JP3793622B2 - Transmission type optical coupling device and manufacturing method thereof - Google Patents

Transmission type optical coupling device and manufacturing method thereof Download PDF

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Publication number
JP3793622B2
JP3793622B2 JP14031297A JP14031297A JP3793622B2 JP 3793622 B2 JP3793622 B2 JP 3793622B2 JP 14031297 A JP14031297 A JP 14031297A JP 14031297 A JP14031297 A JP 14031297A JP 3793622 B2 JP3793622 B2 JP 3793622B2
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Japan
Prior art keywords
light emitting
mold body
light receiving
primary mold
coupling device
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JP14031297A
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JPH10335694A (en
Inventor
省三 森部
純也 古屋敷
静夫 鶴
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Panasonic Corp
Panasonic Holdings Corp
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Panasonic Corp
Matsushita Electric Industrial Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item

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  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)

Description

【０００１】
【発明の属する技術分野】
本発明は、被検出物体の有無を無接点で検出する透過型光結合装置に係り、発光素子と受光素子とを透光性樹脂と遮光性樹脂で二重封止した透過型光結合装置およびその製造方法に関するものである。
【０００２】
【従来の技術】
従来の光電子部品の一例として透過型光結合装置およびその製造方法について図面を参照しつつ説明する。図７は従来の透過型光結合装置の完成状態を示す断面図であり、図７(a)は正面から見た断面図、図７(b)は上面から見た断面図である。図８は図７に示す透過型光結合装置の製造過程における状態を示しており、モールド完成の１工程前の２次モールド装置内での位置決め状態を示す図である。図７において、１Ｌ，１Ｐは対となる発光素子２Ｌ，受光素子２Ｐをそれぞれ内装した１次モールド体、３Ｌ，３Ｐは光窓部、４は全体を密封する２次モールド体であり、遮光性樹脂により構成されている。このように構成することにより、その完成状態に至る１工程前の２次モールド工程において、図８に示すように、１次モールド体１Ｌ，１Ｐのリード端子部５Ｌ，５Ｐを２次モールド金型６にて所定の間隔で固定し、組となる他の２次モールド金型７，８Ｌ，８Ｐの内部へインサートして、突起部９Ｌ，９Ｐを両１次モールド体１Ｌ，１Ｐへ押しつけ、これらを２次モールド金型７の凸部７ａ，７ｂへ接触させることによって、２次モールド工程において、１次モールド体１Ｌ，１Ｐを密封する遮光性のある２次モールド体４が光窓部３Ｌ，３Ｐへまわり込まないようにしている。
【０００３】
図９は従来の光電子部品の他の例を示す断面図であり、図９(a)は正面から見た断面図、図９(b)は上面から見た断面図である。なお、図中、図７，図８に示したものと同一部分には同一符号を付し、その詳細な説明は省略する。この例における光窓部１Ｌａ，１Ｐａは前記同様の２次モールド工程において、１次モールド体１Ｌ，１Ｐを２次モールド金型へ接触させることにより形成しており、前記光窓部１Ｌａ，１Ｐａが遮光性のある２次モールド体４から露出する構造になっている。
【０００４】
【発明が解決しようとする課題】
