JPH10334793A - Manufacture of back plate for plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enhance the yield of product, and easily manufacture a large screen with high dimensional precision by baking at least one of a barrier rib forming part consisting of a barrier rib precursor mixture and an electrode pattern, and a multicolor pattern including a phosphor and an organic material on a base in the state where they are formed in a prescribed arrangement. SOLUTION: A non-hardened barrier rib forming part 2a is formed on a base 1, the barrier rib forming part 2a is hardened to provide a barrier rib forming part 2b consisting of a barrier rib precursor mixture. An electrode pattern 5 is formed, and patterns 4a, 4b, 4c of a first color, a second color and a third color are formed. Baking is performed in this state to form a barrier rib 2c after baking, an electrode pattern 7, and phosphor patterns 6a, 6b, 6c of the first color, the second color and the third color. Thus, the number of processes is reduced, the positioning is facilitated, and the manufacture can be performed with good workability low energy, and excellent dimensional precision in a good yield.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a back plate for a plasma display panel.

[0002]

2. Description of the Related Art Conventionally, as one of flat panel displays, a plasma display panel (hereinafter, referred to as a PDP) capable of performing multicolor display by providing a phosphor which emits light by plasma discharge has been known. In the PDP, a flat front plate and a rear plate made of glass are arranged in parallel and opposed to each other, and both are held at a fixed interval by a fired barrier rib provided therebetween. , And discharges in a space surrounded by the back plate and the fired barrier ribs. In such a space, a phosphor for display is applied, and the phosphor is caused to emit light by ultraviolet rays generated from the sealing gas by discharge, so that the light can be visually recognized by an observer.

Conventionally, as a method of forming a barrier rib, a thick film printing method using a printing screen and a glass paste has been generally performed. (Japanese Patent Laid-Open Nos. 2-165539 and 2-1655)
No. 40, JP-A-7-192626, etc.) have also been proposed. In any of these methods, after forming the barrier rib material at a desired position in a predetermined shape in any method,
The final barrier rib is obtained by firing at about 00 ° C.

As a method of forming a phosphor pattern using a substrate on which barrier ribs are formed as described above, a slurry liquid or paste in which phosphors of each color are dispersed is applied by a printing method such as screen printing. (Japanese Unexamined Patent Publication Nos. 1-115027 and 1-1249)
No. 29, JP-A-1-124930, JP-A-2
Japanese Patent Application Laid-Open No. 6-273925 discloses a method for forming a phosphor pattern with high positional accuracy using a photosensitive element (photosensitive film) containing a phosphor. Gazettes) have been proposed.

In any case, the conventional back plate for PDP is
After forming an uncured barrier rib or a cured barrier rib on a flat plate, firing at 400 to 650 ° C., using a printing method such as screen printing, a photosensitive film containing a phosphor, and using a pattern mask. After forming a multicolor pattern by a method of arranging the multicolor patterns at desired positions, for example, the substrate is again heated from 400 ° C. to 650 ° C.
Baking at about ℃, and scattering and removing the organic binder etc.,
It was made by forming a phosphor pattern,
The substrate shrinks by heating when the uncured or cured barrier ribs are fired (several tens to hundreds of microns shrink on a substrate with a diagonal size of about 50 cm). The mask for body pattern screen printing and the pattern mask for light exposure do not match, making it difficult to align and making it extremely difficult to perform good patterning.

The problem is that the error increases as the display area of the PDP increases.
This was a very serious problem in producing P.

On the other hand, a pattern mask or a screen mask for a phosphor pattern is
There is a case where it is made slightly smaller than the molded size of the uncured barrier ribs or the cured barrier ribs to make it correspond, but the shrinkage width of the substrate at the time of firing is not necessarily constant,
Since the shrinkage width is partially different, the product yield is poor, and it is very difficult to produce a large-screen PDP with dimensional accuracy.

[0008]

SUMMARY OF THE INVENTION According to the first and second aspects of the present invention, there is provided a back plate for a plasma display panel having a reduced number of steps, easy alignment, good workability, low energy and excellent dimensional accuracy. Another object of the present invention is to provide a method of manufacturing a back plate for a plasma display panel which can be manufactured with a high yield. According to the third aspect of the present invention, in addition to the effects of the first aspect of the present invention, the number of steps is further reduced, and a back plate for a plasma display panel is manufactured which has better workability, lower energy and excellent dimensional accuracy. It is intended to provide a method of manufacturing a back plate for a plasma display panel which can be performed. According to the invention of claim 4, in addition to the effect of the invention of claim 1, 2 or 3, the strength of the barrier rib forming portion made of the precursor mixture of barrier ribs can be improved, and further, the shrinkage of the volume of the barrier rib can be controlled, and An object of the present invention is to provide a method for manufacturing a back plate for a plasma display panel, which has improved adhesion to a substrate. A fifth aspect of the present invention provides a method of manufacturing a back plate for a plasma display panel in which the adhesion between a barrier rib and a substrate is further improved in addition to the effects of the first, second, third, or fourth aspect of the present invention. It is.

According to a sixth aspect of the present invention, in addition to the effect of the second aspect of the invention, the strength of the barrier rib forming portion made of the barrier rib precursor mixture is improved, and the handleability in the step of forming a multicolor pattern is further improved. And a method for manufacturing a back plate for a plasma display panel, which is more excellent in workability. The invention described in claim 7 is the third invention.
In addition to the effects of the invention described, the strength of the barrier rib forming portion made of the barrier rib precursor mixture is further improved, and the handleability in the step of forming a pattern for electrodes and the step of forming a multicolor pattern is excellent, and the workability is improved. It is intended to provide a method of manufacturing a back plate for a plasma display panel having excellent performance. The invention according to claim 8 is the invention according to claim 6 or 7
In addition to the effects of the described invention, the curability of the barrier rib material is further excellent, the strength of the barrier rib forming portion composed of the barrier rib precursor mixture is improved, and the handleability in the step of forming a more multicolor pattern is excellent, An object of the present invention is to provide a method for manufacturing a back plate for a plasma display panel which is excellent in workability. According to the ninth aspect of the present invention, in addition to the effects of the eighth aspect of the present invention, there is provided a method for manufacturing a rear plate for a plasma display panel, which further reduces residual organic matter in a barrier rib after firing and has excellent emission intensity. is there.

[0010] The invention according to claim 10 is the first or second invention.
In addition to the effects of the invention described in 3, 4, or 5, the strength of the barrier rib forming portion made of the barrier rib precursor mixture is further improved, and the handling in the process of forming a multicolor pattern is excellent, and the workability is more excellent. And a method of manufacturing a back plate for a plasma display panel. According to the eleventh aspect of the present invention, in addition to the effect of the tenth aspect, the strength of the barrier rib forming portion made of the barrier rib precursor mixture is improved, and the handleability in the process of forming a multicolor pattern is excellent. Another object of the present invention is to provide a method of manufacturing a back plate for a plasma display panel which is more excellent in workability. A twelfth aspect of the present invention provides a method of manufacturing a back plate for a plasma display panel, in which, in addition to the effects of the eleventh aspect, residual organic substances in the fired barrier ribs are further reduced and light emission intensity is excellent. is there.

According to the thirteenth aspect of the present invention, in addition to the effects of the first aspect of the present invention, the number of steps is reduced, and workability is improved.
An object of the present invention is to provide a method of manufacturing a back plate for a plasma display panel, which can produce a back plate for a plasma display panel with low energy and excellent dimensional accuracy at a high yield. According to a fourteenth aspect of the present invention, in addition to the effect of the thirteenth aspect, there is provided a method of manufacturing a rear plate for a plasma display panel in which the strength of the barrier rib forming portion is further reduced, the number of steps is further reduced, and the yield is further improved. Is provided. The invention according to claim 15 provides a method of manufacturing a back plate for a plasma display panel, which is excellent in handleability when forming barrier ribs and more excellent in workability, in addition to the effect of the invention described in claim 14. Things.

[0012]

According to the present invention, a barrier rib forming portion made of a barrier rib precursor mixture in which an inorganic material is held by an organic material and at least one of an electrode pattern containing an electrode material and an organic material are provided on a substrate. The present invention relates to a method for manufacturing a back plate for a plasma display panel, which comprises firing a multicolor pattern including a phosphor and an organic material in a predetermined arrangement. Further, in the present invention, the state formed in a predetermined arrangement is a state in which a multicolor pattern is formed on the inner surface of the concave portion formed by the barrier rib forming portion formed of the barrier rib precursor mixture formed on the substrate and the substrate. The present invention relates to a method of manufacturing the back plate for a plasma display panel. Further, according to the present invention, the electrode pattern and the multicolor pattern are formed on the inner surface of the concave portion formed by the barrier rib forming portion made of the barrier rib precursor mixture formed on the substrate and the substrate when the substrate is formed in a predetermined arrangement. The present invention also relates to a method for manufacturing the back plate for a plasma display panel in a state as described above.

Further, according to the present invention, the barrier rib precursor mixture may contain an organic binder 1 to 100 parts by weight based on the inorganic material.
The present invention relates to a method for manufacturing the back plate for a plasma display panel, which includes 100 parts by weight. The present invention also relates to a method for manufacturing the back plate for a plasma display panel, wherein the organic material contained in the barrier rib precursor mixture includes a thermosetting resin, a resin obtained by thermosetting the thermosetting resin, or a thermoplastic resin.

Further, according to the present invention, the state formed in a predetermined arrangement is as follows: (Ia) a step of forming an uncured barrier rib forming portion on a substrate; (II) a step of curing the uncured barrier rib forming portion; The present invention also relates to a method for manufacturing the back plate for a plasma display panel obtained by the steps of forming a barrier rib forming portion made of a barrier rib precursor mixture and (IIIb) forming a multicolor pattern. Further, according to the present invention, the state formed in a predetermined arrangement is (Ia) on a substrate,
A step of forming an uncured barrier rib forming part, (II) a step of curing the uncured barrier rib forming part to form a barrier rib forming part made of a barrier rib precursor mixture, and (III)
The present invention relates to a method of manufacturing the back plate for a plasma display panel obtained by the steps of a) forming an electrode pattern and (IIIb) forming a multicolor pattern.

[0015] The present invention also relates to the method of manufacturing a back plate for a plasma display panel, wherein the uncured barrier rib forming portion contains an inorganic material and a resin component curable at a temperature of 50 to 300 ° C. In addition, the present invention, 50 ~
The present invention relates to a method for producing a back plate for a plasma display panel, wherein a resin component which cures at a temperature of 300 ° C. has an organic residue after firing of 0.5% by weight or less.

Further, according to the present invention, in a state formed in a predetermined arrangement, (Ib) (A) a barrier rib material containing an inorganic material and an organic material is heated and then cooled to hold the inorganic material with the organic material. The present invention relates to a method for manufacturing the back plate for a plasma display panel, wherein the back plate is a barrier rib forming portion made of a barrier rib precursor mixture. Further, the present invention relates to the method for producing the back plate for a plasma display panel, wherein the organic material contains a resin component having a Tg of 80 ° C. or higher. In the present invention, the resin component having a Tg of 80 ° C. or more contains 0.5% by weight of an organic residue after the completion of firing.
The present invention relates to a method of manufacturing the back plate for a plasma display panel described below.

According to the present invention, there is provided a substrate having a concave portion to be a discharge space, wherein the inner surface of the concave portion includes an electrode pattern including an electrode material and an organic material, and a phosphor and an organic material. The present invention relates to a method for manufacturing the back plate for a plasma display panel, wherein the multi-color pattern is fired in a state of being formed in a predetermined arrangement. Further, the present invention relates to a method for manufacturing the back plate for a plasma display panel, wherein a substrate having a concave portion to be a discharge space is integrated with the same material. Further, the present invention relates to a method for manufacturing the back plate for a plasma display panel, wherein the substrate having a concave portion to be a discharge space has a concave portion formed by glass etching a glass plate.

[0018]

BEST MODE FOR CARRYING OUT THE INVENTION A method of manufacturing a back plate for a plasma display panel (hereinafter referred to as PDP) according to the present invention comprises a step of forming a barrier rib forming portion comprising a barrier rib precursor mixture in which an inorganic material is held by an organic material. The method is characterized in that at least one of an electrode pattern containing an electrode material and an organic material and a multicolor pattern containing a phosphor and an organic material are fired in a state where they are formed in a predetermined arrangement.

The substrate in the present invention is not particularly limited as long as it has a surface having insulation properties or has been subjected to insulation treatment and has heat resistance or has been subjected to heat treatment. For example, glass (soda glass, high strain point glass, and the like), alumina, enamel, and the like are given, and these substrates may be subjected to surface treatment for adhesion. The thickness of these substrates is usually 0.5 to 10 mm. Further, as the substrate in the present invention, a substrate on which an electrode is formed in advance can be used, and the electrode can be formed by a method described later. Examples of the material of the electrode formed in advance on the substrate include Ag, Al, ITO (indium tin oxide), Cr—Cu—Cr, and the like. To form an electrode using these materials, for example, , Screen printing, sputtering, photolithography, and the like. The width of the electrode formed in a stripe shape is usually 50 to 15
0 μm, and the thickness is usually 1 to 20 μm.

The barrier rib forming portion made of the barrier rib precursor mixture in the present invention is formed by fixing an inorganic material with an organic material. A method for fixing the inorganic material with an organic material is described in (IIIa) below. In the step of forming (IIIb) or the step of forming a multi-color pattern, there is no particular limitation as long as the barrier rib forming portion made of the barrier rib precursor mixture can be maintained to the extent that it can withstand the strength without being broken. A method of mixing and kneading an inorganic material and a curable organic material, kneading them, forming them in a predetermined arrangement, then curing and fixing the organic material, mixing and kneading a barrier rib material containing an organic material and an inorganic material, After forming into an arrangement, a method of heating and then holding by cooling, a barrier rib material containing an organic material and an inorganic material The formulation, with heating and kneaded, after forming a predetermined arrangement, and a method of persist and the like by cooling. From the viewpoint of further improving the strength of the barrier rib forming portion made of the barrier rib precursor mixture, it is preferable to use a method of using a curable organic material and curing and fixing the organic material.

The inorganic material and the organic material used in the barrier rib forming portion comprising the barrier rib precursor mixture in the present invention (hereinafter, these inorganic material and organic material are collectively referred to as
Examples of the inorganic material in (A) a barrier rib material include (a) an inorganic pigment and (b) an inorganic binder. (A) Examples of the inorganic pigment include inorganic materials such as titanium oxide, alumina, magnesia, zinc oxide, iron oxide, chromium oxide, and copper oxide, and these are used alone or in combination of two or more. . (B) Examples of the inorganic binder include known glass frit materials such as low-melting glass, which are used as needed.

The organic material in the (A) barrier rib material used in the barrier rib forming part comprising the barrier rib precursor mixture in the present invention includes a thermosetting resin, a resin obtained by thermosetting the thermosetting resin, a thermoplastic resin, and the like ( A composition containing c) an organic binder and (d) an organic solvent having a boiling point of 150 ° C. or more can be used.

Examples of the organic binder (c) include thermoplastic resin compositions such as polymethyl methacrylate, polystyrene, polyethylene, and polyvinyl acetate;
(C ′) a resin component that cures at a temperature of 50 to 300 ° C.,
(C ″) Non-curable resin components having a Tg of 80 ° C. or higher, and among them, (c ′) a resin component that cures at a temperature of 50 to 300 ° C. are preferable. Examples of the resin component that cures at a temperature of 50 to 300 ° C. include (c1) an epoxy resin composition, (c2) a composition containing a thermopolymerizable unsaturated compound having an ethylenically unsaturated group, and (c3) a urethane resin composition. And (c4) an unsaturated polyester resin composition.

(C1) The epoxy resin composition is an epoxy resin (a compound having two or more epoxy groups in a molecule)
And a curing agent, a curing catalyst, a reactive diluent, a curing accelerator, and the like.

Examples of the epoxy resin include phenol ether type epoxy resins (bisphenol A type epoxy resin, bisphenol F type epoxy resin, halogenated bisphenol A type epoxy resin, phenol novolak type epoxy resin, cresol novolak type epoxy resin, halogenated Phenol novolak type epoxy resin, etc., ether type epoxy resin (polyol, polyether polyol, etc. and condensate of epichlorohydrin, diglycidyl ether, polyethylene glycol diglycidyl ether, polypropylene glycol diglycidyl ether, butanediol diglycidyl ether, Neopentyl glycol diglycidyl ether, trimethylolpropane triglycidyl ether, glycerin triglycidyl ether ), Ester epoxy resins (copolymers of glycidyl acrylate, glycidyl methacrylate, etc. and ethylenically unsaturated monomers (methyl methacrylate, ethyl acrylate, acrylonitrile, etc.)), glycidylamine epoxy resins (aniline, diaminodiphenylmethane) , Aminophenols, xylylenediamine, halogenated aniline, condensates of amines such as bisaminomethylcyclohexane and epichlorohydrin, etc.), aliphatic or alicyclic epoxy resins, and the like.
These are used alone or in combination of two or more. Of these, ether-based epoxy resins, ester-epoxy resins and the like are preferred, and ether-based epoxy resins are more preferred.

The curing agent is not particularly limited and a known curing agent can be used. Examples of the curing agent include amine-based curing agents, carboxylic acid-based curing agents, acid anhydride-based curing agents, and phenol-based curing agents. No.

Examples of the amine-based curing agent include aliphatic polyamines [alkylenediamine (ethylenediamine, tetramethylenediamine, hexamethylenediamine, etc.), polyalkylene (alkylene having 2 to 6 carbon atoms) polyamine (diethylenetriamine, triethylenetetramine). Pentaethylenehexamine, iminobispropylamine, bis (hexamethylene) triamine, etc.), alkyl or hydroxyalkylamine compounds (alkyl (C1-3) aminopropylamine, aminoethylethanolamine, methyliminobispropylamine, etc.) , Aromatic-containing aliphatic amines (xylylenediamine, tetrachloroparaxylylenediamine, etc.) and the like; alicyclic or heterocyclic-containing aliphatic amines (N-aminoethylpiperazine, 1,3-diamino Cyclohexane, isophoronediamine, hydrogenated methylenedianiline, 3,9-bis (3
-Aminopropyl) -2,4,8,10-tetraoxaspiro [5,5] untecan, etc., aromatic polyamines (metaphenylenediamine, paraphenylenediamine,
Toluenediamine, diaminodiphenylmethane, diaminodiethyldiphenylmethane, diaminodiphenylsulfone, benzidine, 4,4'-bis (o-toluidine), thiodianiline, dianisidine, methylenebis (o-chloroaniline), bis (3,4-diaminophenyl) sulfone , Diaminoditolyl sulfone, 2,6-
Diaminopyridine, 4-chloro-o-phenylenediamine, 4-methoxy-6-methyl-m-phenylenediamine, m-aminobenzylamine, 4,4'-diamino-3,3'-dimethyldiphenylmethane, etc., polyamide polyamine ( Condensates of the above polyamines and dimer acid), benzoguanamine or alkylguanamine or a modified product thereof, dicyandiamide, and the like.

Examples of the carboxylic acid-based curing agent and acid anhydride-based curing agent include succinic acid, maleic acid, itaconic acid, azelaic acid, sebacic acid, phthalic acid, tetrahydrophthalic acid, hexahydrophthalic acid, and nadic acid. Methyl nadic acid, dodecenyl succinic acid, pyromellitic acid,
Trimellitic acid, cyclopentadienetetracarboxylic acid, anhydrides thereof, and the like.

Examples of the phenolic curing agent include catechol, catechol derivatives, resorcinol, resorcinol derivatives, hydroquinone, hydroquinone derivatives,
Pyroganol, pyroganol derivatives, tetrahydroxybenzenes, tetrahydroxybenzene derivatives, 2,
2'-methylidenebisphenol, 3,3'-methylidenebisphenol, 4,4'-methylidenebisphenol, 2,2'-methylidenebis (4-methylphenol), 2,2'-methylidenebis (5-methylphenol) , 2,2'-methylidenebis (6-methylphenol), 4,4'-methylidenebis (2-methylphenol), 4,4'methylidenebis (3-methylphenol), 2,2'-methylidenebis (4,6-methylphenol) Dimethylphenol), 2,2'-methylidenebis (3,5-dimethylphenol), 4,4'-methylidenebis (2,6
-Dimethylphenol), 3,3'-methylidenebis (2,4,6-trimethylphenol), 2,2'-methylidenebis (4-propylphenol), 4,4'-
Methylidenebis (2-propylphenol), 4,4 '
-Methylidenebis (2-methyl-6-ethylphenol), 2,2'-methylidenebis (3,4,5,6-tetramethylphenol), 4,4'-methylidenebis (2,3,5,6-tetramethyl Phenol), 2,
2'-methylidenebis (4-tert-butylphenol), 4,4'-methylidenebis (2-methyl-5-isopropylphenol), 4,4'-methylidenebis (3-methyl-6-isopropylphenol), 4,
4'-methylidenebis (5-methyl-6-isopropylphenol), 2,2'-methylidenebis (4-tert-
Butyl-6-methylphenol), 2,2'-methylidenebis (6-tert-butyl-4-methylphenol),
4,4'-methylidenebis (2-tert-butyl-6-methylphenol), 4,4'-methylidenebis (2-te
rt-butyl-5-methylphenol), 2,2'-methylidenebis (3.4-dimethyl-6-isopropylphenol), 2,2'-methylidenebis (6-tert-butyl-4-methylphenol), 2, 2'-methylidenebis (4- (1,1,3,3-tetramethylbutyl) phenol), 2,2'-methylidenebis (4,6-di-te
rt-butylphenol), 4,4'-methylidenebis (2,6-di-tert-butylphenol), 4,4'-
Methylidenebis (3,5-di-tert-butylphenol), 2,2'-methylidenebis (4-chlorophenol), 4,4'-methylidenebis (2-chlorophenol), 2,2'-methylidenebis (4-bromophenol ), 2,2'-methylidenebis (4,6-dichlorophenol), 2,2'-methylidenebis (4,5-dichlorophenol), 3,3'-methylidenebis (4,6
-Dichlorophenol), 4,4'-methylidenebis (2,5-dichlorophenol), 4,4'-methylidenebis (2,6-dichlorophenol), 2,2'-methylidenebis (4,6-dibromophenol), 4,
4'-methylidenebis (2,6-dibromophenol), 2,2'-methylidenebis (3,4,5-trichlorophenol), 2,2'-methyldenbis (3
4,6-trichlorophenol), 3,3'-methylidenebis (2,4,6-trichlorophenol), 2,
2'-methylidenebis (6-bromo-4-chlorophenol), 2,2'-methylidenebis (4-chloro-6-
Nitrophenol), 2,2'-methylidenebis (6-
Chloro-4-nitrophenol), 2,2'-methylidenebis (4-nitrophenol), 4,4'-methylidenebis (2-nitrophenol), 2,2'-methylidenebis (4,6-dinitrophenol), 3 , 3'-methylidenebis (6-methoxyphenol), 4,4'-
Methylidenebis (2-methoxyphenol), 2,2 '
-Methylidenebis (4-chloro-6-methylphenol), 2,2'-methylidenebis (6-chloro-4-methylphenol), 4,4'-methylidenebis (2-chloro-5-methylphenol), 4,4 '-Methylidenebis (2-chloro-6-methylphenol), 2,2'
-Methylidenebis (6-bromo-4-methylphenol), 4,4'-methylidenebis (6-bromo-2-methylphenol), 2,2'-methylidenebis (4-chloro-3,5-dimethylphenol), 2 2,2'-methylidenebis (3-chloro-4,6-dimethylphenol), 2,2'-methylidenebis (6-bromo-4,5
-Dimethylphenol), 4,4'-methylidenebis (2-chloro-3,5,6-trimethylphenol),
2,2'-methylidenebis (4-chloro-6-isopropylphenol), 2,2'-methylidenebis (6-chloro-4-tert-butylphenol), 2,2'-methylidenebis (4-chloro-3-methyl- 6-isopropylphenol), 2,2'-methylidenebis (4-chloro-6-tert-butyl-3-methylphenol), 2,
2'-methylidenebis (4,6-dichloro-3-methylphenol), 2,2'-methylidenebis (6-nitro-4-tert-butylphenol), 4,4'-isopropylidenebisphenol, 2,2'-isopropyl Redidenbis (5-methylphenol), 4,4'-isopropylidenebis (2-methylphenol), 4,4'-isopropylidenebis (2-cyclohexylphenol),
4,4'-isopropylidenebis (2,6-dibromophenol), 4,4'-isopropylidenebis (2-nitrophenol), 4,4'-isopropylidenebis (2,6-dinitrophenol), 4 , 4'-butylidenebisphenol, 2,2'-butylidenebis (6-te
rt-butyl-4-methylphenol), 4,4'-butylidenebis (6-tert-butyl-2-methylphenol), 4,4'-sec-butylidenebisphenol,
4,4'-sec-butylidenebis (3-methylphenol), 2,2'-sec-butylidenebis (3-methyl-
6-isopropylphenol), 2,2'-sec-butylidenebis (6-tert-butyl-4-methylphenol), 4,4'-isobutylidenebisphenol, 4,
4'-isobutylidenebis (6-tert-butyl-4-methylphenol), 4,4 '-(1,3-cyclohexanediyl) bisphenol, 4,4'-cyclohexylidenebisphenol, 4,4'- Cyclohexylidenebis (2-chlorophenol), 4,4'-cyclohexylidenebis (2,6-dichlorophenol), 2,2 '
-Thiobisphenol, 4,4'-thiobisphenol, 4,4'-thiobis (2-methylphenol),
2,2'-thiobis (4,5-dimethylphenol),
2,2'-thiobis (4,6-dimethylphenol),
4,4'-thiobis (2,6-dimethylphenol),
2,2'-thiobis (6-tert-butyl-4-methylphenol), 4,4'-thiobis (2-tert-butyl-
5-methylphenol), 2,2'-thiobis (4-fluorophenol), 2,2'-thiobis (4-chlorophenol), 4,4'-thiobis (3-chlorophenol), 2,2'- Thiobis (4-chloro-5-methylphenol), 2,2'-thiobis (4,6-dichlorophenol), 4,4'-thiobis (2-bromophenol), 2,2'-thiobis (5-nitrophenol Phenol), 4,4'-sulfinylbisphenol, 4,
4'-sulfinylbis (2-methylphenol),
4,4'-sulfinylbis (2-tert-butyl-5-
Methylphenol), 4,4'-sulfinylbis (2
-Chlorophenol), 4,4'-sulfinylbis (4-chlorophenol), 2,2'-sulfinylbis (4,6-dichlorophenol), 4,4'-sulfinylbis (2bromophenol), 2, 2'-sulfonylbisphenol, 4,4'-sulfonylbisphenol, 4,4'-sulfonylbis (2-methylphenol), 4,4'-sulfonylbis (2,5-dimethylphenol), 4,4'-sulfonyl Bis (2-tert-butyl-5-methylphenol), 4,4'-sulfonylbis (2-chlorophenol), 4,4'-sulfonylbis (3-chlorophenol), 4,4'-sulfonylbis ( 2-bromophenol), 4,4'-sulfonylbis (2-nitrophenol), 2,3'-oxybisphenol, 2,2 ' -Ethanediyldimercaptobisphenol, 4,4'-methylidenebiscatechol,
4,4'-methylidenebisresorcinol, 4,4'-ethylidenebisresorcinol, 2,2'-propanediylbisresorcinol, 2,2'-butanediylbisresorcinol,
2,2'-pentanediylbisresorcin, 4,4'-
Methylidenebis (6-chlororesorcin), 2,2'-
Methylidenebis (4-chloro-6-nitroresorcinol), 4,4'-sulfinbisresorcinol, 2,2 '
Bisphenols such as ethanediylbishydroquinone and 4,4'-sulfonylbishydroquinone; novolak-type phenolic resins; resol-type phenolic resins; and novolak-type 4-methylphenolic resins. Among these, preferred are aliphatic polyamines, alicyclic or heterocyclic aliphatic amines, aromatic polyamines, polyamide polyamines, and phenolic curing agents.

The mixing ratio of these curing agents is such that the total amount of epoxy groups of the epoxy resin and the reactive diluent and the total amount of functional groups of the curing agent are obtained by dividing the total amount of the functional groups of the curing agent by the total amount of the epoxy groups (equivalent ratio). It is preferable that the ratio is 0.5 / 1.5 to 1.5 / 0.5.
It is more preferable that the ratio be 1.2 / 0.8, and it is particularly preferable that the ratio be 0.95 / 1.05 to 1.05 / 0.95. This ratio is
If the ratio is less than 0.5 / 1.5 or more than 1.5 / 0.5, the uncured barrier rib forming portion described later is cured to form a barrier rib forming portion made of a barrier rib precursor mixture. In the process, the curing is not promoted, and the shape of the barrier rib forming portion made of the barrier rib precursor mixture tends to collapse.

The curing catalyst is not particularly limited, and is preferably a compound which has a potential from room temperature to about 50 ° C. and accelerates the curing reaction by heating at a higher temperature.
Examples thereof include imidazole, hydrazide, boron trifluoride-amine complexes, sulfonium salts, amine imides, salts of polyamines, dicyandiamide, amine adducts, and modified products thereof. These are used alone or in combination of two or more. When the curing catalyst is used, the amount is based on 100 parts by weight of the epoxy resin.
0.1 to 20 parts by weight, preferably 0.5 to 1 part by weight.
More preferably, it is 0 parts by weight.

