JPH10328820A - Heating construction of soldering iron and soldering equipment - Google Patents

Abstract

PROBLEM TO BE SOLVED: To obtain stabilized soldering quality in high speed soldering by making up for shortcoming of a conventional heating construction. SOLUTION: Outer peripheral heating, which is executed by mounting a cylindrical heater 5 on an outer periphery of a soldering iron 1, and high frequency induction heating, which is executed by enbeding an alloy 57 wound with a high frequency induction coil 56 inside the soldering coil 1 and generating high frequency electromagnetic induction, are used jointly, a rising up time of an iron tip temp. of the soldering iron 1 is shortened, further, temp. drop is reduced, in particular, lowering of a iron tip temp. in high speed soldering is suppressed.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a heating structure for heating a soldering iron and a soldering apparatus using the same.

[0002]

2. Description of the Related Art FIG. 10 shows the vicinity of a solder head of a conventional soldering apparatus, for example, an automatic soldering apparatus for automatically performing soldering by a soldering robot.

The soldering iron 100 has a cylindrical heater 111 mounted on the outer periphery thereof, and is held by a solder head 101. The base of the solder head 101 is attached to a robot arm of a soldering robot (not shown). In addition, the soldering iron 100 is guided to a predetermined soldering position by the movement of the robot arm.

[0004] A solder core (thread solder) is
The supply nozzle 102 that automatically supplies the leading end of the nozzle 00 is attached to a support bar 104 via a supply holder 103, and the support bar 104 is held by a holding portion 105 of the solder head 101 protruding.

In such an automatic soldering apparatus, the soldering iron 100 held by the solder head 101 is guided to a predetermined soldering location, and a solder core wire is automatically supplied from a supply nozzle 102 to the tip of the soldering iron 100 at a predetermined supply angle. And soldered.

[0006]

Generally, the heating of the soldering iron 100 in such a soldering apparatus is performed by forming a cylindrical heater around the outer periphery of the soldering iron 100 as shown in the sectional views of FIGS. 12, or a heater 113 having a temperature sensor 117 at the center is disposed inside the soldering iron 112 and heated from the inside of the soldering iron 112 as shown in the sectional view of FIG. Internal heating or Fig. 1
As shown in the cross-sectional view of FIG. 3, a special alloy 116 serving as a heater portion in which a high-frequency induction coil 115 is wound inside a soldering iron 114 and heating by high-frequency electromagnetic induction is used. Done.

The present inventors evaluated the characteristics of these three types of heating as follows.

That is, as shown in FIG. 14, the soldering iron is heated from room temperature to a set temperature (400 ° C.)
Measure the temperature change of the iron tip when the test piece is held in contact with the iron tip of the soldering iron, the rise time from the start of heating to the set temperature, the heat drop that has dropped from the set temperature due to the contact of the test piece The temperature and the heat recovery time from the start of the contact of the test piece to the return to the set temperature again were measured for the above three types of internal heating, peripheral heating and high-frequency induction heating. 15 to 17 show the measurement results.

As shown in FIG. 15, the rise time of the iron tip temperature is shortest and excellent in high-frequency induction heating, and the heat-down temperature is small and excellent in outer peripheral heating as shown in FIG. Further, as shown in FIG. 17, the heat recovery time of the iron tip is the shortest in the internal heating, and is excellent.

As described above, each of the conventional heating structures has advantages and disadvantages. Particularly, in a high-speed soldering operation, if the heat drop temperature is large and the heat recovery time is long,
There is a drawback in that the temperature of the soldering iron tip is lowered and stable soldering quality cannot be secured.

The present invention has been made in view of the above points, and makes it possible to ensure stable soldering quality even in high-speed soldering work by compensating for the disadvantages of the conventional heating structure. It is the main purpose.

[0012]

In order to achieve the above-mentioned object, the present invention is configured as follows.

That is, the heating structure of the soldering iron of the present invention has an internal heating in which a heater is arranged inside the soldering iron,
At least two types of heating are used together: outer peripheral heating in which a heater is arranged on the outer periphery of the soldering iron, and high-frequency induction heating by high-frequency electromagnetic induction.

It is preferable to use both the outer periphery heating and the high frequency induction heating as the two types. A heater in which a cylindrical heater is mounted on the outer periphery of the soldering iron and a high frequency induction coil is wound inside the soldering iron is used. It is preferable to arrange the parts and use two types of heating together.

