JPH1075029A - Connecting structure of flexible printed board - Google Patents

Connecting structure of flexible printed board

Info

Publication number
JPH1075029A
JPH1075029A JP22830996A JP22830996A JPH1075029A JP H1075029 A JPH1075029 A JP H1075029A JP 22830996 A JP22830996 A JP 22830996A JP 22830996 A JP22830996 A JP 22830996A JP H1075029 A JPH1075029 A JP H1075029A
Authority
JP
Japan
Prior art keywords
flexible printed
circuit board
printed circuit
conductor
cover lay
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP22830996A
Other languages
Japanese (ja)
Inventor
Takuya Matsuda
卓也 松田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sanyo Electric Co Ltd filed Critical Sanyo Electric Co Ltd
Priority to JP22830996A priority Critical patent/JPH1075029A/en
Publication of JPH1075029A publication Critical patent/JPH1075029A/en
Pending legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/36Assembling printed circuits with other printed circuits
    • H05K3/361Assembling flexible printed circuits with other printed circuits
    • H05K3/363Assembling flexible printed circuits with other printed circuits by soldering

Landscapes

  • Combinations Of Printed Boards (AREA)

Abstract

PROBLEM TO BE SOLVED: To provide a connection structure of a flexible printed board, wherein connecting sections of the flexible printed board can be surely connected without being peeled off and, at the same time, electrically connected in nearly an electrically ideal state and thereby the damage to be caused by poor contact or generation of heat can be reduced as much as possible. SOLUTION: A flexible printed board 1 which is made by stacking a conductor 1B on a cover lay 1A is soldered to be electrically connected to a connected section 3. In a connecting section 1C of the flexible printed board 1, the conductors 1B are adhered to both faces of the cover lay 1A. The conductors 1B on both faces of the cover lay 1A are soldered to be electrically connected to the connected section 3. Preferably, a through-hole 4a is formed in the connecting section 1C of the flexible printed board 1. Solder enters the through- hole 4 and connects the conductors 1B on both faces of the cover lay 1A to the connected section 3.

Description

【発明の詳細な説明】DETAILED DESCRIPTION OF THE INVENTION

【0001】[0001]

【発明の属する技術分野】本発明は、フレキシブルプリ
ント基板を、硬質のフレキシブルプリント基板等の被連
結部に半田付けして連結する構造に関する。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure for connecting a flexible printed circuit board to a connected portion such as a hard flexible printed circuit board by soldering.

【0002】[0002]

【従来の技術】フレキシブルプリント基板は、自由に変
形できるので、ケース内の隙間に便利に収納できる。フ
レキシブルプリント基板は、プラスチック製のカバーレ
イに導体を接着、積層して製造される。この構造のフレ
キシブルプリント基板は、たとえば、図1の斜視図に示
すように、電子部品を装着する硬いプリント基板2等に
接続して使用される。硬いプリント基板2には電子回路
が装着され、フレキシブルプリント基板1はリード線と
して使用される。フレキシブルプリント基板1をリード
線に使用してケース6に内蔵させると、多数のリード線
を能率よく処理できる。さらに、図に示すように、コネ
クター5でフレキシブルプリント基板1を、プリント基
板2に連結すると、多数の複雑な配線をさらに能率よく
処理できる。ただ、コネクター5は、大電流が流れる部
分の電気接続には使用できない。半田付けに比較して接
触抵抗が大きくなるので、大電流を流すと発熱して損傷
され、あるいは、接触不良の原因となるからである。こ
のため、小電流の接続にコネクターを使用して、大電流
の接続は半田付けして接続する必要がある。
2. Description of the Related Art A flexible printed circuit board can be freely deformed and can be conveniently stored in a gap in a case. The flexible printed circuit board is manufactured by bonding and laminating a conductor to a coverlay made of plastic. The flexible printed circuit board having this structure is used, for example, by connecting to a hard printed circuit board 2 on which electronic components are mounted, as shown in the perspective view of FIG. An electronic circuit is mounted on the hard printed board 2, and the flexible printed board 1 is used as a lead wire. When the flexible printed circuit board 1 is used as a lead wire and is built in the case 6, a large number of lead wires can be efficiently processed. Further, as shown in the figure, when the flexible printed circuit board 1 is connected to the printed circuit board 2 by the connector 5, a large number of complicated wirings can be processed more efficiently. However, the connector 5 cannot be used for electrical connection of a portion where a large current flows. This is because the contact resistance is larger than that of soldering, and if a large current is applied, it is heated and damaged or a contact failure occurs. For this reason, it is necessary to use a connector for the connection of the small current and to connect the connection of the large current by soldering.