Examples of the reactive diluent include monofunctional epoxy compounds (styrene oxide, cresyl glycidyl ether, phenyl glycidyl ether, 2-ethylhexyl glycidyl ether, etc.), epoxy compounds containing a carbon-carbon double bond (glycidyl methacrylate, Glycidyl acrylate, allyl glycidyl ether, vinyl glycidyl ether, epoxidized polybutadiene, p-
(Glycidyloxymethyl) styrene, p- (glycidyloxymethyl) -α-methylstyrene, m- (glycidyloxymethyl) styrene, m- (glycidyloxymethyl) -α-methylstyrene, p- (glycidyloxy) styrene, p- (glycidyloxy) -α-methylstyrene, vinylcyclohexene monoepoxide, etc.)
And the like. These are used alone or in combination of two or more. Of these, a carbon-carbon double bond-containing epoxy compound is preferred.

When the reactive diluent is used, the compounding amount is
The amount is preferably 0 to 100 parts by weight, more preferably 0 to 50 parts by weight, based on 100 parts by weight of the epoxy resin. If the compounding amount exceeds 100 parts by weight, the curing speed of the epoxy resin tends to be slow and the curability tends to be inferior. In the step of forming the portion, the curing is not promoted, and the shape of the barrier rib forming portion made of the barrier rib precursor mixture tends to collapse.

Examples of the curing accelerator include amine catalysts (pyridine, quinoline, imidazole, 2-methylimidazole, 2-phenylimidazole, 2-undecylimidazole, 2-heptadecylimidazole, 1-methylimidazole, 2-ethyl -4-methylimidazole, N, N-dimethylcyclohexylamine, triethylamine, N-methylmorpholine, N-ethylmorpholine, triethylenediamine, N, N-dimethylbenzylamine, tris (N, N-dimethylaminomethyl) phenol, etc.) , 1,8-diazabicyclo [5,4,0] undecene-7, a quaternary ammonium compound (tetraalkylammonium fluoride (where alkyl is an alkyl group having 1 to 8 carbon atoms. The same applies hereinafter) ), Tetraalkylammo Um chloride, tetraalkylammonium bromide, tetraalkylammonium iodide, tetraalkylammonium acetate, tetraalkylammonium hexafluorophosphate, tetraalkylammonium hydrosulfate, tetraalkylammonium hydroxide, tetraalkylammonium perchlorate, tetraalkylammonium sulfate, tetraalkyl Ammonium tetrafluoroborate, tetraalkylammonium p-toluenesulfonate, tetraalkylammonium hydrocarbonate, tetraalkylammonium carbonate, trimethylbenzylammonium chloride, tributylbenzylammonium chloride, etc.), basic alkali metal compounds (sodium methoxide) De, caustic potash, caustic soda, or potassium 2-ethylhexanoate), metal halides _{(SnCl 4, FeCl 3, AlCl} 3, Sb
Cl ₅ , BF ₃ , ZnCl ₂ , ZnBr ₂ , LiCl, etc.),
Organometallic compounds (triethylaluminum, aluminum isopropoxide, tetraisopropyl titanate,
Diethyl zinc, zinc acetate, acetylacetonate, etc.),
Phosphoric acid compounds (trialkylphosphine, trialkylphosphine oxide, triphenylphosphine derivative,
Quaternary phosphonium salts, etc.), boron compounds (trialkyl borates, triaryl borates, tricycloalkyl borates, etc.), sulfur compounds (benzylsulfonium salts,
Alkylsulfonium salt) and the like. These are used alone or in combination of two or more.

When a curing accelerator is used, the amount is preferably 20 parts by weight or less, more preferably 0.1 to 10 parts by weight, based on 100 parts by weight of the epoxy resin.

(C2) Examples of the composition containing a thermopolymerizable unsaturated compound having an ethylenically unsaturated group include, for example, a composition containing a compound having two or more double bonds in a molecule as an essential component. And the like, and if necessary, the composition has a compound having one double bond in the molecule, an unsaturated bond and another polymerized or reactive group such as an epoxy group or an isocyanate group. Compounds, thermal initiators that generate free radicals upon heating, and the like can also be included.

In the compound having two or more double bonds in the molecule, examples of the compound having two double bonds include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, diethylene glycol dimethacrylate,
Triethylene glycol diacrylate, triethylene glycol dimethacrylate, tetraethylene glycol diacrylate, tetraethylene glycol dimethacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, hexapropylene glycol diacrylate, hexapropylene glycol dimethacrylate, polypropylene glycol diacrylate , Polypropylene glycol dimethacrylate, butylene glycol diacrylate, butylene glycol dimethacrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate, 1,3-butanediol diacrylate, 1,3-
Butanediol dimethacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, 1,5-pentanediol diacrylate,
1,5-pentanediol dimethacrylate, 1,6-
Hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol diacrylate, pentaerythritol dimethacrylate, trimethylolpropane diacrylate, trimethylolpropane dimethacrylate, bisphenol A diacrylate, bisphenol A dimethacrylate, 2,2-
Bis (4-acryloxyethoxyphenyl) propane,
2,2-bis (4-methacryloxyethoxyphenyl)
Propane, 2,2-bis (4-acryloxydiethoxyphenyl) propane, 2,2-bis (4-methacryloxydiethoxyphenyl) propane, 2,2-bis (4-
(Acryloxypolyethoxyphenyl) propane 2,2-
Examples include bis (4-methacryloxypolyethoxyphenyl) propane, bisphenol A diglycidyl ether diacrylate, bisphenol A diglycidyl ether dimethacrylate, m-divinylbenzene, p-divinylbenzene, and urethane diacrylate compounds.

In the compound having two or more double bonds in the molecule, examples of the monomer having three double bonds include trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, Pentaerythritol trimethacrylate, ethylene oxide-modified trimethylolpropane triacrylate, ethylene oxide-modified trimethylolpropane trimethacrylate, trimethylolpropane triglycidyl ether triacrylate,
Trimethylolpropane triglycidyl ether trimethacrylate, trivinylbenzene and the like. In the compound having two or more double bonds in the molecule, examples of the monomer having four double bonds include tetramethylolpropane tetraacrylate, tetramethylolpropane tetramethacrylate, pentaerythritol tetraacrylate, and pentaerythritol tetraacrylate. Methacrylate and the like.

In the compound having two or more double bonds in the molecule, examples of the monomer having five double bonds include dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate and the like. In a compound having two or more double bonds in a molecule, examples of a monomer having six double bonds include, for example,
Dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate and the like can be mentioned.
Compounds having two or more double bonds in these molecules are
Used alone or in combination of two or more.

The compound having one double bond in the molecule includes, for example, ester monomers of acrylic acid or methacrylic acid (methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-acrylic acid).
Propyl, n-propyl methacrylate, iso acrylate
-Propyl, iso-propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, iso acrylate
-Butyl, iso-butyl methacrylate, sec-acrylic acid-
Butyl, sec-butyl methacrylate, tert-acrylate
Butyl, tert-butyl methacrylate, pentyl acrylate, pentyl methacrylate, hexyl acrylate, hexyl methacrylate, heptyl acrylate, heptyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, octyl acrylate, methacrylic acid Octyl, nonyl acrylate, nonyl methacrylate, decyl acrylate, decyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate, octadecyl acrylate, octadecyl methacrylate, Eicosyl acrylate, eicosyl methacrylate, docosyl acrylate,
Docosyl methacrylate, cyclopentyl acrylate, cyclopentyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, cycloheptyl acrylate, cycloheptyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, phenyl methacrylate , Methoxyethyl methacrylate, dimethylaminoethyl acrylate, dimethylaminoethyl methacrylate, dimethylaminopropyl acrylate, dimethylaminopropyl methacrylate, 2-chloroethyl acrylate, 2-chloroethyl methacrylate, 2-fluoroethyl acrylate, methacryl 2-fluoroethyl acrylate, 2-cyanoethyl acrylate, 2-cyanoethyl methacrylate, methoxydiethylene acrylate Coal, methoxydiethylene glycol methacrylate, methoxydipropylene glycol acrylate, methoxydipropylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate, etc., styrene monomers (styrene, α-methylstyrene, p- t
-Butylstyrene, etc.), polyolefin monomers (butadiene, isoprene, chloroprene, etc.), vinyl monomers (vinyl chloride, vinyl acetate, etc.), nitrile monomers (acrylonitrile, methacrylonitrile, etc.), 1-
(Methacryloyloxyethoxycarbonyl) -2-
(3'-chloro-2'-hydroxypropoxycarbonyl) benzene and the like. These can be used alone or 2
Used in combination of more than one type.

When a compound having one double bond in the molecule is used, the compounding amount is from 0 to 50 parts by weight based on 100 parts by weight of the compound having two or more double bonds in the molecule. And more preferably 0 to 30 parts by weight. When the compounding amount exceeds 50 parts by weight, in the step (II) of curing the uncured barrier rib forming portion described later to form the barrier rib forming portion composed of the barrier rib precursor mixture, the curing is not promoted and the barrier rib precursor mixture is not cured. The strength of the barrier rib forming portion tends to decrease.

Examples of the compound having an unsaturated bond and another polymerized or reactive group such as an epoxy group or an isocyanate group include, for example, glycidyl methacrylate, glycidyl acrylate, allyl glycidyl ether, vinyl glycidyl ether, epoxidized polybutadiene, p- (glycidyl) (Oxymethyl) styrene, p- (glycidyloxymethyl) -α-methylstyrene, m- (glycidyloxymethyl) styrene, m- (glycidyloxymethyl) -α
-Methylstyrene, p- (glycidyloxy) styrene, p- (glycidyloxy) -α-methylstyrene,
Vinyl cyclohexene monoepoxide, 2-isocyanate ethyl methacrylate, 2-isocyanate ethyl acrylate, and the like are included. When this compound is used, in order to further increase the strength of the barrier ribs, these compounds are provided with a curing agent, a curing catalyst, and the like, which can be used for the epoxy resin described above, such as an unsaturated bond and an epoxy group or an isocyanate group. It is preferable to add 0.5 to 20 parts by weight to 100 parts by weight of the compound having another polymerization or reactive group.

When a compound having an unsaturated bond and another polymerized or reactive group such as an epoxy group or an isocyanate group is used, the compounding amount is 100 parts by weight of a compound having two or more double bonds in the molecule. Is preferably 0 to 80 parts by weight, more preferably 0 to 50 parts by weight.

Examples of the thermal initiator that generates free radicals upon heating include acetyl peroxide, cumyl peroxide,
Tert-butyl peroxide, propionyl peroxide, benzoyl peroxide, 2-chlorobenzoyl peroxide, 3-chlorobenzoyl peroxide, 4-chlorobenzoyl peroxide, 2,4-dichlorobenzoyl peroxide, 4-bromomethyl peroxide Benzoyl, lauroyl peroxide, potassium persulfate, diisopropyl peroxycarbonate, tetralin hydroperoxide, 1-phenyl-2-methylpropyl-1-hydroperoxide, tert-butyl pertriphenylacetate, te
rt-butyl hydroperoxide, tert-butyl formate,
Peroxides such as tert-butyl peracetate, tert-butyl perbenzoate, tert-butyl perphenylacetate, tert-butyl per-4-methoxyacetate, and tert-butyl per-N- (3-toluyl) carbamate; 2'-azobispropane, 2,2 '
-Dichloro-2,2'-azobispropane, 1,1'-
Azo (methylethyl) diacetate, 2,2'-azobis (2-amidinopropane) hydrochloride, 2,2'-azobis (2-amidinopropane) nitrate, 2,2'-azobisisobutane, 2,2 ' -Azobisisobutylamide,
2,2'-azobisisobutyronitrile, methyl 2,2'-azobis-2-methylpropionate, 2,2'-dichloro-2,2'-azobisbutane, 2,2'-azobis-2-methyl Butyronitrile, dimethyl 2,2'-azobisisobutyrate, 1,1'-azobis (sodium 1-methylbutyronitrile-3-sulfonate), 2- (4-
Methylphenylazo) -2-methylmalonodinitrile,
4,4'-azobis-4-cyanovaleric acid, 3,5-dihydroxymethylphenylazo-2-methylmalonodinitrile, 2- (4-bromophenylazo) -2-allylmalonodinitrile, 2,2 ' -Azobis-2-methylvaleronitrile, dimethyl 4,4'-azobis-4-cyanovalerate, 2,2'-azobis-2,4-dimethylvaleronitrile, 1,1'-azobiscyclohexanenitrile, 2, 2'-azobis-2-propylbutyronitrile, 1,1'-azobis-1-chlorophenylethane,
1,1'-azobis-1-cyclohexanecarbonitrile, 1,1'-azobis-1-cycloheptanenitrile, 1,1'-azobis-1-phenylethane,
Ethyl 1'-azobiscumene-4-nitrophenylazobenzylcyanoacetate, phenylazodiphenylmethane,
Phenylazotriphenylmethane, 4-nitrophenylazotriphenylmethane, 1,1'-azobis-1,2
Diphenylethane, poly (bisphenol A-4,
Azo compounds such as 4'-azobis-4-cyanopentanoate), poly (tetraethylene glycol-2,2'-azobisisobutyrate), 1,4-bis (pentamethylene) -2-tetrazene, 1,4-dimethoxycarbonyl-1,4-diphenyl-2-tetrazen, benzenesulfonyl azide and the like can be mentioned. These are used alone or in combination of two or more.

When using a thermal initiator which generates free radicals by heating, the amount of the thermal initiator is from 0 to 20 with respect to 100 parts by weight of the compound having two or more double bonds in the molecule.
It is preferable that the amount be 0.1 parts by weight, more preferably 0.1 to 10 parts by weight.

(C3) Examples of the urethane resin composition include a composition in which a polyfunctional isocyanate compound having two or more isocyanate groups in a molecule and a polyhydric alcohol are blended. Examples of the polyfunctional isocyanate compounds having two or more isocyanate groups in the molecule include aliphatic diisocyanates, diisocyanates containing an aromatic ring, and polyfunctional isocyanate compounds having three or more isocyanate groups in the molecule. Can be

Examples of the aliphatic diisocyanate include methylene diisocyanate, ethylene diisocyanate, trimethylene diisocyanate, tetramethylene diisocyanate, hexamethylene diisocyanate, and the like.
Isophorone diisocyanate, dicyclohexylmethane diisocyanate, 1,2-dimethylcyclohexane-ω, ω'-diisocyanate, dimer acid diisocyanate, 2,5-isocyanatomethyltetrahydrofuran, carbonyl diisocyanate, ethylene glycol diethyl ether-1,1'-diisocyanate, lysine And diisocyanates.

Examples of the diisocyanate containing an aromatic ring include 1,3-diphenylpropane 1,3-diisocyanate and 1,4-dimethylnaphthalene-ω, ω ′
-Diisocyanate, 4,4'-n-propylbiphenyl-ω, ω'-diisocyanate, bis (2-isocyanatoethyl) terephthalate, bis (2-isocyanatoethyl) isophthalate, 1,3-phenylene diisocyanate, 1,4- Phenylene diisocyanate,
1-methyl-2,4-phenylene diisocyanate, 1
-Methyl-2,6-phenylene diisocyanate, 1-
Methyl-2,5-phenylene diisocyanate, 1-methyl-3,5-phenylene diisocyanate, 1-ethyl-2,4-phenylene diisocyanate, 1,3,5
-Triethylbenzene-2,4-diisocyanate, diphenylmethane-4,4'-diisocyanate (MD
I), diphenylmethane-2,2'-diisocyanate, diphenylmethane-2,4'-diisocyanate,
3,3'-dimethyldiphenylmethane-4,4'-diisocyanate, diphenylether-2,4'-diisocyanate, diphenylether-4,4'-diisocyanate, ethylene glycol diphenylether
4,4'-diisocyanate, diphenyl sulfide-
4,4'-diisocyanate, diphenyl sulfide-
2,4'-diisocyanate, diphenylsulfone-
4,4'-diisocyanate, diphenylsulfone-
3,3'-diisocyanate and the like.

The polyfunctional isocyanate compound having three or more isocyanate groups in the molecule includes, for example, 1
-Methylbenzol-2,4,6-triisocyanate, 1,3,5-trimethylbenzol-2,4,6-
Triisocyanate, biphenyl-2,4,4'-triisocyanate, diphenylmethane-2,4,4'-triisocyanate, methyldiphenylmethane-4,6
Examples include 4'-triisocyanate, 4,4'-dimethyldiphenylmethane-2,2 ', 5,5'-tetraisocyanate, triphenylmethane-4,4', 4 "-triisocyanate, and polymeric MDI.

The polyfunctional isocyanate compounds having two or more isocyanate groups in the molecule include aliphatic diisocyanate dimers, aliphatic diisocyanate trimers, aromatic ring-containing diisocyanates, and aromatic ring-containing diisocyanates. Can also be used. Further, dimers of the above-mentioned aliphatic diisocyanates, diisocyanates containing aromatic rings, polyfunctional isocyanate compounds having three or more isocyanate groups in the molecule, and polyfunctional isocyanate compounds having two or more isocyanate groups in the molecule And isothiocyanate compounds corresponding to trimers can also be used.

From the polyfunctional isocyanate compounds having two or more isocyanate groups in these molecules,
Aliphatic diisocyanates, compounds having three or more isocyanate groups in the molecule, and the like are preferred. The above-mentioned polyfunctional isocyanate compounds having two or more isocyanate groups in the molecule are used alone or in combination of two or more.
In addition, when the reactivity of the isocyanate compound is high and the stability of the urethane resin composition is low when mixed with alcohols, if necessary, a mask obtained by masking the isocyanate compound with phenol or the like can be used. .

Examples of the polyhydric alcohol include dihydric alcohols (ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol,
1,3-butanediol, 1,6-hexanediol,
Neopentyl glycol, 1,4-cyclohexanediol, hydrogenated bisphenol A, etc.), trihydric alcohols (glycerin, trimethylolethane, trimethylolpropane, etc.), tetrahydric alcohols (pentaerythritol, etc.), and the like. Or a combination of two or more.

(C3) The mixing ratio of the polyfunctional isocyanate compound having two or more isocyanate groups in the molecule and the polyhydric alcohol in the urethane resin composition is such that the total amount of isocyanate groups / the total amount of hydroxyl groups (equivalent ratio) is 0.5
/1.5-1.5/0.5 is preferable, and more preferably 0.8 / 1.2-1.2 / 0.8. Preferably, 0.95
It is particularly preferable to mix them in a ratio of /1.05 to 1.05 / 0.95. This equivalent ratio is 0.5 / 1.
If the ratio is less than 5 or exceeds 1.5 / 0.5, curing is performed in the step of curing the uncured barrier rib forming portion (described later) to form a barrier rib forming portion made of a barrier rib precursor mixture. There is a tendency that it is not accelerated, and the shape of the barrier rib forming portion made of the barrier rib precursor tends to be broken.

(C3) In addition to the above-mentioned polyfunctional isocyanate compounds having two or more isocyanate groups in the molecule and the polyhydric alcohol, the urethane resin composition may further contain one or more A compound having two isocyanate groups, a monohydric alcohol, or the like can also be used.

The compound having one isocyanate group in the molecule includes, for example, ethyl isocyanate, n-
Propyl isocyanate, isopropyl isocyanate, n-butyl isocyanate, tert-butyl isocyanate, n-hexyl isocyanate, ethylhexyl isocyanate, n-octyl isocyanate, n-decyl isocyanate, n-octadecyl isocyanate, phenyl isocyanate, benzyl isocyanate, p-toluyl isocyanate, o-toluyl isocyanate, p-methylphenyl isocyanate, o-methylphenyl isocyanate, o, p-dimethylphenyl isocyanate, p-methoxyphenyl isocyanate, o-methoxyphenyl isocyanate, p-methoxybenzyl isocyanate, o-methoxybenzyl isocyanate, -Naphthyl isocyanate and the like. Further, an isothiocyanate compound corresponding to a compound having one isocyanate group in these molecules can also be used. These are used alone or in combination of two or more.

(C3) When a compound having one isocyanate group in the molecule is used in the urethane resin composition, the compounding amount of the compound having one isocyanate group in the molecule is two or more in the molecule. The amount is preferably 0 to 50 parts by weight, more preferably 0 to 20 parts by weight, based on 100 parts by weight of the total amount of the compound having an isocyanate group. When this amount exceeds 50 parts by weight,
(C3) The curing speed of the urethane resin composition is slow, and the curability tends to be poor. In the process of curing the uncured barrier rib (described later) to form the barrier rib forming portion composed of the barrier rib precursor mixture, curing is performed. Is not promoted, and the shape of the barrier rib forming portion composed of the barrier rib precursor mixture tends to be lost.

Examples of the monohydric alcohol include methanol, ethanol, isopropanol, butanol,
Hexanol, cyclohexanol, octanol, benzyl alcohol, phenethyl alcohol and the like can be mentioned, and these are used alone or in combination of two or more. (C3) When a monohydric alcohol is used in the urethane resin composition, the amount of the monohydric alcohol is 0 to 100 parts by weight of the total amount of the polyhydric alcohol.
It is preferably 50 parts by weight, more preferably 0 to 20 parts by weight. When the compounding amount exceeds 50 parts by weight, the curing rate of the (c3) urethane resin composition is low,
Curability tends to be inferior, and in the process of curing an uncured barrier rib forming portion described later (II) to form a barrier rib forming portion composed of a barrier rib precursor mixture, curing is not promoted and barrier rib forming of a barrier rib precursor mixture is not performed. The shape of the part tends to collapse.

(C3) A polyhydric alcohol such as polyalkylene glycol (polyethylene glycol, polypropylene glycol, etc.) and a polyhydric isocyanate such as tolylene diisocyanate are added to the urethane resin composition in an isocyanate / alcohol (equivalent ratio). A prepolymerized (previously polyvalent isocyanate) or the like which has been reacted in advance so as to exceed 1 can also be used for the purpose of extending pot life, adjusting flexibility, and the like.

(C4) The unsaturated polyester resin composition includes, for example, an unsaturated polyester obtained by condensing an α, β-unsaturated dibasic acid and / or its anhydride with a polyhydric alcohol, and an ethylenically unsaturated group. Compounds containing a thermopolymerizable unsaturated compound having the following formula:

As the α, β-unsaturated dibasic acid and / or anhydride used in the synthesis of unsaturated polyester, for example, maleic acid, fumaric acid, itaconic acid, citraconic acid, maleic anhydride and the like can be mentioned. . These are used alone or in combination of two or more. Examples of the polyhydric alcohol used for the synthesis of the unsaturated polyester include dihydric alcohols (ethylene glycol, diethylene glycol, propylene glycol, dipropylene glycol, 1,3-butanediol, 1,6-hexanediol, neopentyl glycol, 1,4-cyclohexanediol, hydrogenated bisphenol A
And the like, trihydric alcohols (such as glycerin, trimethylolethane, and trimethylolpropane), and tetrahydric alcohols (such as pentaerythritol). These are used alone or in combination of two or more.

The weight average molecular weight of the unsaturated polyester (measured by gel permeation chromatography and converted using a standard polystyrene calibration curve) is
Preferably, 5,000 to 500,000 are used, and more preferably, 10,000 to 100,000. This weight average molecular weight is 5,000
If less than 0 or more than 500,000 is used, the curing is promoted in the step of curing the uncured barrier rib forming portion (described later) to form the barrier rib forming portion composed of the barrier rib precursor mixture. However, the shape of the barrier rib forming portion made of the barrier rib precursor mixture tends to collapse.

In the synthesis of unsaturated polyester, α,
The mixing ratio of the β-unsaturated dibasic acid and / or anhydride and the polyhydric alcohol is represented by the total amount of functional groups of α, β-unsaturated dibasic acid and / or anhydride in monomer conversion / polyhydric alcohol The total amount of functional groups (equivalent ratio) in monomer conversion of is 1 /
It is preferably in the range of 1-1.1 / 1.3, and 1/1.
More preferably, it is in the range of 03 to 1 / 1.15.
If the equivalent ratio is less than 1/1 or exceeds 1 / 1.3, the uncured barrier rib (to be described later) is cured to form a barrier rib forming portion composed of a barrier rib precursor mixture. Is not promoted, and the shape of the barrier rib forming portion composed of the barrier rib precursor mixture tends to be lost.

The unsaturated polyester includes α,
Those in which polybasic acids other than β-unsaturated dibasic acids are co-condensed can be used. Examples of polybasic acids other than α, β-unsaturated dibasic acids include, for example, phthalic anhydride, phthalic acid, isophthalic acid, terephthalic acid, tetrahydrophthalic anhydride, 3,6-endomethylenetetrahydrophthalic anhydride, glutaric acid , Adipic acid, sebacic acid, trimellitic acid, pyromellitic acid, dimer acid, trimellitic anhydride, succinic acid, azelaic acid, hexahydrophthalic acid, rosin-maleic anhydride and the like. These are used alone or in combination of two or more.

In the case where an unsaturated polyester obtained by co-condensing a polybasic acid other than α, β-unsaturated dibasic acid is used, the blending of a polybasic acid other than α, β-unsaturated dibasic acid is used. The amount is 0 parts by weight based on 100 parts by weight of the total amount when the α, β-unsaturated dibasic acid and / or its anhydride is used as a monomer.
~ 150 parts by weight are preferably copolymerized,
120 parts by weight are more preferably copolymerized,
It is particularly preferred that the copolymerization is carried out at 100 to 100 parts by weight. When the amount exceeds 150 parts by weight, the curing rate of the unsaturated polyester resin composition tends to be low and the curability tends to be inferior due to the small amount of unsaturated groups in the unsaturated polyester. Cure the uncured barrier ribs,
In the process of forming the barrier rib forming portion made of the barrier rib precursor mixture, the curing is not promoted, and the shape of the barrier rib forming portion made of the barrier rib precursor mixture tends to collapse.

(C4) Examples of the thermally polymerizable unsaturated compound having an ethylenically unsaturated group used in the unsaturated polyester resin composition include, for example, the above-mentioned (c) organic binder (c ') at 50 to 300 ° C. For example, those exemplified for the composition containing (c2) a thermopolymerizable unsaturated compound having an ethylenically unsaturated group, which can be used as a resin component that cures at a temperature, can be used. These are used alone or in combination of two or more.

(C4) In the unsaturated polyester resin composition, the compounding amount of the thermopolymerizable unsaturated compound having an ethylenically unsaturated group is 10% or less.
The amount is preferably 25 to 150 parts by weight, more preferably 40 to 100 parts by weight, and particularly preferably 50 to 60 parts by weight with respect to 0 parts by weight.

The (c4) unsaturated polyester resin composition may optionally contain a thermal initiator which generates free radicals upon heating. Examples of the thermal initiator that generates free radicals upon heating include (c2) an ethylenically unsaturated group which can be used as (c) a resin component of the organic binder that cures at a temperature of 50 to 300 ° C. For example, those exemplified as the thermal initiator that generates free radicals by heating can be blended with the thermally polymerizable unsaturated compound having These are used alone or in combination of two or more.

(C4) In the unsaturated polyester resin composition,
In the case of using a compound containing a thermal initiator that generates free radicals by heating, the amount of the thermal initiator that generates free radicals by heating is based on 100 parts by weight of the total amount of the unsaturated polyester described above. The amount is preferably 0 to 20 parts by weight, more preferably 0.1 to 10 parts by weight.

In the present invention, (c ') 50 to 3 in the (c) organic binder of the (A) barrier rib material described above.
The resin component that cures at a temperature of 00 ° C. is used alone or in combination of two or more.

The (A) barrier rib material according to the present invention comprises:
(II) a step of curing the uncured barrier rib forming portion to form a barrier rib forming portion composed of a barrier rib precursor mixture and (IIIa) a step of forming an electrode pattern or (IIIb) forming a multicolor pattern, which will be described later. In the process, from the viewpoint that strength can be improved, inorganic materials ((a) inorganic pigment and (b) inorganic binder) and (c ′) 50 to 30
It is preferable to include a resin component that cures at a temperature of 0 ° C., and (c ′) an epoxy resin composition, (c3) a urethane resin composition, or the like as a resin component that cures at a temperature of 50 to 300 ° C. It is more preferable to use (c
1) It is particularly preferable to use an epoxy resin composition.

The resin component (c ') used in the barrier rib material (A') of the present invention, which cures at a temperature of 50 to 300 ° C., is required in view of strength, brightness and the like of the finally obtained back plate for PDP. Therefore, it is preferable to use a resin in which the residue of the organic substance after the step of baking (IV) described below is 0.5% by weight or less. (IV) As a resin in which the residue of the organic substance after the step of baking is 0.5% by weight or less,
Among the above-mentioned (c ′) resin components that cure at a temperature of 50 to 300 ° C., (c1) an epoxy resin and (c2) a resin having an ethylenically unsaturated group are preferred.

In the present invention, (c) the (c) organic binder of the (A) barrier rib material is used at 50 to 300 ° C.
The resin component which cures at a temperature of 50 to 300 is used for the purpose of adjusting the mechanical strength of the barrier rib forming portion made of the barrier rib precursor mixture, suppressing curing shrinkage when obtaining the barrier rib forming portion made of the barrier rib precursor mixture, and the like. A resin or the like that does not cure at a temperature of ° C. may be added. here,
The resin that does not cure at a temperature of 50 to 300 ° C. is a resin that does not cure by itself with a curing agent or a curing catalyst, and includes, for example, a thermoplastic resin.
As such a thermoplastic resin, for example, acrylic polymer such as polyacrylate, polymethacrylate, polyvinyl acetate, polystyrene, a monomer having an ethylenically unsaturated group, homopolymerization, copolymerization, graft polymerization Alternatively, a polymer, a polyether resin, a cellulose derivative, a polyamide resin, a polyvinyl acetal resin, a polyester resin, a polycarbonate resin, and the like obtained by block polymerization may be used. These are used alone or in combination of two or more.

