housing which is a housing member, and the sensor case is attached to the atmospheric pressure introducing portion in an airtight state, is housed in the housing, and is embedded with a synthetic resin.
【０００３】プリント基板に設けられた入出力端子は、
プリント基板上の電気回路及びシリコン基板上の抵抗に
電源を供給するための電源端子、抵抗値の変化を増幅し
て出力するための出力端子、及びグランド端子である。An input / output terminal provided on a printed circuit board has
A power supply terminal for supplying power to an electric circuit on the printed circuit board and a resistor on the silicon substrate; an output terminal for amplifying and outputting a change in resistance value; and a ground terminal.
【０００４】従来の入出力端子１は、図３に示すように
その一端に入出力端子１と直角にフランジ部２が全周面
に形成されている。また、プリント基板３の所定位置に
は端子挿通口である透孔４が設けられ、透孔４の周囲に
は回路に接続したパッド部６が印刷形成されている。そ
して、透孔４に入出力端子１の一端が挿通され、フラン
ジ部２はパッド部６表面に当接され、互いにハンダ５で
固定されている。As shown in FIG. 3, the conventional input / output terminal 1 has a flange 2 formed on one end thereof at right angles to the input / output terminal 1 on the entire peripheral surface. At a predetermined position of the printed circuit board 3, a through hole 4 serving as a terminal insertion hole is provided, and around the through hole 4, a pad portion 6 connected to a circuit is formed by printing. One end of the input / output terminal 1 is inserted into the through hole 4, and the flange 2 is in contact with the surface of the pad 6 and is fixed to each other by the solder 5.
【０００５】[0005]
【発明が解決しようとする課題】上記従来の技術の場
合、入出力端子１とパッド部６との接合部分は、フラン
ジ部２の偏平な接合端面を、パッド部６の平らな表面に
ハンダ付けしているので、ハンダ付け面積が小さく接着
強度も弱く、接続不良が発生しやすいものであった。In the case of the above-mentioned conventional technique, the flat joint end face of the flange 2 is soldered to the flat surface of the pad 6 at the joint between the input / output terminal 1 and the pad 6. Therefore, the soldering area was small and the bonding strength was weak, and poor connection was likely to occur.
【０００６】この発明は、上記従来の技術の問題点に鑑
みてなされたもので、入出力用の端子と基板との接合強
度が高く、作業効率も良い電子素子とその製造方法を提
供することを目的とする。SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems of the prior art, and provides an electronic element having a high bonding strength between an input / output terminal and a substrate and a high working efficiency, and a method of manufacturing the same. With the goal.
【０００７】[0007]
【課題を解決するための手段】この発明は、一端付近に
フランジ部が設けられた棒状の端子と、上記端子が挿通
される透孔が形成された基板と、この透孔の周囲からこ
の透孔内の周面の少なくとも一部にかけて連続して形成
されたパッド部が設けられ、上記フランジ部の裏面とこ
のフランジ部の裏面側から突出する上記端子端部の側面
の一部とが上記パッド部にハンダ付けされている電子素
子である。According to the present invention, there is provided a rod-shaped terminal provided with a flange portion near one end, a substrate having a through-hole through which the terminal is inserted, and a through-hole formed around the through-hole. A pad formed continuously over at least a part of a peripheral surface in the hole is provided, and a back surface of the flange portion and a part of a side surface of the terminal end protruding from a back surface side of the flange portion are provided on the pad. It is an electronic element soldered to the part.
【０００８】また、この発明は、上記基板の透孔の周囲
からこの透孔内の周面の少なくとも一部にかけて連続し
てパッド部を形成し、上記パッド部にクリームハンダを
付け、上記フランジ部の裏面側から突出する上記端子端
部を上記透孔内に挿入し、上記パッド部に上記フランジ
部を当接させて、上記基板とともにリフロー炉を通過さ
せて上記端子のハンダ付けを行なう電素子の製造方法で
ある。Further, according to the present invention, a pad portion is continuously formed from the periphery of the through hole of the substrate to at least a part of a peripheral surface in the through hole, cream solder is attached to the pad portion, and the flange portion is formed. An electronic element for soldering the terminal by inserting the terminal end protruding from the rear surface side of the terminal into the through hole, bringing the flange portion into contact with the pad portion, and passing the terminal through the reflow furnace together with the substrate; It is a manufacturing method of.