【0003】フレキシブルプリント基板の連結部が、プ
リント基板の被連結部に半田付けされる部分の断面図を
図2に示す。この図に示すように、フレキシブルプリン
ト基板1は、カバーレイ1Aをプリント基板2の被連結
部3の表面に積層し、カバーレイ1Aの上面に表出する
導体1Bを半田付けして被連結部3に電気接続してい
る。
FIG. 2 is a sectional view of a portion where a connecting portion of a flexible printed circuit board is soldered to a connected portion of the printed circuit board. As shown in this figure, the flexible printed circuit board 1 has a cover lay 1A laminated on the surface of the connected portion 3 of the printed circuit board 2, and a conductor 1B exposed on the upper surface of the cover lay 1A is soldered. 3 is electrically connected.

【0004】[0004]

【発明が解決しようとする課題】図2に示すフレキシブ
ルプリント基板の連結構造は、プリント基板2の被連結
部3とフレキシブルプリント基板1の導体1Bとの間に
カバーレイ1Aが介在するので、剥離強度が弱くなる欠
点がある。この弊害を防止するために、半田量を多くし
ているが、この構造では、半田付けする作業時間が長く
なり、また、半田の使用量も多くなる欠点がある。さら
に、半田量を多くしても、導体1Bと被連結部3とが理
想的な状態で半田付けされない、いいかえると、局部的
に半田に接続されて全面が半田に密着されないと、大電
流を流すときにジュール熱で発熱する弊害が発生する。
導体1Bと被連結部3との接触面積が小さく、導体1B
と被連結部3との間にカバーレイ1Aが介在して、半田
で連結される間隔が広くなるからである。さらに困った
ことに、この状態は、出荷時の検査では正常な状態と判
定されるが、相当な時間使用された後に、連結部が損傷
される等の弊害が発生する。このため、出荷時の検査
で、連結部の接続不良を発見するのが極めて難しい欠点
がある。
In the connection structure of the flexible printed circuit board shown in FIG. 2, the coverlay 1A is interposed between the connected portion 3 of the printed circuit board 2 and the conductor 1B of the flexible printed circuit board 1. There is a disadvantage that the strength is weakened. Although the amount of solder is increased in order to prevent this adverse effect, this structure has disadvantages that the work time for soldering is long and the amount of solder used is large. In addition, even if the amount of solder is increased, the conductor 1B and the connected portion 3 are not soldered in an ideal state. When flowing, there is a problem that heat is generated by Joule heat.
The contact area between the conductor 1B and the connected portion 3 is small, and the conductor 1B
This is because the coverlay 1 </ b> A is interposed between the connection part 3 and the connection part 3, and the space for connection by soldering is widened. To further complicate matters, this condition is determined to be normal by inspection at the time of shipment, but after using the device for a considerable period of time, adverse effects such as damage to the connecting portion occur. For this reason, there is a drawback that it is extremely difficult to find a connection failure of the connecting portion by inspection at the time of shipment.

【0005】本発明は、この欠点を解決することを目的
に開発されたものである。本発明の重要な目的は、フレ
キシブルプリント基板の連結部を確実に剥離しないよう
に連結できると共に、電気的により理想に近い状態で電
気接続されて、接触不良や発熱に起因する損傷等を極減
できるフレキシブルプリント基板の連結構造を提供する
ことにある。
The present invention has been developed to solve this drawback. It is an important object of the present invention that the connection portion of the flexible printed circuit board can be connected so as not to be peeled off, and the connection is made in an electrically more ideal state, thereby minimizing damage due to poor contact and heat generation. An object of the present invention is to provide a flexible printed circuit board connecting structure that can be used.

