JPH1069851A - Manufacture of barrier plate - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a barrier plate that is excellent in resolution and high in dimensional accuracy by forming over a substrate a barrier plate material layer containing an ethylene-unsaturated-group-containing polymer compound and a photosensitive resin composition layer, and sandblasting a hardened film pattern. SOLUTION: A photosensitive resin composition layer 3 containing an ethylene-unsaturated group containing polymeric compound represented by the formula 1 is formed using, e.g. a photosensitive film, over a barrier plate material layer 2 formed over a substrate 1, the thickness of the layer 2 ranging between, e.g. 100 and 300μm. An example of the photosensitive film is a polyethylene terephthalate film 5 to 100μm thick, which is pressed against the substrate 1 while being heated to form a pattern of a hardened film 6 after exposure and development processes. By using the pattern of the hardened film 6 as an etching mask and performing sandblasting to remove the pattern of the hardened film 6, a bulkhead 7 is obtained which is excellent in resolution and sandblasting resistance, is refined, and is high in positional and dimensional accuracies.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a partition for forming a discharge cell of a plasma display.

[0002]

2. Description of the Related Art Conventionally, screen printing is most often used for forming barrier ribs of a plasma display. However, in order to obtain a required thickness for the barrier ribs, printing is required several to several tens of times. Printing position accuracy is required. However, a screen plate used for screen printing generates elongation and distortion with the number of times of use, so that the overlaying accuracy is reduced, and the shape of the partition wall is deteriorated, so that a required opening area cannot be obtained, which causes a decrease in luminance and the like.

[0003] In view of the above, a technique of forming a partition wall instead of the screen printing method is being studied. For example, a technique in which a dielectric material is electrodeposited on a metal plate in which holes are formed in a lattice shape is used as a partition (JP-A-3-152830, JP-A-3-205538, JP-A-3-233382, Kaihei 4-32
132, JP-A-4-129131, JP-A-5-159706, etc., and a technique of forming a partition by processing and combining ceramic thin plates in a wave shape (Japanese Patent Laid-Open No. 1-111).
No. 5033), a technique of filling a jig with a partition material and transferring it to a substrate to form a partition (Japanese Patent Application Laid-Open No. 1-137534), forming a partition material layer on the entire surface of the substrate, and then forming a groove with a rotary saw. Digging and using this as a partition (Japanese Patent Laid-Open No. 1-2203)
No. 30, etc.), a technique of forming partition walls with a press die (Japanese Patent Application Laid-Open No. 3-59928, etc.), forming a convex portion of a cell with a photoresist, and then filling a peripheral concave portion with a partition material to form a partition wall. Technology (Japanese Patent Laid-Open No. 64-21846,
JP-A-236539, JP-A-1-251534, JP-A1-272027, JP-A-3-127
429, JP-A-4-109536, JP-A-5-234514, JP-B-4-33097, JP-B-4-33098, etc.) and patterning the photoresist formed on the partition wall material layer. A technique of forming a partition by etching with a sandblast using this as a mask (JP-A-2-301934, JP-A-4-953)
No. 28, JP-A-4-101777, JP-A-4
JP-A-104424, JP-A-4-123745, JP-A-4-249828, JP-A-4-259
733, JP-A-4-282531, JP-A-5-266691, etc.).

[0004] However, among these techniques, the practical application is considered as (1) a technique of forming a convex portion of a cell with a photoresist and then filling a peripheral concave portion with a partition material to form a partition. And (2) a technique of patterning a photoresist formed on a partition material layer and using the mask as a mask to etch the partition material layer by sandblast to form a partition, and in particular, a partition formation technique using sandblast has already been commercialized. Is being done.

[0005] A photoresist used as a mask for the partition wall forming technique using the sand blast is required to have high resolution and sand blast resistance. In particular, when the plasma display is used for a high-definition television or a computer terminal, fine partition walls must be formed with high precision, and therefore a high resolution is required. Therefore, in general, the resolution is increased by reducing the thickness of the photoresist layer. However, when the layer thickness is reduced, the sandblast resistance is reduced, and the photomask serving as a mask is formed before the partition material layer is etched. There is a problem that the resist layer is etched.

