JPH10335808A - Pre-heating method in reflow device and device executing the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To prevent a place except for a soldering part from being affected through heat due to pre-heating by partially pre-heating only the soldering part of a substrate by means of hot air, through the use of a hot air generation device and nozzles blowing out hot air to a prescribed place. SOLUTION: An electronic component PA1 fitted by soldering and an electronic component PA2 which is mechanically fitted are loaded on the substrate PRB. Cream solder CH is applied to the point part of a soldering position. The positions of the respective nozzles NO1-NOn for transmitting hot air on a nozzle panel NOP are set in positions corresponding to the point parts. Thus, hot air transmitted from the respective nozzles NO1-NOn locally and simultaneously heats only the many point parts of the soldering positions in terms of spots and the soldering parts are heated. The place except for the soldering parts is prevented from being affected by heating for soldering.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a preheating method in a reflow apparatus used for soldering an electronic component to a substrate, and an apparatus implementing the method. The preheating method in the reflow apparatus according to the present invention and the apparatus in which the preheating method is carried out use a hot air generator and a nozzle to partially heat only the soldered portion of the board to a location other than the soldered portion in the reflow device. It is intended for use without the influence of preheating.

[0002]

The preheating method in the conventional reflow apparatus is based on a preheating method in which a substrate on which electronic components are mounted is preheated by passing the substrate on which electronic components are mounted through a tunnel furnace using a panel heater. In heating, the soldering of the cream solder for soldering the electronic component to the substrate is facilitated, so that the electronic component is securely attached to the substrate.

[0003] To this end, in the preheating stage: Heating of the entire substrate is inevitable. Because preheating also heats the part of the soldering surface that is not soldered and the surface opposite to the soldering surface, parts that require temperatures below the proper preheating conditions of the cream solder used in conventional equipment, for example, It cannot be applied to soldering to parts containing resin, spring parts, batteries, etc., and substrates on which they are mounted.

[0004] It is difficult to obtain the optimum preheating condition for each component, and in the conventional apparatus, the preheating condition has to be set based on the idea of the greatest common denominator. 2. Inevitably increase the size of the device. The conventional apparatus generally uses three panel heaters in order to obtain an ideal preheat profile. For this reason, upsizing of the device is inevitable. There was a problem.

[0005]

SUMMARY OF THE INVENTION The present invention uses a hot air generator and a nozzle for blowing hot air from a hot air generator toward a predetermined location, and partially preheats only a soldered portion of a substrate with hot air. The present invention solves the conventional problems by realizing a preheating method in a reflow apparatus in which the influence of heating by preheating does not affect a portion other than a soldering portion, and an apparatus implementing the method.

[0006]

BEST MODE FOR CARRYING OUT THE INVENTION

FIG. 1 is an explanatory view showing the configuration of an embodiment of a preheating apparatus for performing a preheating method in a reflow apparatus according to the present invention. In FIG. 1, SGT is a surge tank for generating hot air. HWG is a surge tank SGT
Is a hot air generator that supplies hot air to NOP is a nozzle panel to which a nozzle for sending out hot air is attached. N
.., Non are nozzles for sending out hot air.

[0007] The PRB is a substrate on which electronic components are mounted. PA1 is an electronic component mounted on the substrate PRB by soldering, and PA2 is an electronic component mounted on the substrate PRB mechanically instead of by soldering. CH is the substrate PR
B is a cream solder for soldering the electronic component PA1 to B. The hot air generator HWG is attached to the lower part of the surge tank SGT, and is configured to send hot air into the surge tank SGT. A nozzle panel NOP is attached to the upper opening of the surge tank SGT so as to cover the opening of the surge tank SGT. For this reason, the hot air sent from the hot air generator HWG to the surge tank SGT is applied to the nozzles NO1, NO1 for sending hot air from the nozzle panel NOP.
NO2,... Are blown out toward a certain place.