しかしながら、このような従来の構成、例えば図７のような構造の場合、２次モールド工程におけるインジェクション成形等の成形圧力(数百kg／cm2)が１次モールド体１Ｌ，１Ｐに加わり、これ等１次モールド体１Ｌ，１Ｐが横方向に流されることがある。図10は従来の透過型光結合装置の製造過程において、２次モールド体内で１次モールド体が流された状態を示す正面図であり、２次モールド体４のセンター（Ｃ1−Ｃ1′)と１次モールド体１Ｌ，１Ｐのセンター（Ｃ2−Ｃ2′)がずれてしまい、１次モールド体１Ｌ，１Ｐのセンターに載置された発光素子２Ｌ、受光素子２Ｐが２次モールド体４のセンターに形成された光窓部３Ｌ，３Ｐからずれてしまうという問題があり、図９のような構造の場合も同様なことが起こる。図11は２次モールド体内で１次モールド体が流される状態を示す正面図であり、２次モールド体４のセンター（Ｃ3−Ｃ3′)と１次モールド体に形成された光窓部３Ｌ，３Ｐのセンター（Ｃ4−Ｃ4′)が前記同様ずれる結果となり、いずれの場合も、発光素子と受光素子間の光伝達特性や検出位置特性等の光学的特性が低下してしまうという問題点があった。
【０００５】
本発明は上記従来の問題点を解決するものであり、２次モールド体のセンターと１次モールド体のセンターのずれを抑えることができる高精度一体モールドの透過型光結合装置およびその製造方法を提供することを目的とする。
【０００６】
【課題を解決するための手段】
本発明の透過型光結合装置は、発光素子と受光素子をそれぞれ透光性樹脂で１次封止し、前記透光性樹脂外囲部に凹部を設けて遮光性樹脂で２次封止し、前記遮光性樹脂に前記透光性樹脂外囲部の凹部に達する開口部を設けたものであり、また、本発明の透過型光結合装置の製造方法は、２次モールド工程において１次モールド体を位置決めする工程を含めたものである。
【０００７】
本発明によれば、２次モールド体のセンターと１次モールド体のセンターのずれを抑えた高精度一体モールドの透過型光結合装置が得られる。
【０００８】
【発明の実施の形態】
以下本発明の一実施の形態について図面を参照しつつ説明する。なお、前記従来のものと同一部分には同一符号を付し、その詳細な説明は省略する。
【０００９】
図１は本発明の一実施の形態である透過型光結合装置の完成状態を示す図であり、図１(a)はその斜視図、図１(b)は正面から見た断面図、図１(c)は上部からみた断面図である。図２は図１に示す透過型光結合装置の製造過程における状態を示しており、モールド完成前の工程における２次モールド装置内での位置決め状態を示す図、図３ないし図５は本発明の一実施の形態における透過型光結合装置の製造方法を説明するための図であり、図３は最初の工程における発光素子とリードフレーム近傍の状態を示す斜視図、図４は１次モールド体をその背面から見た斜視図、図５は１次モールド体の凹部と２次モールド金型の位置決め用突起部との係合状態の説明図である。
【００１０】
まず、図３に示すように発光素子２Ｌを基板、この場合は一対のリードフレーム５Ｌの一方に搭載し、さらに、発光素子２Ｌの電極と他のリードフレーム５Ｌとの間を金属細線10で接続する。次いで、図４に示すように透光性樹脂11によって背部(図３のリードフレーム５Ｌの発光素子搭載部に対する裏側)に断面略円形状の凹部12Ｌが設けられるように１次モールドを行い、発光素子側の１次モールド体１Ｌが完成する。受光素子側も、同様の方法によって形成する。この時、１次モールドで形成される凹部12Ｌ、12Ｐは図５に示すようにテーパ部13を設けておくと２次モールドを実施する際、２次モールド装置の断面略円形状の位置決め用突起部９Ｌ，９Ｐとの嵌合を容易にすることができる。なお、１次モールド体１Ｌ，１Ｐを注型法で形成する場合、抜き型の制約から図４の凹部形状は成形できないので、この場合は１次モールド体背面の上下方向に対しての規制はなく、横方向のみ規制できる形状、例えば図６(a)，(b)に示すように１次モールド体の上面から下面方向へ延びた溝、あるいは上面から１次モールド体背面の中央部まで延びた溝にすることで成形可能となる。
【００１１】
次に図２に示すように、完成した発光素子側１次モールド体１Ｌと受光素子側１次モールド体１Ｐを２次モールド金型７の金型内に対向配置し、遮光性樹脂を用いた２次モールド体４により両者を一体化する２次モールドを行うが、この２次モールド時、スプリング14により矢印方向に付勢された移動可能な断面略円形状の突起部９Ｌ，９Ｐと１次モールド体１Ｌ，１Ｐのモールド体背面部の凹部12Ｌ、12Ｐとを嵌合させることにより、１次モールド体１Ｌ，１Ｐを位置決めする。このような、嵌合による位置決めを行えば従来のように強い圧力で挟み込む必要がなく、その後、射出成形により２次モールドを行っても、従来のような１次モールド体１Ｌ，１Ｐが偏心することはない。つまり、２次モールド体４の光窓部15Ｌ，15Ｐのセンターと１次モールド体１Ｌ，１Ｐのセンターがずれることがなく、更に、突起部９Ｌ，９Ｐを抜いた後に形成される開口部16Ｌ，16Ｐと前記各センターは一直線上に並ぶことになり、安定した発光素子と受光素子間の光伝達特性、検出位置特性を有する透過型光結合装置が得られる。