[0006]

SUMMARY OF THE INVENTION The first aspect of the present invention provides a method of manufacturing a partition wall which is excellent in resolution and sandblast resistance, can be fine, and has a high position and dimensional accuracy. The invention described in claim 2 has the effects of the invention described in claim 1 and is further excellent in environmental hygiene. The invention according to claim 3 has the effect of the invention according to claim 1 or 2, and is more excellent in resolution and sandblast resistance. The invention described in claim 4 has the effects of the invention described in claim 1, 2, or 3, and is more excellent in environmental hygiene and workability.

[0007]

According to the present invention, there is provided a method of manufacturing a partition wall of a plasma display substrate having a partition wall for partitioning a minute discharge light emitting region on the substrate. Forming, (II) forming a photosensitive resin composition layer on the partition wall material layer, (III) exposing and developing the photosensitive resin composition layer to form a photosensitive resin composition layer. A step of forming a pattern of a cured film, (IV) a step of sandblasting using the pattern of the cured film as a mask, and (V) a step of removing the pattern of the cured film. A method for producing the same.

In the present invention, the photosensitive resin composition layer comprises (a) a thermoplastic polymer having a carboxyl group, and (b) a repeating unit of pentamethylene carbonate and hexamethylene carbonate in a ratio of 5: 5. An ethylenically unsaturated group-containing polymerizable compound containing a reaction product of copolycarbonate diol, isophorone diisocyanate, and hydroxyethyl acrylate or hydroxyethyl methacrylate; and (c) a photopolymerization initiator that generates free radicals by actinic light. The present invention relates to a method for producing the partition wall.

Further, the present invention provides a polymerizable compound having an ethylenically unsaturated group (b) further comprising a compound represented by the general formula (1):

Embedded image (Wherein, R ¹ and R ² each independently represent a hydrogen atom or a methyl group, and p and q are positive integers selected so that p + q is 4 to 30). The present invention relates to a method for producing the partition wall containing a hydrophilic compound. In addition, the present invention relates to (I
I) a step of forming a photosensitive resin composition layer on a partition material layer, using a photosensitive film obtained by laminating a photosensitive resin composition layer on a support film; And a method of manufacturing the partition wall.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION The method of manufacturing a partition according to the present invention is a method of manufacturing a partition of a plasma display substrate having a partition for partitioning a minute discharge light emitting region on the substrate,
(I) a step of forming a partition material layer on a substrate, (II) a step of forming a photosensitive resin composition layer on the partition material layer, (II)
I) a step of exposing and developing the photosensitive resin composition layer to form a cured film pattern of the photosensitive resin composition layer;
It is characterized by performing a step including (IV) a step of sandblasting using the pattern of the cured film as a mask and (V) a step of removing the pattern of the cured film.

Hereinafter, each step of the method for producing a partition according to the present invention will be described in detail with reference to FIG. FIG. 1 is a schematic view showing each step of the method for producing a partition according to the present invention. [(I) Step of Forming Partition Material Layer on Substrate] FIG. 1 (I) shows a state in which the partition material layer 2 is formed on the substrate 1. As the substrate 1 in the present invention, for example, a glass substrate, which may be subjected to a surface treatment for transparent bonding,
An electrode pattern formed on a synthetic resin substrate or the like may be used. The partition wall material used for the partition wall material layer 2 in the present invention is not particularly limited, and for example, is composed of, as main components, a low melting point lead glass, an inorganic filler (silica-based, titanium-based, chromium-based, etc.) and a resin component. And the like. Also, the color layer of the partition wall material is not particularly limited, and may be white or black. However, it is preferable that the light emission luminance is not reduced after firing.

In the step (I) of the present invention, a method of forming the partition wall material layer 2 on the substrate 1 includes, for example,
The partition wall material can be formed into a thick film by a coating method such as a screen printing method. The thickness of the partition wall material layer 2 is usually 10
The range is from 0 to 300 μm. The substrate 1 on which the partition wall material layer 2 is formed may be baked before performing the step (II) in the present invention described later, but the sand blasting process in the step (IV) in the present invention described later is performed. From the point that it can be easily prepared, (II) to
It is preferable to perform each step of (V).