【０００９】この発明の電子素子は、端子をハンダ付け
するパッド部が、基板の透孔の周囲から透孔内の周面の
少なくとも一部に連続して形成されているため、入出力
端子とのハンダ付け面積が平面及び垂直方向に広くな
り、パッド部と入出力端子を強固に接着することができ
る。In the electronic device according to the present invention, since the pad portion for soldering the terminal is formed continuously from the periphery of the through hole of the substrate to at least a part of the peripheral surface in the through hole, the input / output terminal and the pad are formed. The soldering area of the pad portion increases in the plane and vertical directions, and the pad portion and the input / output terminal can be firmly bonded.
【００１０】[0010]
【発明の実施の形態】以下、この発明の実施の形態につ
いて、図面に基づいて説明する。図１、図２はこの発明
の一実施形態を示すもので、この実施形態の電子素子は
圧力センサの基板と端子についてののものである。この
圧力センサは、シリコン製のセンサチップを内蔵したセ
ンサケース１０を有し、センサチップには、エッチング
により部分的に厚さ数ミクロンにされたシリコンダイヤ
ラムが形成され、このシリコンダイヤフラム上に機械的
歪により抵抗値の変化する半導体抵抗が形成されてい
る。センサケース１０は、ＰＰＳ樹脂などの耐熱性のあ
る樹脂で形成されており、端子用リードフレーム１１が
インサート成形により設けられている。端子用リードフ
レーム１１の基端部と半導体抵抗との間には、図示しな
い金線がボンディングされている。そして、センサケー
ス１０には金属製の圧力導入筒１２が形成され、増幅回
路等の電気回路が形成されたプリント基板１４に端子用
リードフレーム１１が表面実装されている。Embodiments of the present invention will be described below with reference to the drawings. FIGS. 1 and 2 show an embodiment of the present invention. The electronic element of this embodiment relates to a substrate and terminals of a pressure sensor. This pressure sensor has a sensor case 10 in which a silicon sensor chip is built. The sensor chip is formed with a silicon diaphragm partially etched to a thickness of several microns by etching. A semiconductor resistor whose resistance value changes due to mechanical strain is formed. The sensor case 10 is formed of a heat-resistant resin such as a PPS resin, and a terminal lead frame 11 is provided by insert molding. A gold wire (not shown) is bonded between the base end of the terminal lead frame 11 and the semiconductor resistor. A metal pressure introducing cylinder 12 is formed in the sensor case 10, and a terminal lead frame 11 is surface-mounted on a printed circuit board 14 on which an electric circuit such as an amplifier circuit is formed.
【００１１】プリント基板１４には入出力端子１６が設
けられ、入出力端子１６の一端部付近に入出力端子１６
と直角にフランジ部１８が全周に形成されている。そし
てプリント基板１４の側縁近傍の所定位置には透孔２０
が設けられ、透孔２０の周囲から透孔２０の内周面の一
部に、連続して銀等の導電性塗料によるパット部２２が
印刷されている。透孔２０には入出力端子１６のフラン
ジ部１８裏面側の端部が挿通され、フランジ部１８の裏
面がパッド部２２表面に当接している。そして、フラン
ジ部１８の裏面と、フランジ部１８の裏面側に突出して
いる入出力端子１６の側面が、連続してプリント基板１
４の表面から透孔２０内のパッド部２２にかけて、ハン
ダ２４によりハンダ付けさ固定されている。An input / output terminal 16 is provided on the printed circuit board 14, and the input / output terminal 16 is provided near one end of the input / output terminal 16.
At right angles, a flange portion 18 is formed all around. A through hole 20 is provided at a predetermined position near the side edge of the printed circuit board 14.
And a pad portion 22 made of a conductive paint such as silver is printed continuously from the periphery of the through hole 20 to a part of the inner peripheral surface of the through hole 20. The end of the input / output terminal 16 on the back side of the flange portion 18 is inserted into the through hole 20, and the back surface of the flange portion 18 is in contact with the surface of the pad portion 22. Then, the back surface of the flange portion 18 and the side surface of the input / output terminal 16 projecting from the back surface side of the flange portion 18 are continuously connected to the printed circuit board 1.
4 from the surface to the pad portion 22 in the through hole 20, and is fixed by soldering with solder 24.
