JPH1073732A - Optical waveguide block, optical fiber block and optical waveguide module formed by combining the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure and facilitate manufacture without allowing adhesives to flow out to flanks in a fixing stage by setting the width in the direction perpendicular to the optical axis of a protective substrate longer than the width of an optical waveguide chip, setting the width in the direction perpendicular to the optical axis of a fixing substrate longer than the width of substrate for arranging optical fibers and varying the width in the direction perpendicular to the optical axis of a common substrate from the widths of the optical waveguide chip and the substrates for arranging the optical fibers. SOLUTION: An optical waveguide block 9 and optical fiber blocks 1, 1' are generally connected and fixed by the adhesives of, for example, a UV curing type, etc., after the optical axes are aligned. Further, the common substrate 6 for fixing both of the optical waveguide block 9 and the optical fiber blocks 1, 1' in the base parts for the purpose of enhancing the strength of connection is disposed. The transverse width of the common substrate 6 is made longer than the transverse widths of the substrate 11, 11' for arranging the optical fibers and the optical waveguide chip 3. The constitution to make the transferse width of the common substrate 6 shorter than the transferse widths of the substrates 11, 11' for arranging the optical fibers and the optical waveguide chip 3 is equally well.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optical waveguide block and an optical fiber block used in an optical communication system and the like, and an optical waveguide module obtained by combining them.

[0002]

2. Description of the Related Art An optical waveguide chip is a quartz or silicon substrate in which a refractive index is increased by a flame deposition method or an ion exchange method, and a portion for trapping and guiding light is formed. It has something. FIG. 5 (a)
FIG. 3 is a perspective view showing an optical waveguide block using an optical waveguide chip, and a rectangular shape is often used as a shape of a protection substrate 8, and the size is the same as that of the optical waveguide chip 3. Thereafter, the end face of the optical waveguide block 9 is formed at a desired angle by mechanical polishing. However, the protective substrate 8 can prevent chipping of the optical waveguide 4 during polishing.

FIG. 5B is a perspective view showing an optical fiber block for arranging at least one or more optical fibers 2 for determining the position of the optical fibers 2 on a rectangular optical fiber arranging substrate 11. V-grooves 12 are formed. FIG. 5B shows a case where four optical fibers 2 of the table fiber 5 are arranged and fixed, and the V-grooves 12 are parallel to a desired interval. As a forming method, a processing method by mechanical cutting or etching is generally used. After placing the optical fiber 2 in the formed V-groove 12,
A fixing substrate 10 for holding the optical fiber 2 in the V-groove 12 is covered from above, and the gap is filled with an adhesive and fixed. As the shape of the fixed substrate 10, a rectangular shape is often used, and the lateral width (width in the direction perpendicular to the optical axis) is V-groove 1
2 is the same as the lateral width of the optical fiber placement substrate 11 on which is formed. Thereafter, the side surface of the optical fiber block 1 where the end surface of the optical fiber 2 is located is polished. In the polishing step, mechanical polishing is usually performed.

An optical waveguide module having the optical waveguide block 9 shown in FIG. 5A and the optical fiber block 1 shown in FIG. 5B as main components is as shown in a perspective view of FIG. FIG. 4 is a diagram showing a connection example of an optical fiber block 9 having a 1 × 4 branch type optical waveguide chip 3 and optical fiber blocks 1 and 1 ′, which has a general structure, and includes an optical waveguide block 9 and an optical fiber block; The connection end faces of 1, 1 'are polished at a desired angle with respect to the optical axis in order to prevent reflected light from returning, and the core spacing of the four-core optical fiber block, which is the optical fiber block 1', is determined by the light guide. It is manufactured so as to coincide with the interval between the optical waveguides 4 of the waveguide block 9. The optical waveguide block 9 and the optical fiber blocks 1 and 1 'are generally connected and fixed with an adhesive (for example, an ultraviolet curing adhesive) after the optical axes are aligned. A common substrate 6 for fixing the block 9 and the optical fiber blocks 1 and 1 'together is arranged and fixed on the bottom side. As the shape of the common substrate 6, a rectangular shape is often used, and the lateral width (width in the direction perpendicular to the optical axis) is made the same as the lateral width of the optical waveguide block 9 and the optical fiber blocks 1 and 1 '.

