JPH1050761A - Tape carrier package and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To lessen the leaking and spreading of molding sealing material over to the surface of a tape carrier package(TCP) on the opposite side to its surface to its surface to which the molding sealing material is applied, on the occasion of its application. SOLUTION: By providing protruding substances (dams 5) on the backside of a carrier tape, leaking and spreading of molding sealing material is stopped. On the backside to a surface to which a molding sealing material 7 is to be applied, dam material 4 composed of constituents such as polyimide, epoxy, etc., is printed through a stencil mask 3 made up of a stainless or screen mask. This dam material 4 is moved on the stencil mask 3 by a squeegee 6 made out of silicone rubber and so on. The stencil mask 3 had holes bored at desired positions beforehand, and the dam material 4 creeps into these holes. After that, a dam 5 is formed by hardening, based on heating or ultraviolet ray irradiation. Consequently, it becomes possible to stop the leaking and spreading of the molding sealing material over to the backside of the tape carrier package at desired positions.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a tape carrier package and a method for manufacturing the same, and is particularly suitable for use in a case where resin sealing is performed.

[0002]

2. Description of the Related Art In general, integrated circuit chips are generally used in the form of a kind of container called a package in order to protect them so as to maintain environmental resistance and to electrically connect them to an external circuit. It is. In recent years, demands for lighter, thinner and smaller electronic devices have become more and more active, and naturally the demand for smaller and lighter electronic components used in electronic devices has been escalating. In particular, in the case of an integrated circuit chip, although the circuit itself is reduced, a large number of wirings according to the degree of integration of the circuit are required for connection to an external circuit provided outside, and these wirings do not interfere with each other. The problem was to reduce the size of the package. At present, a package technology called “tape carrier package (hereinafter, referred to as“ TCP ”)” has been developed as one means of a package for solving this problem. T
The CP has been developed for the purpose of reducing the size and weight of the package and improving the efficiency of mass production as an electronic component.

[0003] The general shape of TCP is such that an integrated circuit chip is electrically connected to a packaging base called a "carrier tape", and at least a connection portion between the integrated circuit chip and the carrier tape and an integrated circuit chip. The minimum required portion of the circuit configuration surface is solidified with a material such as a liquid epoxy resin which is solidified by heat or light and is called a mold sealing material. The carrier tape has a thickness of about 100 micrometers and a total length of about tens to hundreds of meters so that the length of the carrier tape is band-shaped. The base material is made of a metal foil such as copper which has a thickness of about 30 micrometers and is used to electrically connect the integrated circuit chip and the external circuit. Are formed at equal intervals for each unit circuit based on the integrated circuit chip to be mounted. The wiring formed on the substrate is plated with gold or tin to a thickness of several micrometers to ensure good connectivity with an integrated circuit chip or an external circuit. The integrated circuit chip is mounted so that it can be hung by a part of the wiring formed on the carrier tape called "inner lead" protruding into a hole called "device hole" opened in the carrier tape. You. In general, the degree of integration of the integrated circuit chip is very high, and the number of inner leads connecting the carrier tape and the integrated circuit chip is several hundred. For this reason, the thickness of one inner lead has to be suppressed to a minute size of about one hundred and several tens of square micrometers, and mechanical strength (strength of the lead itself and connection strength) cannot be sufficiently obtained as it is. In addition, simply connecting to the inner leads exposes the integrated circuit chip itself to the outside, and thus lacks reliability at present, for example, from the viewpoint of moisture resistance. Therefore, in order to ensure mechanical strength sufficient to handle as one electronic component and to ensure environmental resistance, sealing is performed at a desired position using a mold sealing material. In general, a mold encapsulant is used at the joint between the inner lead and the integrated circuit chip and at the circuit configuration surface of the integrated circuit chip called the “active surface”. Epoxy resin or the like is used for the mold sealing material.
A liquid thermosetting or photosetting non-plastic resin having a viscosity of about 0 to 1000 poise is used. The reason for using a resin that hardens by liquid heat or light and does not return to the original liquid for the mold encapsulant is that it can easily apply the resin as a protective material to a fine area, and moreover, it can be used for integrated circuit chips. This is to prevent heat and TCP generated during operation from being melted out by washing or the like like other parts. With the above structure, it is possible to secure electronic components in which hundreds to thousands of integrated circuit chips are packaged. Therefore, not only can the size of the component be reduced, but also there are various advantages such as easy automation in production and easy mass production.