A soldering apparatus according to the present invention includes the soldering iron heating structure according to the present invention.

Further, a soldering apparatus according to the present invention is a soldering apparatus having the above-described heating structure and supplying a solder core to the soldering iron and automatically performing soldering, wherein the soldering head holds the soldering iron. Is attached to the robot arm of the soldering robot so as to be displaceable along the axial direction of the soldering iron, and a solder core wire feeding device that supplies a solder core to the soldering iron, The tip of the soldering iron attached to the fixed position along the axial direction and guided to the soldering target by the robot arm is pressed by the soldering target, so that the soldering iron is displaced along the axial direction. Is what you do.

According to the soldering iron heating structure of the present invention,
Since at least two types of heating, internal heating, peripheral heating and high-frequency induction heating, are used in combination, the disadvantages of each heating are supplemented,
It is possible to improve characteristics such as a rise time and a heat falling temperature.

Further, since the outer peripheral heating and the high frequency induction heating are used together, the rise time of the iron tip temperature of the soldering iron can be shortened and the heat falling temperature can be reduced. It is possible to suppress the decrease.

According to the soldering device of the present invention, it is possible to perform soldering according to the required characteristics of the iron tip temperature,
In particular, it is possible to suppress a decrease in the temperature of the iron tip during high-speed soldering and to secure stable soldering quality.

Further, according to the soldering device of the present invention, the tip of the soldering iron guided to the soldering target by the robot arm is pressed against the soldering target, so that the soldering iron moves in the axial direction of the soldering iron. Therefore, the supply position of the solder core wire to the soldering iron is automatically adjusted along the axial direction, so that there is no need for the operator to manually adjust the position as in the related art.

[0021]

Embodiments of the present invention will be described below in detail with reference to the drawings.

(Embodiment 1) FIG. 1 is a configuration diagram of a system using an automatic soldering apparatus having a soldering iron heating structure according to one embodiment of the present invention.

This soldering system comprises a soldering iron 1
And a soldering robot 3 provided with a supply nozzle 2 for supplying a solder core to the soldering iron 1 and the like as described later.
A robot controller 4 for controlling the movement of the robot 3 and a soldering controller 5 for controlling the temperature of the soldering iron 1 based on the supply of a solder core and the output of a temperature sensor for measuring the temperature of the soldering iron 1. A sequencer 6 for controlling the controllers 4 and 5 in a predetermined procedure, a CCD camera 7 for capturing an image of an object to be soldered,
Image processing is performed on the imaging signal from the D camera 7, and the image processing information and the CAD information of the soldering target, that is, the design position information of the soldering target, are subjected to matching processing to determine the soldering position. A computer 8 for calculating a correction value for correction and providing the calculated value to the robot controller 4;

FIG. 2 is an enlarged sectional view of the soldering iron 1 of FIG.

The heating structure of the soldering iron 1 of this embodiment has a structure in which the outer periphery heating and the high frequency induction heating are used in combination, and a cylindrical heater 55 is provided on the outer periphery of the soldering iron 1.
Is mounted inside the soldering iron 1, a special alloy 57 serving as a heater portion around which a high-frequency induction coil 56 is wound.
Are provided, and the high-frequency induction coil 56 is connected to a high-frequency power supply (not shown). In FIG. 2,
58 is a heater wire constituting the heater 55, 59 is a stainless steel pipe, and 60 is a temperature sensor arranged at the tip of the heater 55.

As described above, the outer peripheral heating and the high frequency induction heating by high frequency electromagnetic induction are used in combination, so that the above-described FIG.
As shown in FIG. 5, the rise time of the iron tip temperature can be shortened, and as shown in FIG. 16 described above, the heat drop temperature of the iron tip can be reduced, thereby performing high-speed soldering. In this case, a decrease in the temperature of the iron tip can be suppressed, and stable soldering quality can be ensured.

In this embodiment, the outer periphery heating and the high-frequency induction heating are used together, but as another embodiment of the present invention, the inner heating may be used together, or
Peripheral heating and internal heating may be used in combination. When both the outer peripheral heating and the inner heating are used, the heat lowering temperature can be reduced and the heat recovery time can be shortened.

FIG. 3 is a partial sectional view of the vicinity of the solder head of FIG.

