JPH10335694A - Photoelectronic component and its manufacture - Google Patents
Photoelectronic component and its manufactureInfo
- Publication number
- JPH10335694A JPH10335694A JP14031297A JP14031297A JPH10335694A JP H10335694 A JPH10335694 A JP H10335694A JP 14031297 A JP14031297 A JP 14031297A JP 14031297 A JP14031297 A JP 14031297A JP H10335694 A JPH10335694 A JP H10335694A
- Authority
- JP
- Japan
- Prior art keywords
- light
- primary
- optoelectronic component
- component according
- resin
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、被検出物体の有無
を無接点で検出する透過型光結合装置のように光電子素
子を透光性樹脂と遮光性樹脂で二重封止した光電子部品
およびその製造方法に関するものである。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an optoelectronic component in which an optoelectronic element is double-sealed with a light-transmitting resin and a light-shielding resin, such as a transmission-type optical coupling device for detecting the presence or absence of an object to be detected without contact. The present invention relates to the manufacturing method.
【０００２】[0002]
【従来の技術】従来の光電子部品の一例として透過型光
結合装置およびその製造方法について図面を参照しつつ
説明する。図７は従来の透過型光結合装置の完成状態を
示す断面図であり、図７(a)は正面から見た断面図、図
７(b)は上面から見た断面図である。図８は図７に示す
透過型光結合装置の製造過程における状態を示してお
り、モールド完成の１工程前の２次モールド装置内での
位置決め状態を示す図である。図７において、１Ｌ，１
Ｐは対となる発光素子２Ｌ，受光素子２Ｐをそれぞれ内
装した１次モールド体、３Ｌ，３Ｐは光窓部、４は全体
を密封する２次モールド体であり、遮光性樹脂により構
成されている。このように構成することにより、その完
成状態に至る１工程前の２次モールド工程において、図
８に示すように、１次モールド体１Ｌ，１Ｐのリード端
子部５Ｌ，５Ｐを２次モールド金型６にて所定の間隔で
固定し、組となる他の２次モールド金型７，８Ｌ，８Ｐ
の内部へインサートして、突起部９Ｌ，９Ｐを両１次モ
ールド体１Ｌ，１Ｐへ押しつけ、これらを２次モールド
金型７の凸部７ａ，７ｂへ接触させることによって、２
次モールド工程において、１次モールド体１Ｌ，１Ｐを
密封する遮光性のある２次モールド体４が光窓部３Ｌ，
３Ｐへまわり込まないようにしている。2. Description of the Related Art As an example of a conventional optoelectronic component, a transmission type optical coupling device and a method of manufacturing the same will be described with reference to the drawings. 7A and 7B are sectional views showing a completed state of the conventional transmission type optical coupling device. FIG. 7A is a sectional view seen from the front, and FIG. 7B is a sectional view seen from the top. FIG. 8 shows a state in a manufacturing process of the transmission type optical coupling device shown in FIG. 7, and is a diagram showing a positioning state in a secondary molding apparatus one step before completion of molding. In FIG. 7, 1L, 1
P is a primary molded body in which a light emitting element 2L and a light receiving element 2P to be paired are respectively housed, 3L and 3P are optical windows, and 4 is a secondary molded body that seals the whole, and is made of a light-shielding resin. . With this configuration, the lead terminals 5L and 5P of the primary molded bodies 1L and 1P are connected to the secondary mold dies in the secondary molding step one step before reaching the completed state, as shown in FIG. The other secondary molds 7, 8L, 8P which are fixed at predetermined intervals at 6 and form a set
By pressing the projections 9L and 9P against the two primary mold bodies 1L and 1P and bringing them into contact with the projections 7a and 7b of the secondary molding die 7,
In the next molding step, a light-shielding secondary mold body 4 that seals the primary mold bodies 1L and 1P is provided with an optical window 3L,
I try not to go around 3P.