The operation of the preheating apparatus having such a configuration will be described as follows. Surge tank SGT
The surface corresponding to the soldering surface of the upper substrate PRB is covered with the nozzle panel NOP, so that the hot air sent from the hot air generator HWG to the surge tank SGT is supplied to the nozzles NO1, NO2, ...
・ Sent from Non. Substrate P on which preheating is performed
The RB is held at a predetermined interval above the nozzle panel NOP of the preheating device. An electronic component PA1 attached by soldering and an electronic component PA2 mechanically attached are mounted on the substrate PRB, and the lead terminal of the electronic component PA1 and the point of the soldering position of the substrate PRB are not melted. Is applied.

The positions of the nozzles NO1, NO2,... NOn for sending hot air from the nozzle panel NOP are
Is set at a position corresponding to the point of the soldering position. For this reason, the hot air sent from the nozzles NO1, NO2,... NOn for sending the hot air of the nozzle panel NOP heats only a point portion of the soldering position of the substrate PRB locally at a large number of spots simultaneously. Then, preheating of the soldering portion of the substrate PRB is performed.

The control of the heating temperature for preheating the substrate PRB can be performed by the following method.・ Nozzles NO1, for sending hot air from nozzle panel NOP
By changing the diameter and hole diameter of NO2,... NOn,
The heating temperature is adjusted by changing the amount of hot air blown from the nozzle. The heating temperature is adjusted by changing the distance between the soldering surface of the substrate PRB and the upper surface of the nozzle of the nozzle panel NOP.

FIG. 7 shows an example of a temperature profile of a substrate preheated by the preheating apparatus of the present invention. In FIG. 7, the vertical axis represents the temperature change, and the horizontal axis represents the preheating time. Graphs 1, 3 and 6 show changes in temperature at different soldering points on the board, graphs 2 and 5 show changes in surface temperature of components on the board, and graph 4 shows changes in board temperature. . As is clear from FIG. 7, the temperature of the soldering portion of the board rises at almost the same value as the preheating time elapses, but the surface temperature of the components on the board slightly rises. It can be seen that the temperature of the substrate hardly changes.

FIG. 8 shows an example of a temperature profile of a substrate which has been preheated by a conventional preheating apparatus for comparison with data of a preheating method in the reflow apparatus of the present invention. In FIG. 8, the vertical axis represents the temperature change,
The horizontal axis indicates the preheating time. Graphs 1, 3 and 4 show the change in temperature at different soldering points on the board, graphs 2 and 5 show the change in surface temperature of components on the board, and graph 5 shows the change in board temperature. . As is clear from FIG.
It can be seen that as the temperature of the soldering portion of the board increases with the elapse of the preheating time, the surface temperature of the components on the board and the temperature of the board also increase in a similar manner.

FIG. 1 shows an upward blow type in which hot air is blown to the lower surface of the substrate as an example of the description.
In a substrate such as a surface mount component, hot air is applied to the upper surface of the substrate,
For those that need to spray downward from the top of the substrate, it is also possible to use a downward spray type.
The nozzle panel NOP of the preheating device shown in FIG.
A hot-air blowing hole or a hot-air blowing nozzle is implanted at each soldering point of the substrate to be preheated. For this reason, the nozzle panel NOP is a plate-shaped jig that is independently manufactured for each substrate.

FIG. 2 is a diagram for explaining the configuration of the nozzle panel. 2A shows an assembly view of the nozzle panel, and FIG. 2B shows a perspective view thereof. 2, the same components as those in FIG. 1 are denoted by the same reference numerals, and the description thereof will be omitted. In FIG. 2, FLM is a nozzle panel N
A frame for holding the OP, which is used to mount the nozzle panel NOP on the surge tank. PN is a pin for positioning the substrate attached to the nozzle panel NOP. PH is a hole of the nozzle panel NOP for mounting the positioning pin PN, and NH is a hole of the nozzle panel NOP for mounting the nozzle NO. BS is a screw for attaching the nozzle panel NOP to the frame FLM.

As shown in FIG. 2B, the frame FL
M is equipped with surge tank SGT, nozzle panel NOP
Is attached to the frame FLM by a screw BS. A pin PN for positioning the substrate is attached to the hole PH of the nozzle panel NOP, and a nozzle NO is attached to the hole NH. The pin PN for positioning the substrate attached to the nozzle panel NOP is used to adjust the positional relationship between the nozzle panel NOP and the substrate PRB so that the position of each nozzle of the nozzle panel NOP matches the soldering point of the substrate PRB to be preheated. Used to set. For this purpose, a positioning hole H is formed in the substrate PRB, and by inserting the pin PN of the nozzle panel NOP into this hole, the position of each nozzle of the nozzle panel NOP is positioned at a soldering point of the substrate PRB. Matches automatically.