【００１２】
なお、スプリング14で付勢された移動可能な突起部９Ｌ，９Ｐの代わりに２次モールド金型７のスライド金型８Ｌ，８Ｐに突起部９Ｌ，９Ｐを一体構成して製造してもよく、これにより形成される開口部は２次モールド終了後封止すれば遮光性が向上する。また、このスプリング付勢された移動可能な突起部９Ｌ，９Ｐは１次モールド体１Ｌ，１Ｐの位置決めと光窓部15Ｌ，15Ｐを形成するための２次モールド金型７への押しつけの２つの役目を持っており、加えて２次モールド金型７と突起部９Ｌ，９Ｐにて１次モールド体１Ｌ，１Ｐを挟み込む際には１次モールド体１Ｌ，１Ｐへのストレスを緩和し、信頼性の高い高精度一体モールドの透過型光結合装置が製造できる。
【００１３】
更に、２次モールド体は熱可塑性樹脂あるいは熱硬化性樹脂であってもよく、また、１次モールド体を形成する透光性樹脂は発光素子として赤外発光ダイオードを用いる場合は可視光を遮断するタイプの樹脂であってもよく、受光素子としては、ホトトランジスタ、ホトダイオード、集積化受光素子であってもよい。
【００１４】
以上のように本実施の形態によれば、２次モールド時の２次モールド体のセンターと１次モールド体のセンターのずれを抑えることができ、また、光電子素子が２次モールド体に設けた開口部に対して基板の裏面側に取り付けられるので不要な光が遮光され、またこの基板をリードフレームとすることにより、安価にかつ容易に組立ができる。更に、光窓部と、基板の表面側に載置した光電子素子と、透光性樹脂外囲部の凹部を一直線上に配置したことにより、光伝達特性が良好で、かつ安定した封止ができる。
【００１５】
【発明の効果】
以上のように本発明によれば、２次モールド時の１次モールド体の位置決めを精度よく行え、光通路となる１次モールド体のセンターと２次モールド体のセンターがずれるのを防止できるので、発光素子と受光素子間の安定した光伝達特性、検出位置特性を有する透過型光結合装置を容易に製造できるという有利な効果が得られる。
【図面の簡単な説明】
【図１】 本発明の一実施の形態である透過型光結合装置の完成状態を示す図である。
【図２】 本発明の一実施の形態である透過型光結合装置の製造過程における状態を示しており、２次モールド装置内での位置決め状態を示す図である。
【図３】 本発明の一実施の形態である透過型光結合装置の最初の製造工程における発光素子とリードフレーム近傍の状態を示す斜視図である。
【図４】 本発明の一実施の形態である透過型光結合装置の１次モールド体をその背面から見た斜視図である。
【図５】 本発明の一実施の形態である透過型光結合装置の１次モールド体の凹部と２次モールド装置の位置決め用突起部との係合状態の説明図である。
【図６】 本発明の一実施の形態である透過型光結合装置の１次モールド体の他の例を示し、その背面から見た斜視図である。
【図７】 従来の透過型光結合装置の完成状態を示す断面図である。
【図８】 従来の透過型光結合装置の製造過程における状態を示しており、２次モールド装置内での位置決め状態を示す図である。
【図９】 従来の透過型光結合装置の他の例を示す断面図である。
【図１０】 従来の透過型光結合装置の製造過程において、２次モールド体内で１次モールド体が流された状態を示す正面図である。
【図１１】 従来の透過型光結合装置の製造過程において、２次モールド体内で１次モールド体が流された状態を示す正面図である。
【符号の説明】
１Ｌ，１Ｐ…１次モールド体、 ２Ｌ…発光素子、 ２Ｐ…受光素子、 ４…２次モールド体、 ５Ｌ，５Ｐ…リードフレーム、 ６，７，８Ｌ，８Ｐ…２次モールド金型、 ９Ｌ，９Ｐ…突起部、 11…透光性樹脂、 12Ｌ，12Ｐ…凹部、 13…テーパ部、 14…スプリング、 15Ｌ，15Ｐ…光窓部、 16Ｌ，16Ｐ…開口部。[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a transmission type optical coupling device for detecting the presence or absence of the object to be detected by non-contact, light emitting element and a light receiving element and the transmission optical coupling device and the sealed double sealed with light-shielding resin and the translucent resin It relates to the manufacturing method.