【０００３】図９は従来の光電子部品の他の例を示す断
面図であり、図９(a)は正面から見た断面図、図９(b)は
上面から見た断面図である。なお、図中、図７，図８に
示したものと同一部分には同一符号を付し、その詳細な
説明は省略する。この例における光窓部１Ｌａ，１Ｐａ
は前記同様の２次モールド工程において、１次モールド
体１Ｌ，１Ｐを２次モールド金型へ接触させることによ
り形成しており、前記光窓部１Ｌａ，１Ｐａが遮光性の
ある２次モールド体４から露出する構造になっている。FIG. 9 is a sectional view showing another example of a conventional optoelectronic component. FIG. 9 (a) is a sectional view seen from the front, and FIG. 9 (b) is a sectional view seen from the top. In the drawings, the same parts as those shown in FIGS. 7 and 8 are denoted by the same reference numerals, and detailed description thereof will be omitted. Optical window portions 1La and 1Pa in this example
Is formed by bringing the primary molds 1L and 1P into contact with the secondary mold in the same secondary molding step as described above, and the light window portions 1La and 1Pa are formed of the light-shielding secondary mold 4. It is structured to be exposed from.
【０００４】[0004]
【発明が解決しようとする課題】しかしながら、このよ
うな従来の構成、例えば図７のような構造の場合、２次
モールド工程におけるインジェクション成形等の成形圧
力(数百kg／cm2)が１次モールド体１Ｌ，１Ｐに加わ
り、これ等１次モールド体１Ｌ，１Ｐが横方向に流され
ることがある。図10は従来の透過型光結合装置の製造過
程において、２次モールド体内で１次モールド体が流さ
れた状態を示す正面図であり、２次モールド体４のセン
ター（Ｃ1−Ｃ1′)と１次モールド体１Ｌ，１Ｐのセン
ター（Ｃ2−Ｃ2′)がずれてしまい、１次モールド体１
Ｌ，１Ｐのセンターに載置された発光素子２Ｌ、受光素
子２Ｐが２次モールド体４のセンターに形成された光窓
部３Ｌ，３Ｐからずれてしまうという問題があり、図９
のような構造の場合も同様なことが起こる。図11は２次
モールド体内で１次モールド体が流される状態を示す正
面図であり、２次モールド体４のセンター（Ｃ3−
Ｃ3′)と１次モールド体に形成された光窓部３Ｌ，３Ｐ
のセンター（Ｃ4−Ｃ4′)が前記同様ずれる結果とな
り、いずれの場合も、発光素子と受光素子間の光伝達特
性や検出位置特性等の光学的特性が低下してしまうとい
う問題点があった。However, in the case of such a conventional structure, for example, the structure as shown in FIG. 7, the molding pressure (several hundred kg / cm 2 ) of the injection molding or the like in the secondary molding step is the primary pressure. In addition to the mold bodies 1L and 1P, the primary mold bodies 1L and 1P may flow laterally. FIG. 10 is a front view showing a state in which the primary molded body is flown in the secondary molded body in the process of manufacturing the conventional transmission type optical coupling device, and shows the center (C 1 -C 1 ′) of the secondary molded body 4. ) And the centers (C 2 -C 2 ′) of the primary molds 1L and 1P are shifted, and the primary mold 1
There is a problem that the light emitting element 2L and the light receiving element 2P mounted on the centers of the L and 1P are displaced from the optical windows 3L and 3P formed on the center of the secondary mold body 4, and FIG.
The same occurs in the case of the structure as described above. Figure 11 is a front view showing a state where the first molded body is flown in the secondary mold body, the second molded body 4 Center (C 3 -
C 3 ′) and optical windows 3L, 3P formed in the primary mold body
Results in the center (C 4 -C 4 ′) being shifted similarly to the above, and in any case, there is a problem that optical characteristics such as light transmission characteristics between light emitting elements and light receiving elements and detection position characteristics are deteriorated. there were.