[0005]

However, in the conventional optical waveguide block, optical fiber block, or optical waveguide module as shown in FIG. 5, the protection substrate 8, the fixed substrates 10, 10 ', or the common substrate 6 are not provided. When bonding and fixing, the protection substrate 8 and the optical waveguide chip 3, the fixing substrates 10 and 10 ', and the optical fiber disposing substrates 11, 1
1 ', furthermore, the common substrate 6 and the substrate 1 for arranging the optical fiber
When the position of the optical waveguide chip 3 is shifted from that of the optical waveguide chip 3, especially when the side surface parallel to the optical axis is not parallel, the protective substrate 11, 11 ', the fixed substrate 10, or the common substrate is started from the side surface parallel to the optical axis. In some cases, the substrate 6 protrudes, causing a problem in assembly when the manufactured optical component is used by being incorporated into another device.

In order to prevent such a problem from occurring, it was necessary to adjust the parallelism at the time of fixing. However, since the adhesive before curing was interposed on the connection fixing surface, the parallelism was not adjusted. The agent is an optical waveguide chip 3, a substrate for placement 11, 1
1 ′, or may flow to the side surfaces of the common substrate 6 and adhere to the bottom surfaces thereof. When the adhesive is cured in this state, a problem occurs in that the adhesive is fixed to a manufacturing jig or the like, and work efficiency is reduced. There was a problem.

Further, as a method of performing alignment at once without alignment, for example, a method of providing in advance an uneven portion parallel to the optical axis on each surface of the connection cross section and fitting the uneven portion is adopted. . However, in such a method,
There is a problem that it is necessary to provide a special shape, and the cost is extra.

[0008]

SUMMARY OF THE INVENTION The present invention has been made to solve these problems, and is directed to an optical waveguide block comprising an optical waveguide chip having an optical waveguide formed on an upper surface and a protective substrate provided on the upper surface. The width of the protective substrate in the direction perpendicular to the optical axis is longer than the width of the optical waveguide chip.

With this configuration, in the step of fixing the protection substrate to the optical waveguide chip, even if the side surfaces parallel to the optical axis direction of the optical waveguide chip and the protection substrate are not parallel, the width of the protection substrate is equal to the width of the optical waveguide chip. Longer than
The portion having a difference in width becomes a pool of the adhesive, so that the alignment can be performed without the adhesive flowing out to the side surface. Further, since there is no need to provide a special shape for making the members parallel, reinforcement can be performed at lower cost.

Further, by providing an auxiliary substrate having a width in the direction perpendicular to the optical axis shorter than the width of the protective substrate or substantially the same as the width of the optical waveguide chip on the upper surface of the protective substrate, the cross-sectional shape of the heat-shrinkable tube is reduced. It is possible to make the shape close to a circle having a cross-sectional shape, and when sealing using a heat-shrinkable tube, it is possible to make the stress at the time of heat shrinkage substantially uniform on the side surface of the optical waveguide block.

Further, in an optical fiber block having a fixed substrate for holding and fixing an optical fiber on an upper surface of an optical fiber disposing substrate having at least one or more guide grooves for disposing an optical fiber, This is an optical fiber block in which the width in the vertical direction is longer than the width of the substrate for arranging optical fibers.

With this configuration, in the step of fixing the fixed substrate and the optical fiber arranging substrate, even if the fixed substrate and the side surface parallel to the optical axis direction of the optical fiber arranging substrate are not parallel, the fixed substrate is not illuminated. Since the width is longer than the width of the substrate plate for fiber arrangement, a portion where the width is different becomes a pool of the adhesive, and the alignment can be performed without the adhesive flowing out to the side surface. Further, since there is no need to provide a special shape for making the members parallel, reinforcement can be performed at lower cost.