The automatic soldering apparatus of this embodiment is
Soldering iron 1 having the above-mentioned heating structure such as heater 55
And a solder head 10 for holding the soldering iron 1;
As will be described later, the soldering head 10 is held so as to be displaceable within a certain range along the axial direction of the soldering iron 1 (vertical direction in FIG. 3), and at the tip of the robot arm 11 of the soldering robot 3 A holding plate 13 connected via a connecting shaft 12 and the like, a supply nozzle 2 as a solder core wire feeder for supplying a solder core to the tip of the soldering iron 1, and a supply holder 14 holding the supply nozzle 2
And a rotating mechanism 17 for rotating the holding member 16 to an arbitrary position in the circumferential direction around the axis P of the soldering iron 1, The soldering iron 1 held by the solder head 10
The movement of the robot arm 11 leads to a predetermined soldering position.

In this embodiment, the operator manually adjusts the position of the supply nozzle 2 with respect to the soldering iron 1, that is, the supply position of the solder core, by loosening the screw 18 and the like of the supply holder 14, as in the related art. It is configured so that it can be automatically adjusted along the axial direction of the soldering iron 1 without any trouble.

That is, in this embodiment, the soldering iron 1 is held on the holding plate 13 fixedly attached to the tip end of the robot arm 11 of the soldering robot 3 via the connecting shaft 12 or the like. The solder head 10 is attached so as to be displaceable within a certain range W in the axial direction of the soldering iron 1. The solder head 10 is supported by a pair of guide shafts 19 integrated with the holding plate 13, and is externally fitted to the guide shaft 19 inside an insertion hole 20 of the solder head 10 through which these guide shafts 19 pass. A spring 21 is housed, and the tip of the soldering iron 1 is pressed against a soldering target 22, whereby the solder head 1 is pressed against the urging force of the spring 21.
0 is the range W until the end comes into contact with the end face of the holding plate 13.
It is configured to be able to be displaced over the range.

On the other hand, a supply nozzle 2 for supplying a solder core
Is held at a fixed position along the axial direction of the soldering iron 1 via a supply holder 14, a support rod 15, and a holding member 16, and an operator loosens a screw 18 or the like of the supply holder 14 as in the related art. Unless manually adjusted, solder iron 3
Are constant along the axial direction.

Therefore, by varying the amount of pressing of the tip of the soldering iron 1 against the soldering object 22, it is possible to vary the amount of displacement of the solder head 10, that is, the soldering iron 1 along the guide shaft 19. As a result, as shown in FIGS. 4 (a) and 4 (b), for example,
The distance D along the axial direction of the soldering iron 1 to the tip of the soldering iron 1, that is, the supply position of the supply nozzle 2 to the soldering iron 1, can be changed along the axial direction of the soldering iron 1.

Therefore, in this embodiment, when the coordinate position of the robot arm 11 for designating the movement of the robot arm 11 of the soldering robot 3 is input as a numerical value by the robot controller 4, the soldering iron 1 is soldered. The displacement amount for pressing the target 22 and displacing the soldering iron 1 along the axial direction is input so that the desired displacement amount, and therefore the position of the supply nozzle 2 with respect to the soldering iron 1, becomes the desired supply position. is there.

For example, when it is desired to increase the axial distance D from the tip of the soldering iron 1 to the tip of the supply nozzle 2, the coordinate position of the robot arm 11 is adjusted so that the amount of pressing on the soldering target 22 is reduced. By inputting, the displacement of the solder head 10 due to the soldering iron 1 abutting the soldering target 22 is reduced, and the distance D from the tip of the soldering iron 1 to the tip of the supply nozzle 2 is reduced as shown in FIG. In contrast, when the distance D from the tip of the soldering iron 1 to the tip of the supply nozzle 2 is to be reduced, the coordinate position of the robot arm 11 is increased and the amount of pressing on the soldering target object 22 is increased. The object 2 to be soldered
2, the displacement of the solder head 10 due to the pressing of the soldering iron 1 increases, and the distance D from the tip of the soldering iron 1 to the tip of the supply nozzle 2 decreases as shown in FIG.

As described above, by inputting the coordinates specifying the movement of the robot arm 11 as numerical values, that is, by the program for the robot controller 4, the position of the supply nozzle 2 with respect to the soldering iron 1 can be variably set. As shown in the figure, the operator does not need to perform any troublesome operation such as loosening the screws of the supply holder and manually adjusting the position of the supply nozzle. A core wire can be supplied.