【００１２】センサケース１０及びプリント基板１４
は、ＰＢＴ樹脂等を成形した収容部材である図示しない
ハウジングに収容される。ハウジングには大気圧導入部
と端子挿通口が形成され、センサケース１０はこの大気
圧導入部に気密状態に取り付られ、入出力端子１６は端
子挿通口に挿通されてハウジングに収容される。そして
ハウジング内はシリコン系樹脂等の充填剤で充填され、
圧力導入筒１２が突出した状態に形成されている。Sensor case 10 and printed circuit board 14
Are housed in a housing (not shown), which is a housing member formed of PBT resin or the like. An atmospheric pressure introduction part and a terminal insertion port are formed in the housing, the sensor case 10 is attached to the atmospheric pressure introduction part in an airtight state, and the input / output terminal 16 is inserted into the terminal insertion port and housed in the housing. And the inside of the housing is filled with a filler such as silicone resin,
The pressure introducing cylinder 12 is formed in a protruding state.
【００１３】また、入出力端子１６は、プリント基板１
４上の電気回路及びシリコン基板上の抵抗に電源を供給
するための電源端子、抵抗値の変化を増幅して出力する
ための出力端子及びグランド端子等からなる。The input / output terminal 16 is connected to the printed circuit board 1.
4 includes a power supply terminal for supplying power to the electric circuit and the resistor on the silicon substrate, an output terminal for amplifying and outputting a change in resistance value, a ground terminal, and the like.
【００１４】この実施形態の圧力センサのプリント基板
１４と入出力端子１６の接続方法は、プリント基板１４
の所定位置に回路パターン及びパッド部２２を印刷形成
する。このとき、透孔２０から負圧をかけて、導電性塗
料を透孔２０内へ吸引する。これにより、透孔２０の周
囲からこの透孔２０内の周面の少なくとも一部にかけて
連続してパッド部２２が形成される。この後、パッド部
２２にクリームハンダを付け、入出力端子１６のフラン
ジ部１８の裏面側から突出する端子端部を透孔２０内に
挿入し、パッド部２２にフランジ部１８を当接させて位
置決めする。そして、プリント基板１４とともに図示し
ないリフロー炉を通過させて、入出力端子１６のハンダ
付けを行なうものである。The connection method between the printed circuit board 14 and the input / output terminals 16 of the pressure sensor of this embodiment
The circuit pattern and the pad portion 22 are formed by printing at predetermined positions. At this time, a negative pressure is applied from the through hole 20 to suck the conductive paint into the through hole 20. Thus, the pad portion 22 is formed continuously from the periphery of the through hole 20 to at least a part of the peripheral surface in the through hole 20. Thereafter, cream solder is attached to the pad portion 22, a terminal end protruding from the back surface side of the flange portion 18 of the input / output terminal 16 is inserted into the through hole 20, and the flange portion 18 is brought into contact with the pad portion 22. Position. Then, the input / output terminals 16 are soldered by passing through a reflow furnace (not shown) together with the printed circuit board 14.
【００１５】この実施形態の圧力センサによれば、パッ
ド部２２が透孔２０の周囲から透孔２０の内周面の一部
に連続して印刷されているため、フランジ部１８裏面側
に突出する入出力端子１６側面までハンダ付け面積が広
がり、パッド部２２と入出力端子１６を確実に接着する
ことができ、入出力端子１６とプリント基板１４との接
合強度が高くなる。また、パッド部２２と入出力端子１
６のハンダ付けはリフローハンダ付け方法で行なわれる
ため、作業性が良く生産性が高いものである。According to the pressure sensor of this embodiment, since the pad portion 22 is printed continuously from the periphery of the through hole 20 to a part of the inner peripheral surface of the through hole 20, the pad portion 22 protrudes from the back surface of the flange portion 18. Thus, the soldering area extends to the side surface of the input / output terminal 16, and the pad portion 22 and the input / output terminal 16 can be securely bonded to each other, and the bonding strength between the input / output terminal 16 and the printed board 14 increases. The pad section 22 and the input / output terminal 1
Since the soldering of No. 6 is performed by the reflow soldering method, the workability is good and the productivity is high.