[0004]

As described above, generally, in a tape carrier package, a mold encapsulant is applied to protect a joint between an integrated circuit chip and an inner lead and an active surface of the integrated circuit chip. . T described above
In the CP, since the integrated circuit chip is suspended in a hole formed in the carrier tape, the liquid mold sealing material is applied to the active surface of the suspended integrated circuit chip. When applying a viscous liquid mold sealing material, it is general to drop or print from the active surface side of the integrated circuit chip. However, when viewed in plan, the carrier tape and the integrated circuit chip are not in close contact with each other, and have a gap of about 0.1 to 0.5 mm. This is necessary so that the integrated circuit chip mounted on the carrier tape and the inner lead connected from the carrier tape to the integrated circuit chip do not come into contact with parts other than the electrodes, and are necessary to bend the inner lead. It is a gap. The presence of this gap causes the mold sealing material to spread on the back surface of the TCP. Generally, in TCP requiring a thickness of about 1 mm or less, it is necessary to use a resin having a property of spreading and spreading thinly when applied, but the property of spreading and spreading thinly is harmful, and carrier tape is used. The mold sealing material being applied flows out from the gap between the device hole and the mounted integrated circuit chip to the back side of the surface on which the coating is being applied. The application range of the mold sealing material on the application surface can be freely set according to the worker's will, but the range of the mold sealing material flowing out to the back surface of the TCP depends on the flow characteristics of the mold sealing material. Therefore, at present, the range cannot be adjusted intentionally. In particular, when reducing the size of the TCP in a plane, not only the size of the integrated circuit chip but also the size of the carrier tape is reduced. Therefore, when mounting the TCP as an electronic component on an external circuit board, the TCP should be sandwiched between tools. Therefore, there is a problem that the mold sealing material wets and spreads to a portion where the TCP electrode is provided, which hinders downsizing of the TCP.

SUMMARY OF THE INVENTION Accordingly, it is an object of the present invention to reduce the spread of the mold sealing material on the opposite surface (hereinafter referred to as the "back surface of TCP") of the mold sealing material.

[0006]

SUMMARY OF THE INVENTION The present invention has been made to solve the above problems and attain the object, and a tape carrier package according to claim 1 is a device hole in which an integrated circuit chip is provided. A carrier tape having
A lead provided on the carrier tape and partly protruding into the device hole and connected to each electrode of the integrated circuit chip, and covers at least a surface on which the electrode of the integrated circuit chip is formed. A tape carrier package having a resin,
A projection is provided around the device hole of the carrier tape on the side opposite to the electrode forming side of the integrated circuit chip. By providing a dam on the surface of the carrier tape opposite to the surface on which the mold sealing material is applied, at the position where the mold sealing material is prevented from wetting and spreading, the damping prevents the mold sealing material from spreading and damping. Therefore, the spread of the mold sealing material can be stopped. With this, TCP
Since the dead space other than the portion for mounting the integrated circuit chip and the electrode portion connected to the external circuit board can be reduced, the planar size of the TCP can be reduced. Become.

According to a second aspect of the present invention, there is provided a method for manufacturing a tape carrier package, comprising: forming a protrusion serving as a resin outflow prevention portion for stopping the spread of a mold sealing material on the tape carrier package; The method is characterized in that it includes a step of providing a surface opposite to a surface on which a sealing material is applied.

According to a third aspect of the present invention, the projection is provided by stencil printing.
When a dam is provided by stencil printing, the material used for the dam for stopping the flow of the mold sealing material used for the mold application surface of the carrier tape can be forced, so the carrier tape manufacturing remains the same as the conventional manufacturing process. To be able to do.

According to a fourth aspect of the present invention, in place of the third aspect, the protrusion is provided by dispensing. When the dam is provided by dispensing, it is possible to apply a highly viscous material capable of increasing the height of the dam as a projection, and it is possible to expect more reliable prevention of wet spreading.

According to a fifth aspect of the present invention, in place of the third or fourth aspect, the projection is provided by a laser. When a dam is provided by a laser, the carrier tape itself is formed into a protruding shape by a laser beam, so that it is not necessary to select and purchase a new material, and it is possible to cope only with capital investment of a manufacturing apparatus.