【０００５】本発明は上記従来の問題点を解決するもの
であり、２次モールド体のセンターと１次モールド体の
センターのずれを抑えることができる高精度一体モール
ドの光電子部品およびその製造方法を提供することを目
的とする。SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and provides a high-precision integrated mold optoelectronic component capable of suppressing the displacement between the center of the secondary mold and the center of the primary mold, and a method of manufacturing the same. The purpose is to provide.
【０００６】[0006]
【課題を解決するための手段】本発明の光電子部品は、
光電子素子を透光性樹脂で１次封止し、前記透光性樹脂
外囲部に凹部もしくは凸部を設けて遮光性樹脂で２次封
止し、前記遮光性樹脂に前記透光性樹脂外囲部の凹部も
しくは凸部に達する開口部を設けたものであり、また、
本発明の光電子部品の製造方法は、２次モールド工程に
おいて１次モールド体を位置決めする工程を含めたもの
である。According to the present invention, an optoelectronic component is provided.
The optoelectronic element is primarily sealed with a light-transmitting resin, a concave portion or a convex portion is provided in the outer periphery of the light-transmitting resin, and the light-emitting resin is secondarily sealed with a light-shielding resin. An opening reaching the concave portion or the convex portion of the outer surrounding portion is provided,
The method for manufacturing an optoelectronic component of the present invention includes a step of positioning the primary mold body in the secondary molding step.
【０００７】この発明によれば、２次モールド体のセン
ターと１次モールド体のセンターのずれを抑えた高精度
一体モールドの光電子部品が得られる。According to the present invention, it is possible to obtain a high-precision integrated-mold optoelectronic component in which the center of the secondary mold body and the center of the primary mold body are suppressed from being shifted.
【０００８】[0008]
【発明の実施の形態】以下本発明の一実施の形態につい
て図面を参照しつつ説明する。なお、前記従来のものと
同一部分には同一符号を付し、その詳細な説明は省略す
る。DESCRIPTION OF THE PREFERRED EMBODIMENTS One embodiment of the present invention will be described below with reference to the drawings. The same parts as those of the conventional one are denoted by the same reference numerals, and detailed description thereof will be omitted.
【０００９】図１は本発明の光電子部品の一実施の形態
における光結合装置の完成状態を示す図であり、図１
(a)はその斜視図、図１(b)は正面から見た断面図、図１
(c)は上部からみた断面図である。図２は図１に示す光
結合装置の製造過程における状態を示しており、モール
ド完成前の工程における２次モールド装置内での位置決
め状態を示す図、図３ないし図５は本発明の光電子部品
の一実施の形態における光結合装置の製造方法を説明す
るための図であり、図３は最初の工程における発光素子
とリードフレーム近傍の状態を示す斜視図、図４は１次
モールド体をその背面から見た斜視図、図５は１次モー
ルド体の凹部と２次モールド金型の位置決め用突起部と
の係合状態の説明図である。FIG. 1 is a diagram showing a completed state of an optical coupling device in one embodiment of the optoelectronic component of the present invention.
1 (a) is a perspective view thereof, FIG. 1 (b) is a sectional view seen from the front, FIG.
(c) is a sectional view seen from above. FIG. 2 shows a state in a manufacturing process of the optical coupling device shown in FIG. 1, showing a positioning state in a secondary molding device in a process before completion of a mold, and FIGS. 3 to 5 show optoelectronic components of the present invention. FIG. 3 is a diagram for explaining a method of manufacturing the optical coupling device in one embodiment, FIG. 3 is a perspective view showing a state near a light emitting element and a lead frame in an initial step, and FIG. FIG. 5 is a perspective view seen from the back, and FIG. 5 is an explanatory view of an engagement state between a concave portion of the primary mold body and a positioning projection of the secondary mold.