【0006】[0006]

【課題を解決するための手段】本発明の連結構造は、カ
バーレイ1Aに導体1Bを積層状態で接着してなるフレ
キシブルプリント基板1を、半田付けして被連結部3に
電気接続している。さらに、本発明の連結構造は、被連
結部3に接続されるフレキシブルプリント基板1の連結
部1Cを、カバーレイ1Aの両面に導体1Bを接着して
なる積層構造とし、カバーレイ1A両面の導体1Bを半
田付して被連結部3に電気接続していることを特徴とす
る。
According to the connecting structure of the present invention, a flexible printed circuit board 1 in which a conductor 1B is adhered in a laminated state to a cover lay 1A is soldered and electrically connected to a connected portion 3. . Further, in the connection structure of the present invention, the connection portion 1C of the flexible printed circuit board 1 connected to the connection target portion 3 has a laminated structure in which a conductor 1B is adhered to both surfaces of the cover lay 1A, 1B is electrically connected to the connected portion 3 by soldering.

【0007】さらに、本発明の請求項2に記載するフレ
キシブルプリント基板の連結構造は、カバーレイ1Aの
両面に導体1Bを接着して積層してなる連結部1Cに貫
通孔4を設けている。この貫通孔4に半田を侵入させ
て、カバーレイ1A両面の導体1Bを連結して被連結部
3に接続している。
Further, in the connecting structure for a flexible printed circuit board according to the second aspect of the present invention, a through hole 4 is provided in a connecting portion 1C formed by bonding and laminating a conductor 1B to both surfaces of a cover lay 1A. The solder penetrates into the through-hole 4 to connect the conductors 1B on both surfaces of the cover lay 1A to connect to the connected portion 3.

【0008】[0008]

【発明の実施の形態】以下、本発明の実施例を図面に基
づいて説明する。ただし、以下に示す実施例は、本発明
の技術思想を具体化するためのフレキシブルプリント基
板の連結構造を例示するものであって、本発明は連結構
造を下記の構造に特定しない。
Embodiments of the present invention will be described below with reference to the drawings. However, the embodiments described below exemplify a connecting structure of a flexible printed circuit board for embodying the technical idea of the present invention, and the present invention does not specify the connecting structure to the following structure.

【0009】さらに、この明細書は、特許請求の範囲を
理解しやすいように、実施例に示される部材に対応する
番号を、「特許請求の範囲の欄」、および「課題を解決
するための手段の欄」に示される部材に付記している。
ただ、特許請求の範囲に示される部材を、実施例の部材
に特定するものでは決してない。
Further, in this specification, in order to make it easy to understand the claims, the numbers corresponding to the members shown in the embodiments will be referred to as "claims" and "claims". In the column of “means”.
However, the members described in the claims are not limited to the members of the embodiments.

【0010】図3に示す連結構造は、鎖線の○印で示
す、フレキシブルプリント基板1の2カ所の連結部1C
を、硬質のプリント基板2に半田付けして連結し、1カ
所をコネクター5で連結している。
The connecting structure shown in FIG. 3 has two connecting portions 1C of the flexible printed circuit board 1 indicated by the dashed circles.
Are connected to the hard printed circuit board 2 by soldering, and one portion is connected by a connector 5.

【0011】フレキシブルプリント基板1は、図4に示
すように、カバーレイ1Aに、導体1Bを接着して積層
している。導体1Bは、リード線を構成する形状として
カバーレイ1Aに接着されている。カバーレイ1Aは、
自由に変形できる可撓性のプラスチックフィルムであ
る。このカバーレイ1Aは絶縁層で、導体1Bの両面に
積層されて、導体1B表面を絶縁している。連結部1C
となる導体1Bは、片面にのみカバーレイ1Aを積層し
て、導体1Bの表面を表出させている。
As shown in FIG. 4, the flexible printed circuit board 1 has a conductor 1B bonded and laminated on a cover lay 1A. The conductor 1B is adhered to the cover lay 1A as a shape constituting a lead wire. Coverlay 1A
It is a flexible plastic film that can be freely deformed. The cover lay 1A is an insulating layer, which is laminated on both surfaces of the conductor 1B to insulate the surface of the conductor 1B. Connecting part 1C
In the conductor 1B, the cover lay 1A is laminated only on one surface to expose the surface of the conductor 1B.