Next, a one-station multi-spot reflow apparatus in which an apparatus having the same configuration as that of the preheat apparatus shown in FIG. 1 is used and preheat and main heating of the substrate are performed by the same heater is shown in FIG. ,
This will be described with reference to FIG. FIG. 3 shows an overall external view of a one-station multi-spot reflow apparatus.
(A) shows the lateral side view, (b) shows the longitudinal side view. In FIG. 3, a heating device having the same configuration as the preheating device shown in FIG. 1 is used in the heating device portion, and the preheating and the main heating are performed by this heating device.

In the one-station multi-spot reflow apparatus shown in FIG. 3, the substrate received in the substrate receiving section on the right side of the apparatus is carried into the heating device, where two steps of preheating and main heating for reflow processing are performed. When the reflow process is completed, it is sent to the cooling unit,
The substrate is cooled and the soldering process for the substrate is completed. FIG. 4 is a view for explaining the operation of the heating device of FIG. 3 in which the preheating and main heating steps are performed in one station. 4A shows a state at the time of standby, FIG. 4B shows a state at the time of preheating, and FIG. 4C shows a state at the time of main heating.

In FIG. 4, the same parts as those in FIGS. 1 to 3 are denoted by the same reference numerals, and description thereof will be omitted. In FIG. 4, PHD is a heating device, which is a surge tank S of the device of FIG.
A GT and a nozzle panel NOP are provided. HWG is a hot air generator, which is mounted below the heating device PHD and supplies hot air to the surge tank. SLN is a cylinder for raising and lowering the heating device PHD. EXH is an exhaust device for discharging hot air supplied to the substrate from the heating device PHD. CLN is a substrate transfer line.

1 having the configuration shown in FIGS.
The operation of the station multi-spot reflow device will be described. The board to be soldered is on the transport line CLN
The heating device PHD is further fed into the heating device PHD and is positioned at a predetermined position of the heating device PHD. The positioning of the substrate PRB
By inserting the pins PN of the nozzle panel NOP into the positioning holes H formed in the substrate PRB as shown in FIG. 2, the positions of the nozzles of the nozzle panel NOP are automatically set at the soldering points of the substrate PRB. Is set to match the position.

In the heating device PHD, when the substrate is not fed into the device, and in the standby state of FIG. 4A, the positioning pin PN is at a position lower than the transport line CLN.
The substrate is ready to be sent into the device. When the substrate is fed into the heating device PHD, the level of the heating device PHD is raised by a cylinder SLN, and positioning is performed by inserting pins PN of a nozzle panel into positioning holes formed in the substrate. The state at the time of preheating in (b) of FIG. 4 is obtained. At this time, the distance between the soldering surface of the substrate and the upper surface of the nozzle of the nozzle panel of the heating device PHD is controlled to a value suitable for performing preheating.

In this state, when hot air is blown from the nozzle of the nozzle panel of the heating device PHD to the soldering point of the substrate for a certain period of time, the temperature of the soldering point reaches a preheat state immediately before the melting of the solder. Also in this case, since the temperature of the portion other than the soldering point of the substrate hardly rises as shown in FIG. 7, the components mounted on the substrate are not affected by the preheating temperature. When the temperature of the soldering point of the board reaches the state of preheating,
The level of the heating device PHD is further raised by the cylinder SLN, and enters the state of main heating shown in FIG.

At the time of main heating, the interval between the soldering surface of the substrate and the upper surface of the nozzle of the heating device PHDK nozzle panel is reduced, the amount of heat is increased, the temperature is increased at a stretch, and the solder is melted to solder the components. After the soldering is completed, the level of the heating device PHD is lowered by the cylinder SLN, and when the substrate becomes movable, the substrate is transported to the cooling station and cooled by the cooling fan of the cooling station. As described above, by controlling the distance between the soldering surface of the substrate and the upper surface of the nozzle, that is, the distance between the soldering surface of the substrate and the upper surface of the nozzle is increased during preheating, and the distance is reduced during the main heating, so that the substrate PRB
By controlling the temperature of the soldering point, preheating and main heating can be performed by one apparatus. Therefore, in the one-station multi-spot reflow apparatus shown in FIGS. 3 and 4 to which the present invention is applied, the apparatus can be downsized.