[(II) Step of Forming Photosensitive Resin Composition Layer on Partition Material Layer] A state in which the photosensitive resin composition layer 3 is formed on the partition material layer 2 is shown in FIG. )Pointing out toungue. Examples of the photosensitive resin composition used in the photosensitive resin composition layer 3 in the present invention include (a) a thermoplastic polymer having a carboxyl group, (b) a polymerizable compound containing an ethylenically unsaturated group, and (c) And (2) those containing a photopolymerization initiator that generates free radicals by active light.

The (a) thermoplastic polymer having a carboxyl group in the present invention is preferably a vinyl copolymer. Examples of the copolymerizable monomer used in such a vinyl copolymer include, for example, , Acrylic acid, methacrylic acid, methyl methacrylate, butyl methacrylate, 2-ethylhexyl methacrylate, lauryl methacrylate, ethyl acrylate, methyl acrylate, styrene,
α-methylstyrene, vinyltoluene, N-vinylpyrrolidone, 2-hydroxyethyl methacrylate, 2-hydroxyethyl acrylate, acrylamide, acrylonitrile, methacrylonitrile, dimethylaminoethyl methacrylate, dimethylaminoethyl acrylate, and the like. Further, a half ester of a styrene / maleic acid copolymer may be used. These are used alone or in combination of two or more.

The (a) thermoplastic polymer having a carboxyl group in the present invention has a carboxyl group content of 15%.
５０50 mol%, preferably a weight average molecular weight (measured by a gel permeation chromatography method and converted using a standard polystyrene calibration curve)
However, these (a) thermoplastic polymers having a carboxyl group are used alone or in combination of two or more. In addition, (a) the thermoplastic polymer having a carboxyl group is preferably soluble or swellable in an aqueous alkaline solution, but it is sufficient that the thermoplastic resin is soluble or swellable in an aqueous alkaline solution as a photosensitive resin composition.

As the polymerizable compound (b) having an ethylenically unsaturated group in the present invention, conventionally known compounds can be used. Among them, (b) pentamethylene carbonate and hexamethylene carbonate in a ratio of 5: 5 A copolycarbonate diol having a repeating unit in a ratio,
Preferred are ethylenically unsaturated group-containing polymerizable compounds including a reaction product of isophorone diisocyanate and hydroxyethyl acrylate or hydroxyethyl methacrylate.

The reaction product of the copolycarbonate diol having repeating units of pentamethylene carbonate and hexamethylene carbonate in the ratio of 5: 5 in the present invention, isophorone diisocyanate, and hydroxyethyl acrylate or hydroxyethyl methacrylate is specifically described. , Urethane acrylate oligomer U
F-8001, UF-8002, UF-8003, UF
-8003 and the like (all manufactured by Kyoeisha Chemical Co., Ltd.) are commercially available.
F-8003 is more preferred. Each of these reactants is a methyl ethyl ketone solution.

The (b) polymerizable compound having an ethylenically unsaturated group in the present invention further comprises a compound represented by the general formula (1):

Embedded image (Wherein, R ¹ and R ² each independently represent a hydrogen atom or a methyl group, and p and q are positive integers selected so that p + q is 4 to 30). It is preferable to contain an acidic compound.

In the general formula (1), R ¹ and R
² is each independently a hydrogen atom or a methyl group, and p and q are positive integers selected so that p + q is 4 to 30. If p + q is less than 4, the flexibility tends to decrease, and if it exceeds 30, the hydrophilicity of the system tends to increase and the adhesion at the time of development tends to decrease. Examples of the polymerizable compound represented by the general formula (1) include, for example, 2,
2'-bis (4-methacryloxypentaethoxyphenyl) propane, 2,2'-bis (4-acryloxypentaethoxyphenyl) propane, 2,2'-bis (4-methacryloxytetraethoxyphenyl) propane and the like Commercially available products include, for example, NK ester BPE
-500 (manufactured by Shin-Nakamura Chemical Co., Ltd.). Such polymerizable compounds represented by the general formula (1) are used alone or in combination of two or more.

