JPH1048288A - Connecting device for test head and prober - Google Patents

Abstract

PROBLEM TO BE SOLVED: To reduce the clearance between a positioning pin and a positioning pin receiver by making a test head to face to a prober by rotating the test head around the center of rotation of the head. SOLUTION: A connecting device is constituted so that a test head 10 can supply a test signal to an object to be inspected by bringing the head 10 into contact with a performance board 20 by rotating the head 10 around the center of rotation O of the head 10 and engaging a positioning pin receiver 16 provided on the head 10 side with a positioning pin 24 protruded toward the performance board 20 side from a signal relaying section 34 housed in a prober. In the connecting device, pin receiver driving means 50 and 52 which move the pin receiver 16 in the vertical direction are provided and the receiver 16 is moved to a position where the receiver 16 is engaged with the pin 24 from the state where the receiver 16 is housed in the head 10 by means of the driving means 50 and 52 after the head 10 is brought into contact with the performance board 20. The positioning device is constituted so that the head 10 and board 20 can be positioned when the receiver 16 is engaged with the pin 24.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an apparatus for connecting a test head and a prober used in an inspection apparatus for a highly integrated electronic device such as an LSI, and more particularly to an improvement in positioning accuracy.

[0002]

2. Description of the Related Art Japanese Utility Model Laid-Open No. 4-11 proposed by the present applicant.
As disclosed in Japanese Patent No. 3083, a test head is used in an LSI test apparatus. The test head is placed facing a prober that transports a wafer or a handler that transports a packaged semiconductor component by separating each chip from the wafer and attaching terminals.

FIG. 3 is a front view for explaining a conventional test bed and a prober mounted state. In the drawings, one is a cross-sectional view, the other is a partial cross-sectional view, and the test head 10 is also a cross-sectional view on the bracket side of the CC line on the line AA of the prober 30. . In the drawing, the center O is the center of rotation of the test head 10 and is determined by a support member (not shown) of the test head 10 such as a lift holder.
The test head 10 is a housing having a function of supplying a test signal determined by an externally provided test apparatus main body to a wafer accommodated in the prober 30, and contains a large number of printed boards inside. . The bracket 12 is
A hollow disk-shaped one provided on the surface of the test head 10 facing the prober 30,
Is provided with a contact pin 14 for contacting the contact pin. The positioning pin receiver 16 is provided in the vicinity of the hollow portion of the bracket 12, and positions the test head 10 and the prober 30.

[0004] The performance board 20 has a pad terminal 26 on the test head side connected to the contact pin 14.
A prober-side pad terminal 28 connected to a terminal 34a provided in the signal relay section 34;
A wiring pattern for connecting 6, 6 and 28 and a part specified by a customer as required are provided. The performance board cover 22 covers the performance board 20.
Of the performance board 2 by contacting the test head 10 together.
Excessive stress is prevented from being applied upon contact with zero. The positioning pins 24 are provided so as to protrude from the signal relay section 34 on the performance board 20 side so that the test head side pad terminals 26 provided on the performance board 20 and the contact pins 14 are connected at an accurate position. Then, it engages with the positioning pin receiver 16.

[0005] The prober 30 is a device for transporting a wafer, placing it on the chuck top 40, and bringing the probe 38 into contact with the wafer to inspect the wafer. The prober signal relay unit receiver 32 has a larger opening than the chuck top 40 and forms a part of the housing of the prober 30. The signal relay section 34 is placed on the prober signal relay section receiver 32 and has a wiring inside for connecting the signal relay section terminals 34a and 34b to each other. The signal relay terminal 34a is connected to the prober side pad terminal 28 of the performance board 20, and the signal relay terminal 34b is connected to the probe 38. The probe guard 36 is attached to the chuck top 40 side of the signal relay section 34 and includes a probe 38.
Is held in a predetermined posture. The chuck top 40 moves the wafer placed in the vertical direction V to contact the probe 38.

FIG. 4 is a front view showing a state in which the test head and the prober of FIG. 3 are brought into close contact with each other, and is a cross-sectional view with a part cut along the line BB. Here, by providing a sufficient gap between the positioning pin 24 and the positioning pin receiver 16, the test head 10 rotates clockwise CW about the rotation center O, and the position between the performance board 20 and the contact pin 14 is changed. Makes the connection possible. The bracket 12 is fixed to the block 18 inside the test head 10.

[0007]

However, when the gap between the positioning pin 24 and the positioning pin receiver 16 is large, the connection between the contact pin 14 on the test head side and the pad terminal 26 on the test head side on the performance board 20 side. However, there is a problem that this may not be performed well, which causes a contact failure. Therefore, if the moving direction of the test head 10 is limited to only the vertical direction instead of the structure in which the test head 10 is rotated around the rotation center O, the gap between the positioning pin 24 and the positioning pin receiver 16 is small. However, there arises a problem that maintenance work becomes difficult and manufacturing cost increases. The present invention has solved such a problem, and has a structure in which a test head is turned around a rotation center O to face a prober side, and a gap between a positioning pin and a positioning pin receiver can be small. An object of the present invention is to provide a connection device between a test head and a prober.

