JPS62233737A - Sampling method for material surface - Google Patents
Sampling method for material surfaceInfo
- Publication number
- JPS62233737A JPS62233737A JP7778286A JP7778286A JPS62233737A JP S62233737 A JPS62233737 A JP S62233737A JP 7778286 A JP7778286 A JP 7778286A JP 7778286 A JP7778286 A JP 7778286A JP S62233737 A JPS62233737 A JP S62233737A
- Authority
- JP
- Japan
- Prior art keywords
- sampling
- material surface
- cut
- rod
- depth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005070 sampling Methods 0.000 title claims abstract description 32
- 239000000463 material Substances 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims description 12
- 238000004026 adhesive bonding Methods 0.000 claims 1
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 abstract description 4
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 238000005498 polishing Methods 0.000 abstract description 3
- 238000001816 cooling Methods 0.000 abstract description 2
- 239000007788 liquid Substances 0.000 abstract description 2
- 229910052757 nitrogen Inorganic materials 0.000 abstract description 2
- 101100008047 Caenorhabditis elegans cut-3 gene Proteins 0.000 abstract 1
- 230000015556 catabolic process Effects 0.000 abstract 1
- ZZUFCTLCJUWOSV-UHFFFAOYSA-N furosemide Chemical compound C1=C(Cl)C(S(=O)(=O)N)=CC(C(O)=O)=C1NCC1=CC=CO1 ZZUFCTLCJUWOSV-UHFFFAOYSA-N 0.000 abstract 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Sampling And Sample Adjustment (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は機械部品の品質検査に適用される材料表面の試
料採取法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for sampling the surface of a material applied to quality inspection of mechanical parts.
従来、機械部品の試料採取法としては、機械部品全体ま
たは一部を切断する方法はあったが、表面から深さ数頭
程度の微小なサンプルを無ひずみ的に採取する方法はな
かった。Conventionally, there have been methods for collecting samples of mechanical parts by cutting the whole or a part of the mechanical parts, but there has been no method for collecting microscopic samples several depths from the surface without strain.
しかし、上述した方法では、サンプリング後に該部品の
交換や溶接等の補修が必要であった。However, the above-mentioned method requires replacement of the parts or repair such as welding after sampling.
また使用中の機械部品の中には、例えば事業用ボイラの
主蒸気管のように長時間使用による劣化度が外表面部で
最も高く、その余寿命等の評価が外表面部のごく微小な
サンプリングで高精度で行なえる機械部品が多数ある。Furthermore, among mechanical parts in use, for example, the main steam pipe of a commercial boiler, the degree of deterioration due to long-term use is highest on the outer surface, and the evaluation of the remaining life etc. There are many mechanical parts that can be sampled with high precision.
本発明は機械部品のごく表面を無ひずみ的に試料採取す
る方法を提供しようとするものである。The present invention seeks to provide a method for sampling the very surface of a mechanical component without strain.
上記事情に鑑み、本発明はサンプリング部表面に採取棒
を接着し接着部の周囲の部材に切り欠きをつけ、脆性破
壊温度以下にサンプリング部を冷却し、上記採取棒に衝
撃引張応力をかけ切り欠き部を起点とした脆性破壊によ
り、無ひずみ的に材料表面の試料を採取することを特徴
とする材料表面の試料採取法である。゛〔作 用〕
上述した本発明方法によれば、機械部品の表面部分の微
小な部分を無ひずみ的に採取することができる。In view of the above circumstances, the present invention has been developed by bonding a sampling rod to the surface of the sampling part, making a notch in the member surrounding the adhesive part, cooling the sampling part below the brittle fracture temperature, and applying impact tensile stress to the sampling rod and cutting it. This is a material surface sampling method characterized by collecting a sample of the material surface without strain by using brittle fracture starting from a notch. [Function] According to the method of the present invention described above, a minute portion of the surface portion of a mechanical component can be sampled without strain.
以下、本発明の実施例を第１図を参照して説明する。 Embodiments of the present invention will be described below with reference to FIG.