The (b) ethylenically unsaturated group-containing polymerizable compound in the present invention includes a copolycarbonate diol having pentamethylene carbonate and hexamethylene carbonate as repeating units in a ratio of 5: 5, isophorone diisocyanate, A polymerizable compound having a boiling point of 100 ° C. or more at normal pressure, other than the reaction product with hydroxyethyl acrylate or hydroxyethyl methacrylate and the polymerizable compound represented by the general formula (1), can be contained.

Examples of the polymerizable compound having a boiling point of 100 ° C. or more at normal pressure include acrylic acid, methyl acrylate, ethyl acrylate, n-propyl acrylate, and the like.
Isopropyl acrylate, n-butyl acrylate,
Isobutyl acrylate, cyclohexyl acrylate, benzyl acrylate, carbitol acrylate, methoxyethyl acrylate, ethoxyethyl acrylate, butoxyethyl acrylate, hydroxyethyl acrylate, hydroxypropyl acrylate,
Butylene glycol monoacrylate, N, N-dimethylaminoethyl acrylate, N, N-diethylaminoethyl acrylate, glycidyl acrylate, tetrahydrofurfuryl acrylate, pentaerythritol monoacrylate, trimethylolpropane monoacrylate, allyl acrylate, 1,3-propylene glycol Diacrylate, 1,4-butylene glycol diacrylate, 1,6-hexylene glycol diacrylate, neopentyl glycol diacrylate, dipropylene glycol diacrylate, 2,2-bis (4
-Acryloxydiethoxyphenyl) propane, 2,2
-Bis (4-acryloxypropylxyphenyl) propane, trimethylolpropane diacrylate, pentaerythritol diacrylate, trimethylolpropane triacrylate, pentaerythritol triacrylate, triacrylformal, tetramethylolmethanetetraacrylate, tris (2-hydroxy Ethyl) isocyanuric acid acrylate,

Embedded image (Where m is a positive integer of 1 to 30), methacrylic acid, methyl methacrylate, ethyl methacrylate, propyl methacrylate, isopropyl methacrylate,
Butyl methacrylate, isobutyl methacrylate, cyclohexyl methacrylate, benzyl methacrylate, octyl methacrylate, ethylhexyl methacrylate, methoxyethyl methacrylate, ethoxyethyl methacrylate, butoxyethyl methacrylate, hydroxyethyl methacrylate, hydroxypropyl methacrylate, hydroxybutyl methacrylate, hydroxypentyl methacrylate, N, N- Dimethylamino methacrylate, N, N-diethylamino methacrylate, glycidyl methacrylate, tetrahydrofurfuryl methacrylate, methacryloxypropyltrimethoxysilane, allyl methacrylate, trimethylolpropane monomethacrylate, pentaerythritol monomethacrylate, 1 3-butylene glycol dimethacrylate, 1,6-hexylene glycol dimethacrylate, neopentyl glycol dimethacrylate, 2,
2-bis (4-methacryloxydiethoxyphenyl) propane, trimethylolpropane trimethacrylate,
Pentaerythritol trimethacrylate, tetramethylolmethanetetramethacrylate, methacrylic acid ester of tris (2-hydroxyethyl) isocyanuric acid,

Embedded image (Where n is a positive integer of 1 to 30), a reaction product of trimethylhexamethylene diisocyanate / 2-hydroxyethyl acrylate (1/2 molar ratio), isocyanate ethyl methacrylate / water (2/1 (Mole ratio) Reactant, butyl crotonate, glycerin monochlorate, vinyl butyrate, vinyl trimethyl acetate, vinyl caproate, vinyl chloroacetate, vinyl lactate, vinyl benzoate, divinyl succinate, divinyl phthalate, methacrylamide, N- Methyl methacrylamide, N-ethyl methacrylamide, N-aryl methacrylamide, N-hydroxyethyl-N-methyl methacrylamide, acrylamide, Nt-butylacrylamide, N-methylolacrylamide, N-isobutoxymethyla Riruamido, N- butoxymethyl acrylamide, diacetone acrylamide, hexyl vinyl ether, ethylhexyl vinyl ether, vinyl tri ethers, polyvinyl ethers of polyhydric alcohols, styrene derivatives (ortho and para to the alkyl group,
Styrene having substituents such as alkoxy group, halogen, carboxyl group, allyl group), divinylbenzene, allyloxyethanol, diallyl ester of dicarboxylic acid, N-vinyloxazolidone, N-vinylimidazole, N-vinylpyrrolidone, N- Vinyl carbazole or the like can be used.