Further, by providing an auxiliary substrate having a width in the direction perpendicular to the optical axis shorter than the width of the fixed substrate or substantially the same as the width of the substrate for arranging optical fibers on the upper surface of the fixed substrate,
The cross-sectional shape can be made closer to the circle that is the cross-sectional shape of the heat-shrinkable tube, and when sealing with the heat-shrinkable tube, the stress during heat shrinkage can be made almost uniform on the side of the optical fiber block. Becomes

An optical fiber arranging substrate having at least one guide groove for arranging an optical fiber on both ends of an optical waveguide chip having an optical waveguide formed on an upper surface on a common substrate is provided by an optical waveguide and an optical fiber. An optical waveguide module fixed and connected so that the optical axis of the optical waveguide coincides with that of the optical waveguide module. It was done.

[0015] With this configuration, in the step of fixing the common substrate, the optical fiber arranging substrate, and the optical waveguide chip, the side surfaces of the common substrate, the optical fiber arranging substrate, and the optical waveguide chip that are parallel to the optical axis direction are parallel. Even if this is not the case, the difference in width between the common substrate, the substrate for arranging optical fibers, and the optical waveguide chip will cause the difference in width to become a pool of adhesive.
The alignment can be performed without the adhesive flowing out to the side surface. In addition, since it is not necessary to provide a special shape for making the members parallel to each other, the reinforcement can be performed at lower cost.

An optical fiber disposition having at least one or more guide grooves for disposing an optical fiber on both end surfaces of an optical waveguide block in which a protective substrate is provided on the upper surface of an optical waveguide chip having an optical waveguide formed on the upper surface. An optical fiber block comprising a fixed substrate for holding and fixing an optical fiber on the upper surface of a substrate for connection and fixing such that the optical axes of the optical waveguide and the optical fiber coincide with each other. An optical waveguide module in which an auxiliary substrate whose width in the direction perpendicular to the optical axis is shorter than that of the protective substrate and the fixed substrate or whose width is substantially the same as the width of the optical waveguide chip and / or the optical fiber block is provided on the upper surface of the fixed substrate. is there.

With such a configuration, it is possible to make the cross-sectional shape close to the circle which is the cross-sectional shape of the heat-shrinkable tube. It becomes possible to make it substantially uniform on the side surface.

[0018]

Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1A is a perspective view showing a structure of an optical waveguide block according to the present invention. The optical waveguide chip 3 of the present embodiment is a 1 × 4 branch type optical waveguide chip, and a quartz optical waveguide 4 is formed on a silicon substrate. On the upper surface of the optical waveguide chip 3, a protective substrate 8 longer than the width of the optical waveguide chip 3 is arranged and fixed by, for example, an ultraviolet-effect adhesive 7, so that chipping of the optical waveguide 4 can be reliably prevented. It is possible.

FIG. 1B is a perspective view of another embodiment showing the structure of the optical waveguide block according to the present invention. The width of the optical waveguide chip 3 is limited only to the upper surface of the end face portion. A longer protective substrate 8 is arranged and fixed by, for example, an ultraviolet-effect adhesive 7.

FIG. 2 is a perspective view showing the structure of the optical fiber block according to the present invention. 4-core tape fiber 5
The four optical fibers 2 are arranged in guide V-grooves 12 formed on the optical fiber arranging substrate 11, and the width of the optical fiber 2 from above the optical fiber 2 is larger than the width of the optical fiber arranging substrate 11. Are covered with a long optical fiber fixing substrate 10. The optical fiber 2 is made of, for example, an ultraviolet effect type adhesive 7.
(The gap at the V groove 12 is not shown).