When a resin which does not cure at a temperature of 50 to 300 ° C. is blended, the compounding amount is (c ′) 100 to 100 parts by weight of a resin component which cures at a temperature of 50 to 300 ° C.
It is preferably 0 parts by weight, more preferably 0 to 50 parts by weight. If the compounding amount exceeds 100 parts by weight, in the step (II) of curing the uncured barrier rib described later to form a barrier rib forming portion composed of the barrier rib precursor mixture, the curing is not promoted and the barrier rib composed of the barrier rib precursor mixture is not promoted. The strength of the formed portion tends to decrease.

The (A) barrier rib material in the present invention includes:
(C ') 50 to 30 of the organic binder (c) described above.
By using a resin component that cures at a temperature of 0 ° C.,
In the step of forming a barrier rib forming portion composed of a barrier rib precursor mixture by curing (II) described later, (c)
Since the organic binder is hardened and the mechanical strength can be improved, it is possible to easily perform a step (IIIa) for forming an electrode pattern or a step (IIIb) for forming a multicolor pattern described later, In the (IV) baking step described later, the organic substance in the barrier rib forming portion composed of the barrier rib precursor mixture and the organic substance used in forming the electrode pattern or the organic substance used in forming the multicolor pattern are collectively collected. And can be easily scattered.

(C ″) The resin component having a Tg of 80 ° C. or higher is not particularly limited as long as the resin component has a Tg of 80 ° C. or higher. For example, styrene-based polymers, acrylic acid-based polymers, and other vinyl polymers And the like.
They can be used alone or in combination of two or more.

Examples of the styrene-based polymer include polystyrene, poly-2-methylstyrene, poly-3-methylstyrene, poly-4-methylstyrene, poly-2,
4-dimethylstyrene, poly-2,5-dimethylstyrene, poly-3,4-dimethylstyrene, poly-3,5-
Dimethylstyrene, poly-4-tert-butylstyrene,
Poly-4-methoxystyrene, poly-2-chlorostyrene, poly-3-chlorostyrene, poly-4-chlorostyrene, poly-2,4-dichlorostyrene, poly-2,5
-Dichlorostyrene, poly-3,4-dichlorostyrene, poly-3,5-dichlorostyrene, poly-4-fluorostyrene, poly-4-bromostyrene, poly-4-
Iodostyrene, poly-4-carboxystyrene, poly-2-methoxycarbonylstyrene, poly-4-methoxycarbonylstyrene, poly-2-ethoxycarbonylstyrene, poly-2-butoxycarbonylstyrene, poly-2-isobutoxycarbonylstyrene , Poly-4-
Isobutoxycarbonylstyrene, poly-2-propoxycarbonylstyrene, poly-2-dimethylaminostyrene, poly-4-dimethylaminostyrene, poly-2-
Hydroxymethylstyrene, poly-3-hydroxymethylstyrene, poly-4-hydroxymethylstyrene, poly-4-phenylstyrene, poly-4-p-toluonylstyrene, poly-4-benzoylstyrene, poly-4-
(4-biphenyl) styrene, poly-4-acetylstyrene, poly-4-chloro-2-methylstyrene, poly-
4-chloro-3-methylstyrene, poly-4-chloro-
Examples include 3-fluorostyrene, poly-α-methylstyrene, poly-α-methyl-4-isopropylstyrene, and the like.

Examples of the acrylic acid-based polymer include, for example,
Polyacrylic acid, polyacrylic acid-2-naphthyl, polyacrylic acid-2-cyanobenzyl, polyacrylic acid-4
-Cyanophenyl, polymethacrylic acid, polymethyl methacrylate, poly-tert-butyl methacrylate, polycyclohexyl methacrylate, polyphenyl methacrylate,
Poly-2-cyanoethyl methacrylate, 2-hydroxyethyl polymethacrylate, isobornyl polymethacrylate, polyacrylamide, polyN, N-dimethylacrylamide, polypiperidylacrylamide, poly-4
-Carboxyphenyl methacrylamide, poly-4-methoxycarbonylphenyl methacrylamide, polymethylchloroacrylate, polyethyl-α-chloroacrylate, polyisopropyl-α-chloroacrylate,
Polymethyl-α-fluoroacrylate, polybutyl-
α-cyanoacrylate, polymethyl-α-phenylacrylate and the like.

As other vinyl polymers, for example,
Polyvinyl alcohol, poly-4-tert-butylbenzoylethylene, polyvinyl chloride, polyacrylonitrile, poly-1-methylcyclohexanoyloxyethylene, poly-4-methoxybenzoyloxyethylene, poly-4-tert-butylbenzoyloxyethylene And the like.

Further, polyoxides, polycarbonates, polyesters, polylactones, polyurethanes, polysiloxanes, polysulfides, polysulfones, polyamides, polyimines, polyureas, polybenzoxazoles, polyoxadiazoles , Polybenzothiazoles, polybenzimidazoles, polyquinolines, polyacetals, carbohydrates, etc. (c ″)
It can be mentioned as a resin component having a Tg of 80 ° C. or higher.

(D) Examples of the organic solvent having a boiling point of 150 ° C. or higher include dimethylformamide, dimethyl sulfoxide, N-methyl-2-pyrrolidone, cyclohexanone, dimethyl phthalate, diethyl phthalate, diethylhexyl phthalate, nitrobenzene, Anisole, γ-butyrolactone, diethylene glycol monoethyl ether acetate, diethylene glycol monobutyl ether acetate, 2,2,4-trimethyl-1,3-pentadiol monoisobutyrate, isophorone, butyl carbitol, 3-methoxybutyl acetate, and the like. Can be These are used alone or in combination of two or more.

In the (A) barrier rib material of the present invention, the blending amount of the inorganic material ((a) the inorganic pigment and (b) the inorganic binder) depends on the amount of the inorganic material ((a) the inorganic pigment and (b)
(A) The inorganic pigment is preferably 10 to 90 parts by weight, and the total amount of the inorganic binder is 100 parts by weight.
It is more preferably 70 parts by weight, particularly preferably 40 to 50 parts by weight. (A) If the amount of the inorganic pigment is less than 10 parts by weight or more than 90 parts by weight,
There is a tendency that the shape of the barrier rib after the firing step (IV) described below is broken.

In the (A) barrier rib material of the present invention, the compounding amount of the (c) organic binder is 100% of the total amount of the inorganic material ((a) the inorganic pigment and (b) the inorganic binder).
The amount is preferably 1 to 100 parts by weight, more preferably 2 to 90 parts by weight, and more preferably 3 to 7 parts by weight.
It is more preferably 0 parts by weight, more preferably 4 to 60 parts by weight, particularly preferably 5 to 50 parts by weight, and very preferably 5 to 30 parts by weight. If the compounding amount is less than 1 part by weight, it will be described later (II)
Even after performing the step of forming the barrier rib formation portion made of the barrier rib precursor mixture by curing the uncured barrier rib formation portion, the strength of the barrier rib formation portion made of the barrier rib precursor mixture tends to decrease, and 100 parts by weight If it exceeds, the shrinkage of the volume of the barrier rib after the end of the firing step (IV) described later tends to increase, and the barrier rib formed on the substrate tends to peel. It is preferable that the difference between the volume of the barrier rib forming portion made of the barrier rib precursor mixture before firing and the volume after firing the barrier rib forming portion is smaller.

In the barrier rib material (A) according to the present invention, (d) the amount of the organic solvent having a boiling point of 150 ° C. or more depends on the amount of the inorganic material ((a) the inorganic pigment and (b) the inorganic binder)
The amount is preferably 0 to 50 parts by weight, more preferably 0 to 30 parts by weight, based on 100 parts by weight of the total amount of the organic binder (c). If the amount exceeds 50 parts by weight, the formability of the barrier rib forming portion formed of the barrier rib precursor mixture tends to be poor.

Further, the back plate for PDP of the present invention uses a substrate having a concave portion to be a discharge space as a substrate, and an electrode pattern including an electrode material and an organic material, and a phosphor and an organic material on the inner surface of the concave portion. The electrode pattern and the phosphor pattern can be formed by baking in a state where the multicolor pattern including the multicolor pattern is formed in a predetermined arrangement.

The substrate having the concave portion to be the discharge space has a concave portion, and has a surface having insulation properties or insulation treatment, and has heat resistance or heat treatment treatment. There is no particular limitation as long as the barrier rib material made of an inorganic material and an organic material is embedded on a flat substrate made of a material such as glass (soda glass, high strain point glass, etc.), alumina, and enamel. A predetermined pattern is formed by a photolithographic method using a photosensitive resin composition on a flat substrate, a barrier rib material is buried with a squeegee or the like in portions not covered by the pattern, the pattern is removed, and the buried barrier rib material is removed. A substrate, glass (soda glass, high strain point glass, etc.), alumina, Such as a substrate formed with barrier ribs by cutting the surface of the material flat substrate, such as Ro, and these substrates, the surface treatment may be subjected to adhesion. In addition, the thickness of the substrate excluding the barrier rib forming portion is usually 0.5 to 10 mm.

In the present invention, it is preferable that the substrate having the concave portion to be the discharge space is made of the same material and integrated from the viewpoint of the strength of the barrier rib forming portion and the reduction in the number of steps. As a method of forming a substrate having a concave portion that is to be a discharge space integrated with the same material, from the viewpoint of handleability, workability, etc., for example, a glass plate is glass-etched to form a barrier rib, and discharge is performed. A preferred method is a method using a substrate having a concave portion to be a space.

As a method for forming barrier ribs by glass etching a glass plate, for example, (D) a layer of a photosensitive resin composition is laminated on a glass plate, and a pattern is formed by actinic light through a photomask. After exposure in the shape, the unexposed area or the area of the exposed area, alkaline aqueous solution,
After removal by development using a developing solution such as an aqueous stripping solution or an organic solvent stripping solution, a resist pattern is formed. Then, the resist pattern portion is used as a barrier rib forming portion, and a glass surface not covered with the resist is etched by glass. And a method of forming barrier ribs by removing and removing the resist pattern. As a glass etching method, for example, a method in which an aqueous solution in which glass such as a fluoride solution (hydrofluoric acid or the like) can be dissolved is sprayed onto a glass plate to perform etching, or a fine component having a harder component than glass such as ceramics is used. A method in which particles are etched by spraying the particles on a glass plate may be used. The depth of the glass plate to be glass-etched is 50 to 50 in accordance with the height of the barrier rib to be formed.
The thickness is preferably 0 μm, more preferably 60 to 400 μm. The width of the glass plate to be etched (between resist patterns)
Is preferably 30 to 1000 μm, and 50 to 1000 μm.
More preferably, it is 500 μm.

The photosensitive resin composition (D) is not particularly limited and may be a negative type or a positive type. For example, (e) a film imparting polymer,
Examples include (f) a photopolymerizable unsaturated compound having an ethylenically unsaturated group, and (g) a compound containing a photoinitiator that generates free radicals upon irradiation with active light (negative type).

After the above-described glass etching, the resist pattern is stripped. The method of stripping the resist pattern is not particularly limited. Can be performed by a known method such as spraying, rocking immersion, brushing, and scraping. In addition,
At this time, the stripping time and the stripping temperature can be appropriately adjusted so that the resist pattern can be stripped.

The stripping time is preferably from 1 to 200 minutes, and the stripping temperature is preferably from 10 to 80 ° C. If the peeling time is less than 1 minute, sufficient peeling tends not to occur, and if it exceeds 200 minutes, the glass plate tends to erode. If the peeling temperature is less than 10 ° C.,
When the temperature exceeds 80 ° C., the glass plate tends to be eroded.

Examples of the base used in the aqueous alkali solution include alkali hydroxides (such as hydroxides of lithium, sodium and potassium), alkali carbonates (such as carbonates and bicarbonates of lithium, sodium and potassium), and alkali metal phosphates. Salts (eg, potassium phosphate, sodium phosphate), alkali metal pyrophosphates (eg, sodium pyrophosphate, potassium pyrophosphate), tetramethylammonium hydroxide, triethanolamine, and the like. Tetramethylammonium and the like are preferred. The pH of the alkaline aqueous solution used for stripping is preferably 10 to 14. In addition, a surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating the development, and the like can be mixed in the aqueous alkali solution.

Examples of the aqueous stripper include those comprising water or an aqueous alkali solution and one or more organic solvents.
Here, as the base of the alkaline aqueous solution, in addition to the above substances, for example, borax, sodium metasilicate, ethanolamine, ethylenediamine, diethylenetriamine,
2-amino-2-hydroxymethyl-1,3-propanediol, 1,3-diaminopropanol-2-morpholine, tetramethylammonium hydroxide and the like.

Examples of the organic solvent include acetone alcohol, acetone, ethyl acetate, alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol. Monobutyl ether and the like. These can be used alone or 2
Used in combination of more than one type. The concentration of the organic solvent is usually in the range of 2 to 90% by weight, and the temperature can be adjusted according to the ease of peeling.

The multicolor pattern in the present invention is formed by a composition containing a phosphor and an organic material. Examples of the composition containing a phosphor and an organic material used for forming a multicolor pattern include, for example, a phosphor that emits red, green, and blue light, one color each (B) a phosphor. And the like. The photosensitive resin composition containing the phosphor (B) used for forming a multicolor pattern is not particularly limited as long as it is a photosensitive resin composition containing a phosphor as an essential component. (E) a film-imparting polymer, (f) a photopolymerizable unsaturated compound having an ethylenically unsaturated group, (g) a photoinitiator that generates free radicals upon irradiation with active light, and (h) a phosphor. Are preferred.

As the (e) film imparting polymer in the photosensitive resin composition containing the phosphor (B) used for forming a multicolor pattern, a vinyl copolymer is preferable, and a vinyl copolymer is preferred. Examples of the vinyl monomer used for acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, methacrylic N-propyl acrylate, iso-propyl acrylate, iso-propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, iso-butyl acrylate, iso-butyl methacrylate, sec-butyl acrylate, methacrylic acid sec-butyl, tert-butyl acrylate, tert-butyl methacrylate, pentyl acrylate, methacrylic acid Pentyl acrylate, hexyl acrylate, hexyl methacrylate, heptyl acrylate, heptyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, octyl acrylate, octyl methacrylate, nonyl acrylate, nonyl methacrylate, decyl acrylate , Decyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate, octadecyl acrylate, octadecyl methacrylate, eicosyl acrylate, eicosyl methacrylate,
Docosyl acrylate, docosyl methacrylate, cyclopentyl acrylate, cyclopentyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate,
Cycloheptyl acrylate, cycloheptyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, methoxyethyl acrylate, methoxyethyl methacrylate, methoxydiethylene glycol acrylate, methoxydiethylene glycol methacrylate, methoxydimethacrylate Propylene glycol, methoxydipropylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, dimethylaminoethyl acrylate, dimethylaminoethyl methacrylate, Diethylaminoethyl acrylate, diethylaminoethyl methacrylate, dimethylamino acrylate Propyl, dimethylaminopropyl methacrylate, 2-chloroethyl acrylate, 2-chloroethyl methacrylate, 2-fluoroethyl acrylate, 2-fluoroethyl methacrylate, acrylic acid 2-
Cyanoethyl, 2-cyanoethyl methacrylate, styrene, α-methylstyrene, vinyltoluene, vinyl chloride, vinyl acetate, N-vinylpyrrolidone, butadiene,
Examples include isoprene, chloroprene, acrylamide, methacrylamide, acrylonitrile, and methacrylonitrile. These are used alone or in combination of two or more.

(E) The weight average molecular weight of the film imparting polymer is preferably from 5,000 to 300,000, more preferably from 20,000 to 150,000. If the weight average molecular weight is less than 5,000, the film formability and flexibility of the photosensitive element tend to decrease, and if it exceeds 300,000, the developability (unnecessary portions are easily developed by development). Tend to be reduced). The weight average molecular weight is a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve.

Further, (e) the carboxyl group content (acid value (mgKOH) / g)) can be adjusted as appropriate. For example, when developing using an alkaline aqueous solution such as sodium carbonate or potassium carbonate, (e)
It is preferable that the acid value of the polymer having a film property is 90 to 260. If the acid value is less than 90, development tends to be difficult, and if it exceeds 260, the developer resistance (the property that a portion that is not removed by development and remains as a pattern and is not attacked by the developer) decreases. Tend. In the case where development is performed using an aqueous developer composed of water or an aqueous alkali solution and one or more organic solvents, the acid value of the polymer (e) for imparting film properties is preferably 16 to 260. If the acid value is less than 16, development tends to be difficult, and if it exceeds 260, developer resistance tends to decrease. When an organic solvent developer such as 1,1,1-trichloroethane is used, (e) the polymer having a film property may not contain a carboxyl group.

As the (f) photopolymerizable unsaturated compound having an ethylenically unsaturated group in the photosensitive resin composition containing the phosphor (B) used for forming a multicolor pattern, All those known as photopolymerizable monomers can be used. For example, the following general formula (I)

Embedded image (Wherein, R represents a hydrogen atom or a methyl group, and k represents 1 to 1)
Is an integer of 0, Y is a saturated or unsaturated hydrocarbon group or a heterocyclic residue or a polyalkylene glycol residue which may have a substituent,

Embedded image (Wherein, R ¹ represents a hydrogen atom, a methyl group, an ethyl group, a propyl group, or a trifluoromethyl group, R ² represents a linear or branched alkylene group having 1 to 6 carbon atoms, and m and n each represent Independently represents an integer of 1 to 20).

In the general formula (I), examples of the saturated or unsaturated hydrocarbon residue or heterocyclic residue which may have a substituent represented by Y include a halogen atom, a hydroxyl group and an amino group. A straight-chain, branched or alicyclic alkane residue having 1 to 22 carbon atoms which may have a substituent such as a carboxyl group (methane residue, ethane residue, propane residue,
Cyclopropane residue, butane residue, isobutane residue, cyclobutane residue, pentane residue, isopentane residue, neopentane residue, cyclopentane residue, hexane residue,
Cyclohexane residue, heptane residue, cycloheptane residue, octane residue, nonane residue, decane residue, etc.), aromatic ring residue (benzene residue, naphthalene residue, anthracene residue, biphenyl residue, Phenyl residue), heterocyclic residue (furan residue, thiophene residue, pyrrole residue,
Oxazole residue, thiazole residue, imidazole residue, pyridine residue, pyrimidine residue, pyrazine residue, triazine residue, quinoline residue, quinoxaline residue and the like.

Specifically, the monomer having one unsaturated bond includes, for example, esters of acrylic acid or methacrylic acid (methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-acrylate) −
Propyl, n-propyl methacrylate, iso acrylate
-Propyl, iso-propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, iso acrylate
-Butyl, iso-butyl methacrylate, sec-acrylic acid-
Butyl, sec-butyl methacrylate, tert-acrylate
Butyl, tert-butyl methacrylate, pentyl acrylate, pentyl methacrylate, hexyl acrylate, hexyl methacrylate, heptyl acrylate, heptyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, octyl acrylate, methacrylic acid Octyl, nonyl acrylate, nonyl methacrylate, decyl acrylate, decyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate, octadecyl acrylate, octadecyl methacrylate, Eicosyl acrylate, eicosyl methacrylate, docosyl acrylate,
Docosyl methacrylate, cyclopentyl acrylate, cyclopentyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, cycloheptyl acrylate, cycloheptyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, phenyl methacrylate , Methoxyethyl methacrylate, dimethylaminoethyl acrylate, dimethylaminoethyl methacrylate, dimethylaminopropyl acrylate, dimethylaminopropyl methacrylate, 2-chloroethyl acrylate, 2-chloroethyl methacrylate, 2-fluoroethyl acrylate, methacryl 2-fluoroethyl acrylate, 2-cyanoethyl acrylate, 2-cyanoethyl methacrylate, methoxydiethylene acrylate Coal, methoxydiethylene glycol methacrylate, methoxydipropylene glycol acrylate, methoxydipropylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate, styrene or substituted styrene (α-methylstyrene, pt −
Butylstyrene, etc.), polyolefins (butadiene, isoprene, chloroprene, etc.), vinyl monomers (vinyl chloride, vinyl acetate, etc.), unsaturated nitriles (acrylonitrile, methacrylonitrile, etc.), 1- (methacryloyloxyethoxycarbonyl) -2 -(3'-chloro-2 '
-Hydroxypropoxycarbonyl) benzene and the like.

Examples of the monomer having two unsaturated bonds include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, and tetraethylene glycol dimethacrylate. Ethylene glycol diacrylate, tetraethylene glycol dimethacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, hexapropylene glycol dimethacrylate, hexapropylene glycol dimethacrylate, polypropylene glycol diacrylate, polypropylene glycol dimethacrylate, butylene glycol diacrylate, butylene glycol Jime Acrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate, 1,3-butanediol diacrylate,
1,3-butanediol dimethacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, 1,5-pentanediol diacrylate, 1,5-pentanediol dimethacrylate,
1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol diacrylate, pentaerythritol dimethacrylate, trimethylolpropane diacrylate, trimethylolpropane dimethacrylate, bisphenol A
Diacrylate, bisphenol A dimethacrylate,
2,2-bis (4-acryloxyethoxyphenyl) propane, 2,2-bis (4-methacryloxyethoxyphenyl) propane, 2,2-bis (4-acryloxydiethoxyphenyl) propane, 2,2- Bis (4-methacryloxydiethoxyphenyl) propane, 2,2-bis (4-acryloxypolyethoxyphenyl) propane 2,2-bis (4-methacryloxypolyethoxyphenyl) propane, bisphenol A diglycidyl ether diacrylate , Bisphenol A diglycidyl ether dimethacrylate, urethane diacrylate compound and the like.

Examples of the monomer having three unsaturated bonds include, for example, trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, ethylene oxide-modified trimethylolpropane triacrylate, ethylene oxide Modified trimethylolpropane trimethacrylate, trimethylolpropane triglycidyl ether triacrylate, trimethylolpropane triglycidyl ether trimethacrylate and the like can be mentioned. Examples of the monomer having four unsaturated bonds include tetramethylolpropane tetraacrylate, tetramethylolpropane tetramethacrylate, pentaerythritol tetraacrylate, and pentaerythritol tetramethacrylate.

Examples of the monomer having five unsaturated bonds include dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate and the like. Examples of the monomer having six unsaturated bonds include dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, and the like. Any of these monomers having an unsaturated bond may be those that undergo radical polymerization by light irradiation, and these monomers having an unsaturated bond may be used alone or in combination of two or more. Used in combination.

The photosensitive resin composition containing the phosphor (B) used for forming a multicolor pattern is not required (organic component) in the baking step (IV) described later.
It is necessary to remove from the above-mentioned (f) the photopolymerizable unsaturated compound having an ethylenically unsaturated group, from the following general formula (II)

Embedded image (Wherein R ³ represents a hydrogen atom or a methyl group, and p X
Are each independently

Embedded image Wherein p is an integer of 1 to 60), and the like are more preferred in terms of good thermal decomposability.

As the compound having both functions of (e) the polymer having a film property and (f) the photopolymerizable unsaturated compound having an ethylenically unsaturated group, a photopolymerization having an ethylenically unsaturated group in a side chain may be used. A hydrophilic polymer binder can be used in place of the (e) film-imparting polymer.
Examples of the photopolymerizable polymer binder having an ethylenically unsaturated group in the side chain include, for example, a vinyl copolymer having a functional group such as a carboxyl group, a hydroxyl group, an amino group, an isocyanate group, an oxirane ring, and an acid anhydride. , At least one ethylenically unsaturated group, an oxirane ring, an isocyanate group,
Examples include a photopolymerizable vinyl copolymer obtained by reacting a compound having one functional group such as a hydroxyl group and a carboxyl group.

Examples of the vinyl monomer as a raw material used for synthesizing a vinyl copolymer having a functional group such as a carboxyl group, a hydroxyl group, an amino group, an oxirane ring, and an acid anhydride include acrylic acid, methacrylic acid, and maleic acid. Acid, fumaric acid, itaconic acid, cinnamic acid, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, acrylamide, methacrylamide, ethyl isocyanate methacrylate, glycidyl acrylate, glycidyl methacrylate, carboxyl groups such as maleic anhydride, Examples of the vinyl monomer include a vinyl monomer having a functional group such as a hydroxyl group, an amino group, an oxirane ring, and an acid anhydride, and other vinyl monomers.

Other vinyl monomers include, for example,
Methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate,
N-propyl methacrylate, iso-propyl acrylate, iso-propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, iso-butyl acrylate, iso-butyl methacrylate, sec-butyl acrylate, methacryl Sec-butyl acid, tert-butyl acrylate, tert-butyl methacrylate, pentyl acrylate,
Pentyl methacrylate, hexyl acrylate, hexyl methacrylate, heptyl acrylate, heptyl methacrylate, 2-ethylhexyl acrylate, methacrylic acid 2
-Ethylhexyl, octyl acrylate, octyl methacrylate, nonyl acrylate, nonyl methacrylate, decyl acrylate, decyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate Octadecyl acrylate, octadecyl methacrylate, eicosyl acrylate, eicosyl methacrylate, docosyl acrylate, docosyl methacrylate, cyclopentyl acrylate, cyclopentyl methacrylate, cyclohexyl acrylate,
Cyclohexyl methacrylate, cycloheptyl acrylate, cycloheptyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, methoxyethyl acrylate, methoxyethyl methacrylate, methoxyethyl methacrylate, methoxydiethylene glycol methacrylate, Methoxydipropylene glycol acrylate, methoxydipropylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate, dimethylaminoethyl acrylate, dimethylaminoethyl methacrylate, diethylaminoethyl acrylate, diethylaminoethyl methacrylate, Dimethylaminopropyl acrylate, dimethylamino methacrylate Propyl, 2-chloroethyl, 2-chloroethyl methacrylate acrylate, 2
Fluoroethyl, 2-fluoroethyl methacrylate, 2-cyanoethyl acrylate, 2-cyanoethyl methacrylate, styrene, α-methylstyrene, vinyltoluene, vinyl chloride, vinyl acetate, N-vinylpyrrolidone,
Butadiene, isoprene, chloroprene, acrylonitrile, methacrylonitrile and the like. They are,
It can be used in combination with a vinyl monomer having a functional group such as a carboxyl group, a hydroxyl group, an amino group, an oxirane ring, and an acid anhydride, which are essential components, and used alone or in combination of two or more.

At least one ethylenically unsaturated group,
Examples of the compound having one functional group such as an oxirane ring, an isocyanate group, a hydroxyl group, a carboxyl group, an amino group, and an acid anhydride include, for example, glycidyl acrylate, glycidyl methacrylate, ethyl isocyanate methacrylate, 2-hydroxyethyl acrylate, Examples include 2-hydroxyethyl methacrylate, acrylic acid, methacrylic acid, maleic acid, fumaric acid, itaconic acid, cinnamic acid, acrylamide, methacrylamide, and maleic anhydride. These are used alone or in combination of two or more.

The weight average molecular weight of the photopolymerizable polymer binder having an ethylenically unsaturated group in the side chain is from 5,000 to 30.
20,000, preferably 20,000 to 15
More preferably, it is set to 0000. If the weight average molecular weight is less than 5,000, the film formability and flexibility of the photosensitive element tend to decrease, and if it exceeds 300,000, the developability (unnecessary portions are easily developed by development). Tend to be reduced).

Further, (B) a photopolymerizable polymer binder having an ethylenically unsaturated group in the side chain so that the photosensitive resin composition containing the phosphor can be developed with various known developers. Of the carboxyl group (defined by the acid value (mgKOH / g)) can be appropriately adjusted. For example, when developing using an aqueous alkali solution such as sodium carbonate or potassium carbonate, the acid value is preferably from 90 to 260. If the acid value is less than 90, development tends to be difficult, and if it exceeds 260, the developer resistance (the property that a portion which is not removed by development and remains as a pattern and is not attacked by the developer) decreases. Tend to. When developing using an aqueous developer composed of water or an aqueous alkaline solution and one or more organic solvents, the acid value is 1
It is preferable to be 6 to 260. When the acid value is less than 16, development tends to be difficult, and when it exceeds 260, developer resistance tends to decrease. In addition, 1,
When an organic solvent developer such as 1,1-trichloroethane is used, it does not need to contain a carboxyl group.

Examples of the (B) photoinitiator which generates free radicals upon irradiation with actinic light in the (B) photosensitive resin composition containing the phosphor used in forming a multicolor pattern include: Aromatic ketones (benzophenone, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone), N, N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone Benzoin ether (benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether, etc.), benzoin (methyl benzoin, Ethyl benzoin ), Benzyl derivatives (2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) - butanone-1,2-methyl-1- (4- (methylthio) phenyl) -2-morpholinopropanone -
1,2,2-dimethoxy-1,2-diphenylethane-
1-one, benzyldimethyl ketal, etc.), 2,4,5
-Triarylimidazole dimer (2- (o-chlorophenyl) -4,5-diphenylimidazole dimer,
2- (o-chlorophenyl) -4,5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-phenylimidazole dimer,
-(O-methoxyphenyl) -4,5-diphenylimidazole dimer, 2- (p-methoxyphenyl) -4,
5-diphenylimidazole dimer, 2,4-di (p-
Methoxyphenyl) -5-phenylimidazole dimer, 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer, etc., acridine derivatives (9-phenylacridine, 1,7-bis (9 , 9'-
Acridinyl) heptane and the like. These are used alone or in combination of two or more.