The (b) polymerizable compound containing an ethylenically unsaturated group in the present invention, a copolycarbonate diol having pentamethylene carbonate and hexamethylene carbonate in a repeating unit of 5: 5, isophorone diisocyanate, and hydroxyethyl acrylate Or, the amount of the reaction product with hydroxyethyl methacrylate is from the viewpoint of sandblast resistance in the sandblast treatment performed in the step (IV) described below.
It is preferable that the content is not less than 25% by weight based on the total amount of the component (b). If the amount of the reaction product with this is less than 25% by weight, the sandblast resistance tends to decrease.

In the polymerizable compound (b) containing an ethylenically unsaturated group in the present invention, the compounding amount of the polymerizable compound represented by the above general formula (1) is determined in view of pattern forming property, sandblast resistance and the like. After the reaction product of the above and the above is blended, the content is preferably 5 to 60% by weight based on the total amount of the component (b). If the amount of the polymerizable compound represented by the general formula (1) is less than 5% by weight, pattern formability tends to decrease, and if it exceeds 60% by weight, sandblast resistance tends to decrease. .

Examples of (c) a photopolymerization initiator that generates free radicals by actinic light in the present invention include benzoin ethers (benzoin methyl ether, benzoin ethyl ether, benzoin propyl ether, benzoin isobutyl ether, benzoin phenyl ether, etc.). ), Benzophenones (benzophenone, N,
N'-tetramethyl-4,4'-diaminobenzophenone, N, N'-tetraethyl-4,4'-diaminobenzophenone, etc., benzyl ketals (benzyl dimethyl ketal, benzyl diethyl ketal, etc.), acetophenones (2, 2-dimethoxy-2-phenylacetophenone, p-tert-butyldichloroacetophenone, p
-Dimethylaminoacetophenone, etc.), thioxanthones (2,4-dimethylthioxanthone, 2,4-diisopropylthioxanthone, etc.), hydroxycyclohexylphenyl ketone, 1- (4-isopropylphenyl)
-2-hydroxy-2-methylpropan-1-one, 2
-Hydroxy-2-methyl-1-phenylpropane-1
-On and the like. These are used alone or in combination of two or more.

In the photosensitive resin composition used in the photosensitive resin composition layer of the present invention, the amount of the component (b) is 10 to 200 parts by weight based on 100 parts by weight of the component (a). Is preferred. If the amount is less than 10 parts by weight, sufficient sandblast resistance tends not to be obtained, and if it exceeds 200 parts by weight, developability tends to decrease. The amount of the component (c) is 10%.
It is preferably 0.5 to 20 parts by weight based on 0 part by weight. If the amount is less than 0.5 part by weight, sufficient sensitivity tends not to be obtained, and if it exceeds 20 parts by weight, the pattern shape tends to be poor.

The photosensitive resin composition used in the photosensitive resin composition layer of the present invention contains additives such as dyes, pigments, plasticizers, stabilizers, defoamers, and film-forming agents. It can be added accordingly.

In the step (II) of the present invention, the photosensitive resin composition layer 3 may be formed on the partition wall material layer 2 by, for example, A method of forming a photosensitive resin composition layer 3 by dissolving in a solvent and applying directly onto the partition wall material layer 2 by a conventional method such as spinner coating, spray coating, screen printing, roll coating, or flow coating; The above-described photosensitive resin composition is dissolved in a solvent as necessary, and applied on a support film, and dried, as a photosensitive film.
A method of forming the photosensitive resin composition layer 3 on the partition wall material layer 2 using the photosensitive film may be mentioned. From the viewpoints of environmental sanitation, workability, and the like, use of the photosensitive film It is preferable to use a method of forming the photosensitive resin composition layer 3 on the partition wall material layer 2.

Examples of the solvent used for dissolving the photosensitive resin composition as required include ketone solvents (acetone, methyl ethyl ketone, methyl isobutyl ketone, etc.) and ether solvents (methyl cellosolve, ethyl Cellosolve, etc.). These solvents are used alone or in combination of two or more.