【0012】さらに、フレキシブルプリント基板1の連
結部1Cは、導体1Bを被覆するカバーレイ1Aの両面
に導体1Bを接着している。図において、カバーレイ1
Aの上面に接着される導体1Bは、リード線となり、カ
バーレイ1Aの下面に接着される導体1Bは、被連結部
に半田付けして密着される半田付層となる。半田付層と
なる下面の導体1Bは、半田付けされる部分にのみ接着
されるので短い。
Further, the connecting portion 1C of the flexible printed board 1 has the conductor 1B bonded to both surfaces of the cover lay 1A covering the conductor 1B. In the figure, coverlay 1
The conductor 1B adhered to the upper surface of A becomes a lead wire, and the conductor 1B adhered to the lower surface of the cover lay 1A becomes a soldered layer which is soldered to and adhered to the connected portion. The conductor 1B on the lower surface serving as a soldering layer is short because it is adhered only to a portion to be soldered.

【0013】半田付層となる導体1Bの一部をカバーす
るために、さらに、下面にカバーレイ1Aを接着して積
層している。図4に示す最下層のカバーレイ1Aは、右
端で導体1Bの左端を被覆している。半田付層をカバー
する最下層のカバーレイ1Aは、半田付層を剥離しない
ように積層する。
In order to cover a part of the conductor 1B serving as a soldering layer, a coverlay 1A is further adhered and laminated on the lower surface. The lowermost coverlay 1A shown in FIG. 4 covers the left end of the conductor 1B at the right end. The lowermost cover lay 1A covering the soldering layer is laminated so as not to peel off the soldering layer.

【0014】さらに、図4に示すフレキシブルプリント
基板1の連結部1Cは、複数の貫通孔4を開口してい
る。貫通孔4は、両面の導体1Bとカバーレイ1Aとを
貫通して設けられている。
Further, the connecting portion 1C of the flexible printed circuit board 1 shown in FIG. The through-hole 4 is provided to penetrate the conductor 1B and the cover lay 1A on both surfaces.

【0015】図5は、貫通孔4を有する連結部1Cが、
プリント基板2の被連結部3に半田付けして連結される
断面形状を示す。この図に示すように、貫通孔4のある
連結部1Cは、カバーレイ1Aの両面に積層された導体
1Bを半田に密着できることに加えて、貫通孔4に充填
される半田で、連結部1Cの上下に密着される半田を連
結する。貫通孔4で連結される半田は、図の矢印Aで示
すように、連結部1Cの上面に密着される半田を、錨の
ように被連結部3に強固に連結する。したがって、この
連結構造は、導体1Bが広い面積で半田に接着されるこ
とに加えて、貫通孔4の半田が機械的に強固に連結する
特長がある。さらに、半田付けするときに、貫通孔4に
流入する半田が、下面の導体1Bと被連結部3との隙間
に侵入し、下面の導体1Bを確実に被連結部3に半田付
けできる特長も実現する。
FIG. 5 shows that the connecting portion 1C having the through hole 4 is
3 shows a cross-sectional shape that is connected by soldering to a connected portion 3 of a printed circuit board 2. As shown in this figure, the connecting portion 1C having the through-holes 4 is such that the conductors 1B laminated on both surfaces of the cover lay 1A can be brought into close contact with the solder, and in addition, the connecting portions 1C Connect the solder that comes into close contact with the top and bottom. As shown by the arrow A in the drawing, the solder connected through the through-hole 4 firmly connects the solder that is in close contact with the upper surface of the connecting portion 1C to the connected portion 3 like an anchor. Therefore, this connection structure has a feature that the solder in the through hole 4 is mechanically and strongly connected in addition to the fact that the conductor 1B is bonded to the solder over a wide area. Further, when soldering, the solder flowing into the through hole 4 enters the gap between the conductor 1B on the lower surface and the connected portion 3, and the conductor 1B on the lower surface can be securely soldered to the connected portion 3. Realize.