【００１６】なお、この発明の電子素子は圧力センサに
限らず、ピン状の端子を有したＩＣ基板や、センサ等上
記実施の形態に限定されるものではなく、各部材の形状
や位置、また素材等も適宜変更可能である。The electronic element of the present invention is not limited to a pressure sensor, but is not limited to an IC board having a pin-shaped terminal or a sensor such as a sensor. The material and the like can be appropriately changed.
【００１７】[0017]
【発明の効果】この発明の電子素子は、入出力端子と基
板の取り付け強度が高く、安全性、信頼性が高いもので
ある。また取り付けの作業も簡単で生産性も高いもので
ある。The electronic element of the present invention has a high attachment strength between the input / output terminal and the substrate, and has high safety and reliability. The installation work is simple and the productivity is high.
【図１】この発明の電子素子の一実施形態の端子素子付
部の拡大断面図である。FIG. 1 is an enlarged cross-sectional view of a terminal element attaching portion of an embodiment of an electronic element of the present invention.
【図２】この一実施形態の圧力センサの縦断面図であ
る。FIG. 2 is a longitudinal sectional view of the pressure sensor of the embodiment.
【図３】従来の電子素子の端子取付部の拡大断面図であ
る。FIG. 3 is an enlarged sectional view of a terminal mounting portion of a conventional electronic element.
１０ センサケース １２ 圧力導入筒 １４ プリント基板 １６ 入出力端子 １８ フランジ部 ２０ 透孔 ２２ パッド部 ２４ ハンダ DESCRIPTION OF SYMBOLS 10 Sensor case 12 Pressure introduction cylinder 14 Printed circuit board 16 Input / output terminal 18 Flange part 20 Through hole 22 Pad part 24 Solder
Claims (2)
状の端子と、上記端子が挿通される透孔が形成された基
板と、この透孔の周囲からこの透孔内の周面の少なくと
も一部にかけて連続して形成されたパッド部が設けら
れ、上記フランジ部の裏面とこのフランジ部の裏面側か
ら突出する上記端子端部の側面の一部とが上記パッド部
にハンダ付けされていることを特徴とする電子素子。1. A rod-shaped terminal provided with a flange portion near one end, a substrate having a through hole through which the terminal is inserted, and at least one of a peripheral surface in the through hole from the periphery of the through hole. A pad portion formed continuously over the portion is provided, and a back surface of the flange portion and a part of a side surface of the terminal end protruding from the back surface side of the flange portion are soldered to the pad portion. Electronic device characterized by the above-mentioned.
状の端子と、上記端子が挿通される透孔が形成された基
板とを有し、この透孔の周囲からこの透孔内の周面の少
なくとも一部にかけて連続してパッド部を形成し、上記
パッド部にクリームハンダを付け、上記フランジ部の裏
面側から突出する上記端子端部を上記透孔内に挿入し、
上記パッド部に上記フランジ部を当接させて、上記基板
とともにリフロー炉を通過させて上記端子のハンダ付け
を行なうことを特徴とする電子素子の製造方法。2. A terminal having a rod-like shape provided with a flange portion near one end thereof, and a substrate having a through hole through which the terminal is inserted, and a peripheral surface in the through hole from the periphery of the through hole. A pad portion is continuously formed over at least a part of the pad portion, cream solder is attached to the pad portion, and the terminal end projecting from the rear surface side of the flange portion is inserted into the through-hole,
A method for manufacturing an electronic element, comprising: bringing the flange portion into contact with the pad portion; and passing the terminal through the reflow furnace together with the substrate to perform soldering of the terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25378196A JPH1079574A (en) | 1996-09-04 | 1996-09-04 | Electronic component and its manufacturing method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP25378196A JPH1079574A (en) | 1996-09-04 | 1996-09-04 | Electronic component and its manufacturing method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH1079574A true JPH1079574A (en) | 1998-03-24 |
Family
ID=17256068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP25378196A Pending JPH1079574A (en) | 1996-09-04 | 1996-09-04 | Electronic component and its manufacturing method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1079574A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007059481A (en) * | 2005-08-22 | 2007-03-08 | Densei Lambda Kk | Terminal pin and power supply device using the same |
-
1996
- 1996-09-04 JP JP25378196A patent/JPH1079574A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007059481A (en) * | 2005-08-22 | 2007-03-08 | Densei Lambda Kk | Terminal pin and power supply device using the same |
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