JPH1092313A - Manufacture of phosphor pattern, photosensitive element used for the same, phosphor pattern, and rear face panel for plasma display panel - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve embedding performance and provide precious, uniform shape by disposing and pressurizing an embedding layer on a photosensitive resin composition layer containing phosphor, removing the embedding layer, and forming a pattern on a ragged substrate. SOLUTION: On a substrate 1 having irregularity for a plasma display panel having a barrier rib 2 or the like, a photosensitive resin layer containing phosphor and an embedding layer 6 thereon are disposed. The layer 6 is composed of a material that can be deformed due to external stress and can be peeled from a layer 5. The layer 5 and 6 is pressure welded on the substrate 1 by pressurizing a heating roller or the like, after which the layer 6 is peeled by an adhesive tape or wedge-shaped jig or the like or static electricity or absorption or the like and wound by a uptake roller or the like. Next, an active light beam is image-irradiated with the layer 5, after which an irradiated part is selectively removed by developing, and a pattern is formed. Further, an unnecessary part other than phosphor and bond is removed by burning, and a phosphor pattern is formed. Embedding performance for a ragged substrate space is improved by the layer 6.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for manufacturing a phosphor pattern, a photosensitive element used for the method, a phosphor pattern, and a back plate for a plasma display panel.

[0002]

2. Description of the Related Art Conventionally, as one of flat panel displays, a plasma display panel (hereinafter, referred to as a PDP) capable of performing multicolor display by providing a phosphor which emits light by plasma discharge has been known. The PDP has a flat front plate and a rear plate made of glass, which are arranged in parallel and opposed to each other, and both are held at a fixed interval by barrier ribs provided between the front plate and the rear plate. And discharges in a space surrounded by the barrier ribs. In such a space, a phosphor for display is applied, and the phosphor is caused to emit light by ultraviolet rays generated from the sealing gas by discharge, so that the light can be visually recognized by an observer.

Conventionally, a method of providing this phosphor is as follows.
A method of applying a slurry solution or paste in which phosphors of each color are dispersed by a printing method such as screen printing has been proposed. And Japanese Patent Application Laid-Open No. 2-155142. However, since the above-mentioned phosphor dispersion slurry liquid is liquid, poor dispersion due to precipitation of the phosphor is likely to occur, and when a liquid photosensitive resist is used for the slurry liquid, it is preserved by promoting a dark reaction and the like. It has disadvantages such as poor stability. Furthermore, since printing methods such as screen printing are inferior in printing accuracy, there is a problem that it is difficult to cope with a larger PDP in the future.

In order to solve these problems, a method using a photosensitive element containing a phosphor (also referred to as a photosensitive film) has been proposed (Japanese Patent Laid-Open No. Hei 6-273925).
No.). The method using a photosensitive element means that a photosensitive resin layer containing a phosphor of a photosensitive element comprising a photosensitive resin layer containing a phosphor and a support film is heat-pressed (laminated) on the PDP substrate. Embedded in a space, and then imagewise exposed to actinic light such as ultraviolet light by a photographic method using a negative film. Thereafter, the unexposed portions are removed with a developing solution such as an aqueous alkaline solution, and then unburned by baking. A necessary organic component is removed to form a phosphor pattern only in a necessary portion. Therefore, the P
When forming a phosphor pattern in the space of the DP substrate,
It is not necessary to check the dispersibility of the phosphor, and the storage stability is superior to that of the phosphor dispersion slurry or paste. Furthermore, since a photographic method is used, a phosphor pattern can be formed with high accuracy.

However, when a photosensitive resin layer containing a phosphor is buried in a space (in a cell) of the PDP substrate by lamination using a photosensitive element by a conventional method, the barrier rib wall surface and the space bottom surface are left behind. It was difficult to form a phosphor pattern with a uniform thickness and shape.

[0006]

According to the first aspect of the present invention, there is provided a method of embedding a substrate having irregularities such as a PDP substrate into a space (in the case of a PDP substrate, the phosphor on the wall surface of the barrier rib and the bottom surface of the space is used). The present invention provides a method for producing a phosphor pattern which is excellent in the formability of a photosensitive resin composition layer to be contained, and is capable of forming a phosphor pattern having a uniform shape with high precision. The invention according to claim 2 provides a method for manufacturing a phosphor pattern which is excellent in workability and environmental safety in addition to the effects of the invention described in claim 1. A third aspect of the present invention provides a method of manufacturing a phosphor pattern which is excellent in workability in addition to the effects of the first or second aspect of the present invention. The invention described in claim 4 provides a method of manufacturing a phosphor pattern that is excellent in suppressing film thinning in addition to the effects of the invention described in claim 1 or 2.
The invention described in claim 5 provides a method of manufacturing a phosphor pattern which is excellent in workability and photosensitivity in addition to the effects of the invention described in claim 1, 2, 3 or 4.

The invention according to claim 6 is excellent in suppressing edge fusion and embedding into a space of a substrate having irregularities such as a PDP substrate, and can form a highly accurate and uniform phosphor pattern with good workability. A photosensitive element is provided. The invention described in claim 7 provides a photosensitive element which is excellent in workability and light sensitivity in addition to the effects of the invention described in claim 6. An eighth aspect of the present invention is to provide a phosphor pattern having a high accuracy, a uniform shape, and excellent luminance. The invention according to claim 9 is
It is an object of the present invention to provide a back plate for a plasma display panel provided with a phosphor pattern having a high precision, a uniform shape, and excellent brightness.

[0008]

According to the present invention, there is provided a method comprising the steps of: (I) forming a buried layer on a (A) photosensitive resin composition layer containing a phosphor on a substrate having irregularities;
(B) a step of applying pressure to the buried layer to laminate (A) a photosensitive resin composition layer containing a phosphor and (B) a buried layer on a substrate having irregularities; (II) (B) a buried layer (III) (A) irradiating the photosensitive resin composition layer containing the phosphor imagewise with actinic rays, (I)
V) a step of forming a pattern by selectively removing the phosphor-containing photosensitive resin composition layer imagewise irradiated with actinic rays by development, and (V) baking out unnecessary parts from the pattern. The present invention relates to a method of manufacturing a phosphor pattern, which includes the steps of removing and forming a phosphor pattern.

In the present invention, the step (I) may comprise (I)
a) On the support film, (B) a (Ba) peelable burying layer as a burying layer, and (A)
This is a step of laminating a photosensitive element having a phosphor-containing photosensitive resin composition layer so that the phosphor-containing photosensitive resin composition layer (A) is in contact with a substrate having irregularities. The present invention relates to a method for manufacturing the phosphor pattern. Also,
The present invention provides a method of repeating the steps (I) to (IV),
After forming a multicolor pattern composed of a photosensitive resin composition layer containing a phosphor that emits green and blue, the step (V) is performed to form the multicolor phosphor pattern. About the law. Further, the present invention provides (I) to
The present invention relates to a method for producing the phosphor pattern, wherein each step of (V) is repeated to form a multicolor phosphor pattern that emits red, green and blue. Further, the present invention provides (A) a photosensitive resin composition layer containing a phosphor, wherein (a) a film imparting polymer, (b) a photopolymerizable unsaturated compound having an ethylenically unsaturated group, and (c) The present invention relates to a method for producing the phosphor pattern, comprising a photoinitiator that generates free radicals upon irradiation with actinic light, and (d) a phosphor.

[0010] Further, the present invention provides a method for manufacturing a semiconductor device comprising:
The present invention relates to a photosensitive element having (B) a releasable burying layer as a burying layer, and (A) a photosensitive resin composition layer containing a phosphor thereon. Further, the present invention provides (A) a photosensitive resin composition layer containing a phosphor, wherein (a) a film imparting polymer, (b) a photopolymerizable unsaturated compound having an ethylenically unsaturated group, and (c) The present invention relates to the photosensitive element including a photoinitiator that generates free radicals upon irradiation with actinic light and (d) a phosphor. The present invention also relates to a phosphor pattern manufactured by the method for manufacturing a phosphor pattern. The present invention also relates to a plasma display panel back plate comprising the above-described phosphor pattern on a plasma display panel substrate.

[0011]

BEST MODE FOR CARRYING OUT THE INVENTION The method for producing a phosphor pattern of the present invention comprises the steps of: (I) forming a (B) buried layer on a (A) phosphor-containing photosensitive resin composition layer on a substrate having irregularities; In the placed state, (B) pressure is applied to the buried layer,
(A) a photosensitive resin composition layer containing a phosphor and (B)
Laminating a buried layer on a substrate having irregularities, (I
(I) (B) a step of removing the buried layer, (III) (A) a step of irradiating the photosensitive resin composition layer containing the phosphor imagewise with actinic rays, and (IV) an image formation of the actinic rays by development. (A) a step of forming a pattern by selectively removing the photosensitive resin composition layer containing the phosphor, and (V) forming a phosphor pattern by removing unnecessary portions from the pattern by baking. It is characterized by including each of the steps.

The substrate having irregularities in the present invention includes a substrate for a plasma display panel (substrate for PDP) on which barrier ribs are formed. Examples of the PDP substrate include a substrate such as a glass plate or a synthetic resin plate on which electrodes and barrier ribs are formed, which may be subjected to a surface treatment for transparent bonding.
For forming the barrier rib, a known material can be used without any particular limitation. For example, a rib material containing silica, a thermosetting resin, a low-melting glass (such as lead oxide), a solvent, or the like can be used. In addition, in addition to the electrodes and barrier ribs, the PDP substrate may include a dielectric film, an insulating film, an auxiliary electrode,
A resistor or the like may be formed. There is no particular limitation on the method of forming these on a substrate.
An electrode can be formed on a substrate by a method such as vapor deposition, sputtering, plating, coating, or printing, and a barrier rib can be formed by a method such as a printing method, a sandblast method, or an embedding method.

FIGS. 1 and 2 show a P having a barrier rib formed thereon.
A schematic diagram of an example of a DP substrate is shown. The barrier ribs usually have a height of 20 to 500 μm and a width of 20 to 200 μm. The shape of the discharge space surrounded by the barrier ribs is not particularly limited, and may be a lattice shape, a stripe shape, a honeycomb shape,
Although a square shape, an elliptical shape, and the like are possible, a grid-like or stripe-like discharge space is usually formed as shown in FIGS. 1 and 2, a barrier rib 2 is formed on a substrate 1. In FIG. 1, a grid-like discharge space 3 is formed, and in FIG. 2, a stripe-like discharge space 4 is formed. The size of the discharge space is determined by the size and resolution of the PDP, and in the case of a grid-like discharge space as shown in FIG. 1, the vertical and horizontal lengths are typically 50 μm to 1 mm.
In a striped discharge space as shown in FIG.
μm to 1 mm.

The composition of the photosensitive resin composition layer containing the phosphor (A) in the present invention is not particularly limited, and may be constituted by using a photosensitive resin composition usually used in a photolithographic method. From the viewpoints of photosensitivity and workability, (a) a polymer imparting film properties, (b) a photopolymerizable unsaturated compound having an ethylenically unsaturated group, and (c) photoinitiation of generating free radicals by irradiation with active light It is preferable that the composition contains an agent and (d) a phosphor.

As the polymer (a) for imparting film properties in the present invention, a vinyl copolymer is preferable. Examples of the vinyl monomer used in the vinyl copolymer include acrylic acid, methacrylic acid, maleic acid and fumaric acid. , Itaconic acid, methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, n-propyl acrylate, n-propyl methacrylate, iso-propyl acrylate, iso-propyl methacrylate, n-butyl acrylate, N-butyl methacrylate, iso-butyl acrylate, iso-butyl methacrylate, sec-butyl acrylate, sec-butyl methacrylate, tert-butyl acrylate, tert-butyl methacrylate, pentyl acrylate,
Pentyl methacrylate, hexyl acrylate, hexyl methacrylate, heptyl acrylate, heptyl methacrylate, 2-ethylhexyl acrylate, methacrylic acid 2
-Ethylhexyl, octyl acrylate, octyl methacrylate, nonyl acrylate, nonyl methacrylate, decyl acrylate, decyl methacrylate, dodecyl acrylate, dodecyl methacrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate Octadecyl acrylate, octadecyl methacrylate, eicosyl acrylate, eicosyl methacrylate, docosyl acrylate, docosyl methacrylate, cyclopentyl acrylate, cyclopentyl methacrylate, cyclohexyl acrylate,
Cyclohexyl methacrylate, cycloheptyl acrylate, cycloheptyl methacrylate, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, methoxyethyl acrylate, methoxyethyl methacrylate, methoxyethyl acrylate, methoxydiethylene glycol methacrylate, Methoxydipropylene glycol acrylate, methoxydipropylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate, 2-hydroxyethyl acrylate, 2-hydroxyethyl methacrylate, dimethylaminoethyl acrylate, methacrylic acid Dimethylaminoethyl, diethylaminoethyl acrylate, diethylaminoethyl methacrylate Le, acrylate dimethylaminopropyl, dimethylaminopropyl methacrylate, 2-chloroethyl acrylate, 2-chloroethyl methacrylate, 2-fluoroethyl acrylate, methacrylic acid 2-
Fluoroethyl, 2-cyanoethyl acrylate, 2-cyanoethyl methacrylate, styrene, α-methylstyrene, vinyltoluene, vinyl chloride, vinyl acetate, N-vinylpyrrolidone, butadiene, isoprene, chloroprene, acrylamide, methacrylamide, acrylonitrile, methacryl Lonitrile and the like. These are used alone or in combination of two or more.

The polymer (a) for imparting film properties in the present invention includes polyvinyl alcohol resins (hydrolysates of polyacrylate or polymethacrylate, hydrolysates of polyvinyl acetate, ethylene and vinyl acetate). Of a copolymer of ethylene, a copolymer of ethylene and acrylate, a hydrolyzate of a copolymer of vinyl chloride and vinyl acetate, and a mixture of styrene and acrylate or methacrylate. Hydrolysates of copolymers, hydrolysates of copolymers of vinyl toluene and acrylates or methacrylates, etc.), water-soluble salts of carboxyalkylcellulose, water-soluble celluloses such as hydroxypropylcellulose, water-soluble Cellulose ethers, water-soluble salts of carboxyalkyl starch, polyvinyl alcohol It is also possible to use pyrrolidone.

The weight average molecular weight of the polymer (a) in the present invention is preferably 5,000 to 300,000, more preferably 20,000 to 150,000. This weight average molecular weight is 5,
If it is less than 000, the film forming property and flexibility tend to decrease when the photosensitive element is used.
If it exceeds 000, the developability (the property that unnecessary portions can be easily removed by development) tends to decrease. The weight average molecular weight is a value measured by gel permeation chromatography and converted using a standard polystyrene calibration curve.

In addition, (a) the carboxyl group content (acid value (A) of the film-imparting polymer is such that the photosensitive resin composition layer containing the phosphor (A) can be developed with various known developers. mgKOH / g) can be adjusted appropriately. For example, when developing using an aqueous alkali solution such as sodium carbonate or potassium carbonate, the acid value is preferably from 90 to 260. This acid value is
If it is less than 90, development tends to be difficult, and if it exceeds 260, resistance to developing solution (the property that the remaining pattern that is not removed by development and remains as a pattern is not attacked by the developing solution).
Tends to decrease. In the case of developing using an aqueous developer composed of water or an aqueous alkali solution and one or more organic solvents, the acid value is preferably 16 to 260. When the acid value is less than 16, development tends to be difficult, and when it exceeds 260, developer resistance tends to decrease. Further, in the case where development is performed using a developer (emulsion developer) comprising water and one or more organic solvents that are not soluble in water, it is not necessary to contain a carboxyl group. When an organic solvent developer such as 1,1,1-trichloroethane is used, it does not need to contain a carboxyl group.