The (h) phosphor used in the photosensitive resin composition containing the phosphor (B) used for forming a multicolor pattern is not particularly limited, and is mainly composed of an ordinary metal oxide. Can be used.

Examples of the red emitting phosphor (h) include Y ₂ O ₂ S: Eu, Zn ₃ (PO ₄ ) ₂ : Mn, and Y ₂ O ₃ :
Eu, YVO ₄ : Eu, (Y, Gd) BO ₃ : Eu, γ-Z
n ₃ (PO ₄ ) ₂ : Mn, (ZnCd) S: Ag + In ₂ O and the like. Examples of the green-colored (h) phosphor include ZnS: Cu, Zn ₂ SiO ₄ : Mn, and ZnS: Cu.
+ Zn ₂ SiO ₄ : Mn, Gd ₂ O ₂ S: Tb, Y ₃ Al ₅ O
₁₂ : Ce, ZnS: Cu, Al, Y ₂ O ₂ S: Tb, Zn
O: Zn, ZnS: Cu, Al + In ₂ O ₃ , LaP
_{O 4: Ce, Tb, BaO} · 6Al 2 O 3: Mn , and the like. Examples of the blue-emitting (h) phosphor include, for example, Z
nS: Ag, ZnS: Ag, Al, ZnS: Ag, G
a, Al, ZnS: Ag, Cu, Ga, Cl, ZnS:
Ag + In ₂ O ₃ , Ca ₂ B ₅ O ₉ Cl: Eu ²⁺ , (Sr, C
a, Ba, Mg) ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu ²⁺ , Sr ₁₀ (P
O ₄ ) ₆ Cl ₂ : Eu ²⁺ , BaMgAl ₁₀ O ₁₇ : Eu ²⁺ , B
aMgAl ₁₄ O ₂₃ : Eu ²⁺ , BaMgAl ₁₆ O ₂₆ : Eu
^{2+ and the} like.

The particle size of the phosphor (h) in the photosensitive resin composition containing the phosphor (B) used for forming a multicolor pattern is preferably from 0.1 to 20 μm, It is more preferably 1 to 15 μm, and 2
It is particularly preferred that the thickness be 8 μm. This particle size is 0.1
If it is less than μm, the luminous efficiency tends to decrease, and
If it exceeds 20 μm, the dispersibility tends to decrease. (H) The shape of the phosphor is preferably spherical and the surface area is preferably smaller.

The amount of the component (e) in the photosensitive resin composition containing the phosphor (B) used in forming a multicolor pattern is such that the total amount of the components (e) and (f) is 100 parts by weight is preferably 10 to 90 parts by weight, more preferably 20 to 80 parts by weight. When the amount is less than 10 parts by weight, when supplied as a photosensitive element in a roll form, the photosensitive resin composition containing the phosphor (B) exudes from the end of the roll (hereinafter referred to as edge fusion). This makes it difficult to unwind the photosensitive element from the roll when laminating the photosensitive element, and also causes a problem that the extruded portion is partially and excessively embedded in the space of the PDP substrate, thereby significantly lowering the production yield, When the amount exceeds 90 parts by weight, the sensitivity of the photosensitive resin composition containing the phosphor (B) tends to be insufficient.

The amount of the component (f) in the photosensitive resin composition containing the phosphor (B) used in forming a multicolor pattern is such that the total amount of the components (e) and (f) is 100 parts by weight is preferably 10 to 90 parts by weight, more preferably 20 to 80 parts by weight. If the amount is less than 10 parts by weight, the sensitivity of the photosensitive resin composition containing the phosphor (B) tends to be insufficient, and if it exceeds 90 parts by weight, the photocured product tends to become brittle. Yes, and in the case of a photosensitive element,
(B) The photosensitive resin composition containing the phosphor tends to exude from the end portion due to the flow, or the film-forming property tends to decrease.

The amount of the component (g) in the photosensitive resin composition containing the phosphor (B) used when forming a multicolor pattern is 100% of the total of the components (e) and (f). It is preferably 0.01 to 30 parts by weight, more preferably 0.1 to 20 parts by weight, based on parts by weight. If the amount is less than 0.01 parts by weight,
The sensitivity of the photosensitive resin composition containing the phosphor (B) tends to be insufficient, and if it exceeds 30 parts by weight, the activity of the photosensitive resin composition containing the phosphor (B) on the exposed surface is increased. Light absorption increases and the internal light curing tends to be insufficient.

The amount of the component (h) in the photosensitive resin composition containing the phosphor (B) used when forming a multicolor pattern is determined by the components (e), (f) and (g). 10) to 300 parts by weight based on 100 parts by weight of the total amount of the components.
The weight is preferably set to 50 parts by weight, more preferably 50 to 250 parts by weight, and particularly preferably 70 to 200 parts by weight. If the amount is less than 10 parts by weight,
When light is emitted as a PDP, the luminous efficiency tends to decrease, and when it exceeds 300 parts by weight, when it is used as a photosensitive element, film formability or flexibility tends to decrease.

A plasticizer can be added to the photosensitive resin composition containing the phosphor (B) used for forming a multicolor pattern in order to improve the film properties.

The plasticizer is represented by the general formula (III)

Embedded image (Wherein, R represents a hydrogen atom or a methyl group, Y ¹ represents a hydrogen atom, a saturated hydrocarbon group which may have a substituent or a polyalkylene glycol residue, Y ² represents a hydroxyl group, a substituted Represents a saturated hydrocarbon group or a polyalkylene glycol residue which may have a group, and p is 1 to 10
Polyalkylene glycol derivatives such as polypropylene glycol and its derivatives, polyethylene glycol and its derivatives, and dioctyl phthalate, diheptyl phthalate, dibutyl phthalate, tricresyl phosphate, and cresyl diphenyl phosphate. Fate, biphenyl diphenyl phosphate and the like.

When a plasticizer is used, the amount is preferably 10 to 90 parts by weight based on 100 parts by weight of the total of the components (e) and (f).
The content is more preferably from 80 to 80 parts by weight, particularly preferably from 30 to 70 parts by weight. If the compounding amount is less than 10 parts by weight, the film forming property tends to decrease when formed into a photosensitive element, and if it exceeds 90 parts by weight, the photosensitive resin composition containing (B) a phosphor is used. The sensitivity of the object tends to be insufficient.

The photosensitive resin composition containing the phosphor (B) used for forming a multicolor pattern is prepared by adding carboxyl to the photosensitive resin composition so as not to cause thickening for a long time and to improve storage stability. A compound having a group can be contained.
Examples of the compound having a carboxyl group include saturated fatty acids, unsaturated fatty acids, aliphatic dibasic acids, aromatic dibasic acids, aliphatic tribasic acids, and aromatic tribasic acids.

Specifically, for example, formic acid, acetic acid, chloroacetic acid, dichloroacetic acid, trichloroacetic acid, propionic acid,
Capric, undecanoic, lauric, tridecanoic, myristic, pentadecanoic, palmitic, heptadecanoic, stearic, nonadecanoic, arachidic, palmitooleic, oleic, elaidic, linolenic, linoleic, Oxalic acid, malonic acid, methylmalonic acid, ethylmalonic acid, monomethyl malonate,
Monoethyl malonate, succinic acid, methylsuccinic acid, adipic acid, methyladipic acid, pimelic acid, suberic acid,
Azelaic acid, sebacic acid, maleic acid, itaconic acid,
Examples include phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, citric acid, salicylic acid, pyruvic acid, malic acid and the like. Among them, oxalic acid, malonic acid, methylmalonic acid, ethylmalonic acid, citric acid and the like are preferable, and oxalic acid, malonic acid, citric acid and the like are more preferable in terms of a high effect of suppressing thickening. These are used alone or in combination of two or more.

When a compound having a carboxyl group is used, the amount is preferably 0.01 to 30 parts by weight based on 100 parts by weight of the component (h). When the amount is less than 0.01 part by weight, the effect of storage stability of the photosensitive resin composition containing the phosphor (B) tends to be low, and when the amount exceeds 30 parts by weight, the (B) fluorescence The sensitivity of the photosensitive resin composition containing the compound tends to be insufficient.

The photosensitive resin composition containing the phosphor (B) used for forming a multicolor pattern includes (h)
A dispersant can be added to improve the dispersion of the phosphor. Examples of dispersants include inorganic dispersants (silica gel, bentonite, kaolinite, talc, hectorite, montmorillonite, saponite, beidellite, etc.), and organic dispersants (aliphatic amide, aliphatic ester). Polyethylene oxide type, sulfate type anion activator, polycarboxylic acid amine salt type, polycarboxylic acid type, polyamide type, polymer polyether type, acrylic copolymer type, special silicone type, etc.).
These can be used alone or in combination of two or more.

When a dispersant is used, its amount is not particularly limited, and is preferably 0.01 to 100 parts by weight based on 100 parts by weight of the component (h). When the amount is less than 0.01 part by weight, the effect of adding the dispersant tends not to be exhibited, and when the amount exceeds 100 parts by weight,
Pattern formation accuracy ((B) A pattern formed of a photosensitive resin composition containing a phosphor is dimensionally accurately determined after development.
(A property obtained in a desired shape) tends to decrease.

The photosensitive resin composition containing the phosphor (B) used when forming a multicolor pattern is used in order to prevent (h) the phosphor from peeling off the PDP substrate after firing. In addition, a binder can be used. Examples of the binder include a low-melting glass, a metal alkoxide, and a silane coupling agent. These are used alone or in combination of two or more. When using a binder, the amount used is not particularly limited,
(H) The amount is preferably 0.01 to 100 parts by weight, more preferably 0.05 to 50 parts by weight, particularly preferably 0.1 to 30 parts by weight based on 100 parts by weight of the component. preferable. When the amount is less than 0.01 part by weight, (h) the binding effect of the phosphor tends not to be exhibited,
If it exceeds 100 parts by weight, the luminous efficiency tends to decrease.

The photosensitive resin composition containing the phosphor (B) used for forming a multicolor pattern includes:
Dyes, color formers, plasticizers, pigments, polymerization inhibitors, surface modifiers, stabilizers, adhesion promoters, thermosetting agents, and the like can be added as necessary.

The electrode pattern according to the present invention is formed of a composition containing an electrode material and an organic material. The electrode material and the organic material used when forming the electrode pattern include the following. For example, a photosensitive resin composition containing (C) an electrode material is exemplified. (C) The photosensitive resin composition containing the electrode material is not particularly limited as long as it is a photosensitive resin composition containing the electrode material as an essential component. Preferable examples include a photopolymerizable unsaturated compound having an ethylenically unsaturated group, (g) a photoinitiator that generates free radicals upon irradiation with active light, and (i) a material containing an electrode material (negative type). .

As the (e) polymer for imparting film properties in the photosensitive resin composition containing the electrode material (C) used in forming the electrode pattern, the above-mentioned multicolor pattern may be used. In the photosensitive resin composition containing the phosphor (B) to be used, the same (e) film property-imparting polymer and the like can be used.

The (f) photopolymerizable unsaturated compound having an ethylenically unsaturated group in the photosensitive resin composition containing the electrode material (C) used in forming the electrode pattern is as described above. Use of the same (F) photopolymerizable unsaturated compound having an ethylenically unsaturated group in the photosensitive resin composition containing the phosphor (B) used in forming a color pattern Can be.

The photosensitive resin composition containing the electrode material (C) used in forming the electrode pattern contains the phosphor (B) used in forming the multicolor pattern. As in the case of the photosensitive resin composition to be performed, unnecessary components need to be removed in the baking step (IV) described below, so that the above-mentioned (f) the photopolymerizable unsaturated compound having an ethylenically unsaturated group is used. Therefore, the compound represented by the above general formula (II) is more preferable in terms of good thermal decomposability.

Further, (e) a film-imparting polymer and (f) ethylenically unsaturated polymer which can be used for the (B) phosphor-containing photosensitive resin composition used in forming the above-described multicolor pattern. A compound having both functions of a photopolymerizable unsaturated compound having a group can also be used.

The photoinitiator (g) of the photosensitive resin composition containing the electrode material, which is used for forming the electrode pattern, and (g) a photoinitiator which generates free radicals upon irradiation with actinic light, is as described above. Use of (B) the same photoinitiator as the photoinitiator which generates free radicals upon irradiation with active light in the photosensitive resin composition containing the phosphor (B) used for forming a color pattern Can be.

The (i) electrode material in the photosensitive resin composition containing the (C) electrode material used in forming the electrode pattern may be, for example, a conductive metal (silver, copper,
Chromium) and lead oxide or a low melting glass frit.

The amount of component (e) in the photosensitive resin composition containing the electrode material (C) used in forming the electrode pattern is such that the total amount of component (e) and component (f) is 100%. The weight is preferably 10 to 100 parts by weight, more preferably 20 to 100 parts by weight. When the compounding amount is less than 10 parts by weight, when the photosensitive element is supplied in the form of a roll, the photosensitive resin composition containing the electrode material (C) exudes from the end of the roll (hereinafter referred to as edge fusion). It becomes difficult to feed the photosensitive element out of the roll during lamination of the photosensitive element, and the extruded part is partially excessively embedded in the space of the substrate having the concave portion to be the discharge space,
There is a tendency that a problem such as a remarkable decrease in the production yield occurs or a film forming property is reduced.

The amount of the component (f) in the photosensitive resin composition containing the electrode material (C) used in forming the electrode pattern is such that the total amount of the components (e) and (f) is 100%. The weight part is preferably 0 to 90 parts by weight, more preferably 0 to 80 parts by weight.
When the compounding amount exceeds 90 parts by weight, the photocured product tends to become brittle, and when the photosensitive element is used,
(C) The photosensitive resin composition containing the electrode material tends to exude from the end portion due to the flow, or the film-forming property tends to decrease.

The amount of the component (g) in the photosensitive resin composition containing the electrode material (C) used in forming the electrode pattern is 100 parts by weight in total of the components (e) and (f). Parts by weight, preferably 0.01 to 30 parts by weight, more preferably 0.1 to 20 parts by weight. If the amount is less than 0.01 parts by weight,
The sensitivity of the photosensitive resin composition containing the electrode material (C) tends to be insufficient, and if it exceeds 30 parts by weight, the activity of the photosensitive resin composition containing the electrode material (C) on the exposed surface is increased. Light absorption increases and the internal light curing tends to be insufficient.

The amount of the component (i) in the photosensitive resin composition containing the electrode material (C) used in forming the electrode pattern is as follows: the component (e), the component (f) and the component (g). 10 to 300 based on 100 parts by weight of the total amount of the components
It is preferable that the amount be 5 parts by weight, more preferably 5 to 250 parts by weight. If the compounding amount is less than 10 parts by weight, the luminous efficiency tends to decrease when light is emitted as a PDP. , The flexibility tends to decrease.

A plasticizer can be added to the photosensitive resin composition containing the electrode material (C) used in forming the electrode pattern in order to improve the film properties. As the plasticizer, the same plasticizers that can be used in the photosensitive resin composition containing the phosphor (B) used for forming the above-described multicolor pattern can be used.

When a plasticizer is added, the amount thereof is preferably 10 to 90 parts by weight, preferably 20 to 8 parts by weight, based on 100 parts by weight of the total of components (e) and (f).
It is more preferably 0 parts by weight, particularly preferably 30 to 70 parts by weight. If the compounding amount is less than 10 parts by weight, when the photosensitive element is used, the film-forming property tends to decrease.
(C) The sensitivity of the photosensitive resin composition containing the electrode material tends to be insufficient.

The photosensitive resin composition containing the electrode material (C) used for forming the electrode pattern should not contain a carboxyl group in order to prevent thickening for a long time and to improve the storage stability. Can be contained.
As the compound having a carboxyl group, a compound similar to the compound having a carboxyl group which can be used in the photosensitive resin composition containing the phosphor (B) used for forming the above-described multicolor pattern is used. can do.

When a compound having a carboxyl group is contained, the compounding amount is preferably 0.01 to 30 parts by weight based on 100 parts by weight of the component (i).
When the amount is less than 0.01 part by weight, the effect of the storage stability of the photosensitive resin composition containing the electrode material (C) tends to decrease, and when the amount exceeds 30 parts by weight, the amount of the (C) electrode The sensitivity of the photosensitive resin composition containing the material tends to be insufficient.

The photosensitive resin composition containing the electrode material (C) used in forming the electrode pattern includes (i)
A dispersant can be added to improve the dispersion of the electrode material. As the dispersant, those similar to the dispersant which can be used in the photosensitive resin composition containing the phosphor (B) used for forming the multicolor pattern described above can be used.

When the dispersant is added, the amount thereof is not particularly limited, and is preferably 0.01 to 100 parts by weight based on 100 parts by weight of component (i). When the amount is less than 0.01 part by weight, the effect of adding the dispersant tends not to be exhibited, and when the amount exceeds 100 parts by weight,
Pattern formation accuracy ((C) A pattern made of a photosensitive resin composition containing an electrode material is dimensionally accurately adjusted after development.
(A property obtained in a desired shape) tends to decrease.

The photosensitive resin composition containing the electrode material (C) used in forming the electrode pattern may be used, after firing, in order to prevent (i) the electrode material from peeling from the PDP substrate. , A binder can be used. As the binder, those similar to the binder used in the photosensitive resin composition containing the phosphor (B) used for forming the above-described multicolor pattern can be used. .

When the binder is used, its amount is not particularly limited, and is preferably 0.01 to 100 parts by weight based on 100 parts by weight of the component (i).
The content is more preferably 0.05 to 50 parts by weight, and 0.1 to 50 parts by weight.
It is particularly preferred that the amount be 1 to 30 parts by weight. If the amount is less than 0.01 part by weight, (i) the binding effect of the electrode material tends not to be exhibited, and if it exceeds 100 parts by weight, the conductivity tends to decrease.

The photosensitive resin composition containing the electrode material (C) used in forming the electrode pattern includes:
Dyes, color formers, plasticizers, pigments, polymerization inhibitors, surface modifiers, stabilizers, adhesion promoters, thermosetting agents, and the like can be added as necessary.

The state formed at a predetermined position in the present invention may be, for example, a state where a multicolor pattern is formed on the inner surface of a concave portion formed by a barrier rib forming portion formed of a barrier rib precursor mixture formed on a substrate and a substrate. And a state in which an electrode pattern and a multicolor pattern are formed on the inner surface of the recess. FIG. 1 is a schematic view showing the inner surface of the concave portion formed by the barrier rib forming portion made of the barrier rib precursor mixture and the substrate. In FIG. 1, 1 is a substrate, 2b is a barrier rib forming portion made of a barrier rib precursor mixture, 3 is an inner surface of the concave portion, and the inner surface 3 of the concave portion is shown as a hatched portion. Further, FIG. 2 shows a state in which a multicolor pattern is formed on the inner surface of the recess formed by the barrier rib forming portion composed of the barrier rib precursor mixture formed on the substrate and the substrate. FIG. 3 shows a state in which an electrode pattern and a multicolor pattern are formed on the inner surface of the concave portion formed by the barrier rib forming portion and the substrate. FIG.
3 and 4, reference numeral 4 denotes a multicolor pattern, and reference numeral 5 denotes an electrode pattern.

The state in which the multicolor pattern is formed on the inner surface of the concave portion is as follows: (Ia) the step of forming an uncured barrier rib forming portion on the substrate; and (II) the curing of the uncured barrier rib forming portion. And (IIIb) a step of forming a multicolor pattern by forming each step of forming a barrier rib forming portion composed of a barrier rib precursor mixture.

In the state where the electrode pattern and the multicolor pattern are formed on the inner surface of the concave portion, (Ia) a step of forming an uncured barrier rib forming portion on a substrate;
I) a step of curing the uncured barrier rib forming portion to form a barrier rib forming portion made of a barrier rib precursor mixture, (IIIa) a step of forming an electrode pattern, and (III)
b) It can be obtained by performing each step of the step of forming a multicolor pattern. The method of manufacturing a back plate for a PDP according to the present invention includes the steps of:
And (IV) performing a firing step.

Hereinafter, each step of the method of manufacturing the back plate for PDP of the present invention will be described with reference to FIG.

FIG. 4 is a schematic view showing each step of the method of manufacturing the back plate for PDP of the present invention, and FIG.
FIG. 4 (II) shows a state where an uncured barrier rib forming portion 2a is formed using the barrier rib material (A).
FIG. 4 (IIIa) shows a state in which a barrier rib forming portion 2b made of a barrier rib precursor mixture is formed on the substrate 1.
FIG. 4B shows a state in which the electrode pattern 5 is formed on the inner surface of the concave portion in a state where the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed on the substrate 1. FIG. This shows a state in which an electrode pattern 5 and a multicolor pattern (a first color pattern 4a, a second color pattern 4b, and a third color pattern 4c) are formed on the inner surface of the concave portion where the barrier rib forming portion 2b made of the mixture is formed. 4 (IV), the baking is performed in the state of FIG. 4 (IIIb), and the fired barrier rib 2c, electrode pattern 7 and multicolor phosphor pattern (first color phosphor pattern 6a) are formed on the substrate 1. 2 shows a state in which the second color phosphor pattern 6b and the third color phosphor pattern 6c) are formed. Hereinafter, each step will be described.

[(Ia) Step of Forming Uncured Barrier Rib Forming Part on Substrate] FIG. 4I shows a state in which the uncured barrier rib forming part 2a is formed on the substrate 1. In the present invention, as a method of forming the uncured barrier rib forming portion 2a on the substrate 1, for example,
(D) Laminating a layer of the photosensitive resin composition, performing pattern exposure in a stripe shape with actinic rays through a photomask, removing the unexposed portions by development to form a resist pattern, and then forming the resist pattern. The (A) barrier rib material is buried between the pattern and the resist pattern, dried, (A) the surface of the barrier rib material and the resist pattern is polished and flattened, and after preliminary curing, the resist pattern is peeled off and removed. Then, a method of forming the uncured barrier rib forming portion 2a can be given.

On the substrate 1, an uncured barrier rib forming portion 2
The photosensitive resin composition (D) used in forming (a) is not particularly limited, and a negative type or a positive type can be used. For example, (e) a film-forming polymer, Examples include (f) a photopolymerizable unsaturated compound having an ethylenically unsaturated group, and (g) a compound containing a photoinitiator that generates free radicals upon irradiation with active light (negative type).

On the substrate 1, an uncured barrier rib forming portion 2
(D) Photopolymerizable polymer in (D) photosensitive resin composition used for forming a, (f) Photopolymerizable unsaturated compound having an ethylenically unsaturated group, and (g) Irradiation with active light Examples of the photoinitiator that generates free radicals include (B) a film-forming polymer in a photosensitive resin composition containing a phosphor (B), which is used when forming the above-described multicolor pattern, and (f) The same photopolymerizable unsaturated compound having an ethylenically unsaturated group and (g) a photoinitiator which generates free radicals upon irradiation with active light can be used.

An uncured barrier rib forming portion 2 is formed on a substrate 1.
The amount of the component (e) in the photosensitive resin composition (D) used in forming a is 10 to 90 parts by weight, based on 100 parts by weight of the total amount of the components (e) and (f). And more preferably 20 to 80 parts by weight. When the compounding amount is less than 10 parts by weight, when the photosensitive element is supplied in the form of a roll, the photosensitive element (D) exudes from the end of the roll (hereinafter referred to as edge fusion), and the photosensitive element When laminating, there is a tendency that the film is difficult to be unwound from a roll and the film-forming property tends to decrease, and when it exceeds 90 parts by weight, the sensitivity of the photosensitive resin composition (D) tends to be insufficient.

On the substrate 1, an uncured barrier rib forming portion 2
The compounding amount of the component (f) in the photosensitive resin composition (D) used for forming a is from 10 to 90 parts by weight based on 100 parts by weight of the total amount of the components (e) and (f). And more preferably 20 to 80 parts by weight. If the amount is less than 10 parts by weight, (D)
The sensitivity of the photosensitive resin composition tends to be insufficient, and 9
If it exceeds 0 parts by weight, the photocured product tends to become brittle,
Further, when the photosensitive element is used, the photosensitive resin composition (D) tends to exude from the end due to the flow, and the film-forming property tends to be reduced.

On the substrate 1, the uncured barrier rib forming portion 2
The amount of the component (g) in the photosensitive resin composition (D) used for forming a is 0.01 to 30 based on 100 parts by weight of the total amount of the components (e) and (f). It is preferable that the amount be 0.1 parts by weight, more preferably 0.1 to 20 parts by weight. If the amount is less than 0.01 parts by weight, the sensitivity of the photosensitive resin composition (D) tends to be insufficient, and if it exceeds 30 parts by weight, the exposed surface of the photosensitive resin composition (D) In this case, the absorption of actinic light increases, and the internal light curing tends to be insufficient.

Further, (D) the photosensitive resin composition includes a dye, a color former, a plasticizer, a pigment, a polymerization inhibitor, a surface modifier,
A stabilizer, an adhesion-imparting agent, a thermosetting agent, and the like can be added as needed.

(D) The method of laminating the layer of the photosensitive resin composition on the substrate 1 is not particularly limited.
(D) A method of dissolving or mixing each component of the photosensitive resin composition in a dissolvable or dispersible solvent to form a uniformly dispersed solution, directly applying the solution on the substrate 1, drying and laminating the solution. And (D) a method of laminating on the substrate 1 using a photosensitive element having a layer made of a photosensitive resin composition.

(D) The components of the photosensitive resin composition are dissolved or mixed in a solvent that can be dissolved or dispersed to form a uniformly dispersed solution, which is directly applied to the substrate 1 and dried. In the method of laminating, as the solvent capable of dissolving or dispersing the above components, for example, toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, γ-butyrolactone, N-methylpyrrolidone, dimethylformamide, tetramethyl Methyl sulfone, diethylene glycol dimethyl ether, diethylene glycol monobutyl ether, chloroform, methylene chloride, methyl alcohol,
Ethyl alcohol and the like can be mentioned. These are used alone or in combination of two or more.

As a coating method, a known method can be used. For example, a doctor blade coating method,
Meyer bar coating method, roll coating method,
Screen coating method, spinner coating method,
An ink jet coating method, a spray coating method, a dip coating method, a gravure coating method, a curtain coating method, or the like can be used.
As a drying method, drying can be performed using a known drying method, the drying temperature is preferably 40 to 130 ° C, and the drying time is preferably 10 to 90 minutes.

The thickness of the layer of the photosensitive resin composition (D) after drying is not particularly limited, but is preferably 50 to 500 μm, preferably 5 to 500 μm, according to the height of the barrier rib to be formed.
The thickness is more preferably 5 to 400 μm, and 60 to 30 μm.
It is particularly preferred that the thickness be 0 μm. This thickness is 50μ
If it is less than m, the height of barrier ribs described later tends to be insufficient, and if it exceeds 500 μm, pattern exposure tends to be difficult. In addition, in order to obtain a layer having a desired thickness of the photosensitive resin composition (D), the above-mentioned coating and drying may be performed at a time to form a layer having a desired thickness. By repeating coating and drying a plurality of times, a layer having a desired thickness can be obtained.

The photosensitive element used in the method of laminating the layer of the photosensitive resin composition on the substrate 1 using the photosensitive element having the photosensitive resin composition (D) is as described above. (D) Each component of the photosensitive resin composition is dissolved or mixed in a solvent that can be dissolved or dispersed to form a uniformly dispersed solution, and the solution is obtained by coating and drying on a support film. it can. As the solvent capable of dissolving or dispersing the above components, the same solvents as described above can be used.

Examples of the support film include chemically and thermally stable and flexible materials such as polyethylene terephthalate, polycarbonate, polyethylene and polypropylene. Terephthalate and polyethylene are preferred, and polyethylene terephthalate is more preferred. Since the support film must be able to be removed later from the layer of the photosensitive resin composition (D), the support film may have been subjected to a surface treatment so as not to be removable or may be made of a material. must not. The thickness of the support film is
5 to 100 μm, preferably 10 to 80 μm
Is more preferable.

As the method of applying the photosensitive resin composition (D) to the support film, known methods can be used, for example, knife coating, roll coating, spray coating, gravure coating, bar coating, and the like. A coating method, a curtain coating method and the like can be mentioned. (D) The drying temperature of the layer of the photosensitive resin composition is preferably from 60 to 130 ° C., and the drying time is preferably from 3 minutes to 1 hour.

The thickness of the layer (D) of the photosensitive resin composition of the photosensitive element is not particularly limited, but is preferably 5 to 250 μm, more preferably 10 to 220 μm, and more preferably 15 to 200 μm. It is particularly preferred that If the thickness is less than 5 μm, the number of laminations described later tends to increase to obtain a predetermined barrier rib height, and if it exceeds 250 μm, it is difficult to dry the layer of the photosensitive resin composition (D). Tend to be.

Further, a releasable cover film can be further laminated on the photosensitive resin composition layer (D) of the photosensitive element. As a cover film,
Polyethylene, polypropylene, polyethylene terephthalate, polycarbonate, etc., and the (D) photosensitivity of the cover film and the photosensitive element is compared with the adhesive force between the support film and the (D) layer of the photosensitive resin composition of the photosensitive element. Those having a smaller adhesive strength with the resin composition layer are preferred. The photosensitive element thus obtained can be stored in a roll.

As a method of laminating the layer of the photosensitive resin composition (D) on the substrate 1 using the photosensitive element, for example, the layer of the photosensitive element (D) of the photosensitive element is It is set on the substrate 1 and heated, pressed, etc. (D)
A method of laminating a layer of the photosensitive resin composition is exemplified.