FIG. 5 is a diagram for explaining the operation of the heating device portion of the reflow device of the under-blowing type in which the preheating and main heating processes are performed in one station. 5, the same parts as those in FIGS. 1 to 4 are denoted by the same reference numerals, and description thereof will be omitted. In FIG.
HD is a heating device provided with the surge tank SGT and the nozzle panel NOP of the device of FIG. HWG is a hot air generator that supplies hot air to a surge tank of the heating device PHD. The SPT is a pedestal for the substrate. Positioning pins PNT are provided on the receiving table SPT of the substrate. SLN is a cylinder for raising and lowering the pedestal SPT of the substrate.
EXH is an exhaust device for discharging hot air supplied to the substrate from the heating device PHD. CLN is a substrate transfer line.

A down-spray type one-station multi-spot reflow apparatus having a configuration as shown in FIG. 5 will be described. 5, the position of the heating device PHD is fixed, and the distance between the soldering surface of the substrate and the nozzle surface of the nozzle panel of the heating device PHD is controlled on the side of the substrate receiving table SPT. Is raised and lowered. For this reason,
The positioning pins PN are provided on the side of the board SPT of the substrate. When the substrate to be soldered is sent into the heating device PHD from the transfer line CLN, the substrate is supported by the receiving table SPT of the substrate which is moved up and down by the cylinder SLN, and is positioned at a predetermined position below the heating device PHD.

The positioning of the substrate is performed by inserting the pins PN of the pedestal SPT of the substrate into the positioning holes H formed in the substrate PRB as shown in FIG. The position is set so that the position of each nozzle of the nozzle panel of the PHD automatically matches. The substrate receiving table SPT is at a position lower than the transport line CLN during standby, when the substrate is not fed into the apparatus, and is in a state where the substrate can be fed into the apparatus. When the substrate is fed into the heating device PHD, the level of the pedestal SPT of the substrate is raised by the cylinder SLN, and the pins PN of the pedestal SPT of the substrate are inserted into the positioning holes formed in the substrate. Positioning is performed, the level is fixed at a predetermined level, and the state at the time of preheating is entered.

At this time, the soldering surface of the substrate and the heating device PH
The interval between the nozzle upper surfaces of the nozzle panel D is controlled to a value suitable for performing preheating. In this state, when hot air is blown from the nozzle of the nozzle panel of the heating device PHD to the soldering point of the substrate for a certain period of time, the temperature of the soldering point reaches a preheat state immediately before the melting of the solder. Also in this case, since the temperature of the portion other than the soldering point of the substrate hardly rises as shown in FIG. 7, the components mounted on the substrate PRB are not affected by the preheating temperature.

When the temperature of the soldering point of the substrate reaches the preheat state, the level of the pedestal SPT of the substrate is further raised by the cylinder SLN, and the state enters the main heating state. At the time of main heating, the interval between the soldering surface of the substrate and the nozzle upper surface of the heating device PHD nozzle panel is reduced, the temperature is increased at a stretch, and the solder is melted to solder the components. When the soldering is completed, the level of the receiving table SPT of the substrate is lowered by the cylinder SLN, the substrate is transported from the transport line CLN to the cooling station, and the substrate for which soldering has been completed is cooled by the cooling fan of the cooling station. You.

FIG. 6 is a view showing an embodiment of an in-line type multi-spot reflow apparatus incorporating a multi-spot repeat apparatus. The device shown in FIG. 6 shows an example using an upward spray type device as shown in FIGS. In FIG. 6, PHS is a multi-spot preheating unit. Multi spot repeat section PH
S has a heating device and its raising device, and moves the nozzle close to the substrate until an appropriate preheat is supplied to the substrate according to the substrate arrival signal (an appropriate interval obtained in advance through experiments, etc.) and holds the nozzle for a certain period of time. Then, preheating is performed.