That is, it is possible to quickly cope with various kinds of soldering positions, and it is possible to omit a troublesome manual operation of changing a supply position by an operator, and to stably perform the soldering quality stably and efficiently at all times. Soldering can be performed.

Further, in this embodiment, when there is an obstacle in front of the soldering portion or when there is a restriction on the supply angle of the solder core, it is possible to avoid them and perform soldering. For this purpose, a rotation mechanism 17 for rotating the supply nozzle 2 for supplying the solder core to an arbitrary position in the circumferential direction about the axis P of the soldering iron 1 is provided.

As shown in FIG. 3, the rotation mechanism 17 is a stepping motor 24 that rotates forward and reverse and is supported by a support arm 23 attached to a connecting portion of the robot arm 11, and is driven to rotate by the stepping motor 24. Driven pulley 25, a driven pulley 27, a timing belt 26 is wound around the driven pulley 25, and driven by the driven pulley 25 to rotate.
A rotary pulley 27 that rotates integrally with the rotary member 7 and has a holding member 16 that holds the supply nozzle 2 attached thereto; and a rotation position detection sensor 29 that detects the rotation position of the rotary body 28. A bearing 3 is provided between the connecting shaft 12 to which the solder head 10 is attached.
0 is interposed, and the connecting shaft 12 is configured not to rotate.

In the rotating mechanism 17, the drive pulley 25 is driven to rotate by the forward or reverse rotation of the stepping motor 24, and the driven pulley 27 is rotated by the rotation of the drive pulley 25 and the driven pulley 27 is rotated. The rotating body 28 integrated with the pulley 27 rotates to supply the holder 1.
3 and the supply nozzle 2 held by the holder 14 rotates around the axis P of the soldering iron 1 as shown by the phantom line in FIG. Is controlled by the sequencer 6.

The rotation mechanism 17 allows the supply nozzle 2
Is rotated to an optimal position in the circumferential direction around the soldering iron 1 to supply a solder core and perform soldering.

An example of the soldering work process will be described. First, the iron tip of the soldering iron 1 is cleaned by blowing air with an air blow nozzle or the like, which will be described later, and immediately before the soldering iron 1 is applied to a portion to be soldered. By supplying the primary solder to wet the iron tip, transmitting heat through the solder and preheating as it is, then supplying the secondary solder and applying the soldering iron 1 to the place where the soldering is to be performed, and heating. And soldering.

As another embodiment of the present invention, the rotation mechanism 17 may be omitted, and the supply nozzle 2 may be provided at a fixed position as in the prior art.

Further, as another embodiment of the present invention, the supply nozzle 2 may be rotated only in one direction, the forward direction or the reverse direction.

The rotating mechanism 17 may be constituted by a cylinder, a gear, or the like instead of the motor or the pulley.

(Embodiment 2) FIG. 5 is a partial sectional view of a main part of another embodiment of the present invention, and portions corresponding to FIG. 3 are denoted by the same reference numerals.

Also in this embodiment, as shown in FIG. 2 described above, a heating structure is used in which the outer periphery heating and the high frequency induction heating are used in combination.

Further, in this embodiment, the rotating mechanism 1
In addition to the supply nozzle 2 for supplying the solder core, the support rod 15 held by the rotating body 28 of the nozzle 7 via the holding member 16 has an air for blowing air onto the iron tip of the soldering iron 1 for cleaning. Equipped with a blow nozzle 31,
At the time of cleaning, the cleaning is performed by blowing air from the air blow nozzle 31 to the entire peripheral surface of the iron tip of the soldering iron 1 while rotating the rotating body 28. As described above, since the single air blow nozzle 31 is rotated around the axis P of the soldering iron 1 to blow the air to clean the iron tip, the cleaning is performed securely over the entire peripheral surface of the iron tip to remove the deposits. It can be removed and the soldering quality can be improved.

The cleaning material sprayed on the iron tip is not limited to air, but may be other gases or fine particles.

Other configurations are the same as those of the above-described embodiment.

(Embodiment 3) FIG. 6 is a partial cross-sectional view of a main part of still another embodiment of the present invention, and portions corresponding to FIG. 3 are denoted by the same reference numerals.

Also in this embodiment, as shown in FIG. 2 described above, a heating structure is used in which outer periphery heating and high frequency induction heating are used in combination.