As the photopolymerizable unsaturated compound (b) having an ethylenically unsaturated group in the present invention, all compounds conventionally known as photopolymerizable polyfunctional monomers can be used. For example, the following general formula (I)

Embedded image (Wherein, R represents a hydrogen atom or a methyl group, and k represents 1 to 1)
Is an integer of 0, Y is a saturated or unsaturated hydrocarbon group or a heterocyclic residue or a polyalkylene glycol residue which may have a substituent,

Embedded image (Wherein R ¹ and R ² are each independently a hydrogen atom, a methyl group,
An ethyl group, a propyl group or a trifluoromethyl group, R ³ and R ⁴ each independently represent an alkylene group having 1 to 6 carbon atoms, and m and n each independently represent an integer of 1 to 20) And the like having a terminal ethylenically unsaturated group.

In the general formula (I), examples of the saturated or unsaturated hydrocarbon residue or heterocyclic residue optionally having a substituent represented by Y include a halogen atom, a hydroxyl group and an amino group. A linear, branched or alicyclic alkane residue having 1 to 22 carbon atoms which may have a substituent having a carboxyl group or the like (methane residue, ethane residue, propane residue, cyclopropane residue, Butane residue, isobutane residue, cyclobutane residue, pentane residue, isopentane residue, neopentane residue, cyclopentane residue, hexane residue, cyclohexane residue, heptane residue, cycloheptane residue, octane residue, Nonane residue, decane residue, etc.), aromatic ring residue (benzene residue, naphthalene residue,
Anthracene residue, biphenyl residue, terphenyl residue, etc., heterocyclic residue (furan residue, thiophene residue, pyrrole residue, oxazole residue, thiazole residue, imidazole residue, pyridine residue, pyrimidine residue Group, pyrazine residue, triazine residue, quinoline residue, quinoxaline residue, etc.).

Specifically, the monomer having one unsaturated bond includes, for example, ester monomers of acrylic acid or methacrylic acid (methyl acrylate, methyl methacrylate, ethyl acrylate, ethyl methacrylate, N-propyl acid, n-propyl methacrylate, iso-propyl acrylate, iso-propyl methacrylate, n-butyl acrylate, n-butyl methacrylate, iso-butyl acrylate, iso-butyl methacrylate, acrylic acid
sec-butyl, sec-butyl methacrylate, te acrylate
rt-butyl, tert-butyl methacrylate, pentyl acrylate, pentyl methacrylate, hexyl acrylate,
Hexyl methacrylate, heptyl acrylate, heptyl methacrylate, 2-ethylhexyl acrylate, 2-ethylhexyl methacrylate, octyl acrylate, octyl methacrylate, nonyl acrylate, nonyl methacrylate, decyl acrylate, decyl methacrylate, acrylic acid Dodecyl, dodecyl methacrylate, tetradecyl acrylate, tetradecyl methacrylate, hexadecyl acrylate, hexadecyl methacrylate, octadecyl acrylate, octadecyl methacrylate, eicosyl acrylate, eicosyl methacrylate, docosyl acrylate, docosyl methacrylate, cyclopentyl acrylate, Cyclopentyl methacrylate, cyclohexyl acrylate, cyclohexyl methacrylate, cycloheptyl acrylate, methacryl Cycloheptyl acid, benzyl acrylate, benzyl methacrylate, phenyl acrylate, phenyl methacrylate, methoxyethyl acrylate, methoxyethyl methacrylate, dimethylaminoethyl acrylate, dimethylaminoethyl methacrylate, dimethylaminopropyl acrylate, methacrylic acid Dimethylaminopropyl, 2-chloroethyl acrylate, 2-chloroethyl methacrylate, 2-fluoroethyl acrylate, 2-fluoroethyl methacrylate, acrylic acid 2
-Cyanoethyl, 2-cyanoethyl methacrylate, methoxydiethylene glycol acrylate, methoxydiethylene glycol methacrylate, methoxydipropylene glycol acrylate, methoxydipropylene glycol methacrylate, methoxytriethylene glycol acrylate, methoxytriethylene glycol methacrylate, etc.), styrene Monomer (styrene, α-methylstyrene, pt-butylstyrene, etc.), polyolefin monomer (butadiene, isoprene, chloroprene, etc.), vinyl monomer (vinyl chloride, vinyl acetate, etc.), nitrile monomer (acrylonitrile, methacrylic Lonitrile, etc.), 1- (methacryloyloxyethoxycarbonyl)
-2- (3'-chloro-2'-hydroxypropoxycarbonyl) benzene and the like.

Examples of the monomer having two unsaturated bonds include ethylene glycol diacrylate, ethylene glycol dimethacrylate, diethylene glycol diacrylate, diethylene glycol dimethacrylate, triethylene glycol diacrylate, triethylene glycol dimethacrylate, and tetraethylene glycol dimethacrylate. Ethylene glycol diacrylate, tetraethylene glycol dimethacrylate, polyethylene glycol diacrylate, polyethylene glycol dimethacrylate, hexapropylene glycol dimethacrylate, hexapropylene glycol dimethacrylate, polypropylene glycol diacrylate, polypropylene glycol dimethacrylate, butylene glycol diacrylate, butylene glycol Jime Acrylate, neopentyl glycol diacrylate, neopentyl glycol dimethacrylate, 1,3-butanediol diacrylate,
1,3-butanediol dimethacrylate, 1,4-butanediol diacrylate, 1,4-butanediol dimethacrylate, 1,5-pentanediol diacrylate, 1,5-pentanediol dimethacrylate,
1,6-hexanediol diacrylate, 1,6-hexanediol dimethacrylate, pentaerythritol diacrylate, pentaerythritol dimethacrylate, trimethylolpropane diacrylate, trimethylolpropane dimethacrylate, bisphenol A
Diacrylate, bisphenol A dimethacrylate,
2,2-bis (4-acryloxyethoxyphenyl) propane, 2,2-bis (4-methacryloxyethoxyphenyl) propane, 2,2-bis (4-acryloxydiethoxyphenyl) propane, 2,2- Bis (4-methacryloxydiethoxyphenyl) propane, 2,2-bis (4-acryloxypolyethoxyphenyl) propane, 2,2-bis (4-methacryloxypolyethoxyphenyl) propane, bisphenol A diglycidyl ether Examples include acrylate, bisphenol A diglycidyl ether dimethacrylate, and urethane diacrylate compound.

Examples of the monomer having three unsaturated bonds include trimethylolpropane triacrylate, trimethylolpropane trimethacrylate, pentaerythritol triacrylate, pentaerythritol trimethacrylate, ethylene oxide-modified trimethylolpropane triacrylate, and ethylene oxide. Modified trimethylolpropane trimethacrylate, trimethylolpropane triglycidyl ether triacrylate, trimethylolpropane triglycidyl ether trimethacrylate and the like can be mentioned. Examples of the monomer having four unsaturated bonds include tetramethylolpropane tetraacrylate, tetramethylolpropane tetramethacrylate, pentaerythritol tetraacrylate, and pentaerythritol tetramethacrylate.

Examples of the monomer having five unsaturated bonds include dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate and the like. Examples of the monomer having six unsaturated bonds include dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, and the like. Any of these monomers having an unsaturated bond may be those that undergo radical polymerization by light irradiation, and these monomers having an unsaturated bond may be used alone or in combination of two or more. Used in combination.
Further, in the present invention, the photosensitive resin composition layer containing the phosphor (A) needs to remove unnecessary components by baking at the time of producing a phosphor pattern. Among the photopolymerizable unsaturated compounds having the following, polyethylene glycol dimethacrylate, which has good thermal decomposability, is more preferable.

(A) In the case where the photosensitive resin composition layer containing a phosphor is used as a photosensitive element described below, and the storage stability after being embedded in the space of a PDP substrate described later is improved ((A) (A) the photopolymerizable unsaturated compound having an ethylenically unsaturated group in the photosensitive resin composition layer containing the phosphor can suppress (B) the property of causing migration to the burying layer described later) and (A) And (b) the ethylenic unsaturation in the (A) phosphor-containing photosensitive resin composition layer during heating under reduced pressure when embedding the phosphor-containing photosensitive resin composition layer in the space of the PDP substrate described below. From the viewpoint that evaporation of the photopolymerizable unsaturated compound having a group can be suppressed, the weight average molecular weight of (b) the photopolymerizable unsaturated compound having an ethylenically unsaturated group is preferably 400 or more, and 50 or more. By more preferably more, 6
It is particularly preferable that the boiling point (760 mmHg) of the photopolymerizable unsaturated compound (b) having an ethylenically unsaturated group is 300 ° C. or more. The boiling point (760 mmHg) is preferably 350 ° C. or higher, more preferably 400 ° C. or higher, from the viewpoints of stability and workability when heated below.

(B) a photopolymerizable unsaturated compound having an ethylenically unsaturated group having a weight average molecular weight of 400 or more, or a boiling point (760 mmHg) of 300 ° C. or more (b)
As the photopolymerizable unsaturated compound having an ethylenically unsaturated group, for example, it can be used by selecting from the following photopolymerizable unsaturated compounds. Examples of the monomer having one unsaturated bond include ester monomers of acrylic acid or methacrylic acid (polyethylene glycol acrylate (the number of ethylene oxide is 9 to 50), polyethylene glycol methacrylate (the number of ethylene oxide is 9 to 50) ), Methoxypolyethylene glycol acrylate (the number of ethylene oxide is 9 to 50)
), Methoxypolyethylene glycol methacrylate (the number of ethylene oxide is 9 to 50), methoxypolypropylene glycol acrylate (the number of propylene oxide is 7 to 40), methoxypolypropylene glycol methacrylate (the number of propylene oxide is 7 to 4).
0)), styrene-based monomers, polyolefin-based monomers, vinyl-based monomers, nitrile-based monomers, and the like.

As a monomer having two unsaturated bonds,
For example, polyethylene glycol diacrylate (the number of ethylene oxide is 9 to 50), polyethylene glycol dimethacrylate (the number of ethylene oxide is 9 to 5)
0), hexapropylene glycol diacrylate,
Hexapropylene glycol dimethacrylate, polypropylene glycol diacrylate (the number of propylene oxide is 7 to 40), polypropylene glycol dimethacrylate (the number of propylene oxide is 7 to 40)
), Polyethylene glycol polypropylene glycol diacrylate (total number of ethylene oxide and propylene oxide 7 to 50), polyethylene glycol polypropylene glycol dimethacrylate (total number of ethylene oxide and propylene oxide 7 to 50),
2,2-bis (4-acryloxydiethoxyphenyl)
Propane, 2,2-bis (4-methacryloxydiethoxyphenyl) propane, 2,2-bis (4-acryloxypolyethoxyphenyl) propane, 2,2-bis (4
-Methacryloxypolyethoxyphenyl) propane, bisphenol A diglycidyl ether diacrylate,
Examples thereof include urethane diacrylate compounds such as bisphenol A diglycidyl ether dimethacrylate and a reaction product of trimethylhexamethylene diisocyanate / cyclohexanedimethanol / 2-hydroxyethyl acrylate (2/1/2 molar ratio).

As a monomer having three unsaturated bonds,
For example, propylene oxide-modified trimethylolpropane trimethacrylate, alkyl-modified dipentaerythritol triacrylate and the like can be mentioned. Examples of the monomer having four unsaturated bonds include ditrimethylolpropane tetramethacrylate, alkyl-modified dipentaerythritol tetraacrylate, alkyl-modified dipentaerythritol tetramethacrylate, ethylene oxide-modified pentaerythritol tetraacrylate, and ethylene oxide-modified pentaerythritol tetraacrylate. Methacrylate and the like.

Examples of the monomer having five unsaturated bonds include, for example, dipentaerythritol pentaacrylate, dipentaerythritol pentamethacrylate, dipentaerythritol monohydroxypentaacrylate, dipentaerythritol monohydroxypentamethacrylate, and alkyl-modified diacrylate. And pentaerythritol pentaacrylate. Examples of the monomer having six unsaturated bonds include dipentaerythritol hexaacrylate, dipentaerythritol hexamethacrylate, and the like. These monomers are used alone or in combination of two or more. In addition, since unnecessary components need to be removed by baking when a phosphor pattern described later is prepared, (A) the photosensitive resin composition constituting the photosensitive resin composition layer containing the phosphor in the present invention. Since the photosensitive resin composition other than (d) the phosphor and the binder described later needs to have good thermal decomposability, this (d) photosensitive resin other than the phosphor and the binder is required. It is preferable that the composition does not contain any element other than carbon, hydrogen, oxygen, and nitrogen as an element constituting the composition.

Examples of (c) a photoinitiator that generates free radicals upon irradiation with actinic light include aromatic ketones (benzophenone, N, N'-tetramethyl-4,4'-diaminobenzophenone (Michler's ketone) ), N, N'-tetraethyl-4,4'-diaminobenzophenone, 4-methoxy-4'-dimethylaminobenzophenone, 2-benzyl-2-dimethylamino-1
-(4-morpholinophenyl) -butanone-1,2,2
-Dimethoxy-1,2-diphenylethan-1-one,
1-hydroxy-cyclohexyl-phenyl-ketone,
2-methyl-1- (4- (methylthio) phenyl) -2
-Morpholinopropanone-1,2,4-diethylthioxanthone, 2-ethylanthraquinone, phenanthrenequinone, etc., benzoin ether (benzoin methyl ether, benzoin ethyl ether, benzoin phenyl ether, etc.), benzoin (methyl benzoin, ethyl benzoin, etc.) , Benzyl derivatives (benzyldimethyl ketal, etc.), 2,4,5-triarylimidazole dimer (2- (o-chlorophenyl) -4,5-diphenylimidazole dimer, 2- (o-chlorophenyl) -4 2,5-di (m-methoxyphenyl) imidazole dimer, 2- (o-fluorophenyl) -4,5-phenylimidazole dimer, 2- (o-methoxyphenyl) -4,5-diphenylimidazole dimer Mers, 2-
(P-methoxyphenyl) -4,5-diphenylimidazole dimer, 2,4-di (p-methoxyphenyl)-
5-phenylimidazole dimer, 2- (2,4-dimethoxyphenyl) -4,5-diphenylimidazole dimer, etc., acridine derivatives (9-phenylacridine, 1,7-bis (9,9'- Acridinyl) heptane and the like. These are used alone or in combination of two or more.

The phosphor (d) in the present invention is not particularly limited, and a phosphor mainly composed of an ordinary metal oxide can be used. As a red-colored phosphor, for example, Y ₂ O ₂
S: Eu, Zn ₃ (PO ₄ ) ₂ : Mn, Y ₂ O ₃ : Eu, YV
O ₄ : Eu, (Y, Gd) BO ₃ : Eu, γ-Zn ₃ (PO ₄ )
₂ : Mn, (ZnCd) S: Ag + In ₂ O and the like. Examples of green-colored phosphors include ZnS: C
u, Zn ₂ SiO ₄ : Mn, ZnS: Cu + Zn ₂ Si
O ₄ : Mn, Gd ₂ O ₂ S: Tb, Y ₃ Al ₅ O ₁₂ : Ce,
ZnS: Cu, Al, Y ₂ O ₂ S: Tb, ZnO: Zn,
ZnS: Cu, Al + In ₂ O ₃ , LaPO ₄ : Ce, T
_{b, BaO · 6Al 2 O 3} : Mn , and the like. Examples of the blue-emitting phosphor include ZnS: Ag and ZnS:
Ag, Al, ZnS: Ag, Ga, Al, ZnS: A
g, Cu, Ga, Cl, ZnS: Ag + In ₂ O ₃ , Ca
₂ B ₅ O ₉ Cl: Eu ²⁺ , (Sr, Ca, Ba, Mg) ₁₀ (P
O ₄ ) ₆ Cl ₂ : Eu ²⁺ , Sr ₁₀ (PO ₄ ) ₆ Cl ₂ : Eu ²⁺ ,
BaMgAl ₁₀ O ₁₇ : Eu ²⁺ , BaMgAl ₁₄ O ₂₃ : E
u ²⁺ , BaMgAl ₁₆ O ₂₆ : Eu ^{2+ and the} like.