MHS is a multi-spot main heat section. The multi-spot main heating section MHS has a heating device and a lifting device, and moves the nozzle close to the substrate until an appropriate main heating is performed on the substrate by the substrate arrival signal (an appropriate interval obtained in advance through experiments, etc.). Then, the soldering is performed while holding for a certain period of time. The preheating section PHS and the main heating section MHS have the same configuration. Preheat section PH
In S and the main heating section MHS, PHD is a heating device, and the surge tank SGT and the nozzle panel N of the device in FIG.
OP.

HWG is a hot air generator, which is mounted below the heating device PHD and supplies hot air to the surge tank. S
LN is a cylinder for raising and lowering the heating device PHD. EXH is an exhaust device for discharging hot air supplied to the substrate from the heating device PHD. The cooling device cools the board after soldering. CLN is a substrate transfer line. The board transfer line CLN takes in the board to be soldered into the apparatus, and transfers the board in the order of a preheating section → a main heating section → a cooling device section.

The board to be soldered is sent from the board receiving section through the transfer line CLN into the heating device PHD of the preheating section PHS, and is positioned at a predetermined position of the heating apparatus PHD of the preheating section PHS. As shown in FIG. 2, the positioning of the substrate PRB is performed by inserting the pins PN of the nozzle panel NOP into the positioning holes H formed in the substrate PRB, so that the heating device PHD nozzle panel is positioned at the soldering point of the substrate. The position is set so that the position of each nozzle automatically matches.

In the preheating section PHS heating apparatus PHD, when the substrate is not fed into the apparatus, the positioning pins thereof are at a position lower than the transport line CLN, and the substrate is ready to be fed into the apparatus. When the substrate is fed into the heating device PHD of the preheating unit PHS, the level of the heating device PHD is raised by the cylinder SLN, and the state is at the time of preheating. Substrate PR at this time
The distance between the soldering surface of B and the nozzle upper surface of the nozzle panel of the heating device PHD is controlled to a value suitable for performing preheating.

In this state, when hot air is blown from the nozzle of the nozzle panel of the heating device PHD to the soldering point of the substrate for a certain period of time, the temperature of the soldering point reaches a preheat state immediately before melting of the solder. Again, in this case,
Since the temperature of the portion other than the soldering point of the substrate hardly rises as shown in FIG. 7, the components mounted on the substrate are not affected by the preheating temperature.

When the temperature of the soldering point of the substrate reaches the preheating state, the level of the heating device PHD of the preheating section PHS is lowered by the cylinder SLN to a position lower than the transport line CLN, and the substrate is moved from the transport line CLN. It is sent to the main heating unit MHS and is positioned at a predetermined position of the heating device PHD of the main heating unit MHS. As in the case of the preheating unit PHS, the positioning of the substrate is performed by positioning the heating device P of the main heating unit MHS in the positioning hole H formed in the substrate PRB as shown in FIG.
By inserting the pin PN of the HD nozzle panel,
The position is set so that the position of each nozzle of the nozzle panel automatically matches the soldering point of the substrate.

The heating device PHD of the main heating section MHS is
At the time of standby when the substrate is not fed into the apparatus, its positioning pin is at a position lower than the transport line CLN,
The substrate is ready to be sent into the device. When the substrate is fed into the heating device PHD of the main heating unit MHS,
The level of the heating device PHD is raised by the cylinder SLN, and the heating device PHD is brought into a state at the time of main heating.

At this time, the soldering surface of the substrate and the heating device PH
The interval between the nozzle upper surfaces of the nozzle panel D is controlled to a value suitable for performing main heating. In this state, when hot air is blown from the nozzle of the nozzle panel to the soldering point of the substrate PRB for a certain period of time, the temperature of the soldering point reaches a state of main heating in which the solder melts. Also in this case, the temperature of the portion of the board PRB other than the soldering point hardly rises as shown in FIG. 7, so that the components mounted on the board PRB are not affected by the temperature of the main heating.