FIG. 3 is a perspective view showing an optical waveguide module according to the present invention. The optical waveguide block 9 and the optical fiber blocks 1 and 1 'are connected in the same manner as in FIG. 5C, and the connection end face is polished at a desired angle with respect to the optical axis to prevent reflected return light. I have. The distance between the optical fibers 2 of the optical fiber block 1 ′ is
The optical waveguide chip 3 is manufactured so as to match the interval between the optical waveguides 4. The optical waveguide block 9 and the optical fiber blocks 1, 1 'are generally connected and fixed by, for example, an ultraviolet-curing adhesive after aligning the optical axes.
Further, a common substrate 6 is provided to fix the optical waveguide block 9 and the optical fiber blocks 1 and 1 'together at the bottom portion for the purpose of increasing the connection strength. The width of the common substrate 6 is
The width is longer than the width of the optical fiber placement substrates 11 and 11 ′ and the optical waveguide chip 3. In this embodiment,
Although the width of the common substrate is longer than the width of the optical fiber arranging substrates 11, 11 'and the optical waveguide chip 3, the width may be shorter.

FIG. 4A is a cross-sectional view showing an optical waveguide block according to the present invention. The width is smaller than the width of the protection substrate 8 on the upper surface of the protection substrate 8 whose width is longer than the optical waveguide chip 3. Preferably, an auxiliary substrate 13 having substantially the same width as the optical waveguide chip 3 is provided.

FIG. 4B is a cross-sectional view showing an optical fiber block according to the present invention. The fixed substrate 1 has a lateral width longer than the substrate 11 for arranging optical fibers.
An auxiliary substrate 13 is provided which is shorter than the horizontal width of 0 and is more preferably substantially the same as the horizontal width of the substrate 11 for arranging optical fibers.

In addition, the optical fiber block 1 shown in FIG. 2 is connected and fixed to both end faces of the optical waveguide block 9 shown in FIG. 1 so that the optical axes of the optical waveguide 4 and the optical fiber 2 coincide. On the upper surfaces of the protection substrate 8 and the fixed substrate 10, an auxiliary substrate 13 that is shorter than the width of the protection substrate 8 and the fixed substrate 10, and more preferably substantially the same as the width of the optical waveguide chip 3 or the substrate 11 for arranging optical fibers, is provided. 4 (a) or 4 (b).

[0025]

As described in detail above, in the optical waveguide block, the optical fiber block, or the optical waveguide module according to the present invention, the width of the protective substrate in the direction perpendicular to the optical axis is longer than the width of the optical waveguide chip. By making the width of the fixed substrate in the vertical direction of the optical axis longer than the width of the substrate for arranging the optical fibers, and further, making the width of the common substrate in the vertical direction of the optical axis different from the width of the optical waveguide chip and the substrate for arranging the optical fibers. In the step of fixing them, even when the side surfaces parallel to the optical axis direction are not parallel, since the difference in width becomes an adhesive pool, the alignment is performed without the adhesive flowing out to the side surfaces. Since it can be performed and there is no need to provide a special shape for making it parallel, an optical waveguide block, an optical fiber block, or an optical waveguide module that is reliable and easy to manufacture. It is possible to provide a Le.

Further, according to the optical waveguide block, the optical fiber block, or the optical waveguide module of the present invention, the width in the direction perpendicular to the optical axis is shorter than the width of the protective substrate or the fixed substrate on the upper surface of the protective substrate or the fixed substrate. More preferably, by providing an auxiliary substrate having substantially the same width as the width of the optical waveguide chip or the substrate for arranging optical fibers, the cross-sectional shape can be approximated to a circle which is the cross-sectional shape of the heat-shrinkable tube. It is possible to provide an optical waveguide block, an optical fiber block, or an optical waveguide module that can apply stress at the time of thermal contraction substantially uniformly when sealing.