In the present invention, the particle diameter of the phosphor (d) is as follows:
0.1 to 20 μm, preferably 1 to 15 μm
Is more preferable, and particularly preferably 2 to 8 μm. When the particle size is less than 0.1 μm, the luminous efficiency tends to decrease, and when it exceeds 20 μm, the dispersibility tends to decrease. Further, the shape of the phosphor (d) in the present invention is preferably spherical, and the surface area thereof is preferably smaller.

The amount of the component (a) in the present invention is as follows:
The total amount of the component (a) and the component (b) is preferably 10 to 90 parts by weight based on 100 parts by weight, and more preferably 20 to 8 parts by weight.
More preferably, it is 0 parts by weight. If this blending amount is 1
If it is less than 0 parts by weight, when the photosensitive element is supplied in the form of a roll, the photosensitive resin composition containing the phosphor oozes out from the end of the roll (hereinafter, referred to as edge fusion), so that when the photosensitive element is laminated, There is a tendency that the film is difficult to be unwound from the roll, and the extruded portion is partially and excessively buried in the space of the PDP substrate, causing a problem such as a remarkable decrease in manufacturing yield and a decrease in film formability. , 90 parts by weight, the sensitivity tends to be insufficient.

The amount of the component (b) in the present invention is as follows:
The total amount of the component (a) and the component (b) is preferably 10 to 90 parts by weight based on 100 parts by weight, and more preferably 20 to 8 parts by weight.
More preferably, it is 0 parts by weight. If this blending amount is 1
If the amount is less than 0 parts by weight, the sensitivity of the photosensitive resin composition containing the phosphor tends to be insufficient, and if it exceeds 90 parts by weight, the photocured product tends to become brittle, In such a case, the photosensitive resin composition containing the phosphor tends to exude from the edge due to the flow, and the film-forming property tends to decrease.

The amount of the component (c) in the present invention is as follows:
The amount is preferably 0.01 to 30 parts by weight based on 100 parts by weight of the total of the components (a) and (b).
More preferably, it is 1 to 20 parts by weight. When the amount is less than 0.01 part by weight, the sensitivity of the photosensitive resin composition containing the phosphor tends to be insufficient, and when the amount exceeds 30 parts by weight, the photosensitive resin composition containing the phosphor tends to be insufficient. The absorption of active light on the exposed surface of the object tends to increase, and the internal light curing tends to be insufficient.

In the present invention, the amount of the component (d) is
The amount is preferably from 10 to 500 parts by weight, more preferably from 10 to 400 parts by weight, based on 100 parts by weight of the total of the components (a), (b) and (c).
It is particularly preferred that the content be 0 to 300 parts by weight, and 50 to 2 parts by weight.
It is extremely preferred to be 50 parts by weight. When the amount is less than 10 parts by weight, the luminous efficiency tends to decrease when light is emitted as a PDP. Flexibility tends to decrease.

In the present invention, the photosensitive resin composition constituting the photosensitive resin composition layer containing the phosphor (A) does not increase in viscosity for a long period of time and has good storage stability.
A compound having a carboxyl group can be contained. As the compound having a carboxyl group, for example,
Examples include saturated fatty acids, unsaturated fatty acids, aliphatic dibasic acids, aromatic dibasic acids, aliphatic tribasic acids, aromatic tribasic acids, and the like.

Specifically, for example, formic acid, acetic acid, chloroacetic acid, dichloroacetic acid, trichloroacetic acid, propionic acid,
Capric, undecanoic, lauric, tridecanoic, myristic, pentadecanoic, palmitic, heptadecanoic, stearic, nonadecanoic, arachidic, palmitooleic, oleic, elaidic, linolenic, linoleic, Oxalic acid, malonic acid, methylmalonic acid, ethylmalonic acid, monomethyl malonate,
Monoethyl malonate, succinic acid, methylsuccinic acid, adipic acid, methyladipic acid, pimelic acid, suberic acid,
Azelaic acid, sebacic acid, maleic acid, itaconic acid,
Examples include phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, citric acid, salicylic acid, pyruvic acid, malic acid and the like. Among them, oxalic acid, malonic acid, methylmalonic acid, ethylmalonic acid, citric acid and the like are preferable, and oxalic acid, malonic acid, citric acid and the like are more preferable in terms of a high effect of suppressing thickening. These are used alone or in combination of two or more.

The compounding amount of the compound having a carboxyl group is 0.01 to 30 parts by weight per 100 parts by weight of the component (a).
It is preferable to use parts by weight. When the blending amount is 0.01
If the amount is less than 30 parts by weight, the effect of storage stability tends to decrease, and if it exceeds 30 parts by weight, sensitivity tends to be insufficient.

In the present invention, a dispersant is preferably added to the photosensitive resin composition constituting the photosensitive resin composition layer containing the phosphor (A) in order to improve the dispersion of the phosphor. . Dispersants include inorganic dispersants (silica gel, bentonite, kaolinite, talc, hectorite, montmorillonite, saponite, beidellite, etc.), and organic dispersants (aliphatic amide, aliphatic ester). Polyethylene oxide type, sulfate type anion activator, polycarboxylic acid amine salt type, polycarboxylic acid type, polyamide type, polymer polyether type, acrylic copolymer type, special silicon type, etc.).
These can be used alone or in combination of two or more.

The amount of the dispersant used is not particularly limited, and is preferably 0.01 to 10 parts by weight per 100 parts by weight of the component (a).
It is preferably 0 parts by weight. If this usage is 0.0
If it is less than 1 part by weight, the effect of addition tends not to be exhibited,
If the amount exceeds 100 parts by weight, pattern formation accuracy (the property of obtaining a pattern formed of a photosensitive resin composition containing a phosphor, which is dimensionally accurate and desired in a desired shape after development) tends to decrease.

In the present invention, the photosensitive resin composition constituting the photosensitive resin composition layer containing the phosphor (A) is bonded to the PDP substrate after firing so that the phosphor is not peeled off from the PDP substrate. It is preferable to use an adhesive. Examples of the binder include a low-melting glass, a metal alkoxide, and a silane coupling agent. These are used alone or in combination of two or more. The amount of the binder used is not particularly limited, and is preferably 0.01 to 100 parts by weight, more preferably 0.05 to 50 parts by weight, per 100 parts by weight of the component (d). Preferably
It is particularly preferred that the amount be 0.1 to 30 parts by weight. If the amount is less than 0.01 part by weight, the binding effect of the phosphor tends not to be exhibited, and if it exceeds 100 parts by weight, the luminous efficiency tends to decrease.

In the present invention, the photosensitive resin composition constituting the photosensitive resin composition layer containing the phosphor (A) includes a dye, a color former, a plasticizer, a pigment, a polymerization inhibitor, a surface modifier, Agents, stabilizers, adhesion-imparting agents, thermosetting agents, and the like can be added as necessary.

In the present invention, the photosensitive resin composition layer containing the phosphor (A) is uniformly dispersed by dissolving or mixing the above-mentioned components in a solvent capable of dissolving or dispersing. It can be supplied as a solution in the form of a photosensitive element having a support film obtained by coating and drying on a support film and a photosensitive resin composition layer (A) containing a phosphor.

Examples of the solvent capable of dissolving or dispersing the above components include toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, γ-butyrolactone, N-methylpyrrolidone, dimethylformamide, tetramethylsulfone, and the like. Examples thereof include diethylene glycol dimethyl ether, diethylene glycol monobutyl ether, chloroform, methylene chloride, methyl alcohol, and ethyl alcohol. These are used alone or in combination of two or more.

Examples of the support film include chemically and thermally stable and flexible materials, such as polyethylene terephthalate, polycarbonate, polyethylene and polypropylene.
Among them, polyethylene terephthalate and polyethylene are preferred, and polyethylene terephthalate is more preferred. Since the support film must be removable from the photosensitive resin composition layer containing the phosphor (A) later, the support film may have been subjected to a surface treatment that makes removal impossible, Do not be. The thickness of the support film is preferably 5 to 100 μm, more preferably 10 to 80 μm.

As the coating method, known methods can be used, and examples thereof include a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, a curtain coating method and the like. The drying temperature is 6
The temperature is preferably from 0 to 130 ° C, and the drying time is preferably from 3 minutes to 1 hour. Further, in this coating step, each component constituting the photosensitive resin composition layer containing the phosphor (A) is dissolved or mixed in a solvent capable of dissolving or dispersing, thereby contacting with a uniformly dispersed solution. It is preferable that the material of the coating device in the portion to be formed is a nonmetallic material. In the case where the material of the coating device at the portion that comes into contact with the solution constituting the (A) phosphor-containing photosensitive resin composition layer is a metal, (A) the phosphor-containing photosensitive resin composition layer The coating device that comes into contact with the phosphor is polished by the phosphor in the solution that constitutes (A).
It tends to be mixed as an impurity into the solution constituting the photosensitive resin composition layer containing the phosphor.

The photosensitive element having the support film and the photosensitive resin composition layer containing the phosphor (A) is further provided on the photosensitive resin composition layer containing the phosphor (A). A peelable cover film may be laminated. Examples of such a cover film include polyethylene, polypropylene, polyethylene terephthalate, polycarbonate, and the like. A) It is preferable that the adhesive strength to the photosensitive resin composition layer containing the phosphor is smaller. The thickness of the cover film is not particularly limited, but is preferably 5 to 100 μm,
More preferably, it is set to μm. The photosensitive element thus obtained can be stored in a roll.

The thickness of the photosensitive resin composition layer containing the phosphor (A) in the present invention is not particularly limited.
The thickness is preferably 200 μm, more preferably 20 to 120 μm, and particularly preferably 30 to 80 μm. If the thickness is less than 10 μm, the phosphor pattern after firing tends to be thin and the luminous efficiency tends to decrease. If the thickness exceeds 200 μm, the phosphor pattern after firing becomes thick and the emission area of the phosphor screen is reduced. As a result, the luminous efficiency tends to decrease.

The photosensitive resin composition layer containing the phosphor (A) in the present invention has a viscosity at 100 ° C. of 1 to 1 × 10
It is preferably ⁷ Pa · sec, more preferably 2~1 × 10 ⁶ Pa · sec, particularly preferably from ^{5~1 × 10 5 Pa · sec,} 10~1 × 10 4 Pa · Very preferably sec. The viscosity at 100 ° C is 1 Pa · s
If it is less than ec, when the viscosity at room temperature becomes too low to form a photosensitive element, the photosensitive resin composition layer containing the phosphor (A) tends to bleed from the edge by flow,
Film formability tends to decrease. Also, 1 × 10
^If it exceeds ⁷ Pa · sec, the formability of the (A) phosphor-containing photosensitive resin composition layer on the inner surface of the concave portion of the substrate having irregularities described later tends to decrease.

The sensitivity of the photosensitive resin composition containing the phosphor (A) in the present invention is determined in the step of irradiating actinic rays imagewise, which will be described later, by Hitachi Chemical Co., Ltd.
(A) phosphor remaining after imagewise irradiation with actinic light at a predetermined dose of actinic radiation using a 21-step step tablet or the like and development in a step of removing unnecessary portions by development described later. Is preferably 1 to 21 steps, more preferably 1.5 to 18 steps, and 2 to 1 steps.
It is particularly preferred to have five stages.

The resolution of the photosensitive resin composition containing the phosphor (A) in the present invention is determined by Hitachi Chemical Industries, Ltd.
Co., Ltd., using a photomask for resolution evaluation or the like, irradiating the active light imagewise at a predetermined amount of active light irradiation, and developed when it is developed in a step of removing unnecessary portions by development described below ( A) The minimum line / space of the photosensitive resin composition containing the phosphor is preferably 1 mm / 1 mm or less, more preferably 900 μm / 900 μm or less, and particularly preferably 800 μm / 800 μm. .

The adhesiveness of the photosensitive resin composition containing the phosphor (A) in the present invention is determined by the following formula.
Co., Ltd., using a photomask for adhesion evaluation, etc., by irradiating actinic rays imagewise with a predetermined actinic ray irradiation amount, when developed in the step of removing unnecessary portions by development described below, remained (A) The minimum line / space of the photosensitive resin composition containing the phosphor is 400 μm / 400 μm.
Or less, more preferably 350 μm / 400 μm or less, and more preferably 300 μm / 400 μm.
Is particularly preferred.

The material constituting the embedded layer (B) in the present invention is a material which is deformed by an external stress and which can be separated from the photosensitive resin composition layer containing the phosphor (A). There is no particular limitation as long as the material is, for example, polyethylene, polypropylene, polymethylpentene, polycarbonate, polyurethane, Teflon, rubbers (butadiene rubber, styrene butadiene rubber, silicon rubber, etc.), polyvinyl chloride, polyvinyl acetate , Polyvinylidene chloride, polystyrene, polyvinyl toluene, polyacrylate, polymethacrylate, copolymer of ethylene and vinyl acetate, copolymer of ethylene and acrylate, copolymer of vinyl chloride and vinyl acetate, styrene And acrylate or methacrylate Copolymer of vinyl toluene and acrylate or methacrylate, polyvinyl alcohol-based resin (polyacrylate or polymethacrylate hydrolyzate, polyvinyl acetate hydrolyzate, ethylene Hydrolyzate of copolymer with vinyl acetate, hydrolyzate of copolymer of ethylene and acrylate, hydrolyzate of copolymer of vinyl chloride and vinyl acetate, styrene and acrylate or methacrylic acid A hydrolyzate of a copolymer with an ester,
Hydrolysates of copolymers of vinyl toluene and acrylic or methacrylic esters, etc.), water-soluble salts of carboxyalkyl cellulose, water-soluble cellulose ethers, water-soluble salts of carboxyalkyl starch, polyvinylpyrrolidone, unsaturated carboxylic acids Examples thereof include a resin having a carboxyl group obtained by copolymerizing an acid and an unsaturated monomer copolymerizable therewith. These are used alone or in combination of two or more.

Further, (B) the buried layer in the present invention comprises (B) a photoinitiator which generates free radicals upon irradiation with actinic light in (A) a photosensitive resin composition layer containing a phosphor. From the viewpoint of suppressing migration to the buried layer and the like, it can also be constituted by a resin composition containing a photoinitiator that generates free radicals upon irradiation with active light. Examples of the photoinitiator that generates free radicals upon irradiation with actinic light include (A) an actinic light that can be used in the photosensitive resin composition constituting the photosensitive resin composition layer containing the (A) phosphor described above. Photoinitiators that generate free radicals upon irradiation can be used.

Among the above-mentioned materials, for example, polyethylene, polypropylene, Teflon, etc. formed into a film by a melt extrusion method or the like can be used as the (B) burying layer. The (B) embedding layer in the present invention is a solution in which the resin or the like constituting the embedding layer is uniformly dissolved or dispersed by dissolving or mixing the same in a solvent capable of dissolving or dispersing them. It can also be supplied in the form of a film or sheet obtained by coating and drying.

The support film is chemically and thermally stable and is composed of a flexible substance, for example, polyethylene terephthalate, polycarbonate, polyethylene, polypropylene and the like.
Among them, polyethylene terephthalate and polyethylene are preferred, and polyethylene terephthalate is more preferred. The thickness of the support film is preferably from 5 to 100 μm, more preferably from 10 to 30 μm. As the coating method, a known method can be used, and examples thereof include a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, and a curtain coating method. (B) in the present invention
The thickness of the burying layer is not particularly limited, but is preferably from 10 to 200 μm, more preferably from 20 to 100 μm, from the viewpoint of embedding into the space of the PDP substrate.