When the soldering of the substrate PRB is completed, the level of the heating device PHD of the main heating unit MHS is lowered by the cylinder SLN to a position lower than the transfer line CLN, and the substrate PRB is transferred from the transfer line CLN to the cooling unit. Sent and cooled. In each of the above apparatuses, a robot can be used for controlling the interval between the soldering surface of the substrate and the nozzle surface. In this case, an ideal temperature profile can be stored in the robot, information on the current temperature can be acquired from the sensor, and the distance between the soldering surface of the substrate and the nozzle surface can be automatically controlled. Although FIG. 6 illustrates an example in which an upper spray type device is used, a lower spray type device may be used if necessary.

[0038]

As is apparent from the above description, the preheating method in the reflow apparatus of the present invention and the apparatus in which the preheating method is performed use a hot air generator and a nozzle to partially remove only the soldered portion of the substrate. It is possible to realize a reflow apparatus in which heating is performed so that the influence of heating for soldering does not affect a portion other than the soldering portion.

For this reason, the present invention can obtain the following various effects. 1. In the preheating stage, heating of the entire substrate is avoided. By preheating, the part of the soldering surface that is not soldered and the opposite surface of the soldering surface are not heated,
Parts that required a temperature below the proper preheating condition of the cream solder used, which was not possible before, for example,
It has become possible to perform soldering to a substrate on which a component including a resin, a spring component, a battery, and the like are mounted.

2. In particular, according to the multi-spot repeat method of the present invention, the following effects can be minimized: By this effect, resin parts, parts having springs,
Collective soldering with multi-spot reflow equipment is now possible even for workpieces that include components with severe heat resistance, such as batteries. -Appropriate preheat can be individually supplied to parts having different heat capacities in the same process. Due to this effect, batch soldering with a multi-spot reflow apparatus can be performed even on a board containing large and small components.

3. In the in-line type multi-spot reflow device incorporating the multi-spot repeat device,
In addition to the effects of the multi-spot repeat method, the tact time can be reduced.

4. The size of the device can be reduced. With conventional equipment, to obtain an ideal preheat profile,
Generally, three zones of panel heaters are used. For this reason, an increase in the size of the apparatus was unavoidable. However, with the one-station multi-spot reflow apparatus employing the multi-spot repeat method of the present invention, the size of the apparatus can be reduced and the cost of the multi-spot reflow apparatus can be reduced.

[Brief description of the drawings]

FIG. 1 is an explanatory diagram showing a configuration of an embodiment of a preheating apparatus that performs a preheating method in a reflow apparatus of the present invention.

FIG. 2 is a diagram for explaining a configuration of a nozzle panel using the present invention.

FIG. 3 shows an overall external view of a one-station multi-spot reflow apparatus using the present invention.

FIG. 4 is a diagram for explaining an operation of a heating device portion of a one-station multi-spot reflow device in which the preheating and main heating processes are performed in one station.

FIG. 5 is a diagram for explaining the operation of a lower-spray-type heating device in which the preheating and main heating processes are performed in one station.

FIG. 6 is a view showing an embodiment of an inline-type multi-spot reflow apparatus incorporating a multi-spot repeat apparatus using the present invention.

FIG. 7 shows an example of a temperature profile of a substrate preheated by the preheating apparatus of the present invention.

FIG. 8 shows an example of a temperature profile of a substrate preheated by a conventional preheating apparatus.

[Explanation of symbols]

SGT: Surge tank for generating hot air, HWG
... Hot air generator for supplying hot air to surge tank,
NOP: Nozzle panel, NO1, NO2,
~ Non ... Nozzle for sending hot air, PRB ...
・ Substrate to which electronic parts are attached, PA1 ...
Electronic components attached to the board by soldering,
PA2: electronic components mechanically attached to the substrate,
CH: cream solder for soldering electronic components to the board; FLM: frame holding the nozzle panel; PN: positioning pins;
· Holes in the substrate into which positioning pins are inserted, NH ...
Nozzle panel holes for nozzle installation, B
S: Screw for attaching the nozzle panel to the frame

Claims (18)