[0002]
[Prior art]
As an example of a conventional optoelectronic component, a transmissive optical coupling device and a manufacturing method thereof will be described with reference to the drawings. 7 is a cross-sectional view showing a completed state of a conventional transmission type optical coupling device, FIG. 7 (a) is a cross-sectional view seen from the front, and FIG. 7 (b) is a cross-sectional view seen from the top. FIG. 8 shows a state in the manufacturing process of the transmission type optical coupling device shown in FIG. 7, and shows a positioning state in the secondary molding device one step before the completion of the mold. In FIG. 7, 1L and 1P are primary mold bodies in which a pair of light emitting element 2L and light receiving element 2P are respectively housed, 3L and 3P are optical window portions, and 4 is a secondary mold body that seals the whole, and is light-shielding It is made of resin. By configuring in this way, in the secondary molding step one step before reaching the completed state, as shown in FIG. 8, the lead terminal portions 5L and 5P of the primary mold bodies 1L and 1P are made into the secondary mold. 6 are fixed at predetermined intervals, inserted into the other secondary mold dies 7, 8L, 8P to be paired, and the protrusions 9L, 9P are pressed against both primary mold bodies 1L, 1P. Is brought into contact with the convex portions 7a and 7b of the secondary mold 7 so that in the secondary molding step, the light-shielding secondary mold body 4 that seals the primary mold bodies 1L and 1P is formed into the optical window portion 3L, I try not to go into 3P.
[0003]
FIG. 9 is a cross-sectional view showing another example of a conventional optoelectronic component, FIG. 9 (a) is a cross-sectional view seen from the front, and FIG. 9 (b) is a cross-sectional view seen from the top. In the figure, the same parts as those shown in FIGS. 7 and 8 are denoted by the same reference numerals, and detailed description thereof is omitted. The optical window portions 1La and 1Pa in this example are formed by bringing the primary mold bodies 1L and 1P into contact with the secondary mold in the same secondary molding step as described above. The structure is exposed from the secondary mold body 4 having light shielding properties.
[0004]
[Problems to be solved by the invention]
However, in the case of such a conventional configuration, for example, the structure as shown in FIG. 7, a molding pressure (several hundred kg / cm 2 ) such as injection molding in the secondary molding process is applied to the primary mold bodies 1L and 1P. The primary mold bodies 1L and 1P may flow in the lateral direction. FIG. 10 is a front view showing a state in which the primary mold body is poured in the secondary mold body in the manufacturing process of the conventional transmission type optical coupling device, and shows the center (C 1 -C 1 ′) of the secondary mold body 4. ) And the center (C 2 -C 2 ′) of the primary mold bodies 1L and 1P are misaligned, and the light emitting element 2L and the light receiving element 2P placed at the centers of the primary mold bodies 1L and 1P are secondary mold bodies. There is a problem that the light window portions 3L and 3P formed at the center of FIG. 4 are displaced, and the same thing occurs in the case of the structure as shown in FIG. FIG. 11 is a front view showing a state in which the primary mold body is flowed in the secondary mold body, and the center (C 3 -C 3 ′) of the secondary mold body 4 and the light window portion formed in the primary mold body. As a result, the centers (C 4 -C 4 ′) of 3L and 3P are shifted as described above, and in any case, optical characteristics such as light transmission characteristics and detection position characteristics between the light emitting element and the light receiving element are deteriorated. There was a problem.
[0005]
SUMMARY OF THE INVENTION The present invention solves the above-mentioned conventional problems, and provides a transmission optical coupling device for a high-precision integral mold that can suppress the deviation between the center of the secondary mold body and the center of the primary mold body, and a method for manufacturing the same. The purpose is to provide.
[0006]
[Means for Solving the Problems]
Transmissive optical coupling device of the present invention, it seals the primary sealing a light emitting element and a light receiving element at each translucent resin, 2 Tsugifutome by the light shielding resin by a concave portion provided on the translucent resin outer circumferential portion and is intended an opening portion which reaches the recessed portion of the transparent resin outer circumferential portion in the light-shielding resin, a method of manufacturing a transmission type optical coupling device of the present invention, 1 in the secondary molding step The process includes positioning the next mold body.
[0007]
According to the present invention, it is possible to obtain a transmission optical coupling device of a high-precision integral mold that suppresses a shift between the center of the secondary mold body and the center of the primary mold body.
[0008]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, an embodiment of the present invention will be described with reference to the drawings. In addition, the same code | symbol is attached | subjected to the same part as the said conventional thing, and the detailed description is abbreviate | omitted.