[0011]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to FIGS. First, before the general T
The CP will be described. The general shape of TCP is that a chip for packaging is called a carrier tape, and an integrated circuit chip is electrically connected to a mother body at the time of packaging. The minimum part is solidified with a material such as a liquid epoxy resin which is solidified by heat or light called a mold sealing material. Carrier tape has a thickness of 1
The length of the tape is about several tens to several hundreds of meters so that the length of the tape is about 00 micrometers. The base material of the carrier tape is made of polyimide or the like having heat resistance and chemical resistance. The base material has a thickness of about 30 micrometers and is made of copper or the like for electrically connecting an integrated circuit chip to an external circuit. Wiring made of metal foil is formed at equal intervals for each unit circuit. The wiring formed on the substrate is plated with gold or tin to a thickness of several micrometers to ensure good connectivity with an integrated circuit chip or an external circuit. The integrated circuit chip is suspended in a device hole formed in the carrier tape by a part of a wiring formed on the carrier tape protruding into the hole, that is, an inner lead. For the connection between the inner lead and the integrated circuit chip, a conductive projection made of gold or the like called a bump is provided on an electrode formed in the integrated circuit chip for making an electrical connection with the outside in advance. The bump and the inner lead of the tin-plated carrier tape are connected at a pressure of several tens of grams per connection point and at a temperature of 300 to 50 degrees.
This is done by forming a eutectic alloy of gold and tin by applying while giving a temperature in the range of 0 degrees. However, since the degree of integration of the integrated circuit chip is very high, the number of inner leads connecting the carrier tape and the integrated circuit chip is several hundred, and the thickness of one inner lead is more than one hundred and ten square. In this case, sufficient mechanical strength cannot be obtained, and the integrated circuit chip is also exposed to the outside. Therefore, in order to ensure sufficient mechanical strength to handle as one electronic component and to ensure environmental resistance, the junction between the inner lead and the integrated circuit chip and the integrated circuit chip called the active surface are required. A liquid thermosetting or photocuring non-plastic resin having a viscosity of about 20 to 1000 poise, which is made of epoxy or the like called a mold sealing material, is applied to the circuit configuration surface. Harden by applying heat. The reason for using a resin that is cured by liquid heat or light and does not return to the original liquid for the mold encapsulant is that the resin as a protective material can be easily applied to fine parts, and the operation of integrated circuit chips This is in order to prevent heat or TCP generated due to its low operation efficiency from being melted out by washing or the like like other parts. According to the above-described manufacturing method, electronic components in which a chip for an integrated circuit is housed in a container at a time on a scale of several hundreds to several thousands can be obtained, so that not only can the size of the component be reduced, but also It has the advantage of being easy to automate and easy to mass produce.

A method of using TCP as an electronic component is as follows: a circuit board on which TCP is to be mounted;
The electrode provided on P is soldered to the electrode on the circuit board,
Alternatively, the connection is generally made with an adhesive or an adhesive tape having anisotropic conductive properties. At this time, T
Since the electrodes of the CP are formed on the same plane of the carrier tape, the TCP and the electrodes of the circuit board are sandwiched by a block-shaped tool called a "tool", so that the electrodes are collectively joined to the circuit board.

FIGS. 1 to 3 show an embodiment of the present invention. FIG. 1 is a schematic plan external view of a product to which the present invention is applied, and FIG. 2 is a sectional view taken along the line AA ′ shown in FIG. FIG. 3 and FIG. 4 explain the outline of a method of manufacturing a dam used for preventing the wetting and spreading of the mold sealing material by stencil printing. 1 and 2, reference numeral 1 denotes an integrated circuit chip having a plurality of electrodes on a circuit configuration surface (active surface). Reference numeral 2 denotes a carrier tape, which serves as a base for packaging the integrated circuit chip as described above. Reference numeral 5 denotes a resin outflow prevention unit (hereinafter, referred to as “dam”). Reference numeral 7 denotes a mold sealing material that seals necessary parts. With respect to the carrier tape 2 before the integrated circuit chip 1 is bonded, as shown in FIG.
A dam member 4 made of a resin such as polyimide or epoxy is printed on the back surface of the surface on which the mold sealing material 7 is applied via a stencil mask 3 made of stainless steel or a screen mask. The stencil mask 3 is provided with a hole of a size to be provided in a portion corresponding to a position on the carrier tape 2 where the dam 5 is to be provided. Dam material 4 is stencil mask 3
It is placed on the top and moved to the position of the hole by a squeegee 6 made of silicone rubber or the like. At this time, dam material 4
And the pressure received from the squeegee 6 causes the dam member 4 to enter the hole formed in the stencil mask 3. As shown in FIG. 4, by using a squeegee 6 that is sufficiently larger than the hole formed in the stencil mask 3, the stencil 6 can be removed by the thickness of the stencil mask 6 without scraping out the dam member 4 that has entered the hole. Only the dam member 4 can be filled in the holes of the stencil mask 6. After the series of operations described above using a stencil mask and a squeegee, when the stencil mask 3 is removed from the carrier tape 2, a necessary amount of dam material 4 remains on the carrier tape. When the dam material has a property of being hardened by heating, the carrier tape 2 on which the dam material 4 is printed is heated in the range of 50 to 200 degrees to harden the dam material 4 and harden the dam 5.
To When the dam member 4 has a property of being cured by ultraviolet light, the ultraviolet light having a wavelength in the range of 300 to 600 nanometers is irradiated at an intensity of 100 to 200 watts per meter for about 5 to 10 seconds. To cure. Thereafter, the integrated circuit chip is bonded to the carrier tape by the above-described method, and the joint between the tape carrier and the integrated circuit chip and the active surface of the integrated circuit chip are protected using a mold sealing material. At this time, the spreading of the mold sealing material by the width 8 shown in FIG. 2 can be stopped by the dam 5 previously provided on the back surface of the carrier tape.

