JPH1054844A - Probe device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To surely bring a check pin and an earth pin into contact with objects to be contacted by supporting the earth pin and a probe main body in a state where they can slide relatively to each other. SOLUTION: A probe main body 31 is provided with a probe device 20, a check pin 32 which is connected to another measuring instrument at its front end section, and an adjustment dial 34 which is positioned above the pin 32. A conductive slide arm 33 has an L-shape and its front end section is constituted as an earth pin 33a which is extended in parallel with the main body 31. At the time of measuring the electrical characteristics of an element to be measured, the dial 34 is turned while the earth pin 33a is brought into contact with an earth terminal 23 and the check pin 32 is brought into contact with a desired signal terminal by sliding the arm 33 and moving the pin 32 around the earth pin 33a. It is also possible, on the contrary, to bring the check pin 32 into contact with the earth terminal 23 by sliding the slide arm 33 by turning the dial 34 and moving the earth pin 33a around the pin 32 after the pin 32 is brought into contact with the desired signal terminal by moving the pin 32.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a probe device, and more particularly to a probe device for measuring the electrical characteristics of an electronic circuit by bringing a check pin and an earth pin into contact with a signal terminal and an earth terminal of the electronic circuit.

[0002]

2. Description of the Related Art In a process of mass-producing electronic devices such as a television receiver and a video tape recorder, it is indispensable to measure electric characteristics of electronic circuits used in the electronic devices. An oscilloscope having a probe device is used for this measurement. As a conventional probe device, there is one described in Japanese Patent Application Laid-Open No. 62-242874.

In the probe device described in the above publication, FIG.
As shown in (1), a rod-shaped check pin (probe needle) 15 at the tip of a probe 14 is brought into contact with a copper foil pattern 12 connected to a signal terminal of an electronic circuit mounted on a printed circuit board 11 and connected to a ground terminal. The ground pin 16 of the probe 14 is brought into contact with the grounded copper foil pattern 13, and the electrical characteristics of the electronic circuit are measured by a measuring device (not shown) which receives the signal of the check pin 15. The copper foil pattern 12 is formed with test points 12a plated with through holes, and the copper foil pattern 13 for ground is formed with ground points 13a plated with through holes at positions adjacent to the test points 12a. I have. An earth pin 16 is detachably mounted on the cylindrical portion 14a above the check pin 15. Earthpin 16
Consists of a coil spring-shaped mounting portion 16a and a rod-shaped insertion portion 16b, and is mounted on the probe 14 by fitting the mounting portion 16a to the cylindrical portion 14a.

When measuring the electrical characteristics of an electronic circuit to be measured using the probe device, first, test points 12a and 12a are selected from various ground pins 16 having different intervals between the mounting portion 16a and the insertion portion 16b. Earth point 13
The one corresponding to the interval a is selected, and the selected earth pin 16 is mounted on the cylindrical portion 14a of the probe 14. Thereafter, the insertion portion 16b of the ground pin 16 is inserted into the ground point 13a while the check pin 15 is inserted into the test point 12a. As a result, the check pin 15 is electrically connected to the copper foil pattern 12 and the ground pin 16 is electrically connected to the ground copper foil pattern 13, so that the electrical characteristics of the electronic circuit are measured by the measuring instrument. be able to.

[0005]

When measuring an electronic circuit with the above-mentioned conventional probe device, the check pin 15 and the ground pin 16 are brought into contact with the test point and the ground point as close as possible to the terminal of the device under test. It can be done. However, the number of test points and ground points is limited, and it is difficult to make the check pin 15 and the ground pin 16 contact the test points and ground points close to all the terminals to be measured. In order to measure the electronic circuit more accurately, it is desirable to directly contact the check pin 15 and the ground pin 16 with the terminals of the device under test forming the electronic circuit mounted on the printed circuit board, but this is also difficult in practice. It is.

[0006] Each time measurement is performed, the test point 12a
It is necessary to select and replace the earth pin corresponding to the distance between the ground point 13a and the earth pin 13a. However, it is difficult to prepare the number of ground pins corresponding to all the distances between the two points 12a and 13a.

SUMMARY OF THE INVENTION In view of the above, it is an object of the present invention to reliably contact a check pin and a ground pin with a desired test point and a ground point or a signal terminal and a ground terminal of an electronic circuit without replacing the ground pin each time. It is an object of the present invention to provide a probe device that can measure the electrical characteristics of an electronic circuit more accurately.

[0008]

In order to achieve the above object, a probe device according to the present invention is a probe device comprising a check pin provided on a probe main body and an earth pin held apart from the probe main body. And a support member for supporting the earth pin and the probe body so as to be relatively slidable.

In the probe apparatus of the present invention, the test pin and the ground point as close as possible to the electronic circuit to be measured or the signal terminal and the ground terminal of the electronic circuit can be reliably connected without replacing the ground pin each time. Since the check pin and the ground pin can be brought into contact with each other, the electrical characteristics of the electronic circuit can be measured more accurately.