[0009]
FIG. 1 is a view showing a completed state of a transmissive optical coupling device according to an embodiment of the present invention, FIG. 1 (a) is a perspective view thereof, FIG. 1 (b) is a sectional view as seen from the front, FIG. 1 (c) is a cross-sectional view seen from above. FIG. 2 shows a state in the manufacturing process of the transmission type optical coupling device shown in FIG. 1, and shows a positioning state in the secondary molding device in a process before completion of the mold. FIGS. 3 to 5 show the present invention . are views for explaining a manufacturing method of a transmission type optical coupling device according to an embodiment, FIG. 3 is a perspective view showing a first state of the light emitting element and the neighboring lead frame in the process, Figure 4 is first molded body FIG. 5 is an explanatory view of the engagement state between the concave portion of the primary mold body and the positioning projection of the secondary mold.
[0010]
First, as shown in FIG. 3, the light emitting element 2L is mounted on the substrate, in this case, one of the pair of lead frames 5L, and the electrode of the light emitting element 2L and the other lead frame 5L are connected by a thin metal wire 10. To do. Next, as shown in FIG. 4, primary molding is performed by translucent resin 11 so that a concave portion 12 </ b> L having a substantially circular cross section is provided on the back (the back side of the lead frame 5 </ b> L of FIG. 3 with respect to the light emitting element mounting portion). The primary mold body 1L on the element side is completed. The light receiving element side is also formed by a similar method. At this time, the concave portions 12L and 12P formed by the primary mold are provided with a tapered portion 13 as shown in FIG. The fitting with the portions 9L and 9P can be facilitated. When the primary mold bodies 1L and 1P are formed by the casting method, the concave shape in FIG. 4 cannot be formed due to the restriction of the punching die. Shape that can be restricted only in the lateral direction, for example, as shown in FIGS. 6A and 6B, a groove extending from the upper surface of the primary mold body toward the lower surface, or extending from the upper surface to the center of the back surface of the primary mold body. It becomes possible to mold by making a groove.
[0011]
Next, as shown in FIG. 2, the completed light-emitting element side primary mold body 1L and light-receiving element side primary mold body 1P are placed opposite to each other in the mold of the secondary mold 7 and light-shielding resin is used. The secondary mold 4 performs a secondary mold that integrates both, and at the time of the secondary molding, the movable projections 9L and 9P having a substantially circular cross section that are urged in the direction of the arrow by the spring 14 and the primary mold are used. The primary mold bodies 1L and 1P are positioned by fitting the recesses 12L and 12P on the mold body back surface of the mold bodies 1L and 1P. If positioning by such fitting is performed, it is not necessary to sandwich with a strong pressure as in the prior art, and even if secondary molding is performed by injection molding thereafter, the primary mold bodies 1L and 1P as in the past are eccentric. There is nothing. That is, the centers of the optical window portions 15L and 15P of the secondary mold body 4 and the centers of the primary mold bodies 1L and 1P do not deviate, and the openings 16L formed after the protrusions 9L and 9P are removed. 16P and the respective centers are aligned in a straight line, and a transmissive optical coupling device having stable light transmission characteristics and detection position characteristics between the light emitting element and the light receiving element is obtained.
[0012]
In addition, instead of the movable projections 9L and 9P urged by the spring 14, the projections 9L and 9P may be integrally formed with the slide molds 8L and 8P of the secondary mold 7, If the opening formed thereby is sealed after the completion of the secondary molding, the light shielding property is improved. The spring-biased movable projections 9L and 9P are provided for positioning the primary mold bodies 1L and 1P and pressing them against the secondary mold 7 for forming the light window portions 15L and 15P. In addition, when the primary mold bodies 1L and 1P are sandwiched between the secondary mold 7 and the protrusions 9L and 9P, the stress on the primary mold bodies 1L and 1P is relieved and reliability is improved. A high-precision integrated mold transmission type optical coupling device can be manufactured.
[0013]
Further, the secondary mold body may be a thermoplastic resin or a thermosetting resin, and the translucent resin forming the primary mold body blocks visible light when an infrared light emitting diode is used as a light emitting element. The light receiving element may be a phototransistor, a photodiode, or an integrated light receiving element .