【００１０】まず、図３に示すように発光素子２Ｌを基
板、この場合は一対のリードフレーム５Ｌの一方に搭載
し、さらに、発光素子２Ｌの電極と他のリードフレーム
５Ｌとの間を金属細線10で接続する。次いで、図４に示
すように透光性樹脂11によって背部(図３のリードフレ
ーム５Ｌの発光素子搭載部に対する裏側)に断面略円形
状の凹部12Ｌが設けられるように１次モールドを行い、
発光素子側の１次モールド体１Ｌが完成する。受光素子
側も、同様の方法によって形成する。この時、１次モー
ルドで形成される凹部12Ｌ、12Ｐは図５に示すようにテ
ーパ部13を設けておくと２次モールドを実施する際、２
次モールド装置の断面略円形状の位置決め用突起部９
Ｌ，９Ｐとの嵌合を容易にすることができる。なお、１
次モールド体１Ｌ，１Ｐを注型法で形成する場合、抜き
型の制約から図４の凹部形状は成形できないので、この
場合は１次モールド体背面の上下方向に対しての規制は
なく、横方向のみ規制できる形状、例えば図６(a)，(b)
に示すように１次モールド体の上面から下面方向へ延び
た溝、あるいは上面から１次モールド体背面の中央部ま
で延びた溝にすることで成形可能となる。First, as shown in FIG. 3, a light emitting element 2L is mounted on a substrate, in this case, one of a pair of lead frames 5L. Further, a thin metal wire is connected between the electrode of the light emitting element 2L and another lead frame 5L. Connect with 10. Next, as shown in FIG. 4, primary molding is performed by using a translucent resin 11 so that a concave portion 12L having a substantially circular cross section is provided on a back portion (on the back side of the light emitting element mounting portion of the lead frame 5L in FIG. 3).
The primary mold body 1L on the light emitting element side is completed. The light receiving element side is also formed by the same method. At this time, when the concave portions 12L and 12P formed by the primary mold are provided with the tapered portions 13 as shown in FIG.
Positioning projection 9 having a substantially circular cross section of the next molding device
L, 9P can be easily fitted. In addition, 1
When the next molded bodies 1L and 1P are formed by the casting method, the concave shape shown in FIG. 4 cannot be molded due to the limitation of the punching die. Shapes that can restrict only the direction, for example, FIGS. 6 (a) and 6 (b)
As shown in (1), molding can be performed by forming a groove extending from the upper surface of the primary mold body to the lower surface or a groove extending from the upper surface to the center of the back surface of the primary mold body.
【００１１】次に図２に示すように、完成した発光素子
側１次モールド体１Ｌと受光素子側１次モールド体１Ｐ
を２次モールド金型７の金型内に対向配置し、遮光性樹
脂を用いた２次モールド体４により両者を一体化する２
次モールドを行うが、この２次モールド時、スプリング
14により矢印方向に付勢された移動可能な断面略円形状
の突起部９Ｌ，９Ｐと１次モールド体１Ｌ，１Ｐのモー
ルド体背面部の凹部12Ｌ、12Ｐとを嵌合させることによ
り、１次モールド体１Ｌ，１Ｐを位置決めする。このよ
うな、嵌合による位置決めを行えば従来のように強い圧
力で挟み込む必要がなく、その後、射出成形により２次
モールドを行っても、従来のような１次モールド体１
Ｌ，１Ｐが偏心することはない。つまり、２次モールド
体４の光窓部15Ｌ，15Ｐのセンターと１次モールド体１
Ｌ，１Ｐのセンターがずれることがなく、更に、突起部
９Ｌ，９Ｐを抜いた後に形成される開口部16Ｌ，16Ｐと
前記各センターは一直線上に並ぶことになり、安定した
発光素子と受光素子間の光伝達特性、検出位置特性を有
する透過型光結合装置が得られる。Next, as shown in FIG. 2, the completed light emitting element side primary molded body 1L and the light receiving element side primary molded body 1P
Are arranged opposite to each other in the mold of the secondary mold 7 and the two are integrated by the secondary mold body 4 using a light-shielding resin.
