JPH10335896A - Apparatus for mounting electronic component - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the availability and throughput of the apparatus by operating a line controller to index the production time per automatic mounting line from the information of a first and second memory tables, based on input production information for selecting the best combination of mounting lines to control the process. SOLUTION: A CAD unit 5 designs a printed circuit board to send its mounting data to a file server 4, which saves it in an intermediate data form. A production schedule plan is sent from a production control information 6 to a line controller 3 so as to distribute data to automatic mounting lines 1A-1C, while the controller 3 indexes the production time for every automatic mounting line 1A-1C from a first memory table storing printed wiring board information and electronic components information and second memory table storing printed wiring board information and mounting components information to select the best processing-efficiency combination of mounting lines for controlling the process.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an electronic component mounting apparatus for mounting electronic components on a printed wiring board to produce a printed circuit board.

[0002]

2. Description of the Related Art In recent years, with the diversification and personalization of electronic devices, printed circuit boards have become more diversified and reduced in number in order to support product functions that match user needs, and repeated production has been decreasing. is there. In such a production background, the ratio of initial man-hours for performing operations such as data conversion and production instructions to the production cost is increasing.

FIG. 9 is a schematic plan view (a) of a conventional automatic mounting line and a side view (b) of a printed circuit board to be produced. The automatic mounting line 1 is composed of a printed wiring board supply section 11, a mounting machine 12 controlled by numerical control, and a printed wiring board receiving section 13.
In this example, three mounting machines 12 are arranged.

The mounting machine 12 includes a mounting table 12a for setting a printed wiring board 20, a component setting section 12b for loading electronic components 21 of a plurality of types, and a component mounting unit for picking the electronic components 21 and mounting them on the printed wiring board 20. 12
c, transport rail section 12 for moving printed wiring board 20
d.

[0005] The data format of the mounting machine 12 is composed of the coordinates of the mounting position of the electronic component and the data indicating the component take-out position in the component setting section 12b. When mounting the electronic component, the electronic component and the form indicating the setting position are included. Attached, set up parts set etc. based on it,
Work is to begin.

[0006]

However, the automatic mounting line has a different configuration of the mounting machine depending on the line, and the shape, the number of kinds of electronic components to be mounted, the target size of the printed wiring board, etc. are different for each line. The mounting data created in advance becomes dedicated data for each mounting line. For this reason, if the number of production types or production quantities of the printed circuit board fluctuates, the operation rate of the entire line becomes unbalanced, and the production time becomes longer.

[0007] In addition, the changeover of parts based on the form causes a reduction in the operation rate and work capacity of the equipment. In addition, as the number of times of part changeover increases, human errors such as erroneous setting of parts are more likely to occur in proportion thereto, which leads to a decrease in quality and a decrease in work efficiency due to rework.

Therefore, in order to correct such imbalance of the mounting line, when it is newly attempted to create mounting data for another line, the shape of the component to be mounted is different for each mounting machine constituting the automatic mounting line. Different and limited by the size and packing form (for example, taping, tray, stick packing, etc.) of the target component that can be set in the component setting part of the mounting machine, it requires skill in data creation and
There is a disadvantage that much time is required for data creation.

SUMMARY OF THE INVENTION The present invention has been made to solve such a conventional problem, and has as its object to provide an electronic component mounting apparatus capable of improving the operation rate and processing capacity of equipment.

[0010]

According to a first aspect of the present invention, there are provided a plurality of automatic mounting lines for producing a printed circuit board by mounting electronic components on a printed wiring board, and assembling each automatic mounting line. A first memory table storing possible printed wiring board information and electronic component information, a second memory table storing printed wiring board information and mounted component information of a printed circuit board to be produced, and control of each automatic mounting line A line controller that determines the production time for each automatic mounting line from each piece of information stored in the first and second memory tables based on the input production information. Process control by selecting a combination of mounting lines.

According to the present invention, since the production time can be determined based on the production information and the most efficient and optimal data distribution and operation conditions can be instructed to a plurality of automatic mounting lines, Operating rate and processing capacity are greatly improved.