Preferably, the apparatus further comprises an adjusting mechanism for adjusting a distance between the ground pin and the check pin. Preferably, the support member is slidably penetrated through a through-hole formed in the probe main body, and has a slide arm having one end fixed to the ground pin. Further, a rack is formed on the side surface of the slide arm along the length direction of the arm, and the adjusting mechanism has a gear portion rotatably supported by the probe main body and meshing with the rack on an outer peripheral surface. It preferably comprises an adjustment dial.

It is preferable that the ground pin slides by a distance corresponding to a distance between adjacent signal terminals provided on the device under test forming an electronic circuit when the adjustment dial is rotated by one division. According to this configuration, when measuring the electrical characteristics of the electronic circuit mounted on the printed circuit board, the distance between the check pin and the ground pin is quickly changed in accordance with the distance between the signal terminals of the device under test that forms the electronic circuit. Can be adjusted.

[0012]

The present invention will be described in more detail with reference to the drawings. FIG. 1 is a perspective view showing a probe device according to an embodiment of the present invention, and FIG. 2 is a perspective view showing the probe device in a state when measuring a device to be measured different from FIG. As shown in FIG. 1, the probe device 20 includes a probe body 31, a slide arm (supporting member) 33 that slidably supports the ground pin 33 a with respect to the probe body 31, and a ground pin 33 with respect to the check pin 32.
and an adjustment dial 34 for adjusting the position of “a”.

The probe main body 31 has a check pin 32 at a distal end thereof electrically connected to a measuring instrument (not shown) separate from the probe device 20, and an adjustment dial is provided above the check pin 32 in FIG. 34. The adjustment dial 34 is rotatably supported by a shaft 34a and has a gear portion 34b on the outer peripheral surface.

The slide arm 33 is made of a conductive material and has a substantially L-shape as a whole.
An earth pin 33a extending substantially parallel to the probe main body 31 is formed. The straight part excluding the L-shaped tip part is the sliding part 3
3b. In the probe main body 31, a through hole 31a is formed at an intermediate portion between the adjustment dial 34 and the check pin 32 to support the sliding portion 33b of the slide arm 33 so as to be slidable in the left-right direction in FIG. Sliding part 33b
Is electrically connected to the measuring instrument while being insulated from the check pin 32 when supported by the probe main body 31 through the through hole 31a.

Further, the slide arm 33 includes a sliding portion 33.
A rack 33c is formed on the upper surface of the sliding member 33b along the length direction of the sliding portion 33b. When the slide arm 33 is supported slidably with respect to the probe main body 31, the rack 33c has a gear portion 34b of the adjustment dial 34.
Mesh with.

The adjustment dial 34 constitutes an adjustment mechanism for adjusting the distance between the ground pin 33a and the check pin 32. That is, by rotating the adjustment dial 34 clockwise or counterclockwise, the slide arm 33 can be slid left and right in FIG. 1 and the ground pin 33a can be moved with respect to the check pin 32. The adjustment dial 34 is locked by a click stop mechanism (not shown) when the adjustment pin 34 is rotated by an angle that moves the ground pin 33a by a distance corresponding to the distance between adjacent signal terminals of the device under test 28. The adjustment dial 34 is provided with a plurality of scales at equal angular intervals with one scale corresponding to the rotation angle as one scale.

A device under test 28 constituting an electronic circuit under test is mounted on a printed circuit board 19 to be measured. The device under test 28 is a QFP (quad flat package)
And signal terminals 28a, 28b, 28c and a ground terminal 28e that project from the plastic box-shaped frame at predetermined intervals. The printed circuit board 19 has
The copper foil pattern 22 is formed close to the signal terminal 28a of the device under test 28, and the ground copper foil pattern 23 is formed close to the ground terminal 28e. A test point 22a and an earth point 23a plated with through holes are formed on the copper foil patterns 22 and 23, respectively. Test points are also formed on copper foil patterns (not shown) corresponding to the signal terminals 28b and 28c, but are not shown. In addition, signal terminals other than the signal terminals 28a, 28b, and 28c are provided on the device under test 28 at equal intervals, but illustration is omitted.

When measuring the electrical characteristics of the device under test 28 using the probe device 20 having the above-described configuration, first, the adjustment dial 34 is rotated while the ground pin 33a is in electrical contact with the ground terminal 23. Slide arm 33
Is slid, and the check pin 32 is moved to a desired signal terminal with the earth pin 33a as a fulcrum to make electrical contact. Conversely, after the check pin 32 is brought into electrical contact with the desired signal terminal, the adjustment dial 34
Can be rotated to slide the slide arm 33, and the earth pin 13a can be moved with the check pin 32 as a fulcrum to make electrical contact with the earth terminal 28e.

