JPH1063854A - Mark recognition device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To make it possible to securely recognize a mark provided to confirm the position of a circuit board when flux is stuck on the mark by providing a 1st polarizing filter provided between the mark and an image pickup means, a 2nd polarizing filter which crosses a Nicol. SOLUTION: Light 12b reflected by the board 1 is put in a CCD camera 12, so the camera 12 picks up an image of the board 1. When the mark is arranged on the board 1, light 12a reflected on the flux 4 does not reach the camera 12 and light reflected by the mark is irregularly reflected, so it passes through the 2nd polarizing filter 22, so that an image of the mark is picked up by the camera 12. On the basis of the image of the mark picked up by this camera 12, the position of the mark is indicated by a control part. Consequently, even when the flux 4 on the board 1 is coated or when the mark arranged on the board 1 is coated with the flux 2, the mark can securely be photographed by the camera 12.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a mark recognizing device for recognizing a mark for recognizing a position provided on a circuit board on which electronic components are mounted.

[0002]

2. Description of the Related Art A mounting device for mounting an IC chip or the like on a circuit board is known. In this mounting device, solder is printed in advance at a position where an IC chip is to be mounted, and a solder printing device is also known.

In order to print solder with this solder printing apparatus, it is necessary to accurately recognize the position of the circuit board. Therefore, as shown in FIG. 5, a circuit board 1 is provided with a mark 2 made of, for example, copper foil. Have been.

Then, the mark 2 is recognized by imaging the mark 2 with a CCD camera, and the circuit board 1 is recognized.
Is detected. FIG. 6 shows a camera using a CCD camera.
The mark recognition device for recognizing mark 2 will be described. FIG.
, 11 is a lamp for irradiating light. The light emitted from the lamp 11 is reflected by a mark 2 provided on the substrate, and then enters a CCD camera 12. The position of the mark 2 is recognized by processing the image of the mark 2 captured by the CCD camera 12 and recognizing the image.

[0005]

When solder is printed on the circuit board 1 by a solder printing apparatus, the flux 4 contained in the solder may adhere to the mark 2 as shown in FIG. When the flux 4 adheres to the mark 2 as described above, the light 1 emitted from the lamp 11
1a is reflected on the surface of the flux 4 and reflected light 1
The light is incident on the CCD camera 12 as 2a. Note that 12
b is the light reflected by the mark 2 and incident on the CCD camera 12.

When the flux 4 adheres to the mark 2 as described above, a part of the light 11a emitted from the lamp 11 is reflected by the flux 4, so that the light 11a is reflected by the mark 2 and is reflected by the CCD 2. Since the amount of light incident on the camera 12 is reduced, there is a problem that it is difficult to recognize the mark 2.
When the amount of light reflected by the mark 2 and incident on the CCD camera 12 is greatly reduced, there is a problem that the mark 2 cannot be recognized.

SUMMARY OF THE INVENTION The present invention has been made in view of the above points, and has as its object to surely make a mark when flux is attached to a mark provided for confirming the position of a circuit board. An object of the present invention is to provide a mark recognition device capable of recognizing the mark.

[0008]

According to a first aspect of the present invention, there is provided a mark recognition apparatus for irradiating a mark provided on a circuit board with light, and polarizing the light radiated from the illuminator. A first polarization filter, imaging means for capturing an image of the mark, and a second polarization filter provided between the mark and the imaging means and intersecting the first polarization filter and Nicol. And a filter.

According to a second aspect of the present invention, there is provided a solder printing apparatus for printing solder on a circuit board, comprising: a solder printing means for printing solder on the circuit board; and a mark provided on the circuit board. An illumination unit for irradiating light to the light source, a first polarizing filter for polarizing the light emitted from the illumination unit, imaging means for capturing an image of the mark, and the mark and the imaging means. Provided between the first
And a second polarizing filter that crosses Nicols. According to a third aspect of the present invention, there is provided a mark discriminating apparatus, wherein the second polarizing filter is orthogonal to the first polarizing filter in Nicols.

[0010]

According to the present invention, the light emitted from the illumination unit is polarized through the first polarizing filter, and the light reflected by the mark passes through the second polarizing filter. The image is taken by means. However, the light reflected by the flux on the mark does not pass through the second polarizing filter and is not incident on the image pickup means. Therefore, the imaging means includes a marker.
Since only the image of the mark is incident, it is possible to surely recognize the mark.

[0011]

BRIEF DESCRIPTION OF THE DRAWINGS FIG. 1 is a block diagram showing a first embodiment of the present invention;
An embodiment will be described. FIG. 1 is a diagram showing a configuration of a mark recognition device. In FIG. 1, reference numeral 11 denotes a lamp for outputting light 11a for irradiating a mark 2 on a substrate 1. A first polarizing filter 21 is provided between the lamp 11 and the substrate 1.

A second polarizing filter 22 is provided in an optical path where the light 11a is reflected by the substrate 1 or the flux 4. The second polarizing filter 22 of the first polarizing filter 21 is disposed at a position where the Nicols intersect. In this embodiment, the first polarizing filter 21 and the second polarizing filter 22 are provided at positions where Nicols are orthogonal to each other.

The CCD camera 12 is disposed behind the second polarizing filter 22. By the way, in FIG. 1, reference numeral 12a denotes light in which the light 11a is reflected by the flux 4, and reference numeral 12b denotes light in which the light 11a is reflected on the substrate 1.