The layer of the photosensitive resin composition (D) of the photosensitive element is placed on the substrate 1 and heated and pressed to form the (D).
As a method of laminating the layer of the photosensitive resin composition, for example, when a cover film is present on the photosensitive element, after removing the cover film, on the substrate 1,
(D) A method in which the layers of the photosensitive resin composition are heated and pressed so that the layers are in contact with each other. The heating temperature during thermocompression bonding is 1
The temperature is preferably from 0 to 130 ° C, more preferably from 20 to 120 ° C, and particularly preferably from 30 to 110 ° C. If the heating temperature is less than 10 ° C.,
There is a tendency that the layer of the photosensitive resin composition (D) does not sufficiently adhere to the substrate 1, and when the temperature exceeds 130 ° C., the layer of the photosensitive resin composition (D) tends to be thermally cured.

[0172] In addition, the pressing pressure during the heat pressing is a linear pressure.
It is preferably 50 to 1 × 10 ⁵ N / m, and 200 to 5
× 10 ⁴ N / m, more preferably 500 to 4 × 1
It is particularly preferable that the 0 ⁴ N / m. This pressure is 5
If it is less than 0 N / m, there is a tendency that the layer of the photosensitive resin composition (D) cannot be sufficiently adhered onto the substrate 1, and 1 × 10 ⁵ N / m
When it exceeds, the substrate 1 tends to be damaged. Here, as a method of setting the linear pressure to 5 × 10 ³ N / m, for example, using a laminator having a cylinder diameter of 40 mmφ, a thickness of 3 mm and a length of 1 mm
Using a substrate of 0 cm x 10 cm (square), the cylinder pressure of the laminator (normal pressure 1 atm is 0) is 2 kg / cm ²
By setting the linear pressure to 5 × 10 ³ N / m, using a laminator having a cylinder diameter of 40 mmφ and a thickness of 3 mm,
The cylinder pressure of laminator (normal pressure 1atm is 0) is 4kg / using a 20cm length x 20cm width (square) substrate.
A method in which the linear pressure is set to 5 × 10 ³ N / m by setting to cm ² is exemplified.

If the photosensitive element is heated as described above, it is not necessary to pre-heat the substrate 1;
(D) From the viewpoint of further improving the adhesion of the layer of the photosensitive resin composition, it is preferable to perform a pre-heat treatment on the substrate 1. Furthermore, for the same purpose, the above-mentioned operations of the press bonding and the heat pressing can be performed under reduced pressure of 5 × 10 ⁴ Pa or less. Further, from the viewpoint of further improving the adhesion of the layer of the photosensitive resin composition to the substrate 1 (D), the surface of the pressure roll is made of a material having high flexibility such as rubber and plastic. You can also. In addition, it is preferable that the thickness of the layer made of a material having high flexibility is 50 to 400 μm.

From the viewpoint of further improving the adhesion of the layer (D) of the photosensitive resin composition to the substrate 1, the photosensitive elements can be laminated while heating the photosensitive elements with a heating roll or the like. Also, after the lamination is completed in this way, 30
Heating can also be performed at a temperature in the range of ~ 150 ° C for 1 to 120 minutes. At this time, the support film can be removed as necessary. In the case where a layer of the photosensitive resin composition (D) is formed using the photosensitive element as described above, in order to obtain a desired barrier rib height, lamination of the photosensitive element is repeated a plurality of times. It is also possible to form a layer having a desired thickness, and it is also possible to laminate a plurality of photosensitive elements in advance and to laminate them at once using a photosensitive element having a desired thickness. . The thickness of the layer of the (D) photosensitive resin composition to be laminated is the same as in the case of directly applying and drying the (D) photosensitive resin composition described above.

After laminating the layer of the photosensitive resin composition (D) on the substrate 1 in this manner, the active layer is passed through a photomask through a photomask so that the active light is not transmitted to the portion where the barrier rib is to be formed. A light beam is radiated imagewise to expose in a pattern. As a method of irradiating actinic rays imagewise, for example, when a support film is provided on the (D) photosensitive resin composition layer laminated on the substrate 1, a negative film, A method of irradiating actinic rays imagewise through a photomask such as a negative glass, a positive film, and a positive glass may be used.

As the actinic ray, a known actinic light source can be used, and examples thereof include a carbon arc, a mercury vapor arc, a xenon arc, a flood lamp for photography, and a sun lamp. In this case, the active light beam is preferably a parallel light beam.

The irradiation amount of the actinic ray is not particularly limited.
5 to 10000 mJ / cm ² , preferably 7 to 50 mJ / cm ²
00 mJ / cm ² , more preferably 10 to 1000
Particularly preferred is mJ / cm ² . If the irradiation amount of the actinic ray is less than 5 mJ / cm ² , the photo-curing of the laminated (D) layer of the photosensitive resin composition tends to be insufficient. ) There is a tendency that the developer resistance of the layer of the photosensitive resin composition (the property that the remaining pattern which is not removed by development and is not attacked by development) is reduced. In addition, the irradiation amount of the actinic ray is 10,000 mJ
If it exceeds / cm ² , there is a tendency for light curing to take place to a portion that does not need to be light cured, and there is a tendency for unnecessary portions to remain after development described later.

After exposure in a pattern, unexposed portions are removed by development to form a resist. As a developing method, for example, if a support film is present on the layer of the photosensitive resin composition (D) after patternwise exposure, after removing the support film, the same alkali film as described above is used. Using a known developer such as an aqueous solution, an aqueous developer, or an organic solvent, a method of performing development by a known method such as spraying, rocking immersion, brushing, and scraping to remove an unexposed portion, and the like. . The pH of the aqueous alkali solution used for development is preferably 9 to 11.
Further, (D) the unexposed portion of the layer of the photosensitive resin composition can be removed by dry development.

The development time is preferably 1 to 10 times the minimum development time of the layer of the photosensitive resin composition (D), and the development temperature is preferably 10 to 60 ° C.
If the development time is less than the minimum development time, development residual tends to occur, and if the development time exceeds 10 times the minimum development time, (D) the photocured portion of the layer of the photosensitive resin composition tends to be removed. There is. When the developing temperature is lower than 10 ° C.,
When the temperature exceeds 60 ° C., the developer resistance tends to decrease.

Thus, the portion of the photosensitive resin composition (D) on the substrate 1 where the barrier rib is to be formed can be removed by development. Further, after development, in order to improve the adhesion and chemical resistance of a photoresist (resist pattern) formed in a pattern on the substrate 1,
Ultraviolet irradiation or heating by a high-pressure mercury lamp or the like can also be performed. At this time, the irradiation amount of ultraviolet rays is usually 0.2 to
It is 10 J / cm ² , and irradiation may be accompanied by heating. Further, the temperature during heating is preferably from 60 to 180 ° C, more preferably from 100 to 180 ° C. Further, the heating time is preferably set to 15 to 90 minutes. Irradiation and heating of these ultraviolet rays may be performed separately from irradiation and heating, and either may be performed first.

Next, the above-described barrier rib material (A) of the present invention is buried between the resist pattern on the substrate 1 thus obtained (gap portion) and dried. As a method of embedding the barrier rib material (A) between the resist patterns (gap portion) in the present invention, for example, printing by screen printing or the like can be mentioned. In addition, after embedding, the bubbles that were introduced when embedding,
Defoaming treatment can be performed under reduced pressure. The drying temperature is 40
To 80 ° C., and the drying time is 15 to 3
Preferably, it is 0 minutes. When (A) the barrier rib material is embedded in the gap portion and then drying is performed, the (A) barrier rib material embedded in the gap portion shrinks due to drying, and a gap is formed between the embedded (A) barrier rib material and the resist. In order to cause this, it is preferable to repeat (A) the embedding and drying of the barrier rib material 2 to 4 times.

Next, the surfaces of the (A) barrier rib material and the resist pattern embedded in the gap portion in this manner are polished so as to be flat using a sandpaper, a polishing machine, or the like. The resist pattern is peeled off and removed after the target is hardened.
The uncured barrier rib 2a can be formed.

Note that the (A) preliminary curing of the barrier rib material performed here means (II) a step of curing an uncured barrier rib forming portion to form a barrier rib forming portion made of a barrier rib precursor mixture, which will be described later. Are different,
When the resist pattern is stripped, curing is performed to such an extent that the uncured barrier rib forming portion 2a can be prevented from being destroyed. The heating temperature in the preliminary curing is 5
The temperature is preferably from 0 to 200 ° C, more preferably from 50 to 150 ° C. When the heating temperature is lower than 50 ° C., the uncured barrier rib forming portion 2a tends to be destroyed when the resist is stripped.
The patterned resist tends to deform,
The peelability of the resist tends to decrease. The heating time in the preliminary curing is preferably 1 to 15 minutes, more preferably 1 to 10 minutes. If the heating time is less than 1 minute, when the resist is stripped,
The uncured barrier rib forming portion 2a tends to be destroyed, and if it exceeds 15 minutes, the resist pattern tends to be deformed, and the peelability of the resist tends to decrease.

The barrier rib material (A) of the present invention described above may be buried between the resist pattern on the substrate 1 (gap portion), and then cooled after heating. In the case where the (A) barrier rib material contains a solvent, drying may be involved during the heating. As a method of embedding the barrier rib material (A) between the resist patterns (gap portion) in the present invention, for example, printing by screen printing or the like can be mentioned. After embedding,
Bubbles introduced during embedding can be subjected to defoaming treatment under reduced pressure. When heating is performed after (A) the barrier rib material is buried in the gap portion, the (A) barrier rib material buried in the gap portion shrinks by drying, and a gap is formed between the buried (A) barrier rib material and the resist. In order to cause this, it is preferable to repeat the (A) embedding and heating of the barrier rib material 2 to 4 times.

Here, the heating temperature for forming the barrier rib is preferably 50 to 300 ° C., and 60 to 2 ° C.
The temperature is more preferably set to 50 ° C, particularly preferably 70 to 220 ° C, and particularly preferably 80 to 200 ° C. If the heating temperature is lower than 50 ° C., the strength of the barrier rib forming portion 2b formed of the barrier rib precursor mixture tends to decrease, and the following (IIIa) step of forming an electrode pattern or (IIIb) forming a multicolor pattern In the process, the barrier rib forming portion 2b made of the barrier rib precursor mixture tends to be broken. Also, 30
If the temperature exceeds 0 ° C., the (c) organic binder in the (A) barrier rib material tends to decompose, and the resist pattern tends to be deformed.

The heating time for forming the barrier rib is preferably 5 minutes to 8 hours, and 30 minutes to 4 hours.
More preferably, it is time. If the heating time is less than 5 minutes, the strength of the barrier rib forming portion 2b composed of the barrier rib precursor mixture tends to decrease.
In the step of a) forming the electrode pattern or the step of forming the multicolor pattern (IIIb), the barrier rib forming portion 2b made of the barrier rib precursor mixture tends to be broken. If the time exceeds 8 hours, the organic binder (c) in the barrier rib material (A) tends to decompose, and the resist pattern tends to be deformed.

The heating for forming the barrier ribs is as follows.
(A) After the barrier rib material is embedded in the gap portion, the heat treatment may be performed, or (A) heating may be performed when the barrier rib material is kneaded, and the heated state may be embedded in the gap portion. In addition, when heating is performed at the time of kneading the (A) barrier rib material, the kneading of the (A) barrier rib material may be performed at a relatively low temperature, and after the embedding into the gap portion, heating may be performed at a high temperature. The cooling temperature when forming the barrier rib is a lower temperature than the heating temperature during the heating,
(A) T of the organic binder used for the barrier rib material (C)
There is no particular limitation as long as the temperature is less than g. The cooling method for forming the barrier ribs is not particularly limited, and may be quenched by a known method, or may be allowed to cool naturally, but the strength of the barrier rib forming portion 2b made of the barrier rib precursor mixture may be used. From the viewpoint of improving the temperature, it is preferable to cool by standing to cool naturally.

Next, the surfaces of the (A) barrier rib material and the resist pattern thus embedded in the gap portion are polished so as to be flat using a sandpaper, a polisher or the like, and then the resist pattern is peeled off. Remove. There is no particular limitation on the method for stripping the resist pattern. For example, using a known stripping solution such as an alkaline aqueous solution, an aqueous stripping solution, or an organic solvent stripping solution, a known method such as spraying, rocking immersion, brushing, and scraping is used. It can be performed by a method or the like. Note that the stripping time and the stripping temperature at this time can be appropriately adjusted so that the resist pattern can be stripped.

The method for removing the resist pattern is not particularly limited. For example, spraying, oscillating, and the like can be performed by using a known stripping solution such as an alkali aqueous solution, an aqueous stripping solution, and an organic solvent stripping solution as described above. It can be performed by a known method such as immersion, brushing, and scraping. The pH of the alkaline aqueous solution used for peeling was 10
It is preferable to make the above.

The stripping time is preferably from 1 to 200 minutes, and the stripping temperature is preferably from 10 to 80 ° C. If the peeling time is less than 1 minute, sufficient peeling does not tend to occur, and if it exceeds 200 minutes, the glass substrate and the uncured barrier rib forming portion 2a tend to erode. If the peeling temperature is less than 10 ° C., the peeling tends to be difficult, and if it exceeds 80 ° C., the substrate 1 and the uncured barrier rib forming portion 2a tend to be eroded.

In this way, as shown in FIG. 4I, the uncured barrier rib forming portion 2a can be formed on the substrate 1.

[(II) Step of curing the uncured barrier rib forming part to form a barrier rib forming part composed of a barrier rib precursor mixture] The uncured barrier rib forming part 2a of FIG. FIG. 4 (II) shows a state in which a barrier rib forming portion 2b made of a barrier rib precursor mixture is formed on the substrate 1. The curing in this step is different from the preliminary curing performed in the above-mentioned step (I), and is different from the preliminary curing performed in the step (I).
The strength of b is such that it can withstand without being destroyed in the step (IIIa) of forming an electrode pattern or the step (IIIb) of forming a multicolor pattern described later. As the curing method in this step, for example, thermal curing, light curing, electron beam curing, ultrasonic curing, high frequency curing and the like can be mentioned. From the viewpoint of workability, ease of material selection, etc., thermal curing is used. Is preferred.

The heating temperature in the case of performing thermosetting is from 50 to
The temperature is preferably 300 ° C., more preferably 60 to 250 ° C., particularly preferably 70 to 220 ° C., and particularly preferably 80 to 200 ° C. When the heating temperature is lower than 50 ° C., the curing tends to be insufficient, and in the step (IIIa) for forming an electrode pattern or the step (IIIb) for forming a multicolored pattern described below, a barrier rib precursor mixture is used. The barrier rib forming portion 2b tends to be broken. On the other hand, when the temperature exceeds 300 ° C., during the curing reaction, the (c) organic binder in the (A) barrier rib material tends to decompose, and the substrate 1 tends to shrink. The heating time when performing thermosetting is preferably 30 minutes to 8 hours, and more preferably 1 to 4 hours. If the heating time is less than 30 minutes, the curing tends to be insufficient.
In the step of forming a multicolor pattern, the barrier rib forming portion 2b made of the barrier rib precursor mixture tends to be broken. Also, if it exceeds 8 hours, during the curing reaction,
(A) The organic binder (c) in the barrier rib material tends to decompose, and the substrate 1 tends to shrink.

In FIG. 4 (II), the height of the barrier rib forming portion 2b formed of the barrier rib precursor mixture formed on the substrate 1 is preferably 50 to 500 μm,
It is more preferable that the thickness be 400 μm. Further, the width of the barrier rib forming portion 2b made of the barrier rib precursor mixture is
The thickness is preferably 20 to 300 μm. The interval between the barrier rib forming portions 2b made of the stripe-shaped barrier rib precursor mixture is preferably 30 to 1000 μm, and more preferably 50 to 500 μm.

[(IIIa) Step of Forming Electrode Pattern] A barrier rib forming portion 2b made of the barrier rib precursor mixture in the state of FIG. FIG. 4 (IIIa) shows a state in which the electrode pattern 5 is formed on the inner surface of the concave portion formed by the substrate 1. As a method for forming an electrode pattern, for example, the above-described (C) layer of the photosensitive resin composition (negative type) containing the electrode material is formed by forming a barrier rib forming portion 2b made of a barrier rib precursor mixture on the concave portion of the substrate 1 formed with the concave portion. A method of forming the electrode pattern 5 by laminating the inner surface so as to follow the inner surface, irradiating an actinic ray imagewise and removing unnecessary portions by development to remove the unnecessary portions. Further, instead of the photosensitive resin composition (negative type),
The same operation can be performed using a photosensitive resin composition (positive type).

(C) A method of laminating a layer of the photosensitive resin composition containing the electrode material so as to follow the inner surface of the concave portion of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed, for example, , On the substrate 1 described above,
In the same manner as the (D) photosensitive resin composition used when forming the uncured barrier rib forming portion 2a, directly apply,
Examples include a method of drying and laminating, and a method of laminating a photosensitive resin composition containing an electrode material (C) used when forming the electrode pattern 5 as a photosensitive element. When the photosensitive resin composition containing the electrode material (C) used when forming the electrode pattern 5 is used as a photosensitive element, the uncured barrier rib forming portion 2 a is formed on the substrate 1. It can be produced using the same method as in the case where the photosensitive resin composition (D) used in the formation is a photosensitive element.

In the photosensitive element of the photosensitive resin composition containing the electrode material (C), the thickness of the layer of the photosensitive resin composition containing the electrode material (C) is not particularly limited.
To 200 μm, preferably 10 to 120 μm
More preferably, it is particularly preferably 15 to 80 μm. If the thickness is less than 5 μm, the electrode pattern after the (IV) firing step described below tends to be thin, and if it exceeds 200 μm, the electrode pattern after the (IV) firing step becomes thick and the discharge space Tends to decrease.

The layer of the photosensitive resin composition containing the electrode material (C) of the photosensitive element comprising the photosensitive resin composition containing the electrode material (C) has a viscosity at 100 ° C. of 1 to 1 × 1.
It is preferably ^{0 9 Pa · sec, 2~1 ×} 10 8 Pa · sec
Is more preferable, the pressure is particularly preferably 5 to 1 × 10 ⁷ Pa · sec, and particularly preferably 10 to 1 × 10 ⁶ Pa · sec. The viscosity at 100 ° C is 1 Pa · s
If it is less than ec, the viscosity at room temperature becomes too low, and when the photosensitive element is used, the layer of the photosensitive resin composition containing the electrode material (C) tends to bleed from the edge due to the flow, resulting in film formation. Properties tend to decrease. Also, 1 ×
When it exceeds 10 ⁹ Pa · sec, the formability of the layer of the photosensitive resin composition containing the electrode material (C) on the inner surface of the concave portion of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed decreases. Tend.

On the layer of the photosensitive resin composition containing the (C) electrode material of the photosensitive element comprising the photosensitive resin composition containing the (C) electrode material, the above-mentioned substrate 1 was further placed. A peelable cover film that can be used for the photosensitive resin composition (D) used when forming the uncured barrier rib forming portion 2a can be laminated. The cover film is formed of a layer of the photosensitive resin composition containing the cover film and the electrode material (C) rather than an adhesive force between the support film and the layer of the photosensitive resin composition containing the electrode material (C). It is preferable that the adhesive strength with the adhesive be smaller. The photosensitive element comprising the photosensitive resin composition containing the electrode material (C) thus obtained can be stored in a roll shape.

Using a photosensitive element made of a photosensitive resin composition containing an electrode material (C), a layer of the photosensitive resin composition containing an electrode material (C) was formed on a barrier rib forming portion made of a barrier rib precursor mixture. As a method of laminating so as to follow the inner surface of the concave portion of the substrate 1 on which the substrate 2b is formed, for example, a layer of a photosensitive resin composition containing the electrode material (C) of the photosensitive element is formed by forming a barrier rib comprising a barrier rib precursor mixture. It is laminated on the uneven surface of the substrate 1 on which the formation portion 2b is formed, and follows the inner surface of the concave portion by embedding a layer of the photosensitive resin composition containing the electrode material (C) in the inner surface of the concave portion by heating, pressing or the like. A method of laminating, (E) a layer of a photosensitive resin composition containing an electrode material (C) is embedded in the recess by heating, pressure bonding, or the like using an embedding layer to follow the inner surface of the recess and laminate. Method, and the like.

A layer of the photosensitive resin composition containing the electrode material (C) of the photosensitive element is laminated on the uneven surface of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed, and heated and pressed. As a method of embedding a layer of a photosensitive resin composition containing an electrode material (C) inside the concave portion to follow the inner surface of the concave portion and laminate the photosensitive resin composition, for example, a cover film is present on the photosensitive element. In some cases, after removing the cover film, the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed.
(C) A method of thermocompression bonding so that the layer of the photosensitive resin composition containing the electrode material is in contact with the surface having irregularities. The heating temperature at the time of heat compression bonding is 10 to
The temperature is preferably 130 ° C, more preferably 20 to 120 ° C, particularly preferably 30 to 110 ° C. When the heating temperature is less than 10 ° C., the layer of the photosensitive resin composition containing the electrode material (C) sufficiently follows the inner surface of the concave portion on the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed. When the temperature exceeds 130 ° C., the layer of the photosensitive resin composition containing the electrode material (C) tends to be thermally cured.

[0202] The pressing pressure at the time of heating and pressing at this time is:
Preferably, the linear pressure is 50 to 1 × 10 ⁵ N / m.
It is more preferably 50 to 5 × 10 ⁴ N / m, and 500
It is particularly preferable to set to ４4 × 10 ⁴ N / m. When the pressure is less than 50 N / m, (C) the layer of the photosensitive resin composition containing the electrode material sufficiently follows the inner surface of the concave portion of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed ( If it exceeds 1 × 10 ⁵ N / m, the barrier rib forming portion 2b formed of the barrier rib precursor mixture on the substrate 1 tends to be broken.

When the photosensitive element is heated as described above, the barrier rib forming portion 2 composed of the barrier rib precursor mixture is formed.
Although it is not necessary to pre-heat the substrate 1 on which the b is formed, (C) the layer of the photosensitive resin composition containing the electrode material can be embedded in the inside of the concave portion, and can follow the inner surface of the concave portion. From the viewpoint of further improvement, it is preferable to perform a pre-heat treatment on the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed. Further, for the same purpose, 4 × 10 ³ P
The operations of the above-mentioned compression bonding and heat compression bonding can also be performed under the following reduced pressure. In addition, (C) the surface of the pressure-sensitive adhesive roll is preferably made of rubber, A flexible material such as plastic can also be used. Note that the thickness of the layer made of a material having high flexibility is preferably 200 to 400 μm.

(C) The photosensitive resin composition containing the electrode material is further improved in the embedding property of the layer of the photosensitive resin composition containing the electrode material into the inside of the concave portion, the followability to the inner surface of the concave portion, and the like. The elements can be laminated while being heated. After the completion of the lamination, 30 to 1
Heating can also be performed at 50 ° C. for 1 to 120 minutes. At this time, the support film can be removed as necessary.

(E) Using the buried layer, heating,
As a method of embedding a layer of the photosensitive resin composition containing the electrode material (C) inside the concave portion by pressing or the like to follow the inner surface of the concave portion and stack the layer, for example, a barrier rib forming portion 2b made of a barrier rib precursor mixture is used. On the uneven surface of the formed substrate 1, a layer of the photosensitive resin composition containing the electrode material (C) of the photosensitive element, and (E) a buried layer disposed thereon, A method in which the buried layer is heated and pressed is exemplified.

(E) Examples of the embedding layer include a layer of a thermoplastic resin. The thermoplastic resin is not particularly limited as long as it is softened at the temperature at the time of thermocompression bonding. ) A layer of the phosphor-containing photosensitive resin composition, (B) a film-imparting polymer, polyethylene, polypropylene, polyvinyl chloride, poly (e) usable for the phosphor-containing photosensitive resin composition. Vinyl acetate, polyvinylidene chloride, polystyrene, polyvinyl toluene, polyacrylate, polymethacrylate, copolymer of ethylene and vinyl acetate, copolymer of ethylene and acrylate, copolymer of vinyl chloride and vinyl acetate , A copolymer of styrene and acrylate or methacrylate, vinyl toluene and acrylate or Copolymers with acrylates, polyvinyl alcohol resins (hydrolysates of polyacrylates or polymethacrylates, hydrolysates of polyvinyl acetate, hydrolysates of copolymers of ethylene and vinyl acetate, A hydrolyzate of a copolymer of ethylene and acrylate, a hydrolyzate of a copolymer of vinyl chloride and vinyl acetate, a hydrolyzate of a copolymer of styrene and acrylate or methacrylate,
Hydrolysates of copolymers of vinyl toluene and acrylic or methacrylic esters, etc.), water-soluble salts of carboxyalkyl cellulose, water-soluble cellulose ethers, water-soluble salts of carboxyalkyl starch, polyvinylpyrrolidone, unsaturated carboxylic acids Examples thereof include a resin having a carboxyl group obtained by copolymerizing an acid and an unsaturated monomer copolymerizable therewith.

Further, the thermoplastic resin layer may contain a plasticizer from the viewpoint of improving workability and film properties. As the plasticizer, (f) an ethylenically unsaturated group that can be used in the photosensitive resin composition containing the phosphor (B) that constitutes the layer of the photosensitive resin composition containing the phosphor (B) described above. And a plasticizer that can be used in the photosensitive resin composition containing the phosphor (B) described above. Also, the layer of thermoplastic resin has
(B) Photo-initiation which generates free radicals by irradiation with active light (g) which can be used for the photosensitive resin composition containing the phosphor (B) constituting the layer of the photosensitive resin composition containing the phosphor An agent may be contained.

The compounding amount of the resin component contained in the thermoplastic resin layer is preferably from 10 to 100 parts by weight based on 100 parts by weight of the total amount of the resin component and the plasticizer component.
More preferably, the content is 20 to 100 parts by weight. If the blending amount is less than 10 parts by weight, when the film is formed, the thermoplastic resin tends to exude from the end due to the flow, or the film-forming property tends to be reduced.

The amount of the plasticizer component contained in the thermoplastic resin layer is such that the total amount of the resin component and the plasticizer component is 1%.
The amount of 00 parts by weight is preferably 0 to 90 parts by weight, more preferably 0 to 80 parts by weight. When the compounding amount exceeds 90 parts by weight, when a film is formed,
The flow tends to exude from the end portion, or decrease the film-forming property.

Further, it can be used for the photosensitive resin composition containing the phosphor (B) constituting the layer of the photosensitive resin composition containing the phosphor (B) contained in the layer of the thermoplastic resin. g) The amount of the photoinitiator component that generates free radicals upon irradiation with active light is preferably 0 to 30 parts by weight, preferably 0 to 20 parts by weight, based on 100 parts by weight of the total amount of the resin component and the plasticizer component. It is more preferred to be parts by weight. If the amount exceeds 30 parts by weight, the absorption of active light on the exposed surface increases, and the internal light curing tends to be insufficient.

In the developing step described later, the layer of the thermoplastic resin (C) containing the photosensitive resin composition and the layer of the thermoplastic resin were developed using the same developing solution. It is preferable to be able to reduce the number of steps. Those which can be developed with the same developer include those soluble in water or an aqueous alkaline solution.

Examples of the resin constituting the thermoplastic resin layer soluble in water or an aqueous alkali solution include polyvinyl alcohol resins, hydrolysates of polyacrylates or polymethacrylates, and hydrolysis of polyvinyl acetate. Product, hydrolyzate of copolymer of ethylene and vinyl acetate, hydrolyzate of copolymer of ethylene and acrylic acid ester, hydrolyzate of copolymer of vinyl chloride and vinyl acetate, styrene and acrylic acid Hydrolysates of copolymers with esters or methacrylates, such as hydrolysates of copolymers with vinyl toluene and acrylates or methacrylates, water-soluble salts of carboxyalkyl cellulose, water-soluble cellulose ethers, Water-soluble salts of carboxyalkyl starch, polyvinylpyrrolidone, unsaturated carboxylic acids A resin having a carboxyl group obtained by copolymerizing et copolymerizable unsaturated monomers.

Examples of the resin having a carboxyl group obtained by copolymerizing an unsaturated carboxylic acid and an unsaturated monomer copolymerizable therewith include, for example, unsaturated carboxylic acids (acrylic acid, methacrylic acid, maleic acid). , Fumaric acid, itaconic acid, etc.) and (B) a vinyl monomer which can be used for the film-imparting polymer constituting the layer of the photosensitive resin composition containing the phosphor (e). It is preferable to use the obtained vinyl copolymer or the like. The resin having a carboxyl group obtained by copolymerizing an unsaturated carboxylic acid and an unsaturated monomer copolymerizable therewith, preferably has a weight average molecular weight of 5,000 to 300,000, More preferably, it is 5,000 to 150,000. This weight average molecular weight is 5,0
If it is less than 00, the film formability and flexibility tend to decrease when the film is formed, and if it exceeds 300,000, the developability tends to decrease.

As a layer of a thermoplastic resin soluble in an aqueous alkaline solution, an unsaturated carboxylic acid and an unsaturated monomer copolymerizable therewith are copolymerized so as to be developable with various known developing solutions. Value (acid value (mg KOH / mg KOH /
g) can be adjusted as appropriate. For example, when developing with an aqueous alkali solution such as sodium carbonate or potassium carbonate, the acid value is preferably from 90 to 260. If the acid value is less than 90, development tends to be difficult, and if it exceeds 260, developer resistance tends to decrease. In the case of developing using an aqueous developer comprising water or an aqueous alkali solution and one or more organic solvents, the acid value is preferably from 16 to 260. When the acid value is less than 16, development tends to be difficult, and when it exceeds 260, developer resistance tends to decrease.