According to a second aspect of the present invention, in the first aspect of the present invention, the line controller has electronic component information and printed wiring board information set at the time of the pre-setup, and the printed circuit board to be produced. The setup change is minimized in consideration of the setup time at the time of product type switching and the net mounting time.

According to the present invention, it is possible to minimize the selection of an automatic mounting line for distributing mounting data when mounting an electronic component and the changeover due to the change of production type. It does not require much time, and the facility operation rate and work processing capacity can be improved.

[0014]

FIG. 1 is a block diagram showing an embodiment of an electronic component mounting apparatus according to the present invention. A plurality (three in this example) of automatic mounting lines 1A, 1B, and 1C, Controllers 2A, 2B, and 2C that individually control the automatic mounting lines 1A to 1C;
A line controller 3 for overall control of C, a file server 4 for saving data sent to the line controller 3 in an intermediate data format, a CAD 5 for designing a printed circuit board, and a small production schedule in units of days or weeks. And production management information 6 for managing the information. Each of the plurality of automatic mounting lines 1A to 1C has the same configuration as the automatic mounting line 1 described above.

In this configuration, when a printed circuit board is designed by the CAD 5, its mounting data (size of the printed wiring board and mounting information of mounted components) is sent to the file server 4 and saved in an intermediate data format. When a small production schedule such as a day or a week is sent from the production management information 6 to the line controller 3, data is distributed to the automatic mounting lines 1A to 1C in consideration of the current work in process.

At this time, the line controller 3
5 is an intermediate data format, the data is converted at the execution level to each of the automatic mounting lines 1A to 1C, and at the same time, the change information of the mounting table 12a and the transfer rail 12d generated when the production type is switched. Then, the work instruction data such as the component set position of the electronic component 21 to be used, the usage amount thereof, the number of products to be produced, etc. are displayed on the screen or printed out.

As preparation work, the controllers 2A to 2A
C based on the work instruction data output from the electronic component 2
1 in the component setting section 12b, and the printed wiring board 2
Mounting table 12a and transfer rail unit 1 according to the size of
Adjust 2d.

When the mounting data is sent to the mounting machine 12, the printed wiring board 20 set in the printed wiring board supply section 11 in advance is supplied to the mounting machine 12, and is fixed to the mounting table 12a. The component mounting unit 12c is
The electronic component 21 is picked from the position designated on the data b and mounted on the printed wiring board 20. Each electronic component 2
When the mounting of 1 is completed, the printed wiring board 20 is stored in the printed wiring board receiving section 13.

Next, a data flow and a processing procedure until the mounting work is started will be described with reference to a flowchart shown in FIG. First, production information such as a production type and a production quantity is loaded into the line controller 3 (step S1), and mounting intermediate data corresponding to the production type is read from the file server 4 (step S2). The mounting intermediate data includes, as initial data, mounting information such as the size (length × width × plate thickness) of a printed wiring board (PWB), mounting position coordinates and mounting angles of mounting components, and component names. This data storage area is called a second memory table.

Next, a line to be mounted is selected (step S3). FIG. 3 is a flowchart illustrating details of the mounting target line selection processing. Line control 3
Has a mounting table TB1 as a first memory table indicating the processing capability of each of the automatic mounting lines 1A to 1C. The mounting table TB1 and the read mounting intermediate data (step S31) are used to determine the length of the printed wiring board. ·side·
The automatic mounting line is selected based on the maximum and minimum mountable sizes of the thickness (step S32).

Here, as shown in FIG. 4, the mounting table TB1 has a processing capacity for each of the automatic mounting lines 1A to 1N,
That is, it shows the size of the printed wiring board (PWB), the set classification indicating the packing state of the electronic components (tray, stick, taping), and whether or not mounting is possible for each electronic component (Ox).

For the automatic mounting line that satisfies the condition of step S32, it is determined from the mounting table TB1 whether the electronic component to be mounted can be mounted, and the automatic mounting line is selected (step S33). Whether or not each electronic component can be mounted is indicated by ○ × for each of the electronic components P1 to Pn in the mounting table TB1, but is not limited thereto. It has data that can determine the size and size of electronic components that can be mounted for each
The determination may be made by taking the consistency with the data on a macro basis.