Further, in this embodiment, the position of the supply nozzle 2 for supplying the solder core is automatically retracted to a position where it does not interfere with the cleaning of the soldering tip of the soldering iron 1 or the replacement of the soldering iron 1. After the cleaning or replacement is completed, it can be automatically returned to the original position again.

That is, in this embodiment, the supply nozzle 2 is swung between a supply position inclined with respect to the axis P of the soldering iron 1 and a retracted position parallel to the axis P of the soldering iron 1. The swing mechanism 32 is provided. The supply position is a position where the solder core can be supplied to the soldering iron 1 at a predetermined supply angle, and the retreat position is
This is a position where the soldering iron 1 can be cleaned and replaced without the supply nozzle 2 being in the way.

The swing mechanism 32 includes a pinion 3 provided on a supply holder 14 for holding the supply nozzle 2 in a swingable manner.
3, a rack 34 that meshes with the pinion 33, and an air cylinder 35 that drives the rack 34 forward and backward along a support rod 15 that supports the supply holder 14. The air cylinder 35 Fixedly attached to

In the swing mechanism 32, the air cylinder 3
The feed nozzle 2 is moved through the rack 34 and the pinion 33 by moving the piston rod 36 of
Supply position inclined with respect to soldering iron 1 and soldering iron 1
Swinging between a retracted position and a retracted position which is parallel to.

Since the supply nozzle 2 is oscillated by the oscillating mechanism 32 as described above, when the soldering iron 1 is cleaned or the soldering iron 1 is replaced, the oscillating mechanism 3 is rotated by the sequencer 6.
2 and the piston rod 36 of the air cylinder 35
And the cleaning or replacement operation is performed by swinging the supply nozzle 2 to the retracted position.
Is retracted to return the supply nozzle 2 to the supply position.

Thus, when cleaning the soldering iron tip of the soldering iron 1, the ironing tip can be sufficiently cleaned without the supply nozzle 2 being in the way.

After the soldering iron 1 has been replaced,
The position of the supply nozzle 2 can be returned to the same position as before the replacement without a troublesome operation of manually adjusting the position of the supply nozzle 2 to the original position.

The other structure is the same as that of the embodiment shown in FIG. In the embodiment described above, the supply nozzle 2 is switched between the supply position and the retreat position by the advance and retreat of the piston rod 36 of the air cylinder 35. However, as another embodiment of the present invention, a forward / reverse rotation motor The rotational power may be transmitted to the pinion 33 to displace the supply nozzle 2 arbitrarily. In this case, the supply nozzle 2
Can be set arbitrarily.

(Embodiment 4) FIG. 7 is a partial cross-sectional view of a main part of still another embodiment of the present invention, and portions corresponding to FIG. 3 are denoted by the same reference numerals.

Also in this embodiment, as shown in FIG. 2 described above, the heating structure is a combination of the outer periphery heating and the high frequency induction heating.

Further, in this embodiment, the holding member 1
6, a supply nozzle 2 is held, and a glass tube heater 37 for preheating by blowing high-temperature nitrogen gas to a portion to be soldered is held. 1 and is preliminarily heated by blowing a high-temperature nitrogen gas to a soldering location immediately before soldering.

As described above, the glass tube heater 37 is provided so as to move integrally with the soldering iron 1 and preheating is performed by locally blowing high-temperature nitrogen gas immediately before soldering. Since the resin component does not undergo thermal deformation and preheating is performed immediately before soldering, thermal efficiency is improved.

Moreover, since nitrogen gas is used, the solder and the base metal are not oxidized as in the case of using air, and the soldering quality can be improved.

Further, since the glass tube heater 37 can be turned around the axis P of the soldering iron 1 by the turning mechanism 17, the direction of blowing the high-temperature nitrogen gas from the glass tube heater 37 can be easily changed.

Although nitrogen gas is used in this embodiment, air or another inert gas may be used as another embodiment of the present invention.

(Other Embodiments) As another embodiment of the present invention, the above embodiments may be appropriately combined. For example, the embodiment of FIG. 5 and the embodiment of FIG. As shown in FIG. 8 in combination, the air blow nozzle 31 and the glass tube heater 37 may be provided.

In each of the above-described embodiments, the present invention is applied to an automatic soldering apparatus for automatically performing soldering. However, the heating structure of the soldering iron according to the present invention is not limited to an automatic soldering apparatus, but may be applied to a manual soldering apparatus. Of course, it is good.