Another embodiment of the present invention will be described with reference to FIGS. 1, 5 and 6. FIG.

FIGS. 5 and 6 show schematic explanatory views of different manufacturing methods. This corresponds to the BB 'section in FIG. Regarding the method of installing the dam on the carrier tape, in the example shown in FIG. Then, the shape of the dam 5 is formed by dripping the dam material.

In the example shown in FIG. 6, a gas laser having an output of about 1 watt or less is applied to a desired position of the tape carrier 2. Since the carrier tape is made of a heat-resistant film such as polyimide, only the portion irradiated with the laser beam is exposed to a high temperature to loosen the bonds of molecules and expand the volume. In this way, since the projections are formed such that the above-described dam member is printed or dropped, it is possible to stop the spread of the mold sealing material from spreading.

[0017]

According to the present invention, as shown in FIG. 2, a mold encapsulant applied to protect a carrier tape to which an integrated circuit chip is connected is spread on a TCP back surface at a desired position. You can stop it. In addition, since it is not necessary to control the wetting and spreading by the applied amount of the mold sealing material, it is possible to secure the thickness of the mold sealing material on the integrated circuit chip, and to control the thickness of the mold sealing material in manufacturing. Becomes easier.

[Brief description of the drawings]

FIG. 1 is a schematic external view of an embodiment according to the present invention.

FIG. 2 is a sectional view for explaining the effect of the embodiment according to the present invention.

FIG. 3 is a sectional view showing one step of a manufacturing method of an embodiment based on the means 1 of the present invention.

FIG. 4 is a sectional view showing one step of a manufacturing method according to an embodiment based on the means 1 of the present invention.

FIG. 5 is a sectional view showing a manufacturing method of an embodiment based on the means 2 of the present invention.

FIG. 6 is a sectional view showing a manufacturing method of an embodiment based on the means 3 of the present invention.

[Explanation of symbols]

 REFERENCE SIGNS LIST 1 integrated circuit chip 2 carrier tape 3 stencil mask 4 dam material 5 dam 6 squeegee 7 mold sealing material 8 difference in wet spreading of mold sealing material depending on the presence or absence of dam 9 container containing dam material 10 laser light oscillator 11 laser light

Claims (5)

[Claims] 1. A carrier tape having a device hole in which an integrated circuit chip is provided, and each electrode of the integrated circuit chip provided on the carrier tape and partially protruding into the device hole. A tape carrier package comprising: a connected lead; and a resin that covers at least a surface of the integrated circuit chip on which the electrodes are formed, wherein the tape carrier package is a surface opposite to the electrode forming surface of the integrated circuit chip. A tape carrier package, wherein a projection is provided around the device hole of a carrier tape. 2. A method for manufacturing a tape carrier package, comprising: forming a protrusion serving as a resin outflow prevention portion for stopping the spread of a mold sealing material on the tape carrier package;
A method for manufacturing a tape carrier package, comprising a step of providing the tape carrier package on a surface opposite to a surface on which the mold sealing material is applied. 3. The method according to claim 2, wherein the projections are provided by stencil printing. 4. The method according to claim 2, wherein the protrusion is provided by dispensing. 5. The method according to claim 2, wherein the protrusion is provided by a laser.