One scale of the adjustment dial 34 corresponds to an angle at which the ground pin 33a is moved by a distance corresponding to a distance between adjacent signal terminals of the device under test 28, so that the measurement is performed by sequentially contacting the adjacent signal terminals. Is very easily adjusted. In particular, when the measurement operation is performed while visually counting the number of signal terminals, the number of signal terminals may be incorrectly counted. Since the earth pin 33a or the check pin 32 can be moved in units of the terminal interval of the device under measurement 28 by the rotation of the adjustment dial 34, the measuring operation performed by sequentially contacting adjacent signal terminals can be performed reliably and quickly. That is, if the present probe device 20 is used, even if the number of terminals is large, a desired terminal can be found immediately by appropriately moving the ground pin 13a or the check pin 32 by rotating the adjustment dial 14.

In the present probe device 20, the probe body 3
Without replacing the ground pin 33a connected to 1 with another one,
By appropriately adjusting the distance between the check pin 32 and the ground pin 33a, the signal terminals 28a,
Any one of 28b and 28c can be reliably and directly contacted. Therefore, it is possible to reliably and directly contact the terminal at a place where the test point or the ground point is not provided, and in that case, the measurement accuracy is further improved.

Next, a case where another device to be measured is measured by the probe device 20 will be described.

The device under test 35 shown in FIG. 2 is mounted on the printed circuit board 29, and is made of a TCP (tape carrier package) having a terminal spacing as small as possible due to high-density design. When measuring such a device under test 35,
Generally, it is extremely difficult to make the check pin 32 and the ground pin 33a contact only desired signal terminals without contacting adjacent signal terminals.

However, if the present probe device 20 is used,
The test point 24a of the copper foil pattern 24 connected to the desired signal terminal of the device under test 35, the test point 25a of the copper foil pattern 25, the test point 26a of the copper foil pattern 26, and the grounding copper connected to the ground terminal The measurement can be performed by appropriately bringing the check pin 32 and the ground pin 33a into contact with the ground point 27a of the foil pattern 27, respectively. In this case, the distance that the earth pin 33a moves with respect to the check pin 32 by one graduation when the adjustment dial 34 is rotated is set to the distance between the copper foil patterns 25, 26, and 27 of the device under test 35 arranged at equal intervals. If correspondingly set, the measurement operation can be performed simply as in the measurement of the device under test 28.

When the device under test 28 is measured in FIG. 1 and when the device under test 35 is measured in FIG. 2, the ground pin 33a in contact with the ground point is used.
If the probe body 31 is rotated with the fulcrum as a fulcrum, the operation for bringing another test point or signal terminal into contact with the probe body 31 becomes easy.

Although the present invention has been described based on the preferred embodiment, the probe device of the present invention is not limited to the configuration of the above-described embodiment, but is based on the configuration of the above-described embodiment. A probe device with various modifications and changes is also included in the scope of the present invention.

[0026]

As described above, according to the probe apparatus of the present invention, the check pin can be connected to the desired test point and ground point or the signal terminal and ground terminal of the electronic circuit without replacing the ground pin each time. As a result, the electrical characteristics of the electronic circuit can be measured more accurately and quickly.

[Brief description of the drawings]

FIG. 1 is a perspective view showing a probe device according to an embodiment of the present invention.

FIG. 2 is a perspective view showing a state when the device to be measured different from FIG. 1 is measured by the probe device.

FIG. 3 is a perspective view showing a conventional probe device.

[Explanation of symbols]

 19, 29 Printed circuit board 20 Probe device 23, 27 Copper foil pattern for ground 24, 25, 26 Copper foil pattern 28, 35 Device under test (electronic circuit) 28a, 28b, 28c Signal terminal 28e Ground terminal 31 Probe body 31a Through hole 32 check pin 33 slide arm (support member) 33a earth pin 33b sliding part 33c rack 34 adjustment dial (adjustment mechanism) 34b gear part

Claims (5)

[Claims] 1. A probe device comprising a check pin provided on a probe main body and an earth pin held apart from the probe main body, wherein a support member for supporting the earth pin and the probe main body so as to be relatively slidable is provided. A probe device, comprising: 2. The probe device according to claim 1, further comprising an adjusting mechanism for adjusting a distance between the ground pin and the check pin. 3. The apparatus according to claim 2, wherein said support member is slidably penetrated through a through hole formed in said probe main body, and has a slide arm having one end fixed to said ground pin. Item 2. The probe device according to item 1. 4. A rack is formed on the slide arm along a length direction of the arm, and the adjusting mechanism includes a gear portion rotatably supported by the probe main body and meshing with the rack on an outer peripheral surface. 4. The probe device according to claim 3, comprising an adjustment dial provided. 5. The ground pin slides a distance corresponding to a distance between adjacent signal terminals provided on a device under test forming an electronic circuit when the adjustment dial is rotated by one division. The probe device according to claim 4.