Further, a releasable cover film can be further laminated on the (B) embedding layer in the above-mentioned film or sheet. Examples of the cover film include polyethylene, polypropylene, polyethylene terephthalate, and polycarbonate.
Than the adhesive strength between the support film and the (B) buried layer,
It is preferable that the adhesive strength between the cover film and the burying layer (B) is smaller. Also, (B) described later.
In the step of removing the buried layer, (B) in order to improve the releasability of the buried layer, (A) between the (B) buried layer and the cover film, (A) A film having a small adhesive force between the photosensitive resin composition layer containing the phosphor and the cover film, and a film or the like for easily separating the layer (B) and the layer (A) can be further laminated. Such a film-shaped or sheet-shaped (B) embedding layer can be stored in a roll shape.

Hereinafter, an example of the method for producing a phosphor pattern of the present invention will be described for each step with reference to FIGS. FIGS. 3 and 4 are schematic views showing each step of an example of the method for manufacturing a phosphor pattern of the present invention.

[(I) Pressure is applied to the (B) buried layer while (B) the buried layer is disposed on the (A) phosphor-containing photosensitive resin composition layer on the substrate having irregularities. And (A) a step of laminating a photosensitive resin composition layer containing a phosphor and (B) an embedding layer on a substrate having irregularities. In this step (I), (A) The (B) layer is pressure-bonded in a state where the (B) burying layer is disposed on the photosensitive resin composition layer containing the phosphor. FIG. 3 shows an example of the step of pressing the (B) layer in a state where (B) the burying layer is disposed on the (A) photosensitive resin composition layer containing the phosphor on the substrate having the unevenness.
This is shown in (I) and FIG. 3 (II). FIG. 3 (I) shows a state in which (A) a photosensitive resin composition layer 5 containing a phosphor is laminated on a PDP substrate 1 (substrate having irregularities) on which barrier ribs 2 are formed. In FIG. 3 (I), as a method of laminating (A) the photosensitive resin composition layer 5 containing a phosphor on the PDP substrate 1 on which the barrier ribs 2 are formed, for example, the above-mentioned support film and (A) A method of laminating using a photosensitive element having a photosensitive resin composition layer containing a phosphor is exemplified.

In the case of laminating using this photosensitive element, if a cover film is present on the photosensitive element, the cover film is removed, and then the PDP substrate 1 is provided with ( A) The photosensitive resin composition layer 5 containing the phosphor may be simply placed on the photosensitive resin composition layer 5 so as to be in contact with the photosensitive resin composition layer 5, may be pressed by a pressure roll or the like, or may be reduced in pressure. At this time, heating may be involved.

The pressure for pressurization is gauge pressure (normal pressure 1).
atm is 0), preferably 1 × 10 ³ to 1 × 10 ⁶ Pa, more preferably 1 × 10 ^{4 to} 5 × 10 ⁵ Pa, more preferably 5 × 1 ⁴ to 2 × 10 ⁵ Pa It is particularly preferred to be ⁵ Pa. Since the pressing pressure at the time of heating and pressing is a cylinder pressure of a laminator which is a pressing device, it is preferable to convert the pressure into a linear pressure of 24 to 2.4 × 10 ⁴ N / m, if converted to a linear pressure. It is more preferably 4 × 10 ^{2 to} 1.2 × 10 ⁴ N / m, and particularly preferably 2.4 × 10 ^{2 to} 5 × 10 ³ N / m. If the compression pressure is less than 24 N / m, the embedding property of the (A) photosensitive resin composition layer 5 containing the phosphor into the recessed space of the PDP substrate tends to decrease, and 2.4 × 10 ⁴ N If it exceeds / m, the barrier rib of the PDP substrate tends to be broken. Here, the linear pressure is 5 ×
As a method of setting to 10 ³ N / m, for example, when the cylinder diameter is 4
Using a laminator of 0 mmφ and a substrate of 3 mm in thickness, 10 cm in length and 10 cm in width (square), and setting the cylinder pressure of the laminator (normal pressure 1 atm is 0) to 2 kgf / cm ² , Pressure of 5 × 10 ³ N / m, using a laminator with a cylinder diameter of 40 mmφ, thickness 3 mm, length 20 cm
A method of using a 20 cm (square) substrate and setting the cylinder pressure of the laminator (normal pressure 1 atm is 0) to 4 kgf / cm ² to make the linear pressure 5 × 10 ³ N / m, etc. Is mentioned.

As the material of the pressure roll or the like when the pressure is applied, from the viewpoint of further improving the embedding property of the photosensitive resin composition layer 5 containing the phosphor (A) described later into the space,
It is preferable that the surface is rich in flexibility such as rubber and plastic. Note that the thickness of the layer made of a material having high flexibility is preferably 200 to 400 μm. Further, the heating temperature is preferably 10 to 140 ° C, more preferably 20 to 135 ° C, and particularly preferably 30 to 130 ° C. When the heating temperature is lower than 10 ° C., the photosensitive resin composition layer 5 containing the phosphor (A) tends to be unable to sufficiently adhere to the PDP substrate. Is liable to be thermally cured.

If the photosensitive element is heated as described above, it is not necessary to pre-heat the PDP substrate 1 (substrate having irregularities) on which the barrier ribs 2 are formed. In order to further improve the embedding property of the photosensitive resin composition layer 5 contained in the space, the P
It is preferable to perform a pre-heat treatment on the DP substrate. further,
For the same purpose, the above-mentioned operations of the pressure bonding and the heat pressure bonding can be performed under a reduced pressure of 5 × 10 ⁴ Pa or less. Also, after the lamination is completed in this manner, in the range of 30 to 150 ° C,
Heating can be performed for 1 to 120 minutes. At this time, the support film can be removed as necessary.

FIG. 3 (II) shows that (B) the buried layer 6 is disposed on the (A) photosensitive resin composition layer 5 containing the phosphor, and (B) the buried layer 6 is press-bonded to form a barrier rib. (A) Photosensitive resin composition layer 5 containing phosphor and (B) buried layer in space surrounded by barrier rib wall surface and base bottom surface of PDP substrate 1 (substrate having irregularities) on which substrate 2 is formed 6 is shown.

In FIG. 3 (II), the method of (A) disposing the (B) burying layer 6 above the phosphor-containing photosensitive resin composition layer 5 and press-bonding it is, for example, as shown in FIG.
When the support film is present on the photosensitive resin composition layer 5 containing the phosphor (A) in the state (I),
After removing the support film, (B) the buried layer 6 is placed on the photosensitive resin composition layer 5 containing the phosphor (A).
(If a cover film is present, after removing the cover film), and then press-fitting with a press-fit roll 7 or the like. Further, in order to further improve the embedding property of the photosensitive resin composition layer 5 containing the phosphor into the space of the PDP substrate, (B) the case where a support film exists on the embedding layer 6 May be pressed by a pressure roll 7 or the like while removing the support film as necessary.

The pressing pressure at this time is a gauge pressure (normal pressure 1 at
m is 0), preferably 1 × 10 ⁴ to 1 × 10 ⁷ Pa, more preferably 2 × 10 ^{4 to} 5 × 10 ⁶ Pa, and more preferably 4 × 10 ⁴ to 1 × 10 ⁶ Pa. It is particularly preferred to be Pa. If this pressure is less than 1 × 10 ⁴ Pa,
(A) PDP of photosensitive resin composition layer 5 containing phosphor
There is a tendency that the embedding property of the substrate into the space tends to decrease,
When the pressure exceeds 10 ⁷ Pa, the barrier ribs of the PDP substrate tend to be broken. Since the pressing pressure at the time of the above-mentioned heat pressing is the cylinder pressure of the laminator which is a pressing device, when it is converted into a linear pressure, the linear pressure is 2.4 × 10 ^{2 to} 2.4 × 10 ^5.
N / m, preferably 4.8 × 10 ^{2 to} 1.2 × 1
More preferably to ^{0 5 N / m, 9.6 ×} 10 2 ~
It is particularly preferred to be 2.4 × 10 ⁴ N / m. If the pressing pressure is less than 2.4 × 10 ² N / m, the embedding property of the photosensitive resin composition layer 5 containing the phosphor (B) into the recessed space of the PDP substrate tends to decrease. .4 × 10 ⁵ N / m
If it exceeds, the barrier rib of the PDP substrate tends to be broken.

Here, as a method of setting the linear pressure to 5 × 10 ³ N / m, for example, a laminator having a cylinder diameter of 40 mmφ is used, and a substrate having a thickness of 3 mm and a length of 10 cm × width of 10 cm (square) is used. By setting the cylinder pressure of the laminator (normal pressure 1 atm is 0) to 2 kgf / cm ² , the linear pressure becomes 5
A method of setting to × 10 ³ N / m, using a laminator having a cylinder diameter of 40 mmφ and a substrate having a thickness of 3 mm and a length of 20 cm × width 20 cm (square), the cylinder pressure of the laminator (normal pressure 1 atm is 0) ) Is set to 4 kgf / cm ^2, and the linear pressure is set to 5 × 10 ³ N / m.

In order to further improve the embedding property of the photosensitive resin composition layer 5 containing the phosphor (A) into the space, the surface of the pressure roll is rich in flexibility such as rubber and plastic. A material of a material can also be used.
The thickness of the layer made of a material having a high flexibility is 200 to 40.
Preferably, it is 0 μm.

Further, from the viewpoint of further improving the embedding property of the photosensitive resin composition layer 5 containing the phosphor into the space, (B) heating the embedding layer 6 with a heating roll or the like, It can also be laminated by pressing against the surface of the substrate on which the barrier ribs are formed. The heating temperature at the time of heating is preferably from 10 to 140 ° C, preferably from 20 to 13 ° C.
The temperature is more preferably 5 ° C, particularly preferably 30 to 130 ° C. If the heating temperature is lower than 10 ° C., the (A) P of the photosensitive resin composition layer 5 containing the phosphor is
The embedding property of the DP substrate in the space tends to decrease,
When the temperature exceeds 140 ° C., the photosensitive resin composition layer 5 having the phosphor (A) tends to be thermally cured.

(B) If the buried layer 6 is heated as described above, it is not necessary to pre-heat the PDP substrate on which the (A) photosensitive resin composition layer 5 containing the phosphor is laminated. (A) From the viewpoint of further improving the embedding property of the photosensitive resin composition layer 5 containing the phosphor into the space, (A)
PD having laminated photosensitive resin composition layer 5 containing phosphor
It is preferable that the substrate for P is pre-heat treated. The preheating temperature at this time is preferably 30 to 140 ° C., and
The preheating time is preferably 0.5 to 20 minutes.
In order to further improve the embedding property of the photosensitive resin composition layer 5 containing the phosphor (A) into the space, the surface of the thermocompression bonding roll is made of a flexible material such as rubber or plastic. Things can also be used. Note that the thickness of the layer made of a material having high flexibility is preferably 200 to 400 μm.

Further, for the same purpose, the above-mentioned press-bonding and heat-pressing operations can be performed under reduced pressure of 5 × 10 ⁴ Pa or less. After the lamination is completed, 30 to 150 ° C
Can be heated for 1 to 120 minutes. At this time, if a support film exists on the (B) buried layer 6, the support film may be removed as necessary. In this manner, (A) the photosensitive resin composition layer 5 containing the phosphor can be uniformly formed in the space of the PDP substrate.

In the step (I) of the present invention,
(A) Photosensitive resin composition layer 5 containing phosphor and (B)
The buried layer 6 and the buried layer 6 can also be laminated while heating and pressing at the same time. As the thermocompression bonding conditions when the two layers are thermocompression-bonded at the same time, the conditions for thermocompression bonding of the (B) buried layer 6 can be used. Further, in the step (II) (B) for removing the buried layer described later,
(B) After the step (I), the PDP substrate is cooled (usually -50 to 50) so that the buried layer can be easily peeled.
° C range). Further, by changing the combination of the above-described heating conditions during the thermocompression bonding, the pressure bonding conditions, the preheating conditions of the PDP substrate, and (B) the thickness of the buried layer 6, etc., as shown in FIG. It can also be laminated in a state. FIG. 5 is an example after the step (I) in the method for producing a phosphor pattern of the present invention.

Regarding the layer thickness of (A) the photosensitive resin composition layer 5 containing the phosphor and (B) the embedding layer 6, specifically, irregularities are formed on a substrate having irregularities (PDP substrate). In the region (A) of the photosensitive resin composition layer containing the phosphor and the region (B) of the burying layer,
The ratio ((V ¹ ) / (V ¹ ) / (V ¹ ) of the total volume (V ¹ ) of the photosensitive resin composition layer containing the phosphor and the (B) buried layer to the volume (V ² ) of the concave space of the substrate having irregularities. V ² )) is (V ¹ ) /
It is preferable that (V ² ) = 1 to 2 in that a phosphor pattern having a uniform shape with high accuracy can be formed. At this time, if (V ¹ ) / (V ² ) is in the range of 1 to 1.2, as shown in FIG. 3 (II), (A) Photosensitive resin composition layer 5 containing phosphor
(A) The photosensitive resin composition layer 5 containing the phosphor tends to be formed on the inner surface of the concave portion, and (V ¹ ) / (V ² ) is 1.2. In the case of exceeding the range of 2 or less, as shown in FIG. 5, in the state where the photosensitive resin composition layer 5 containing the phosphor (A) remains on the convex portion, the phosphor (A) Is liable to be formed on the inner surface of the concave portion. Here, (V ¹ )
When / (V ² ) is less than 1, there is a tendency that a portion where the photosensitive resin composition layer 5 containing the phosphor (A) cannot be adhered to the inner surface of the concave portion, and (V ¹ ) / (V ² )
Exceeds 2, the cross-sectional shape of the multicolor phosphor pattern described later tends to be non-uniform.

(A) When the PDP substrate is manufactured before the photosensitive resin composition layer 5 containing the phosphor is laminated, the PDP substrate may be entirely or partially shrunk by heating or the like. When the PDP substrate shrinks almost completely, and the PDP substrate shrinks completely or partially, the alignment in the step (III) of irradiating actinic rays imagewise described later is performed. From the viewpoint of increasing the tolerance of accuracy, as shown in FIG. 3 (II), the photosensitive resin composition layer 5 containing the phosphor (A) is formed on the convex portion.
(V ¹ ) / (V ² ) is preferably in the range of 1 to 1.2, and almost no shrinkage of the PDP substrate occurs. If not, the layers may be laminated as shown in FIG. 3 (II), and as shown in FIG.
The layers may be laminated in a state where the photosensitive resin composition layer 5 containing the phosphor remains.

[(II) Step of Removing (B) Buried Layer] (B) FIG.
It was shown to. In FIG. 3 (III), (B) buried layer 6
For example, as a method of removing the buried layer 6 (B)
Above, a method of physically peeling the (B) buried layer 6 using an adhesive tape or using a hook-shaped jig or the like may be used. Further, for the purpose of improving workability, a method (B) of peeling off the buried layer 6 using a force such as static electricity or suction may be used. (B) Immediately after the embedded layer 6 is peeled off, using a winding roll or the like (B)
The buried layer 6 can be wound.

[(III) (A) Step of irradiating actinic ray imagewise to photosensitive resin composition layer containing phosphor] The state of irradiating actinic ray 9 imagewise is shown in FIG. 4 (IV). Was. FIG.
In (IV), the method of irradiating actinic rays 9 imagewise includes, as shown in FIG. 3 (III), (A) a negative film, a positive film on the photosensitive resin composition layer 5 containing a phosphor, The actinic rays 9 can be radiated imagewise through a photomask 8 such as described above. At this time, the above-mentioned support film may be newly coated on the photosensitive resin composition layer 5 containing the phosphor (A), and the actinic ray 9 may be irradiated imagewise. If (B) the buried layer 6 is made of a material that transmits the actinic ray 9, this step is performed in a state where the (B) buried layer is arranged, and then (II)
(B) A step of removing the buried layer can also be performed.

