JPH1051133A - リフロー方法及び装置 - Google Patents
リフロー方法及び装置Info
- Publication number
- JPH1051133A JPH1051133A JP8206736A JP20673696A JPH1051133A JP H1051133 A JPH1051133 A JP H1051133A JP 8206736 A JP8206736 A JP 8206736A JP 20673696 A JP20673696 A JP 20673696A JP H1051133 A JPH1051133 A JP H1051133A
- Authority
- JP
- Japan
- Prior art keywords
- printed circuit
- circuit board
- hot air
- cold air
- reflow
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
- H05K3/3415—Surface mounted components on both sides of the substrate or combined with lead-in-hole components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3494—Heating methods for reflowing of solder
Landscapes
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8206736A JPH1051133A (ja) | 1996-08-06 | 1996-08-06 | リフロー方法及び装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8206736A JPH1051133A (ja) | 1996-08-06 | 1996-08-06 | リフロー方法及び装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH1051133A true JPH1051133A (ja) | 1998-02-20 |
| JPH1051133A5 JPH1051133A5 (enExample) | 2004-08-19 |
Family
ID=16528259
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8206736A Pending JPH1051133A (ja) | 1996-08-06 | 1996-08-06 | リフロー方法及び装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH1051133A (enExample) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7357288B2 (en) | 2003-07-17 | 2008-04-15 | Matsushita Electric Industrial Co., Ltd. | Component connecting apparatus |
| JP2010225749A (ja) * | 2009-03-23 | 2010-10-07 | Sanyo Electric Co Ltd | 太陽電池モジュールの製造方法 |
| JP2016134606A (ja) * | 2015-01-22 | 2016-07-25 | 有限会社ヨコタテクニカ | 電子部品を搭載した基板を熱風で加熱して半田付けするリフロー炉、その熱風循環ユニット及びアタッチメント並びに基板加熱方法 |
-
1996
- 1996-08-06 JP JP8206736A patent/JPH1051133A/ja active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7357288B2 (en) | 2003-07-17 | 2008-04-15 | Matsushita Electric Industrial Co., Ltd. | Component connecting apparatus |
| JP2010225749A (ja) * | 2009-03-23 | 2010-10-07 | Sanyo Electric Co Ltd | 太陽電池モジュールの製造方法 |
| JP2016134606A (ja) * | 2015-01-22 | 2016-07-25 | 有限会社ヨコタテクニカ | 電子部品を搭載した基板を熱風で加熱して半田付けするリフロー炉、その熱風循環ユニット及びアタッチメント並びに基板加熱方法 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A977 | Report on retrieval |
Free format text: JAPANESE INTERMEDIATE CODE: A971007 Effective date: 20040423 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20040518 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20040720 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20041026 |