The thermoplastic resin layer is formed into a uniform solution by dissolving or mixing it in a solvent that dissolves the resin constituting the thermoplastic resin layer, and is coated on the above-mentioned support film by knife coating, roll coating, spray coating, or the like. It can be formed into a film by coating and drying using a known coating method such as a coating method, a gravure coating method, a bar coating method, and a curtain coating method. Examples of the solvent for dissolving the resin constituting the thermoplastic resin layer include the same solvents as described above.

The thickness of the layer of the thermoplastic resin is not particularly limited, and the thickness of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed can be embedded in the inside of the concave portion, and the followability to the inner surface of the concave portion can be achieved. In view of this, the thickness is preferably 10 to 200 μm, more preferably 20 to 100 μm. The thermoplastic resin layer has a viscosity at 100 ° C. of 1
１1 × 10 ⁹ Pa · sec, preferably 2-1 × 1 ⁹ Pa · sec.
0 ⁸ Pa · sec, more preferably 5 to 1 × 10 ⁷ Pa
Sec is particularly preferable, and 10 to 1 × 10 ⁶ Pa · se
Very preferably c. When the viscosity at 100 ° C. is less than 1 Pa · sec, when the viscosity at room temperature becomes too low to form a film, the thermoplastic resin layer tends to bleed out from the edge by the flow, and the film formability is reduced. Tends to decrease. On the other hand, if it exceeds 1 × 10 ⁹ Pa · sec, the layer of the photosensitive resin composition containing the electrode material (C) enters the inside of the concave portion on the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed. There is a tendency that the embedding property, the ability to follow the inner surface of the recess (formability), and the like are reduced.

Further, a releasable cover film can be further laminated on the thermoplastic resin layer. Examples of the cover film include polyethylene, polypropylene, polyethylene terephthalate, and polycarbonate.The adhesive force between the cover film and the thermoplastic resin layer is smaller than the adhesive force between the support film and the thermoplastic resin layer. Are preferred. The layer of the thermoplastic resin thus formed into a film can be stored in a roll shape.

(E) The photosensitive resin composition containing (C) the electrode material of the photosensitive element on the uneven surface of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed using the buried layer. The layer of the thermoplastic resin ((E) embedding layer) is placed thereon, and the layer of the thermoplastic resin is heat-pressed. For example, the method of (C) of the photosensitive element When the layer of the photosensitive resin composition containing the electrode material is laminated on the uneven surface of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed, and a support film is present thereon,
After removing the support film, (C) a layer of a thermoplastic resin (after removing the cover film, if the cover film is present) on the photosensitive resin composition layer containing the electrode material, A method of arranging and heat-pressing with a heating roll or the like can be used.

At this time, the heating temperature at the time of thermocompression bonding is 10 to 10.
The temperature is preferably 130 ° C, more preferably 20 to 120 ° C, particularly preferably 30 to 110 ° C. When the heating temperature is lower than 10 ° C., the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed of the layer of the photosensitive resin composition containing the electrode material (C)
Of the photosensitive resin composition containing the electrode material (C) tends to be thermally cured when the temperature exceeds 130 ° C. There is. Further, the pressing pressure at the time of heat pressing at this time is preferably a linear pressure of 50 to 1 × 10 ⁵ N / m,
-5 × 10 ⁴ N / m, more preferably 500-4
It is particularly preferred to be × 10 ⁴ N / m. When the pressure is less than 50 N / m, (C) the layer of the photosensitive resin composition containing the electrode material can be embedded in the recess of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed. The ability to follow the inner surface of the recess tends to decrease,
If it exceeds 1 × 10 ⁵ N / m, the barrier rib forming portion 2b formed on the substrate 1 and formed of the barrier rib precursor mixture tends to be broken.

When the thermoplastic resin layer is heated as described above, the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture formed by laminating the (C) layer of the photosensitive resin composition containing the electrode material is formed. Although it is not necessary to perform a pre-heat treatment, (C) the layer of the photosensitive resin composition containing the electrode material is further improved in the embedding property in the inside of the recess, the followability to the inner surface of the recess, and the like. C) It is preferable to pre-heat the substrate 1 on which the barrier rib forming portion 2b formed of the barrier rib precursor mixture in which the layers of the photosensitive resin composition containing the electrode material are laminated. The preheating temperature at this time is 30 to 13
0 ° C., and the preheating time is 0.5
It is preferable to set it to 20 minutes. In addition, (C) the surface of the pressure-sensitive adhesive roll is preferably made of rubber, A flexible material such as plastic can also be used.
The thickness of the layer made of a material having a high flexibility is 200 to 40.
Preferably, it is 0 μm.

Further, for the same purpose, the above-mentioned compression bonding and heating compression bonding can be performed under reduced pressure of 4 × 10 ³ Pa or less. After the lamination is completed, 30 to 150 ° C
Can be heated for 1 to 120 minutes. At this time, if a support film exists on the thermoplastic resin layer, the support film may be removed as necessary. In this manner, (C) the layer of the photosensitive resin composition containing the electrode material is uniformly laminated (formed) on the inner surface of the concave portion of the substrate 1 on which the barrier rib forming portion 2b formed of the barrier rib precursor mixture is formed. can do.

When using a photosensitive element having a layer of a photosensitive resin composition containing an (E) buried layer such as a layer of a thermoplastic resin and a (C) electrode material, the (C) electrode material is used. The layer of the photosensitive resin composition and the layer of the thermoplastic resin are contained in the barrier rib forming portion 2 in which the layer of the photosensitive resin composition containing the electrode material (C) is formed of a barrier rib precursor mixture.
The two layers can also be laminated while being heated and pressed at the same time so as to be in contact with the uneven surface of the substrate 1 on which b is formed. As the thermocompression bonding conditions when the two layers are thermocompressed at the same time, the conditions for thermocompression bonding of the thermoplastic resin layer can be used. In addition, a (E) embedded layer such as a layer of a thermoplastic resin and a layer of a photosensitive resin composition containing an (C) electrode material are integrated with a photosensitive element. Two layers can be simultaneously heated and pressed so that the layer of the photosensitive resin composition to be contained is in contact with the surface of the substrate having irregularities, and the layers can be laminated.

In this manner, the layer of the photosensitive resin composition containing the electrode material (C) is made to uniformly follow the inner surface of the concave portion on the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture has been formed. After the lamination, an actinic ray is irradiated imagewise through a photomask having a transmission width substantially equal to the electrode width for forming a pattern.

The method of irradiating actinic rays imagewise includes:
For example, a layer of the photosensitive resin composition containing the electrode material (C) is uniformly laminated on the inner surface of the concave portion of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed. Examples include a method of irradiating actinic rays imagewise through a photomask such as a negative film, a negative glass, a positive film, and a positive glass. At this time,
(C) On the layer of the photosensitive resin composition containing the electrode material,
When the (E) buried layer is present, the actinic ray can be imagewise irradiated after the (E) buried layer is removed or removed by development, and the (E) buried layer transmits the actinic ray. If the material is a material, it is also possible to imagewise irradiate the active ray with a photomask on the (E) buried layer while the (E) buried layer is present.
Incidentally, when (E) the actinic ray is imagewise irradiated in the presence of the buried layer, and when the (E) buried layer has photosensitivity, the buried layer of the irradiated part is also (C) of the irradiated part. ) Photocuring is performed in the same manner as the layer of the photosensitive resin composition containing the electrode material.

As the actinic ray, on the substrate 1 described above,
When forming the uncured barrier rib forming portion 2a (D)
The active light source used in irradiating the layer of the photosensitive resin composition imagewise can be used. In this case, it is preferable to use a parallel ray as the active ray.

The irradiation amount of the actinic ray is not particularly limited.
5 to 10000 mJ / cm ² , preferably 7 to 50 mJ / cm ²
More preferably to mJ / cm ² but is less than 5 mJ / cm ^2, an insufficient photocuring of the layer of the photosensitive resin composition containing the formed electrode width of the object (C) electrode material In the later-described development, the resistance of the layer of the photosensitive resin composition containing the electrode material (C) formed to the target electrode width in the later-described development (resistance to the remaining pattern without being removed by development) However, there is a tendency that properties which are not affected by development) are reduced. Further, when the irradiation amount of the actinic ray exceeds 10,000 mJ / cm ² , the photocuring tends to be performed to a portion other than the target electrode width to be photocured, and an unnecessary portion tends to remain after development described later.

After imagewise irradiation with actinic rays, unnecessary portions are removed by development. As the developing method, for example, (C)
If the support film is present on the layer of the photosensitive resin composition containing the electrode material, the support film is removed ((C)
On the layer of the photosensitive resin composition containing the electrode material, (E)
If a buried layer is present and (E) the support film is present in the buried layer, after removing it), using a known developer, spraying, rocking immersion, brushing, scraping, etc. A method in which development is performed by a known method to remove unnecessary portions, and the like can be given.

In the case where (E) the buried layer is present on the layer of the photosensitive resin composition containing the electrode material,
When removing unnecessary portions, first, water, an alkaline aqueous solution, a semi-solvent aqueous solution, a semi-solvent alkaline aqueous solution, an organic solvent, or the like that does not dissolve the layer of the photosensitive resin composition containing the electrode material is used. (E) After removing the buried layer by dissolving, the unnecessary portion of the layer of the photosensitive resin composition containing the electrode material (C) may be removed using a developing solution.
When the layer of the photosensitive resin composition containing the electrode material and the (E) embedding layer can be developed using the same developer, the (C) electrode material is removed using the developer. Unnecessary portions of the layer of the photosensitive resin composition to be contained and unnecessary portions of the (E) buried layer can be removed in one step. Also,
As a method for removing unnecessary portions of the layer of the photosensitive resin composition containing the electrode material (C) and unnecessary portions of the (E) embedded layer,
Dry development can be performed individually or in one step.

The (C) layer of the photosensitive resin composition containing the electrode material other than the formed electrode width and the (E) buried layer are unnecessary portions, and need to be removed by development. The developing time and the developing temperature at this time can be appropriately adjusted so that unnecessary portions can be removed. Also,
On the layer of the photosensitive resin composition containing the electrode material having the electrode width (C) having the width of the electrode irradiated with actinic rays, a photosensitive (E) embedding layer (photocured (E) embedding layer) is provided. If present, after this development, the photocured (E) buried layer needs to be removed.

The developing time for removing unnecessary portions is as follows:
The minimum development time of the layer of the photosensitive resin composition containing the electrode material ((C)) is applied to the layer of the photosensitive resin composition containing the electrode material. After embedding inside, the time is preferably 1 to 10 times (the shortest time during which the layer of the photosensitive resin composition containing the electrode material is removed by development), and the development temperature is 10 to 10 times. Preferably, the temperature is 60 ° C. When the development time is less than the minimum development time, the undeveloped portion tends to occur, and when the development time exceeds 10 times the minimum development time, (C) the necessary portion of the layer of the photosensitive resin composition containing the electrode material is required. Tends to be removed. Also, when the developing temperature is
If the temperature is lower than 10 ° C., the developability tends to decrease.
If it exceeds, the developer resistance tends to decrease.

As the developing solution, (D) the developing solution used for developing the layer of the photosensitive resin composition when forming the uncured barrier rib forming portion 2a on the substrate 1 is used. Can be.

Thus, the layer (unnecessary portion) of the photosensitive resin composition containing the electrode material (C) formed in the area other than the area where the electrode is to be formed ((C) the photosensitive resin composition containing the electrode material) (E) If the buried layer is present on the layer of the resin composition, the (E) buried layer is removed by development, and the photo-cured (C) is formed in a region where an electrode is to be formed.
A layer of the photosensitive resin composition containing the electrode material is formed.

After the development, the adhesiveness of the photocured (C) layer of the photosensitive resin composition containing the electrode material on the inner surface of the concave portion of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture was formed, For the purpose of improving chemical resistance and the like, ultraviolet irradiation or heating using a high-pressure mercury lamp or the like can be performed. At this time, the irradiation amount of the ultraviolet ray is usually set at 0.
² to 10 J / cm ² , and irradiation may be accompanied by heating. Further, the temperature during heating is preferably from 60 to 180 ° C, more preferably from 100 to 180 ° C. Further, the heating time is preferably set to 15 to 90 minutes. Irradiation and heating of these ultraviolet rays may be performed separately from irradiation and heating, and either may be performed first.

In the case where the development is carried out using a developer containing a base such as an alkaline aqueous solution, the base remaining after the development can be removed by neutralization. For the neutralization, both an inorganic acid and an organic acid can be used, but usually an organic acid is used.

Examples of the organic acid include saturated fatty acids, unsaturated fatty acids, aliphatic dibasic acids, aromatic dibasic acids, aliphatic tribasic acids, and aromatic tribasic acids.
For example, formic acid, acetic acid, chloroacetic acid, dichloroacetic acid, trichloroacetic acid, propionic acid, oxalic acid, malonic acid, methylmalonic acid, ethylmalonic acid, succinic acid, methylsuccinic acid, adipic acid, methyladipate, pimelic acid, Examples include suberic acid, azelaic acid, sebacic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, and citric acid.

Of these, oxalic acid, malonic acid, methylmalonic acid, ethylmalonic acid, succinic acid, methylsuccinic acid, citric acid, etc. are preferred because of their high neutralizing effect. Malonic acid, citric acid and the like are more preferred. These are used alone or in combination of two or more. After neutralization, it can be washed with water.

By performing the above-described steps from lamination to development, the electrode pattern 5 can be formed on the inner surface of the concave portion of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture has been formed. The thickness of the electrode pattern 5 that can be formed in this manner is usually 1 to 20 μm.
And the width of the electrode formed in a stripe shape is
Usually, it is 50 to 150 μm.

[(IIIb) Step of Forming Multicolor Pattern] A barrier rib forming portion 2b made of a barrier rib precursor mixture was formed on the substrate 1, and an electrode pattern 5 was formed.
FIG. 4 (IIIa) shows a state in which a multicolor pattern is formed on the inner surface of the recess formed by the barrier rib forming portion 2b made of the barrier rib precursor mixture and the substrate 1 in the state of FIG.
b). In FIG. 4 (IIIb), 4a is a pattern of the first color, 4b is a pattern of the second color,
c is the pattern of the third color. In the case where the substrate 1 on which the electrodes are formed in advance is used, the above (III)
a) It is not necessary to perform a step of forming an electrode pattern, and this step (IIIb) is performed after the step (II).
The step of forming a multicolor pattern is performed.

As a method of forming a multicolor pattern,
For example, using each of the photosensitive resin compositions (negative type) containing a phosphor that emits red, green, and blue one color each, the above-described photosensitive resin composition containing the phosphor (B) is used. The layer is laminated so as to follow the inner surface of the concave portion in the state of FIG. A method of forming a multicolor pattern containing phosphors that emit red, green, and blue light, and the like can be given. Also,
The same can be done by using a photosensitive resin composition (positive type) instead of the photosensitive resin composition (negative type).

(B) The method of laminating the layer of the photosensitive resin composition containing the phosphor so as to follow the inner surface of the concave portion in the state of FIG. A method of directly applying, drying and laminating in the same manner as the photosensitive resin composition (D) used when forming the uncured barrier rib forming portion 2a, forming the multicolor pattern described above. A method of laminating a photosensitive resin composition containing a phosphor (B) used in the above process as a photosensitive element. In the case where the photosensitive resin composition containing the phosphor (B) used for forming a multicolor pattern is used as a photosensitive element, the above-described substrate 1 is used.
It can be manufactured using the same method as when the photosensitive element (D) used when forming the uncured barrier rib forming portion 2a is used as a photosensitive element.

In the photosensitive element of the photosensitive resin composition containing the phosphor (B), the thickness of the layer of the photosensitive resin composition containing the phosphor (B) is not particularly limited.
0 to 200 μm, preferably 20 to 120 μm
m, more preferably 30 to 80 μm. If the thickness is less than 10 μm, the phosphor pattern after the (IV) firing step described below tends to be thin, and the luminous efficiency tends to decrease. There is a tendency that the body pattern becomes thicker, the emission area of the phosphor screen is reduced, and the emission efficiency is reduced.

The layer of the photosensitive resin composition containing the phosphor (B) of the photosensitive element composed of the photosensitive resin composition containing the phosphor (B) has a viscosity at 100 ° C. of 1 to 1 × 1.
It is preferably ^{0 9 Pa · sec, 2~1 ×} 10 8 Pa · sec
Is more preferable, the pressure is particularly preferably 5 to 1 × 10 ⁷ Pa · sec, and particularly preferably 10 to 1 × 10 ⁶ Pa · sec. The viscosity at 100 ° C is 1 Pa · s
If it is less than ec, the viscosity at room temperature becomes too low, and when the photosensitive element is used, the layer of the photosensitive resin composition containing the phosphor (B) tends to bleed from the edge due to the flow, and the film is formed. Properties tend to decrease. Also, 1 ×
If it exceeds 10 ⁹ Pa · sec, the formability of the layer of the photosensitive resin composition containing the phosphor (B) on the inner surface of the concave portion on the substrate 1 tends to decrease.

On the layer of the photosensitive resin composition containing the phosphor (B) of the photosensitive element composed of the photosensitive resin composition containing the phosphor (B), on the substrate 1 described above, A peelable cover film that can be used when forming the uncured barrier rib forming portion 2a can be laminated. The cover film is composed of a support film and (B)
The adhesive strength between the cover film and the (B) layer of the photosensitive resin composition containing the phosphor may be smaller than the adhesive strength between the layer of the photosensitive resin composition containing the phosphor. preferable. The photosensitive element composed of the photosensitive resin composition containing the phosphor (B) thus obtained can be stored in a roll shape.

By using a photosensitive element composed of the photosensitive resin composition containing the phosphor (B), the layer of the photosensitive resin composition containing the phosphor (B) was formed as shown in FIG.
As a method of laminating so as to follow the inner surface of the concave portion in the state of a), for example, a layer of a photosensitive resin composition containing a phosphor (B) of a photosensitive element is formed by forming a barrier rib forming portion made of a barrier rib precursor mixture. A method of laminating on the substrate 1 on which 2b is formed, and following the inner surface of the recess by embedding a layer of the photosensitive resin composition containing the phosphor (B) in the inner surface of the recess by heating, pressure bonding, or the like; E) A method of embedding a layer of the photosensitive resin composition containing the phosphor (B) into the inner surface of the concave portion by heating, pressure bonding, or the like using an embedding layer to follow the inner surface of the concave portion and stack the layer.

A layer of the photosensitive resin composition containing the phosphor (B) of the photosensitive element is laminated on the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed, and the concave portion is formed by heating, pressing or the like. As a method of embedding a layer of the photosensitive resin composition containing the phosphor (B) on the inner surface and following the inner surface of the concave portion and laminating, the (C) electrode used when forming the electrode pattern 5 described above is used. The layers can be laminated in the same manner as the method of laminating the layers of the photosensitive resin composition containing the material. In addition, various conditions such as a heating temperature and a pressing pressure during the heating and pressing at this time can be performed in the same manner as in the method of laminating the layer of the photosensitive resin composition containing the electrode material (C).

Further, (E) heating by using the buried layer
As a method of embedding a layer of the photosensitive resin composition containing the phosphor (B) into the inner surface of the concave portion by pressing or the like to follow the inner surface of the concave portion and stack the layers, for example, a barrier rib forming portion 2b made of a barrier rib precursor mixture is formed. The (B) layer of the photosensitive resin composition containing the phosphor of the photosensitive element is embedded (E) in a state where the (E) embedding layer is disposed thereon on the uneven surface of the substrate 1 thus obtained. For example, a method in which the layer is heated and pressed.

(E) Using a buried layer, a layer of a photosensitive resin composition containing a phosphor (B) is buried in the recess by heating, pressure bonding, etc., so as to follow the inner surface of the recess and laminate. Can be laminated in the same manner as the method of laminating the layer of the photosensitive resin composition containing the electrode material (C) used in forming the electrode pattern 5 described above. Various conditions such as (E) the burying layer used at this time, the heating temperature at the time of thermocompression bonding, and the compression pressure are also shown in (C).
It can be carried out in the same manner as the method of laminating a layer of the photosensitive resin composition containing the electrode material.

In this manner, the layer of the photosensitive resin composition containing the phosphor (B) uniformly follows the inner surface of the concave portion on the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed. After lamination, actinic light is imagewise irradiated through a photomask having a transmission width substantially equal to the opening width of the concave portion for forming a pattern.

As a method of irradiating actinic rays imagewise,
For example, on the state where the layer of the photosensitive resin composition containing the phosphor (B) is uniformly laminated on the inner surface of the concave portion of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed, Examples include a method of irradiating actinic rays imagewise through a photomask such as a negative film, a negative glass, a positive film, and a positive glass. At this time,
(B) On the layer of the photosensitive resin composition containing the phosphor,
When the (E) buried layer is present, the actinic ray can be imagewise irradiated after the (E) buried layer is removed or removed by development, and the (E) buried layer transmits the actinic ray. If the material is a material, it is also possible to imagewise irradiate the active ray with a photomask on the (E) buried layer while the (E) buried layer is present.
In the case where (E) the active layer is imagewise irradiated in the presence of the buried layer, if the (E) buried layer has photosensitivity, the buried layer of the irradiated part is also ( B) Photocuring is performed similarly to the layer of the photosensitive resin composition containing the phosphor.

As the actinic ray, on the substrate 1 described above,
When forming the uncured barrier rib forming portion 2a, (D)
The active light source used in irradiating the layer of the photosensitive resin composition imagewise can be used. The active light at this time may be either a parallel light or a scattered light, or both may be used in one step, or both may be used separately in two stages. If both are used separately in two stages, either may be performed first. In addition, a laser beam can be used as the active light beam. In the case of using the laser beam, the exposure can be performed without using a photomask by narrowing the focus.

The irradiation amount of the actinic ray is not particularly limited.
5 to 10000 mJ / cm ² , preferably 7 to 50 mJ / cm ²
It is more preferable to be 00 mJ / cm ² , but if it is less than 5 mJ / cm ² , the photocuring of the layer of the (B) phosphor-containing photosensitive resin composition formed on the inner surface of the target recess is insufficient. In the later-described development, the layer of the photosensitive resin composition containing the phosphor (B) formed on the inner surface of the target concave portion has a developing solution resistance (a pattern remaining without being removed by development and (The part that does not become damaged by development) tends to decrease. In addition, the irradiation amount of the actinic ray is 10,000 mJ / c
If it exceeds m ² , photocuring tends to occur to portions other than the inner surface of the concave portion desired to be photocured, and unnecessary portions tend to remain after development described later.

After imagewise irradiation with actinic rays, unnecessary portions are removed by development. As the developing method, for example, (B)
When the support film is present on the layer of the photosensitive resin composition containing the phosphor, after removing the support film ((B)
On the layer of the photosensitive resin composition containing the phosphor, (E)
If a buried layer is present and (E) the support film is present in the buried layer, after removing it), using a known developer, spraying, rocking immersion, brushing, scraping, etc. A method in which development is performed by a known method to remove unnecessary portions, and the like can be given.

In the case where the (E) buried layer is present on the layer of the photosensitive resin composition containing the phosphor (B), when removing unnecessary portions, first, the phosphor (B) is removed. After removing the embedding layer by dissolution using water, an alkali aqueous solution, a semi-solvent aqueous solution, a semi-solvent alkaline aqueous solution, an organic solvent or the like which does not dissolve the layer of the photosensitive resin composition to be contained, using a developing solution And (B) unnecessary portions of the layer of the photosensitive resin composition containing the phosphor may be removed,
When the (B) layer of the photosensitive resin composition containing the phosphor and the (E) burying layer can be developed by using the same developer, the developer is used to obtain (B) Unnecessary portions of the layer of the photosensitive resin composition containing the phosphor and unnecessary portions of the (E) buried layer can be removed in one step. Further, as a method of removing the unnecessary portion of the layer of the photosensitive resin composition containing the phosphor (B) and the unnecessary portion of the burying layer (E), the method may be performed by dry development alone or in one step. it can.

(B) Except for the inner surface of the formed concave portion,
A layer of a photosensitive resin composition containing a phosphor ((B) a layer of a photosensitive resin composition containing a phosphor, if an (E) buried layer is present, the (E) buried layer or (E) When the buried layer has photosensitivity,
The (E) buried layer other than the inner surface of the concave portion is an unnecessary portion,
This needs to be removed by development. The developing time and the developing temperature at this time can be appropriately adjusted so that unnecessary portions can be removed.

The developing time for removing unnecessary portions is as follows:
Minimum development time of the layer of the photosensitive resin composition containing the phosphor ((B) The inner surface of the concave portion of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture is formed by changing the layer of the photosensitive resin composition containing the phosphor After embedding in (B), the time is preferably 1 to 10 times (the shortest time during which the layer of the photosensitive resin composition containing the phosphor is removed by development), and the development temperature is 10 to 60 times. It is preferably set to ° C.
If the development time is less than the minimum development time, the undeveloped portion tends to occur. If the development time exceeds 10 times the minimum development time, (B) the required portion of the layer of the photosensitive resin composition containing the phosphor is required. Tends to be removed. When the developing temperature is 1
If the temperature is lower than 0 ° C., the developability tends to decrease, and if the temperature exceeds 60 ° C., the developer resistance tends to decrease.

As the developing solution, (D) the developing solution used for developing the layer of the photosensitive resin composition when forming the uncured barrier rib forming portion 2a on the substrate 1 is used. Can be.

The layer (unnecessary portion) of the (B) phosphor-containing photosensitive resin composition thus formed other than on the inner surface of the intended concave portion ((B) the photosensitive resin composition containing the phosphor) In the case where the (E) buried layer is present on the layer of (a), the buried layer or (E) the buried layer other than the inner surface of the intended concave portion if the (E) buried layer is photosensitive. Is removed by development, and on the inner surface of the target concave portion, the layer of the photosensitive resin composition containing the phosphor (B) after the photocuring (the layer of the photosensitive resin composition containing the phosphor (B)) In the case where a (E) buried layer having photosensitivity is present, a photo-cured (E) buried layer is also included.

After the development, the adhesiveness of the photocured (B) layer of the photosensitive resin composition containing the phosphor on the inner surface of the concave portion of the substrate 1 on which the barrier rib forming portion 2b made of the barrier rib precursor mixture was formed, For the purpose of improving chemical resistance and the like, ultraviolet irradiation or heating using a high-pressure mercury lamp or the like can be performed. At this time, the irradiation amount of the ultraviolet ray is usually set at 0.
² to 10 J / cm ² , and irradiation may be accompanied by heating. Further, the temperature during heating is preferably from 60 to 180 ° C, more preferably from 100 to 180 ° C. Further, the heating time is preferably set to 15 to 90 minutes. Irradiation and heating of these ultraviolet rays may be performed separately from irradiation and heating, and either may be performed first.

The above-described steps from lamination to development are repeated for each color to produce red, green and blue (B)
A multicolor pattern composed of a layer of a photosensitive resin composition containing a phosphor can be formed. In addition, when forming a multicolor pattern, the layer of the photosensitive resin composition containing the phosphor (B), which contains each phosphor that emits red, blue, and green independently, is red, blue, and green. Can be performed in any order.

In the case where the development is carried out using an alkali substance, the alkali substance remaining after the development can be removed by neutralization. As the acid used for the neutralization, the same acid as the acid that can be used for the neutralization when forming the electrode pattern 5 described above can be used.

In each of the above-described steps from lamination to development, depending on the exposure, development conditions, misalignment of the photomask, etc., the photosensitive material containing the phosphor (B) at the top of the barrier rib forming portion 2b made of the barrier rib precursor mixture. In some cases, a layer of the conductive resin composition remains. In this case, after the formation of the multicolor pattern, the layer of the cured (B) phosphor-containing photosensitive resin composition on the top of the barrier rib forming portion 2b made of the barrier rib precursor mixture can be completely removed by polishing or the like. Assuming such a case, after forming the multicolor pattern and before the firing step (IV) described later, iron oxide, chromium oxide, copper oxide, and the like are formed on the top of the barrier rib forming portion 2b made of the barrier rib precursor mixture. After applying or printing a black inorganic material paste containing a black inorganic pigment such as a low melting point glass frit or the like or forming a black stripe using a photosensitive element containing a black inorganic material, performing a baking step (IV) described later. Can also.

FIGS. 8, 9 and 10 are schematic diagrams showing an example of the multicolor pattern thus obtained. FIG. 8 is a schematic view of an example of the multicolor pattern of the substrate 1 on which the barrier rib forming portion 2b made of the stripe-shaped barrier rib precursor mixture is formed.
FIG. 3 is a schematic view of an example of a multicolor pattern of the substrate 1 on which a barrier rib forming portion 2b made of a lattice-like barrier rib precursor mixture is formed. 8, 9, and 10,
R is a layer of the photosensitive resin composition containing the phosphor (B) that emits red, G is a layer of the photosensitive resin composition containing the phosphor that emits green (B), and B is This is a layer of a photosensitive resin composition containing a phosphor (B) that emits blue light.

[(IV) Firing Step] (IIIa) After forming the electrode pattern and (IIIb) forming the multicolor pattern, (IV) firing step is performed to obtain the electrode pattern and the multicolor pattern. FIG. 4 (IV) shows a state in which the phosphor pattern was formed. In FIG. 4 (IV), 2c
Is a barrier rib after firing, and in FIG.
a is a first color phosphor pattern, 6b is a second color phosphor pattern, 6c is a third color phosphor pattern, and 7 is an electrode pattern.