The transmission width of the actinic rays 9 of the photomask 8 is usually the opening width of the concave portion of the PDP substrate. In the step (I), the transmission width is as shown in FIG. In this case, it is preferable that the transmission width is the same as the opening width of the concave portion of the PDP substrate or the transmission width is wider than the opening width of the concave portion of the PDP substrate, from the viewpoint that the latitude of the positioning accuracy can be increased. On the other hand, in the step (I), FIG.
In the case of laminating as described above, it is necessary to set the transmission width equal to the opening width of the concave portion of the PDP substrate or the transmission width smaller than the opening width of the concave portion of the PDP substrate, so that undesired light curing on the barrier ribs is prevented. This is preferable because the latitude of the positioning accuracy can be increased without leaving the photosensitive resin composition layer containing the phosphor.

As the actinic ray 9, a known actinic light source can be used, and examples thereof include light generated from a carbon arc, a mercury vapor arc, a xenon arc, and the like.
Since the sensitivity of the photoinitiator is usually maximal in the ultraviolet region, the active light source in that case should be one that effectively emits ultraviolet light. When the photoinitiator is sensitive to visible light, for example, 9,10-phenanthrenequinone or the like, visible light is used as the active light 9, and the light source is as described above. In addition, a photo flood bulb, a sun lamp, and the like can be used.

The actinic rays 9 in the present invention include parallel rays and scattered rays. Either parallel rays or scattered rays may be used, or both may be used in one step. , Both may be used separately in two stages. If both are used separately in two stages, either may be performed first. The irradiation amount of the actinic ray 9 in the present invention is not particularly limited, but is preferably 5 to 10000 mJ / cm ^2, and more preferably 7 to 5000 mJ / cm ² from the viewpoint of photocurability and the like. Preferably 1
It is particularly preferred to be 0 to 1000 mJ / cm ² .

[(IV) Step of Forming Pattern by Selectively Removing (A) Phosphor-Containing Photosensitive Resin Composition Layer Irradiated with Active Rays Imagewise by Development] Unnecessary Parts are Removed by Development FIG. 4 (V) shows the state after the above. FIG.
In (V), 5 ′ is a photosensitive resin composition layer containing a phosphor after photocuring. In FIG. 4 (V), as a developing method, for example, after the state of FIG. 4 (IV), (A) a case where a support film is present on the photosensitive resin composition layer 5 containing a phosphor. After removing this, development is performed by a known method such as spraying, rocking immersion, brushing, and scraping using a known developing solution such as an alkaline aqueous solution, an aqueous developing solution, or an organic solvent to remove unnecessary portions. And the like.

As a method for removing unnecessary portions of the photosensitive resin composition layer 5 containing the phosphor (A), the difference between the adhesiveness of the exposed portion and the unexposed portion is utilized. Dry development in which only unnecessary portions of the photosensitive resin composition layer 5 containing the adhesive having adhesiveness are removed can also be performed.

Examples of the base of the aqueous alkali solution include alkali hydroxides (such as hydroxides of lithium, sodium or potassium), alkali carbonates (such as lithium or sodium or potassium carbonate or bicarbonate), and alkali metal phosphates (such as carbonates or bicarbonates). Potassium phosphate, sodium phosphate, etc.), alkali metal pyrophosphates (sodium pyrophosphate, potassium pyrophosphate, etc.), tetramethylammonium hydroxide, triethanolamine, etc., among which sodium carbonate, tetramethylammonium hydroxide And the like are preferred. PH of aqueous alkaline solution used for development
Is preferably 9 to 11, and the temperature can be adjusted in accordance with the developability of the photosensitive resin composition layer 5 containing the phosphor (A). In addition, a surfactant, an antifoaming agent, a small amount of an organic solvent for accelerating the development, and the like can be mixed in the aqueous alkali solution.

Examples of the aqueous developer include those comprising water or an aqueous alkali solution and one or more organic solvents.
Here, as the base of the alkaline aqueous solution, in addition to the above substances, for example, borax, sodium metasilicate, ethanolamine, ethylenediamine, diethylenetriamine,
2-amino-2-hydroxymethyl-1,3-propanediol, 1,3-diaminopropanol-2-morpholine, tetramethylammonium hydroxide and the like. The pH of the aqueous developer is preferably from 8 to 12, more preferably from 9 to 10.

Examples of the organic solvent include acetone alcohol, acetone, ethyl acetate, alkoxyethanol having an alkoxy group having 1 to 4 carbon atoms, ethyl alcohol, isopropyl alcohol, butyl alcohol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, and diethylene glycol. Monobutyl ether and the like. These can be used alone or 2
Used in combination of more than one type.

An aqueous developing solution comprising water and one or more organic solvents (emulsion solution when the organic solvent does not dissolve in water). Examples of the organic solvent include acetone alcohol, acetone, ethyl acetate, and C 1 -C. Alkoxyethanol having 4 alkoxy groups, ethyl alcohol, isopropyl alcohol, butyl alcohol, diethylene glycol monomethyl ether, diethylene glycol monoethyl ether, diethylene glycol monobutyl ether, triethylene glycol monobutyl ether, dipropylene glycol monomethyl ether, dipropylene glycol monopropyl ether, 3-methyl-3-methoxybutyl acetate, 1,1,1-trichloroethane, N-methylpyrrolidone, N, N-dimethylformamide, cycle Hexanone, methyl isobutyl ketone, .gamma.-butyrolactone. These are used alone or in combination of two or more. The concentration of the organic solvent is usually in the range of 2 to 90% by weight, and the temperature can be adjusted according to the developability. Further, a small amount of a surfactant, an antifoaming agent and the like can be mixed in the aqueous developer.

The organic solvent developer used alone includes, for example, 1,1,1-trichloroethane, N-methylpyrrolidone, N, N-dimethylformamide, cyclohexanone, methyl isobutyl ketone, γ-butyrolactone and the like. These organic solvents are used to prevent ignition.
Water may be added in the range of 1 to 20% by weight. Also,
In known developing solutions such as water, an aqueous alkali solution, an aqueous developing solution (composed of water and one or more organic solvents or an aqueous alkali solution and one or more organic solvents), and an organic solvent, the phosphor is prevented from deteriorating during development. In view of the above, it is preferable that metal ions other than alkali metal ions or halogen ions are not included.

For the purpose of preventing the phosphor from deteriorating after the development, the base of the aqueous alkali solution remaining in the photosensitive resin composition layer 5 'containing the phosphor after photocuring is converted into an organic acid, an inorganic acid or Using these acid aqueous solutions, acid treatment (neutralization treatment) can be performed by a known method such as spraying, rocking immersion, brushing, and scraping. Examples of the acid include organic acids and inorganic acids such as saturated fatty acids, unsaturated fatty acids, aliphatic dibasic acids, aromatic dibasic acids, aliphatic tribasic acids, and aromatic tribasic acids.

As specific organic acids, for example, formic acid,
Acetic acid, chloroacetic acid, dichloroacetic acid, trichloroacetic acid, propionic acid, capric acid, undecanoic acid, lauric acid,
Tridecanoic acid, myristic acid, pentadecanoic acid, palmitic acid, heptadecanoic acid, stearic acid, nonadecanoic acid, arachidic acid, palmitooleic acid, oleic acid,
Elaidic acid, linolenic acid, linoleic acid, oxalic acid, malonic acid, methyl malonic acid, ethyl malonic acid, monomethyl malonate, monoethyl malonate, succinic acid, methyl succinic acid, adipic acid, methyl adipic acid, pimelic acid, suberic acid , Azelaic acid, sebacic acid, maleic acid, itaconic acid, phthalic acid, isophthalic acid, terephthalic acid, trimellitic acid, citric acid, salicylic acid, pyruvic acid, malic acid and the like. Also, specific inorganic acids include:
For example, sulfuric acid, hydrochloric acid, nitric acid and the like can be mentioned. Among them, those having a dissociation index pKa of 4 or less in an aqueous solution of formic acid, oxalic acid, malonic acid, citric acid, and the like are preferable because they have a high neutralization effect.

The pH of the aqueous acid solution used for the acid treatment is preferably from 2 to 6.
It can be adjusted in accordance with the acid resistance (durability that does not deteriorate with acid) of the P substrate (substrate having irregularities). Further, after the acid treatment (neutralization treatment), a step of washing with water can be performed.

After the development, UV irradiation or heating using a high-pressure mercury lamp or the like may be performed for the purpose of improving the adhesion and chemical resistance of the phosphor-containing photoresist on the surface of the space of the PDP substrate. At this time, the irradiation amount of the ultraviolet ray is usually 0.2 to 10 J / cm ² , and the irradiation may be accompanied by heating. The heating temperature is
The temperature is preferably 60 to 180 ° C, and 100 to 180 ° C.
C. is more preferable. The heating time is 15
It is preferable to set it for 90 minutes. Irradiation and heating of these ultraviolet rays may be performed separately from irradiation and heating, and either may be performed first.

When the photosensitive resin composition layer 4 containing the phosphor (A) remains on the protrusions as shown in FIG. 5, the exposure / development conditions and the misalignment of the photomask may cause the problem. By performing this step ((IV) step), the photosensitive resin composition layer (unnecessary part) containing the photocured phosphor remaining on the inner surface of the concave portion tends to remain. In this case, the photosensitive resin composition layer (unnecessary portion) containing the phosphor after the photocuring remaining on the inner surface of the concave portion can be completely removed by polishing or the like. Alternatively, instead of the polishing, an adhesive tape may be adhered to the unnecessary portion and then peeled off to physically remove only the unnecessary portion.
Further, assuming such a case, after forming a multicolor pattern composed of a photosensitive resin composition layer containing a phosphor that emits red, green, and blue to be described later, and before a firing step described later,
Applying or printing a black inorganic material paste containing a black inorganic pigment such as iron oxide, chromium oxide, and copper oxide and a low melting point glass frit on the upper part of the protrusion, or forming a black stripe using a black inorganic material-containing photosensitive element After that, the firing described below can be performed.

[(V) Step of Removing Unwanted Parts from the Pattern by Firing to Form Phosphor Pattern] FIG. 4 (VI) shows a state of forming the phosphor pattern after removing the unnecessary parts by firing. Was. In FIG. 4 (VI), 1
0 is a phosphor pattern. In FIG. 4 (VI), the firing method is not particularly limited, and a known firing method can be used to remove unnecessary components other than the phosphor and the binder to form a phosphor pattern. The firing temperature at this time is preferably from 350 to 800 ° C.,
More preferably, the temperature is set to 600 ° C. The firing time is preferably from 3 to 120 minutes, more preferably from 5 to 90 minutes. At this time, the heating rate is
0.5 to 50 ° C / min, preferably 1 to 45 ° C
/ Min is more preferable. Further, a step of maintaining the temperature between 350 and 450 ° C. before reaching the maximum firing temperature can be provided, and the holding time is 5 to 5.
Preferably, it is 100 minutes.

The method for producing a phosphor pattern according to the present invention is characterized in that (I) according to the present invention is advantageous in that the number of steps can be reduced.
Steps (V) to (IV) are repeated for each color to form a multicolor pattern composed of a photosensitive resin composition layer containing a phosphor that emits red, green, and blue light. It is preferable to form a multicolor phosphor pattern.
In the present invention, the photosensitive resin composition layer 5 containing the phosphor (A), which has each phosphor that emits red, blue, and green colors alone, is prepared in any order for the red, blue, and green colors. But you can do it.

The steps (I) to (IV) in the present invention are repeated for each color to form a multicolor pattern including a photosensitive resin composition layer containing a phosphor emitting red, green and blue colors. FIG. 6 shows the state after the completion. In FIG. 6, 5'a
Is a first color pattern, 5'b is a second color pattern, and 5'c is a third color pattern. FIG. 7 shows a state in which the multicolor phosphor pattern is formed by performing the step (V) in the present invention. In FIG. 7, 10a is the first color phosphor pattern, 10b is the second color phosphor pattern, and 10c is the third color phosphor pattern.

In the method of manufacturing a phosphor pattern according to the present invention, the steps (I) to (V) of the present invention are repeated for each color to reduce red,
It is preferable to form a multicolor phosphor pattern that emits green and blue light.

In the method for producing a phosphor pattern according to the present invention, the step (I) includes the step of (Ia) having a (B) releasable buried layer as a buried layer on the support film. A photosensitive element having a (A) phosphor-containing photosensitive resin composition layer thereon, and a (A) phosphor-containing photosensitive resin composition layer in contact with a substrate having irregularities. It is preferable that this is a step of laminating in terms of workability and environmental safety. in this case,
The method for producing the phosphor pattern is as follows: (Ia) A photosensitive resin containing (B) a peelable embedding layer as an embedding layer on a support film, and (A) a phosphor containing thereon The photosensitive element having the composition layer is heated and pressed so that the photosensitive resin composition layer containing the phosphor (A) is in contact with the uneven surface of the substrate having the unevenness, and the photosensitive element is formed on the uneven surface. Laminating a photosensitive resin composition layer containing a phosphor and (B) a (Ba) peelable burying layer as a burying layer, (IIa) (B) a (Ba) peelable burying layer as a burying layer Removing (III)
a) a step of (A) irradiating the photosensitive resin composition layer containing the phosphor imagewise with actinic rays, and (IVa) developing (A) removing unnecessary portions from the photosensitive resin composition layer containing the phosphor by development. The method includes the step of removing and the step of (Va) removing unnecessary components from the photosensitive resin composition layer containing the phosphor by firing (A).

The photosensitive element used in the above-mentioned step (Ia) is also one of the present invention, and has (B) a peelable burying layer (B) as a burying layer on the support film. The photosensitive element having a (A) phosphor-containing photosensitive resin composition layer thereon is prepared by dissolving the resin constituting the (B) burying layer in a solvent that dissolves the resin. By mixing, a uniform solution is formed, and this solution is coated on the support film by a known coating method such as a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, and a curtain coating method. To form a (B) releasable embedding layer as a (B) embedding layer on the support film by applying and drying, and forming (Ba) the (B) as the formed (B) embedding layer. The above components constituting the photosensitive resin composition layer containing the phosphor (A) are dissolved or mixed in a solvent capable of dissolving or dispersing on the releasable buried layer, thereby uniformly dispersing the components. The resulting solution is applied and dried using a known coating method such as a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, a curtain coating method, etc., and contains (A) a phosphor. It can be obtained by forming a photosensitive resin composition layer.

On the photosensitive element composition (A) of the photosensitive element of the present invention thus obtained, the above-mentioned peelable cover film can be further laminated. As the cover film, polyethylene, polypropylene, polyethylene terephthalate,
Polycarbonate and the like, and the adhesive force between the support film and (B) the (Ba) peelable burying layer as the burying layer, and (B) the (Ba) peelable burying layer as the burying layer and (A) the fluorescence Cover film and (A) rather than the adhesive strength with the photosensitive resin composition layer containing the body.
It is preferable that the adhesive strength with the photosensitive resin composition layer containing the phosphor is smaller.

Examples of the solvent for dissolving the above-mentioned components constituting the (B) resin constituting the peelable embedding layer as the embedding layer or (A) the photosensitive resin composition layer containing the phosphor are as follows. For example, water, toluene, acetone, methyl ethyl ketone, methyl isobutyl ketone, methyl cellosolve, ethyl cellosolve, γ-butyl lactone, N
-Methylpyrrolidone, dimethylformamide, tetramethylsulfone, diethylene glycol dimethyl ether, diethylene glycol monobutyl ether, chloroform, methylene chloride, methyl alcohol, ethyl alcohol and the like. These are used alone or in combination of two or more. In the coating process,
(A) The material of the coating device at the portion that comes into contact with the uniformly dispersed solution by dissolving or mixing each of the components constituting the photosensitive resin composition layer containing the phosphor in a solvent that can be dissolved or dispersed. Is preferably a nonmetallic material. In the case where the material of the coating device at the portion which comes into contact with the solution constituting the (A) phosphor-containing photosensitive resin composition layer is a metal, (A) the phosphor-containing photosensitive resin composition layer Is applied to the coating device which is in contact with the phosphor in the solution constituting the phosphor, and the polishing powder tends to be mixed as an impurity into the solution constituting the photosensitive resin composition layer containing the phosphor (A). is there. Drying temperature is 60-130
C., and the drying time is preferably 3 minutes to 1 hour.