The mounting structure of the solder head 10 is not limited to the above-described embodiment. For example, as shown in FIG. 9, a guide bush 70 on which the guide shaft 19 of the holding plate 13 is in sliding contact with the solder head 10. Equipped with a compression coil spring 72 disposed between the storage recess 71 of the solder head 10 and the holding plate 13, and by pressing the tip of the soldering iron 1 against a soldering object, the biasing force of the compression coil spring 72 is reduced. Soldering head 10
May be displaceable along the guide shaft 19 over a range W until it comes into contact with the end face of the holding plate 13.

[0071]

As described above, according to the present invention, at least two types of heating, internal heating, outer peripheral heating, and high-frequency induction heating, are used together. Characteristics such as time and heat drop temperature can be improved.

Further, since the outer peripheral heating and the high-frequency induction heating are used together, the rise time of the iron tip temperature of the soldering iron can be shortened and the heat falling temperature can be reduced. As a result, it is possible to suppress the reduction, and it is possible to secure stable soldering quality.

Further, according to the soldering device of the present invention, the tip of the soldering iron guided to the soldering target by the robot arm is pressed against the soldering target, so that the soldering iron moves in the axial direction of the soldering iron. In this case, the supply position of the solder core wire to the soldering iron is automatically adjusted along the axial direction, so that there is no need for the operator to make manual and troublesome adjustments as in the related art. .

[Brief description of the drawings]

FIG. 1 is a configuration diagram of a soldering system according to one embodiment of the present invention.

FIG. 2 is a sectional view of the soldering iron of FIG. 1;

FIG. 3 is a partial cross-sectional view of the vicinity of a solder head of the present invention.

FIG. 4 is an enlarged view for explaining the operation.

FIG. 5 is a partial cross-sectional view of the vicinity of a solder head according to another embodiment of the present invention.

FIG. 6 is a partial cross-sectional view of the vicinity of a solder head according to still another embodiment of the present invention.

FIG. 7 is a partial sectional view of the vicinity of a solder head according to still another embodiment of the present invention.

FIG. 8 is a partial sectional view of the vicinity of a solder head according to still another embodiment of the present invention.

FIG. 9 is a partial cross-sectional view of a solder head according to another embodiment of the present invention.

FIG. 10 is a diagram showing a conventional example.

FIG. 11 is a diagram showing a configuration of outer peripheral heating.

FIG. 12 is a diagram showing a configuration of internal heating.

FIG. 13 is a diagram showing a configuration of high-frequency induction heating.

FIG. 14 is a diagram showing a change in the iron tip temperature of a soldering iron.

FIG. 15 is a graph showing rise time of each heating.

FIG. 16 is a view showing a heat falling temperature of each heating.

FIG. 17 is a diagram showing a heat recovery time of each heating.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Solder iron 2 Supply nozzle 3 Soldering robot 10 Solder head 11 Robot arm 17 Rotating mechanism 22 Soldering object 24 Stepping motor 25 Drive pulley 27 Follower pulley 28 Rotating body 31 Air blow nozzle 32 Swinging mechanism 37 Glass tube heater 55 Heater 56 High frequency induction coil

Claims (5)

[Claims] 1. A structure for heating a soldering iron, comprising at least two types of heating: an internal heating in which a heater is arranged inside the soldering iron, an outer peripheral heating in which a heater is arranged on the outer periphery of the soldering iron, and a high-frequency induction heating by high-frequency electromagnetic induction. A heating structure for a soldering iron, characterized by using a combination of the above heating. 2. The heating structure for a soldering iron according to claim 1, wherein said outer peripheral heating and said high frequency induction heating are used in combination. 3. The soldering iron heating structure according to claim 2, wherein a cylindrical heater is mounted on an outer periphery of the soldering iron, and a heater portion around which a high-frequency induction coil is wound is disposed inside the soldering iron. 4. A soldering device comprising the soldering iron heating structure according to claim 1. 5. A soldering apparatus for automatically soldering by supplying a solder core to a soldering iron, wherein a soldering head for holding the soldering iron is arranged in the axial direction of the soldering iron with respect to a robot arm of the soldering robot. A solder core feeder that is displaceably mounted along the wire and supplies a solder core to the soldering iron is mounted at a fixed position along the axial direction with respect to the robot arm. The soldering device according to claim 4, wherein the tip of the soldering iron guided to the object is pressed by the object to be soldered, so that the soldering iron is displaced along the axial direction.