Next, since there is a limit to the types that can be set in the component setting section 12b due to the difference in the set division of the electronic components, totaling is performed for each set division (tray, stick, taping) of the electronic components to be set, and the mounting table TB is set.
Then, an automatic mounting line is selected by comparing with and matching with Step 1 (Step S34).

Thus, an automatic mounting line that satisfies all the conditions of steps S32 to S34 is selected as a mounting target line (step S35). If at least one of the conditions in steps S32 to S34 is not satisfied, it is determined to be NG (step S36).

When the line to be mounted is selected in this way (step S3), a permutation combination of data distribution to the mounting line is determined (step S4). Then, the mounting time is calculated based on the intermediate data, the mounting table, and the production quantity (step S5). The mounting time is the mounting table TB1
From the following. First, the mounting time Ti for each type is determined.

Mounting time Ti = setup time Di + (net time Si × production quantity) The setup time Di is an initial time that occurs at the time of switching the production type, and the mounting net time Si is the mounting time per board. The setup time Di and the mounting net time Si are obtained from the following equation by referring to the values from the mounting table TB1.

Setup time Di = dwi + Σdpi ... Net mounting time Si = Σ (transportation time of mounted components) + Σ (component-specific mounting time) + Σ (mounting electronic component type switching time) + (printed wiring board loading / unloading time) In the equation, dwi is the setup time due to the change in the size of the printed wiring board, and is the setup time due to the change in the vertical dimension, the horizontal dimension, and the board thickness. dpi is the part change setup time. These times are calculated in consideration of the contents set up before and if the contents are the same, so that the set-up time does not occur. The “component-specific mounting time” is a physical mounting time due to a component-specific difference excluding the transport time.

FIG. 5 is a mounting time calculation table TB2 in which the mounting time thus obtained is stored in a memory.
The setup time Di and the mounting net time Si are stored for each of the automatic mounting lines 1A to 1N.

Next, data distribution to the mounting line is determined (step S6). FIG. 6 is a flowchart illustrating details of the data distribution determination process. First, based on the mounting time master table TB3 stored in the memory, the mounting time for each automatic mounting line in each combination of the production types A to D of the printed circuit board is calculated (step S61). FIG.
Shows an example of the mounting time master table TB3.

Next, the maximum mounting time MaxT2 for each automatic mounting line in each combination is picked (step S62). Then, the maximum mounting time MaxT in each combination
A combination having a minimum value of 2 is extracted (step S6).
3).

Next, it is determined whether or not there is a combination of the same value (step S64). If there is a combination of the same value, the mounting time of the automatic mounting line in the same combination is integrated (step S65), and the integrated mounting time is calculated. A combination indicating the minimum value of ΣT2 is selected (step S66), and mounting data is allocated (step S67).

If there is no combination of the same value in step S64, the combination indicating the minimum value of the maximum mounting time MaxT2 is determined among the combinations (step S68), and the mounting data is allocated (step S67).

Taking the mounting time master table TB3 shown in FIG. 7 as an example, when the mounting assignment of the automatic mounting lines 1A to 1C to the printed circuit boards A to D is obtained, as shown in the combination time calculation table TB4 of FIG. , 12 combinations are possible.

That is, the assignment of the printed circuit board A is 1
As shown, there are three ways of allocating the printed circuit board B, two ways of allocating the printed circuit board C, and two ways of allocating the printed circuit board D, and "1 × 3 × 2 × 2 = 12”, which is twelve. . In the combination time calculation table TB4, indicates the automatic mounting line 1A, indicates the automatic mounting line 1B, indicates the automatic mounting line 1C, and the number in the adjacent parentheses indicates the mounting time.

Automatic mounting lines 1A to 1C for each combination
Looking at the processing time of (~), the maximum processing time MaxT
Determine 2. The combination in which the maximum machining time MaxT2 is the minimum is an efficient assignment (steps S61 to S6).
3).