The thickness of the photosensitive resin composition layer containing the phosphor (A) in the present invention is not particularly limited.
The thickness is preferably 200 μm, more preferably 15 to 150 μm, and particularly preferably 20 to 100 μm. If the thickness is less than 10 μm, the phosphor pattern after firing described below tends to be thin and the luminous efficiency tends to decrease. And the luminous efficiency tends to decrease. (B) in the present invention
The thickness of the (Ba) peelable embedding layer as the embedding layer is not particularly limited, but is preferably 10 to 200 μm, more preferably 15 to 150 μm, and particularly preferably 20 to 100 μm. preferable. If the thickness is less than 10 μm, the phosphor pattern after firing described later becomes thin, and the luminous efficiency tends to decrease.
If it exceeds 00 μm, the phosphor pattern after firing becomes thick, the light emitting area of the phosphor screen is reduced, and the light emission efficiency tends to be reduced.

Further, the photosensitive element of the present invention comprises:
(A) A solution uniformly dispersed by dissolving or mixing the components constituting the photosensitive resin composition layer containing the phosphor in the solvent capable of dissolving or dispersing, to form a solution on the support film. Then, using a known coating method such as a knife coating method, a roll coating method, a spray coating method, a gravure coating method, a bar coating method, a curtain coating method and the like, and applying and drying (A) a photosensitive material containing a phosphor. After the formation of the conductive resin composition layer, the (A) photosensitive resin composition layer containing the phosphor and the (B) peelable burying layer as the burying layer (B) provided on the support film are provided. It can also be obtained by bonding together. At this time, (B) the support film in contact with the (Ba) peelable embedding layer as the embedding layer and (B)
Adhesive strength between (Ba) peelable burying layer as burying layer and (B) adhesion between (Ba) peelable burying layer as burying layer and (A) photosensitive resin composition layer containing phosphor The adhesive force between the support film to which the (A) phosphor-containing photosensitive resin composition layer is in contact and the (A) phosphor-containing photosensitive resin composition layer is smaller than the force. Preferably, there is. The photosensitive element of the present invention thus obtained can be stored in a roll.

Hereinafter, the step (I) comprises (Ia) forming a (B) peelable burying layer as a burying layer on a support film, and (A) containing a phosphor on the support film. A photosensitive element having a photosensitive resin composition layer to be laminated on a substrate having irregularities so that the photosensitive resin composition layer containing the phosphor (A) is in contact with the substrate having irregularities. The steps will be described with reference to FIG. FIG.
FIG. 3 is a schematic view showing a step (Ia) which is one step of the method for producing a phosphor pattern of the present invention.

[(Ia) Photosensitive resin composition having (B) a releasable embedding layer as a (B) embedding layer on a support film, and (A) a phosphor containing thereon Of laminating a photosensitive element having an object layer on a substrate having unevenness so that the photosensitive resin composition layer containing the phosphor (A) is in contact with the substrate having the unevenness] 1 (substrate having irregularities), the present invention comprises (B) a releasable embedding layer 6a as an embedding layer and (A) a photosensitive resin composition layer 5 containing a phosphor on an irregular surface. FIG. 8 shows a state in which the photosensitive elements are stacked using the pressure roll 7.

In the step shown in FIG. 8, on the PDP substrate 1 on which the barrier ribs 2 are formed, (B) a peelable burying layer 6a as a burying layer and (A) a photosensitive resin containing a phosphor As a method for laminating the photosensitive element of the present invention including the composition layer 5, for example, when a cover film is present on the photosensitive element, the cover film ((B) embedded layer on the support film as the burying layer) (Ba) A photosensitive element obtained by laminating a peelable embedded layer formed on a support film and (A) a photosensitive resin composition layer containing a phosphor on a support film is used. In such a case, after removing (A) the support film of the photosensitive resin composition layer 5 containing the phosphor, the surface of the PDP substrate on which the barrier ribs are formed is provided with (A)
The photosensitive resin composition layer 5 containing the phosphor can be laminated by pressing with a pressure roll 7 so as to be in contact therewith.

The pressure roll 7 may be provided with a heating means so as to be able to heat and press, and the heating temperature in the case of heat and pressure is preferably 10 to 140 ° C.
The temperature is more preferably 20 to 135 ° C, and 30 to 13 ° C.
It is particularly preferred that the temperature be 0 ° C. This heating temperature is 10
If the temperature is lower than 0 ° C, the embedding property of the photosensitive resin composition layer 5 containing the phosphor (A) into the space of the PDP substrate tends to decrease. The conductive resin composition layer 5 tends to be cured by heat. Also,
The pressing pressure at the time of heating and pressing is preferably 50 to 1 × 10 ⁵ N / m, more preferably 2.5 × 10 ^{2 to} 5 × 10 ⁴ N / m, and more preferably 5 × 10 5 N / m. It is particularly preferred to be ² to 4 × 10 ⁴ N / m. When the pressure is less than 50 N / m, (A) the phosphor-containing photosensitive resin composition layer 5
When the PDP substrate exceeds 1 × 10 ⁵ N / m, the barrier ribs of the PDP substrate tend to be broken.

The photosensitive element of the present invention including (B) the releasable embedding layer 6a as the embedding layer and (A) the photosensitive resin composition layer 5 containing the phosphor is heated as described above. For example, although it is not necessary to pre-heat the PDP substrate, the (A) PDP substrate is pre-heated from the viewpoint of further improving the embedding property of the photosensitive resin composition layer 5 containing the phosphor into the concave space. Heat treatment is preferred. The preheating temperature at this time is preferably 30 to 140 ° C., and the preheating time is preferably 0.5 to 20 minutes. Further, from the viewpoint of further improving the embedding property of the photosensitive resin composition layer 5 containing the phosphor in the recessed space, the surface of the pressure roll is made of a flexible material such as rubber or plastic. Things can also be used. The thickness of the layer made of a material having a high flexibility is 20
The thickness is preferably from 0 to 400 μm.

Further, for the same purpose, the above-mentioned press-fitting and heat-pressing operations can be performed under reduced pressure of 5 × 10 ⁴ or less. Moreover, after lamination is completed, it can also be heated in the range of 30 to 150 ° C. for 1 to 120 minutes. At this time, when the support film is present on the (B) releasable embedding layer 6a as the (B) embedding layer,
The support film may be removed as needed. In this manner, (A) the photosensitive resin composition layer 5 containing the phosphor can be uniformly formed in the concave space of the PDP substrate. Further, in the step of removing the (Ba) peelable burying layer 6a as the (IIa) (B) burying layer described later, the (Ba) peelable burying layer 6a as the (B) burying layer is easily peeled off. For (I
After the step a), the PDP substrate is cooled (usually -50).
~ 50 ° C).

Further, the heating conditions, the pressing pressure conditions, the preheating conditions of the PDP substrate, and the (A) photosensitive resin composition layer 5 containing the phosphor are described below. By changing the combination of the conditions such as the thickness of the (B) peelable buried layer 6a as the (B) buried layer, the layers can be stacked as shown in FIG.

Regarding the layer thickness of (A) the photosensitive resin composition layer 5 containing the phosphor and (B) the releasable buried layer 6a as the (B) buried layer, specifically, a substrate having irregularities ( In the (A) photosensitive resin composition layer containing the phosphor and (B) the peelable burying layer as the burying layer, (A) ) volume of the photosensitive resin composition containing a phosphor layer and the (B) the total volume of (Ba) peelable buried layer as a buried layer (V ^1), concave space of the substrate having unevenness (V ² ) And ((V ¹ ) / (V ² ))
However, it is preferable that (V ¹ ) / (V ² ) = 1 to 2 in that a phosphor pattern having a uniform shape can be formed with high accuracy. At this time, when (V ¹ ) / (V ² ) is in the range of 1 to 1.2, as shown in FIG. In a state where the composition layer 5 hardly remains, the photosensitive resin composition layer 5 containing the phosphor (A) tends to be formed on the inner surface of the concave portion, and (V ¹ ) /
When (V ² ) is more than 1.2 and not more than 2, as shown in FIG. 5, (A) the photosensitive resin composition layer 5 containing the phosphor is formed on the convex portion. In the remaining state, the photosensitive resin composition layer 5 containing the phosphor (A) tends to be formed on the inner surface of the concave portion. Here, when (V ¹ ) / (V ² ) is less than 1, there is a tendency that a portion where the photosensitive resin composition layer 5 containing the phosphor (A) cannot be adhered to the inner surface of the concave portion, When (V ¹ ) / (V ² ) exceeds 2,
In a multicolor phosphor pattern described later, the cross-sectional shape tends to be non-uniform.

It should be noted that, when the PDP substrate is manufactured before the photosensitive elements are laminated, the entire or partial shrinkage of the PDP substrate occurs due to heating or the like.
Shrinkage of the substrate for PDP
When the entire or partial shrinkage of the substrate for use occurs, the PDP substrate and the photomask may be misaligned. Therefore, in the case where the PDP substrate contracts entirely or partially, it will be described later (IIIa).
(A) In order to increase the latitude of photomask positioning accuracy in the step of imagewise irradiating the photosensitive resin composition layer 5 containing the phosphor with actinic rays, as shown in FIG. Since it is preferable to laminate the photosensitive resin composition layer 5 containing the phosphor (A) on the inner surface of the concave portion so as to hardly remain, the (V ¹ ) / (V ² ) is 1 to 1.2.
In the case where the PDP substrate hardly shrinks, it may be laminated as shown in FIG. 5, and as shown in FIG. May be laminated in a state where the photosensitive resin composition layer 5 containing

[(IIa) (B) (B) as an embedded layer
a) Step of removing the peelable buried layer] The method of removing the (Ba) peelable buried layer as the (B) burying layer is the same as the method of (II) (B) the step of removing the buried layer. All methods can be used.

[(IIIa) (A) Step of irradiating the photosensitive resin composition layer containing the phosphor imagewise with actinic rays]
The method of irradiating actinic rays imagewise is described in (III) above.
(A) All the same methods as in the step of irradiating the photosensitive resin composition layer containing the phosphor imagewise with actinic rays can be used.

[(IVa) Step of Forming Pattern by Selectively Removing (A) Phosphor-Containing Photosensitive Resin Composition Layer Irradiated with Active Rays Imagewise by Development] Unnecessary part is removed by development As a method for forming a pattern, the same method as in the step of forming a pattern by selectively removing the (A) phosphor-containing photosensitive resin composition layer imagewise irradiated with actinic rays by development (IV) is used. A method can be used.

[(Va) Step of Removing Unwanted Components from the Pattern by Firing to Form Phosphor Pattern] As a method of removing unnecessary components by firing, (V) removing unnecessary components from the pattern by firing All the same methods as in the step of forming the phosphor pattern can be used.

In the method of manufacturing a phosphor pattern of the present invention, the steps (Ia) to (IVa) of the present invention are repeated for each color from the viewpoint that the number of steps can be reduced.
After forming a multicolor pattern composed of a photosensitive resin composition layer containing a phosphor that emits red, green and blue light, (V
It is preferable to perform the step a) to form a multicolor phosphor pattern. In the present invention, the photosensitive resin composition layer 5 containing the phosphor (A), which contains each phosphor that emits red, blue, and green independently, is formed in any order for the red, blue, and green colors. But you can do it.
In addition, the method for producing a phosphor pattern of the present invention is characterized in that (Ia) to (Va) according to the present invention are used in view of suppression of film thinning and the like.
Is preferably repeated for each color to form a multicolor phosphor pattern that emits red, green, and blue light.

When the height of the barrier rib is L (μm), the phosphor pattern of the present invention has a layer thickness x (μm) of the phosphor pattern formed on the barrier rib wall at a position of 0.9 × L.
m) and the layer thickness ratio x / y of the layer thickness y (μm) of the phosphor pattern formed on the barrier rib wall surface at the position of 0.4 × L is x
/Y=0.1 to 1.5 is preferably satisfied in terms of luminance, light utilization factor, etc., and x / y = 0.1
More preferably, it is in the range of 5 to 1.3, and x / y =
It is particularly preferred that it is in the range of 0.2 to 1.2. x /
When y is less than 0.1, when PDP emits light, the apparent brightness in visual recognition from a wide viewing angle tends to decrease. When y exceeds 1.5, the use of visible light emitted by the phosphor is used. The rate tends to decrease, and the luminance tends to decrease.
Further, when light is emitted as a PDP, x / y becomes x from the point that the utilization rate of visible light emitted by the phosphor can be improved.
/Y=0.1 to 0.5, preferably x
/Y=0.15 to 0.45 is more preferable, and x / y = 0.2 to 0.4 is particularly preferable. Further, when light is emitted as a PDP, x / y may be in the range of x / y = 0.5 to 1.5 from the viewpoint that it is possible to suppress a decrease in apparent luminance when viewed from a wide viewing angle. Preferably, x / y = 0.55 to 1.3, more preferably x / y = 0.6 to 1.2.

The back plate for a plasma display panel of the present invention is provided with the fluorescent pattern obtained as described above on a substrate for a plasma display panel. The back plate for a plasma display panel will be described below with reference to FIG. FIG. 9 is a schematic view showing an example of a plasma display panel (PDP). In FIG. 9, 1 is a substrate, 2 is a barrier rib, 4 is a stripe-shaped discharge space, 10 is a phosphor pattern, and 11 is an address. Electrodes, 12 a protective film, 13 a dielectric layer, 14
Is a display electrode and 15 is a front plate substrate. In FIG. 9, the lower portion including the substrate 1, the barrier ribs 2, the phosphor pattern 10, and the address electrodes 11 is a PDP back plate, and the protective film 12, the dielectric layer 13, the display electrodes 14, and the front plate substrate 15 The upper part includes the front panel for PDP. P
DP is an AC (AC) type PDP,
A schematic diagram of FIG. 9 which can be classified into a DC (direct current) type PDP and the like and shown as an example is an AC type PDP. The method for producing a phosphor pattern and the photosensitive element of the present invention can be applied to a self-luminous display such as a field emission display (FED) and an electroluminescence display (ELD).

In the present invention, the photosensitive resin composition layer containing the phosphor (A) is satisfactorily buried in the space (in the recess) of the substrate having irregularities by the function of the burying layer (B). After this embedding, (B) the embedding layer is peeled off, so that (B) a photopolymerizable unsaturated compound having an ethylenically unsaturated group in the (A) photosensitive resin composition layer containing a phosphor, ) Photoinitiators that generate free radicals upon irradiation with actinic light can be prevented from migrating to the (B) buried layer to improve stability, and (A) a photosensitive resin composition layer containing a phosphor In the step of irradiating actinic rays imagewise, (B) actinic rays can be illuminated imagewise without passing through the buried layer, so that the pattern resolution can be improved. When the development for forming the pattern is performed using a developer, it is not necessary to remove (B) the buried layer, so that the development can be performed easily and in a shorter time, and the settling of the developer can be reduced. it can.

[0120]

The present invention will be described below with reference to examples. Production Example 1 [Preparation of solution (a-1) of film-imparting polymer] In a flask equipped with a stirrer, a reflux condenser, an inert gas inlet, and a thermometer, the components shown in Table 1 were charged, and under a nitrogen gas atmosphere. The temperature shown in Table 1 was dropped uniformly over 4 hours while maintaining the reaction temperature at 80 ° C. ± 2 ° C. After the dropwise addition, stirring was continued at 80 ° C. ± 2 ° C. for 6 hours, and a solution of a film-imparting polymer having a weight average molecular weight of 80,000 and an acid value of 130 mgKOH / g (solid content: 45.5% by weight) (a-
1) was obtained.

[0121]

[Table 1]

Production Example 2 [(A) Preparation of Solution (A-1) for Photosensitive Resin Composition Layer Containing Phosphor] The materials shown in Table 2 were mixed for 15 minutes using a Raikai machine. ) A solution (A-1) for a photosensitive resin composition layer containing a phosphor was prepared.

