JPH1065486A - Vibrator and electronic device using the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce occurrence of an improper mount or the like by covering a control element with a cover open to the substrate side and providing an external electrode on the outer face of the cover so as to form the external electrode with a free size. SOLUTION: A crystal-made vibrator 2 is mounted to a lower face side of a substrate 1. The vibrator 2 is mounted to a lower side of the substrate 1 with a metallic frame 3-and a metal-made cover 4 in an air-tight sealing state. A control element 5 is mounted to an upper side of the substrate 1, and the control element 5 is connected to the vibrator 2 via a bonding wire 6, a conductor 7 and a closing conductor path 7a. A cover 8 is covered to the upper side of the control element 5 thereby sealing the control element 5. The cover 8 is shaped so that its lower side is open and a connection electrode 11 is provided to a corner of an outer circumferential frame 9. An external electrode 13 is provided to an outer ceiling face and an outer side face of the cover 8. The external electrode 13 and the conductor 14 are connected to the control element 5 via the connection electrode 11.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vibration device and an electronic device using the vibration device.

[0002]

2. Description of the Related Art A conventional vibrating apparatus comprises a substrate, a vibrator mounted on one surface of the substrate in a hermetically sealed state, and a vibrator mounted on the other surface of the vibrator and controlling the vibrator. The configuration was provided with a control element to perform.

[0003]

In the above-mentioned conventional vibrating apparatus, the external electrodes cover the outer periphery of the control element on the other surface of the substrate with an outer peripheral frame, and the external electrodes are provided at the opening ends of the outer peripheral frame. Met. Since the width of the outer peripheral frame is limited, the dimensions of the outer frame are limited when external electrodes are provided. That is, since the external electrodes cannot be made large, there is a possibility that a mounting defect may occur during mounting.

[0004] Therefore, an object of the present invention is to prevent mounting defects and the like from occurring.

[0005]

According to the present invention, a control element is covered with a cover having an opening on the other side of the substrate, and external electrodes are provided on the outer surface of the cover. It is a thing. According to this configuration, it is possible to provide an external electrode having a free size on the outer surface of the cover, so that a mounting failure or the like is less likely to occur.

[0006]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The invention described in claim 1 of the present invention is directed to a substrate, a vibrator hermetically mounted on one surface of the substrate, and a vibrator mounted on the other surface of the substrate. And a control element for controlling the vibrator, wherein the control element is covered with a cover having an open side on the other side of the substrate, and an external electrode is provided on an outer surface of the cover. Since the external electrodes are provided on the outer surface of the cover, the external electrodes can be formed to have an arbitrary size on the outer surface of the cover, thereby reducing the occurrence of mounting defects and the like when mounting using the external electrodes. is there.

According to a second aspect of the present invention, there is provided the semiconductor device according to the first aspect, wherein a connection electrode for connecting to the substrate is provided on an opening edge of the cover, and a sealing band is provided on an inner peripheral side or an outer peripheral side of the connection electrode. The vibration device according to the above, wherein a control element on the substrate can be sealed with the cover by bonding an opening edge of the cover to a sealing band of the substrate.

[0008] The invention according to claim 3 of the present invention further provides
3. The vibrating device according to claim 1, wherein a triangular connection electrode having a vertex at a corner is formed at four corners of an opening edge of the cover and at an opposing portion of the substrate facing the cover. The positioning of the connection electrodes on the cover and the connection electrodes on the substrate is performed by positioning and mounting the connection electrodes, so that reliable connection can be made.

The invention according to claim 4 of the present invention is directed to any one of claims 1 to 3, wherein a protrusion is formed on one of the opening edge of the cover and the substrate opposed thereto, and a recess is formed on the other. The vibration device according to any one of claims 1 to 3, wherein the positioning between the cover and the substrate is ensured by fitting the concave and convex portions formed by the cover and the substrate.

[0010] Further, the invention according to claim 5 of the present invention provides:
A corner portion of the opening edge of the cover and a convex portion on one side of the substrate portion facing the corner portion, a concave portion is formed on the other side, and in a state where the opening edge of the cover is in contact with the substrate,
The vibration device according to claim 1, wherein a gap is formed between the concave and convex portions, wherein the positioning concave and convex portions are in a state where the opening edge of the cover and the substrate are in contact with each other. By adopting a configuration in which the concave and convex portions do not contact, the opening edge of the cover surely contacts the substrate, and the sealing property is improved.