[Claims] A hot air generator is used to blow a hot air from a nozzle of a nozzle panel to only a soldered portion of a substrate by using a nozzle panel provided with a hot air generating device and a nozzle for sending out hot air generated by the hot air generating device. A preheating method in a reflow apparatus in which the soldering portion is partially preheated so that the heating by the preheating does not affect a portion other than the soldering portion. 2. A nozzle of a nozzle panel provided only at a plurality of soldered portions of a substrate using a nozzle panel having a hot air generator and a plurality of nozzles for sending out hot air generated by the hot air generator. By blowing more hot air to partially preheat the soldered part of the board,
A multi-spot preheating method in a reflow apparatus in which the influence of heating by preheating does not affect a portion other than a soldering portion. 3. A hot air generating device and a nozzle panel provided with a nozzle for sending out hot air generated by the hot air generating device are used to blow hot air from a nozzle of the nozzle panel to only a soldered portion of the substrate. Pre-heating the soldering part of the part, and controlling the heating amount of pre-heating by controlling the distance between the ripening outlet and the soldering surface, if the influence of heating by pre-heating affects the place other than the soldering part Preheating method in a reflow device that has been eliminated. 4. Using a hot air generating device and a nozzle panel provided with a nozzle for sending out hot air generated by the hot air generating device, hot air is blown from a nozzle of the nozzle panel only to a soldered portion of the substrate. Part of the pre-heated part was preheated, and the amount of preheating heating was changed by changing the diameter of the nozzle that sent the hot air, so that the effect of the preheat heating did not affect the parts other than the soldered part. Preheating method in reflow device. 5. A hot air generating device and a nozzle panel provided with a nozzle for sending out hot air generated by the hot air generating device are used to blow hot air from the nozzle of the nozzle panel to only the soldered portion of the substrate. Preheating part of the soldering part, and controlling the heating amount of the preheating by changing the diameter of the hole of the nozzle panel that supplies hot air to the nozzle, so that the effect of heating by preheating in places other than the soldering part A preheating method in a reflow device that is kept out of reach. 6. A hot air generating device and a nozzle panel provided with a nozzle for sending out hot air generated by the hot air generating device are used to blow hot air from a nozzle of the nozzle panel to only a soldered portion of the substrate. After partially preheating the soldering part, the main heating was performed by changing the amount of heating by the nozzle and soldering was performed, so that the influence of heating by soldering did not affect the places other than the soldering part One-station reflow method. 7. A nozzle of a nozzle panel is provided only at a plurality of soldered portions of a substrate using a hot air generator and a nozzle panel on which a plurality of nozzles for sending out hot air generated by the hot air generator are mounted. By blowing more hot air and partially preheating the soldered part of the board, changing the heating amount by the nozzle and performing main heating and soldering at multiple places on the board, soldering to places other than the soldered part A one-station multi-spot reflow method that is not affected by heating. 8. A nozzle of a nozzle panel provided only at a plurality of soldered portions of a substrate, using a nozzle panel provided with a hot air generator and a plurality of nozzles for sending hot air generated by the hot air generator. Blow more hot air to partially preheat the soldering part of the board, then control the distance between the hot air outlet of the nozzle and the soldering surface, change the amount of heating and perform main heating to solder the board at multiple locations Thus, a one-station multi-spot reflow method in which preheating and main heating are performed by the same heater so that the influence of heating by soldering does not affect a portion other than the soldering portion. 9. A substrate, comprising: a hot air generating device; and a nozzle panel to which a nozzle for sending out hot air generated by the hot air generating device is mounted. A preheating device in a reflow device that partially preheats a soldered portion of the reflow device. And a nozzle panel to which a hot air generator and a plurality of nozzles for sending out hot air generated by the hot air generator are attached. A multi-spot preheating device in a reflow device in which hot air is blown to partially preheat a soldered portion of a substrate. 11. A hot air generating device, a nozzle panel provided with a nozzle for sending out hot air generated by the hot air generating device, and a heating amount control means for controlling a heating amount of mature wind of the nozzle panel. A preheating apparatus in a reflow apparatus, comprising: a hot air blown from a nozzle of a nozzle panel to only a soldered portion of a substrate to partially preheat a soldered portion of the substrate. 