【0016】さらにまた、貫通孔4に侵入する半田は、
被連結部3に垂直に突出して、フレキシブルプリント基
板1が、図の矢印Bで示すように表面と平行な方向に引
っ張られる引張強度も相当に強くする。すなわち、貫通
孔4のある連結部1Cは、引張強度と剥離強度の両方を
向上して被連結部3に連結する。さらに、貫通孔4に充
填される半田は、上面の導体1Bを被連結部3に電気接
続して、より低抵抗な状態で連結部1Cを被連結部3に
電気接続する。
Furthermore, the solder that enters the through hole 4 is
The flexible printed circuit board 1 protruding perpendicularly to the connected portion 3 and being pulled in the direction parallel to the surface as shown by the arrow B in the drawing also considerably increases the tensile strength. That is, the connecting portion 1C having the through hole 4 is connected to the connected portion 3 while improving both the tensile strength and the peel strength. Further, the solder filled in the through hole 4 electrically connects the conductor 1B on the upper surface to the connected portion 3 and electrically connects the connected portion 1C to the connected portion 3 with a lower resistance.

【0017】ただ、本発明のフレキシブルプリント基板
の連結構造は、図6に示すように、貫通孔4のない連結
部1Cを被連結部3に半田付けして連結することもでき
る。この図の連結構造は、カバーレイ1Aの両面に接着
して積層された導体1Bを、半田に密着して電気接続す
る状態に連結する。
However, in the connection structure of the flexible printed circuit board of the present invention, as shown in FIG. 6, the connection portion 1C having no through hole 4 can be connected to the connection target portion 3 by soldering. In the connection structure of this figure, the conductors 1B bonded and laminated on both sides of the cover lay 1A are connected in a state of being in close contact with solder and electrically connected.

【0018】以上の実施例は、フレキシブルプリント基
板を硬いプリント基板の被連結部に連結する具体例を示
す。本発明は、フレキシブルプリント基板の連結部を連
結する被連結部を、硬いプリント基板に特定しない。フ
レキシブルプリント基板の連結部は、プリント基板以外
の被連結部、たとえば、電池の電極等や金属板等、フレ
キシブルプリント基板を半田付けして連結する全ての部
分とすることができる。
The above embodiment shows a specific example in which a flexible printed board is connected to a connected portion of a hard printed board. The present invention does not specify a connected portion that connects the connecting portions of the flexible printed circuit board to a rigid printed circuit board. The connection portion of the flexible printed circuit board may be a connected portion other than the printed circuit board, for example, any part that connects the flexible printed circuit board by soldering, such as a battery electrode or a metal plate.

【0019】[0019]

【発明の効果】本発明の連結構造は、フレキシブルプリ
ント基板の連結部を確実に剥離しないように被連結部に
連結できる特長がある。それは、本発明の連結構造が、
フレキシブルプリント基板の連結部において、カバーレ
イの両面に導体を接着しており、両面の導体が半田付し
て被連結部に連結されるからである。とくに、カバーレ
イの下面に積層される導体は、被連結部に直接に接触す
るのに近い状態で、被連結部に半田付けされる。このた
め、カバーレイ下面の導体と、被連結部との隙間は著し
く狭くなり、溶融されたこの間に流入される半田は、極
めて強固に導体を被連結部に連結する。このことは、カ
バーレイの両面を広い面積で被連結部に半田付けするこ
とと相乗して、フレキシブルプリント基板の連結強度を
著しく向上させる。
The connecting structure of the present invention has a feature that the connecting portion of the flexible printed circuit board can be connected to the connected portion so as not to be peeled off without fail. That is, the connection structure of the present invention
This is because conductors are adhered to both sides of the coverlay at the connecting portion of the flexible printed circuit board, and the conductors on both surfaces are connected to the connected portion by soldering. In particular, the conductor laminated on the lower surface of the coverlay is soldered to the connected portion in a state close to directly contacting the connected portion. For this reason, the gap between the conductor on the lower surface of the coverlay and the portion to be connected is significantly reduced, and the molten solder flowing during this time connects the conductor to the portion to be connected extremely strongly. This synergizes with soldering both sides of the cover lay to the connected portion with a large area, thereby significantly improving the connection strength of the flexible printed circuit board.