According to a sixth aspect of the present invention, in the vibration device according to the first aspect, a spring is interposed between the connection electrode of the cover and the connection electrode of the substrate, and the cover is connected by a dimensional absorption effect of the spring. The connection electrode between the electrode and the substrate is
This ensures that the cover is electrically connected with the cover attached to the board.

According to a seventh aspect of the present invention, a spring is inserted into the opening at the opening edge of the cover, at one side of the substrate, or at both of the opposing portions. A vibrating device, in which the spring is positioned by inserting the spring into the hole, thereby improving workability.

According to an eighth aspect of the present invention, a terminal is planted on an outer peripheral frame of a cover, one end of the terminal is drawn out of the cover, and the other end of the terminal is projected into the cover. 2. The vibrating device according to claim 1, wherein the protrusion is provided with elasticity, and the terminal is formed integrally with the cover, thereby facilitating the formation of the terminal and the elasticity of the portion protruding into the cover. Thereby, the electrical connection between the cover and the substrate is ensured.

According to a ninth aspect of the present invention, there is provided the vibration device according to any one of the first to eighth aspects, wherein a shield electrode is provided on an inner top surface of the cover. And a shield electrode can be provided very easily on the inner top surface of the cover.

An embodiment of the present invention will be described below with reference to the accompanying drawings. (Embodiment 1) In FIGS. 1 to 5, reference numeral 1 denotes a substrate having a structure in which a plurality of ceramic plates are laminated, and a quartz oscillator 2 is mounted on the lower surface of the substrate. A metal frame 3 for seam welding is provided on the outer periphery of the quartz-crystal vibrator 2, and a metal cover 4 is provided on the lower surface opening of the metal frame 3.
Are thereby seam-welded, whereby the vibrator 2 is mounted on the lower surface side of the substrate 1 in a hermetically sealed state.

A control element 5 is mounted on the upper surface side of the substrate 1 as shown in FIG. 2, and the control element 5 is connected via a bonding wire 6, a conductor 7 provided on the substrate 1, and a closed conductive path 7a. Connected to the vibrator 2. That is,
In this configuration, the temperature of the vibrator 2 is ensured by the control element 5.

A cover 8 shown in FIGS. 3 and 4 is put on the upper surface side of the control element 5, whereby the control element 5
Is being sealed.

As shown in FIGS. 1, 3 and 4, this cover 8 has a shape in which the lower surface side is open (it is shown upside down in FIGS. 3 and 4). A metal sealing band 10 is provided on the surface. The four corner portions of the metal sealing band 10 are notched, and a connection electrode 11 having the corner as the apex is provided in a portion of the outer peripheral frame 9 corresponding to the corner portion. Further, a shield electrode 12 is provided on the inner top surface of the cover 8 and is connected to one of the connection electrodes 11 (not shown). Also cover 8
As shown in FIG. 5, the outer electrodes 13
Is provided. The external electrode 13 and the connection electrode 11 provided on the outer peripheral frame 9 are connected by a conductor 14 as shown in FIG.

On the other hand, as shown in FIG. 2, the substrate 1 is also provided with a similar sealing band 15 facing the sealing band 10 of the cover 8 and a connection electrode 16 on the outer periphery thereof. That is, when the cover 8 is mounted on the upper surface of the substrate 1 as shown in FIG.
1. The control element 5 is connected to the control element 5 via the connection electrode 16, and the control element 5 is electrically connected to the vibrator 2 as described above.

The mechanical bonding of the cover 8 and the substrate 1 is performed by electrically and mechanically connecting the sealing bands 10 and 15 to each of the sealing bands 10 and 15 with a conductor such as a solder metal or a conductive adhesive. In this way, the two are bonded and fixed.
Of course, at this time, the connection electrodes 11 and 16 are also connected by a solder metal or a conductive adhesive. Note that the sealing bands 10 and 15 are made of a conductor in this example,
Although the joining of both is an example using a conductive material such as solder, the joining at the same portion can also use a non-conductive adhesive, for example, a resin-based adhesive or a low-melting glass adhesive. It is. Of course, in this case, it is also possible to omit providing conductivity to the sealing bands 10 and 15.