In the method in which the photosensitive resin composition layer 3 is formed by directly coating on the partition wall material layer 2, the thickness of the photosensitive resin composition layer 3 is preferably 10 to 150 μm.

In the method of forming the photosensitive resin composition layer 3 on the partition wall material layer 2 using the photosensitive film, as the support film used for the photosensitive film, for example, a polymer film ( polyethylene terephthalate,
Film made of polypropylene, polyethylene, etc.)
And the like. Among them, a polyethylene terephthalate film is preferable. Since these support films must be removable from the photosensitive resin composition layer 3 later, they should not be surface-treated or made of a material that cannot be removed.

The thickness of these support films is 5 to 1
The thickness is preferably set to 00 μm, and more preferably to 10 to 30 μm. One of the polymer films used for the support film is a support film for the photosensitive resin composition layer 3, and the other is a protective film for the photosensitive resin composition layer 3. The photosensitive film can also be laminated on both sides of the composition layer 3.

The photosensitive film according to the present invention is obtained by uniformly dissolving the photosensitive resin composition in the above-mentioned solvent, applying the solution uniformly on the support film by a roll coating method, a knife coating method or the like, and then drying. (The solvent is removed by heating and / or blowing with hot air). The thickness of the photosensitive resin composition layer 3 after drying the photosensitive film is
There is no particular limitation, and the thickness is preferably 10 to 100 μm, and more preferably 20 to 60 μm. The thus obtained photosensitive film of the present invention can be stored as it is or by further laminating a protective film on the other surface of the photosensitive resin composition layer 3, winding up in a roll shape.

Using the photosensitive film of the present invention,
As a method of forming the photosensitive resin composition layer 3 on the partition wall material layer 2, for example, when a protective film is present on the photosensitive film, the photosensitive resin composition is removed after removing the protective film. A method of forming the material layer 3 by pressing the material layer 3 onto a substrate while heating the material layer 3 is exemplified. The heating at this time is usually 70 to 130 ° C., and the pressing pressure is usually
It is 1 to 10 kg / cm ² . Further, in order to further improve the formability of the photosensitive resin composition layer 3, the substrate 1 on which the partition wall material layer 2 is formed may be subjected to a pre-heat treatment, but these conditions are not particularly limited.

[(III) The photosensitive resin composition layer is exposed,
Step of Forming Cured Film Pattern of Photosensitive Resin Composition Layer by Developing] Exposure and Development of Photosensitive Resin Composition Layer 3, Pattern of Cured Film 6 of Photosensitive Resin Composition Layer 3 1 (III) and FIG. 1 (II)
This is shown in b) of I). After the step (II), the photosensitive resin composition layer 3 can be imagewise irradiated with actinic rays 5 through a photomask 4 such as a negative film or a positive film to be exposed (FIG. 1 (III), a). At this time, if the support film existing on the photosensitive resin composition layer 3 is transparent, it may be exposed as it is, and if it is opaque, it is necessary to remove it. From the viewpoint of protecting the photosensitive resin composition layer 3, the support film is preferably transparent, and it is preferable to expose the support film through the support film.

As the actinic ray 5, a known actinic light source can be used, and for example, a light source generated from a carbon arc, a mercury vapor arc, a xenon arc, or the like can be used.
Since the sensitivity of the photopolymerization initiator contained in the photosensitive resin composition layer 3 is generally maximum in the ultraviolet region, the active light source should be one that effectively emits ultraviolet light.

Next, after the exposure, if a support film is present on the photosensitive resin composition layer 3, the support film is removed, and then, using an aqueous alkali solution, for example, spraying,
The pattern of the cured film 6 of the photosensitive resin composition layer 3 can be formed by removing the unexposed portion by a known method such as rocking immersion, brushing, and scraping, and developing the film (FIG. 1 ( III) b)).

Examples of the base of the alkaline aqueous solution include alkali hydroxides (hydroxides such as lithium, sodium and potassium), alkali carbonates (carbonates or bicarbonates such as lithium, sodium and potassium), and alkali metal phosphates. Salts (such as potassium phosphate and sodium phosphate) and alkali metal pyrophosphates (such as sodium pyrophosphate and potassium pyrophosphate) are exemplified, and among them, an aqueous solution of sodium carbonate is preferred. The pH of the aqueous alkali solution used for development is preferably 9 to 11, and the temperature can be adjusted according to the developability of the photosensitive resin composition layer 3. Further, a surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating the development, and the like can be further mixed into the aqueous alkali solution.