[0014]
As described above, according to the present embodiment, the shift between the center of the secondary mold body and the center of the primary mold body during the secondary molding can be suppressed, and the optoelectronic element is provided in the secondary mold body. Since it is attached to the back side of the substrate with respect to the opening, unnecessary light is shielded, and by using this substrate as a lead frame, it can be assembled inexpensively and easily. Furthermore, an optical window, and the optoelectronic device placed on the surface side of the substrate, by which the concave portion of the translucent resin outer circumferential portion arranged on a straight line, the light transmission characteristics are good, and stable sealing Can do.
[0015]
【The invention's effect】
As described above, according to the present invention, it is possible to accurately position the primary mold body during the secondary molding and prevent the center of the primary mold body and the center of the secondary mold body serving as an optical path from being shifted. An advantageous effect is obtained that a transmission type optical coupling device having stable light transmission characteristics and detection position characteristics between the light emitting element and the light receiving element can be easily manufactured.
[Brief description of the drawings]
FIG. 1 is a diagram showing a completed state of a transmissive optical coupling device according to an embodiment of the present invention.
FIG. 2 is a diagram showing a state in a manufacturing process of a transmission type optical coupling device according to an embodiment of the present invention , and a diagram showing a positioning state in a secondary molding device.
FIG. 3 is a perspective view showing a state in the vicinity of a light emitting element and a lead frame in an initial manufacturing process of a transmissive optical coupling device according to an embodiment of the present invention.
FIG. 4 is a perspective view of a primary mold body of a transmissive optical coupling device according to an embodiment of the present invention as seen from the back side thereof.
FIG. 5 is an explanatory diagram of an engaged state between a concave portion of a primary mold body of a transmission type optical coupling device according to an embodiment of the present invention and a positioning projection of a secondary mold device.
FIG. 6 is a perspective view showing another example of the primary mold body of the transmissive optical coupling device according to the embodiment of the present invention , viewed from the back side thereof.
FIG. 7 is a cross-sectional view showing a completed state of a conventional transmissive optical coupling device.
FIG. 8 is a view showing a state in a manufacturing process of a conventional transmission type optical coupling device, and is a view showing a positioning state in a secondary molding device.
FIG. 9 is a cross-sectional view showing another example of a conventional transmissive optical coupling device.
FIG. 10 is a front view showing a state in which the primary mold body is poured in the secondary mold body in the manufacturing process of the conventional transmission type optical coupling device.
FIG. 11 is a front view showing a state in which the primary mold body is poured in the secondary mold body in the manufacturing process of the conventional transmission type optical coupling device.
[Explanation of symbols]
1L, 1P ... primary mold body, 2L ... light emitting element, 2P ... light receiving element, 4 ... secondary mold body, 5L, 5P ... lead frame, 6, 7, 8L, 8P ... secondary mold die, 9L, 9P ... Projection part, 11 ... Translucent resin, 12L, 12P ... Recess, 13 ... Tapered part, 14 ... Spring, 15L, 15P ... Light window part, 16L, 16P ... Opening part.

Claims (10)

発光素子と受光素子とをそれぞれ個別の基板に載置し、前記発光素子と前記受光素子とをそれぞれ透光性樹脂で封止した発光側１次モールド体と受光側１次モールド体とを対向配置し、前記発光素子と前記受光素子を光学的に結合する光窓部を設けるよう前記発光側１次モールド体と前記受光側１次モールド体の周囲をそれぞれ遮光性樹脂にて封止した構成の透過型光結合装置において、前記発光側１次モールド体の発光面と前記受光側１次モールド体の受光面に対する背面部にそれぞれ凹部を設け、かつ前記発光側１次モールド体と前記受光側１次モールド体の前記遮光性樹脂に前記透光性樹脂外囲部の凹部に達する開口部を設けたことを特徴とする透過型光結合装置。  