(Embodiment 2) FIG. 6 shows Embodiment 2 of the present invention. In this embodiment, two or more portions of the cover 8 where the connection electrodes 11 are formed are projected downward. On the other hand, two or more corners of the substrate 1 corresponding to the projections 17 are provided with recesses 18 having shapes corresponding to the projections 17. The cover 8 is placed and joined to the upper surface of the substrate 1 so that the projection 17 is fitted into the recess 18 of the substrate 1.
The connection between 1 and 16 is also made electrically by solder metal or conductive adhesive.

In this case, when the opening edge of the cover 8 is placed on the upper surface of the substrate 1 and the sealing bands 10 and 15 are in contact with each other, a gap is formed between the projection 17 and the recess 18. It has become. That is, when the projection 17 and the recess 18 come in contact with each other, the contact portion serves as a support, thereby preventing the opening edge of the cover 8 from contacting the substrate 1.

(Embodiment 3) FIGS. 7 and 8 show a third embodiment. In this embodiment, the projections 17 shown in FIG.
And four concave portions 18 are provided. That is, concave portions 18 are provided at the four corners of the substrate 1, and projections 17 are provided at four corner portions of the cover 8 facing the concave portions 18, so that the cover can be mounted on the substrate 1. This is a configuration that is easier. That is, the concave portions 18 provided at the four corners of the substrate 1 and the convex portions 17 of the cover 8 opposed to and aligned with the same position are fitted with the concave and convex portions when the cover 8 is mounted and joined on the substrate 1. 1 and cover 8
Is easily and reliably achieved.

In the present embodiment, the above-mentioned uneven portions are formed at four corners. However, the object can be similarly achieved by providing three or more portions. The same effect can be obtained by a configuration in which the fitting concave and convex portions having different dimensions are formed at two diagonal corners.

Further, in this embodiment, the concave portion 18 is formed on the substrate 1 side and the convex portion 17 is formed on the cover 8 side. However, there is no problem even if the convex portion is formed on the substrate side and the concave portion is formed on the cover side.

(Embodiment 4) FIGS. 9 and 10 show Embodiment 4. In this embodiment, an outer peripheral frame 9 of a cover 8 is provided.
A hole 20 is also formed in the substrate 1 opposed to the hole 19, and connection electrodes 11 and 16 are provided inside the holes 19 and 20, respectively. Hole 19,
20 is obtained by inserting a conductive spring 21 into the inside 20. That is, according to this configuration, after the spring 21 is inserted into the hole 20 of the substrate 1 and the cover 8 is placed on the substrate 1, the spring 21 is compressed as shown in FIG. The connection electrode 16 of the cover 8 is a spring 21
Is electrically connected via the.

(Fifth Embodiment) FIGS. 11 and 12 show a fifth embodiment in which a plurality of lead terminals 22 are implanted in a cover 8b. In this case, the cover 8b is made of a synthetic resin material, and as shown in FIG. 12, the lead terminal 22 passes through the outer wall surface and the outer top surface of the cover 8b, then passes through the inside of the cover 8b member, and projects into the cover 8b. 23 is a cover having a structure integrally formed of a synthetic resin material for a cover, using a lead terminal member previously processed into a shape having elasticity.

When the cover 8b is placed and joined at a predetermined position on the substrate 1 as shown in FIG.
3 is pressed against the connection electrode 16 on the substrate 1 so that the substrate 1 is connected to the lead terminals 22 of the cover 8b. In this example, the connection electrode 16 on the substrate 1 is provided inside the sealing band 15.

In this embodiment, the cover 8b is manufactured by integrally molding the cover 8b with a resin on the hoop-shaped lead terminal 22 as shown in FIG. Cover 8 held by
After mounting and fixing the substrate 1 to the substrate b, the surplus portion of the lead terminal 22 is cut to form a vibration device as shown in FIG.

The shield electrode 12b shown in FIG.
When the resin of the cover 8b is integrally molded, the cover 8b is formed on the inner top surface or inside the top surface.