The firing method is not particularly limited, and a known firing method can be used. In this firing step, the barrier rib forming portion 2 made of the barrier rib precursor mixture is used.
(c) Unnecessary components other than the electrode material and the binder in the electrode pattern 5 and (h) Unnecessary components other than the phosphor and the binder in the multicolor pattern are collectively included in (b). Removed by firing, the fired barrier ribs 2c on the substrate 1,
The electrode pattern 7 and the multicolor phosphor pattern can be formed.

The firing temperature during firing is preferably from 400 to 800 ° C., and more preferably from 450 to 600 ° C. If the firing temperature is lower than 400 ° C., unnecessary components other than (c) the organic binder in the barrier rib forming portion 2b made of the barrier rib precursor mixture, (i) the electrode material and the binder in the electrode pattern 5, and in the multicolor pattern (H) Unnecessary components other than the phosphor and the binder tend not to be removed. When the temperature exceeds 800 ° C., the (i) electrode material in the electrode pattern 5 and the (h) phosphor in the multicolor pattern are reduced. It tends to deteriorate, and the substrate 1 tends to deform.
The firing time during firing is preferably 15 minutes to 28 hours, more preferably 1 to 15 hours, and 3 to
It is particularly preferable to set it to 10 hours. This firing time is 1
In the case of less than 5 minutes, (c) the organic binder in the barrier rib forming portion 2b made of the barrier rib precursor mixture, (i) unnecessary components other than the electrode material and the binder in the electrode pattern 5, and (h) in the multicolor pattern Unnecessary components other than the phosphor and the binder tend not to be removed. If the time exceeds 28 hours, the electrode material (i) in the electrode pattern 5 and the phosphor (h) in the multicolor pattern tend to deteriorate. Yes, and the substrate 1 tends to be deformed.

The rate of temperature rise during firing is preferably from 0.5 to 50 ° C./min, more preferably from 1 to 45 ° C./min. The firing time at the highest temperature is 3-12.
The time is preferably 0 minutes, more preferably 5 to 90 minutes. Also, before reaching the maximum firing temperature, 3
It is preferable to provide a step of maintaining the temperature between 00 and 450 ° C., and the holding time is preferably 5 to 100 minutes.

In the firing step (IV) in the present invention, firing can be performed while blowing air or nitrogen gas, if necessary. The flow rate of air or nitrogen gas when firing is performed while blowing air or nitrogen gas is preferably 0 to 300 liter / min.
It is more preferable to be ~ 200 l / min. Further, the flow rate and type of air or nitrogen gas can be appropriately selected according to the temperature at the time of firing.

In addition, the P described above with reference to FIGS.
FIGS. 5 to 7 show the production of the back plate for PDP in another mode different from the production of the back plate for DP. FIG. 5 is a schematic cross-sectional view showing the inner surface 3 of the concave portion of the substrate 1 ′ having the concave portion to be the discharge space, and FIG. 6 is a diagram showing the inner surface 3 of the concave portion of the substrate 1 ′ having the concave portion to be the discharge space. FIG. 7 is a schematic cross-sectional view showing a state where an electrode pattern 5 and a multicolor pattern 4 are formed, and FIG. 7 is a schematic cross-sectional view showing an example of each step of a method for manufacturing the plasma display panel back plate. FIG. 5 shows the features of this alternative embodiment. In the manufacture of the back panel for PDP described with reference to FIGS. 1 to 4, as shown in FIG. This is another one, in which barrier ribs are formed on a substrate by using a barrier rib material. On the other hand, in the production of the PDP back plate according to FIGS. The barrier rib and the substrate do not need to be initially different from each other. The substrate 1 ′ having a concave portion to be a discharge space in FIG. 5 is, for example, a substrate formed by etching a glass plate to form a concave portion. A substrate integrally formed of the same material is preferably used.

FIG. 4 (IIIa) in the manufacture of the PDP back plate according to FIGS. 1 to 4 corresponds to FIG. 7 (I) in the manufacture of the PDP back plate according to FIGS. FIG.
(IIIb) corresponds to FIG. 7 (II), and FIG. 4 (IV) corresponds to FIG.
Corresponding to II), in the production of the back plate for a PDP according to FIGS.
It can be carried out in the same manner as in the production of the back plate for DP.

[0270]

The present invention will be described below with reference to examples. Production Example 1 [(A) Preparation of barrier rib material (A-1)] The inorganic material and the organic material shown in Table 1 were mixed at room temperature to obtain (A) a barrier rib material (A-1).

[0271]

[Table 1]

Production Example 2 [(A) Preparation of Barrier Rib Material (A-2)] The inorganic materials and organic materials shown in Table 2 were mixed at room temperature to obtain (A) a barrier rib material (A-2).

[0273]

[Table 2]

Production Example 3 [(A) Preparation of Barrier Rib Material (A-3)] The inorganic materials and organic materials shown in Table 3 were mixed at room temperature to obtain (A) a barrier rib material (A-3).

[0275]

[Table 3]

Production Example 4 [(A) Preparation of Barrier Rib Material (A-4)] Of the inorganic materials and organic materials shown in Table 4, only the organic material was heated to 60 ° C. to dissolve it. Add and mix,
After cooling to room temperature, (A) a barrier rib material (A-4) was obtained.

[0277]

[Table 4]

Production Example 5 [(A) Production of Barrier Rib Material (A-5)] Only the inorganic and organic materials shown in Table 5 were heated to 60 ° C. and dissolved, and then the inorganic material was added and mixed. After cooling to room temperature and mixing at room temperature, (A) a barrier rib material (A-5) was obtained.

[0279]

[Table 5]

Production Example 6 [(e) Preparation of Solution of Film-Providing Polymer (e-1)] A flask equipped with a stirrer, a reflux condenser, an inert gas inlet, and a thermometer is shown in Table 6. Charged, the temperature was raised to 80 ° C. in a nitrogen gas atmosphere, and the temperature shown in Table 6 was dropped uniformly over 4 hours while maintaining the reaction temperature at 80 ° C. ± 2 ° C. After the dropwise addition, stirring was continued at 80 ° C. ± 2 ° C. for 6 hours to obtain a solution of a film-imparting polymer (e-1) having a weight average molecular weight of 80,000 and an acid value of 130 mgKOH / g.

[0281]

[Table 6]

Production Example 7 [(e) Preparation of Solution of Film-Providing Polymer (e-2)] A flask equipped with a stirrer, a reflux condenser, an inert gas inlet, and a thermometer is shown in Table 7. Charged, the temperature was raised to 80 ° C. in a nitrogen gas atmosphere, and the contents shown in Table 7 were dropped uniformly over 4 hours while maintaining the reaction temperature at 80 ± 2 ° C. After the dropwise addition, stirring was continued at 80 ° C. ± 2 ° C. for 6 hours, and the weight average molecular weight was 80,000 and the acid value (solid content) was 114.
A solution of the (e) film-imparting polymer (e-2) in mgKOH / g (NV = 45.5% by weight) was obtained.

[0283]

[Table 7]

Production Example 8 [(e) Preparation of Solution of Film-Providing Polymer (e-3)] In a flask equipped with a stirrer, a reflux condenser, an inert gas inlet and a thermometer, the solvent shown in Table 8 was added. And heated to 80 ° C. under a nitrogen gas atmosphere, and the reaction temperature was raised to 80 ± 2 ° C.
, A mixed solution having the composition shown in Table 8 was dropped uniformly over 4 hours. After the dropwise addition, stirring was continued at 80 ° C. ± 2 ° C. for 6 hours, and a solution (NV) of a (e) film-imparting polymer (e-3) having a weight average molecular weight of 30,000 and an acid value (solid content) of 157 mgKOH / g was used. = 45.5% by weight).

[0285]

[Table 8]

Production Example 9 [(e) Preparation of Solution of Film-Providing Polymer (e-4)] The solvent shown in Table 9 was placed in a flask equipped with a stirrer, a reflux condenser, an inert gas inlet, and a thermometer. And heated to 80 ° C. under a nitrogen gas atmosphere, and the reaction temperature was raised to 80 ± 2 ° C.
, A mixed solution having the composition shown in Table 9 was dropped uniformly over 4 hours. After the dropwise addition, stirring was continued at 80 ° C. ± 2 ° C. for 6 hours, and a solution (NV) of the (e) film-imparting polymer (e-4) having a weight average molecular weight of 150,000 and an acid value (solid content) of 144 mgKOH / g (NV) = 45.5% by weight).

[0287]

[Table 9]

Production Example 10 [(D) Production of photosensitive element (D-1) containing layer of photosensitive resin composition] The materials shown in Tables 10 and 11 were mixed for 15 minutes using a mechanical stirrer. A photosensitive resin composition solution was prepared.

[0289]

[Table 10]

[0290]

[Table 11]

The obtained solution was uniformly coated on a polyethylene terephthalate film having a thickness of 20 μm.
The solvent was removed by drying with a hot air convection dryer at ~ 110 ° C for 10 minutes to form (D) a layer of the photosensitive resin composition. The thickness of the obtained layer of the photosensitive resin composition after drying is (D)
It was 50 μm. Next, a polyethylene film having a thickness of 25 μm is laminated as a cover film on the layer of the photosensitive resin composition (D), and the photosensitive element (D-1) including the layer of the photosensitive resin composition (D) Was prepared.

Production Example 11 [(B) Production of photosensitive element (B-1) having layer of photosensitive resin composition containing phosphor] The materials shown in Table 12 were mixed for 15 minutes using a Raikai machine. Then, a solution of the photosensitive resin composition containing the red (B) phosphor was prepared.

[0293]

[Table 12]

The obtained solution was uniformly coated on a polyethylene terephthalate film having a thickness of 50 μm.
The solvent was removed by drying with a hot air convection dryer at 〜110 ° C. for 10 minutes to form a layer of the photosensitive resin composition containing the red (B) phosphor. The thickness of the obtained layer of the photosensitive resin composition containing the red (B) phosphor is 50 μm after drying.
m. Next, a polyethylene film having a thickness of 25 μm is laminated as a cover film on the layer of the photosensitive resin composition containing the red (B) phosphor,
A photosensitive element (B-1) having a layer of a photosensitive resin composition containing a red (B) phosphor was obtained.

Production Example 12 [(B) Production of photosensitive element (B-2) having layer of photosensitive resin composition containing phosphor] The materials shown in Table 13 were mixed for 15 minutes using a raikai machine. Then, a solution of a photosensitive resin composition containing a green phosphor (B) was prepared.

[0296]

[Table 13]

Thereafter, in the same manner as in Production Example 11, a layer of the photosensitive resin composition containing the green (B) phosphor was formed, and the photosensitive resin composition containing the green (B) phosphor was formed. A photosensitive element (B-2) having a layer was obtained. The thickness of the obtained layer of the photosensitive resin composition containing the green phosphor (B) after drying was 50 μm.

Production Example 13 [(B) Production of photosensitive element (B-3) having layer of photosensitive resin composition containing phosphor] The materials shown in Table 14 were mixed for 15 minutes using a Raikai machine. Then, a solution of a photosensitive resin composition containing a blue (B) phosphor was prepared.

[0299]

[Table 14]

Thereafter, in the same manner as in Production Example 11, a layer of the photosensitive resin composition containing the blue (B) phosphor was formed, and the layer of the photosensitive resin composition containing the blue (B) phosphor was formed. A photosensitive element (B-3) having a layer was obtained. The thickness of the obtained layer of the photosensitive resin composition containing the blue (B) phosphor was 50 μm after drying.

Production Example 14 [(B) Production of photosensitive element (B-4) containing layer of photosensitive resin composition containing phosphor] The materials shown in Table 15 were mixed for 15 minutes using a Raikai machine. And red (B)
A mixed solution of a photosensitive resin composition containing a phosphor was prepared.

[0302]

[Table 15]

The obtained mixed solution was uniformly applied on a polyethylene terephthalate film having a thickness of 50 μm.
The solvent was removed by drying with a hot air convection dryer at 80 to 110 ° C. for 10 minutes to form a layer of a photosensitive resin composition containing a red (B) phosphor. The thickness of the obtained layer of the photosensitive resin composition containing the red (B) phosphor is 5 after drying.
It was 0 μm. Then, a 25 μm-thick polyethylene film is laminated as a cover film on the layer of the photosensitive resin composition containing the red (B) phosphor, to thereby form a photosensitive resin containing the red (B) phosphor. A photosensitive element (B-4) including the composition layer was prepared.

Production Example 15 [(B) Production of photosensitive element (B-5) containing layer of photosensitive resin composition containing phosphor] Materials shown in Table 16 were mixed for 15 minutes using a raikai machine. And blue (B)
A mixed solution of a photosensitive resin composition containing a phosphor was prepared.

[0305]

[Table 16]

The obtained mixed solution was uniformly applied on a polyethylene terephthalate film having a thickness of 50 μm,
The solvent was removed by drying with a hot air convection dryer at 80 to 110 ° C. for 10 minutes to form a layer of a photosensitive resin composition containing a blue (B) phosphor. The dried layer thickness of the photosensitive resin composition containing the blue (B) phosphor is 5
It was 0 μm. Next, a 25 μm-thick polyethylene film is laminated as a cover film on the layer of the photosensitive resin composition containing the blue (B) phosphor, to thereby form a photosensitive resin containing the blue (B) phosphor. A photosensitive element (B-5) including the composition layer was produced.

Production Example 16 [(B) Production of photosensitive element (B-6) containing layer of photosensitive resin composition containing phosphor] Materials shown in Table 17 were mixed for 15 minutes using a Raikai machine. Then, a photosensitive resin composition suspension containing a green phosphor was prepared.

[0308]

[Table 17]

The obtained mixed solution was uniformly coated on a polyethylene terephthalate film having a thickness of 50 μm,
The solvent was removed by drying with a hot air convection dryer at 80 to 110 ° C. for 10 minutes to form a layer of a photosensitive resin composition containing a green phosphor (B). The thickness of the obtained layer of the photosensitive resin composition containing the green (B) phosphor after drying is 5
It was 0 μm. Next, a polyethylene film having a thickness of 25 μm is laminated as a cover film on the layer of the photosensitive resin composition containing the green (B) phosphor to form a photosensitive resin containing the green (B) phosphor. A photosensitive element (B-6) including the composition layer was produced.

Production Example 17 [(C) Production of photosensitive element (C-1) containing layer of photosensitive resin composition containing electrode material] The materials shown in Table 18 were mixed for 15 minutes using a Raikai machine. Then, a mixed solution of the photosensitive resin composition containing (C) the electrode material was prepared.

[0311]

[Table 18]

The obtained mixed solution was uniformly applied on a polyethylene terephthalate film having a thickness of 20 μm,
The solvent was removed by drying with a hot air convection dryer at 80 to 110 ° C. for 10 minutes to form (C) a layer of a photosensitive resin composition containing an electrode material. The thickness of the obtained layer of the photosensitive resin composition containing the electrode material (C) after drying was 40 μm. Next, a polyethylene film having a thickness of 25 μm is laminated as a cover film on the layer of the photosensitive resin composition containing the electrode material to form a layer of the photosensitive resin composition containing the electrode material. The photosensitive element (C-1) containing was produced.

Production Example 18 [(D) Production of photosensitive element (D-2) having layer of photosensitive resin composition] The materials shown in Table 19 were mixed for 15 minutes using a stirrer, and A solution of the photosensitive resin composition was prepared.

[0314]

[Table 19]

The obtained solution was uniformly coated on a polyethylene terephthalate film having a thickness of 20 μm.
The solvent was removed by drying with a hot air convection dryer at ~ 110 ° C for 10 minutes to form (D) a layer of the photosensitive resin composition. The thickness of the obtained layer of the photosensitive resin composition after drying is (D)
It was 50 μm. Next, a polyethylene film having a thickness of 25 μm is laminated as a cover film on the (D) photosensitive resin composition layer, and the photosensitive element (D-2) having the (D) photosensitive resin composition layer I got

Production Example 19 [(D) Production of Film (D-3) Containing Thermoplastic Resin Layer] A resin solution composed of the materials shown in
And dried with a hot air convection dryer at 80 to 110 ° C. for 10 minutes to remove distilled water, thereby forming a layer of a thermoplastic resin (D). The thickness of the obtained thermoplastic resin layer after drying was 45 μm.

[0317]

[Table 20]

Next, on the thermoplastic resin layer (D),
A polyethylene film having a thickness of 25 μm was laminated as a cover film to prepare (D) a film (D-3) including a thermoplastic resin layer.

Production Example 20 [(E) Production of film (E-1) having embedded layer (thermoplastic resin layer)] A resin solution composed of the materials shown in Table 21 was placed on a polyethylene terephthalate film having a thickness of 20 μm. The mixture was uniformly coated and dried with a hot air convection dryer at 80 to 110 ° C. for 10 minutes to remove distilled water, thereby forming (E) an embedding layer (thermoplastic resin layer). Obtained (E)
The thickness of the embedded layer (thermoplastic resin layer) after drying is 60
μm.

[0320]

[Table 21]

Next, a polyethylene film having a thickness of 25 μm was laminated as a cover film on the (E) embedded layer (thermoplastic resin layer), and a film (E) having an (E) embedded layer (thermoplastic resin layer) was laminated thereon. -1) was obtained.

Production Example 21 [(E) Production of film (E-2) having embedded layer (thermoplastic resin layer)] The materials shown in Table 22 were mixed for 30 minutes using a mechanical stirrer while heating to 60 ° C. Then, a solution of a thermoplastic resin was prepared.

[0323]

[Table 22]

The obtained solution was uniformly coated on a polyethylene terephthalate film having a thickness of 20 μm.
The solvent was removed by drying with a hot air convection dryer at 110 ° C. for 10 minutes to form (E) an embedded layer (thermoplastic resin layer). The thickness of the obtained (E) embedded layer (thermoplastic resin layer) after drying was 60 μm. Next, a polyethylene film having a thickness of 25 μm is laminated as a cover film on the (E) embedding layer (thermoplastic resin layer) to form a photosensitive element (E-) including the (E) embedding layer (thermoplastic resin layer). 2) was produced.

Example 1 [(I) Step of forming uncured barrier rib forming portion on substrate] Stripe-shaped silver electrodes having a width of 80 μm and a thickness of 15 μm were provided at regular intervals in parallel with the longitudinal direction of the substrate. The photosensitive element (D-2) having the layer of the photosensitive resin composition (D) obtained in Production Example 18 on a transparent substrate for a back plate having a 40-inch diagonal (length 61 cm, width 81 cm). The cover film is peeled off, and the heating temperature is 80 ° C. and the pressure is 1 × 10 ⁴ N / m so that the layer of the photosensitive resin composition (D) is in contact with the substrate surface.
(Linear pressure), the substrate was fed three times at a feed speed of 3 m / min, and the thickness of the (D) photosensitive resin composition layer on the substrate was reduced to 15
It was set to 0 μm.

Next, on the layer of the photosensitive resin composition (D), the opening width between the barrier ribs (exposed portion) was 150 μm and the width of the barrier rib (light shielding portion) was 70 μm in parallel with the longitudinal direction of the substrate. And a stripe mask designed so that the center of the opening width between the barrier ribs becomes the center of the electrode width, and HMW-590 manufactured by Oak Manufacturing Co., Ltd.
UV irradiation of 120 mJ / cm ² was performed using a parallel light exposure machine. After standing at room temperature for 15 minutes, a 1% by weight aqueous solution of sodium carbonate was spray-developed at 30 ° C. for 70 seconds to form a resist pattern other than the position where the barrier rib was formed. After the development, the film was dried at 80 ° C. for 10 minutes, and irradiated with 3 J / cm ² of ultraviolet light using a Toshiba ultraviolet light irradiation device manufactured by Toshiba Electric Materials Co., Ltd.

Next, at the position (between the resist pattern and the resist pattern) of the substrate on which the resist pattern was formed other than the position where the barrier rib was formed, the (A) barrier rib material (A) obtained in Production Example 1 was obtained.
After embedding -1) by screen printing, performing vacuum degassing, and drying at 70 ° C. for 20 minutes. This embedding ~
In order to minimize the loss to the drying at the time of final filling, the drying was repeated four times, and then the barrier rib material (A-1) and (A-1) embedded using a # 800 sandpaper were used. The surface of the resist pattern was polished so as to be flat, and preliminarily cured at 150 ° C. for 10 minutes. Next, (A) the substrate in which the barrier rib material (A-1) is embedded is immersed in a 5% by weight aqueous solution of sodium hydroxide at 60 ° C. for 20 minutes to remove the resist pattern, and then sufficiently washed with water. A substrate on which uncured barrier rib forming portions were formed was obtained.

[(II) Step of Curing Uncured Barrier Rib Forming Section to Form Barrier Rib Forming Section Made of Barrier Rib Precursor Mixture] Next, the substrate having the uncured barrier rib forming section formed thereon is heated at 180 ° C. for 2 hours. Heating is performed to thermally cure the uncured barrier rib forming portion, and a barrier rib forming portion made of a stripe-shaped barrier rib precursor mixture having an opening width between the barrier ribs of 150 μm, a barrier rib width of 70 μm, and a barrier rib height of 150 μm is formed on the substrate. Formed.

[(IIIb) Step of Forming a Multicolor Pattern] On the side of the substrate on which the barrier rib forming portion made of the barrier rib precursor mixture obtained above was formed, the side where the barrier rib forming portion made of the barrier rib precursor mixture was formed, B) The photosensitive element (B-1) having the layer of the photosensitive resin composition containing the phosphor (B) obtained in Production Example 11 so that the layer of the photosensitive resin composition containing the phosphor is in contact with the layer. ), While using a vacuum laminator (trade name: VLM-1 type, manufactured by Hitachi Chemical Co., Ltd.), the heating temperature is 30 ° C., the pressure is 4000 Pa or less, and the pressure is 2.5 × 10 ^3. N / m (linear pressure), substrate feeding speed 0.5m /
Laminated in minutes.

Next, the polyethylene terephthalate film of the photosensitive element (B-1) having a layer of the photosensitive resin composition containing the phosphor (B) is peeled off, and the photosensitive resin composition containing the phosphor (B) is removed. Production Example 2 on the product layer
The laminator (trade name: HLM-3000, manufactured by Hitachi Chemical Co., Ltd.) was peeled from the film (E-1) having the (E) embedded layer (thermoplastic resin layer) obtained in Step 0, while peeling off the polyethylene film. The heating temperature is 110 ° C.
Lamination is performed at a compression pressure of 5 × 10 ³ N / m (linear pressure) and a substrate feeding speed of 0.5 m / min. (B) The layer of the photosensitive resin composition containing the phosphor follows the inner surface of the concave portion. It was formed so that.

Next, (E) On the polyethylene terephthalate film of the film (E-1) having the burying layer (thermoplastic resin layer), the same as the opening width formed at every three ribs between the barrier ribs. The center of the active light transmission width of the photomask is positioned at the center of the opening width between the barrier ribs at the center of the back plate on which the barrier ribs having a diagonal width of 40 inches are formed. Then, adhere closely so that it is parallel to the stripe direction,
Active light was imagewise irradiated at 100 mJ / cm ² using an HMW-201GX type exposure machine manufactured by Oak Manufacturing Co., Ltd.

Next, after irradiation with actinic rays, the film was left at room temperature for 1 hour, and then the polyethylene terephthalate film (E-1) having an embedded layer (thermoplastic resin layer) (E) was peeled off, and 1% by weight of carbon dioxide was removed. Spray development was performed at 30 ° C. for 120 seconds using an aqueous sodium solution. After development
It was dried at 80 ° C. for 10 minutes, irradiated with 3 J / cm ² ultraviolet rays using a Toshiba ultraviolet ray irradiator manufactured by Toshiba Electric Materials Co., Ltd., and further heated at 150 ° C. for 1 hour.

The above pattern was formed by the photosensitive element (B-2) having a layer of the photosensitive resin composition containing the phosphor (B) obtained in Production Example 12 and the photosensitive element (B-2) obtained in Production Example 13. (B) The same applies to the photosensitive element (B-3) having the layer of the photosensitive resin composition containing the phosphor, and the substrate on which the barrier rib forming portion made of the barrier rib precursor mixture is formed has red, A multicolor pattern was formed in which stripes of a layer of the photosensitive resin composition containing green and blue phosphors were repeatedly formed on the inner surface of the concave portion.

[(IV) Firing Step] The substrate on which the barrier rib forming portion composed of the barrier rib precursor mixture obtained above and the multicolor pattern are formed is heated from room temperature to 500 ° C.
The temperature is raised at a rate of 2 ° C./min.
For 1 hour to remove the organic binder in the barrier rib forming portion composed of the barrier rib precursor mixture and unnecessary components other than the phosphor and the binder in the multicolor pattern at a time. A barrier rib and a multicolor phosphor pattern were formed to obtain a back plate for a plasma display panel.

[Evaluation of Plasma Display Panel Back Plate] The cross section of the plasma display panel back plate obtained above was visually observed with a stereoscopic microscope and an SEM, and the phosphor pattern formed between the barrier ribs was formed. As shown in FIG. 11, the center A of the plasma display panel back plate is set as a reference position, and each value 3 cm inside from the end of the plasma display panel back plate 5 is evaluated as nine evaluation positions (center a, center- Upper b, center-lower c,
Left-center d, left-top e, left-bottom f, right-center g, right-top h, right-bottom i) were set, and the evaluation positions were evaluated. The results are shown in Table 23. FIG. 11 is a schematic diagram showing the evaluation positions of the plasma display panel back plate, and 8 is the plasma display panel back plate, a to
i is each evaluation position. The evaluation criteria are as follows. ：: The phosphor pattern is uniformly and symmetrically formed on the inner surface of the concave portion (the barrier rib wall surface and the substrate surface) of the PDP substrate. X: The phosphor pattern is not formed uniformly and symmetrically on the inner surface of the concave portion (the barrier rib wall surface and the substrate surface) of the PDP substrate.

Example 2 In Example 1, the (A) barrier rib material (A-1) obtained in Production Example 1 was replaced with the (A) barrier rib material (A-2) obtained in Production Example 2. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Example 1. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 23.

Example 3 In Example 1, the (A) barrier rib material (A-1) obtained in Production Example 1 was replaced with the (A) barrier rib material (A-3) obtained in Production Example 3. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Example 1. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 23.

Example 4 In Example 1, [(I) the step of forming an uncured barrier rib forming portion on a substrate] and [(II) the uncured barrier rib forming portion were cured to form a barrier rib precursor mixture. The step of forming a barrier rib forming portion] is described below [(I
b) (A) Step of Forming a Barrier Rib Preform Mixture on a Substrate by Forming a Barrier Rib Preform on a Substrate by Heating and Cooling the Barrier Rib Material].
A back plate for a plasma display panel was obtained in the same manner as in Example 1 except that the conditions were changed from (1) to (A-4).

[(Ib) (A) Step of Forming Barrier Rib Forming Section Made of Barrier Rib Precursor Mixture on Substrate by Heating and Cooling (A) Barrier Rib Material] A striped silver electrode having a width of 80 μm and a thickness of 15 μm is formed on a substrate. Production Example 18 was applied to a transparent substrate for a back plate having a diagonal length of 40 inches (length 61 cm, width 81 cm) provided at regular intervals in parallel with the vertical direction of the substrate.
Peeling off the cover film of the photosensitive element (D-2) having the layer of the photosensitive resin composition (D) obtained in
(D) such that the layer of the photosensitive resin composition is in contact with the substrate surface,
Heating temperature is 80 ° C, pressing pressure is 1 × 10 ⁴ N / m (linear pressure),
The substrate was laminated three times at a feed speed of 3 m / min, and the thickness of the layer of the photosensitive resin composition (D) on the substrate was set to 150 μm.

Next, on the layer of the photosensitive resin composition (D), the opening width between the barrier ribs (exposed portion) was 150 μm and the width of the barrier rib (light shielding portion) was 70 μm in parallel with the longitudinal direction of the substrate. And a stripe mask designed so that the center of the opening width between the barrier ribs becomes the center of the electrode width, and HMW-590 manufactured by Oak Manufacturing Co., Ltd.
UV irradiation of 120 mJ / cm ² was performed using a parallel light exposure machine. After standing at room temperature for 15 minutes, a 1% by weight aqueous solution of sodium carbonate was spray-developed at 30 ° C. for 70 seconds to form a resist pattern other than the position where the barrier rib was formed. After the development, the film was dried at 80 ° C. for 10 minutes, and irradiated with 3 J / cm ² of ultraviolet light using a Toshiba ultraviolet light irradiation device manufactured by Toshiba Electric Materials Co., Ltd.

Next, at the position (between the resist pattern and the resist pattern) of the substrate on which the resist pattern was formed other than the position where the barrier rib was formed, the (A) barrier rib material (A) obtained in Production Example 4 was obtained.
-4) is embedded by screen printing, vacuum degassed, and then heated at 70 ° C. for 20 minutes. This embedding ~
Heating was repeated four times in order to minimize the loss to drying at the time of final filling, heated at 180 ° C. for 2 hours, and then allowed to cool to room temperature by natural standing. Then
Embedded using No. 800 sandpaper (A)
The surfaces of the barrier rib material (A-4) and the resist pattern were polished so as to be flat.