[0123]

[Table 2]

Production Example 3 [(A) Preparation of Solution for Photosensitive Resin Composition Layer (A-2) Containing Phosphor] The materials shown in Table 3 were mixed for 15 minutes using a Raikai machine, and ) A solution (A-2) for a photosensitive resin composition layer containing a phosphor was prepared.

[0125]

[Table 3]

Production Example 4 [(A) Preparation of Solution for Photosensitive Resin Composition Layer (A-3) Containing Phosphor] The materials shown in Table 4 were mixed for 15 minutes using a Raikai machine. ) A solution (A-3) for a photosensitive resin composition layer containing a phosphor was prepared.

[0127]

[Table 4]

Production Example 5 [Preparation of Photosensitive Element (i)] The solution (A-1) for the photosensitive resin composition layer containing the phosphor (A) obtained in Production Example 2 was coated with a 20 μm thick film. The resulting mixture was uniformly coated on a polyethylene terephthalate film and dried with a hot air convection dryer at 110 ° C. for 10 minutes to remove the solvent, thereby forming (A) a photosensitive resin composition layer containing a phosphor. The thickness of the obtained photosensitive resin composition layer containing the phosphor (A) is 6
It was 0 μm. Next, a polyethylene film having a thickness of 25 μm was further laminated as a cover film on the photosensitive resin composition layer containing the phosphor (A) to prepare a photosensitive element (i).

The edge fusion property of the obtained photosensitive element (i) was evaluated by the following method. The results are shown in Table 6. [Edge fusion property] The photosensitive element (i) having a length of 90 m wound up in a roll shape is stored at a temperature of 23 ° C and a humidity of 60% Rh, and the state of exudation of the photosensitive layer from the roll side surface is shown below. Evaluation was made visually for 6 months. The evaluation criteria are as follows. ：: Good edge fusion property (no exudation of photosensitive layer even in 6 months) ×: Poor edge fusion property (thing exuded of photosensitive layer in 6 months)

Production Example 6 [Preparation of photosensitive element (ii)]
The photosensitive resin composition layer solution (A-1) containing the phosphor (A) obtained in Production Example 2 was mixed with the photosensitive resin composition containing the phosphor (A) obtained in Production Example 3. Layer solution (A
A photosensitive element (ii) was produced in the same manner as in Production Example 5, except that the composition was changed to -2). In addition, the thickness of the photosensitive resin composition layer containing the phosphor (A) of the photosensitive element (ii) was 40 μm. The edge fusion properties of the obtained photosensitive element (ii) were evaluated in the same manner as in Production Example 5, and the results are shown in Table 6.

Production Example 7 [Preparation of Photosensitive Element (iii)] In Production Example 5, the solution (A-1) for a photosensitive resin composition layer containing the phosphor (A) obtained in Production Example 2 was used. The solution (A) for the photosensitive resin composition layer containing the phosphor (A) obtained in Production Example 4
A photosensitive element (iii) was produced in the same manner as in Production Example 5 except for changing to (-3). The thickness of the photosensitive resin composition layer containing the phosphor (A) of the photosensitive element (iii) was 60 μm. The edge fusion property of the obtained photosensitive element (iii) was evaluated in the same manner as in Production Example 5, and the results are shown in Table 6.

Production Example 8 [Preparation of photosensitive element (iv)]
A solution (A-4) for a photosensitive resin composition layer containing a phosphor was prepared in the same manner as in Production Example 2 except that the materials shown in Table 2 were changed to the materials shown in Table 5.

[0133]

[Table 5]

Next, in Production Example 5, the solution (A-1) for the photosensitive resin composition layer containing the phosphor (A) was replaced with the solution (A) for the photosensitive resin composition layer containing the phosphor (A).
A photosensitive element (iv) was produced in the same manner as in Production Example 5, except that the photosensitive element (iv) was replaced with (-4). The thickness of the photosensitive resin composition layer containing the phosphor (A) of the photosensitive element (iv) was 40 μm. The edge fusion property of the obtained photosensitive element (iv) was evaluated in the same manner as in Production Example 5, and the results are shown in Table 6.

[0135]

[Table 6]

From the results shown in Table 6, the edge fusion properties of the photosensitive elements produced in Production Examples 5 to 8 were good.

[Preparation of Phosphor Pattern] Example 1 [(I) On a substrate having irregularities, (A) a state in which a (B) burying layer is disposed on a photosensitive resin composition layer containing a phosphor. , (B) applying pressure to the buried layer,
(A) a photosensitive resin composition layer containing a phosphor and (B)
Step of laminating buried layer on substrate having irregularities] PD
On the side where the barrier ribs of the substrate for P (striped barrier ribs, opening width between barrier ribs 140 μm, via rib width 70 μm, barrier rib height 140 μm) are formed,
While peeling off the polyethylene film of the photosensitive element (i) obtained in Production Example 5, using a vacuum laminator (trade name: VLM-1 type, manufactured by Hitachi Chemical Co., Ltd.), the heat shoe temperature was 30 ° C., and the laminate was laminated. The speed is 1.5m / min, the air pressure is 4000Pa or less, and the pressure (cylinder pressure) is 5x
The substrate was laminated at 104 Pa (thickness: 3 mm, length: 10 cm × width: 10 cm, so that the linear pressure at this time was 2.4 × 10 ³ N / m).

Next, the polyethylene terephthalate film on the surface of the photosensitive element (i) that is not in contact with the barrier rib is peeled off, and (A) a 100 μm-thick polyethylene film is placed on the photosensitive resin composition layer containing the phosphor. (Vicat softening point: 82-100 ° C.) as a (B) embedding layer and a laminator (trade name: H, manufactured by Hitachi Chemical Co., Ltd.)
LM-3000) and the lamination temperature is 70
° C, lamination speed 0.5m / min, compression pressure (cylinder pressure) 4 × 10 ⁵ Pa (thickness 3mm, length 10cm × width 10c)
m, the linear pressure at this time was 9.8 × 10 ³ N /
In (m), the (B) buried layer was pressed, and the (A) photosensitive resin composition layer containing the phosphor and the (B) buried layer were buried in the space surrounded by the barrier rib wall surface and the base bottom surface. At this time, the (A) phosphor is contained in the (A) photosensitive resin composition layer containing the phosphor and the (B) burying layer in the same region as the region on the PDP substrate in which the irregularities are formed. The ratio ((V ¹ ) / (V ² )) of the total volume (V ¹ ) of the photosensitive resin composition layer and the (B) buried layer to the volume (V ² ) of the concave space of the PDP substrate is: (V ¹ ) / (V ² ) =
1.714.

[(II) Step of Removing (B) Embedding Layer] Then, an adhesive tape is adhered to a polyethylene film having a thickness of 100 μm as the (B) embedding layer, and the (B) embedding layer 6 is physically removed. Peeled off.

[(III) (A) Step of irradiating actinic rays imagewise to the photosensitive resin composition layer containing the phosphor]
A photomask for test was brought into close contact with the surface of the photosensitive element (i) that was not in contact with the barrier rib, and an HMW-590 type exposure machine manufactured by Oak Manufacturing Co., Ltd. was used to obtain 100 mJ / cm.
In Step 2, actinic rays were irradiated imagewise.

[(IV) Step of Forming a Pattern by Selectively Removing (A) a Phosphor-Containing Photosensitive Resin Composition Layer Exposed to Actinic Rays Imagewise by Development] Then, Irradiation with Actinic Rays Thereafter, the mixture was allowed to stand at room temperature for 1 hour, and then spray-developed with a 1% by weight aqueous solution of sodium carbonate at 30 ° C. for 70 seconds. After development, dry at 80 ° C for 10 minutes.
Ultraviolet irradiation of 3 mJ / cm ² was performed using a Toshiba ultraviolet irradiation apparatus manufactured by Co., Ltd.

[(V) Step of Removing Unwanted Parts from the Pattern by Firing to Form Phosphor Pattern]
Heat treatment (baking) was performed at 50 ° C. for 30 minutes to remove unnecessary resin components, and a phosphor pattern was formed in the space of the PDP substrate.

[Evaluation of Phosphor Pattern] The cross section of the obtained phosphor pattern was visually observed with a stereoscopic microscope and an SEM, and the formation state of the phosphor pattern was evaluated. The results are shown in Table 7. The evaluation criteria are as follows. ：: The phosphor pattern is uniformly formed in the space of the PDP substrate (on the barrier rib wall surface and the cell bottom surface). X: The phosphor pattern is uniformly formed in the space of the PDP substrate (the barrier rib wall surface and the cell bottom surface). Not

Example 2 In the step (I) of Example 1, a polyethylene film having a thickness of 100 μm (Vicat softening point: 82 to 100 ° C.)
A phosphor pattern was formed in the same manner as in Example 1, except that the embedded layer (B) was replaced with the embedded layer (B) of a 100-μm-thick polypropylene film (Vicat softening point: 125 to 155 ° C.) The state of formation of the obtained phosphor pattern was evaluated, and the results are shown in Table 7. At this time, the (A) phosphor is contained in the (A) photosensitive resin composition layer containing the phosphor and the (B) burying layer in the same region as the region on the PDP substrate in which the irregularities are formed. The ratio ((V ¹ ) / (V ² )) of the total volume (V ¹ ) of the photosensitive resin composition layer and the (B) buried layer to the volume (V ² ) of the concave space of the PDP substrate is: (V ¹ ) / (V ² ) = 1.714.

Example 3 A phosphor pattern was formed in the same manner as in Example 1 except that the steps (I) and (II) were changed as described below. The state of pattern formation was evaluated, and the results are shown in Table 7. [(I) A pressure is applied to the (B) buried layer in a state where the (B) buried layer is disposed on the (A) phosphor-containing photosensitive resin composition layer on the substrate having irregularities,
(A) a photosensitive resin composition layer containing a phosphor and (B)
Step of laminating buried layer on substrate having irregularities] PD
On the side where the barrier ribs of the substrate for P (striped barrier ribs, opening width between barrier ribs 140 μm, barrier rib width 70 μm, barrier rib height 140 μm) are formed,
While peeling off the polyethylene film of the photosensitive element (i) obtained in Production Example 5, using a laminator (trade name: HLM-3000, manufactured by Hitachi Chemical Co., Ltd.), the laminating temperature was 60 ° C. and the laminating speed was 0.5m / min, crimping pressure (cylinder pressure) 5 × 10 ⁴ Pa (thickness 3mm,
Since a substrate having a length of 10 cm and a width of 10 cm was used, the layers were laminated at a linear pressure of 2.4 × 10 ³ N / m.

Next, the polyethylene terephthalate film on the surface of the photosensitive element (i) that was not in contact with the barrier rib was peeled off, and (A) a 34 μm-thick poly ( Using an (ethylene / ethyl acrylate) film as the burying layer (B), a laminator (HLM-3000, manufactured by Hitachi Chemical Co., Ltd.)
), The laminating temperature is 120 ° C, the laminating speed is 0.5 m / min, and the pressing pressure (cylinder pressure) is 4 ×
10 ⁵ Pa (the substrate was 3 mm thick, 10 cm long × 10 cm wide, so the linear pressure at this time was 9.8 × 10 ³ N / m) and (B)
The buried layer is pressure-bonded via a 20 μm-thick polyethylene terephthalate film, and the (A) photosensitive resin composition layer containing the phosphor and (B) the buried layer are put into a space surrounded by the barrier rib wall surface and the base bottom surface. Embedded. At this time, the (A) phosphor is contained in the (A) photosensitive resin composition layer containing the phosphor and the (B) burying layer in the same region as the region on the PDP substrate in which the irregularities are formed. The total volume (V ¹ ) of the photosensitive resin composition layer and the (B) buried layer, and the volume (V ² ) of the concave space of the PDP substrate
((V ¹ ) / (V ² )) is (V ¹ ) / (V ² ) = 1.007
Met.

[(II) (B) Step of Removing Buried Layer] Next, (B) a film thickness of 3 which is a peelable buried layer
An adhesive tape was adhered to a 4 μm poly (ethylene / ethyl acrylate) film, and the (B) peelable embedding layer 6 was physically peeled off.

Example 4 In Example 3, the photosensitive element (i) obtained in Production Example 5 was replaced with the photosensitive element (i) obtained in Production Example 6.
In place of i), a poly (ethylene / ethyl acrylate) film having a thickness of 34 μm was
In place of the (ethyl acrylate) film, (III) a step of irradiating actinic rays imagewise, (IV) a step of removing unnecessary portions by development, and (V) a step of removing unnecessary portions by baking are shown below. A phosphor pattern was formed in the same manner as in Example 3 except that the phosphor pattern was changed, and the state of formation of the obtained phosphor pattern was evaluated. The results are shown in Table 7. At this time, the (A) phosphor is contained in the (A) photosensitive resin composition layer containing the phosphor and the (B) burying layer in the same region as the region on the PDP substrate in which the irregularities are formed. The ratio ((V ¹ ) / (V ² )) of the total volume (V ¹ ) of the photosensitive resin composition layer and the (B) buried layer to the volume (V ² ) of the concave space of the PDP substrate is: (V ¹ ) / (V ² ) = 1.05.

[(III) (A) Step of irradiating actinic rays imagewise to the photosensitive resin composition layer containing the phosphor]
A photomask having an active light transmission width of 130 μm is adhered to a surface of the photosensitive element (ii) that is not in contact with the barrier rib so that the center of the active light transmission width of the photomask is positioned at the center of the opening width between the barrier ribs. Using an HMW-201GX type exposure machine manufactured by Oak Manufacturing Co., Ltd., 30
Actinic light was irradiated imagewise at 0 mJ / cm ² .

[(IV) Step of Forming a Pattern by Selectively Removing (A) a Phosphor-Containing Photosensitive Resin Composition Layer Imagewise Irradiated with Active Light by Development] Next, Irradiation with Active Light Thereafter, the mixture was allowed to stand at room temperature for 1 hour, and then spray-developed at 30 ° C. for 40 seconds using a 1% by weight aqueous solution of sodium carbonate. After development, dry at 80 ° C for 10 minutes.
Ultraviolet irradiation of 3 J / cm ² was performed using a Toshiba ultraviolet irradiator manufactured by Toshiba Corporation. Next, heat treatment was performed at 150 ° C. for 1 hour.

[(V) Step of Removing Unwanted Parts from the Pattern by Firing to Form Phosphor Pattern]
Raise the temperature in an electric furnace at a rate of 5 ° C / min.
Heat treatment (firing) was performed for 0 minutes to remove unnecessary resin components, and a phosphor pattern was formed on the inner surface of the concave portion of the PDP substrate.

Example 5 In Example 3, the photosensitive element (i) obtained in Production Example 5 was replaced with the photosensitive element (ii) obtained in Production Example 7.
In the same manner as in Example 3, except that the step (i) of irradiating actinic rays imagewise and the step (IV) of removing unnecessary portions by development are changed as shown below, A body pattern was formed, and the state of formation of the obtained phosphor pattern was evaluated. The results are shown in Table 7.

[(III) (A) Step of irradiating actinic rays imagewise to the photosensitive resin composition layer containing the phosphor]
A photomask having an active light transmission width of 130 μm is closely attached to a surface of the photosensitive element (iii) which is not in contact with the barrier rib such that the center of the active light transmission width of the photomask is located at the center of the opening width between the barrier ribs. Using an HMW-201GX type exposure machine manufactured by Oak Manufacturing Co., Ltd.
An actinic ray was imagewise irradiated at 00 mJ / cm ² .

[(IV) Step of Forming Pattern by Selectively Removing (A) Phosphor-Containing Photosensitive Resin Composition Layer Exposed to Actinic Rays Imagewise by Development] Then, Irradiation with Actinic Rays Then, after leaving at room temperature for 1 hour, 3-methyl-3
-Emulsion solution composed of methoxybutyl acetate and water (3-methyl-3-methoxybutyl acetate /
Water (weight ratio = 25/75) was spray-developed at 30 ° C for 70 seconds. After the development, the film was dried at 80 ° C. for 10 minutes, and dried by using a Toshiba UV irradiator manufactured by Toshiba Electric Materials Co., Ltd.
Ultraviolet irradiation of J / cm ² was performed. Next, heat treatment was performed at 150 ° C. for 1 hour in a dryer.

Example 6 [(Ia) Photosensitive resin composition comprising (B) a releasable embedding layer as an embedding layer (B) on a support film, and (A) a phosphor contained thereon A photosensitive element having an object layer on an uneven surface of a substrate having unevenness,
(A) The photosensitive resin composition layer containing the phosphor is heated and pressed so as to be in contact with the photosensitive resin composition layer, and the (A) photosensitive resin composition layer containing the phosphor and (B) the burying layer are formed on the uneven surface. Ba) Step of laminating releasable embedded layer] The polyethylene film of the photosensitive element (ii) obtained in Production Example 6 was peeled off, and poly (ethylene) having a thickness of 58 μm was formed on a polyethylene terephthalate film having a thickness of 20 μm. (Ethyl acrylate) film ((B) peelable burying layer as (B) burying layer) and photosensitive resin composition layer containing (A) phosphor of photosensitive element (ii). A photosensitive element (A) having a (B) peelable burying layer as a burying layer and having (A) a photosensitive resin composition layer containing a phosphor thereon, ) Was prepared.

Next, on the side where the barrier ribs of the PDP substrate (striped barrier ribs, opening width between barrier ribs 140 μm, barrier rib width 70 μm, barrier rib height 140 μm) are formed, the photosensitive element (v) (A) ) While peeling off the polyethylene terephthalate film in contact with the photosensitive resin composition layer containing the phosphor, a laminator (trade name: HLM-, manufactured by Hitachi Chemical Co., Ltd.)
(3000 type), so that the laminating temperature is 110 ° C., the laminating speed is 0.5 m / min, and the pressing pressure (cylinder pressure) so that the photosensitive resin composition layer containing the phosphor (A) is in contact with the PDP substrate. ) Was 4 × 10 ⁵ Pa (thickness: 3 mm, length: 10 cm × width: 10 cm (square), and the linear pressure at this time was 9.8 × 10 ³ N / m). At this time, (A) a photosensitive resin composition layer containing a phosphor and (B) a releasable buried layer as a buried layer in a region equal to a region on the PDP substrate where the unevenness is formed. In (A), the total volume (V ¹ ) of (A) the photosensitive resin composition layer containing the phosphor and (B) the (Ba) peelable embedding layer as the embedding layer, and the volume of the concave space of the PDP substrate the ratio of the ^{(V 2) ((V 1} ) / (V 2)) is, (V ¹⁾ /
(V ² ) = 1.05.

[(II) (B) (B) as the buried layer
a) Step of removing the peelable embedded layer]
(B) An adhesive tape is adhered to a film containing a (Ba) peelable embedding layer (poly (ethylene / ethyl acrylate) film) as an embedding layer, and physically (B)
The (Ba) peelable embedding layer as the embedding layer was peeled off.

[(III) Step of Imagewise Irradiating (A) Photosensitive Resin Composition Layer Containing Phosphor] with (A) Photosensitive Resin Composition Layer Containing Phosphor The active light transmission width is 130
μm photomask at the center of the opening width between barrier ribs,
The photomask was brought into close contact with the center of the active light beam transmission width so as to be positioned, and an active light beam was imagewise irradiated at 300 mJ / cm ² using an HMW-201GX type exposure machine manufactured by Oak Manufacturing Co., Ltd.

[(IV) Step of Removing Unwanted Parts from Photosensitive Resin Composition Layer Containing Phosphor by (IV) Development] Then, after irradiation with actinic rays, the mixture was allowed to stand at room temperature for 1 hour, and then 1% by weight. Spray development was performed at 30 ° C. for 40 seconds using an aqueous solution of sodium carbonate. After development, dried at 80 ° C. for 10 minutes,
Using a Toshiba UV irradiator manufactured by Toshiba Electric Materials Co., Ltd., 3 J / cm
² UV irradiation was performed. Then, in the dryer,
Heat treatment was performed at 150 ° C. for 1 hour.

[(V) Step of Removing Unwanted Components from Photosensitive Resin Composition Layer Containing Phosphor by Firing (A)] Then, the temperature is raised at a rate of 5 ° C./min in an electric furnace. 470
Heat treatment (baking) was performed at 20 ° C. for 20 minutes to remove unnecessary resin components, and a phosphor pattern was formed on the inner surface of the concave portion of the PDP substrate. The state of formation of the obtained phosphor pattern was evaluated in the same manner as in Example 1, and the results are shown in Table 7.

Example 7 In Example 4, the photosensitive element (ii) obtained in Production Example 6 was replaced with the photosensitive element (i) obtained in Production Example 8.
A phosphor pattern was formed in the same manner as in Example 4 except that the step (IV) of removing unnecessary portions by development was changed as shown below, instead of (v), and a phosphor pattern was obtained. The state of formation was evaluated, and the results are shown in Table 7. At this time, the (A) phosphor is contained in the (A) photosensitive resin composition layer containing the phosphor and the (B) burying layer in the same region as the region on the PDP substrate in which the irregularities are formed. The ratio ((V ¹ ) / (V ² )) of the total volume (V ¹ ) of the photosensitive resin composition layer and the (B) buried layer to the volume (V ² ) of the concave space of the PDP substrate is: (V ¹ ) / (V ² ) = 1.05.

[(IV) Step of Forming Pattern by Selectively Removing (A) Phosphor-Containing Photosensitive Resin Composition Layer Irradiated with Actinic Light Imagewise by Development] Next, Actinic Light Irradiation Thereafter, the mixture was allowed to stand at room temperature for 1 hour, and then spray-developed with a 1% by weight aqueous solution of sodium carbonate at 30 ° C. for 40 seconds, and washed with spray water for 40 seconds. Next, it was immersed in a 1% by weight malonic acid aqueous solution for 10 minutes, and then washed with water for 5 minutes. After washing with water, drying was performed at 80 ° C. for 10 minutes, and 3 J / cm ² ultraviolet irradiation was performed using a Toshiba ultraviolet irradiation apparatus manufactured by Toshiba Electric Materials Co., Ltd. Next, heat treatment was performed at 150 ° C. for 1 hour.

Comparative Example 1 A phosphor pattern was formed in the same manner as in Example 1 except that (B) the burying layer was not used, and the formation state of the obtained phosphor pattern was evaluated. The results are shown in Table 7.

[0164]

[Table 7]

From Table 7, it can be seen that Examples 1, 2, 3, 4, 5, 6, and 7 using (B) the buried layer are in the space of the PDP substrate. It can be seen that the formability of the phosphor pattern (embedding property on the barrier rib wall surface and the space bottom surface of the PDP substrate) is good. In comparison with this, (B) Comparative Example 1 in which the burying layer was not used has a low phosphor pattern formability (embedding on the barrier rib wall surface and the space bottom of the PDP substrate) in the space of the PDP substrate. It turns out that it is inferior.

Example 8 (A) was prepared in the same manner as in Production Example 3 except that 140 parts by weight of (Y, Gd) BO ₃ : Eu was replaced with 110 parts by weight of BaMgAl ₁₄ O ₂₃ : Eu ^2+. ) A phosphor-containing photosensitive resin composition layer solution (A-5) was prepared, and then (A) a phosphor-containing photosensitive resin composition layer was formed in the same manner as in Production Example 5. The thickness of the obtained photosensitive resin composition layer containing the phosphor (A) after drying is 40 μm.
m. Next, in the same manner as in Production Example 5, (A) a photosensitive element (vi) including a photosensitive resin composition layer containing a phosphor was produced.

Next, the substrate on which the photosensitive resin composition layer containing the phosphor emitting the first color red, which was obtained by performing the steps (I) to (IV) in Example 4, was formed. In Example 4, a photosensitive element (ii) containing a (A) phosphor-containing photosensitive resin composition layer was used as a photosensitive element (A) containing a phosphor-containing photosensitive resin composition layer. The steps (I) to (IV) were carried out in the same manner as in Example 4 except that (vi) was replaced to form a photosensitive resin composition layer containing a phosphor emitting the second color blue. Then, the steps (I) to (IV) are performed in the same manner as in Example 7 to form a photosensitive resin composition layer containing a phosphor that emits a third green color, thereby forming a multicolor pattern. Produced. Next, using the obtained multicolor pattern, the process (V) in Example 4 was performed to produce a PDP back plate on which a multicolor phosphor pattern was formed. The cross section of the obtained multicolor phosphor pattern was visually observed with a stereoscopic microscope and an SEM, and the state of formation of the multicolor phosphor pattern was evaluated. As a result, the multicolor fluorescence emitted in red, green and blue was obtained. It was confirmed that the body pattern was uniformly formed in the space (on the barrier rib wall surface and the cell bottom surface) of the back panel for PDP.

[0168]

According to the method for manufacturing a phosphor pattern according to the first aspect of the present invention, there is provided a method of embedding a substrate having irregularities such as a PDP substrate in a space (if the substrate is a PDP substrate, the phosphor on the barrier rib wall surface and the space bottom surface). (Formability of a photosensitive resin composition layer containing the same) and can form a highly accurate and uniform phosphor pattern. The method for manufacturing a phosphor pattern according to the second aspect provides the effect of the invention according to the first aspect,
Furthermore, it is excellent in workability and environmental safety. The method of manufacturing a phosphor pattern according to the third aspect further improves the workability in addition to the effects of the first or second aspect of the invention. The method for manufacturing a phosphor pattern according to claim 4 is excellent in suppressing film thinning in addition to the effects of the invention described in claim 1 or 2. The method for producing a phosphor pattern according to the fifth aspect of the present invention has excellent workability and light sensitivity in addition to the effects of the first, second, third or fourth aspect of the present invention.

The photosensitive element according to claim 6 is excellent in suppression of edge fusion and excellent embedding into a space of a substrate having irregularities such as a PDP substrate, and is capable of forming a phosphor pattern having a uniform shape with high precision with good workability. It can be formed. The photosensitive element according to claim 7 is excellent in workability and light sensitivity in addition to the effects of the invention described in claim 6. The phosphor pattern according to the eighth aspect has a uniform shape with high accuracy and excellent luminance. The back plate for a plasma display panel according to the ninth aspect is provided with a phosphor pattern having a high precision, a uniform shape, and excellent luminance.

[Brief description of the drawings]

FIG. 1 is a schematic view showing an example of a PDP substrate on which barrier ribs are formed.

FIG. 2 is a schematic view showing an example of a PDP substrate on which barrier ribs are formed.

FIG. 3 is a schematic view showing each step of the method for producing a phosphor pattern of the present invention.

FIG. 4 is a schematic view showing each step of the method for producing a phosphor pattern of the present invention.

FIG. 5 shows a method for producing a phosphor pattern of the present invention.
(I) This is an example after the end of the process.

FIG. 6 is a schematic diagram showing a state in which a multicolor pattern formed of a photosensitive resin composition layer containing a phosphor is formed.

FIG. 7 is a schematic diagram showing a state in which a multicolor phosphor pattern is formed.

FIG. 8 is a schematic view showing one step of the method for producing a phosphor pattern of the present invention.

FIG. 9 is a schematic view showing an example of a back plate for a plasma display panel of the present invention.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 ... Substrate 2 ... Barrier rib 3 ... Grating discharge space 4 ... Stripe discharge space 5 ... Phosphor containing photosensitive resin composition layer 5 '... Photocured phosphor containing photosensitive resin composition layer 5 'A: pattern of the first color 5'b: pattern of the second color 5'c: pattern of the third color 6 ... embedding layer 6a ... peelable embedding layer 7 ... compression roll 8 ... photomask 9 ... active ray 10 ... phosphor Pattern 10a: First-color phosphor pattern 10b: Second-color phosphor pattern 10c: Third-color phosphor pattern 11: Address electrode 12: Protective film 13: Dielectric layer 14: Display electrode 15: Front plate substrate

 ──────────────────────────────────────────────────続 き Continuing on the front page (72) Inventor Yumiko Wada 4-3-1-1, Higashicho, Hitachi City, Ibaraki Prefecture Inside the Ibaraki Research Laboratory, Hitachi Chemical Co., Ltd. 1 Ibaraki Research Laboratory, Hitachi Chemical Co., Ltd. (72) Inventor Kazuya Sato 4-13-1, Higashicho, Hitachi City, Ibaraki Prefecture Within Ibaraki Research Laboratory, Hitachi Chemical Co., Ltd. (72) Inventor Naoki Kimura Hitachi, Ibaraki Prefecture 4-3-1-1, Higashicho, Ibaraki Research Laboratory, Hitachi Chemical Co., Ltd. (72) Inventor Ikuo Muko 4-1-1, Higashimachi, Hitachi, Ibaraki Prefecture, Yamazaki Plant, Hitachi Chemical Co., Ltd. (72) Inventor, Kiyoyoshi Tanno Hitachi Chemical Industry Co., Ltd. Yamazaki Factory 4-72-1, Higashicho, Hitachi City, Ibaraki Prefecture (72) Inventor Hajime Kadomaru 4-1-1, Higashimachi, Hitachi City, Ibaraki Prefecture Hitachi Chemical Industry Co., Ltd. Yamazaki Plant

Claims (9)

[Claims] 1. A pressure is applied to (B) a buried layer in a state where (B) a buried layer is arranged on a (A) photosensitive resin composition layer containing a phosphor on a substrate having irregularities. In addition, (A) a step of laminating a photosensitive resin composition layer containing a phosphor and (B) a buried layer on a substrate having irregularities; (II) a step of removing the (B) buried layer;
(III) (A) a step of irradiating the photosensitive resin composition layer containing the phosphor imagewise with actinic rays, and (IV) a step of irradiating the actinic ray imagewise by development with the (A) phosphor containing the phosphor. A step of forming a pattern by selectively removing the conductive resin composition layer, and (V) a step of forming a phosphor pattern by removing unnecessary components from the pattern by firing. How to make body patterns. 2. The step (I) comprises (Ia) forming a (B) releasable burying layer as a burying layer on a support film, and containing (A) a phosphor thereon. 2. The step of laminating a photosensitive element having a photosensitive resin composition layer to be performed so that the photosensitive resin composition layer containing the phosphor (A) is in contact with a substrate having irregularities. Method of manufacturing phosphor pattern. 3. Repeating each of the steps (I) to (IV),
2. A multicolor phosphor pattern is formed by forming a multicolor pattern composed of a photosensitive resin composition layer containing a phosphor that emits red, green and blue, and then performing the step (V).
Or a method for producing a phosphor pattern according to item 2. 4. Repeating each of the steps (I) to (V),
The method for producing a phosphor pattern according to claim 1 or 2, wherein a multicolor phosphor pattern that emits red, green, and blue light is formed. 5. The photosensitive resin composition layer containing (A) a phosphor, wherein (a) a film-providing polymer, (b) a photopolymerizable unsaturated compound having an ethylenically unsaturated group, and (c) activity. 5. A photo-initiator which generates free radicals upon irradiation with light and (d) a phosphor.
A method for producing the phosphor pattern as described above. 6. A support film having (B) a releasable burying layer as a burying layer, and (A) a photosensitive resin composition layer containing a phosphor on the support film. Photosensitive element. 7. (A) a photosensitive resin composition layer containing a phosphor, wherein (a) a film imparting polymer, (b) a photopolymerizable unsaturated compound having an ethylenically unsaturated group, and (c) activity. 7. The photosensitive element according to claim 6, comprising a photoinitiator that generates free radicals upon irradiation with light and (d) a phosphor. 8. A phosphor pattern manufactured by the method for manufacturing a phosphor pattern according to claim 1, 2, 3, 4, or 5. 9. A back plate for a plasma display panel comprising the phosphor pattern according to claim 8 on a substrate for a plasma display panel.