However, as shown in the combination time calculation table TB4, the maximum processing time MaxT
2 is the same at the minimum value 71 (step S6
4) The total mounting time ΔT2 is obtained, and a combination having a short time is selected (steps S65 to S66). In this example, the combination number 12 is selected, and the automatic mounting line is set in a state in which the idle time can be set, and the next operation input is smoothly selected as the best combination.

The allocation of the distribution of the mounting data is performed by selecting the combination number 12 so that the automatic mounting line 1A has no printed circuit board A, the automatic mounting line 1B has no data distribution, and the automatic mounting line 1C has the printed circuit board B. C and D are obtained (step S67).

When the allocation of the automatic mounting lines is determined (step S6), the mounting data is sent from the line controller 3 to the controllers 2A to 2C. Controller 2A
2C has a table of electronic components set in the component setting unit 12b, and determines whether or not setting is possible depending on the packing state of the electronic components such as trays, sticks, and taping for each station of the component setting unit 12b. Has classification information.

Data conversion at execution level (step S
7) First, as the first step, when there is the same component as the component set up in advance so that the component setup time is minimized when allocating the component, data is allocated so that the component is taken out from the same position.

Next, with respect to the remaining components that need to be set, consistency is determined for each set division of the component setting section 12b, and allocation is determined so as to minimize the switching time when switching electronic component mounting components. Then, finally, the use amount of the electronic component and the setup change of the set position are instructed by screen display or printout (step S8).

[0041]

According to the present invention, there are provided a printed wiring board size that can be set for each of a plurality of automatic mounting lines and a mounting table indicating whether or not each electronic component can be mounted, and the production time can be reduced based on the production information. Since indexing, distribution determination of optimal data with the highest mounting efficiency to a plurality of automatic mounting lines, and work instructions can be performed, the operation rate and processing capacity of each automatic mounting line can be improved.

According to the present invention, the printed circuit is provided by having the set information of the electronic parts set at the time of the pre-setup and performing data conversion so as to minimize the change of the parts when the same parts are used. When mounting electronic components on a board, data can be distributed and work instructions can be given in a combination of selection of automatic mounting lines for distributing mounting data, setup change by product type change, and minimization including net time. In addition, the work processing ability can be improved.

[Brief description of the drawings]

FIG. 1 is a configuration diagram showing an embodiment of an electronic component mounting apparatus according to the present invention.

FIG. 2 is a flowchart illustrating the operation of the present invention.

FIG. 3 is a flowchart illustrating an operation of selecting a mounting target line.

FIG. 4 is a mounting table for selecting a mounting target line.

FIG. 5 is a mounting time calculation table for mounting data distribution.

FIG. 6 is a flowchart illustrating an operation for determining mounting data distribution.

FIG. 7 is a mounting time master table showing calculation results of mounting time for each mounting line.

FIG. 8 is a combination time calculation table showing all combinations of mounting data distribution and mounting time calculation results.

FIG. 9A is a plan view showing an example of an automatic mounting line,
(B) is a side view of the printed circuit board.

[Explanation of symbols]

 1, 1A to 1C Automatic mounting line 2A to 2C Controller 3 Line controller 4 File server 5 CAD 6 Production management information 11 Printed wiring board supply unit 12 Mounting machine 12a Mounting table 12b Component setting unit 12c Component mounting unit 12d Transport rail 13 Printed wiring board receiving section 20 Printed wiring board 21 Electronic component

Claims (2)

[Claims] 1. A plurality of automatic mounting lines for producing a printed circuit board by mounting electronic components on a printed wiring board, and a first printed wiring board information and electronic component information that can be mounted on each of the automatic mounting lines. A second memory table that stores printed wiring board information and mounted component information of a printed circuit board to be produced; and a line controller that controls each of the automatic mounting lines. Determining the production time for each of the automatic mounting lines from the information stored in the first and second memory tables based on the production information, selecting a combination of mounting lines having the highest processing efficiency, and controlling the processing; Electronic component mounting apparatus characterized by the above-mentioned. 2. The line controller has electronic component information and printed wiring board information set at the time of pre-setup, and performs a setup change in consideration of a setup time and a net mounting time when a type of a printed circuit board to be produced is changed. The electronic component mounting apparatus according to claim 1, wherein the mounting is minimized.