Next, (A) Barrier rib material (A-4)
Is immersed in a 5% by weight aqueous solution of sodium hydroxide at 60 ° C. for 20 minutes to remove the resist pattern, and then sufficiently washed with water. The opening width between the barrier ribs is 150 μm, and the width of the barrier ribs is 150 μm. A barrier rib forming portion made of a stripe-shaped barrier rib precursor mixture having a barrier rib height of 70 μm and a barrier rib height of 150 μm was formed on the substrate. The obtained back plate for plasma display panel is
Evaluation was performed in the same manner as in Example 1, and the results are shown in Table 23.

Example 5 In Example 4, the (A) barrier rib material (A-4) obtained in Production Example 4 was replaced with the (A) barrier rib material (A-5) obtained in Production Example 5. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Example 4. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 23.

Example 6 [Production of a substrate having a concave portion to be a discharge space] A photosensitive element (D) obtained in Production Example 10 was placed on a glass substrate having a thickness of 4 mm and a length of 10 cm × a width of 10 cm (square). -1)
(Substrate preheating: 80 ° C., laminating roll temperature: 110 ° C., laminating roll pressure: 2 × 10 3 N / m, laminating speed: 1.0 m / min), and a 25 μm-thick (D) photosensitive resin composition A layer was formed. After leaving at room temperature for 30 minutes, the exposure amount is 80 mJ through a predetermined photomask.
After exposure at / cm ^{2, the} unexposed portion of the layer of the photosensitive resin composition (D) was developed and removed using 1% by weight (aqueous sodium carbonate solution) to form a resist for glass etching.
Next, a 0.1 wt% aqHF solution is sprayed on the glass substrate on which the glass etching resist is formed, and the glass substrate is etched to form a stripe-shaped groove having a width of 170 μm and a depth of 130 μm on the surface of the glass. To
A substrate was formed at intervals of 220 μm and had a concave portion to be a stripe-shaped discharge space.

[(IIIa) Step of Forming Electrode Pattern] The width obtained above is 170 μm and the height is about 130 μm
The photosensitive element (C-1) obtained in Production Example 17 was formed on the uneven surface of a substrate having a concave portion to be a discharge space in which stripe-shaped barrier ribs were formed at intervals of 220 μm.
(Laminate preheating: 80 ° C., laminating roll temperature: 110 ° C., laminating roll pressure: 2 × 10 ³ N / m, laminating speed: 1.0 m / min), and after polyethylene terephthalate is peeled off, further from above Production Example 21
The film (E-2) obtained in the above was laminated (substrate preheating: 80 ° C., laminating roll temperature: 110 ° C., laminating roll pressure: 5 × 10 ³ N / m, laminating speed: 1.0).
(m / min), a layer of the photosensitive resin composition containing the electrode material (C) was laminated on the inner surface of the concave portion of the substrate having the concave portion to be the discharge space.

Next, the film (E-2) is peeled off, and a stripe-shaped mask (irradiation width: 50 μm) in which light is applied only to the electrode forming portion on the inner surface of the concavity and convexity of the substrate having a concave portion to be a discharge space. Exposure so as to cure in a stripe shape, and developing and removing the unexposed portion, thereby forming a stripe-shaped electrode on the recess inner surface of the substrate having a recess to be a stripe-shaped discharge space. A substrate on which a pattern was formed was obtained.

[(IIIb) Step of Forming Multicolor Pattern] The photosensitive element (B-4) obtained in Production Example 14
(B) The layer of the photosensitive resin composition containing the phosphor and the layer of the thermoplastic resin (D) of the film (D-3) obtained in Production Example 19 were bonded to each other to form the electrode obtained above. The polyethylene terephthalate film of the photosensitive element (B-4) is applied so that the layer of the photosensitive resin composition containing the phosphor (B) follows (closely adheres to) the inner surface of the concave portion of the substrate on which the pattern for use is formed. While peeling, Hitachi Chemical Co., Ltd.
Manufactured by HLM-3000 (trade name: 100 ° C., laminating roll temperature: 110 ° C.)
Laminating roll pressure: 5 × 10 ³ N / m, laminating speed:
0.5 m / min).

Next, on the polyethylene terephthalate film of the film (D-3), a photomask having an active light width approximately equal to the width of the opening between the barrier ribs, which was produced at an interval of one between the barrier ribs, was formed. The center of the active light transmission width of the photomask is located at the center of the opening width between the barrier ribs at the center of the back plate substrate on which the barrier ribs of 10 cm × 10 cm (square) are formed. It is made by Oak Manufacturing Co., Ltd.
Active light was irradiated imagewise at 80 mJ / cm ² using an HMW-201GX type exposure machine.

Next, after irradiation with actinic rays, the film (D-3) was allowed to stand for 1 hour at room temperature, and the polyethylene terephthalate film was peeled off. Then, the unexposed portions were developed and removed. After the development, the film was dried at 80 ° C. for 10 minutes, irradiated with 3 J / cm ² of ultraviolet light using a Toshiba UV irradiation device manufactured by Toshiba Electric Materials Co., Ltd., and further heated at 150 ° C. for 1 hour in a dryer. .

The above pattern was formed by the photosensitive element (B-5) having the layer of the photosensitive resin composition containing the phosphor (B) obtained in Production Example 15 and the photosensitive element (B-5) obtained in Production Example 16. (B) The same applies to the photosensitive element (B-6) having the layer of the photosensitive resin composition containing the phosphor, and red and green are formed on the inner surface of the concave portion of the substrate on which the electrode pattern is formed. And a multicolor pattern in which stripes of a layer of a photosensitive resin composition containing a blue phosphor were repeatedly formed. Next, a black matrix paste composed of iron oxide, a low-melting glass frit, an acrylic resin and butyl carbitol was printed on top of the barrier ribs to form a black matrix.

[(IV) Firing Step] The substrate having a concave portion to be a discharge space in which the electrode pattern and the multicolored pattern obtained above are formed is put into a firing furnace in which air at a flow rate of 10 L / min is flown. The temperature was raised to 400 ° C. at a rate of 2 ° C./min, and maintained at 400 ° C. for 1 hour.
By raising the temperature to ℃ and holding for 30 minutes, baking is performed, and unnecessary parts other than the electrode material and the binder of the electrode pattern and unnecessary parts other than the phosphor and the binder of the multicolor pattern are collectively collected. Then, an electrode pattern and a multicolor phosphor pattern were formed to obtain a back plate for a plasma display panel. The obtained back panel for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 23.

Comparative Example 1 In Example 1, [(II) the step of curing the uncured barrier rib forming portion to form the barrier rib forming portion made of the barrier rib precursor mixture] and the following [firing step] After that, a back plate for a plasma display panel was obtained in the same manner as in Example 1 except that [(IIIb) a step of forming a multicolor pattern] and [(IV) a step of baking] were performed. .

[Firing Step] The substrate on which the barrier rib forming portion made of the barrier rib precursor mixture was formed was heated at room temperature to 50 ° C.
The temperature was raised to 0 ° C. at a rate of 2 ° C./min, and after reaching 500 ° C., a heat treatment (firing) was performed at 500 ° C. for 1 hour to remove an organic binder in a barrier rib forming portion composed of a barrier rib precursor mixture. A substrate having a fired barrier rib was obtained. The obtained back plate for plasma display panel is
Evaluation was performed in the same manner as in Example 1, and the results are shown in Table 24.

Comparative Example 2 In Comparative Example 1, the (A) barrier rib material (A-1) obtained in Production Example 1 was replaced with the (A) barrier rib material (A-2) obtained in Production Example 2. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Comparative Example 1. The obtained rear panel for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 24.

Comparative Example 3 In Comparative Example 1, the (A) barrier rib material (A-1) obtained in Production Example 1 was replaced with the (A) barrier rib material (A-3) obtained in Production Example 3. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Comparative Example 1. The obtained rear panel for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 24.

Comparative Example 4 In Example 4, [(Ib) (A) Step of forming barrier rib forming portion made of barrier rib precursor mixture on substrate by heating and cooling using barrier rib material] After performing the following [firing step],
[(IIIb) Step of Forming Multicolor Pattern] and [(I
V) Baking step], except that a back plate for a plasma display panel was obtained in the same manner as in Example 4.

[Firing Step] The substrate on which the barrier rib forming portion made of the barrier rib precursor mixture was formed was heated from room temperature to 50 ° C.
The temperature was raised to 0 ° C. at a rate of 2 ° C./min, and after reaching 500 ° C., a heat treatment (firing) was performed at 500 ° C. for 1 hour to remove an organic binder in a barrier rib forming portion composed of a barrier rib precursor mixture. A substrate having a fired barrier rib was obtained. The obtained back plate for plasma display panel is
Evaluation was performed in the same manner as in Example 1, and the results are shown in Table 24.

Comparative Example 5 In Comparative Example 4, the (A) barrier rib material (A-4) obtained in Production Example 4 was replaced with the (A) barrier rib material (A-5) obtained in Production Example 5. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Comparative Example 4. The obtained rear panel for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 24.

Comparative Example 6 In Example 6, following [(IIIa) Step of Forming Electrode Pattern], following [Firing Step], [(IIIb) Forming Multicolor Pattern] A back plate for a plasma display panel was obtained in the same manner as in Example 1 except that the [Step] and [(IV) firing step] were performed.

[Firing Step] The substrate on which the electrode pattern was formed was placed in a firing furnace in which air at a flow rate of 10 L / min was flown, and the temperature was raised to 350 ° C. at a rate of 3 ° C./min.
After holding at 30 ° C. for 30 minutes, the temperature was further raised to 550 ° C. at 5 ° C./minute, and the temperature was held at 30 minutes, so that firing was performed to remove unnecessary components other than the electrode material and the binder of the electrode pattern. The cross section of the obtained plasma display panel back plate was evaluated in the same manner as in Example 1, and the results are shown in Table 24.

[0361]

[Table 23]

[0362]

[Table 24]

From the results of Tables 23 and 24, the phosphor pattern of the plasma display panel back plate (Examples 1 to 6) manufactured by using the method of manufacturing the plasma display panel back plate of the present invention was PDP. A highly accurate, high-quality back panel for a plasma display panel, which is formed uniformly and symmetrically on the inner surface of the concave portion of the substrate for use (wall surface of the barrier ribs and the surface of the substrate). On the other hand, the phosphor pattern of the back plate for plasma display panel (Comparative Examples 1 to 6) using the conventional method has a uniform and symmetrical shape on the inner surface of the concave portion (barrier rib wall surface and substrate surface) of the PDP substrate. (The position of the phosphor pattern was shifted), and as a back plate for a plasma display panel,
It was not practical.

Example 7 In Example 1, [(II) Step of curing uncured barrier rib forming portion to form barrier rib forming portion made of barrier rib precursor mixture] was followed by the following [(IIIa) After performing the step of forming a pattern], [(II
A back plate for a plasma display panel was obtained in the same manner as in Example 1 except that Ib) the step of forming a multicolor pattern] and the step of (IV) baking were performed. The obtained back plate for a plasma display panel was prepared in Example 1.
The evaluation was performed in the same manner as described above, and the results are shown in Table 25.

[(IIIa) Step of Forming Electrode Pattern] On the side of the substrate on which the barrier rib forming portion made of the barrier rib precursor mixture obtained above was formed, the (C) was formed on the side where the barrier rib forming portion made of the barrier rib precursor mixture was formed. ) The photosensitive element (C-1) having the layer of the photosensitive resin composition containing the electrode material (C) obtained in Production Example 17 so that the layer of the photosensitive resin composition containing the electrode material is in contact with the layer. While peeling off the polyethylene film of (1), lamination (substrate preheating: 80 ° C., laminating roll temperature: 110 ° C., laminating roll pressure: 2 × 10 ³ N / m (linear pressure), laminating speed: 1.0 m / min).

Next, the polyethylene terephthalate film of the photosensitive element (C-1) having a layer of the photosensitive resin composition containing the electrode material is peeled off, and the photosensitive resin composition containing the electrode material is removed. Production Example 2 on the product layer
While peeling off the polyethylene film from the (E) film (E-2) having the embedded layer (thermoplastic resin layer) obtained in 1 above, a laminator (trade name: HLM-3000 type, manufactured by Hitachi Chemical Co., Ltd.) was used. The heating temperature is 110 ° C.
The layers are laminated at a pressure of 5 × 10 ³ N / m (linear pressure) and a feed speed of the substrate of 1.0 m / min, and (C) a layer of the photosensitive resin composition containing the electrode material follows the inner surface of the concave portion. It was formed so that.

Next, (E) the film (E-2) having the embedded layer (thermoplastic resin layer) is peeled off and removed, and only the electrode forming portion on the inner surface of the concave portion is irradiated with light by a striped mask (irradiation mask). Using a HMW-201GX type exposure machine manufactured by Oak Manufacturing Co., Ltd.
Actinic light was irradiated imagewise at mJ / cm ² . Then, after irradiation with actinic rays, the mixture was allowed to stand at room temperature for 1 hour, and then spray-developed at 30 ° C. for 120 seconds using a 1% by weight aqueous sodium carbonate solution. After development, dry at 80 ° C for 10 minutes.
Ultraviolet irradiation of 3 J / cm ² was performed using a Toshiba ultraviolet irradiation apparatus manufactured by Co., Ltd., and further heated at 150 ° C. for 1 hour.

Example 8 In Example 7, the (A) barrier rib material (A-1) obtained in Production Example 1 was replaced with the (A) barrier rib material (A-2) obtained in Production Example 2. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Example 7. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 25.

Example 9 In Example 7, the (A) barrier rib material (A-1) obtained in Production Example 1 was replaced with the (A) barrier rib material (A-3) obtained in Production Example 3. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Example 7. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 25.

Example 10 In Example 4, a substrate having no electrode was used.
[(Ib) (A) Step of Forming Barrier Rib Forming Section Made of Barrier Rib Precursor Mixture on Substrate by Heating and Cooling Using (R) Barrier Rib Material] Next, Example 7 [(IIIa) Electrode Pattern [(IIIb) Step of Forming Multicolor Pattern]
And a back plate for a plasma display panel was obtained in the same manner as in Example 4 except that [(IV) firing step] was performed. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 25.

Example 11 In Example 10, the (A) barrier rib material (A-4) obtained in Production Example 4 was replaced with the (A) barrier rib material (A-5) obtained in Production Example 4. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Example 10. The obtained back plate for plasma display panel is
Evaluation was performed in the same manner as in Example 1, and the results are shown in Table 25.

Comparative Example 7 In Example 7, [(II) the step of curing the uncured barrier rib forming portion to form a barrier rib forming portion composed of a barrier rib precursor mixture] and the following [firing step] were carried out. After performing [(IIIa) forming a pattern for an electrode] and then performing the following [baking step], [(IIIb) forming a multicolor pattern] and [(IV) firing step] ], And a back plate for a plasma display panel was obtained in the same manner as in Example 7. The obtained back plate for plasma display panel is
Evaluation was performed in the same manner as in Example 1, and the results are shown in Table 26.

[Firing Step] The substrate on which the barrier rib forming portion made of the barrier rib precursor mixture was formed was placed at room temperature to 5 ° C.
The temperature was raised to 00 ° C. at a rate of 2 ° C./min, and after reaching 500 ° C., heat treatment (firing) was performed at 500 ° C. for 1 hour to remove the organic binder in the barrier rib forming portion composed of the barrier rib precursor mixture. A substrate having a fired barrier rib was obtained. [Firing step] The substrate on which the electrode pattern is formed,
Put into a firing furnace with air flowing at 10 liters / minute, raise the temperature to 350 ° C. at a rate of 3 ° C./minute, hold at 350 ° C. for 30 minutes, and then further raise the temperature to 550 ° C. at 5 ° C./minute. do it,
By holding for 30 minutes, baking was performed to remove unnecessary components other than the electrode material and the binder of the electrode pattern.

Comparative Example 8 In Comparative Example 7, the (A) barrier rib material (A-1) obtained in Production Example 1 was replaced with the (A) barrier rib material (A-2) obtained in Production Example 2. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Comparative Example 7. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 26.

Comparative Example 9 In Comparative Example 7, the (A) barrier rib material (A-1) obtained in Production Example 1 was replaced with the (A) barrier rib material (A-3) obtained in Production Example 3. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Comparative Example 7. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 26.

Comparative Example 10 In Example 10, following [(Ib) (A) a step of forming a barrier rib forming portion composed of a barrier rib precursor mixture on a substrate by heating and then cooling by using a barrier rib material] The following [firing step] is performed, and [(II
After performing the following [firing step] following [Ia) forming electrode pattern], [(IIIb) forming a multicolor pattern] and [(IV) firing step] were performed. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Example 10. The obtained back plate for a plasma display panel was evaluated in the same manner as in Example 1, and the results are shown in Table 26.

[Firing Step] The substrate on which the barrier rib forming portion made of the barrier rib precursor mixture was formed was placed at room temperature to 5 ° C.
The temperature was raised to 00 ° C. at a rate of 2 ° C./min, and after reaching 500 ° C., heat treatment (firing) was performed at 500 ° C. for 1 hour to remove the organic binder in the barrier rib forming portion composed of the barrier rib precursor mixture. A substrate having final barrier ribs was obtained. [Firing step] The substrate on which the electrode pattern is formed,
Put into a firing furnace with air flowing at 10 liters / minute, raise the temperature to 350 ° C. at a rate of 3 ° C./minute, hold at 350 ° C. for 30 minutes, and then further raise the temperature to 550 ° C. at 5 ° C./minute. do it,
By holding for 30 minutes, baking was performed to remove unnecessary components other than the electrode material and the binder of the electrode pattern.

Comparative Example 11 In Comparative Example 10, the (A) barrier rib material (A-4) obtained in Production Example 4 was replaced with the (A) barrier rib material (A-5) obtained in Production Example 5. Except for the above, a back plate for a plasma display panel was obtained in the same manner as in Comparative Example 10. The obtained back plate for plasma display panel is
Evaluation was performed in the same manner as in Example 1, and the results are shown in Table 26.

[0379]

[Table 25]

[0380]

[Table 26]

From the results of Tables 25 and 26, the phosphor pattern of the plasma display panel back plate (Examples 7 to 11) manufactured by using the method of manufacturing the plasma display panel back plate of the present invention was PDP. A highly accurate, high-quality back panel for a plasma display panel, which is formed uniformly and symmetrically on the inner surface of the concave portion of the substrate for use (wall surface of the barrier ribs and the surface of the substrate). On the other hand, the phosphor pattern of the back plate for a plasma display panel (Comparative Examples 7 to 11) using the conventional method has a uniform and symmetrical shape on the inner surface of the concave portion (the barrier rib wall surface and the substrate surface) of the PDP substrate. (The position of the phosphor pattern was displaced), and it was not practical for a plasma display panel back plate. Comparative Examples 7-1
The displacement of the phosphor pattern of No. 1 was larger than the displacement of the phosphor patterns of Comparative Examples 1 to 5 in which the electrode pattern was not formed.

[0382]

According to the method of manufacturing a back panel for a plasma display panel according to the first and second aspects, the number of steps is reduced, the alignment is easy, the workability is good, the energy is low, and the dimensional accuracy is excellent. The back plate for use can be manufactured with high yield. A method of manufacturing a back plate for a plasma display panel according to claim 3 is described in claim 1.
In addition to the effects of the manufacturing method of the back panel for a plasma display panel described above, the number of steps can be reduced, the workability can be improved, the energy can be reduced, and the back panel for a plasma display panel having excellent dimensional accuracy can be manufactured. is there. The method for manufacturing a back plate for a plasma display panel according to claim 4 has the effect of the method for manufacturing a back plate for a plasma display panel according to claim 1, 2 or 3, and the strength of a barrier rib forming portion made of a barrier rib precursor mixture. And the shrinkage of the volume of the barrier ribs can be controlled, and the adhesion between the barrier ribs and the substrate can be improved. Claim 5
According to the method for manufacturing a back plate for a plasma display panel described above, in addition to the effect of the method for manufacturing a back plate for a plasma display panel according to the first, second, third, or fourth aspect, the adhesion between the barrier rib and the substrate is further improved. Things.

The method of manufacturing a back plate for a plasma display panel according to the sixth aspect provides the effect of the method of manufacturing a back plate for a plasma display panel according to the second embodiment, in addition to the effect of the strength of the barrier rib forming portion made of the barrier rib precursor mixture. It is excellent in handleability in the step of improving and further forming a multicolor pattern, and is more excellent in workability. According to the method for manufacturing a back plate for a plasma display panel according to claim 7, in addition to the effect of the method for manufacturing a back plate for a plasma display panel according to claim 3, the strength of a barrier rib forming portion made of a barrier rib precursor mixture is further improved. Further, the handleability in the step of forming the electrode pattern and the step of forming the multicolor pattern is excellent, and the workability is further improved. The method for manufacturing a back plate for a plasma display panel according to claim 8 is advantageous in that the method for manufacturing a back plate for a plasma display panel according to claim 6 or 7 has the following advantages.
Further, the curability of the barrier rib material is excellent, the strength of the barrier rib forming portion made of the barrier rib precursor mixture is improved, the handleability in the step of forming a multicolor pattern is excellent, and the workability is more excellent. The method for manufacturing a back plate for a plasma display panel according to claim 9 is:
In addition to the effects of the method of manufacturing a back panel for a plasma display panel according to the eighth aspect, the present invention further reduces the residual organic matter in the fired barrier ribs and provides excellent emission intensity.

The method of manufacturing a back plate for a plasma display panel according to claim 10 is the method of claim 1, 2, 3, 4, or 5.
In addition to the effect of the manufacturing method of the back plate for a plasma display panel described above, the strength of the barrier rib forming portion composed of the barrier rib precursor mixture is further improved, and the handling property in the process of forming a multicolor pattern is excellent, so that more work is performed. It has excellent properties. According to the method for manufacturing a back plate for a plasma display panel according to the eleventh aspect, in addition to the effect of the method for manufacturing a back plate for a plasma display panel according to the tenth aspect, the strength of a barrier rib forming portion made of a barrier rib precursor mixture is further improved. In addition, the handleability in the step of forming a multicolor pattern is excellent, and the workability is more excellent. According to the method for manufacturing a back plate for a plasma display panel according to claim 12, in addition to the effect of the method for manufacturing a back plate for a plasma display panel according to claim 11, the organic matter remaining in the barrier rib after firing is further reduced, and the emission intensity is reduced. Is excellent.

The method of manufacturing a back plate for a plasma display panel according to the thirteenth aspect has the effect of reducing the number of steps, improving workability and reducing the number of steps, in addition to the effect of the method of manufacturing a back panel for a plasma display panel according to the first aspect. Energy and excellent dimensional accuracy. The method for manufacturing a back plate for a plasma display panel according to claim 14 has the effect of the method for manufacturing a back plate for a plasma display panel according to claim 13, further maintaining the strength of the barrier rib forming portion, and further reducing the number of steps. As a result, the yield is further improved. The method for manufacturing a back plate for a plasma display panel according to claim 15 has an excellent handling property when forming a barrier rib, and has a further advantage in addition to the effect of the method for manufacturing a back plate for a plasma display panel according to claim 14. It has excellent properties.

[Brief description of the drawings]

FIG. 1 is a schematic diagram showing an inner surface of a concave portion formed of a barrier rib forming portion made of a barrier rib precursor mixture and a substrate in the present invention.

FIG. 2 is a schematic cross-sectional view showing a state in which a multicolor pattern is formed on an inner surface of a concave portion of a substrate on which a barrier rib forming portion made of a barrier rib precursor mixture is formed.

FIG. 3 is a schematic cross-sectional view showing a state in which an electrode pattern and a multicolor pattern are formed on the inner surface of a concave portion of a substrate on which a barrier rib forming portion made of a barrier rib precursor mixture is formed.

FIG. 4 is a schematic cross-sectional view showing an example of each step of the method for manufacturing a back plate for a plasma display panel of the present invention.

FIG. 5 is a schematic sectional view showing an inner surface of a concave portion of a substrate having a concave portion to be a discharge space in the present invention.

FIG. 6 is a schematic cross-sectional view showing a state where an electrode pattern and a multicolor pattern are formed on an inner surface of a concave portion of a substrate having a concave portion to be a discharge space.

FIG. 7 is a schematic cross-sectional view showing an example of each step of the method for manufacturing a back plate for a plasma display panel of the present invention.

FIG. 8 is a schematic diagram showing an example of a multicolor pattern according to the present invention.

FIG. 9 is a schematic diagram showing an example of a multicolor pattern according to the present invention.

FIG. 10 is a schematic diagram showing an example of a multicolor pattern according to the present invention.

FIG. 11 is a schematic diagram showing an evaluation position of a back plate for a plasma display panel.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Substrate 1 The board | substrate which has the recessed part which becomes a discharge space 2a The uncured barrier rib formation part 2b The barrier rib formation part which consists of a barrier rib precursor mixture 2c The fired barrier rib 3 The concave surface 4 Multicolor pattern 4a The first color pattern 4b Color pattern 4c Third color pattern 5 Electrode pattern 6a First color phosphor pattern 6b Second color phosphor pattern 6c Third color phosphor pattern 7 Electrode pattern R A red-colored (B) photosensitive material containing a phosphor Layer of photosensitive resin composition G Layer of photosensitive resin composition containing green phosphor (B) containing phosphor B Layer of photosensitive resin composition containing phosphor that produces blue (B) 8 Plasma display panel Back plate a center b center-top c center-bottom d left-center e left-top f left-bottom g right-center h right-top i right-bottom

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Naoki Kimura 4-3-1-1, Higashi-cho, Hitachi City, Ibaraki Prefecture Inside the Ibaraki Research Laboratory, Hitachi Chemical Co., Ltd. 1 Ibaraki Research Laboratory, Hitachi Chemical Co., Ltd. (72) Inventor Tetsuya Sudo 4-3-1-1, Higashicho, Hitachi City, Ibaraki Prefecture Inside Yamazaki Plant, Hitachi Chemical Co., Ltd. No. 4-13-1, Hitachi Chemical Co., Ltd., Yamazaki Plant

Claims (15)

[Claims] 1. A barrier rib forming portion made of a barrier rib precursor mixture in which an inorganic material is held by an organic material, at least one of an electrode pattern containing an electrode material and an organic material, and a multi-layer containing a phosphor and an organic material. A method for producing a back plate for a plasma display panel, comprising firing a color pattern in a state of being formed in a predetermined arrangement. 2. A state in which the multi-color pattern is formed on the inner surface of the recess formed by the barrier rib forming portion formed of the barrier rib precursor mixture formed on the substrate and the substrate. Item 2. The method for producing a back plate for a plasma display panel according to Item 1. 3. An electrode pattern and a multicolor pattern are formed on the inner surface of a concave portion formed by a barrier rib forming portion made of a barrier rib precursor mixture formed on a substrate and a substrate. The method for manufacturing a back plate for a plasma display panel according to claim 1, wherein the back plate is in a state. 4. The method according to claim 1, wherein the barrier rib precursor mixture is an inorganic material.
4. The method according to claim 1, wherein the organic material is contained in an amount of 1 to 100 parts by weight with respect to 0 parts by weight. 5. The back for a plasma display panel according to claim 1, wherein the organic material contained in the barrier rib precursor mixture contains a thermosetting resin, a resin obtained by thermosetting the thermosetting resin, or a thermoplastic resin. Manufacturing method of face plate. 6. The state formed in a predetermined arrangement is (Ia)
A step of forming an uncured barrier rib forming portion on the substrate,
3. The plasma according to claim 2, which is obtained by: (II) a step of curing an uncured barrier rib forming section to form a barrier rib forming section made of a barrier rib precursor mixture; and (IIIb) a step of forming a multicolor pattern. Manufacturing method of back panel for display panel. 7. The state formed in a predetermined arrangement is (Ia)
A step of forming an uncured barrier rib forming portion on the substrate,
(II) a step of curing the uncured barrier rib forming portion to form a barrier rib forming portion made of a barrier rib precursor mixture, (IIIa) a step of forming an electrode pattern, and (III)
4. The method of manufacturing a back plate for a plasma display panel according to claim 3, which is obtained by each step of b) a step of forming a multicolor pattern. 8. The method for manufacturing a back plate for a plasma display panel according to claim 6, wherein the uncured barrier rib forming portion contains an inorganic material and a resin component which cures at a temperature of 50 to 300 ° C. 9. The method for producing a back plate for a plasma display panel according to claim 8, wherein the resin component which cures at a temperature of 50 to 300 ° C. has an organic residue of 0.5% by weight or less after firing. 10. The state formed in a predetermined arrangement is (I)
b) A barrier rib forming portion comprising a barrier rib precursor mixture, wherein (A) a barrier rib material containing an inorganic material and an organic material is heated and then cooled to hold the inorganic material with an organic material. Or the method for producing a back plate for a plasma display panel according to 5. 11. The method according to claim 10, wherein the organic material contains a resin component having a Tg of 80 ° C. or higher. 12. The method of manufacturing a back plate for a plasma display panel according to claim 11, wherein the resin component having a Tg of 80 ° C. or more has an organic residue of 0.5% by weight or less after firing. 13. A substrate having a concave portion to be a discharge space, wherein an electrode pattern including an electrode material and an organic material and a multicolor pattern including a phosphor and an organic material are formed on the inner surface of the concave portion of the substrate. And baking in a state where they are formed in a predetermined arrangement. 14. A substrate having a concave portion to be a discharge space is integrated with the same material.
A method for producing a back plate for a plasma display panel according to the above. 15. The method for manufacturing a back plate for a plasma display panel according to claim 13, wherein the substrate having a concave portion to be a discharge space has a concave portion formed by etching a glass plate with glass. .