The next molding is performed.
By fitting the movable protrusions 9L, 9P of a substantially circular cross section urged in the direction of the arrow by 14 with the recesses 12L, 12P on the back surface of the molded body of the primary molded bodies 1L, 1P, The mold bodies 1L and 1P are positioned. By performing such positioning by fitting, it is not necessary to sandwich with a strong pressure as in the conventional case.
L and 1P are not eccentric. That is, the center of the optical windows 15L and 15P of the secondary mold 4 and the primary mold 1
The centers of L and 1P do not shift, and the openings 16L and 16P formed after the protrusions 9L and 9P are removed and the centers are aligned with each other, so that a stable light emitting element and light receiving element can be obtained. Thus, a transmission type optical coupling device having light transmission characteristics and detection position characteristics between them can be obtained.
【００１２】なお、スプリング14で付勢された移動可能
な突起部９Ｌ，９Ｐの代わりに２次モールド金型７のス
ライド金型８Ｌ，８Ｐに突起部９Ｌ，９Ｐを一体構成し
て製造してもよく、これにより形成される開口部は２次
モールド終了後封止すれば遮光性が向上する。また、こ
のスプリング付勢された移動可能な突起部９Ｌ，９Ｐは
１次モールド体１Ｌ，１Ｐの位置決めと光窓部15Ｌ，15
Ｐを形成するための２次モールド金型７への押しつけの
２つの役目を持っており、加えて２次モールド金型７と
突起部９Ｌ，９Ｐにて１次モールド体１Ｌ，１Ｐを挟み
込む際には１次モールド体１Ｌ，１Ｐへのストレスを緩
和し、信頼性の高い高精度一体モールドの透過型光結合
装置が製造できる。In addition, instead of the movable projections 9L and 9P urged by the spring 14, the projections 9L and 9P are integrally formed on the slide dies 8L and 8P of the secondary molding die 7 to manufacture. If the opening formed by this is sealed after the completion of the secondary molding, the light shielding property is improved. The movable projections 9L and 9P that are biased by the spring are used to position the primary mold bodies 1L and 1P and to adjust the optical windows 15L and 15P.
It has two roles of pressing against the secondary mold 7 to form P. In addition, when the primary mold 1L, 1P is sandwiched between the secondary mold 7 and the projections 9L, 9P. In this method, a stress on the primary mold bodies 1L and 1P can be reduced, and a highly reliable high-precision integral-mold transmission optical coupling device can be manufactured.
【００１３】更に、２次モールド体は熱可塑性樹脂ある
いは熱硬化性樹脂であってもよく、また、１次モールド
体を形成する透光性樹脂は発光素子として赤外発光ダイ
オードを用いる場合は可視光を遮断するタイプの樹脂で
あってもよく、受光素子としては、ホトトランジスタ、
ホトダイオード、集積化受光素子であってもよい。更に
また、上記の実施の形態は透過型光結合装置の例で説明
しているが、発光素子または受光素子単体ならびにそれ
等の組み合わせの場合であっても本発明を適用し得るこ
とは勿論である。Further, the secondary mold body may be a thermoplastic resin or a thermosetting resin, and the translucent resin forming the primary mold body is visible when an infrared light emitting diode is used as a light emitting element. A resin that blocks light may be used. As the light receiving element, a phototransistor,
It may be a photodiode or an integrated light receiving element. Furthermore, although the above embodiment has been described with reference to the example of the transmission type optical coupling device, it is needless to say that the present invention can be applied to the case of a single light emitting element or a light receiving element and a combination thereof. is there.