The light emitting element and the light receiving element are respectively placed on separate substrates, and the light emitting side primary mold body and the light receiving side primary mold body in which the light emitting element and the light receiving element are respectively sealed with a translucent resin face each other. A structure in which the periphery of the light emitting side primary mold body and the light receiving side primary mold body is sealed with a light shielding resin so as to provide an optical window portion that optically couples the light emitting element and the light receiving element. In the transmissive optical coupling device, a light emitting surface of the light emitting side primary mold body and a back surface portion with respect to the light receiving surface of the light receiving side primary mold body are provided with recesses, respectively, and the light emitting side primary mold body and the light receiving side are provided. A transmission type optical coupling device, wherein an opening reaching the concave portion of the translucent resin surrounding portion is provided in the light shielding resin of the primary mold body. 前記発光素子と前記受光素子を、基板の表面側に載置された状態で前記透光性樹脂により封止したことを特徴とする請求項１記載の透過型光結合装置。  The transmissive optical coupling device according to claim 1, wherein the light emitting element and the light receiving element are sealed with the translucent resin in a state of being placed on the surface side of the substrate. 前記基板はリードフレームであることを特徴とする請求項２記載の透過型光結合装置。  3. The transmission type optical coupling device according to claim 2, wherein the substrate is a lead frame. 前記凹部を略円形状にしたことを特徴とする請求項１記載の透過型光結合装置。The transmissive optical coupling device according to claim 1, wherein the concave portion has a substantially circular shape . 前記凹部を前記発光側１次モールド体と前記受光側１次モールド体の前記透光性樹脂において上面から下面方向へ延びる溝にしたことを特徴とする請求項１記載の透過型光結合装置。2. The transmission type optical coupling device according to claim 1, wherein the concave portion is a groove extending from the upper surface to the lower surface in the light transmitting resin of the light emitting side primary mold body and the light receiving side primary mold body . 前記凹部にテーパ部を設けたことを特徴とする請求項１，２または３記載の透過型光結合装置。4. The transmission type optical coupling device according to claim 1 , wherein a tapered portion is provided in the concave portion. 前記光窓部と、前記発光素子と、前記受光素子と、前記凹部とを一直線上に配置したことを特徴とする請求項１記載の透過型光結合装置。 Said optical window, said light emitting element, said light receiving element, according to claim 1 Symbol placement of transmission type optical coupling device, characterized in that a said recess on a straight line. 発光素子と受光素子とをそれぞれ個別の基板に載置し、前記発光素子と前記受光素子とをそれぞれ透光性樹脂で１次封止した発光側１次モールド体と受光側１次モールド体を対向配置し、前記発光素子と前記受光素子を光学的に結合する光窓部を設けるよう前記発光側１次モールド体と前記受光側１次モールド体の周囲を遮光性樹脂にて２次封止する透過型光結合装置の製造方法であって、前記２次封止の工程に、前記発光側１次モールド体の発光面と前記受光側１次モールド体の受光面に対する背面部にそれぞれ設けた凹部に係合してこれを支持する支持部材により、各１次モールド体を位置決めする工程を含むことを特徴とする透過型光結合装置の製造方法。 A light emitting side primary mold body and a light receiving side primary mold body in which a light emitting element and a light receiving element are respectively mounted on separate substrates, and the light emitting element and the light receiving element are primarily sealed with a translucent resin, respectively. The light emitting side primary mold body and the light receiving side primary mold body are secondarily sealed with a light-shielding resin so as to face each other and to provide an optical window portion for optically coupling the light emitting element and the light receiving element. The transmission type optical coupling device manufacturing method according to claim 1, wherein the secondary sealing step is provided on a light emitting surface of the light emitting side primary mold body and a back surface portion with respect to a light receiving surface of the light receiving side primary mold body. A method of manufacturing a transmissive optical coupling device , comprising: a step of positioning each primary mold body by a support member that engages with and supports a recess . 前記発光側１次モールド体と前記受光側１次モールド体を位置決めする工程において、弾性体により１次モールド体方向に付勢された移動可能な位置決め用支持部材を用いることを特徴とする請求項８記載の透過型光結合装置の製造方法。 In the step of positioning the light receiving side first molded body and the light emitting side first molded body, according to claim which comprises using a biased movable positioning support member to first molded body direction by the elastic member 9. A method for producing a transmissive optical coupling device according to claim 8 . 前記光窓部と前記発光素子または前記受光素子と基板の位置決めは一直線上で行われることを特徴とする請求項９記載の透過型光結合装置の製造方法。Method of manufacturing a transmission type optical coupling device according to claim 9, wherein the positioning of the light emitting element or the light receiving element and the substrate and the light window is characterized by Rukoto place in a straight line.
JP14031297A 1997-05-29 1997-05-29 Transmission type optical coupling device and manufacturing method thereof Expired - Fee Related JP3793622B2 (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200470928Y1 (en) 2011-03-18 2014-01-22 아사히 가세이 일렉트로닉스 가부시끼가이샤 Photo coupler

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200470928Y1 (en) 2011-03-18 2014-01-22 아사히 가세이 일렉트로닉스 가부시끼가이샤 Photo coupler

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