FIG. 2 is a perspective view showing a main part. Next, an embodiment of the present invention configured as described above will be described with reference to FIGS. The light 11a emitted from the lamp 11 is polarized by the first polarizing filter 21, and is emitted to the substrate 1 as light 11b.

When the light 11b is reflected by the surface of the flux 4 applied on the substrate 1, the light 11b
The light 12a polarized in the same manner as the light radiated from is reflected. However, this light 12a is
Cuts most. Therefore, flux 4
The light 12a reflected on the surface of the camera does not reach the CCD camera 12.

On the other hand, when the light 12a is reflected by the substrate 1, the light 12a is irregularly reflected, so that the light bias is reduced. For this reason,
The light 12 b reflected by the substrate 1 is captured by the CCD camera 12.

As described above, since the light 12b reflected by the substrate 1 is captured by the CCD camera 12, the CCD camera 1
2, an image of the substrate 1 is captured. Therefore, when the mark 2 is provided on the substrate 1 as shown in FIG. 5, the light 12a reflected on the flux 4 does not reach the CCD camera 12, but is reflected on the mark 2. The reflected light is irregularly reflected and passes through the second polarizing filter 22, so that the image of the mark 2 is captured by the CCD camera 12.

The position of the mark 2 is determined by a control unit (not shown) based on the image of the mark 2 picked up by the CCD camera 12. In this way, even when the flux 4 on the substrate 1 is applied, or when the flux 4 is applied to the mark 2 provided on the substrate 1, the image of the mark 2 can be reliably formed. Can be taken by the CCD camera 12. Therefore, by recognizing the mark 2,
The position of the substrate 1 is recognized.

The optical system for recognizing the mark 2 can be applied to a solder printing apparatus for printing solder as shown in FIG. In FIG. 3, reference numeral 31 denotes an apparatus base. The device base 31 has two guide rails 32 and 33 in the X direction, both ends of which are support members 3.
4a, 34b and supporting members 35a, 35b.

A universal backup 36 is provided so that the sides facing the guide rails 32 and 33 are slidably supported. The universal backup 36 supports a mask 37. The mask 37 is disposed directly below the mask 37 as shown in FIG.
A hole corresponding to the pattern on the substrate is previously formed by etching or the like at a portion where the solder paste is to be printed.

The universal backup 36 is provided with two guide rails 38a and 38b in the Y direction. These guide rails 38a, 38
A brush support 39 guided by b is mounted.

A brush 40 is supported on the brush support 39 so that the printing pressure can be feedback-controlled. A solder paste is attached to the brush 40, and the brush 40 is operated on the mask 37 by operating the brush support 39 in the Y direction. Solder paste is printed on a circuit board.

Reference numerals 41 and 42 denote CCD cameras for recognizing the positions of the mark 2 and the mask 37 provided on the circuit board 1. CC for recognizing mark 2
The D camera 41 corresponds to the above-described CCD 12 in FIG.

The CCD cameras 41 and 42 are supported by camera support members 43 and 44, respectively. The camera support members 43 and 44 are slidably supported by guide rails 45 in the Y direction. Both ends of the guide rail 45 are supported by the apparatus base 31.

In the solder printing apparatus constructed as described above, the flux 4 adheres to the mark 2 provided on the circuit board 1 by mounting the mark recognition device as shown in FIG. In this case, the mark 2 can be recognized by the CCD camera 41.

In the above embodiment, the mark recognition by the CCD camera 12 is not limited to the solder printing apparatus, but can be applied to a mounting apparatus for mounting electronic components.

[0027]

According to the first to third aspects of the present invention,
It is possible to provide a mark recognition device capable of reliably recognizing a mark provided with flux on a mark provided for checking the position of a circuit board.

[Brief description of the drawings]

FIG. 1 is a diagram showing a configuration of a mark recognition device according to an embodiment of the present invention.

FIG. 2 is a perspective view of a mark recognition device according to one embodiment of the present invention.

FIG. 3 is a perspective view showing a solder printing apparatus provided with the mark recognition device.

FIG. 4 is a view showing a mark provided on a circuit board.

FIG. 5 is a cross-sectional view of the circuit board at a position where a mark is provided.

FIG. 6 is a diagram showing a conventional mark recognition device.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Circuit board, 2 ... Mark, 4 ... Flux, 11 ... Lamp, 12 ... CCD camera, 21 ... First polarizing filter, 22 ... Second polarizing filter.

Claims (3)

[Claims] An illumination unit for irradiating a mark provided on a circuit board with light, a first polarizing filter for polarizing light emitted from the illumination unit, and capturing an image of the mark And a second polarization filter provided between the mark and the imaging means and intersecting the Nicol and the first polarization filter. 2. A solder printing apparatus for printing solder on a circuit board, comprising: a solder printing means for printing solder on the circuit board; and an illuminating unit for irradiating light on a mark provided on the circuit board. A first polarizing filter for polarizing light emitted from the illuminating section; imaging means for capturing an image of the mark; and a first polarizing filter provided between the mark and the imaging means. A solder printing apparatus, comprising: a polarizing filter and a second polarizing filter that crosses Nicols. 3. The mark discriminating apparatus according to claim 1, wherein the second polarizing filter is orthogonal to the first polarizing filter in Nicols.