12. A method for controlling a distance between a hot air generating device, a nozzle panel on which a nozzle for sending out hot air generated by the hot air generating device is mounted, and a mature air outlet of the nozzle panel and a soldering surface. A preheating apparatus in a reflow apparatus, comprising: a heating amount controlling means, wherein hot air is blown only from a nozzle of a nozzle panel to a soldered portion of a substrate to partially preheat a soldered portion of the substrate. 13. A surge tank for sending hot air, a hot air generator for supplying hot air to the surge tank, and a hot air generated from a hot air generating device attached to an opening at an upper portion of the surge tank. Surge tank level to control the heating amount by raising or lowering the level of the nozzle panel and the surge tank to which the nozzles to send out the nozzles are mounted, and controlling the distance between the mature air outlet of the nozzle panel and the soldering surface of the board A preheating device in a reflow device, comprising an adjusting device, wherein hot air is blown from a nozzle of a nozzle panel only to a soldered portion of the substrate to partially preheat the soldered portion of the substrate. 14. A surge tank for sending out hot air, a hot air generator for supplying hot air to the surge tank, and a hot air generated from a hot air generator attached to an opening at a lower portion of the surge tank to a substrate below the surge tank. Nozzle panel to which the nozzle to be sent out is attached, the level of the surge tank is raised or lowered to control the space between the mature air outlet of the nozzle panel and the soldering surface of the board. A preheating device in a reflow device, comprising a level adjusting device, wherein hot air is blown from nozzles of a nozzle panel only to a soldered portion of the substrate to partially preheat the soldered portion of the substrate. 15. A surge tank for delivering hot air, a hot air generator for supplying hot air to the surge tank, and a hot air generated from a hot air generating device attached to an opening at an upper portion of the surge tank. The level of the surge tank, which controls the heating amount by raising or lowering the nozzle panel to which the nozzles to send out the nozzles are mounted, or raising and lowering the surge tank to control the distance between the mature air outlet of the nozzle panel and the soldering surface of the board The device is equipped, and hot air is blown from the nozzles of the nozzle panel only to the soldering part of the board, and the soldering part of the board is partially preheated. Then, the level of the surge tank is raised and the main heating is performed to perform the soldering. 1-station reflow apparatus. 16. A surge tank for delivering hot air, a hot air generator for supplying hot air to the surge tank, and a hot air generated by a hot air generator attached to an opening at a lower portion of the surge tank to a substrate at a lower portion of the surge tank. A nozzle panel to which the nozzles to be sent out are mounted, and a substrate level adjusting device for controlling the amount of heating by raising or lowering the substrate to control the interval between the mature air outlet of the nozzle panel and the soldering surface of the substrate. Then, after blowing hot air from the nozzle of the nozzle panel to only the soldered portion of the board to partially preheat the soldered portion of the board, the level of the board is raised and the main heating is performed to perform the soldering. One-station reflow device. 17. A surge tank for sending out hot air, a hot air generator for supplying hot air to the surge tank, and a hot air generated from a hot air generator attached to an opening of the surge tank for a substrate having an alignment hole. The amount of heating is controlled by raising or lowering the nozzle panel and the surge tank to which the plurality of nozzles to be sent and the alignment pins are attached, and controlling the distance between the mature air outlet of the nozzle panel and the soldering surface of the substrate. Equipped with a surge tank level adjusting device, and by positioning the positioning pins of the nozzle panel to the positions of the positioning holes of the substrate, hot air is blown from the nozzles of the nozzle panel to the soldered portions of the substrate only at a plurality of soldered parts. Soldering by changing the surge tank level and performing main heating after partially preheating the attachment part 1 station multi-spot reflow apparatus that perform. 18. A nozzle having a hot air generating device and a nozzle panel to which a plurality of nozzles for sending out hot air generated by the hot air generating device are attached. The same nozzle as the preheater in which the hot air is blown to partially preheat the soldered portion of the substrate, a hot air generator and a plurality of nozzles for sending out the hot air generated by the hot air generator are attached. With a panel, hot air is blown from the nozzle of the nozzle panel only to a plurality of soldered portions of the substrate preheated by the preheating device, and the soldered portion of the substrate is partially heated main so that soldering is performed. And a carrier device for moving the substrate from the preheating device to the main heating device. Line-type multi-spot reflow apparatus.