【００１４】以上のように本実施の形態によれば、２次
モールド時の２次モールド体のセンターと１次モールド
体のセンターのずれを抑えることができ、また、光電子
素子が２次モールド体に設けた開口部に対して基板の裏
面側に取り付けられるので不要な光が遮光され、またこ
の基板をリードフレームとすることにより、安価にかつ
容易に組立ができる。更に、光窓部と、基板の表面側に
載置した光電子素子と、透光性樹脂外囲部の凹部もしく
は凸部とを一直線上に配置したことにより、光伝達特性
が良好で、かつ安定した封止ができる。As described above, according to the present embodiment, the displacement between the center of the secondary mold and the center of the primary mold during the secondary molding can be suppressed, and the optoelectronic device can be used in the secondary mold. Since unnecessary light is shielded because it is attached to the back side of the substrate with respect to the opening provided in the substrate, and the substrate is used as a lead frame, it is possible to easily and inexpensively assemble. Further, the optical window, the optoelectronic element mounted on the front surface side of the substrate, and the concave or convex portion of the translucent resin outer peripheral portion are arranged in a straight line, so that light transmission characteristics are good and stable. Sealing can be achieved.
【００１５】[0015]
【発明の効果】以上のように本発明によれば、２次モー
ルド時の１次モールド体の位置決めを精度よく行え、光
通路となる１次モールド体のセンターと２次モールド体
のセンターがずれるのを防止できるので、発光素子と受
光素子間の安定した光伝達特性、検出位置特性を有する
光電子部品を容易に製造できるという有利な効果が得ら
れる。As described above, according to the present invention, the position of the primary mold body can be accurately determined at the time of the secondary molding, and the center of the primary mold body and the center of the secondary mold body serving as an optical path are shifted. Therefore, an advantageous effect that an optoelectronic component having stable light transmission characteristics between the light emitting element and the light receiving element and the detection position characteristic can be easily manufactured is obtained.
【図１】本発明の光電子部品の一実施の形態における光
結合装置の完成状態を示す図である。FIG. 1 is a diagram showing a completed state of an optical coupling device in one embodiment of an optoelectronic component of the present invention.
【図２】本発明の光電子部品の一実施の形態における光
結合装置の製造過程における状態を示しており、２次モ
ールド装置内での位置決め状態を示す図である。FIG. 2 is a diagram illustrating a state in a manufacturing process of the optical coupling device according to the embodiment of the optoelectronic component of the present invention, and illustrating a positioning state in the secondary molding device.
【図３】本発明の光電子部品の一実施の形態における光
結合装置の最初の製造工程における発光素子とリードフ
レーム近傍の状態を示す斜視図である。FIG. 3 is a perspective view showing a state near a light emitting element and a lead frame in a first manufacturing process of the optical coupling device in one embodiment of the optoelectronic component of the present invention.
【図４】本発明の光電子部品の一実施の形態における光
結合装置の１次モールド体をその背面から見た斜視図で
ある。FIG. 4 is a perspective view of a primary molded body of the optical coupling device in one embodiment of the optoelectronic component of the present invention as viewed from a back surface thereof.
【図５】本発明の光電子部品の一実施の形態における光
結合装置の１次モールド体の凹部と２次モールド装置の
位置決め用突起部との係合状態の説明図である。FIG. 5 is an explanatory view of an engagement state between a concave portion of the primary mold body of the optical coupling device and a positioning projection of the secondary molding device in one embodiment of the optoelectronic component of the present invention.
【図６】本発明の光電子部品の一実施の形態における光
結合装置の１次モールド体の他の例を示し、その背面か
ら見た斜視図である。FIG. 6 is a perspective view showing another example of the primary molded body of the optical coupling device according to the embodiment of the optoelectronic component of the present invention, as viewed from the back surface thereof.
【図７】従来の透過型光結合装置の完成状態を示す断面
図である。FIG. 7 is a cross-sectional view showing a completed state of a conventional transmission type optical coupling device.
【図８】従来の透過型光結合装置の製造過程における状
態を示しており、２次モールド装置内での位置決め状態
を示す図である。FIG. 8 is a diagram showing a state in a manufacturing process of a conventional transmission type optical coupling device, and showing a positioning state in a secondary molding device.