材料表面１のサンプリング部分を研磨紙を用いて平滑に
した後、内径５■Ｖ肉厚３寵の円筒状研磨治具を用いて
該材料表面に深さ２ｍの円形の溝２をつける。該溝のサ
ンプリング部側の側面に放電加工により約１．５箇深さ
の切り欠き３をつけた後採取棒４をサンプリング部表面
に接着剤５にて接着する。次にサンプリング部全体を液
体窒素によシ冷却し、採取棒４を材料表面に垂直方向に
引張ると切欠き部より脆性的に破壊し５ ｒｍ ９６
１，５ ｔｍＬの円板状試料のサンプリングができた。After smoothing the sampling portion of the material surface 1 using abrasive paper, a circular groove 2 with a depth of 2 m is formed on the material surface using a cylindrical polishing jig with an inner diameter of 5 cm and a wall thickness of 3 cm. After making a notch 3 about 1.5 deep in the side surface of the groove on the sampling part side by electric discharge machining, a sampling rod 4 is bonded to the surface of the sampling part with an adhesive 5. Next, the entire sampling part was cooled with liquid nitrogen, and when the sampling rod 4 was pulled in a direction perpendicular to the material surface, it was brittlely fractured from the notch part, and 5 rm 96
A disk-shaped sample of 1.5 tmL was able to be sampled.
しかして本実施例にかかる採取法によれは機械部品等の
材料表面から深さ１．５ｍ直径５８程度の微小な領域の
サンプルを採取することができる。According to the sampling method according to this embodiment, a sample can be sampled from a minute area with a depth of 1.5 m and a diameter of about 58 mm from the surface of a material such as a mechanical part.
以上詳述した如く、本発明によれば材料表面の微小な領
域を無ひずみ的にサンプリングでき、サンプリング後は
、グラインダ等による簡単な研磨仕上げ等で、補修する
事ができるサンプリング法を提供することができる。As detailed above, the present invention provides a sampling method that allows sampling of a minute area on the surface of a material without strain, and after sampling, it can be repaired by simple polishing using a grinder or the like. I can do it.
第１図は本発明の実施例におけるサンプリングに用いら
れた方法を示す概略図である。
１・・・材料表面、２・・・円形の溝、３・・・切欠き
、４・・・採取棒、５・・・接着剤。FIG. 1 is a schematic diagram illustrating the method used for sampling in an embodiment of the invention. 1... Material surface, 2... Circular groove, 3... Notch, 4... Collection rod, 5... Adhesive.
Claims (1)
小な切り欠きをつけた後、該材料の脆性破壊温度以下に
該材料を冷却し、上記採取棒に衝撃引張応力を加えて該
切り欠き部を起点とした脆性破壊により、無ひずみ的に
材料表面の試料を採取することを特徴とする材料表面の
試料採取法。After gluing a sampling rod to the material surface and making a minute notch on the material surface near the bonded part, the material is cooled to below the brittle fracture temperature of the material, and an impact tensile stress is applied to the sampling rod to remove the material. A material surface sampling method characterized by collecting material surface samples without strain through brittle fracture starting from a notch.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7778286A JPS62233737A (en) | 1986-04-04 | 1986-04-04 | Sampling method for material surface |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP7778286A JPS62233737A (en) | 1986-04-04 | 1986-04-04 | Sampling method for material surface |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62233737A true JPS62233737A (en) | 1987-10-14 |
Family
ID=13643538
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP7778286A Pending JPS62233737A (en) | 1986-04-04 | 1986-04-04 | Sampling method for material surface |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62233737A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012121036A (en) * | 2010-12-07 | 2012-06-28 | Ihi Corp | Sampling and repairing method |
| CN103364223A (en) * | 2013-07-26 | 2013-10-23 | 吉林大学 | Acoustic material sampling cutter |
-
1986
- 1986-04-04 JP JP7778286A patent/JPS62233737A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012121036A (en) * | 2010-12-07 | 2012-06-28 | Ihi Corp | Sampling and repairing method |
| CN103364223A (en) * | 2013-07-26 | 2013-10-23 | 吉林大学 | Acoustic material sampling cutter |
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