【0020】さらに、本発明の連結構造は、フレキシブ
ルプリント基板の連結部を、より理想に近い状態で被連
結部に電気的に接続できる特長も実現される。このた
め、フレキシブルプリント基板と被連結部との接触不良
や発熱に起因する損傷等を極減できる特長がある。この
特長は、フレキシブルプリント基板の連結部を、より広
い面積で被連結部に半田付けできることと、連結部の下
面に積層される導体を被連結部に極めて接近できること
で実現される。カバーレイの両面に積層された導体は、
表裏両面に設けることによって約2倍の面積で半田付け
されて、接触面積を倍増して半田との接触抵抗を極減さ
せる。図5と図6の太線で示す部分が、半田に連結され
る。従来の連結構造は、図2の太線で示すように、狭い
領域が半田に連結される。さらに、本発明の連結構造
は、カバーレイの下面に設けられた導体を、被連結部に
極めて薄い半田層で連結できるので、この半田層が薄く
なって、半田層の電気抵抗を極減できる。これらのこと
が相乗して、本発明の連結構造は、フレキシブルプリン
ト基板と被連結部との接続部の電気抵抗を極減できる特
長がある。
Further, the connection structure of the present invention also realizes a feature that the connection portion of the flexible printed circuit board can be electrically connected to the connection portion in a more ideal state. For this reason, there is a feature that damage due to poor contact between the flexible printed circuit board and the connected portion and heat generation can be minimized. This feature is realized because the connecting portion of the flexible printed circuit board can be soldered to the connected portion with a larger area, and the conductor laminated on the lower surface of the connecting portion can be very close to the connected portion. The conductors laminated on both sides of the coverlay
By providing on both the front and back surfaces, the solder is soldered in about twice the area, and the contact area is doubled to minimize the contact resistance with the solder. 5 and FIG. 6 are connected to the solder. In the conventional connection structure, a narrow area is connected to solder as shown by a thick line in FIG. Furthermore, since the connection structure of the present invention can connect the conductor provided on the lower surface of the coverlay to the connected portion with an extremely thin solder layer, the thickness of the solder layer can be reduced, and the electrical resistance of the solder layer can be extremely reduced. . Together with these, the connection structure of the present invention has a feature that the electric resistance of the connection portion between the flexible printed board and the connected portion can be extremely reduced.

【図面の簡単な説明】[Brief description of the drawings]

【図1】フレキシブルプリント基板を被連結部に連結す
るパック電池の分解斜視図
FIG. 1 is an exploded perspective view of a battery pack for connecting a flexible printed circuit board to a connected portion.

【図2】フレキシブルプリント基板と被連結部との従来
の連結構造を示す断面図
FIG. 2 is a cross-sectional view showing a conventional connection structure between a flexible printed circuit board and a connected portion.

【図3】本発明の実施例の連結構造を示す平面図FIG. 3 is a plan view showing a connection structure according to the embodiment of the present invention.

【図4】本発明の実施例の連結構造に使用されるフレキ
シブルプリント基板の連結部を示す平面図、断面図、底
面図
FIG. 4 is a plan view, a cross-sectional view, and a bottom view showing a connecting portion of a flexible printed circuit board used in the connecting structure according to the embodiment of the present invention.

【図5】本発明の実施例の連結構造を示す断面図FIG. 5 is a sectional view showing a connection structure according to an embodiment of the present invention.

【図6】本発明の他の実施例の連結構造を示す断面図FIG. 6 is a sectional view showing a connection structure according to another embodiment of the present invention.