[0008]

In order to achieve the above object, the present invention provides a test head in which a test head rotates around a rotation center and abuts on a performance board, and a positioning mechanism provided on the test head is provided. The pin receiver 16 is engaged with the positioning pin 24 protruding toward the performance board of the signal relay section 34 housed in the prober, and a test signal is transmitted from the contact pin 14 provided on the test head to the performance signal. In a test head and prober connection device that supplies a test object to a test object via a board and a signal relay unit, a position between a state in which the positioning pin receiver is housed in the test head and a state in which the positioning pin is engaged with the positioning pin. Positioning pin receiving driving means 50 and 52 for moving up and down with the test head are provided. Then, the positioning pin receiving drive means moves the positioning pin receiver from the state accommodated in the test head to a position where the positioning pin receiving section engages with the positioning pin, and engages with the positioning pin receiving section and the positioning pin. In this case, the test head and the performance board are positioned with each other.

According to the configuration of the present invention, after the test head comes into contact with the performance board, the positioning pin receiving drive means moves the positioning pin receiver from the state accommodated in the test head to a position where it engages with the positioning pin. It is moving. Then, along with the engagement between the positioning pin receiver and the positioning pin, the positioning between the test head and the performance board is performed, and the contact failure between the contact pins 14 and the test head side pad terminals 26 of the performance board is eliminated. .

[0010]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below with reference to the drawings. FIG. 1 is a front view showing a state in which a test head and a prober according to an embodiment of the present invention are brought into close contact with each other. In FIG. 1, components having the same functions as those in FIG. 3 are denoted by the same reference numerals, and description thereof will be omitted. Here, the positioning pin receiver 16
And a ball spline 52 for vertically moving between a state accommodated in the test head 10 and a state engaged with the positioning pin 24. By the rotation of the AC motor 50, the positioning pin receiving 16 pivotally supported on the ball spline 52 moves up and down in the vertical direction V _1.

FIGS. 2A and 2B are explanatory diagrams of the operation of the positioning pin receiving drive section. FIG. 2A shows a state in which the positioning pin receiver 16 and the positioning pin 24 are separated, FIG. )
Indicates an engaged state. Positioning pin receiver 16
Is a tubular body having an inner diameter D16, and the axis Z16 is a ball spline 5
2 coincides with the rotation axis. The positioning pin 24 is a cylindrical body having an outer diameter D24 whose tip is conically pointed, and the axis Z24 is the central axis.

Positioning pin receiver 16 and positioning pin 24
When the test head 10 is turned away from the performance board 20, the axis Z16 and the axis Z24 are separated from each other. Of the degree. Here, by designing this deviation to be less than half of the inner diameter D16, when the positioning pin receiver 16 is moved in the direction of the positioning pin 24 by the AC motor 50, the positioning pin 24 is moved.
Are located inside the positioning pin receiver 16, and both of them are in partial contact with each other. Further, when the positioning pin receiver 16 is moved in the direction of the positioning pin 24 by the AC motor 50, the positioning pin 24 and the positioning pin receiver 16 are engaged, and the axes Z16 and Z24 coincide. This movement occurs when the performance board 20 having the positioning pins 24 is displaced in the direction of the arrow H24, but may be generated on the test head 10 side having the positioning pin receivers 16.

[0013]

As described above, according to the present invention, after the test head 10 comes into contact with the performance board 20, the positioning pin receiver 16 is housed in the test head 10 by the positioning pin receiving drive units 50 and 52. The position of the test head 10 and the performance board 20 is moved along with the engagement of the positioning pin receiver 16 and the positioning pin 24 since the positioning pin 24 is moved from the engaged state to the position where the positioning pin 24 is engaged. And the contact pins 14
There is an effect that contact failure between the test board side pad terminal 26 of the performance board 20 and the test board side is eliminated.

[Brief description of the drawings]

FIG. 1 is a front view of a state in which a test head and a prober according to an embodiment of the present invention are in close contact with each other.

FIG. 2 is an operation explanatory diagram of a positioning pin receiving drive unit.

FIG. 3 is a front view illustrating a conventional test bed and a prober mounted state.

FIG. 4 is a front view showing a state where a conventional test head and a prober are brought into close contact with each other.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 10 Test head 20 Performance board 30 Prober 40 Chuck top 50 Positioning pin receiving drive part

Claims (1)

[Claims] A test head (10) pivots about a rotation center (O) to abut against a performance board (20), and a positioning pin receiver (1) provided on the test head side.
6) and positioning pins (2) protruding toward the performance board of the signal relay section (34) housed in the prober.
4), a test head and a prober connection device for supplying a test signal from a contact pin (14) provided on the test head to the object to be inspected via the performance board and the signal relay section. Positioning pin receiving drive means (50, 52) for vertically moving the positioning pin receiver between a state accommodated in the test head and a state engaged with the positioning pin; After contacting the performance board, the positioning pin receiving drive means moves the positioning pin receiver from a state of being housed in the test head to a position where it engages with the positioning pin. With the engagement with the positioning pin, the test head and the performance board are positioned. A connection device between a test head and a prober, characterized in that: