JPH10329100A - Cutting method for brittle material - Google Patents

Abstract

PROBLEM TO BE SOLVED: To produce a cut product with a thin section with a low cutting loss by a method wherein a line mark to previously assign a section to be cut is formed, and a pressure is then applied on the flank of the brittle material in which line marks are formed. SOLUTION: A glass rod 2 in which line marks 5, 5, 5, 5, and 5 are formed by a Vickers indenter is inserted in a pressure vessel 1. Cylindrical spacers 6 and 6 are arranged between the two end parts of a space forming part 3 and a glass rod 2. A fastening tool 9 having a thread formed in an outer periphery and an outside diameter approximately equal to the inside diameter of the fastening tool fixing part 4 is fitted in the fastening tool fixing part 4 and rotated and an O-ring 7 is fastened through a spacer 6. A pressure is applied on a space, brought into an airtight state and partitioned with a space forming part 3, the O-rings 7 and 7, and a pressure transmission cylinder 8, through a pressure medium introducing hole 10 and this way produces cut pieces cut in the positions of the line marks 5, 5, 5, 5, and 5.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

TECHNICAL FIELD The present invention relates to silicon, GaAs
The present invention relates to a method for cutting a brittle material such as a compound semiconductor such as s, GaP, and InP, and quartz or an oxide single crystal.

[0002]

2. Description of the Related Art As a method of cutting an object to be cut such as a single crystal or polycrystal such as silicon, or glass,
Removal such as wire saw cutting, inner peripheral blade cutting or outer peripheral blade cutting, which cuts the workpiece by shaving it along the surface to be cut, and making a cut at the cutting point of the workpiece, bending, heat There is known a splitting process in which a stress is applied to a cut portion to cut the cut so that the crack is spread by expanding the cut by expansion or pressing.

[0003] The removal process has a problem that the cutting loss is larger than the splitting process. That is, for example, in the inner peripheral blade cutting, the blade thickness is about 0.3 mm even if it is thin, and the wire thickness is about 0.2 mm even in the wire saw cutting with relatively small cutting loss. The object to be cut is scrapped by the thickness and the thickness of the wire, and the cutting loss is larger than in the case of split processing. Large cutting losses include silicon, sapphire, zirconia,
In the cutting of expensive materials such as quartz, it is a direct cause of high cost. In particular, when cutting thinly, the ratio of the cutting loss becomes larger than that of a thin plate obtained by cutting, and the reduction in yield due to the cutting loss becomes a particular problem. Further, there is a problem that the time required for cutting is longer in the removal processing than in the split processing.

[0004] On the other hand, the split processing requires less time for cutting and less processing loss than the removal processing. However, in the splitting method, in the method of cutting an object by bending, when a stress is applied to the notch so that the object is bent and the crack spreads, cracks are generated in directions other than the intended direction. There is a problem that it is stretched, crushed, or the cut surface is not smooth.

In the method of cutting an object to be cut by thermal expansion, a heating wire is wound along the cut to flow an electric current, or an object having a high temperature is brought into contact with the cut. In addition to the problem that when a stress is applied to the notch due to the thermal expansion of the workpiece, the crack may extend in a direction other than the intended direction, and this method is also used when cutting a workpiece with high thermal conductivity. Has the problem that it cannot be applied.

[0006] The following two methods using pressure are known as splitting methods that do not have such a defect. The first
Is a method as described in Japanese Patent Application Laid-Open No. 50-72279. As shown in FIG. 4, a material 22 to be cut is inserted into a cylindrical pressure vessel 21 and the material 22 is cut. O-rings 23, 23 are arranged on both sides of the scheduled cutting position, and cutting is performed by directly applying hydraulic pressure to an airtight space 25 formed between the pressure vessel 21 and the material 22 to be cut.

[0007] In this method, since one cut is performed at one pressurization, if a plurality of cut surfaces are required, the cut surface formed by moving the material to be cut 22 in the axial direction is moved to the space 25. Get out and raise the pressure again. Therefore, both O-rings 2
It is not possible to obtain a cut piece having a thickness smaller than the wire diameter of 3, 23. Further, the O-ring 23 needs a certain wire diameter in order to secure good sealing properties. Therefore, there is a problem that the minimum thickness of the cut material obtained by this method is limited.

A second method is a method described in Japanese Patent Publication No. 61-13958. In this method, the method is substantially the same as the above-described method, but when applying pressure, cutting is performed by applying pressure to a material to be cut via a pressure transmission cylinder. According to this method, the pressure medium does not leak from the cut portion even after the cut has occurred at one point due to the pressure increase, and the cuts occur one after another by further increasing the pressure, and a plurality of cut surfaces can be obtained by one pressure increase be able to. However, in this method, cutting occurs due to the difference in the amount of deformation between the pressure transmission cylinder and the material to be cut, so that the difference in the amount of deformation is absorbed near the location where the cutting has occurred, and the cut surface is brought close to the thin plate shape. There is a problem that a cut product cannot be obtained.

[0009]

SUMMARY OF THE INVENTION An object of the present invention is to solve the above-mentioned problems and to reduce the cutting loss when cutting an object to be cut, to shorten the cutting time, and to reduce the thickness in particular. An object of the present invention is to provide a method for cutting a brittle material from which an object can be obtained.

[0010]

Means for Solving the Problems The present inventors have conducted various studies in view of the above object, and as a result, have found that a columnar brittleness having one or two or more bonded portions perpendicular to the axial direction in which the end portions are bonded. A method of cutting a brittle material, which cuts the brittle material at the position of the streak by providing in advance a streak specifying a cross section to be cut in the material, and then applying pressure to the side surface of the brittle material provided with the streak As a result, the above object has been achieved, and the present invention has been completed.

According to the above-described first method of the prior art, when pressure is applied to the side surface of the material to be cut using a pressure medium, the pressure cannot be applied if the end portion of the material to be cut is present in the pressure load section. Therefore, it is impossible to cut near the end portion where the end portion enters the pressure load portion, and a thin cut product cannot be obtained. However, according to the method of the present invention, since pressure is applied to the brittle material which is the material to be cut to which the ends are bonded, by applying a pressure after forming a streak near the bonded portion, Cutting can be performed in the vicinity, that is, in the vicinity of the end portion, and after cutting, a thin cut product can be obtained by removing the adhesive portion.

In the case of the above-mentioned second method of the prior art, the difference in the amount of deformation between the pressure transmitting cylinder and the material to be cut is absorbed by the displacement of the cut surface in the vicinity of the cut portion. Cutting in the vicinity of the plane was impossible, and a thin cut product could not be obtained. However, according to the method of the present invention, since the cut surfaces can be bonded to each other and cut again to prevent absorption of deformation at the bonded surface, cutting in the vicinity of the bonded surface can be performed. By removing the above, a thin cut product can be obtained.

In the present invention, as a method for applying pressure to the side surface of the brittle material, a first method, that is, as described in claim 2, a columnar brittle material is inserted into a cylindrical pressure vessel. An airtight holding member is arranged between the pressure vessel and the brittle material so that the streaks are interposed therebetween, and a space defined by the pressure vessel, the brittle material and the airtight holding member is filled with a pressure medium to apply pressure. It is also possible to adopt a method of applying pressure to the side surface of the brittle material.

Further, in the present invention, when applying pressure, the second method, that is, as described in claim 3, a pressure transmission cylinder made of a material having a Young's modulus smaller than that of the brittle material around the brittle material. And the pressure medium may transmit pressure to the brittle material via the pressure transmission cylinder. In the present invention, as described in claim 4, the axial distance between the bonded portion and the streak can be set to 1/5 or less of the diameter of the brittle material.

[0015]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
As a brittle material cut by the present invention, for example,
Compound semiconductors such as silicon, GaAs, GaP, and InP; single crystals or polycrystals of quartz, sapphire or zirconia; various oxide single crystals; magnetic materials; glass; Useful for cutting. As the shape of this brittle material,
Any shape can be cut in the present invention as long as it is columnar, but it is particularly suitable for cutting a columnar brittle material.

The columnar brittle material cut in the present invention has one or two or more bonded portions perpendicular to the axial direction where the ends are bonded. This bonding site is a site where the brittle material is bonded with an adhesive, and as the bonding agent used here, in particular, as long as the bonding portion can be bonded to the brittle material and the bonding portion can be removed later. It is not limited, and examples thereof include a thermosetting resin adhesive using a phenol resin, a polyurethane resin, or the like, and a thermoplastic resin adhesive using polyvinyl acetate, polyvinyl butyral, or the like. Among them, epoxy-based adhesives are preferable because of high adhesive strength and ease of peeling after cutting.

The bonding portion may be formed by bonding the same type of brittle material or by bonding different types of brittle materials. Preferably, the same type of brittle material is bonded. Is obtained by cutting a brittle material once and bonding the cut surfaces to obtain a thinner cut product. If different types of brittle materials are bonded and used,
It is preferable to use a material having a close hardness because of the ease of the subsequent cutting step. Also, the cross section of the brittle material to be bonded is preferably substantially the same shape, particularly preferably the same shape.

By bonding the ends of the brittle material to be cut in this manner, the brittle material can be lengthened, so that the lengthened brittle material can be cut again at a predetermined position. . This makes it difficult to cut again once because it was cut once and shortened, or it was impossible to cut near the end, but it can be cut easily, and a large amount of thin plate-like material can be obtained without processing loss be able to.

In the present invention, such a brittle material is provided with a streak for designating a cross section to be cut in advance.
The streak here means a notch, a streak, a groove or the like. For example, when cutting a columnar brittle material, the streak may be annularly formed on the outer circumference so as to be perpendicular to the axis, or may be partially formed on the outer circumference.

The thickness of the cut piece obtained is determined by the distance of the streak from the bonding site. In the present invention, this distance can be set to 1/5 or less, particularly 1/20 or less of the diameter of the brittle material. Here, the diameter means the diameter when the brittle material is a column, and the longest portion in a cross section perpendicular to the axial direction when the other brittle material is a column.

In the present invention, by applying pressure to the side surface of the brittle material provided with the streak, the brittle material is cut at the position of the streak. The method of applying this pressure is not particularly limited, but it can be performed using the above-mentioned conventional method (see Japanese Patent Application Laid-Open No. 50-72279 and Japanese Patent Publication No. 61-13958). That is, for example, a columnar brittle material is inserted into a cylindrical pressure vessel, and two airtight holding members such as O-rings are arranged between the pressure vessel and the brittle material. At this time, the streaks formed on the brittle material are arranged so as to be between the two airtight holding members. A pressure medium is introduced into a space defined by the pressure vessel, the brittle material and the member that maintains airtightness, and pressure is applied to cut the brittle member at the streak portion.

In the present invention, a pressure transmission cylinder may be provided around the brittle material, and when pressure is applied by the pressure medium, pressure may be applied to the brittle material via the pressure transmission cylinder. This pressure transmission cylinder is made of a material having a Young's modulus lower than that of the brittle material, for example, acrylic resin, and is formed so as to fit around the brittle material.

[0023]

EXAMPLES Examples of the present invention will be shown below, but the present invention is not limited to these examples. (Embodiment 1) A first embodiment of the present invention will be described with reference to FIGS. In the figure, reference numeral 1 denotes a cylindrical pressure vessel. The inner wall of the pressure vessel 1 is provided with a space forming portion 3 having a slightly larger inner diameter so that a space for introducing a pressure medium is formed between the pressure vessel 1 and the glass rod 2 to be inserted. This space forming part 3
A fastener fixing portion 4 having a larger inner diameter and a threaded inner wall is formed at one end. A glass rod 2 having a diameter of 20 mm and having five first streaks 5, 5, 5, 5, 5 is inserted into the pressure vessel 1 at intervals of 2 mm with a Vickers indenter. Both ends of space forming part 3 and glass rod 2
Between them, cylindrical spacers 6, 6 are arranged, and O-rings 7, 7 are arranged at positions determined by the spacers 6, 6. The five first streaks 5, 5,
5, 5, 5 are arranged so as to be located between the O-rings 7, 7.

An acrylic pressure transmission cylinder 8 having a length of 40 mm is covered on the outer periphery of the glass rod 2 between the O-rings 7 and 7. In this state, the O-ring 7 is tightened via the spacer 6 by inserting and rotating a fastener 9 having an outer diameter substantially equal to the inner diameter of the fastener fixing part 4 and being screwed around the outer circumference of the fastener fixing part 4. be able to. A pressure medium is introduced from a pressurizing device (not shown) through a pressure medium introduction hole 10 into a space defined by the space forming section 3, the O-rings 7, 7 and the pressure transmission cylinder 8 which is thus airtight,
A pressure of 1000 kgf / cm ² was applied. This allows
Cut pieces cut at the positions of five first streaks 5, 5, 5, 5, 5 were obtained. In this case, as the pressure medium,
Water or other liquid may be used, or gas such as compressed air may be used.

The cut pieces are taken out, and the five cut surfaces are respectively bonded with an epoxy-based adhesive to form five bonded portions 1.
A glass rod 2 'having 1, 11, 11, 11, 11 was obtained. Two adjacent bonding portions 11 among the bonding portions 11,
A second streak 12 was provided at a total of four places at the center of 11 by a Vickers indenter.

Such a glass rod 2 'was mounted on a device similar to that for the first cutting described above in the same manner as shown in FIG. 2, and a pressure of 1000 kgf / cm ² was applied. As a result, cut pieces cut at the four second streaks 12, 12, 12, 12 were obtained. The obtained cut pieces were taken out, immersed in an acidic solution, and peeled off the bonded portions, thereby obtaining eight glass plates having a diameter of 20 mm and a thickness of 1 mm.

(Embodiment 2) A second embodiment of the present invention will be described with reference to FIG. A glass rod 2 provided with one first streak is inserted into a pressure vessel 1 having substantially the same shape as that of the first embodiment by a Vickers indenter.
Spacers 6, 6 and O-rings 7, 7 were arranged in the same manner as in Example 1 so as to be arranged between the rings 7, 7. O-rings 7 and 7 are cylindrical and define a pressure load range, 5 m wide
A load range spacer 13 of m is arranged. The load range spacer 13 is arranged along the inner wall of the pressure vessel 1, and a hole 14 is provided at a position corresponding to the pressure medium introduction hole 10. The O-ring 7 is tightened by rotating the fastener 9 in the same manner as in the first embodiment, and the pressure medium is placed in an airtight space formed between the load range spacer 13, the O-rings 7, 7 and the glass rod. Is introduced through the pressure medium introduction hole 10 and the hole 14, and 1000 kgf / c
A pressure of m ² was applied. Thereby, the glass rod was cut at the position of the streak.

The cut surface was bonded with an epoxy adhesive, and a second streak 12 was formed at a position 1 mm away from the bonding portion 11 with a Vickers indenter. This second streak 12
However, as shown in FIG. 3, the glass rod 2 was mounted on the pressure vessel 1 again so as to be located between the two O-rings 7 and 7, and a pressure of 1000 kgf / cm ² was also applied. Thereby, the glass rod was cut at the position of the second streak 12. The cut piece was taken out, immersed in an acidic solution to remove the adhesive surface, and one glass plate having a diameter of 20 mm and a thickness of 1 mm was obtained.

The present invention is not limited to the above embodiment. The above embodiment is an exemplification, and has substantially the same configuration as the technical idea described in the scope of the claims of the present invention. It is included in the technical scope of the invention.

For example, in the above-described embodiment, an example has been described in which the end portions of the brittle material are bonded once and then cut with streaks. However, the method of the present invention is such that bonding is performed only once. The present invention is not limited to the case where cutting is performed, and it is also possible to repeatedly bond and cut and cut out thinner cut pieces in large quantities.

[0031]

According to the present invention, a columnar brittle material having one or more adhesive portions perpendicular to the axial direction is provided with a mark for designating a cross section to be cut in advance, and then the mark is provided. Since the brittle material is cut at the position of the streak by applying pressure to the side surface of the brittle material, a thin cut product can be obtained with a small cutting loss.

[Brief description of the drawings]

FIG. 1 is a sectional view showing a pressure load device used in a cutting method of the present invention.

FIG. 2 is a sectional view of a pressure load device for explaining an example of a cutting method of the present invention.

FIG. 3 is a sectional view of a pressure load device used in another example of the cutting method of the present invention.

FIG. 4 is a sectional view of a pressure load device used in a conventional cutting method.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 ... Pressure vessel, 2 and 2 '... Glass bar, 3 ... Space formation part, 4 ... Fastener fixing part, 5 ... First streak, 6 ... Spacer, 7 ... O-ring, 8 ... Pressure transmission cylinder, 9 ... Tightener, 10 ... Pressure medium introduction hole, 11 ... Adhesive part, 12 ...
Second streak, 13 ... spacer for load range, 14
... holes.

Claims (4)

[Claims] 1. A column-shaped brittle material having one or more bonded portions perpendicular to an axial direction in which end portions are bonded to each other is provided with a mark for designating a cross section to be cut in advance, and then the mark is provided. A method for cutting a brittle material, wherein the brittle material is cut at the position of the streak by applying pressure to a side surface of the brittle material. 2. The column-shaped brittle material is inserted into a cylindrical pressure vessel, and an airtight holding member is arranged between the pressure vessel and the brittle material so that the streak enters between the pressure vessel and the brittle material.
The method for cutting a brittle material according to claim 1, wherein a pressure medium is filled in a space defined by the brittle material and the airtight holding member, and pressure is applied to a side surface of the brittle material. 3. A pressure transmission cylinder made of a material having a Young's modulus smaller than that of the brittle material is disposed around the brittle material, and the pressure medium transmits pressure to the brittle material via the pressure transmission cylinder. 3. The method according to claim 1, wherein
The method for cutting a brittle material according to the above. 4. An axial distance between the bonding portion and the streak is not more than one fifth of a diameter of the brittle material.
The method for cutting a brittle material according to claim 3.