After the development is completed, in the step (IV) to be described later, ultraviolet irradiation or heating with a high-pressure mercury lamp can be performed for the purpose of improving sandblast resistance and the like.

[(IV) Step of Sandblasting Using Pattern of Cured Film as Mask] FIG. 1 shows the state of sandblasting using the pattern of cured film 6 as a mask.
(IV). After the step (III), the injection amount is 100 to 2000 g / min using, for example, an abrasive having an average particle size of 5 to 100 μm using the pattern of the cured film 6 of the photosensitive resin composition layer 3 as an etching mask. , Processing pressure is 1
By performing sandblasting in the range of 10 to 10 kg / cm ² , the partition wall material layer 2 can be etched to form a predetermined pattern.

The blast particles used for sand blasting are preferably those having a higher hardness than the partition wall material layer 2, for example, natural abrasives such as natural silica sand (sand), garnet (garnet), silicon carbide, oxide Examples include artificial abrasives such as silicon and aluminum oxide, metal abrasives such as pig iron (steel) and steel (true steel), glass beads, soft grit (walnut shell powder), and plastic beads. Further, an appropriate particle size can be selected depending on a pattern size to be formed. For example, it is preferable to select a particle size of 1/3 or less of a processing width.

[(V) Step of Removing Pattern of Cured Film] FIG. 1 (V) shows a state in which the pattern of the cured film 6 of the photosensitive resin composition layer 3 has been removed. After the step (IV), the pattern of the cured film 6 of the photosensitive resin composition layer 3 used as the etching mask is sprayed with a removing solution using an alkaline aqueous solution, an organic solvent, or a mixed solution thereof,
It can be removed by a known method such as rocking immersion, brushing, and scraping. The removal liquid used here is not particularly limited as long as it does not damage materials necessary for manufacturing a plasma display substrate, such as electrodes formed on the substrate 1 and the partition material layer 2.

Next, the pattern of the cured film 6 of the photosensitive resin composition layer 3 is removed, and the partition wall material layer 2 formed on the substrate 1 is subjected to a predetermined baking treatment, so that minute discharge light emitting regions are partitioned. Can be manufactured. Further, as a method of removing the pattern of the cured film 6 of the photosensitive resin composition layer 3, it can be removed in a baking treatment.

[0043]

Next, the present invention will be described in detail with reference to examples. Production Example 1 [Preparation of Photosensitive Film] A solution containing the materials shown in Table 1 was uniformly applied on a 25 μm-thick polyethylene terephthalate film, and dried with a hot air convection dryer at 100 ° C. for 5 minutes. The solvent is removed and the film thickness after drying is 50μ.
m of the photosensitive resin composition layer was obtained. Next, a polyethylene film was laminated as a protective film on the photosensitive resin composition layer to obtain a photosensitive film.

[0044]

[Table 1]

Example 1 [Preparation of Partition Wall] [(I) Step of Forming Partition Material Layer on Substrate] On a glass substrate on which a Ni electrode was formed, a partition material (manufactured by DuPont;
After printing 9741 glass paste), it was dried (15 minutes / 150 ° C.) to form a partition wall material layer having a thickness of 160 to 180 μm.

[(II) Step of Forming Photosensitive Resin Composition Layer on Partition Material Layer] Next, on the partition material layer, the photosensitive film prepared in Production Example 1 is thermocompressed with a laminator. (VLM-1500, manufactured by Hitachi Chemical Co., Ltd.)
Speed 0.5 m / min, the pressure 2 kgf / cm ^2, temperature 120
Laminated at a temperature of ° C. to form a photosensitive resin composition layer.