【図９】従来の透過型光結合装置の他の例を示す断面図
である。FIG. 9 is a cross-sectional view showing another example of a conventional transmission type optical coupling device.
【図１０】従来の透過型光結合装置の製造過程におい
て、２次モールド体内で１次モールド体が流された状態
を示す正面図である。FIG. 10 is a front view showing a state in which a primary mold has flowed in a secondary mold in a manufacturing process of a conventional transmission type optical coupling device.
【図１１】従来の透過型光結合装置の製造過程におい
て、２次モールド体内で１次モールド体が流された状態
を示す正面図である。FIG. 11 is a front view showing a state in which a primary mold has flowed in a secondary mold in a manufacturing process of a conventional transmission type optical coupling device.
１Ｌ，１Ｐ…１次モールド体、 ２Ｌ…発光素子、 ２
Ｐ…受光素子、 ４…２次モールド体、 ５Ｌ，５Ｐ…
リードフレーム、 ６，７，８Ｌ，８Ｐ…２次モールド
金型、 ９Ｌ，９Ｐ…突起部、 11…透光性樹脂、 12
Ｌ，12Ｐ…凹部、13…テーパ部、 14…スプリング、
15Ｌ，15Ｐ…光窓部、 16Ｌ，16Ｐ…開口部。1L, 1P: primary molded body, 2L: light emitting element, 2
P: light receiving element, 4: secondary mold body, 5L, 5P ...
Lead frame, 6, 7, 8L, 8P: Secondary mold, 9L, 9P: Projection, 11: Translucent resin, 12
L, 12P recess, 13 taper, 14 spring,
15L, 15P: optical window, 16L, 16P: opening.
Claims (14)
前記透光性樹脂外囲部に凹部もしくは凸部を設けて遮光
性樹脂で２次封止し、前記遮光性樹脂に前記透光性樹脂
外囲部の凹部もしくは凸部に達する開口部及び光窓部を
設けた光電子部品。1. A primary sealing of an optoelectronic element with a translucent resin,
A concave portion or a convex portion is provided in the light-transmitting resin outer peripheral portion, and the light-transmitting resin is secondarily sealed with a light-shielding resin. Opto-electronic components with windows.
状態で透光性樹脂により１次封止されることを特徴とす
る請求項１記載の光電子部品。2. The optoelectronic component according to claim 1, wherein the optoelectronic device is firstly sealed with a translucent resin while being mounted on the front surface side of the substrate.
とする請求項２記載の光電子部品。3. The optoelectronic component according to claim 2, wherein the substrate is a lead frame.
されることを特徴とする請求項１記載の光電子部品。4. The optoelectronic component according to claim 1, wherein the opening reaching the concave portion or the convex portion is sealed.
を特徴とする請求項１記載の光電子部品。5. The optoelectronic component according to claim 1, wherein the concave portion or the convex portion has a substantially circular shape.
面から下面方向へ延びた溝であることを特徴とする請求
項１記載の光電子部品。6. The optoelectronic component according to claim 1, wherein the recess is a groove extending from the upper surface to the lower surface of the primary molded body of the translucent resin.
とを特徴とする請求項１記載の光電子部品。7. The optoelectronic component according to claim 1, wherein a tapered portion is provided in the concave portion or the convex portion.
あることを特徴とする請求項１記載の光電子部品。8. The optoelectronic component according to claim 1, wherein the optoelectronic device is a light emitting device or a light receiving device.
合わせであることを特徴とする請求項１記載の光電子部
品。9. The optoelectronic component according to claim 1, wherein the optoelectronic device is a combination of a light emitting device and a light receiving device.