The first to fifth embodiments are received in a case of an electronic device such as a cellular phone, and function as an oscillator.

In this case, as shown in FIG. 5 or FIGS. 7 and 8, the external electrodes 14 can be formed on the upper surface of the cover 8 at arbitrary positions and dimensions. It is easy and reliable, and the workability can be improved.

[0033]

As described above, according to the present invention, the substrate, the vibrator mounted on one surface of the substrate in a hermetically sealed state, and the vibrator mounted on the other surface of the substrate are controlled. A control element that covers the control element with a cover having the substrate opened on the other side of the substrate, and external electrodes are provided on the outer surface of the cover. It can be set at any position on the top surface and with any size.Therefore, when mounting and connecting to various electronic devices using these external electrodes, the degree of freedom in mounting is extremely high and the reduction of mounting defects is reduced. It can be planned.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of Embodiment 1 of the present invention.

FIG. 2 is a plan view of the substrate.

FIG. 3 is a plan view from the lower surface side of the cover.

FIG. 4 is a partially cutaway front view of the cover.

FIG. 5 is an exploded perspective view thereof.

FIG. 6 is a partially cutaway front view of the second embodiment of the present invention.

FIG. 7 is an exploded perspective view of Embodiment 3 of the present invention.

FIG. 8 is a perspective view thereof.

FIG. 9 is a partially cutaway front view of the fourth embodiment of the present invention.

FIG. 10 is a partially cutaway exploded front view thereof.

FIG. 11 is a sectional view of a fifth embodiment of the present invention.

FIG. 12 is an exploded sectional view of the same.

FIG. 13 is a plan view of the cover viewed from the lower surface side.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Substrate 2 Oscillator 5 Control element 8 Cover 10 Seal band 11 Connection electrode 12 Shield electrode 13 External electrode 15 Seal band 16 Connection electrode 17 Projection (convex part) formed on cover side 18 Depression formed on substrate side 19 , 20 hole 21 spring 22 lead terminal

 ──────────────────────────────────────────────────の Continued on the front page (72) Inventor Yoshihisa Kumita 1006 Kazuma Kadoma, Kadoma City, Osaka Prefecture Inside Matsushita Electric Industrial Co., Ltd.

Claims (10)

[Claims] 1. A substrate, a vibrator hermetically sealed on one surface side of the substrate, and a control element mounted on the other surface side of the substrate and controlling the vibrator. A vibrating device comprising: a control element covered by a cover having an open side on the other side of the substrate; and an external electrode provided on an outer surface of the cover. 2. The vibration device according to claim 1, wherein a connection electrode with the substrate is provided on an opening edge of the cover, and a sealing band is provided on an inner peripheral side or an outer peripheral side of the connection electrode. 3. A connecting electrode having a triangular shape having a corner as a vertex at four corners of an opening edge of the cover.
The vibration device according to any one of the above. 4. The vibrating device according to claim 1, wherein a convex portion is formed on one of the opening edge of the cover and the substrate opposed thereto, and a concave portion is formed on the other. 5. In a state where a convex portion is formed on one of a corner portion of an opening edge of the cover and a substrate portion facing the corner portion and a concave portion is formed on the other, and the opening edge of the cover is in contact with the substrate, 2. A gap is formed between the concave and convex portions.
5. The vibration device according to any one of items 4 to 4. 6. The vibration device according to claim 1, wherein a spring is interposed between the connection electrode of the cover and the connection electrode of the substrate. 7. The vibration device according to claim 6, wherein a hole is provided on one side at an opening edge of the cover and / or a portion facing the substrate, and a spring is inserted into the hole. 8. A terminal in which a terminal is implanted in an outer peripheral frame of the cover, one end of the terminal is pulled out of the cover, and the other end of the terminal is projected into the cover, and a projecting portion in the cover is provided with elasticity. Item 4. The vibration device according to Item 1. 9. The vibration device according to claim 1, wherein a shield electrode is provided on the inner top surface or inside the top surface of the cover, and the cover is connected to the substrate via connection electrodes. 10. An electronic device having the vibration device according to claim 1 incorporated therein as an oscillator.