[(III) The photosensitive resin composition layer is exposed,
Step of developing and forming a pattern of a cured film of the photosensitive resin composition layer) Then, on the photosensitive film formed on the partition material layer, a portion corresponding to the partition pattern to be formed is exposed. Photomask (stripe pattern, exposed part width 100 μm,
Non-exposed part width 470 μm) is brought into close contact, and 100 mJ is applied with an ultra-high pressure mercury lamp exposure machine (Oak Seisakusho, HMW-201GX).
/ cm ² . After the exposure, spray development was performed with a 1% by weight aqueous solution of sodium carbonate at 30 ° C. for 100 seconds, and then an ultraviolet irradiator (manufactured by Toshiba Electric Materials, rated voltage 200 V, rated power consumption 7.2 kW, compatible lamp H56001 / 2, number of lamps 1) Using the present method, ultraviolet rays of 3 J / cm ² were irradiated to obtain a cured film pattern of a photosensitive resin composition layer having excellent dimensional accuracy corresponding to a negative mask.

[(IV) Step of sandblasting using the pattern of the cured film as a mask] Then, a sandblasting machine (SC-3, fine powder type, manufactured by Fuji Manufacturing Co., Ltd.)
With a silicon oxide abrasive (average particle size 8 μm, maximum particle size 2
0 μm), under the processing conditions of the injection amount of 650 g / min and the processing pressure of 4 kg / cm ² , unnecessary using the pattern of the cured film of the photosensitive resin composition layer formed on the partition wall material layer as a mask. Portions were removed by polishing.

[(V) Step of removing the pattern of the cured film] Next, the photosensitive resin composition layer was immersed in a 5% by weight aqueous solution of sodium hydroxide at 40 ° C. for 5 minutes to peel off the cured film pattern. Then bake at 530 ° C for 10 minutes,
A high-precision partition wall having a partition wall width of 90 μm and a distance between partition walls of 480 μm was obtained.

[0050]

According to the method for manufacturing a partition according to the first aspect, a partition having excellent resolution and sandblast resistance, and having fineness and high positional and dimensional accuracy can be manufactured. The method for producing a partition according to the second aspect has the effect of the method for producing a partition according to the first aspect, and further has excellent environmental hygiene. The method of manufacturing a partition according to the third aspect has the effect of the method of manufacturing a partition according to the first or second aspect, and is more excellent in resolution and sandblast resistance. The method for producing a partition according to claim 4 has the effect of the method for producing a partition according to claim 1, 2 or 3, and is more excellent in environmental health.
Further, the workability is excellent.

[Brief description of the drawings]

FIG. 1 is a schematic view showing each step of a method for producing a partition according to the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 substrate 2 partition material layer 3 photosensitive resin composition layer 4 photomask 5 actinic ray 6 cured film 7 partition

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁶ Identification code Agency reference number FI Technical display location G03F 7/40 521 G03F 7/40 521

Claims (4)

[Claims] 1. A method of manufacturing a partition wall of a plasma display substrate having a partition wall for partitioning a minute discharge light emitting region on a substrate, wherein: (I) a step of forming a partition wall material layer on the substrate; Forming a photosensitive resin composition layer on the material layer, (III) exposing and developing the photosensitive resin composition layer to form a cured film pattern of the photosensitive resin composition layer And (IV) a step of sandblasting using the pattern of the cured film as a mask and (V) a step of removing the pattern of the cured film. 2. A photosensitive resin composition layer comprising: (a) a thermoplastic polymer having a carboxyl group; (b) a copolycarbonate diol having a repeating unit of pentamethylene carbonate and hexamethylene carbonate in a ratio of 5: 5. An ethylenically unsaturated group-containing polymerizable compound containing a reaction product of isophorone diisocyanate and hydroxyethyl acrylate or hydroxyethyl methacrylate, and (c) a photopolymerization initiator that generates free radicals by active light. The method for producing a partition according to claim 1. 3. The polymerizable compound having an ethylenically unsaturated group (b) further comprises a compound represented by the general formula (1): (Wherein, R ¹ and R ² each independently represent a hydrogen atom or a methyl group, and p and q are positive integers selected so that p + q is 4 to 30). The method for producing a partition according to claim 1, which comprises a hydrophilic compound. And (II) forming a photosensitive resin composition layer on the partition wall material layer by using a photosensitive film obtained by laminating a photosensitive resin composition layer on a support film. 4. The method for producing a partition according to claim 1, which is a step of forming a photosensitive resin composition layer.