の基板に載置し、前記発光素子と受光素子とをそれぞれ
透光性樹脂で１次封止した発光側１次モールド体と受光
側１次モールド体とを対向配置し、前記発光素子と受光
素子を光学的に結合する光窓部を設けるよう両１次モー
ルド体の周囲を遮光性樹脂にて２次封止し、前記両１次
モールド体の発光面、受光面に対する１次モールド体背
面部に凹部もしくは凸部を設けた光電子部品。10. A light-emitting side primary molded body and a light-receiving side 1 in which a light-emitting element and a light-receiving element are mounted on separate substrates, respectively, and the light-emitting element and the light-receiving element are respectively primarily sealed with a transparent resin. The two primary mold bodies are secondarily sealed with a light-blocking resin so as to provide an optical window for optically coupling the light emitting element and the light receiving element. An optoelectronic component in which a concave portion or a convex portion is provided on the back surface of the primary mold body with respect to the light emitting surface and the light receiving surface of the mold body.
は凸部とは一直線上に配置されることを特徴とする請求
項１ないし請求項10のいずれか１つに記載の光電子部
品。11. The optoelectronic component according to claim 1, wherein the optical window, the optoelectronic element, and the concave or convex portion are arranged on a straight line.
の基板に載置し、前記発光素子と受光素子とをそれぞれ
透光性樹脂で１次封止した発光側１次モールド体と受光
側１次モールド体を対向配置し、前記発光素子と受光素
子を光学的に結合する光窓部を設けるよう両１次モール
ド体の周囲を遮光性樹脂にて２次封止する光電子部品の
製造方法であって、前記２次封止の工程に、前記両１次
モールド体の発光面、受光面に対する１次モールド体背
面部に設けた凹部もしくは凸部に係合してこれを支持す
る支持部材により、各１次モールド体を位置決めする工
程を含むことを特徴とする光電子部品の製造方法。12. A light-emitting side primary molded body and a light-receiving side 1 in which a light-emitting element and a light-receiving element are mounted on separate substrates, respectively, and the light-emitting element and the light-receiving element are primarily sealed with a transparent resin, respectively. A method of manufacturing an optoelectronic component in which a primary mold body is disposed to face and a periphery of both primary mold bodies is secondarily sealed with a light-blocking resin so as to provide an optical window for optically coupling the light emitting element and the light receiving element. In the secondary sealing step, a supporting member that engages with and supports a concave portion or a convex portion provided on the back surface of the primary mold body with respect to the light emitting surface and the light receiving surface of the two primary mold bodies. And a step of positioning each primary mold body.
において、弾性体により１次モールド体方向に付勢され
た移動可能な位置決め用支持部材を用いることを特徴と
する請求項12記載の光電子部品の製造方法。13. The optoelectronic component according to claim 12, wherein in the step of positioning each primary mold body, a movable positioning support member urged in the direction of the primary mold body by an elastic body is used. Manufacturing method.
と基板の位置決めは一直線上で行われることを特徴とす
る請求項13記載の光電子部品の製造方法。14. The method for manufacturing an optoelectronic component according to claim 13, wherein the positioning of the optical window, the light emitting element or the light receiving element and the substrate is performed in a straight line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14031297A JP3793622B2 (en) | 1997-05-29 | 1997-05-29 | Transmission type optical coupling device and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14031297A JP3793622B2 (en) | 1997-05-29 | 1997-05-29 | Transmission type optical coupling device and manufacturing method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH10335694A true JPH10335694A (en) | 1998-12-18 |
| JP3793622B2 JP3793622B2 (en) | 2006-07-05 |
Family
ID=15265880
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14031297A Expired - Fee Related JP3793622B2 (en) | 1997-05-29 | 1997-05-29 | Transmission type optical coupling device and manufacturing method thereof |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3793622B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP5917007B2 (en) | 2011-03-18 | 2016-05-11 | 旭化成エレクトロニクス株式会社 | Photo coupler |
-
1997
- 1997-05-29 JP JP14031297A patent/JP3793622B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3793622B2 (en) | 2006-07-05 |
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