[Brief description of the drawings]

FIG. 1A is a perspective view showing an optical waveguide block according to the present invention, and FIG. 1B is a perspective view showing another embodiment of the optical waveguide block according to the present invention.

FIG. 2 is a perspective view showing an optical fiber block of the present invention.

FIG. 3 is a perspective view showing an optical waveguide module of the present invention.

FIG. 4A is a cross-sectional view showing another embodiment of the optical waveguide block of the present invention, and FIG. 4B is a cross-sectional view showing another embodiment of the optical fiber block of the present invention.

5A is a perspective view showing an optical waveguide chip which is a component of a conventional optical waveguide module, and FIG. 5B is a perspective view showing an optical fiber block which is a component of a conventional optical waveguide module. FIG. 1C is a perspective view showing a conventional optical waveguide module.

[Description of Signs] 1, 1 ': Optical fiber block 2: Optical fiber 3: Optical waveguide chip 4: Optical waveguide 5: Tape fiber 6: Common substrate 7: Adhesive 8: Protective substrate 9: Optical waveguide block 10: Fixed Substrate 11, 11 ': Substrate for optical fiber placement 12: V-groove 13: Auxiliary substrate

Claims (9)

[Claims] In an optical waveguide block in which a protective substrate is provided on an upper surface of an optical waveguide chip having an optical waveguide formed on a substrate, the width of the protective substrate in the direction perpendicular to the optical axis is larger than the width of the optical waveguide chip. An optical waveguide block characterized by being elongated. 2. The optical waveguide block according to claim 1, wherein an auxiliary substrate having a width in a direction perpendicular to an optical axis shorter than the width of the protective substrate is provided on an upper surface of the protective substrate. 3. The optical waveguide block according to claim 1, wherein an auxiliary substrate having a width in a direction perpendicular to an optical axis substantially equal to a width of the optical waveguide chip is provided on an upper surface of the protection substrate. 4. An optical fiber block comprising a fixed substrate for holding and fixing an optical fiber provided on an upper surface of an optical fiber disposing substrate having at least one or more guide grooves for disposing the optical fiber. An optical fiber block, wherein a width in a direction perpendicular to an axis is longer than a width of the substrate for arranging optical fibers. 5. The optical fiber block according to claim 4, wherein an auxiliary substrate having a width in a direction perpendicular to the optical axis shorter than the width of the fixed substrate is provided on an upper surface of the fixed substrate. 6. An optical fiber block according to claim 4, wherein an auxiliary substrate having a width in a direction perpendicular to an optical axis substantially equal to a width of said optical fiber arranging substrate is provided on an upper surface of said fixed substrate. . 7. An optical fiber arranging substrate having at least one or more guide grooves for arranging optical fibers on both ends of an optical waveguide chip having an optical waveguide formed on the substrate on a common substrate. In an optical waveguide module fixedly connected so that the optical axis of the optical fiber coincides with the optical fiber, the width of the common substrate in the direction perpendicular to the optical axis is made different from the width of the optical waveguide chip and / or the substrate for disposing the optical fiber. An optical waveguide module, characterized in that: 8. A light having at least one or more guide grooves for arranging optical fibers on both end surfaces of an optical waveguide block having a protective substrate provided on an upper surface of an optical waveguide chip having an optical waveguide formed on a substrate. An optical waveguide module comprising an optical fiber block having a fixed substrate for holding and fixing an optical fiber on an upper surface of a fiber arrangement substrate, and being connected and fixed such that the optical axes of the optical waveguide and the optical fiber coincide with each other. An optical waveguide module comprising: an auxiliary substrate having a width in a direction perpendicular to an optical axis shorter than that of the protective substrate and / or the fixed substrate provided on upper surfaces of the protective substrate and the fixed substrate. 9. The optical waveguide module according to claim 8, wherein a width of the auxiliary substrate in a direction perpendicular to an optical axis is substantially equal to a width of the optical waveguide chip and / or the optical fiber block.