【符号の説明】[Explanation of symbols]

1…フレキシブルプリント基板 1A…カバーレイ 1B…導体 1C…連
結部 2…プリント基板 3…被連結部 4…貫通孔 5…コネクター 6…ケース
DESCRIPTION OF SYMBOLS 1 ... Flexible printed circuit board 1A ... Cover lay 1B ... Conductor 1C ... Connection part 2 ... Printed circuit board 3 ... Connection part 4 ... Through-hole 5 ... Connector 6 ... Case

Claims (2)

【特許請求の範囲】[Claims] 【請求項1】 カバーレイ(1A)に導体(1B)を積層状態で
接着してなるフレキシブルプリント基板(1)が、半田付
けして被連結部(3)に電気接続されてなるフレキシブル
プリント基板の連結構造において、 被連結部(3)に接続されるフレキシブルプリント基板(1)
の連結部(1C)が、カバーレイ(1A)の両面に導体(1B)を接
着してなる積層構造で、カバーレイ(1A)両面の導体(1B)
が半田付して被連結部(3)に電気接続されてなることを
特徴とするフレキシブルプリント基板の連結構造。
1. A flexible printed circuit board (1) formed by bonding a conductor (1B) to a coverlay (1A) in a laminated state, and a flexible printed circuit board formed by soldering and electrically connected to a connected portion (3). In the connection structure of (1), the flexible printed circuit board (1) connected to the connected portion (3)
The connection part (1C) has a laminated structure in which the conductor (1B) is adhered to both sides of the coverlay (1A), and the conductor (1B) on both sides of the coverlay (1A)
Characterized by being soldered and electrically connected to the connected portion (3).
【請求項2】 カバーレイ(1A)の両面に導体(1B)を接着
して積層してなる連結部(1C)に貫通孔(4)が設けられて
おり、この貫通孔(4)に半田が侵入されてカバーレイ(1
A)両面に導体(1B)を連結して被連結部(3)に接続するよ
うに構成されてなる請求項1に記載されるフレキシブル
プリント基板の連結構造。
2. A through hole (4) is provided in a connecting portion (1C) formed by bonding and laminating a conductor (1B) to both surfaces of a coverlay (1A), and a solder hole is provided in the through hole (4). Is invaded by coverlay (1
2. The connection structure for a flexible printed circuit board according to claim 1, wherein the connection structure is configured such that A) a conductor (1B) is connected to both surfaces to be connected to a connected portion (3).
JP22830996A 1996-08-29 1996-08-29 Connecting structure of flexible printed board Pending JPH1075029A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP22830996A JPH1075029A (en) 1996-08-29 1996-08-29 Connecting structure of flexible printed board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP22830996A JPH1075029A (en) 1996-08-29 1996-08-29 Connecting structure of flexible printed board

Publications (1)

Publication Number Publication Date
JPH1075029A true JPH1075029A (en) 1998-03-17

Family

ID=16874429

Family Applications (1)

Application Number Title Priority Date Filing Date
JP22830996A Pending JPH1075029A (en) 1996-08-29 1996-08-29 Connecting structure of flexible printed board

Country Status (1)

Country Link
JP (1) JPH1075029A (en)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6822169B2 (en) 2001-06-07 2004-11-23 Matsushita Electric Industrial Co., Ltd. Flexible printed circuit board and connecting method thereof
KR100485563B1 (en) * 2002-07-23 2005-04-27 세일전자 주식회사 Bandable printed circuit board and the manufacturing method
JP2005216915A (en) * 2004-01-27 2005-08-11 Seiko Epson Corp Mounting structure, manufacturing method therefor, electrooptic device and electronic equipment
JP2007294561A (en) * 2006-04-24 2007-11-08 Sumitomo Electric Ind Ltd Optical module having connecting structure by flexible substrate

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6822169B2 (en) 2001-06-07 2004-11-23 Matsushita Electric Industrial Co., Ltd. Flexible printed circuit board and connecting method thereof
KR100485563B1 (en) * 2002-07-23 2005-04-27 세일전자 주식회사 Bandable printed circuit board and the manufacturing method
JP2005216915A (en) * 2004-01-27 2005-08-11 Seiko Epson Corp Mounting structure, manufacturing method therefor, electrooptic device and electronic equipment
JP2007294561A (en) * 2006-04-24 2007-11-08 Sumitomo Electric Ind Ltd Optical module having connecting structure by flexible substrate

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